Display apparatus, manufacturing apparatus of display apparatus, method of manufacturing display apparatus, and electronic device including display apparatus

Abstract

A display device, a manufacturing apparatus of the display device, a method of manufacturing the display device, and an electronic apparatus including the display device are provided. The display device includes a display panel including an aperture region having an aperture portion, a display region at least partially surrounding the aperture region, and an intermediate region between the aperture region and the display region, a cover window disposed to cover a first surface of the display panel, a first resin structure disposed on a second surface of the display panel along an outer periphery of the display panel, the second surface including a side surface of the display panel and a surface of the display panel opposite the first surface, and a second resin structure disposed inside the aperture portion.

Description

[0001] Cross-reference to related applications

[0002] This application claims priority to Korean Patent Application No. 10-2024-0179691, filed on December 5, 2024, and all benefits derived therefrom, the contents of which are incorporated herein by reference in their entirety. Technical Field

[0003] One or more embodiments relate to apparatus and methods, and more specifically, to display devices, manufacturing apparatus for display devices, methods for manufacturing display devices, and electronic devices including display devices. Background Technology

[0004] Mobile electronic devices are already widely used. In recent years, in addition to small electronic devices (such as mobile phones), tablet personal computers (PCs) have been widely used as mobile electronic devices.

[0005] Such mobile electronic devices include display devices that provide various functions (e.g., providing visual information to the user, such as images or videos). Recently, the proportion of display devices in electronic devices has increased, and structures that can be bent from a flat state to a specific angle have also been developed.

[0006] The background technology mentioned above refers to the technical information that the inventors possessed in order to obtain this disclosure or that they obtained in the process of obtaining this disclosure, and it does not necessarily have to be known technology that had been disclosed to the public before this disclosure was filed. Summary of the Invention

[0007] The display device includes a display panel. In this case, the display panel can be inserted into the housing, and due to the contact between the display panel and the housing, the edges of the display panel can be impacted, causing damage to the display panel. Additionally, if the display panel has openings, those openings can be damaged.

[0008] To address the various problems including those described above, embodiments of this disclosure provide a display device that can prevent damage to a display panel housed within a housing, a manufacturing apparatus for the display device, a method for manufacturing the display device, and an electronic device including the display device.

[0009] However, these aspects are examples, and the scope of this disclosure is not limited thereto.

[0010] Other aspects will be set forth in part in the description which follows, and in part will be obvious from the description or may be learned by practice of the embodiments of this disclosure presented.

[0011] According to one or more embodiments, a display device includes: a display panel including an opening region having an opening portion, a display region at least partially surrounding the opening region, and an intermediate region located between the opening region and the display region; a cover window configured to cover a first surface of the display panel; a first resin structure disposed along the outer periphery of the display panel on a second surface of the display panel, the second surface including a side surface of the display panel and a surface of the display panel opposite to the first surface; and a second resin structure disposed inside the opening portion.

[0012] In an implementation, in a plan view, the second resin structure may be disposed inside the inner periphery of the first resin structure.

[0013] In one embodiment, in a plan view, the second resin structure may be arranged in a ring shape along the inner surface of the display panel, and the inner surface of the display panel may define an opening portion.

[0014] In one embodiment, the second resin structure may include: a first portion disposed on the inner surface of the display panel, the inner surface defining an opening portion; and a second portion extending from the first portion to the outside of the opening area to cover at least a portion of the intermediate area.

[0015] In one embodiment, the first portion may be cylindrical, and the second portion may be annular.

[0016] In an embodiment, the second resin structure may include a material different from that of the first resin structure.

[0017] In an embodiment, the display panel may further include: an image generating layer for emitting light to display an image; and an optical functional layer disposed on the upper part of the image generating layer, wherein a second resin structure may be bonded to the inner surface of the optical functional layer, and the inner surface of the optical functional layer may define an opening portion.

[0018] In one embodiment, the optical functional layer may include a first protective layer, a second protective layer, and a polarizing layer between the first and second protective layers, and a second resin structure may be bonded to the inner surface of the polarizing layer, and the inner surface of the polarizing layer may define an opening portion.

[0019] In one embodiment, the second resin structure can be bonded to the inner surface of the polarization layer via hydrogen bonds or covalent bonds.

[0020] In an embodiment, the second resin structure may include an acrylic material.

[0021] In this embodiment, the adhesive strength of the second resin structure can be 10 Newtons per square centimeter (N / cm²). 2 ) to 50 N / cm 2 .

[0022] According to one or more embodiments, a manufacturing apparatus for a display device includes: a first fixture; a second fixture on which a display panel having an opening portion is mounted and configured to face the first fixture; a first mold disposed between the first fixture and the second fixture, selectively connected to the first fixture, and together with the second fixture forming a first space outside an edge portion of the display panel for injecting resin into the first space; and a second mold forming a second space inside the opening portion for injecting resin into the second space.

[0023] In one embodiment, the second mold may include: a shaft extending in a vertical direction; and a cover having a flat portion connected to an upper surface of the shaft and a protruding portion spaced from and surrounding the outer peripheral surface of the shaft.

[0024] In one embodiment, the length of the shaft in the vertical direction may be greater than the length of the protruding portion of the cover in the vertical direction.

[0025] In one implementation, in a plan view, the second mold may be disposed inside the edge of the first mold, which is formed as a closed loop.

[0026] According to one or more embodiments, a method of manufacturing a display device includes: providing a display panel having an opening portion on a second clamp spaced apart from a first clamp; forming a space in the display panel and around an edge portion of the display panel by providing the first clamp and a mold on the display panel; supplying a photocurable resin into the space; and curing the photocurable resin by irradiating the space with light, wherein the mold includes: a first mold surrounding the edge portion of the display panel to form a first space; and a second mold forming a second space in the opening portion, and the space includes the first space and the second space.

[0027] In one embodiment, the second mold may include: a shaft extending in a vertical direction; and a cover having a flat portion connected to an upper surface of the shaft and a protruding portion spaced from and surrounding the outer peripheral surface of the shaft.

[0028] In one embodiment, the shaft can be inserted into the center of the opening, and the cover can be configured to cover the outer periphery of the opening.

[0029] In one embodiment, the photocurable resin supplied to the first space may be different from the photocurable resin supplied to the second space.

[0030] In this embodiment, the adhesive strength of the photocurable resin supplied to the second space can be 10 N / cm. 2 Up to 50 N / cm 2 .

[0031] According to one or more embodiments, an electronic device includes: a display device and a housing accommodating the display device, and the display device includes: a display panel including an opening region having an opening portion, a display region at least partially surrounding the opening region, and an intermediate region located between the opening region and the display region; a cover window configured to cover a first surface of the display panel; a first resin structure disposed along the outer periphery of the display panel on a second surface of the display panel, the second surface including a side surface of the display panel and a surface of the display panel opposite to the first surface; and a second resin structure disposed inside the opening portion.

[0032] Other aspects, features, and advantages beyond those described above will now become apparent from the following drawings, claims, and detailed embodiments of this disclosure. Attached Figure Description

[0033] The above-described aspects, features, and advantages of specific embodiments of this disclosure, as well as other aspects, features, and advantages, will become more apparent from the following description taken in conjunction with the accompanying drawings, wherein:

[0034] Figure 1 This is a schematic perspective view of an electronic device according to an embodiment;

[0035] Figure 2 According to the implementation method, along Figure 1 A schematic cross-sectional view of the electronic device taken from line II-II';

[0036] Figure 3 This is a schematic plan view of a display device according to an embodiment;

[0037] Figure 4 This is a schematic rear view of a display device according to an embodiment;

[0038] Figure 5 For along Figure 4 The image shows a cross-sectional view of the display device taken by line V-V'.

[0039] Figure 6 According to the implementation method, along Figure 3 A schematic cross-sectional view of the display device taken by line VI-VI';

[0040] Figure 7 For illustrative purposes only, the display device according to the embodiments is shown. Figure 6 Enlarged cross-sectional view of section VII;

[0041] Figure 8 This is a schematic cross-sectional view of the display panel according to an embodiment;

[0042] Figure 9 and Figure 10Each is shown illustratively. Figure 8 The circuit diagram of the pixel circuit of the display panel;

[0043] Figure 11 This is a schematic perspective view of the manufacturing equipment for the display device according to the embodiment;

[0044] Figure 12 This is a schematic diagram of a manufacturing apparatus for a display device as viewed in direction A according to an embodiment;

[0045] Figure 13 According to the implementation method, along Figure 12 A cross-sectional view of the manufacturing equipment for the display device, taken by line B-B';

[0046] Figure 14 According to the implementation method, along Figure 12 A cross-sectional view of the manufacturing equipment for the display device, taken along line C-C'; and

[0047] Figure 15 This is a schematic perspective view of the second mold according to an embodiment. Detailed Implementation

[0048] The embodiments described in the accompanying drawings will now be explained in detail with reference to examples thereof, wherein like reference numerals refer to like elements throughout. In this regard, the embodiments may take different forms and should not be construed as limited to the description set forth herein. Accordingly, embodiments are described below only with reference to the figures to explain aspects of this description. As used herein, the term “and / or” includes any and all combinations of one or more of the associated enumerated items. Throughout this disclosure, the expression “at least one of a, b, and c” indicates only a, only b, only c, both a and b, both a and c, both b and c, all of a, b, and c, or variations thereof.

[0049] Because this disclosure allows for various modifications and numerous implementations, specific embodiments will be illustrated in the accompanying drawings and described in detail in the written description. The effects and features of this disclosure, as well as methods for achieving these effects and features, will become apparent from the embodiments and accompanying drawings described in detail below. However, the disclosure can be embodied in many different forms and should not be construed as limited to the embodiments set forth herein.

[0050] The present disclosure will now be described more fully with reference to the accompanying drawings, in which embodiments of the present disclosure are illustrated. The same reference numerals in the drawings denote the same elements, and therefore their descriptions will not be repeated.

[0051] In the following embodiments, although terms such as "first" and "second" may be used to describe various elements, these elements are not necessarily limited to the terms above.

[0052] In the following implementation, the singular expression encompasses the plural expression, unless they have a distinctly different meaning in the context.

[0053] In the following embodiments, it should be understood that terms such as “comprising” and “having” are intended to indicate the presence of the features or elements disclosed in this disclosure and are not intended to exclude the possibility that one or more other features or elements may be present or added.

[0054] It will be understood that when a layer, area, or element is said to be formed on another layer, area, or element, it may be formed directly or indirectly on the other layer, area, or element. That is, for example, an intermediary layer, area, or element may exist.

[0055] It will be understood that when a layer, zone, or component is referred to as being connected to another layer, zone, or component, it may be directly and / or indirectly connected to that other layer, zone, or component. That is, for example, an intermediary layer, zone, or component may exist. Furthermore, it will be understood that when a layer, zone, or component is referred to as being electrically connected to another layer, zone, or component, it may be directly and / or indirectly electrically connected to that other layer, zone, or component. That is, for example, an intermediary layer, zone, or component may exist.

[0056] For ease of explanation, the dimensions of the components in the accompanying drawings may be enlarged. In other words, because the dimensions (e.g., thickness) of the components in the drawings have been arbitrarily interpreted for ease of explanation, the following embodiments are not limited thereto.

[0057] In the following embodiments, "A and / or B" may include "A", "B" or "A and B". In addition, "at least one of A and B" or "selected from at least one of A and B" may include "A", "B" or "A and B".

[0058] In the following embodiments, it will be understood that when wiring is referred to as “extending in a first direction or a second direction”, it can extend not only in a straight shape, but also in a zigzag or curved shape in the first or second direction.

[0059] In the following embodiments, "in a plan view" means viewing the object portion from above (i.e., in the z-direction). The z-direction is the thickness direction of the display panel. In the following embodiments, "in a cross-sectional view" means vertically cutting the object portion and viewing it from the side (i.e., in a direction perpendicular to the z-direction). In the following embodiments, "overlapping" the first component with the second component means that the first component is located above or below the second component.

[0060] The x, y, and z directions are not limited to directions corresponding to the three axes of an orthogonal coordinate system, and can be interpreted in a general sense to include directions corresponding to the three axes of an orthogonal coordinate system. For example, the x, y, and z directions can be perpendicular to each other, or they can represent different directions that are not perpendicular to each other.

[0061] When specific implementation methods can be carried out differently, the specific process sequence can be different from the order in which they are described. For example, two consecutively described processes can be performed substantially simultaneously or in the reverse order of their description.

[0062] Figure 1 This is a schematic perspective view of the electronic device 2 according to an embodiment.

[0063] refer to Figure 1 Electronic device 2 is a device for displaying video or still images. Electronic device 2 can be a portable electronic device (e.g., mobile phone, smartphone, tablet PC, mobile communication terminal, e-notebook computer, e-reader, portable multimedia player (PMP), navigation device, or ultra-mobile PC (UMPC), etc.), and can also be used as a display screen for various products (e.g., television, laptop computer, monitor, billboard, or Internet of Things (IoT) device, etc.). Furthermore, electronic device 2 according to the embodiment can be applied to wearable devices (e.g., smartwatch, watch phone, glasses-type display, and head-mounted display (HMD)). Additionally, electronic device 2 according to the embodiment can be used as a central information display (CID) installed on the dashboard and center console of a vehicle, an interior mirror display replacing the side mirrors of the vehicle, and an entertainment display installed on the back of the front seats as a passenger entertainment display in the rear seats of the vehicle. For ease of description, in Figure 1 In the embodiment, the electronic device 2 is shown as a smartphone.

[0064] In a plan view, electronic device 2 may have a rectangular shape. For example, as shown... Figure 1 As shown, the electronic device 2 may have a rectangular planar shape, which has a shorter side in the x-direction and a longer side in the y-direction. The angle where the shorter side in the x-direction and the longer side in the y-direction intersect may be a rounded shape with a specific curvature or a right angle. The planar shape of the electronic device 2 is not limited to a rectangular shape, and may be other polygonal shapes, elliptical shapes, or irregular shapes.

[0065] Electronic device 2 may include an opening region OA (or a first region) and a display region DA (or a second region) surrounding at least the opening region OA. Electronic device 2 may include an intermediate region MA (or a third region) located between the opening region OA and the display region DA, and an outer peripheral region PA (or a fourth region) outside the display region DA (e.g., surrounding the display region DA). In an embodiment, in a plan view, the intermediate region MA may have a closed-loop shape that completely surrounds the opening region OA.

[0066] The opening area OA can be located inside the display area DA. In an implementation, such as... Figure 1As shown, the opening area OA can be located at the center of the upper side of the display area DA. Alternatively, the opening area OA can be set differently; for example, the opening area OA can be located on the upper left side or the upper right side of the display area DA. Although Figure 1 The description explains the provision of a single opening area OA, but in another embodiment, multiple opening areas OA may be provided.

[0067] Figure 2 According to the implementation method, along Figure 1 A schematic cross-sectional view of electronic device 2 taken from line II-II'.

[0068] refer to Figure 2 The electronic device 2 may include a display device 1 and a housing HS. The display device 1 may include a display panel 10, a component 70 disposed in an opening area 0A of the display panel 10, and a cover window 20. The display panel 10, the cover window 20, and the component 70 may be housed in the housing HS.

[0069] In an embodiment, the display panel 10 may include a substrate 100, a display layer D, a touch sensor layer 400, and an optical functional layer 500.

[0070] Display layer D may include display elements (or light-emitting elements) that emit light to display images. The display elements may include light-emitting diodes (LEDs), such as organic light-emitting diodes (OLEDs) including an organic emitting layer. In another embodiment, the LED may be an inorganic LED comprising inorganic materials. The inorganic LED may include a PN junction diode comprising materials based on inorganic semiconductors. When a voltage is applied to the PN junction diode in the forward direction, holes and electrons can be injected, and the energy generated by the recombination of holes and electrons can be converted into light energy to emit light of a specific color. The aforementioned inorganic LEDs may have widths ranging from several micrometers to hundreds of micrometers or from several nanometers to hundreds of nanometers. In some embodiments, display layer D may include quantum dot LEDs. For example, the emitting layer of display layer D may include organic materials, inorganic materials, quantum dots, organic materials and quantum dots, or inorganic materials and quantum dots. Display layer D may be referred to as an "image generation layer."

[0071] The touch sensor layer 400 can obtain coordinate information based on external input (e.g., a touch event). The touch sensor layer 400 may include sensing electrodes (or touch electrodes) and traces connected to the sensing electrodes. The touch sensor layer 400 may be disposed on the display layer D. The touch sensor layer 400 can sense external input using mutual capacitance and / or self-capacitance methods.

[0072] The touch sensor layer 400 may be formed directly on the display layer D, or it may be formed separately and then bonded to the display layer D via an adhesive layer (e.g., an optically transparent adhesive layer). For example, the touch sensor layer 400 may be formed sequentially after the process of forming the display layer D, and in this case, the adhesive layer may not be between the touch sensor layer 400 and the display layer D. Figure 2 The illustration shows that the touch sensor layer 400 is located between the display layer D and the optical functional layer 500, but in another embodiment, the touch sensor layer 400 may be disposed on the optical functional layer 500.

[0073] The optical functional layer 500 can reduce the reflectivity of light (e.g., external light) incident from the outside toward the electronic device 2, and at the same time, can control the propagation direction of light emitted by the display layer D.

[0074] To improve the light transmittance of the opening area OA, the display panel 10 may include opening portions 10OP that penetrate some of the layers forming the display panel 10. The opening portions 10OP may include first to fourth openings 100OP, DOP, 400OP, and 500OP that respectively penetrate the substrate 100, the display layer D, the touch sensor layer 400, and the optical functional layer 500. The first opening 100OP of the substrate 100, the second opening DOP of the display layer D, the third opening 400OP of the touch sensor layer 400, and the fourth opening 500OP of the optical functional layer 500 may overlap each other to form the opening portions 10OP of the display panel 10.

[0075] Cover window 20 may be disposed on optical functional layer 500. Cover window 20 may be attached to optical functional layer 500 via an adhesive layer (e.g., optically clear adhesive (OCA) layer) between cover window 20 and optical functional layer 500. Cover window 20 may cover the first opening 100OP of substrate 100, the second opening DOP of display layer D, the third opening 400OP of touch sensor layer 400, and the fourth opening 500OP of optical functional layer 500.

[0076] The covering window 20 may include glass or plastic materials. The glass material may include ultra-thin glass. The plastic material may include polyethersulfone, polyacrylate, polyetherimide, polyethylene naphthalate, polyethylene terephthalate (PET), polyphenylene sulfide, polyarylate, polyimide (PI), polycarbonate, or cellulose acetate propionate, etc.

[0077] The opening area OA can be a component area in which the component 70 is placed (e.g., a sensor area, a camera area, or a speaker area, etc.), and the component 70 is configured to add various functions to the electronic device 2.

[0078] Component 70 may include electronic components. For example, component 70 may be an electronic component that uses light and / or sound. For example, the electronic component may include a light-using sensor (e.g., an infrared sensor), a camera that captures images by receiving light, a sensor that outputs and senses light or sound to measure distance or identify fingerprints, a small lamp that outputs light, or a speaker that outputs sound, etc. The light-using electronic component may use light of various wavelengths (e.g., visible light, infrared light, or ultraviolet light). The opening area OA corresponds to the area through which light and / or sound output from component 70 to the outside or light and / or sound propagating from the outside toward the electronic component can be transmitted.

[0079] Figure 3 This is a schematic plan view of the display device 1 according to an embodiment. Figure 4 This is a schematic rear view of the display device 1 according to an embodiment. Figure 5 For along Figure 4 The figure shows a cross-sectional view of display device 1 taken by line V-V'.

[0080] refer to Figures 3 to 5 The display device 1 may include a plurality of sub-pixels P disposed in a display area DA, and the display device 1 may display an image by using light emitted by each of the plurality of sub-pixels P. Each sub-pixel P may emit red, green, or blue light by using a light-emitting diode. The light-emitting diode of each sub-pixel P may be connected to a scan line SL and a data line DL.

[0081] A scan driver 2100 providing a scan signal for each sub-pixel P, a data driver 2200 providing a data signal for each sub-pixel P, and a first main power line (not shown) and a second main power line (not shown) configured to provide a first power supply voltage and a second power supply voltage, respectively, may be disposed in the outer peripheral region PA. The scan driver 2100 may be disposed on each of the two sides of the display region DA, with the display region DA between these two sides. In this case, a sub-pixel P disposed on the left side relative to the aperture region OA may be connected to the left-side scan driver 2100, and a sub-pixel P disposed on the right side relative to the aperture region OA may be connected to the right-side scan driver 2100.

[0082] The intermediate region MA may surround the opening region OA. The intermediate region MA is the area in which no display element (e.g., a light-emitting diode) is disposed, and signal lines providing signals to the sub-pixels P around the opening region OA may bypass the intermediate region MA. For example, data lines DL and / or scan lines SL may cross the display region DA, and some of the data lines DL and / or scan lines SL may bypass the intermediate region MA along the edge of the opening portion 10OP formed in the opening region OA of the display panel 10. In this embodiment, Figure 3This illustrates that data lines DL cross the display area DA in the y-direction, and some of the data lines DL bypass the intermediate area MA to partially surround the aperture area OA. Scan lines SL cross the display area DA in the x-direction and may be spaced apart from each other, with the aperture area OA located between the scan lines SL.

[0083] Figure 3 The data driver 2200 is described as being positioned adjacent to one side of the substrate 100. However, in another embodiment, the data driver 2200 may be disposed on a printed circuit board electrically connected to pads disposed on one side of the display panel 10. The printed circuit board may be flexible, and a portion of the printed circuit board may be bent to lie below the rear surface of the substrate 100.

[0084] The display panel 10 can be a flexible display panel, which can be easily bent, folded, or rolled up due to its flexibility. For example, the display panel 10 can be a foldable display panel that can be folded and unfolded, a curved display panel with a curved display surface, a bent display panel with a curved area outside the display surface, a rollable display panel that can be rolled up or unfolded, and a retractable display panel.

[0085] The display panel 10 described above may include a display area DA for displaying an image and an outer peripheral area PA surrounding the display area DA. Separate drive circuitry or pads may be provided in the outer peripheral area PA.

[0086] In particular, the outer peripheral region PA may include a bent region BA that bends around a bending axis BAX and a pad region PDA connected to the bent region BA and in which the display circuit board 50 is disposed. In the display panel 10, a portion of the substrate 100 may be bent based on a virtual bending axis BAX disposed in the bent region BA. That is, as the display panel 10 bends in the bent region BA, the display region DA and the pad region PDA may be configured to face each other.

[0087] The display device 1 may include a display panel 10, a cover window 20 covering the display panel 10, a first resin structure 30 configured to surround the side surface of the display panel 10, and a second resin structure 40 configured to fill at least a portion of the opening portion 10OP of the display panel 10.

[0088] The display panel 10 may include a substrate 100, an emission layer and pixel circuitry PC disposed on the substrate 100 (see reference). Figure 8 The display layer D, the touch sensor layer 400 on the display layer D, and the optical functional layer 500 on the touch sensor layer 400.

[0089] The display panel 10 may be disposed on the lower part of the cover window 20. The display device 1 may include a protective film 600 and an adhesive member 700 disposed on the lower part of the substrate 100. In this case, the protective film 600 may include a protective film substrate 610 and an adhesive layer 620. In this case, the protective film substrate 610 may include polyethylene terephthalate (PET) or polyimide (PI). And, the adhesive layer 620 may include various adhesive materials. In this case, the adhesive layer 620 may be disposed on the front surface of the substrate 100, and the protective film substrate 610 may be partially removed after the protective film substrate 610 is disposed on the adhesive layer 620 to form the opening portion 10OP (see Figure 2 As another embodiment, although not illustrated in the drawings, a portion of the protective film substrate 610 and a portion of the adhesive layer 620 may be removed to form the opening portion 10OP. In this case, both the protective film substrate 610 and the adhesive layer 620 may not be present in the opening portion 10OP.

[0090] Additionally, the display device 1 may include a pad 800 between the protective film substrates 610. In this case, the pad 800 may be disposed in the areas where the display area DA and the pad area PDA face each other. That is, the pad 800 may be configured to contact a portion of the protective film substrate 610 in the display area DA and a portion of the protective film substrate 610 in the pad area PDA. The pad 800 may be disposed in the space between the display area DA and the pad area PDA after the substrate 100 is bent, to support the display panel 10 and absorb impact. The pad 800 may include an elastic material. In this case, the display device 1 is not limited to this, and the pad 800 may be attached to the protective film substrate 610 before bending.

[0091] The display panel 10 can be connected to the display circuit board 50 via an anisotropic conductive film. The touch sensor driving unit 60 can be disposed on the display circuit board 50. Alternatively, the touch sensor driving unit 60 can be directly disposed on the substrate 100 of the display panel 10. For ease of explanation, the following description focuses on the case where the touch sensor driving unit 60 is disposed on the display circuit board 50.

[0092] The touch sensor layer 400 can be formed in the form of a panel or a film. Optionally, the touch sensor layer 400 can be integrally formed with the display layer D. For example, when the touch sensor layer 400 is formed in the form of a film, the touch sensor layer 400 can be integral with the thin film encapsulation layer 300 of the display panel 10 (see reference). Figure 8 They are formed as one.

[0093] In another embodiment, the touch sensor layer 400 may also be configured as electrodes in the form of a pattern on the display layer D. In this case, lines may be provided in the thin-film encapsulation layer 300 (see reference). Figure 8 The touch sensor layers 400 intersect each other, and the change in electrostatic capacitance at the intersection points can be measured according to the user's touch. The touch sensor layer 400, as described above, can be connected to the display circuit board 50.

[0094] The touch sensor driving unit 60 can apply a touch driving signal to the touch sensor layer 400, sense a first sensing signal sensed from the touch sensor layer 400, and analyze the first sensing signal to calculate the user's touch position. Additionally, the touch sensor driving unit 60 can apply a touch driving signal to a sensing unit (not shown), sense a second sensing signal sensed from the sensing unit, and analyze the second sensing signal to calculate the position of a signal input unit (not shown), thereby obtaining the user's touch position.

[0095] In one embodiment, an optical functional layer 500 may be disposed on the touch sensor layer 400. The optical functional layer 500 can reduce the reflectivity of light (external light) incident from the outside toward the display device 1.

[0096] The display circuit board 50 can be attached to one side of the display panel 10. In particular, the display circuit board 50 can be attached to pads provided on one side of the display panel 10 using an anisotropic conductive film. The display circuit board 50 can be connected to a main circuit board (not shown) via a display connection unit (not shown).

[0097] The display panel 10 may include a display area DA and a pad area PDA. The display area DA has a width in a first direction (e.g., the x-direction) and a length in a second direction (e.g., the y-direction) intersecting the first direction. In this case, the display area DA and the pad area PDA may be arranged parallel to each other in the second direction, and a bending area BA may be disposed between the display area DA and the pad area PDA to connect the display area DA and the pad area PDA to each other. Additionally, the bending area BA may be bent so that the display area DA and the pad area PDA face each other. In this case, it will be understood that the bending area BA is connected to either edge of the display area DA.

[0098] The cover window 20 can be configured to cover the display panel 10. In one embodiment, the cover window 20 may include a transparent material. In another embodiment, the cover window 20 may include a glass material or a plastic material. The glass material may include ultra-thin glass. The plastic material may include polyethersulfone, polyacrylate, polyetherimide, polyethylene naphthalate, polyethylene terephthalate, polyphenylene sulfide, polyarylate, PI, polycarbonate, or cellulose acetate propionate, etc.

[0099] The first resin structure 30 may be configured to surround a side portion of the display panel 10. In an embodiment, the display panel 10 may include a first surface for displaying an image and a second surface including a side surface and a surface opposite to the first surface. A cover window 20 may be disposed on the first surface of the display panel 10, and the first resin structure 30 may be disposed on the second surface of the display panel 10. In this case, the first resin structure 30 may be disposed along the outer periphery of the display panel 10 and may extend to surround a side portion of the display panel 10. Accordingly, the first resin structure 30 may be configured to cover a portion of the second surface of the display panel 10 (e.g., the outer periphery of the display panel 10) and extend outward to cover the outer periphery of the cover window 20. In an embodiment, the first resin structure 30 may be configured as a closed loop along the outer periphery of the display panel 10.

[0100] In an embodiment, the first resin structure 30 may include resin. As described below, the first resin structure 30 can be formed by injecting resin into a mold and curing the injected resin.

[0101] Figure 6 According to the implementation method, along Figure 3 A schematic cross-sectional view of display device 1 taken by line VI-VI'.

[0102] Additionally, refer to Figure 6 In one embodiment, the display device 1 may include a second resin structure 40. The second resin structure 40 may be disposed within the opening region OA (i.e., the opening portion 10OP) as described above. That is, in one embodiment, the first resin structure 30 (refer to...) Figure 4 ) can be along the display panel 10 (reference) Figure 4 The outer periphery of the first resin structure 30 is provided, and in the plan view, the second resin structure 40 may be provided inside the inner periphery of the first resin structure 30.

[0103] In one embodiment, the second resin structure 40 may extend along the display panel 10 (see reference). Figure 4 The inner surface of the defined opening portion 10OP of the display panel 10 is configured as an annular shape. The second resin structure 40 is accessible to and attached to the inner surface of the defined opening portion 10OP of the display panel 10.

[0104] Additionally, in this embodiment, the second resin structure 40 may include a first portion 41 and a second portion 42. The first portion 41 may be disposed on the display panel 10 (see reference). Figure 4The first portion 41 is a portion of the inner surface of the defined opening portion 10OP. In an embodiment, the first portion 41 may be cylindrical, i.e., tubular. The second portion 42 may be a portion that projects radially outward from one end of the first portion 41. The second portion 42 may be configured to cover a second surface of the display panel 10 and may be configured to extend from the first portion 41 toward the outside of the opening region OA to cover at least a portion of the intermediate region MA. In an embodiment, the second portion 42 may be annular. The shape of the second resin structure 40 may be determined by the process of manufacturing the second resin structure 40.

[0105] The second resin structure 40 can contact and attach to the inner surface of the defined opening portion 10OP of the display panel 10 to prevent damage to the display panel 10 in the opening area OA. Specifically, when the first resin structure 30 is provided on the outer periphery of the display panel 10 and the second resin structure 40 is not provided, the display panel 10, particularly the optical functional layer 500, can be fixed by the first resin structure 30, thereby limiting shrinkage and expansion at the outer periphery of the display panel 10 due to temperature changes. Conversely, because there is no resin structure in the opening portion 10OP of the display panel 10, the display panel 10, particularly the optical functional layer 500, can experience concentrated shrinkage and expansion in the opening area OA, and thus the optical functional layer 500 can be damaged. According to embodiments of this disclosure, the display panel 10, particularly the optical functional layer 500, can have the same degree of shrinkage and expansion in the opening area OA, and damage is prevented by the second resin structure 40 contacting and attaching to the opening portion 10OP of the display panel 10.

[0106] In addition, the second resin structure 40 can be more firmly supported on the display panel 10 by the second part 42, and can be more firmly attached to the interior of the opening portion 10OP of the display panel 10 without removal.

[0107] Figure 7 For illustrative purposes, the display device 1 according to the embodiment... Figure 6 Enlarged cross-sectional view of section VII.

[0108] refer to Figure 7 The optical functional layer 500 may include a phase delay layer (PRL) 510, an adhesive layer 520, a first protective layer 530, a polarizing layer 540, and a second protective layer 550.

[0109] The polarizing layer 540 polarizes light incident from a light source (not shown) into light aligned with the polarization axis. In some embodiments, the polarizing layer 540 can be formed by including a polarizer and / or a dichroic dye in a polyvinyl alcohol (PVA) film. The dichroic dye may include iodine and / or other dichroic dyes.

[0110] In some embodiments, the polarizing layer 540 can be formed by stretching a PVA film in one direction and immersing the PVA film in a solution of iodine and / or a dichroic dye. In this case, the iodine molecules and / or the dichroic dye molecules are arranged parallel to the stretching direction. Because the iodine molecules and the dichroic dye molecules exhibit dichroism, they can absorb light vibrating in the stretching direction and transmit light vibrating in a direction perpendicular to the stretching direction.

[0111] PRL 510 may be disposed on one side (e.g., the lower part) of polarization layer 540 to delay the phase of light reflected by the metal layer inside display panel 10. For example, PRL 510 may delay the phase of the reflected light by λ / 4 to make the reflected light circularly polarized. Accordingly, the reflectivity of the light may be reduced. In some embodiments, PRL 510 may be wavelength dependent, and the phase delay value may decrease as the wavelength of the reflected light decreases.

[0112] The first protective layer 530 and the second protective layer 550 can support the polarizing layer 540 and the PRL 510, serving as protective layers to supplement the mechanical strength of the polarizing layer 540 and the PRL 510. The first protective layer 530 can be disposed between the polarizing layer 540 and the PRL 510. The second protective layer 550 can be disposed on the upper part of the polarizing layer 540. In this case, the first protective layer 530 can be attached to the PRL 510 via an adhesive layer 520. While the first protective layer 530 is described above as being disposed between the polarizing layer 540 and the PRL 510, in another embodiment, it will be understood that the first protective layer 530 can be disposed on the lower part of the PRL 510.

[0113] In one embodiment, the first protective layer 530 may comprise triacetyl cellulose (TAC), and the second protective layer 550 may comprise a cyclic olefin polymer (COP). Alternatively, in another embodiment, each of the first protective layer 530 and the second protective layer 550 may comprise at least one of TAC, COP, and polymethyl methacrylate (PMMA).

[0114] Additionally, although not illustrated in the accompanying drawings, in an embodiment, a hard coating may be applied to the second protective layer 550. The hard coating may be a component used to protect the optical functional layer 500 from external impacts. The hard coating may also have scratch-resistant properties.

[0115] As described above, the second resin structure 40 can extend along the defined opening portion 10OP of the display panel 10 (see above). Figure 6The second resin structure 40 contacts and attaches to the inner surface of the display panel 10. In this case, the second resin structure 40 can contact and attach to the optical functional layer 500. For example, the second resin structure 40 can be along the opening portion 10OP, particularly the fourth opening 500OP defined in the optical functional layer 500 (see...). Figure 6 The inner surface of the second resin structure 40 contacts and attaches to the opening portion 10OP. The second resin structure 40 may include a resin with high adhesive strength to firmly bond to the inner surface of the polarizing layer 540 of the optical functional layer 500.

[0116] In one embodiment, the second resin structure 40 may comprise a material different from that of the first resin structure 30. For example, the first resin structure 30 may comprise a silicon material, and the second resin structure 40 may comprise an acrylic material. The second resin structure 40 may have improved adhesion strength to the polarizing layer 540 via hydrogen bonds or covalent bonds. For this purpose, in one embodiment, the polarizing layer 540 may be pre-treated with a surface treatment (e.g., plasma treatment or ultraviolet ozone treatment). In one embodiment, the adhesion strength of the second resin structure 40 may be 10 N / cm. 2 Up to 50 N / cm 2 When the adhesive strength of the second resin structure 40 is less than 10 N / cm 2 At this time, the second resin structure 40 may detach due to weak adhesion to the inner surface of the optical functional layer 500, causing gaps. These gaps can lead to cracks in the optical functional layer 500. When the adhesive strength of the second resin structure 40 is greater than 50 N / cm... 2 At that time, due to the high adhesive strength, it may be difficult to control its application when the second resin structure 40 is used in the process.

[0117] Additionally, in this embodiment, the second resin structure 40 may include a black material. For example, the second resin structure 40 may include a black dye or the like. Accordingly, the second resin structure 40 can prevent cracks in the optical functional layer 500 while also preventing light leakage.

[0118] Figure 8 For the display panel 10 according to the embodiment (reference) Figure 2 A schematic cross-sectional view of ).

[0119] refer to Figure 8 Display panel 10 (reference) Figure 2 It may include a substrate 100, a display layer D, and a touch sensor layer 400 (see reference). Figure 5 ) and optical functional layer 500 (reference) Figure 5 The following mainly describes the substrate 100 and the display layer D. The display layer D can be provided by stacking a buffer layer 110, a circuit layer, a display element layer, and a thin film encapsulation layer 300.

[0120] As described above, substrate 100 may include an insulating material (e.g., glass, quartz, or polymer resin). Substrate 100 may be a flexible substrate capable of being bent, folded, or rolled up.

[0121] A buffer layer 110 may be located on the substrate 100 to reduce or block the infiltration of foreign matter, moisture, or external air from beneath the substrate 100 and to provide a flat surface on the substrate 100. The buffer layer 110 may comprise inorganic materials (e.g., oxides or nitrides), organic materials, or organic-inorganic composites, and may comprise a single-layer structure or a multilayer structure, each comprising inorganic and organic materials. A further insulating layer (not shown) may be included between the substrate 100 and the buffer layer 110 to block the infiltration of external air. In some embodiments, the buffer layer 110 may comprise silicon oxide (SiO2) or silicon nitride (SiN). x The buffer layer 110 can be provided by stacking the first buffer layer 110a and the second buffer layer 110b.

[0122] The circuit layer may be disposed on the buffer layer 110 and includes a pixel circuit PC, a first gate insulating layer 120, a second gate insulating layer 130, a sandwich insulating layer 150, and a planarization layer 170. The pixel circuit PC may include a thin-film transistor (TFT) and a storage capacitor Cst.

[0123] A thin-film transistor (TFT) may be disposed on the buffer layer 110. The TFT may include a first semiconductor layer A1, a first gate electrode G1, a first source electrode S1, and a first drain electrode D1. The TFT may be connected to an organic light-emitting diode (OLED) to drive the OLED.

[0124] The first semiconductor layer A1 may be disposed on the buffer layer 110 and may include polycrystalline silicon. In another embodiment, the first semiconductor layer A1 may include amorphous silicon. In yet another embodiment, the first semiconductor layer A1 may include an oxide of at least one material selected from the group consisting of indium (In), gallium (Ga), tin (Sn), zirconium (Zr), vanadium (V), hafnium (Hf), cadmium (Cd), germanium (Ge), chromium (Cr), titanium (Ti), and zinc (Zn). The first semiconductor layer A1 may include a channel region, a source region, and a drain region, wherein the source and drain regions are doped with impurities.

[0125] The first gate insulating layer 120 may be provided to cover the first semiconductor layer A1. The first gate insulating layer 120 may include an inorganic insulating material (e.g., silicon oxide (SiO2), silicon nitride (SiN)). x ), silicon oxynitride (SiON), aluminum oxide (Al2O3), titanium oxide (TiO2), tantalum pentoxide (Ta2O5), hafnium oxide (HfO2) or zinc oxide (ZnO) x(etc.). The first gate insulating layer 120 may include a single-layer structure or a multi-layer structure, each comprising the aforementioned inorganic insulating material.

[0126] The first gate electrode G1 is disposed on the first gate insulating layer 120 to overlap with the first semiconductor layer A1. The first gate electrode G1 may include molybdenum (Mo), aluminum (Al), copper (Cu), or titanium (Ti), and may include a single-layer structure or a multi-layer structure. For example, the first gate electrode G1 may have a structure with a single Mo layer.

[0127] The second gate insulating layer 130 may be provided to cover the first gate electrode G1. The second gate insulating layer 130 may include an inorganic insulating material (e.g., silicon oxide (SiO2), silicon nitride (SiN)). x ), silicon oxynitride (SiON), aluminum oxide (Al2O3), titanium oxide (TiO2), tantalum pentoxide (Ta2O5), hafnium oxide (HfO2) or zinc oxide (ZnO) x (etc.). The second gate insulating layer 130 may include a single-layer structure or a multi-layer structure, each comprising the aforementioned inorganic insulating material.

[0128] The first upper electrode CE2 of the storage capacitor Cst can be disposed on the second gate insulating layer 130.

[0129] In the display area DA (reference) Figure 3 In this structure, the first upper electrode CE2 may overlap with the first gate electrode G1 disposed below the first upper electrode CE2. The overlapping first gate electrode G1 and the first upper electrode CE2 may form a storage capacitor Cst, wherein the second gate insulating layer 130 is between the first gate electrode G1 and the first upper electrode CE2. The first gate electrode G1 may be the first lower electrode CE1 of the storage capacitor Cst.

[0130] The first upper electrode CE2 may include Al, platinum (Pt), palladium (Pd), silver (Ag), magnesium (Mg), gold (Au), nickel (Ni), neodymium (Nd), iridium (Ir), chromium (Cr), calcium (Ca), Mo, Ti, tungsten (W), and / or Cu, and may include a single-layer structure or a multi-layer structure comprising each of the above materials.

[0131] The interlayer insulating layer 150 may be formed to cover the first upper electrode CE2. The interlayer insulating layer 150 may include inorganic insulating materials, such as silicon oxide (SiO2) or silicon nitride (SiN). x ), silicon oxynitride (SiON), aluminum oxide (Al2O3), titanium oxide (TiO2), tantalum oxide (Ta2O5), hafnium oxide (HfO2) or zinc oxide (ZnO) x (e.g., etc.) The interlayer insulation layer 150 may include a single-layer structure or a multi-layer structure, each comprising the aforementioned inorganic insulating material.

[0132] The first source electrode S1 and the first drain electrode D1 are disposed on the interlayer insulating layer 150. The first source electrode S1 and the first drain electrode D1 may each comprise a conductive material (such as Mo, Al, Cu, or Ti), and may each comprise a multilayer structure or a single-layer structure comprising the aforementioned conductive material. For example, the first source electrode S1 and the first drain electrode D1 may each have a Ti / Al / Ti multilayer structure.

[0133] The planarization layer 170 may be configured to cover the first source electrode S1 and the first drain electrode D1. The planarization layer 170 may have a flat surface, such that the pixel electrode 210 disposed on the planarization layer 170 can be formed flatly.

[0134] Planarization layer 170 may include organic or inorganic insulating materials and may have a single-layer or multi-layer structure. Planarization layer 170 may include general-purpose polymers (e.g., benzocyclobutene (BCB), PI, hexamethyldisiloxane (HMDSO), PMMA, or polystyrene), phenolic polymer derivatives, acrylic polymers, imide polymers, aryl ether polymers, amide polymers, fluoropolymers, p-xylene polymers, or vinyl alcohol polymers, etc. Planarization layer 170 may include inorganic insulating materials (e.g., silicon oxide (SiO2), silicon nitride (SiN)). x ), silicon oxynitride (SiON), aluminum oxide (Al2O3), titanium oxide (TiO2), tantalum pentoxide (Ta2O5), hafnium oxide (HfO2) or zinc oxide (ZnO) x (etc.) When the planarization layer 170 is formed, a layer can be formed, and then the upper surface of the layer can be chemically and mechanically polished to provide a flat upper surface.

[0135] The planarization layer 170 may have a via that exposes either the first source electrode S1 or the first drain electrode D1 of the thin-film transistor TFT, and the pixel electrode 210 may be electrically connected to the thin-film transistor TFT by contacting the first source electrode S1 or the first drain electrode D1 via the via.

[0136] Pixel electrode 210 may include a conductive oxide (e.g., indium tin oxide (ITO), indium zinc oxide (IZO), zinc oxide (ZnO), indium oxide (In₂O₃), indium gallium oxide (IGO), or aluminum zinc oxide (AZO)). Pixel electrode 210 may include a reflective film comprising Ag, Mg, Al, Pt, Pd, Au, Ni, Nd, Ir, Cr, or compounds thereof. For example, pixel electrode 210 may have a structure in which a film comprising ITO, IZO, ZnO, or In₂O₃ is present on or beneath the aforementioned reflective film. In this case, pixel electrode 210 may have an ITO / Ag / ITO stacked structure.

[0137] A pixel defining layer 190 may be disposed on the planarization layer 170 to cover the edge of the pixel electrode 210, and may have a pixel opening OP1 exposing the central portion of the pixel electrode 210. Organic light-emitting diode OLED (i.e., sub-pixel P (reference) Figure 3 The size and shape of the emission area are defined by the pixel aperture OP1.

[0138] The pixel defining layer 190 can prevent arcing at the edge of the pixel electrode 210 by increasing the distance between the edge of the pixel electrode 210 and the counter electrode 230 above the pixel electrode 210. The pixel defining layer 190 can be formed from an organic insulating material (e.g., PI, polyamide, acrylic resin, BCB, HMDSO, and phenolic resin) by spin coating or the like.

[0139] Multiple emitting layers 220b, each corresponding to a plurality of pixel electrodes 210, may be disposed within the pixel opening OP1 of the pixel defining layer 190. The emitting layers 220b may comprise polymer materials or low molecular weight materials and may emit red, green, blue, or white light.

[0140] The organic functional layer 220e may be disposed on and / or below the emitter layer 220b. The organic functional layer 220e may include a first functional layer 220a and / or a second functional layer 220c. The first functional layer 220a or the second functional layer 220c may be omitted.

[0141] The first functional layer 220a may be disposed below the emitter layer 220b. The first functional layer 220a may be a single-layer structure or a multi-layer structure, each comprising an organic material. The first functional layer 220a may be a hole transport layer (HTL) with a single-layer structure. Optionally, the first functional layer 220a may include a hole injection layer (HIL) and an HTL. The first functional layer 220a may be integrally formed to correspond to the display area DA (reference). Figure 3 ) and the intermediate region MA (reference) Figure 3 Organic light-emitting diodes (OLEDs) are included in this.

[0142] The second functional layer 220c may be disposed on the emitter layer 220b. The second functional layer 220c may be a single-layer structure or a multi-layer structure, each comprising an organic material. The second functional layer 220c may include an electron transport layer (ETL) and / or an electron injection layer (EIL). The second functional layer 220c may be integrally formed to correspond to the display area DA (reference). Figure 3 Organic light-emitting diodes (OLEDs) are included in this.

[0143] Counter electrode 230 is disposed on the second functional layer 220c. Counter electrode 230 may include a conductive material with low work function. For example, counter electrode 230 may include a (semi-)transparent layer, which may include Ag, Mg, Al, Pt, Pd, Au, Ni, Nd, Ir, Cr, lithium (Li), Ca, or alloys thereof. Optionally, counter electrode 230 may further include a layer on top of the (semi-)transparent layer comprising the above-mentioned materials, such as a layer comprising ITO, IZO, ZnO, or In2O3. Counter electrode 230 may be integrally formed to correspond to display area DA (reference). Figure 3 Organic light-emitting diodes (OLEDs) are included in this.

[0144] In the display area DA (reference) Figure 3 The layer formed from pixel electrode 210 to counter electrode 230 in the process can form an organic light-emitting diode (OLED).

[0145] An upper layer 250, comprising an organic material, may be formed on the counter electrode 230. The upper layer 250 may provide a layer for increasing light extraction efficiency while protecting the counter electrode 230. The upper layer 250 may comprise an organic material having a higher refractive index than the counter electrode 230. Alternatively, the upper layer 250 may be provided by stacking layers having different refractive indices from each other. For example, the upper layer 250 may be provided by stacking a high refractive index layer / a low refractive index layer / a high refractive index layer. In this case, the refractive index of the high refractive index layer may be 1.7 or greater, and the refractive index of the low refractive index layer may be 1.3 or less.

[0146] The upper layer 250 may further include lithium fluoride (LiF). Optionally, the upper layer 250 may further include inorganic insulating materials (e.g., silicon oxide (SiO2) and silicon nitride (SiN)). x The upper layer 250 can be omitted when necessary. However, for ease of explanation, the following mainly describes in detail the case where the upper layer 250 is disposed on the counter electrode 230.

[0147] The thin-film encapsulation layer 300 can be configured to directly contact the upper layer 250. In this case, the thin-film encapsulation layer 300 can cover the display area DA (reference). Figure 3 ) and peripheral region PA (reference) Figure 3 As part of the structure, it prevents the penetration of external moisture and oxygen. The thin-film encapsulation layer 300 may include at least one organic encapsulation layer and at least one inorganic encapsulation layer. For ease of explanation, the following mainly describes in detail the case where the thin-film encapsulation layer 300 includes a first inorganic encapsulation layer 310, an organic encapsulation layer 320, and a second inorganic encapsulation layer 330 sequentially stacked on the upper surface of the upper layer 250.

[0148] In this case, the first inorganic encapsulation layer 310 may cover the counter electrode 230 and may include silicon oxide, silicon nitride, and / or silicon oxynitride, etc. Because the first inorganic encapsulation layer 310 is formed along the underlying structure, its upper surface may not be flat. An organic encapsulation layer 320 covers the first inorganic encapsulation layer 310, and unlike the first inorganic encapsulation layer 310, its upper surface may be formed to be substantially flat. In particular, the organic encapsulation layer 320 may be formed corresponding to the display area DA (reference...). Figure 3 The portion of the organic encapsulation layer 320 has a substantially flat upper surface. The organic encapsulation layer 320 may include one or more materials selected from the group consisting of: PET, polyethylene naphthalate, polycarbonate, PI, polyethylene sulfonate, polyoxymethylene, polyarylate, and HMDSO. The second inorganic encapsulation layer 330 may cover the organic encapsulation layer 320 and may include silicon oxide, silicon nitride, and / or silicon oxynitride, etc.

[0149] Touch sensor layer 400 (reference) Figure 2 ) and optical functional layer 500 (reference) Figure 2 It can be set on the thin film encapsulation layer 300.

[0150] Figure 9 and Figure 10 Each is shown illustratively. Figure 8 Display panel 10 (reference) Figure 2 The circuit diagram of the pixel circuit PC.

[0151] refer to Figure 9 and Figure 10 The pixel circuit PC can be connected to the light-emitting element ED to realize the emission of sub-pixels. The pixel circuit PC includes a driving thin-film transistor T1, a switching thin-film transistor T2, and a storage capacitor Cst. The switching thin-film transistor T2 is connected to the scan line SL and the data line DL, and is configured to transmit the data signal Dm input through the data line DL to the driving thin-film transistor T1 according to the scan signal Sn input through the scan line SL.

[0152] The storage capacitor Cst is connected to the switching thin-film transistor T2 and the drive voltage line PL, and stores the voltage corresponding to the difference between the voltage received from the switching thin-film transistor T2 and the drive voltage ELVDD supplied to the drive voltage line PL.

[0153] The driving thin-film transistor T1 can be connected to the driving voltage line PL and the storage capacitor Cst, and the driving current flowing from the driving voltage line PL to the light-emitting element ED can be controlled according to the voltage value stored in the storage capacitor Cst. The light-emitting element ED can emit light with a specific brightness according to the driving current.

[0154] although Figure 9The pixel circuit PC is explained to include two thin-film transistors and a storage capacitor, but this disclosure is not limited thereto.

[0155] refer to Figure 10 The pixel circuit PC may include a driving thin-film transistor T1, a switching thin-film transistor T2, a compensation thin-film transistor T3, a first initialization thin-film transistor T4, an operation control thin-film transistor T5, an emission control thin-film transistor T6, and a second initialization thin-film transistor T7.

[0156] although Figure 10 Each pixel circuit PC is illustrated to include signal lines SL, SL-1, SL+1, EL, and DL, an initialization voltage line VL, and a drive voltage line PL; however, this disclosure is not limited thereto. As another embodiment, at least one of the signal lines SL, SL-1, SL+1, EL, and DL and / or the initialization voltage line VL may be shared by adjacent pixel circuits.

[0157] The drain electrode of the driving thin-film transistor T1 can be electrically connected to the light-emitting element ED via the emitter control thin-film transistor T6. The driving thin-film transistor T1 receives the data signal Dm in response to the switching operation of the switching thin-film transistor T2 and supplies driving current to the light-emitting element ED.

[0158] The gate electrode of the switching thin-film transistor T2 is connected to the scan line SL, and the source electrode of the switching thin-film transistor T2 is connected to the data line DL. The drain electrode of the switching thin-film transistor T2 can be connected to the drive voltage line PL via the operating control thin-film transistor T5, and is also connected to the source electrode of the driving thin-film transistor T1.

[0159] The switching thin-film transistor T2 can be turned on in response to the scan signal Sn received through the scan line SL, and can perform a switching operation to transmit the data signal Dm received through the data line DL to the source electrode of the driving thin-film transistor T1.

[0160] The gate electrode of the compensation thin-film transistor T3 can be connected to the scan line SL. The source electrode of the compensation thin-film transistor T3 can be connected to the pixel electrode of the light-emitting element ED via the emission control thin-film transistor T6, and simultaneously connected to the drain electrode of the driving thin-film transistor T1. The drain electrode of the compensation thin-film transistor T3 can be simultaneously connected to any electrode of the storage capacitor Cst, the source electrode of the first initialization thin-film transistor T4, and the gate electrode of the driving thin-film transistor T1. The compensation thin-film transistor T3 is turned on in response to the scan signal Sn received via the scan line SL, and connects the gate electrode and drain electrode of the driving thin-film transistor T1 to each other, thereby connecting the diode of the driving thin-film transistor T1.

[0161] The gate electrode of the first initialization thin-film transistor T4 can be connected to the previous scan line SL-1. The drain electrode of the first initialization thin-film transistor T4 can be connected to the initialization voltage line VL. The source electrode of the first initialization thin-film transistor T4 can be simultaneously connected to any electrode of the storage capacitor Cst, the drain electrode of the compensation thin-film transistor T3, and the gate electrode of the driving thin-film transistor T1. The first initialization thin-film transistor T4 can be turned on in response to the previous scan signal Sn-1 received through the previous scan line SL-1, and is configured to transmit the initialization voltage Vint to the gate electrode of the driving thin-film transistor T1 to perform an initialization operation of the voltage of the gate electrode of the driving thin-film transistor T1.

[0162] The gate electrode of the operating control thin-film transistor T5 can be connected to the emitter control line EL. The source electrode of the operating control thin-film transistor T5 can be connected to the drive voltage line PL. The drain electrode of the operating control thin-film transistor T5 can be connected to the source electrode of the driving thin-film transistor T1 and the drain electrode of the switching thin-film transistor T2.

[0163] The gate electrode of the emitter control thin-film transistor T6 can be connected to the emitter control line EL. The source electrode of the emitter control thin-film transistor T6 can be connected to the drain electrode of the driving thin-film transistor T1 and the source electrode of the compensation thin-film transistor T3. The drain electrode of the emitter control thin-film transistor T6 can be electrically connected to the pixel electrode of the light-emitting element ED. When the operation control thin-film transistor T5 and the emitter control thin-film transistor T6 are simultaneously turned on in response to the emitter control signal En received through the emitter control line EL, the driving voltage ELVDD is transmitted to the light-emitting element ED, and the driving current flows through the light-emitting element ED.

[0164] The gate electrode of the second initialization thin-film transistor T7 can be connected to the next scan line SL+1. The source electrode of the second initialization thin-film transistor T7 can be connected to the pixel electrode of the light-emitting element ED. The drain electrode of the second initialization thin-film transistor T7 can be connected to the initialization voltage line VL. The second initialization thin-film transistor T7 can be turned on in response to the next scan signal Sn+1 received through the next scan line SL+1 to initialize the pixel electrode of the light-emitting element ED.

[0165] although Figure 10 The present invention describes a scenario where the first initialization thin-film transistor T4 and the second initialization thin-film transistor T7 are respectively connected to the previous scan line SL-1 and the next scan line SL+1, but this disclosure is not limited thereto. As another embodiment, both the first initialization thin-film transistor T4 and the second initialization thin-film transistor T7 may be connected to the previous scan line SL-1 to be driven according to the previous scan signal Sn-1.

[0166] Any one electrode of the storage capacitor Cst can be simultaneously connected to the gate electrode of the driving thin-film transistor T1, the drain electrode of the compensation thin-film transistor T3, and the source electrode of the first initialization thin-film transistor T4. The other electrode of the storage capacitor Cst can be connected to the driving voltage line PL.

[0167] The counter electrode (e.g., cathode) of the light-emitting element ED receives a common voltage ELVSS. The light-emitting element ED receives a drive current from the driving thin-film transistor T1 to emit light.

[0168] Pixel circuit PC is not limited to reference Figure 9 and Figure 10 The number of thin-film transistors and storage capacitors, as well as the circuit design, are described, and the number of thin-film transistors and storage capacitors, as well as the circuit design, can be varied.

[0169] Figure 11 This is a schematic perspective view of a manufacturing apparatus 1000 for a display device according to an embodiment. Figure 12 This is a schematic diagram of a manufacturing apparatus 1000 for a display device as viewed in direction A according to an embodiment. Figure 12 It mainly explains the mold in detail. Figure 13 According to the implementation method, along Figure 12 A cross-sectional view of the manufacturing equipment 1000 of the display device, taken by line B-B'. Figure 14 According to the implementation method, along Figure 12 The cross-sectional view of the manufacturing equipment 1000 of the display device is taken by line C-C'. Figure 15 This is a schematic perspective view of the second mold 1260 according to an embodiment.

[0170] refer to Figures 11 to 15 The manufacturing equipment 1000 for the display device may include a first fixture 1100, a mold 1200, a second fixture 1300, a driver (not shown), and a light source unit 1600.

[0171] The first clamp 1100 may include a first clamp body 1110, a pressure unit 1120, a coupling unit 1130, and a first injection unit 1140. The pressure unit 1120 may protrude from the first clamp body 1110. The pressure unit 1120 may contact a portion of the display panel 10 to apply force to that portion of the display panel 10. The coupling unit 1130 may protrude from the first clamp body 1110. In this case, the coupling unit 1130 may be formed in the form of a pin to protrude from the first clamp body 1110. In this case, multiple coupling units 1130 may be provided, and the multiple coupling units 1130 may be disposed at the corners of the first clamp body 1110 and spaced apart from each other. The first injection unit 1140 may be disposed on the first clamp body 1110. In this case, at least one first injection unit 1140 may be provided, and when multiple first injection units 1140 are provided, the multiple first injection units 1140 may be arranged to be spaced apart from each other. The first injection unit 1140 can be connected to a separate supply unit and pipeline for supplying photocurable resin from the outside, or can be inserted with a nozzle for spraying photocurable resin.

[0172] The mold 1200 may move together with or be coupled to the first clamp 1100. The mold 1200 may include a mold body 1210, a first mold 1220, a second mold 1260, a second injection unit 1230, and a first receiving portion 1240. The mold body 1210 may be in the form of a plate and may be in close contact with the second clamp 1300. The first mold 1220 may protrude from the mold body 1210 toward the first clamp 1100. The first mold 1220 may include a mold opening 1221, and a pressure unit 1120 may be inserted into the mold opening 1221. In this case, the pressure unit 1120 may pass through the mold opening 1221 to contact the display panel 10, for example, contacting the rear surface that is part of the second surface of the display panel 10. The second injection unit 1230 may be configured to correspond to the first injection unit 1140. The second injection unit 1230 may be disposed within the first mold 1220. The first receiving portion 1240 may be configured to correspond to the connecting unit 1130. In this case, the first receiving portion 1240 may be in the form of a hole.

[0173] The second mold 1260 may be disposed inside the mold opening 1221 defined by the first mold 1220. That is, in the plan view, the second mold 1260 may be disposed within the outer periphery of the first mold 1220, which is formed as a closed loop. As described above, the first mold 1220 may be a mold configured to inject resin into the edge of the display panel 10, and the second mold 1260 may be a mold configured to inject resin into the opening portion 10OP of the display panel 10.

[0174] In one embodiment, the second mold 1260 may include a shaft 1261 and a cover 1262. The shaft 1261 may extend in one direction (e.g., a third direction (z-direction)). Here, the z-direction may be referred to as the "vertical direction." That is, the shaft 1261 may project from the mold body 1210 toward the first clamp 1100. The width of the shaft 1261 in the direction perpendicular to the z-direction may be less than the opening portion 10OP (see [link to original document]). Figure 2 (or opening area OA (see)) Figure 2 Width in the same direction. Cover 1262 may include a flat portion and a protruding portion projecting from the flat portion into the display panel 10. The flat portion of cover 1262 may contact and connect to the end of shaft 1261, for example, the upper surface (the surface in the +z direction, see...) Figure 15 (The dashed line in the middle). Figure 14 The flat surface of the flat portion of the cover 1262 can contact and connect to the upper surface of the shaft 1261, and the inner surface of the protruding portion of the cover 1262 can be spaced apart from the outer peripheral surface of the shaft 1261 to surround the outer peripheral surface of the shaft 1261. In this case, the length of the inner surface of the protruding portion of the cover 1262 in the third direction can be less than the length of the shaft 1261 in the third direction (i.e., the extension length of the shaft 1261). Although the protruding portion of the cover 1262 can contact the pad 800, the flat surface of the flat portion can not contact the pad 800. The width of the inner surface of the protruding portion in the direction perpendicular to the z-direction can be greater than the width of the opening portion 10OP (or the opening area OA) in the same direction. Accordingly, the second mold 1260 can form a space (i.e., the second space CV2) along the inner surface of the opening portion 10OP of the display panel 10, and resin can be injected into the space.

[0175] The second clamp 1300 may include a second clamp body 1310 in the form of a plate and a second receiving portion 1320 therein into which the connecting unit 1130 is inserted. The second receiving portion 1320 may be disposed in the second clamp body 1310 to correspond to the connecting unit 1130 and the first receiving portion 1240. In this case, the second receiving portion 1320 may be in the form of a portion of the connecting unit 1130 protruding through the first receiving portion 1240 into which it is inserted.

[0176] An actuator may be connected to at least one of the first clamp 1100 and the second clamp 1300 to linearly move at least one of the first clamp 1100 and the second clamp 1300. For example, the actuator may be connected to the first clamp 1100 and move the first clamp 1100 closer to or further away from the second clamp 1300. Alternatively, the actuator may be connected to the second clamp 1300 and move the second clamp 1300 closer to or further away from the first clamp 1100. Another embodiment may include a first actuator 1400 connected to the first clamp 1100 and a second actuator 1500 connected to the second clamp 1300. For ease of description, the following description focuses primarily on the case where the actuator includes both the first actuator 1400 and the second actuator 1500.

[0177] The actuator can be formed in various forms. For example, the actuator may include a cylinder. As another embodiment, the actuator may include a linear motor. As yet another embodiment, the actuator may also include a motor and a ball screw connected to the motor. In this case, the actuator is not limited to these and may include all means and all structures connected to at least one of the first clamp 1100 and the second clamp 1300 to move at least one of the first clamp 1100 and the second clamp 1300.

[0178] The light source unit 1600 may be disposed near the side surface of the display panel 10 to illuminate the display panel 10. In this case, the light source unit 1600 may emit visible light outward. In particular, the light source unit 1600 may supply light in the range of wavelength peak values ​​of 450 nm or greater and 500 nm or less. The light source unit 1600 may be in various forms. For example, the light source unit 1600 may be in the form of a point light source. As another embodiment, the light source unit 1600 may be disposed near a portion of the side surface of the display panel 10, and may also be formed in a linear shape. The light source unit 1600 may also be configured to completely surround the side surface of the display panel 10.

[0179] Referring to the operation of the manufacturing equipment 1000 for the reference display device, after the display panel 10 is placed on the second fixture 1300, the first fixture 1100 and the mold 1200 can be placed on the display panel 10. In this case, at least one of the first driver 1400 and the second driver 1500 can arrange the first fixture 1100 and the second fixture 1300 to be spaced apart from each other. Alternatively, the mold 1200 can be coupled to the first fixture 1100, or the mold 1200 can be placed on the display panel 10 independently. In this case, the mold 1200 and the second fixture 1300 can be arranged such that the first receiving portion 1240 and the second receiving portion 1320 correspond to each other.

[0180] At least one of the first driver 1400 and the second driver 1500 is operable to bring the first clamp 1100 and the second clamp 1300 close together. In this case, the first clamp 1100 can be in close contact with the second clamp 1300. The first clamp 1100 (e.g., pressure unit 1120) can be inserted into the mold opening 1221 to contact the display panel 10 and apply force to the display panel 10 so as to prevent the display panel 10 from moving. In addition, the coupling unit 1130 can be inserted into the first receiving portion 1240 and the second receiving portion 1320 to prevent the mold 1200 from moving and to prevent the first clamp 1100 and the second clamp 1300 from moving relative to each other.

[0181] When the above process is completed, the mold 1200, the second fixture 1300, and the display panel 10 can form a first space CV1 and a second space CV2. The first space CV1 is the space formed by the first mold 1220 and can be formed along the outer periphery of the display panel 10. The second space CV2 is the space formed by the second mold 1260 and can be formed in the opening portion 10OP in the display panel 10 (see...). Figure 2 The photocurable resin can be injected into the first space CV1 through the first injection unit 1140 and the second injection unit 1230, which are connected to the first space CV1. Similarly, the photocurable resin can be injected into the second space CV2 through the corresponding injection unit connected to the second space CV2.

[0182] Subsequently, light can be irradiated from the light source unit 1600 onto the entire side surface of the first clamp 1100 and the mold 1200 to cure the photocurable resin. In this case, each of the first clamp 1100 and the mold 1200 may include a transparent material. For example, the first clamp 1100 may include at least one of PMMA, polycarbonate (PC), glass, and quartz as transparent materials. In addition, the mold 1200 may have a certain degree of stretchability and may include at least one of silicone rubber, plastic rubber, and Teflon rubber.

[0183] When the photocurable resin has cured by light irradiation, at least one of the first actuator 1400 and the second actuator 1500 can be operated to separate the first clamp 1100 and the second clamp 1300. In this case, the mold 1200 can move together with the first clamp 1100 to separate from the second clamp 1300, or the first clamp 1100 can separate from the mold 1200, and then the mold 1200 can be removed separately.

[0184] As described above, the connecting unit 1130 is provided in the first clamp 1100, but this disclosure is not limited thereto. As another embodiment, the connecting unit 1130 may be disposed in the second clamp 1300, and the second receiving portion 1320 may be disposed in the first clamp 1100. As another embodiment, the connecting unit 1130 may be disposed on the mold 1200, the first receiving portion 1240 may be disposed in the first clamp 1100, and the second receiving portion 1320 may be disposed in the second clamp 1300. In this case, the connecting unit 1130 of the mold 1200 may include a first connecting unit (not shown) protruding toward the first clamp 1100 and a second connecting unit (not shown) protruding toward the second clamp 1300.

[0185] The methods for forming the first resin structure (not shown) and the second resin structure (not shown) are described in detail below.

[0186] The first mold 1220 can be configured to surround the edges of the display panel 10, i.e., multiple edges. The first mold 1220 can form a first space CV1 at the edges of the display panel 10, i.e., multiple edges. The second mold 1260 can be disposed at the opening portion 10OP of the display panel 10 (see...). Figure 2 In the second mold 1260, the shaft 1261 can be inserted into the opening portion 10OP on the second surface of the display panel 10. In this case, Figure 14 The lower end of the protruding portion of the cover 1262 can contact the pad 800. That is, the cover 1262 can cover the opening area 0A of the display panel 10 (see...). Figure 2 ) and the intermediate region MA (see Figure 2 Part of the second mold 1260. The second mold 1260 can form a second space CV2 in the opening region OA (i.e., the opening portion 10OP).

[0187] Next, after connecting the first fixture 1100, the mold 1200, and the second fixture 1300 to each other, a photocurable resin can be injected into the first space CV1 and the second space CV2. In this case, in the embodiment, the resins injected into the first space CV1 and the second space CV2 can be different from each other.

[0188] Subsequently, the light source unit 1600 can irradiate light onto the side surface of the display panel 10 from outside the first fixture 1100 and the mold 1200. This allows the photocurable resin disposed in the first space CV1 and the second space CV2 to be cured.

[0189] In this case, the photocurable resin disposed in the first space CV1 can form a first resin structure (not shown), and the photocurable resin disposed in the second space CV2 can form a second resin structure (not shown).

[0190] According to embodiments of this disclosure, damage to the display panel can be prevented by protecting the edges of the display panel.

[0191] In addition, it can prevent damage to the openings in the display panel.

[0192] The effects of this disclosure are not limited to those mentioned above, and other effects not mentioned will be clearly understood by those skilled in the art from the description of the claims.

[0193] It should be understood that the embodiments described herein are for descriptive purposes only and are not intended to be limiting. The description of features or aspects in each embodiment should generally be considered in light of other similar features or aspects that may be used in other embodiments. Although one or more embodiments have been described with reference to the figures, those skilled in the art will understand that various changes in form and detail may be made therein without departing from the spirit and scope defined by the appended claims.

Claims

1. A display device, comprising: The display panel includes an opening area having an opening portion, a display area at least partially surrounding the opening area, and an intermediate area located between the opening area and the display area; An overlay window is configured to cover the first surface of the display panel; A first resin structure is disposed along the outer periphery of the display panel on a second surface of the display panel, wherein the second surface includes a side surface of the display panel and a surface of the display panel opposite to the first surface; as well as The second resin structure is disposed inside the opening portion.

2. The display device according to claim 1, wherein, In the plan view, the second resin structure is disposed inside the inner periphery of the first resin structure.

3. The display device according to claim 1, wherein, In the plan view, the second resin structure is arranged in a ring shape along the inner surface of the display panel, and the inner surface of the display panel defines the opening portion.

4. The display device according to claim 1, wherein the second resin structure comprises: The first part is disposed on the inner surface of the display panel, the inner surface defining the opening portion, and The second part extends from the first part to the outside of the opening area to cover at least a portion of the intermediate area.

5. The display device according to claim 4, wherein the first portion is provided in a cylindrical shape and the second portion is provided in a ring shape.

6. The display device according to claim 1, wherein the second resin structure comprises a material different from the material of the first resin structure.

7. The display device according to claim 1, wherein the display panel further comprises: Image generation layer, used to emit light to display images; as well as An optical functional layer is disposed on top of the image generation layer, and The second resin structure is bonded to the inner surface of the optical functional layer, and the inner surface of the optical functional layer defines the opening portion.

8. The display device according to claim 7, wherein the optical functional layer comprises: A first protective layer, a second protective layer, and a polarizing layer between the first protective layer and the second protective layer, and The second resin structure is bonded to the inner surface of the polarizing layer, and the inner surface of the polarizing layer defines the opening portion.

9. The display device according to claim 8, wherein the second resin structure is bonded to the inner surface of the polarization layer by hydrogen bonds or covalent bonds.

10. The display device according to claim 1, wherein the second resin structure comprises an acrylic material.

11. The display device according to claim 10, wherein the adhesive strength of the second resin structure is 10 N / cm. 2 Up to 50 N / cm 2 .

12. A manufacturing apparatus for a display device, comprising: First clamp; The second clamp has a display panel with an opening mounted on it and is positioned to face the first clamp; A first mold is disposed between the first clamp and the second clamp, selectively connected to the first clamp, and together with the second clamp, forms a first space outside the edge portion of the display panel so as to inject resin into the first space; as well as The second mold forms a second space inside the opening portion so that resin can be injected into the second space.

13. The manufacturing apparatus of claim 12, wherein the second mold comprises: The axis extends vertically, and The cover has a flat portion connected to the upper surface of the shaft and a protruding portion spaced apart from and surrounding the outer peripheral surface of the shaft.

14. The manufacturing apparatus of claim 13, wherein the length of the shaft in the vertical direction is greater than the length of the protruding portion of the cover in the vertical direction.

15. The manufacturing apparatus of claim 12, wherein, in a plan view, the second mold is disposed inside the edge of the first mold that is formed as a closed loop.

16. A method of manufacturing a display device, the method comprising: A display panel with an opening is provided on a second clamp spaced apart from the first clamp; By setting the first fixture and mold on the display panel, a space is formed in the display panel and around the edge portion of the display panel; A photocurable resin is supplied to the space; as well as The photocurable resin is cured by shining light into the space. The mold includes: a first mold that surrounds an edge portion of the display panel to form a first space; And a second mold, forming a second space in the opening portion, and the space comprising the first space and the second space.

17. The method of claim 16, wherein the second mold comprises: The axis extends vertically, and The cover has a flat portion connected to the upper surface of the shaft and a protruding portion spaced apart from and surrounding the outer peripheral surface of the shaft.

18. The method of claim 16, wherein the photocurable resin supplied to the first space is different from the photocurable resin supplied to the second space.

19. The method of claim 16, wherein the adhesive strength of the photocurable resin supplied to the second space is 10 N / cm. 2 Up to 50 N / cm 2 .

20. An electronic device comprising: The display device according to any one of claims 1 to 11 or the display device manufactured by the method according to any one of claims 16 to 19; as well as A housing that accommodates the display device.

Images