Housing, method of manufacturing the same, and electronic device

Abstract

The application relates to the technical field of electronic equipment, in particular to a shell, a preparation method thereof and electronic equipment. The shell comprises a heat conduction layer and a temperature control layer, the inner surface of the temperature control layer is connected with the outer surface of the heat conduction layer, the outer surface of the temperature control layer is closer to the exposed surface of the shell than the inner surface of the temperature control layer, the heat conduction coefficient of the heat conduction layer is λ 导1 , the heat conduction coefficient of the temperature control layer is λ 温1 , the heat conduction coefficient of the heat conduction layer is λ 导2 , and the heat conduction coefficient of the temperature control layer is λ 温2 , and the following relationships are met: λ 导2 ≥ 2λ 导1 , λ 导1 ≥ 2λ 温1 , λ 导1 ≥ 2λ 温2 . The shell can realize large-span conduction of heat generated by a mainboard and a battery to a middle frame and other structures inside the shell, relieve the problem of temperature rise caused by heat aggregation inside the electronic equipment, block a large amount of heat from being conducted to the exposed surface of the shell, avoid the feeling of "hot hands" of consumers, and improve the product experience of users.

Description

Technical Field

[0001] This application relates to the field of electronic device technology, and in particular to a housing, a method for manufacturing the same, and an electronic device. Background Technology

[0002] With the increasing popularity and performance improvement of smart electronic devices, high-energy-consuming applications such as games and video playback are used more frequently. These applications place increasingly higher demands on the performance of electronic devices. When running these high-energy-consuming applications, the heat generated by the motherboard and battery inside the electronic devices is also increasing. "Hot-hot" has become a common problem for consumers of electronic devices. How to effectively dissipate heat while keeping the user's hands cool has become an important issue in the design of smart electronic devices. Summary of the Invention

[0003] Based on this, this application provides a housing, a method for manufacturing the same, and an electronic device.

[0004] The first aspect of this application provides a housing, the technical solution of which is as follows:

[0005] A housing includes a thermally conductive layer and a temperature-controlled layer, each having an outer and an inner surface, and a plurality of side surfaces located between the outer and inner surfaces connecting the outer and inner surfaces. The inner surface of the temperature-controlled layer is connected to the outer surface of the thermally conductive layer, and the outer surface of the temperature-controlled layer is closer to the exposed surface of the housing than the inner surface of the temperature-controlled layer.

[0006] Let the heat flow along the inner surface of the heat-conducting layer towards the outer surface of the temperature-controlling layer, and let the thermal conductivity of the heat-conducting layer be λ. 导1 The thermal conductivity of the temperature control layer is λ. 温1 The heat flows downwards along one side of the heat-conducting layer in a direction pointing to the opposite side, and the thermal conductivity of the heat-conducting layer is λ. 导2 The heat flows downwards along one side of the temperature control layer in a direction pointing to the opposite side, and the thermal conductivity of the temperature control layer is λ. 温2 ;

[0007] λ 导1 , λ 温1 , λ 导2 and λ 温2 Satisfy the following relationship: λ 导2 ≥2λ 导1 , λ 导1 ≥2λ 温1 , λ 导1 ≥2λ 温2 .

[0008] The second aspect of this application provides a method for preparing a shell, the technical solution of which is as follows:

[0009] A method for preparing a shell includes the following steps:

[0010] A heat-conducting layer having an outer surface, an inner surface, and multiple side surfaces, and a temperature-controlling layer having an outer surface, an inner surface, and multiple side surfaces are formed, and the inner surface of the temperature-controlling layer is connected to the outer surface of the heat-conducting layer, and the materials of the heat-conducting layer and the temperature-controlling layer are controlled. 导1 , λ 温1 , λ 导2 and λ 温2 Satisfy the following relationship: λ 导2 ≥2λ 导1 , λ 导1 ≥2λ 温1 , λ 导1 ≥2λ 温2 ;

[0011] Where, λ 导1 The thermal conductivity λ represents the thermal conductivity of the heat flow through the lower heat-conducting layer in the direction from the inner surface of the heat-conducting layer to the outer surface of the temperature-controlling layer. 温1 The thermal conductivity λ represents the thermal conductivity of the temperature control layer through which heat flows from the inner surface of the thermally conductive layer to the outer surface of the temperature control layer. 导2 The thermal conductivity λ represents the thermal conductivity of the heat flow through the lower thermal layer in a direction from one side to the opposite side. 温2 The thermal conductivity represents the thermal conductivity of the temperature control layer, indicating the direction in which heat flows through the layer from one side to the opposite side.

[0012] A third aspect of this application provides an electronic device, the technical solution of which is as follows:

[0013] An electronic device includes a display module, a motherboard, a battery, a mid-frame, and a housing, wherein the housing is as described above or is manufactured by the manufacturing method described above;

[0014] The display module, the middle frame, and the housing enclose a receiving space;

[0015] The motherboard and the battery are located within the housing space.

[0016] This application designs a housing including a heat-conducting layer and a temperature-controlling layer, wherein four thermal conductivity parameters λ of the heat-conducting layer and the temperature-controlling layer are controlled. 导1 , λ 温1 , λ 导2 and λ 温2 On the one hand, this design allows for the rapid and extensive transfer of heat generated by the motherboard and battery within the casing to heat-dissipating structures such as the mid-frame, alleviating the problem of heat buildup and temperature increases within electronic devices. On the other hand, it prevents a large amount of heat from being conducted to the exposed surfaces of the casing, avoiding the feeling of "burning heat" for consumers and improving the user experience. Attached Figure Description

[0017] To more clearly illustrate the technical solutions in the embodiments of this application and to more completely understand this application and its beneficial effects, the drawings used in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0018] Figure 1 A schematic diagram of the casing structure for one embodiment;

[0019] Figure 2 This is a schematic diagram of the heat-conducting layer.

[0020] Figure 3 This is a schematic diagram of the temperature control layer.

[0021] Figure 4 A schematic diagram of the casing for another embodiment;

[0022] Figure 5 The highest temperature of the exposed surface at different locations of the housing in Example 1 during simulation of the whole machine's gaming conditions;

[0023] Figure 6 The highest temperature of the exposed surface at different locations is measured when the casing of Comparative Example 1 is simulated under full-system gaming conditions. Detailed Implementation

[0024] The present application will be further described in detail below with reference to specific embodiments. The present application can be implemented in many different forms and is not limited to the embodiments described herein. Rather, these embodiments are provided to provide a more thorough and complete understanding of the disclosure of this application.

[0025] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The terminology used herein in the specification of this application is for the purpose of describing particular embodiments only and is not intended to be limiting of this application.

[0026] the term

[0027] Unless otherwise stated or in case of conflict, the terms or phrases used in this application shall have the following meanings:

[0028] In this application, the terms "multiple", "various", "multiple times", "multi-dimensional", etc., unless otherwise specified, refer to a quantity greater than or equal to 2. For example, "one or more" means one or more or more.

[0029] In this application, "several" means at least one, such as one, two, etc., unless otherwise expressly and specifically defined.

[0030] In this application, the terms "optionally," "optionally," and "optional" refer to options that are optional, meaning they can be selected from either "with" or "without." If multiple "optional" options appear in a technical solution, unless otherwise specified and there are no contradictions or mutual constraints, each "optional" option is independent.

[0031] In this application, the terms "first aspect," "second aspect," "third aspect," and "fourth aspect," etc., are used for descriptive purposes only and should not be construed as indicating or implying relative importance or quantity, nor should they be construed as implicitly indicating the importance or quantity of the indicated technical features. Moreover, "first," "second," "third," and "fourth," etc., serve only a non-exhaustive enumeration purpose and should be understood not to constitute a closed limitation on quantity.

[0032] In this application, "above" or "below" the second feature can mean that the first feature is in direct contact with the second feature, or that the first feature is in indirect contact with the second feature through an intermediate medium. Furthermore, "above," "on top of," and "over" the second feature can mean that the first feature is directly above or diagonally above the second feature, or simply that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature can mean that the first feature is directly below or diagonally below the second feature, or simply that the first feature is at a lower horizontal level than the second feature.

[0033] In this application, when an element is referred to as "fixed to" or "set on" another element, it can be directly on the other element or there may be an intervening element. When an element is considered to be "connected to" another element, it can be directly connected to the other element or there may be an intervening element. It should also be understood that, in interpreting the connection or positional relationship of elements, although not explicitly described, connection and positional relationships are interpreted to include a range of error, which should be within the acceptable deviation range of a specific value as determined by a person skilled in the art.

[0034] Traditional heat dissipation solutions include: (1) Graphite heat dissipation. This involves using a large area of ​​graphite heat sinks to cover the circuit board inside the electronic device. Some also combine it with a metal casing, with a metal heat-conducting plate designed inside the casing to connect with the graphite heat sink. The advantages of this heat dissipation are low cost and good thermal conductivity of graphite, which is usually between 1000W / (m·K) and 300W / (m·K), and can distribute heat evenly to the body. The disadvantages are that the thermal conductivity of the graphite sheet is low in the thickness direction, and the contact between the graphite sheet and the heat-generating element inside the electronic device is not tight, which can easily cause heat to accumulate at the interface and make it difficult to quickly conduct heat from inside the electronic device to the outside of the electronic device. In addition, during long-term use, the thermal conductivity of the graphite sheet may decrease due to dust, oil, or extreme temperatures, which will affect the heat dissipation effect. (2) Metal casing heat dissipation. It uses a metal casing and sets a metal heat-conducting plate inside the casing. It utilizes the good thermal conductivity of metal (thermal conductivity of 10W / (m·K)~400W / (m·K)) to conduct heat quickly. However, the disadvantages are also prominent. The metal casing has electromagnetic interference and electromagnetic shielding problems. In addition, the metal has a large density, which will increase the weight of electronic devices and affect the user experience. (3) Thermal gel / silicone grease heat dissipation. It applies thermal gel or thermal grease to the processor. Thermal gel and thermal grease have good thermal conductivity (thermal conductivity of 0.5W / (m·K)~10W / (m·K)), high temperature resistance and insulation. It can directly and quickly transfer the heat of the processor to the heat sink. However, the disadvantages are that thermal gel and thermal grease will dry out or fail over time, and the thermal conductivity will decrease. It needs to be maintained or replaced regularly. In addition, its use will increase the size of the mobile phone, which is not conducive to the thin and light design of the mobile phone. (4) Heat pipe heat dissipation / liquid cooling heat dissipation. It places a hollow heat dissipation metal plate inside the electronic device and fills the tube with liquid (such as pure water). When the electronic device heats up, the liquid absorbs heat and turns into gas. After diffusing to other areas, it exchanges and dissipates heat energy. Then the gas condenses into liquid and returns to the evaporation section through capillary action, and so on. Its advantage is that the heat dissipation efficiency is high and it can effectively reduce the temperature of the processor. However, the structure is relatively complex, the cost is high, and the length and thickness of the heat pipe are limited by the internal space of the mobile phone. (5) Vapor Chamber (VC) heat dissipation (can be regarded as a large sheet heat pipe). VC is a vacuum copper cavity with a fine structure on the inner wall and filled with coolant. It also uses the phase change principle for heat dissipation, but it is more efficient than heat pipe because the heat conduction mode of VC is two-dimensional surface conduction, which can transfer and dissipate heat more quickly. However, the cost of VC is generally high. It also uses metal and complex structure, so its weight is large, and it is difficult to manufacture and maintain. In addition, due to its limited heat capacity, the liquid condensation and reflux cannot keep up with the heat absorption and evaporation requirements, which can easily lead to convection failure. (6) Air cooling heat dissipation. Heat dissipation is achieved by installing fans inside electronic devices to accelerate airflow.Its heat dissipation effect is very direct, especially for situations with continuous high heat generation. However, the disadvantages are also significant. The built-in fan increases the size and weight of electronic devices, and may also increase the difficulty of dust and water protection and maintenance. In addition, it may generate noise during operation, which greatly affects the consumer experience. (7) Ice Nest Heat Dissipation (developed by OPPO). Ice Nest uses a liquid metal-like material as a heat conduction medium to fill the gap between the PCB board and the middle frame. Based on the conventional PCB board design, a single-sided board is used, so that the heat-generating components such as the CPU are closely attached to the heat conduction sheet of liquid metal-like material, which improves the heat dissipation efficiency and can quickly and evenly dissipate normal heat. Moreover, the liquid metal-like material can remain stable at higher temperatures. However, Ice Nest heat dissipation also has the limitations of high cost and increased size and weight of mobile phones, and it has new requirements for the design of PCB boards.

[0035] Unlike the aforementioned heat dissipation methods, the first aspect of this application provides a housing, please refer to [link / reference needed]. Figure 1 In one embodiment, the housing 100 includes a thermally conductive layer 11 and a temperature-controlled layer 12. The thermally conductive layer 11 has opposing inner surfaces 111 and outer surfaces 112, and a plurality of side surfaces 113 (side surfaces 113A and 113B are shown in the figure, other side surfaces are not shown in the figure) located between the inner surfaces 111 and outer surfaces 112 and connecting the inner surfaces 111 and outer surfaces 112. The temperature-controlled layer 12 has opposing inner surfaces 121 and outer surfaces 122, and a plurality of side surfaces 123 (side surfaces 123A and 123B are shown in the figure, other side surfaces are not shown in the figure) located between the inner surfaces 121 and outer surfaces 122 and connecting the inner surfaces 121 and outer surfaces 122. The inner surface 121 of the temperature-controlled layer 12 is connected to the outer surface 112 of the thermally conductive layer 11, and the outer surface 122 of the temperature-controlled layer 12 is closer to the exposed surface of the housing 100 than the inner surface 121.

[0036] Assuming the heat flows along the inner surface 111 of the heat-conducting layer 11 towards the outer surface 122 of the temperature-controlling layer 12, the thermal conductivity of the heat-conducting layer 11 is λ. 导1 The thermal conductivity of the temperature control layer 12 is λ. 温1 The heat flow passes through the heat-conducting layer 11 in a direction from one side 113A to the opposite side 113B. The thermal conductivity of the heat-conducting layer 11 is λ. 导2 The heat flows downwards along one side 123A of the temperature control layer 12 in a direction pointing towards the opposite side 123B. The thermal conductivity of the temperature control layer 12 is λ. 温2 ;

[0037] λ 导1 , λ 温1 , λ 导2 and λ 温2 Satisfy the following relationship: λ 导2 ≥2λ 导1 , λ 导1 ≥2λ 温1 , λ导1 ≥2λ 温2 .

[0038] The above embodiment designs a housing 100 including a heat-conducting layer 11 and a temperature-controlling layer 12, wherein the four thermal conductivity parameters λ of the heat-conducting layer 11 and the temperature-controlling layer 12 are controlled. 导1 , λ 温1 , λ 导2 and λ 温2 On the one hand, this design allows for the rapid and extensive transfer of heat generated by the motherboard and battery within the casing 100 to heat-dissipating structures such as the mid-frame, alleviating the problem of heat buildup and temperature increases within electronic devices. On the other hand, it prevents a large amount of heat from being transferred to the exposed surfaces of the casing 100, avoiding the feeling of "burning heat" for consumers and improving the user's product experience.

[0039] Where, λ 导2 With λ 导1 The larger the ratio, the more beneficial it is to conduct heat over a large span within the casing 100 to structures capable of heat dissipation, such as the middle frame. Optionally, λ 导2 ≥3λ 导1 Optionally, λ 导2 ≥5λ 导1 Optionally, λ 导2 ≥7λ 导1 Optionally, λ 导2 ≥9λ 导1 Optionally, λ 导2 ≥12λ 导1 Optionally, λ 导2 ≥15λ 导1 Optionally, λ 导2 ≤30λ 导1 .

[0040] λ 温1 and λ 温2 Relative to λ 导1 Smaller size can prevent a large amount of heat from being conducted to the exposed surface of the casing 100. Optionally, λ 导1 ≥3λ 温1 Optionally, λ 导1 ≥5λ 温1 Optionally, λ 导1 ≥7λ 温1 Optionally, λ 导1 ≥9λ 温1 Optionally, λ 导1 ≥12λ 温1 Optionally, λ 导1 ≥15λ 温1 Optionally, λ 导1 ≤30λ 温1 Optionally, λ 导1≥3λ 温2 Optionally, λ 导1 ≥5λ 温2 Optionally, λ 导1 ≥7λ 温2 Optionally, λ 导1 ≥9λ 温2 Optionally, λ 导1 ≥12λ 温2 Optionally, λ 导1 ≥15λ 温2 Optionally, λ 导1 ≤30λ 温2 .

[0041] The λ can be adjusted by changing the materials of the heat-conducting layer 11 and the temperature-controlling layer 12. 导1 , λ 温1 , λ 导2 and λ 温2 Numerical value, and make λ 导1 , λ 温1 , λ 导2 and λ 温2 The above relationship is satisfied. Optionally, λ 导1 The value ranges from 1 W / (m·K) to 3 W / (m·K). This includes, but is not limited to, 1 W / (m·K), 1.5 W / (m·K), 2 W / (m·K), 2.5 W / (m·K), and 3 W / (m·K). Optionally, λ 温1 ≤0.5 W / (m·K). Including but not limited to 0 W / (m·K), 0.1 W / (m·K), 0.2 W / (m·K), 0.3 W / (m·K), 0.4 W / (m·K), and 0.5 W / (m·K). Optionally, λ 导2 ≥2W / (m·K). Optionally, it is 2W / (m·K) to 20W / (m·K). Including but not limited to 2W / (m·K), 5W / (m·K), 8W / (m·K), 10W / (m·K), 12W / (m·K), 15W / (m·K), and 20W / (m·K). Optionally, λ 温2 ≤0.5W / (m·K). Including but not limited to 0W / (m·K), 0.1W / (m·K), 0.2W / (m·K), 0.3W / (m·K), 0.4W / (m·K), and 0.5W / (m·K).

[0042] Traditional glass housings have thermal conductivity of approximately 0.7 W / (m·K) to 1.1 W / (m·K) in all directions, traditional ceramic housings have thermal conductivity of approximately 1.5 W / (m·K) to 2.5 W / (m·K) in all directions, and traditional polycarbonate (PC) / polymethyl methacrylate (PMMA) housings have thermal conductivity of approximately 0.2 W / (m·K) in all directions. Compared to these materials, the thermal conductivity of this embodiment is... 导2 The higher temperature allows for faster heat dissipation to the mid-frame and other heat dissipation structures, solving the problem of heat dissipation difficulties in traditional casings.

[0043] In this embodiment, please refer to Figure 2 The thermally conductive layer 11 includes a plurality of stacked first fiber meshes 11a and a thermally conductive resin 11b that bonds the plurality of first fiber meshes 11a together. Figure 3 In the embodiment shown, the first fiber web 11a has 3 layers. In other embodiments, the number of layers of the first fiber web can be adjusted according to actual needs.

[0044] Optionally, the extension surfaces of several layers of the first fiber mesh 11a intersect with the side surfaces 113 of the heat-conducting layer 11. The first fiber mesh 11a can be formed by alternating plain weave of fibers in the horizontal and vertical directions. When the extension surfaces of the first fiber mesh 11a intersect with the side surfaces 113 of the heat-conducting layer 11, heat can be transferred to the side surfaces 113 along the horizontal and vertical grid structure formed by the fibers, and further transferred to the heat dissipation structure such as the middle frame.

[0045] Optionally, each of the first fiber webs is independently made of one or more of ultra-high molecular weight polyethylene (UPE) fibers and poly(p-phenylenebenzodioxazole) (PBO) fibers. The UPE fiber filaments are produced using UPE as a raw material. UPE has a linear structure, allowing heat to be transferred along its linear molecular chains. Furthermore, UPE fibers have high orientation and crystallinity, enabling heat conduction between tightly packed and ordered molecules. Therefore, UPE fibers with high molecular weight, linear molecular chains, and high orientation and crystallinity have high thermal conductivity. Along the fiber axis, the thermal conductivity of UPE fibers is approximately 25 W / (m·K), which is beneficial for quickly transferring heat generated by the motherboard and battery to heat dissipation structures such as the mid-frame. Simultaneously, the basis weight of UPE fibers is 55 g / m². 2The lower density of PBO fiber is beneficial for reducing the weight of the shell 100, thus achieving a lightweight design. Understandably, the first fiber web, made of UPE fiber, can be provided by UPE fiber woven fabric. PBO fiber filaments are produced from PBO, whose molecular chains are regularly arranged, resulting in stronger intermolecular forces that facilitate phonon transmission. Furthermore, PBO fibers have higher orientation and crystallinity, exhibiting outstanding thermal conductivity. Along the fiber axis, the thermal conductivity of PBO fibers can reach 60 W / (m·K), approximately 1.5 times that of UPE fibers. Simultaneously, the elastic modulus of PBO fibers is approximately twice that of UPE fibers, resulting in better rigidity and durability. However, the cost of PBO fibers is 3-5 times that of UPE fibers, and their weight is approximately 1.5 times that of UPE fibers. Using PBO as the material for the first fiber web would result in higher cost and greater weight.

[0046] The thermally conductive resin 11b in the thermally conductive layer 11 has a high thermal conductivity, which can assist in the conduction of heat inside the shell. Optionally, the thermal conductivity of the thermally conductive resin is 1 W / (m·K) to 3 W / (m·K). Optionally, the thermally conductive resin includes a resin matrix and thermally conductive fillers dispersed in the resin matrix. Optionally, the resin matrix includes an epoxy-cured resin. The thermal conductivity of epoxy-cured resin is generally not high. By adding thermally conductive fillers to the epoxy-cured resin, the thermally conductive fillers can form thermally conductive pathways, thereby significantly improving the thermal conductivity of the thermally conductive resin. Optionally, the thermally conductive fillers include one or more of metal particles, metal compound particles, carbon nanotubes, and graphene. Optionally, the metal compound particles include one or more of alumina particles, magnesium oxide particles, boron nitride particles, silicon carbide particles, zinc oxide particles, and aluminum nitride particles. The thermal conductivity of the alumina particles is 32 W / (m·K), that of the magnesium oxide particles is 36 W / (m·K), that of the boron nitride particles is 56 W / (m·K)~80 W / (m·K), that of the silicon carbide particles is 84 W / (m·K), that of the zinc oxide particles is 60 W / (m·K)~70 W / (m·K), and that of the aluminum nitride particles is 200 W / (m·K). Appropriate thermally conductive fillers can be added and their mass percentage adjusted according to the requirements of the thermally conductive layer 11 on the thermally conductive resin 11b and the requirements for the bending performance of the thermally conductive layer. It should be noted that as the thermal conductivity of the aforementioned metal compound particles increases, the price of the metal compound also increases accordingly. Optionally, the thermally conductive resin also includes color powder dispersed in the resin matrix.

[0047] The thickness of the thermally conductive layer 11 can be flexibly designed according to the thickness of the housing. Optionally, the thickness of the thermally conductive layer 11 is 0.1mm to 0.4mm. For example, the thickness of the thermally conductive layer 11 is 0.1mm, 0.2mm, 0.3mm, or 0.4mm.

[0048] In this embodiment, please refer to Figure 3 The temperature control layer 12 includes several layers of second fiber mesh 12a stacked together and resin 12b bonding the several layers of second fiber mesh 12a together. Figure 3 In the embodiment shown, the second fiber web 12a has 3 layers. In other embodiments, the number of layers of the second fiber web can be adjusted according to actual needs.

[0049] Optionally, the extended surfaces of several layers of the second fiber mesh 12a intersect with the side surfaces 123 of the temperature control layer 12. The second fiber mesh 12a can be formed by alternating plain weave of fibers in the horizontal and vertical directions. When the extended surfaces of the second fiber mesh 12a intersect with the side surfaces 123 of the temperature control layer 12, heat can be transferred to the side surfaces 123 along the horizontal and vertical grid structure formed by the fibers, and further transferred to the heat dissipation structure such as the middle frame.

[0050] Optionally, each second fiber mesh is independently made of one or more of glass fiber, ceramic fiber, and Kevlar (aramid) fiber. In the fiber axis direction, the thermal conductivity of glass fiber is approximately 0.1 W / (m·K). On the one hand, it helps transfer heat generated by the motherboard and battery to heat dissipation structures such as the mid-frame; on the other hand, it can be combined with resins with low thermal conductivity to prevent heat conduction to the exposed surface of the casing 100, thus providing thermal insulation. Furthermore, the basis weight of the glass fiber is 104 g / m². 2The lower density is beneficial for reducing the weight of the shell 100, thus achieving a lightweight design. Understandably, the second fiber web, which includes glass fiber, can be provided by alkali-free glass fiber cloth. Furthermore, to improve the bonding strength between the glass fiber and the resin, the glass fiber can optionally be subjected to coupling modification treatment to obtain modified glass fiber. Each second fiber web independently includes modified glass fiber, which is beneficial for improving the stiffness of the temperature control layer 12. Optionally, the coupling agent is selected from one or more of silane coupling agents (e.g., KH560), titanate coupling agents, aluminate coupling agents, and borate coupling agents. Ceramic fibers and aramid fibers can also be used as materials for the second fiber web. Optionally, the ceramic fiber can be alumina fiber. Along the fiber axis, alumina fibers have a thermal conductivity of 0.02 W / (m·K) to 0.04 W / (m·K), lower than that of glass fibers, and an elastic modulus of 150 GPa to 370 GPa, which is 4 to 5 times that of glass fibers. In contrast, aramid fibers have a thermal conductivity of approximately 0.1 W / (m·K), close to that of glass fibers, and an elastic modulus of 90 GPa to 110 GPa, which is 1.5 times that of glass fibers. Using alumina and aramid fibers, the temperature control layer 12 can achieve both thermal insulation and greater rigidity, resulting in higher structural strength and durability. However, alumina ceramics and aramid fibers are expensive, and using them as the material for the second fiber web would increase the cost of the shell.

[0051] The resin 12b in the temperature control layer 12 has a low thermal conductivity, which can prevent heat generated by the motherboard and battery from being transferred to the exposed surface of the housing 100, reducing the touch temperature for the consumer, providing a lower thermal sensation, and improving the user experience. Optionally, the thermal conductivity of the resin is 0.3 W / (m·K) to 0.5 W / (m·K). Optionally, the resin includes an epoxy-cured resin, which has a low thermal conductivity.

[0052] The thickness of the temperature control layer 12 can be flexibly designed according to the thickness of the shell. Optionally, the thickness of the temperature control layer 12 is 0.1mm to 0.4mm. For example, the thickness of the temperature control layer 12 is 0.1mm, 0.2mm, 0.3mm, or 0.4mm.

[0053] In this embodiment, the heat-conducting layer 11 includes several layers of first fiber mesh 11a. The temperature-controlling layer 12 includes several layers of second fiber mesh 12a stacked together. The heat-conducting layer 11 and the temperature-controlling layer 12 are integrally formed by molding, so that the inner surface 121 of the temperature-controlling layer 12 is connected to the outer surface 112 of the heat-conducting layer 11. Moreover, the molding process production line is mature and the cost is low.

[0054] In this embodiment, the material of each first fiber mesh 11a in the heat-conducting layer 11 includes UPE fiber, and the material of each second fiber mesh 12a in the temperature control layer 12 includes glass fiber. UPE fiber has good toughness, while glass fiber has good rigidity. The resulting shell cleverly combines rigidity and toughness, meeting the requirements of mechanical performance. The impact resistance of the shell can reach more than 15 times that of shells made of traditional glass materials. Furthermore, both have low densities, which solves the problem of the heavy weight of traditional shells. The density of the resulting shell is 1.5 g / cm³. 3 ~1.8g / cm 3 The density of the shell is 2.4 g / cm³, compared to that of traditional glass. 3 ~2.8g / cm 3 This can reduce weight by about 6g to 7g, which aligns with the trend of thinner and lighter electronic devices. Furthermore, the cost of raw materials is also lower at this time.

[0055] In another embodiment, please refer to Figure 4 The housing 200 includes a thermally conductive layer 21, a temperature-controlled layer 22, and a decorative layer 23. The thermally conductive layer 21 and temperature-controlled layer 22 are described above as thermally conductive layer 11 and temperature-controlled layer 12, and will not be repeated here. The decorative layer 23 is located on the outer surface 222 of the temperature-controlled layer 22. The decorative layer 23 can be formed by CMF surface treatment. The decorative layer may include a paint layer, a texture layer, a decorative film, etc. The thermal conductivity of the paint layer in the thickness direction is 0.1 W / (m·K) to 0.2 W / (m·K). For example, thermal conductivity of 0.1 W / (m·K), 0.15 W / (m·K), and 0.2 W / (m·K).

[0056] Optionally, the thickness of the decorative layer 23 is 0.03 mm to 0.07 mm. For example, the thickness of the decorative layer 23 is 0.03 mm, 0.05 mm, or 0.07 mm.

[0057] The casing described above offers excellent heat dissipation while also considering the user's tactile temperature, addressing the pain point of traditional casings that "cool down quickly and heat up quickly." This allows heat generated by electronic devices operating at high power consumption to be rapidly conducted to the heat dissipation structure, such as the mid-frame, while the temperature of the exposed surface of the casing in the user's contact does not rise rapidly, preventing the user from getting "burned" and improving the user experience. It also offers the advantages of being lightweight, economical, and durable.

[0058] Compared to heat dissipation within a small area of ​​the heat source, such as using thermally conductive gel / silicone grease, the above-described implementation utilizes a larger thermally conductive layer for rapid heat transfer and is less prone to failure. Compared to contact-type in-plane cooling within electronic devices, such as graphite, metal casing, VC, and ice-nest cooling, the above-described implementation avoids heat accumulation between the casing and the heat-generating components, is less prone to failure over long-term use, does not interfere with the electronic device's signals, is low-cost, and saves internal space, aligning with the current trend towards thinner and lighter devices. Furthermore, traditional contact-type in-plane cooling, when dissipating heat quickly, easily transfers heat to the exposed surface of the electronic device's casing, causing a significant temperature rise and making it difficult for users to experience a low-heat sensation (i.e., not "hot to the touch"). Compared to internal components, such as air cooling, heat pipe cooling / liquid cooling, the above-described implementation saves internal space, is noiseless, contributes to weight reduction, and is easier to repair.

[0059] The second aspect of this application provides a method for preparing a shell, the technical solution of which is as follows:

[0060] A method for preparing a shell includes the following steps:

[0061] A heat-conducting layer having an outer surface, an inner surface, and multiple side surfaces, and a temperature-controlling layer having an outer surface, an inner surface, and multiple side surfaces are formed, and the inner surface of the temperature-controlling layer is connected to the outer surface of the heat-conducting layer, and the materials of the heat-conducting layer and the temperature-controlling layer are controlled. 导1 , λ 温1 , λ 导2 and λ 温2 Satisfy the following relationship: λ 导2 ≥2λ 导1 , λ 导1 ≥2λ 温1 , λ 导1 ≥2λ 温2 ;

[0062] Where, λ 导1 The thermal conductivity λ represents the thermal conductivity of the heat flow through the lower heat-conducting layer in the direction from the inner surface of the heat-conducting layer to the outer surface of the temperature-controlling layer. 温1 The thermal conductivity λ represents the thermal conductivity of the temperature control layer through which heat flows from the inner surface of the thermally conductive layer to the outer surface of the temperature control layer. 导2 The thermal conductivity λ represents the thermal conductivity of the heat flow through the lower thermal layer in a direction from one side to the opposite side. 温2 The thermal conductivity represents the thermal conductivity of the temperature control layer, indicating the direction in which heat flows through the layer from one side to the opposite side.

[0063] Optionally, the heat-conducting layer comprises several layers of a first fiber web, and the temperature-controlling layer comprises several layers of a second fiber web. The heat-conducting layer and the temperature-controlling layer are integrally molded. Optionally, the heat-conducting layer and the temperature-controlling layer are formed, and the inner surface of the temperature-controlling layer is connected to the outer surface of the heat-conducting layer. The materials of the heat-conducting layer and the temperature-controlling layer are controlled. 导1 , λ 温1 , λ 导2 and λ 温2 Satisfy the following relationship: λ 导2 ≥2λ 导1 , λ 导1 ≥2λ 温1 , λ 导1 ≥2λ 温2 This includes the following steps:

[0064] Several layers of first fiber mesh are impregnated in thermally conductive resin liquid and stacked to prepare first fiber mesh prepreg.

[0065] Several layers of the second fiber web are impregnated in resin solution and stacked to prepare a second fiber web prepreg.

[0066] The first fiber web prepreg and the second fiber web prepreg are stacked and then molded, with the first fiber web prepreg forming the thermally conductive layer and the second fiber web prepreg forming the temperature control layer.

[0067] The materials of the first and second fiber webs are as described above and will not be repeated here.

[0068] Optionally, the thermally conductive resin liquid includes epoxy resin, thermally conductive filler, and curing agent. Optionally, the conductive resin liquid also includes colorant. In some examples, the conductive resin liquid comprises the following components by mass fraction: 25%–28% epoxy resin, 69%–71% thermally conductive filler, 2%–5% curing agent, and 0%–1% colorant. The mass fraction of epoxy resin in the thermally conductive resin liquid includes, but is not limited to, 25%, 26%, 27%, and 28%. The mass fraction of thermally conductive filler in the thermally conductive resin liquid includes, but is not limited to, 69%, 70%, and 71%. The mass fraction of curing agent in the thermally conductive resin liquid includes, but is not limited to, 2%, 3%, 4%, and 5%. The mass fraction of colorant in the thermally conductive resin liquid includes, but is not limited to, 0%, 0.5%, and 1%.

[0069] Optionally, the resin solution includes epoxy resin and a curing agent. Optionally, the resin solution also includes colorant. In some examples, the resin solution includes the following components by mass fraction: 67%~83% epoxy resin, 17%~33% curing agent, and 0%~1% colorant. The mass fraction of epoxy resin in the resin solution includes, but is not limited to, 66%, 67%, 70%, 80%, and 83%. The mass fraction of curing agent in the resin solution includes, but is not limited to, 17%, 20%, 30%, and 33%.

[0070] Optionally, when the first fiber web prepreg and the second fiber web prepreg are stacked, the stacking angle can be adjusted as needed. For example, the stacking angle can be 0° or 45°. When the stacking angle is 0°, it means that the orthographic projections of the transverse and vertical fibers of the first fiber web in the first fiber web prepreg coincide with the orthographic projections of the transverse and vertical fibers of the second fiber web in the second fiber web prepreg. When the stacking angle is 45°, it means that the orthographic projections of the transverse and vertical fibers of the first fiber web in the first fiber web prepreg intersect with the orthographic projections of the transverse and vertical fibers of the second fiber web in the second fiber web prepreg, and the intersection angle is 45°.

[0071] Compression molding can be performed in a hot press, with the following process parameters: pressure of 150KG~180KG (e.g., pressures of 150KG, 160KG, 170KG, and 180KG); temperature of 115℃±10℃; and hot pressing time of 100min~140min (e.g., hot pressing times of 100min, 120min, and 140min). The pressure can be adjusted according to the area of ​​the hot pressing surface.

[0072] Optionally, the method for preparing the shell further includes the following step: forming a decorative layer on the outside of the temperature control layer. The decorative layer can be formed by CMF surface treatment. CMF is an abbreviation for Color, Material, and Finishing. CMF is a fundamental part of industrial design. Its core is to determine the most suitable colors, materials, and surface processes to ensure optimal product performance. Optionally, CMF surface treatment includes spraying colored paint to form a colored paint layer, imprinting textures to form a texture layer, and applying films to form a decorative film, wherein the film applied can be vegan leather.

[0073] The above preparation method can integrally form the heat-conducting layer and the temperature-controlling layer. The molding process production line is mature and the cost is low.

[0074] A third aspect of this application provides an electronic device. In one embodiment, the electronic device includes a display module, a motherboard, a battery, a mid-frame, and a housing. The housing is as described above or is manufactured by the manufacturing method described above.

[0075] The display module, mid-frame, and housing enclose and form an accommodating space;

[0076] The motherboard and battery are located within the housing space.

[0077] In the aforementioned electronic devices, the heat generated by the motherboard and battery can be conducted to the mid-frame through the casing for rapid heat dissipation. At the same time, the exposed surface of the casing has a low temperature, so the user will not feel that it is "hot" to the touch, resulting in a good user experience.

[0078] The following description is further illustrated with specific embodiments and comparative examples. Unless otherwise specified, the raw materials involved in the following specific embodiments and comparative examples are all commercially available. Unless otherwise specified, the instruments used are all commercially available. Unless otherwise specified, the processes involved are conventionally selected by those skilled in the art.

[0079] Example 1

[0080] This embodiment provides a method such as Figure 4 The shell structure shown includes a thermally conductive layer 21, a temperature control layer 22, and a decorative layer 23. The thermally conductive layer 21 and the temperature control layer 22 are prepared as follows: three layers of UPE fiber woven fabric are impregnated in a thermally conductive resin liquid (including 26% epoxy resin, 70% alumina particles, and 4% curing agent), removed, and stacked to obtain a first fiber web prepreg. Three layers of alkali-free glass fiber cloth are impregnated in a resin liquid (including 80% epoxy resin and 20% curing agent), removed, and stacked to obtain a second fiber web prepreg. The first and second fiber web prepregs are stacked at a 45° overlap angle and immersed in a hot press. The pressure is set to 160KG, the temperature to 115℃, and the molding time is 120min to obtain an integrally formed thermally conductive layer with a thickness of 0.3mm and a temperature control layer with a thickness of 0.28mm. Color paint is sprayed on the temperature control layer to form a 0.05mm color paint layer, thus obtaining the shell.

[0081] Comparative Example 1

[0082] This comparative example provides a glass shell with a thickness of 0.63.

[0083] The conductivity λ of Test Example 1 导1 , λ 温1 , λ 导2 and λ 温2 The results are shown in Table 1. The conductivity coefficients of Comparative Example 1 are the same in all directions, which is 1.02 W / (m·K).

[0084] Table 1

[0085]

[0086] The housings of Example 1 and Comparative Example 1 were simulated under full-game gaming conditions. The highest temperatures at various locations on the exposed surfaces of the housings were tested, and the results are shown in […]. Figure 5 and Figure 6 ,in, Figure 5 The shell of Example 1 was simulated under full-system gaming conditions, and the highest temperature at various locations on the exposed surface of the shell was measured. Figure 6 To simulate the casing of Comparative Example 1 under full-system gaming conditions, the highest temperatures at various locations on the exposed surface of the casing were measured. Figure 5 and Figure 6It can be seen that when the shell of Example 1 is used to simulate the whole machine gaming conditions, the highest temperature of the exposed surface of the shell is lower than that of the shell of Comparative Example 1, with a difference of 0.19℃, which can bring the user a benefit of low temperature.

[0087] In addition, the density of the shell in Test Example 1 was 1.45 g / cm³. 3 The density of glass is approximately 2.4 g / cm³. 3 ~2.8g / cm 3 It can be seen that the shell of Example 1 can reduce the weight by about 6g to 7g. In addition, the impact resistance of the shell of Example 1 is more than 15 times that of the glass shell.

[0088] In summary, compared to traditional glass shells, the shell of Example 1 has a higher λ value. 导2 The higher density of the casing facilitates rapid heat dissipation to the mid-frame and other heat dissipation structures, solving the heat dissipation difficulties of traditional casings. It also prevents heat transfer to exposed surfaces, providing users with a cooler feel while ensuring good heat dissipation. Furthermore, the casing has low density, is lightweight, has good mechanical properties, and is cost-effective.

[0089] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0090] The embodiments described above are merely illustrative of several implementation methods of this application, and while the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the invention patent. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this application, and these all fall within the protection scope of this application. Therefore, the protection scope of this patent application should be determined by the appended claims.

Claims

1. A housing, characterized in that, It includes a thermally conductive layer and a temperature-controlled layer, both of which have opposing inner and outer surfaces, and multiple side surfaces located between the inner and outer surfaces connecting the inner and outer surfaces. The inner surface of the temperature-controlled layer is connected to the outer surface of the thermally conductive layer, and the outer surface of the temperature-controlled layer is closer to the exposed surface of the housing than the inner surface of the temperature-controlled layer. Let the heat flow along the inner surface of the heat-conducting layer towards the outer surface of the temperature-controlling layer, and let the thermal conductivity of the heat-conducting layer be λ. 导1 The thermal conductivity of the temperature control layer is λ. 温1 The heat flows downwards along one side of the heat-conducting layer in a direction pointing to the opposite side, and the thermal conductivity of the heat-conducting layer is λ. 导2 The heat flows downwards along one side of the temperature control layer in a direction pointing to the opposite side, and the thermal conductivity of the temperature control layer is λ. 温2 ; λ 导1 , λ 温1 , λ 导2 and λ 温2 Satisfy the following relation: λ 导2 ≥2λ 导1 , λ 导1 ≥2λ 温1 , λ 导1 ≥2λ 温2 .

2. The housing according to claim 1, characterized in that, Includes at least one of the following features: (1) λ 导1 The value ranges from 1 W / (m·K) to 3 W / (m·K). (2)l 温1 ≤0.5W / (m K); (3)l 导2 ≥2W / (m·K); (4)l 温2 ≤0.5W / (m K).

3. The housing according to claim 2, characterized in that, The thermally conductive layer comprises several layers of first fiber mesh stacked together and a thermally conductive resin bonding the several layers of first fiber mesh together.

4. The housing according to claim 3, characterized in that, Each of the first fiber webs is made of one or more of ultra-high molecular weight polyethylene fibers and poly(p-phenylene benzodioxazole) fibers.

5. The housing according to claim 3, characterized in that, The thermally conductive resin includes a resin matrix and thermally conductive fillers dispersed within the resin matrix.

6. The housing according to claim 5, characterized in that, Includes at least one of the following features: (1) The resin matrix includes epoxy-cured resin; (2) The thermally conductive filler includes one or more of metal particles, metal compound particles, carbon nanotubes and graphene.

7. The housing according to claim 2, characterized in that, The temperature control layer comprises several layers of second fiber mesh stacked together and a resin bonding the several layers of second fiber mesh together.

8. The housing according to claim 7, characterized in that, Each of the second fiber webs is made of one or more of glass fiber, ceramic fiber, and aramid fiber.

9. The housing according to claim 7, characterized in that, The resin includes epoxy-cured resin.

10. The housing according to any one of claims 1 to 9, characterized in that, Includes at least one of the following features: (1) The thickness of the thermally conductive layer is 0.1 mm to 0.4 mm; (2) The thickness of the temperature control layer is 0.1mm~0.4mm.

11. The housing according to any one of claims 1 to 9, characterized in that, It includes a decorative layer, which is located on the outside of the temperature control layer.

12. A method for preparing a shell, characterized in that, Includes the following steps: A heat-conducting layer having an outer surface, an inner surface, and multiple side surfaces, and a temperature-controlling layer having an outer surface, an inner surface, and multiple side surfaces are formed. The inner surface of the temperature-controlling layer is connected to the outer surface of the heat-conducting layer. The materials of the heat-conducting layer and the temperature-controlling layer are controlled to make λ 导1 , λ 温1 , λ 导2 and λ 温2 Satisfy the following relation: λ 导2 ≥2λ 导1 , λ 导1 ≥2λ 温1 , λ 导1 ≥2λ 温2 ; Where, λ 导1 The thermal conductivity λ represents the thermal conductivity of the heat flow through the lower heat-conducting layer in the direction from the inner surface of the heat-conducting layer to the outer surface of the temperature-controlling layer. 温1 The thermal conductivity λ represents the thermal conductivity of the temperature control layer through which heat flows from the inner surface of the thermally conductive layer to the outer surface of the temperature control layer. 导2 The thermal conductivity λ represents the thermal conductivity of the heat flow through the lower thermal layer in a direction from one side to the opposite side. 温2 The thermal conductivity represents the thermal conductivity of the temperature control layer, indicating the direction in which heat flows through the layer from one side to the opposite side.

13. The method for preparing the shell according to claim 12, characterized in that, The thermally conductive layer and the temperature-controlled layer are formed, and the inner surface of the temperature-controlled layer is connected to the outer surface of the thermally conductive layer. The materials of the thermally conductive layer and the temperature-controlled layer are controlled. 导1 , λ 温1 , λ 导2 and λ 温2 Satisfy the following relation: λ 导2 ≥2λ 导1 , λ 导1 ≥2λ 温1 , λ 导1 ≥2λ 温2 This includes the following steps: Several layers of first fiber mesh are impregnated in thermally conductive resin liquid and stacked to prepare first fiber mesh prepreg. Several layers of the second fiber web are impregnated in resin solution and stacked to prepare a second fiber web prepreg. The first fiber web prepreg and the second fiber web prepreg are stacked and then molded, with the first fiber web prepreg forming the thermally conductive layer and the second fiber web prepreg forming the temperature control layer.

14. The method for preparing the shell according to any one of claims 12 to 13, characterized in that, Includes the following steps: A decorative layer is formed on the outside of the temperature control layer.

15. An electronic device, characterized in that, It includes a display module, a motherboard, a battery, a mid-frame, and a housing, wherein the housing is manufactured as described in any one of claims 1 to 11 or by the manufacturing method described in any one of claims 12 to 14; The display module, the middle frame, and the housing enclose a receiving space; The motherboard and the battery are located within the housing space.

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