A gradient composite glass solder for joining alumina to aluminum nitride ceramics and method
By designing a gradient composite glass solder with matched thermal expansion coefficients and a graded sintering method, the problems of thermal expansion coefficient mismatch and wettability in the connection of alumina and aluminum nitride ceramics were solved, achieving a high-strength and low-cost connection effect, which is suitable for modern microelectronic packaging and aerospace fields.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- JUNYUAN ELECTRONIC TECHNOLOGY (HAINING) CO LTD
- Filing Date
- 2026-01-30
- Publication Date
- 2026-06-09
AI Technical Summary
Existing technologies struggle to achieve high-strength bonding between alumina and aluminum nitride ceramics at low temperatures, and suffer from issues such as thermal expansion coefficient mismatch, poor wettability, and hydrolysis sensitivity, resulting in insufficient bonding strength and reliability.
A gradient composite glass brazing alloy is used. By designing two glass brazing alloys with matching coefficients of thermal expansion, they are coated on the surfaces of alumina and aluminum nitride ceramics respectively. Combined with a staged sintering method, the connection is achieved at a lower temperature, which relieves thermal stress and improves wettability and chemical compatibility.
It significantly improves the thermal shock resistance and long-term reliability of the connector, reduces production costs, and has superior performance that meets the requirements of electronic packaging substrates.