A semiconductor dual-layer bonder environment control system

Abstract

The present application relates to the technical fields of semiconductor double-layer bonding machine, and particularly relates to a semiconductor double-layer bonding machine environment control system, which comprises a bonding machine box body, the bonding machine box body comprises a fixed table, the fixed table is provided with a chuck workbench, the upper portion of the fixed table is provided with an FFU module, the lower portion of the fixed table is provided with a local heat source wind collecting box and a wind collecting pipeline; a filtering assembly, the filtering assembly comprises a processing box, a plurality of groups of ionization pieces and anode plates are arranged at intervals in the processing box, a movable cleaning frame is movably arranged on the processing box, a rack is arranged on the movable cleaning frame, an air inlet pipe is arranged on the processing box, a driving piece is arranged at the bottom of the air inlet pipe; and a movable exhaust plate is movably arranged in the processing box, a plurality of groups of exhaust holes and dust removal grooves are arranged on the movable exhaust plate, dust removal holes are arranged on the movable exhaust plate, and a lower sealing strip and an upper sealing strip matched with the exhaust holes and the dust removal grooves are arranged on the processing box. The present application can realize targeted temperature control on the working area, automatic cleaning, frequent replacement is not needed, and operation and maintenance costs are reduced.

Description

Technical Field

[0001] This invention relates to the field of semiconductor double-layer bonding machine technology, and more specifically to an environmental control system for a semiconductor double-layer bonding machine. Background Technology

[0002] An environmental control system for semiconductor double-layer bonding machines is designed to improve the stability and bonding quality of the semiconductor bonding process by optimizing the air quality inside the bonding machine.

[0003] In existing technologies, environmental control systems mainly achieve air purification through mechanical filtration, chemical adsorption, or single electrostatic dust removal. These methods can maintain the basic cleanliness inside the bonding machine to a certain extent and ensure the initial stability of the bonding process. For example, using a high-efficiency particulate air (HEPA) filter can effectively trap most suspended particles. Some systems also combine temperature and humidity control modules to reduce the impact of environmental fluctuations on bonding materials (such as wafers and substrates). These existing solutions have relatively simple structures, controllable maintenance costs, and can meet the basic requirements of general bonding processes in conventional clean environments.

[0004] However, as semiconductor devices develop towards miniaturization and high integration, the requirements for environmental cleanliness in bonding processes are becoming increasingly stringent. Traditional mechanical filtration methods have limited efficiency in removing submicron particles, and filters are prone to clogging, requiring frequent replacement and increasing maintenance costs. This also leads to poor stability in the semiconductor bonding process and low bonding yield. Summary of the Invention

[0005] In view of the above-mentioned shortcomings of the prior art, the present invention provides an environmental control system for a semiconductor double-layer bonding machine, which can effectively solve the problems in the prior art.

[0006] To achieve the above objectives, the present invention provides the following technical solution: This invention provides an environmental control system for a semiconductor double-layer bonding machine, comprising: A bonding machine housing, the bonding machine housing includes a fixed platform that divides the bonding machine housing into upper and lower cavities, a chuck worktable for wafer bonding is provided on the fixed platform, an FFU module is provided above the fixed platform, and a local heat source air collection box and air collection duct are provided below the fixed platform for cooling the centralized heat source. A filter assembly for treating gas includes a processing box, which contains multiple sets of spaced-apart ionizing elements and anode plates. A movable cleaning frame for cleaning the anode plates is movably mounted on the processing box. The movable cleaning frame is equipped with a rack. An air inlet pipe is provided on the processing box, and a drive component for driving the movable cleaning frame is provided at the bottom of the air inlet pipe. The device includes a movable exhaust plate installed inside the processing box for guiding air and removing dust. The movable exhaust plate is provided with multiple sets of exhaust holes and dust removal grooves, and the movable exhaust plate is provided with dust removal holes for connecting the multiple sets of dust removal grooves. The processing box is provided with a lower sealing strip and an upper sealing strip that cooperate with the exhaust holes and dust removal grooves.

[0007] According to some embodiments of the present invention, the movable cleaning frame is slidably mounted with transverse supports on both sides, the transverse supports being used to guide the movable cleaning frame to move laterally, the movable exhaust plate is provided with a vertical support slidably connected to the transverse supports, the vertical support being used to guide the transverse supports to move longitudinally, and the bottom of the movable exhaust plate is provided with a cylinder for lifting and lowering.

[0008] According to some embodiments of the present invention, the movable cleaning rack is provided with multiple sets of racks, the driving member is provided with incomplete gears, the racks are four sets and adjacent racks are staggered, and the thickness of the incomplete gears on the driving member is greater than or equal to twice the thickness of the racks.

[0009] According to some embodiments of the present invention, the processing box is provided with a gas quality detection sensor connected to the cylinder control.

[0010] According to some embodiments of the present invention, the bottom of the intake pipe is provided with multiple sets of arc-shaped exhaust strips arranged in a ring array, and the driving component is located at the bottom of the arc-shaped exhaust strips, and in the initial state, the incomplete gear on the driving component is misaligned with the rack.

[0011] According to some embodiments of the present invention, the bonding machine housing is composed of an aluminum profile frame and multiple windows and door panels. A temperature sensor located above the fixed platform is provided inside the aluminum profile frame, and an electrical box is provided on the outside of the aluminum profile frame.

[0012] According to some embodiments of the present invention, the fixed platform is provided with multiple sets of air holes on both sides, and one side is connected to the local heat source air collection box, while the other side is connected to the air collection pipe.

[0013] According to some embodiments of the present invention, the FFU module consists of a housing, a flow equalization membrane and an upper air guide plate, wherein the flow equalization membrane is located below the housing and communicates with the bonding machine housing, the upper air guide plate is located above the housing and communicates with the processing box, and the upper air guide plate is provided with multiple sets of air guide holes.

[0014] According to some embodiments of the present invention, the air guide hole is frustoconical, and the diameter of the air guide hole on the side near the treatment box is smaller than the diameter of the air guide hole on the side near the flow equalization membrane.

[0015] Beneficial effects The technical solution provided by this invention has the following advantages compared with the known prior art: 1. By setting up ionization components and anode plates, fine particles in the air are ionized and removed, achieving efficient removal of submicron particles. Combined with the flow equalization effect of the flow equalization membrane and air guide holes, a stable and uniform laminar flow is formed and sent into the sealed working chamber of the bonding machine, providing a stable environment with ultra-high cleanliness for the wafer bonding process. The hot air generated by the equipment and the heat in the working chamber is drawn into the local heat source air collection box and air collection duct below through the air holes on both sides of the fixed table and discharged in a concentrated manner, realizing targeted temperature control of the working area; 2. When the gas quality does not meet the requirements for semiconductor bonding environment, the movable exhaust plate descends, changing the position of the horizontal support and the movable cleaning rack. At the same time, it changes the positional relationship between the lower and upper sealing strips and the movable exhaust plate, thereby altering the flow state between the exhaust port and the dust removal trough. Specifically, the lower sealing strip blocks the exhaust port on the movable exhaust plate, preventing gas from entering the FFU module and guiding the gas out of the processing box through the dust removal port. Simultaneously, the rack on the movable cleaning rack meshes with the incomplete gear on the drive component. As the drive component rotates and works in conjunction with the rack, it reciprocates, moving the movable cleaning rack horizontally and vertically. This, combined with the scraper at the bottom of the movable cleaning rack, automatically scrapes and cleans the dust on the anode plate, achieving automated processing without frequent replacements and reducing maintenance costs. Attached Figure Description

[0016] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the accompanying drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are merely some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without any creative effort.

[0017] Figure 1 This is a schematic diagram of the overall structure of the present invention; Figure 2 This is a partial exploded view of the structure of the present invention; Figure 3 This is a schematic diagram of the internal structure of the bonding machine housing of the present invention; Figure 4 This is a partial cross-sectional view of the filtering component of the present invention; Figure 5 This is a partial exploded view of the filter assembly of the present invention; Figure 6 This is an exploded view of the FFU module of the present invention; Figure 7 This is a three-dimensional state change diagram of the upper and lower sealing strips when the movable exhaust plate of the present invention is raised and lowered. Figure 8 This is a diagram showing the changes in the planar state of the movable exhaust plate relative to the upper and lower sealing strips during the raising and lowering of the device.

[0018] Reference numerals: 1. Bonded chassis; 11. Aluminum profile frame; 12. Fixing platform; 13. Chuck workbench; 14. Local heat source air collection box; 15. Air collection duct; 16. Electrical box; 17. FFU module; 171. Housing; 172. Flow equalization membrane; 173. Upper air guide plate; 1731. Air guide hole; 2. Filter assembly; 21. Processing box; 211. Lower sealing strip; 212. Upper sealing strip; 22. Air inlet pipe; 221. Arc-shaped exhaust strip; 222. Drive component; 23. Ionization component; 24. Anode plate; 25. Movable cleaning rack; 251. Rack; 26. Horizontal support; 27. Movable exhaust plate; 271. Vertical support; 2701. Exhaust hole; 2702. Dust removal trough; 2703. Dust removal hole. Detailed Implementation

[0019] To make the objectives, technical solutions, and advantages of the embodiments of the present invention clearer, the technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some, not all, of the embodiments of the present invention. All other embodiments obtained by those skilled in the art based on the embodiments of the present invention without creative effort are within the scope of protection of the present invention.

[0020] The present invention will be further described below with reference to embodiments.

[0021] See attached document Figure 1-8 An environmental control system for a semiconductor double-layer bonding machine, comprising: The bonding machine housing 1 is a sealed enclosure composed of an aluminum profile frame 11 and multiple windows and door panels. The housing includes a fixed platform 12 dividing the housing into upper and lower chambers. A chuck stage 13 for wafer bonding is mounted on the fixed platform 12. A temperature sensor is located above the fixed platform 12 within the aluminum profile frame 11. An FFU module 17 is located above the fixed platform 12. The FFU module 17, along with the temperature and humidity sensors and an internal control module, regulate the airflow temperature, humidity, and speed within the chamber above the fixed platform 12 to ensure a suitable environment for wafer bonding on the chuck stage 13. Below the fixed platform 12 are a localized heat source cooling box 14 and a cooling duct 15 for cooling concentrated heat sources. Since many bonding processes require precise temperature profiles (e.g., from room temperature to 400°C or even higher), the microenvironment system needs to ensure temperature uniformity and stability to prevent wafer warping caused by thermal stress. Furthermore, after bonding, the heat source needs to be cooled. Gas is discharged through multiple sets of air holes on both sides of the fixed platform 12, with one side connected to the local heat source air collection box 14 and the other side connected to the air collection pipe 15, enabling the recovery of local heat sources. An electrical box 16 is provided on the outside of the aluminum profile frame 11, which is used to supply power to the electrical components inside the aluminum profile frame 11, such as temperature sensors and humidity sensors. The FFU module 17 consists of a housing 171, a flow equalization membrane 172, and an upper air guide plate 173, with the flow equalization membrane 172 located below the housing 171 and connected to the air collection pipe 173. The bonding machine housing 1 is connected, and the upper air guide plate 173 is located above the housing 171 and connected to the processing box 21. The upper air guide plate 173 is provided with multiple sets of air guide holes 1731. The air guide holes 1731 are truncated cone-shaped, and the diameter of the air guide hole 1731 on the side near the processing box 21 is smaller than the diameter of the air guide hole 1731 on the side near the flow equalization film 172. Through the special setting of the air guide holes 1731, the flow velocity of the airflow entering the bonding machine housing 1 is reduced, and the airflow is prevented from blowing up the dust hidden in the corners of the bonding machine housing 1 too fast. A filter assembly 2 for gas treatment includes a treatment chamber 21. The treatment chamber 21 contains multiple sets of spaced-apart ionizing elements 23 and anode plates 24. The ionizing elements 23 are composed of corona wires. By applying a certain DC negative high voltage to the ionizing elements 23, gas molecules in a small area around the discharge electrode are ionized, generating a large number of free electrons and positive ions, forming a corona region. Subsequently, when the gas passes through the electric field generated by the ionizing elements 23 and the anode plates 24, dust particles encounter and adsorb these free electrons, thus acquiring a negative charge. Under the action of the electric field force, the negatively charged dust particles... Dust particles are driven towards the positively charged anode plate 24 and eventually adhere to its surface, thus treating the gas. A movable cleaning frame 25 for cleaning the anode plate 24 is movably mounted on the treatment box 21. The movable cleaning frame 25 has multiple sets of scrapers on the side facing the anode plate 24, with two sets of scrapers on each side of the corresponding anode plate 24. The distance between the two sets of scrapers is greater than the width of the anode plate 24. This means that after the movable cleaning frame 25 descends to the designated position, it will not immediately contact the anode plate 24, preventing the dust on the anode plate 24 from being scraped away during descent. The airflow enters the chuck workbench 13 area. The movable cleaning rack 25 is equipped with multiple sets of racks 251. The processing box 21 is equipped with an air inlet pipe 22, and the bottom of the air inlet pipe 22 is equipped with a drive component 222 for driving the movable cleaning rack 25. The drive component 222 is equipped with incomplete gears. There are four sets of racks 251, with adjacent racks 251 staggered. The thickness of the incomplete gears on the drive component 222 is greater than or equal to twice the thickness of the racks 251. When the drive component 222 rotates, it can engage with the racks 251 on the movable cleaning rack 25 at any angle. 1. Engagement: The bottom of the air intake pipe 22 is provided with multiple sets of arc-shaped exhaust strips 221 arranged in a ring array. An air storage plate is rotatably installed at the bottom of the air intake pipe 22. Multiple sets of arc-shaped exhaust strips 221 are arranged in a patient array on the air storage plate. Due to the special setting of the arc-shaped exhaust strips 221, when air enters the air intake pipe 22 and is discharged from the arc-shaped exhaust strips 221, it can drive the air intake pipe 22 to rotate, thereby driving the drive component 222 to rotate. The drive component 222 is located at the bottom of the arc-shaped exhaust strips 221. In the initial state, the incomplete gear on the drive component 222 is misaligned with the rack 251. In the non-cleaning state, the drive component 222 only rotates on its own. The movable exhaust plate 27 is installed inside the processing box 21 for guiding airflow and dust removal. The movable exhaust plate 27 has multiple sets of exhaust holes 2701 and dust removal channels 2702, and also has dust removal holes 2703 for connecting the multiple sets of dust removal channels 2702. The processing box 21 has lower sealing strips 211 and upper sealing strips 212 that cooperate with the exhaust holes 2701 and dust removal channels 2702. Horizontal supports 26 are slidably installed on both sides of the movable cleaning frame 25 to guide the movable cleaning frame 25 to move laterally. Vertical supports 271 are slidably connected to the horizontal supports 26 on the movable exhaust plate 27 to guide the horizontal supports 26 to move longitudinally. The bottom of the movable exhaust plate 27 is equipped with a cylinder for lifting. In the initial state, i.e., the non-cleaning state, after the gas enters the processing box 21 from the intake pipe 22, it undergoes corona treatment through the ionization element 23 and the anode plate 24. At this time, the movable exhaust plate 27 is in the high limit position, and the upper sealing strip 212 will block the dust discharge groove 2702 on the movable exhaust plate 27. The treated gas can only enter the FFU module 17 through the exhaust hole 2701 on the movable exhaust plate 27, and then enter the bonding machine housing 1. Since the processing box 21 is equipped with a gas quality detection sensor connected to the cylinder control, when the gas quality detection sensor detects that the gas quality does not meet the semiconductor bonding environment, it will send a signal. The signal is transmitted to the control module, which then activates the cylinder to lower the movable exhaust plate 27. At this time, with the cooperation of the vertical support 271, the horizontal support 26 and the movable cleaning frame 25 are lowered to their lowest limit position. First, the lower sealing strip 211 blocks the exhaust hole 2701 on the movable exhaust plate 27, and the upper sealing strip 212 disengages from the dust discharge groove 2702. This prevents gas from entering the FFU module 17 and guides the gas through the dust discharge hole 2703 to the outside of the processing box 21. After the movable cleaning frame 25 lowers to its limit position, the rack 251 on the movable cleaning frame 25 meshes with the incomplete gear on the drive component 222. As the drive component 222 rotates and engages with the rack 251, the movement is reciprocating. The movable cleaning frame 25 moves horizontally and vertically, and the scraper at the bottom of the movable cleaning frame 25 scrapes and cleans the dust on the anode plate 24. The dust is discharged from the equipment through the dust discharge hole 2703 along with the gas. When the movable cleaning frame 25 moves horizontally, the movable cleaning frame 25 slides relative to the horizontal support 26. When the movable cleaning frame 25 moves vertically, the horizontal support 26 slides relative to the vertical support 271 to prevent interference. In addition, while treating the gas entering the treatment box 21, the machine can automatically clean the dust on the surface of the anode plate 24 when the ionization element 23 and the anode plate 24 are not processed due to dust accumulation, thus achieving automated processing.

[0022] Working principle: External air enters the processing chamber 21 through the intake pipe 22. The gas is discharged through the end of the arc-shaped exhaust strip 221. The special design of the arc-shaped exhaust strip 221 changes the direction of airflow, preventing it from directly impacting the flow equalization membrane 172. On the other hand, the gas discharged from the arc-shaped exhaust strip 221 backflows and drives the gas storage device at the bottom of the intake pipe 22 to rotate, which in turn drives the drive unit 222 to rotate. In the working state, the gas flows through the corona zone of the ionization element 23 and the anode plate 24. The fine particles in the air are recharged by the negative ions generated by the ionization element 23 and adsorbed onto the anode plate 24, achieving submicron-level particle processing. The gas is efficiently removed and finally sent to the FFU module 17. Through the flow equalization effect of the internal flow equalization film 172 and air guide holes 1731, a stable and uniform laminar flow is formed and sent into the working chamber of the sealed bonding machine housing 1, providing a stable environment with ultra-high cleanliness for the wafer bonding process. At the same time, the hot air generated by the equipment and the heat in the working chamber is drawn into the local heat source air collection box 14 and the air collection pipe 15 below through the air holes on both sides of the fixed table 12 and discharged in a concentrated manner, realizing targeted temperature control of the working area. When the gas quality detection sensor detects that the gas quality does not meet the semiconductor bonding environment, the movable exhaust plate 27 is pulled by the cylinder and the vertical support. With the cooperation of 271, the horizontal support 26 and the movable cleaning frame 25 are pulled down to the lowest limit position. At this time, the upper sealing strip 212 disengages from the dust discharge trough 2702, and the lower sealing strip 211 blocks the exhaust hole 2701 on the movable exhaust plate 27 and prevents gas from entering the FFU module 17. The gas is then guided to the outside of the processing box 21 through the dust discharge hole 2703. After the movable cleaning frame 25 descends to the limit position, the rack 251 on the movable cleaning frame 25 will mesh with the incomplete gear on the drive component 222. As the drive component 222 rotates and cooperates with the rack 251, the movable cleaning frame 25 will be reciprocated horizontally and vertically. The moving frame 25 moves back and forth, and the scraper at the bottom of the moving frame 25 scrapes and cleans the dust on the anode plate 24. The dust is discharged from the equipment through the dust discharge hole 2703 along with the gas. When the moving frame 25 moves laterally, the moving frame 25 slides relative to the horizontal support 26. When the moving frame 25 moves longitudinally, the horizontal support 26 slides relative to the vertical support 271 to prevent interference. In this way, while the gas entering the treatment box 21 is treated, the dust on the surface of the anode plate 24 can be automatically cleaned when the ionization element 23 and the anode plate 24 are not processed due to dust accumulation, thus realizing automated processing.

[0023] The above embodiments are only used to illustrate the technical solutions of the present invention, and are not intended to limit it. Although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features. Such modifications or substitutions will not cause the essence of the corresponding technical solutions to deviate from the protection scope of the technical solutions of the embodiments of the present invention.

Claims

1. An environmental control system for a semiconductor double-layer bonding machine, characterized in that, include: The bonding machine housing (1) includes a fixed platform (12) that divides the bonding machine housing (1) into upper and lower cavities. The fixed platform (12) is provided with a chuck worktable (13) for wafer bonding. An FFU module (17) is provided above the fixed platform (12), and a local heat source air collection box (14) and an air collection duct (15) for cooling the centralized heat source are provided below the fixed platform (12). A filter assembly (2) for treating gas includes a processing box (21), which contains multiple sets of spaced ionization elements (23) and anode plates (24). A movable cleaning frame (25) for cleaning the anode plates (24) is movably mounted on the processing box (21). The movable cleaning frame (25) is equipped with a rack (251). An air inlet pipe (22) is provided on the processing box (21), and a driving element (222) for driving the movable cleaning frame (25) is provided at the bottom of the air inlet pipe (22). And a movable exhaust plate (27) installed in the processing box (21) for guiding air and removing dust. The movable exhaust plate (27) is provided with multiple sets of exhaust holes (2701) and dust removal grooves (2702). The movable exhaust plate (27) is provided with dust removal holes (2703) for connecting multiple sets of dust removal grooves (2702). The processing box (21) is provided with a lower sealing strip (211) and an upper sealing strip (212) that cooperate with the exhaust holes (2701) and dust removal grooves (2702).

2. The environmental control system for a semiconductor double-layer bonding machine according to claim 1, characterized in that, The movable cleaning rack (25) is slidably mounted with horizontal supports (26) on both sides. The horizontal supports (26) are used to guide the movable cleaning rack (25) to move laterally. The movable exhaust plate (27) is provided with a vertical support (271) that is slidably connected to the horizontal supports (26). The vertical support (271) is used to guide the horizontal supports (26) to move longitudinally. The bottom of the movable exhaust plate (27) is provided with a cylinder for lifting.

3. The environmental control system for a semiconductor double-layer bonding machine according to claim 2, characterized in that, The movable cleaning rack (25) is provided with multiple sets of racks (251), and the drive unit (222) is provided with incomplete gears. The racks (251) are four sets and adjacent racks (251) are staggered. The thickness of the incomplete gears on the drive unit (222) is greater than or equal to twice the thickness of the racks (251).

4. The environmental control system for a semiconductor double-layer bonding machine according to claim 3, characterized in that, The processing box (21) is equipped with a gas quality detection sensor that is connected to the cylinder control.

5. The environmental control system for a semiconductor double-layer bonding machine according to claim 1, characterized in that, The bottom of the intake pipe (22) is provided with multiple sets of arc-shaped exhaust strips (221) arranged in a ring array, and the drive unit (222) is located at the bottom of the arc-shaped exhaust strips (221), and in the initial state, the incomplete gear on the drive unit (222) is misaligned with the rack (251).

6. The environmental control system for a semiconductor double-layer bonding machine according to claim 1, characterized in that, The bonding machine housing (1) is a sealed housing consisting of an aluminum profile frame (11) and multiple windows and door panels. The aluminum profile frame (11) is equipped with a temperature sensor located above the fixed platform (12). The aluminum profile frame (11) has an electrical box (16) on its outer side.

7. The environmental control system for a semiconductor double-layer bonding machine according to claim 1, characterized in that, The fixed platform (12) has multiple sets of air holes on both sides, and one side is connected to the local heat source air collection box (14), while the other side is connected to the air collection pipe (15).

8. The environmental control system for a semiconductor double-layer bonding machine according to claim 1, characterized in that, The FFU module (17) consists of a housing (171), a flow equalization membrane (172) and an upper air guide plate (173). The flow equalization membrane (172) is located below the housing (171) and communicates with the bonding machine housing (1). The upper air guide plate (173) is located above the housing (171) and communicates with the processing box (21). The upper air guide plate (173) is provided with multiple sets of air guide holes (1731).

9. The environmental control system for a semiconductor double-layer bonding machine according to claim 8, characterized in that, The air guide hole (1731) is truncated cone-shaped, and the diameter of the air guide hole (1731) on the side near the treatment box (21) is smaller than the diameter of the air guide hole (1731) on the side near the flow equalization membrane (172).

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