A temperature and pressure sensor

Abstract

The application discloses a temperature and pressure sensor, and relates to the technical field of sensors.The temperature and pressure sensor comprises a shell, an electrical connector, a ceramic core, a temperature sensing element and a flexible circuit board.The shell forms a containing cavity with an opening.The electrical connector covers the opening at one end of the shell.The ceramic core is located in the containing cavity and jointly seals the containing cavity with the electrical connector.The ceramic core comprises a ceramic core substrate and a ceramic core pressure sensing sheet which are integrally connected, and a pin for connection.The temperature sensing element is located in the containing cavity and is welded with the pin of the ceramic core.The flexible circuit board is located in the containing cavity and is connected with the electrical connector and the ceramic core respectively.The temperature and pressure sensor provided by the application has simple structure, is convenient to assemble, has good sealing performance and low leakage risk.

Description

Technical Field

[0001] This invention relates to the field of sensor technology, and specifically to a temperature and pressure sensor. Background Technology

[0002] A temperature and pressure sensor is an integrated sensing device that detects both temperature and pressure parameters. Its core is that the temperature measurement unit and the pressure measurement unit are encapsulated in the same housing. It can simultaneously acquire the temperature and pressure signals of the measured medium, and most of them have built-in temperature compensation algorithms to correct the error of pressure measurement caused by temperature drift. Compared with separate temperature and pressure sensor combinations, it has the characteristics of small size, easy installation, good signal synchronization and strong anti-interference ability.

[0003] Currently, common temperature and pressure sensors typically require a plastic support to secure the temperature-sensing resistor and connect it to the electrical terminals. Due to inherent challenges in dimensional accuracy and sealing with plastic, manufacturing not only adds the assembly step of the support but also necessitates addressing the sealing difficulties. Consequently, these sensors usually rely on at least two sealing rings to isolate the medium from the electrical terminals, ultimately resulting in high overall cost, complex manufacturing processes, and a significant risk of leakage. Summary of the Invention

[0004] The purpose of this invention is to overcome the above-mentioned technical deficiencies and propose a temperature and pressure sensor that solves the technical problems of complex structure, low assembly efficiency and high leakage risk in the prior art.

[0005] To achieve the above-mentioned technical objectives, the present invention adopts the following technical solution: This invention provides a temperature and pressure sensor, which includes a housing, an electrical connector, a ceramic core, a temperature sensing element, and a flexible circuit board. The housing forms a receiving cavity with an opening. The electrical connector covers the opening at one end of the housing. The ceramic core is located within the receiving cavity and, together with the electrical connector, seals the receiving cavity. The ceramic core includes an integrally connected ceramic core substrate and a ceramic core pressure-sensing plate, as well as pins for connection. The temperature sensing element is located within the receiving cavity and is soldered to the pins of the ceramic core. The flexible circuit board is located within the receiving cavity and is connected to both the electrical connector and the ceramic core.

[0006] In some embodiments, a cavity exists between the ceramic core substrate and the ceramic core pressure sensing plate; the ceramic core substrate has a substrate temperature sensing pin extending through the ceramic core thickness direction; the ceramic core pressure sensing plate has a pressure sensing plate temperature sensing pin extending through the ceramic core thickness direction, and the substrate temperature sensing pin and the pressure sensing plate temperature sensing pin are connected through the cavity.

[0007] In some embodiments, the ceramic core substrate and the ceramic core pressure sensing plate are respectively printed with metal layers, and conductive epoxy resin is injected into the cavity. The temperature sensing pins of the substrate and the temperature sensing pins of the pressure sensing plate are connected through the conductive epoxy resin and the metal layers.

[0008] In some embodiments, the ceramic core substrate has a substrate pressure-sensing pin that extends through the thickness direction of the ceramic core. One end of the substrate pressure-sensing pin and the substrate temperature-sensing pin are respectively inserted into the cavity, and the other end of the substrate pressure-sensing pin and the substrate temperature-sensing pin are respectively soldered to the flexible circuit board.

[0009] In some embodiments, the temperature sensing element includes a temperature sensing chip and a lead wire, one end of which is connected to the temperature sensing chip and the other end of which is connected to the temperature sensing pin of the pressure sensor.

[0010] In some embodiments, the housing has a recess for placing a temperature-sensing chip and leads, and the recess has thermally conductive adhesive that at least covers the temperature-sensing chip.

[0011] In some embodiments, the ceramic core pressure-sensitive sheet is a concave pressure-sensitive sheet, which includes a middle portion, an edge portion, and a pressure-sensitive sheet sealing slope connecting the middle portion and the edge portion respectively, wherein the thickness of the middle portion is less than the thickness of the edge portion.

[0012] In some embodiments, the housing is provided with a housing sealing slope, which is directly opposite to and parallel to the pressure-sensing sheet sealing slope, and a sealing ring is provided between the housing sealing slope and the pressure-sensing sheet sealing slope.

[0013] In some embodiments, the housing is provided with a bearing surface connected to the housing sealing slope, and the bearing surface is used to bear the sealing ring.

[0014] In some embodiments, one end of the housing is connected to the electrical connector by a riveting process, and the other end of the housing is provided with threads for external connection.

[0015] Compared with existing technologies, the temperature and pressure sensor provided by this invention adopts an integrated ceramic core design, reducing assembly and connection links, improving the structural stability of the ceramic core and the reliability of signal transmission, and reducing detection errors caused by poor contact. Furthermore, by directly soldering the temperature sensing element to the ceramic core, traditional support components and additional sealing rings are eliminated, simplifying the design, reducing material and assembly costs, and fundamentally eliminating leakage risks and potential failure points associated with multi-component assembly, thereby improving product reliability and process robustness. Simultaneously, the flexible circuit board replaces traditional complex wiring, enabling efficient coupling with the ceramic core pressure sensor and temperature sensing element, achieving integrated acquisition and processing of pressure and temperature signals, adapting to the cavity space, improving wiring flexibility, and enhancing assembly efficiency. Attached Figure Description

[0016] Figure 1 This is a cross-sectional view of a temperature and pressure sensor provided in an embodiment of the present invention; Figure 2 yes Figure 1 Enlarged view of part A in the middle; Figure 3 This is a schematic diagram of the structure of a ceramic core provided in an embodiment of the present invention; Figure 4 This is a structural schematic diagram of the ceramic core provided in an embodiment of the present invention from another perspective; Figure 5 This is a schematic diagram of the connection structure between the ceramic core substrate and the ceramic core pressure-sensitive sheet provided in an embodiment of the present invention; Figure 6 yes Figure 5 A magnified view of part B in the diagram. Explanation of reference numerals in the attached figures: 100. Temperature and pressure sensor; 110. Housing; 111. Groove; 112. Housing sealing bevel; 113. Bearing surface; 120. Electrical connectors; 130. Ceramic core; 131. Ceramic core substrate; 1311. Substrate temperature-sensing pin; 1312. Substrate pressure-sensing pin; 132. Ceramic core pressure sensor; 1321. Pressure sensor temperature-sensing pin; 1322. Middle part; 1323. Edge part; 1324. Pressure sensor sealing bevel; 133. Cavity; 134. Glass glue; 135. Metal layer; 140. Temperature sensing element; 141. Temperature sensing chip; 142. Lead wire; 150. Flexible circuit board; 160. Sealing ring. Detailed Implementation

[0017] To make the objectives, technical solutions, and advantages of this invention clearer, the invention will be further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative and not intended to limit the invention.

[0018] A temperature and pressure sensor is an integrated sensing device that detects both temperature and pressure parameters. It encapsulates the temperature and pressure measurement units in the same housing, enabling simultaneous acquisition of temperature and pressure signals from the measured medium. Currently, temperature and pressure sensors are complex in structure, expensive, and require complex manufacturing processes, and also pose a high risk of leakage.

[0019] To address the technical problems of complex structure, low assembly efficiency, and high leakage risk, this invention provides a temperature and pressure sensor with a simple structure, convenient assembly, good sealing performance, and low leakage risk.

[0020] It should be noted that the temperature and pressure sensor provided by this invention is used in, but not limited to, industrial production scenarios. For ease of explanation, this invention will only use the application of the temperature and pressure sensor in industrial production scenarios as an example. The principle of the temperature and pressure sensor in other types of scenarios, such as automotive transportation, HVAC, new energy, aerospace, and environmental monitoring, is essentially the same as that in industrial production scenarios, and will not be described in detail here.

[0021] This invention provides a temperature and pressure sensor 100, such as Figure 1 As shown, the temperature and pressure sensor 100 includes a housing 110, an electrical connector 120, a ceramic core 130, a temperature sensing element 140, and a flexible circuit board 150. The housing 110 forms a receiving cavity with an opening. The electrical connector 120 covers the opening at one end of the housing 110. The ceramic core 130 is located inside the receiving cavity and, together with the electrical connector 120, seals the receiving cavity. The ceramic core 130 includes an integrally connected ceramic core substrate 131 and a ceramic core pressure sensing element 132, as well as pins for connection. The temperature sensing element 140 is located inside the receiving cavity and is soldered to the pins of the ceramic core 130. The flexible circuit board 150 is located inside the receiving cavity and is connected to both the electrical connector 120 and the ceramic core 130.

[0022] The housing 110 is an outer shell structure used to house various components, and its specific shape can be determined according to actual needs, such as a cylinder.

[0023] Electrical connector 120 is located at one end of housing 110. Electrical connector 120 and housing 110 form a receiving cavity. The connection method between electrical connector 120 and housing 110 is not limited, as long as the connection requirements are met. The connection includes, but is not limited to, riveting, snap-fitting, etc.

[0024] The ceramic core 130 includes an integrally connected ceramic core substrate 131 and a ceramic core pressure-sensitive sheet 132, such as... Figures 2 to 4 As shown, the ceramic core pressure-sensitive plate 132 is sealed to the other end of the housing 110 by a sealing ring 160, thereby the electrical connector 120 and the ceramic core pressure-sensitive plate 132 jointly enclose the receiving cavity of the housing 110. The detailed structure of the ceramic core 130 will be described later through specific embodiments.

[0025] The temperature sensing element 140 is soldered to the pins of the ceramic core 130. The pins are metal components in the connector used for conduction and signal transmission. The main material is tungsten carbide hard alloy, which has high hardness, wear resistance and corrosion resistance.

[0026] The flexible circuit board 150 is located between the ceramic core 130 and the electrical connector 120, and is used for the connection between the ceramic core 130 and the electrical connector 120.

[0027] It should be noted that the temperature sensing element 140 is soldered to the pins of the ceramic core pressure-sensing sheet of the ceramic core 130. The temperature sensing element 140, the ceramic core 130, and the flexible circuit board 150 are sequentially arranged in the cavity along the direction from the housing 110 to the electrical connector 120. For example, one end of the housing 110 has a threaded section for external connection, and the other end of the housing 110 has an open receiving cavity. The ceramic core 130 and the flexible circuit board 150 are both located in the open receiving cavity, and the electrical connector 120 seals the open receiving cavity.

[0028] In this embodiment, by adopting an integrated design of the ceramic core 130, assembly and connection links are reduced, improving the structural stability of the ceramic core 130 and the reliability of signal transmission, and reducing detection errors caused by poor contact. Furthermore, by directly soldering the temperature sensing element 140 to the ceramic core 130, traditional support components and additional sealing rings can be eliminated, simplifying the design, reducing material and assembly costs, and eliminating leakage risks and potential failure points in multi-component assembly from the root, thereby improving product reliability and process robustness. At the same time, the flexible circuit board 150 replaces the traditional complex wiring, which can be efficiently coupled with the ceramic core pressure sensing plate 132 and the temperature sensing element 140 to achieve integrated acquisition and processing of pressure and temperature signals, adapting to the cavity space, improving wiring flexibility, and improving assembly efficiency.

[0029] In some embodiments, such as Figure 5 and Figure 6 As shown, a cavity 133 is provided between the ceramic core substrate 131 and the ceramic core pressure sensing plate 132. The ceramic core substrate 131 has a substrate temperature sensing pin 1311 that extends through the thickness direction of the ceramic core 130. The ceramic core pressure sensing plate 132 has a pressure sensing plate temperature sensing pin 1321 that extends through the thickness direction of the ceramic core 130. The substrate temperature sensing pin 1311 and the pressure sensing plate temperature sensing pin 1321 are connected through the cavity 133.

[0030] In this embodiment, the core temperature sensing circuit of the temperature and pressure sensor 100 is connected by two sets of pins. The ceramic core substrate 131 can be cylindrical, and the ceramic core pressure sensing plate 132 can be cylindrical or concave. For example, the ceramic core substrate 131 has two pinholes for the substrate temperature sensing pins 1311 to pass through. The first end of the substrate temperature sensing pin 1311 is connected to the flexible circuit board 150, and the second end of the substrate temperature sensing pin 1311 extends into the cavity 133. For example, the ceramic core pressure sensing plate 132 has two pinholes for the pressure sensing plate temperature sensing pins 1321 to pass through. The first end of the pressure sensing plate temperature sensing pin 1321 is soldered to the temperature sensing element 140, and the second end of the pressure sensing plate temperature sensing pin 1321 extends into the cavity 133. The second end of the substrate temperature sensing pin 1311 and the second end of the pressure sensing plate temperature sensing pin 1321 extend into the cavity 133 for electrical signal connection. The connection method is not limited, as long as it meets the requirements of electrical signal transmission.

[0031] It should be noted that the pinholes of the ceramic core substrate 131 and the ceramic core pressure sensing plate 132 are both connected to the cavity 133, and the connected parts belong to the cavity 133. That is, the second end of the substrate temperature sensing pin 1311 can protrude from the surface of the cavity 133 or not. Similarly, the second end of the pressure sensing plate temperature sensing pin 1321 can also be like this.

[0032] In some embodiments, such as Figure 5 and Figure 6 As shown, the ceramic core substrate 131 and the ceramic core pressure sensing sheet 132 are respectively printed with metal layers 135, and conductive epoxy resin is injected into the cavity 133. The substrate temperature sensing pin 1311 and the pressure sensing sheet temperature sensing pin 1321 are connected through the conductive epoxy resin and the metal layer 135.

[0033] In this embodiment, the design of the metal layer 135 increases the conductive contact area, reduces contact resistance, decreases energy loss during signal transmission, and improves the stability of the detection signal. Furthermore, conductive epoxy resin is injected into the cavity 133 to achieve seamless connection between the substrate temperature-sensing pin 1311 and the pressure-sensing pin 1321. Simultaneously, the conductive epoxy resin fixes and encapsulates the connection points of the pins, preventing loosening or displacement due to vibration, impact, or other external forces, thus improving the vibration resistance of the core structure. The conductive epoxy resin combines adhesive and conductive properties, completing the pin connection and fixation in one step, simplifying the core assembly process and improving production efficiency.

[0034] In this embodiment, the core temperature sensing circuit of the temperature and pressure sensor 100 is connected by two sets of pins through conductive epoxy resin and metal layer 135, replacing the traditional through hole design, reducing the requirements for hole position accuracy and size, and reducing the stringency of the manufacturing process.

[0035] In some embodiments, such as Figure 1 and Figure 5 As shown, the ceramic core substrate 131 has a substrate pressure-sensing pin 1312 that extends through the thickness direction of the ceramic core 130. One end of the substrate pressure-sensing pin 1312 and the substrate temperature-sensing pin 1311 are respectively inserted into the cavity 133, and the other end of the substrate pressure-sensing pin 1312 and the substrate temperature-sensing pin 1311 are respectively soldered to the flexible circuit board 150.

[0036] In this embodiment, the ceramic core substrate 131 has five pins. One end of each pin is inserted into the cavity 133, where electrical connection and mechanical fixation are achieved after the conductive epoxy resin cures. The other ends of the five pins are soldered to the flexible circuit board 150, and the pins can be connected to the electrical connector 120 via the flexible circuit board 150. For example, there are two substrate temperature-sensing pins 1311 and three substrate pressure-sensing pins 1312. The three substrate pressure-sensing pins 1312 are used for grounding, connecting to the sensing electrode, and connecting to the shielding ring, respectively. The two substrate temperature-sensing pins 1311 are used for electrical connection with the pressure-sensing plate temperature-sensing pins 1321, respectively.

[0037] In some embodiments, such as Figure 1 As shown, the temperature sensing element 140 includes a temperature sensing chip 141 and a lead wire 142. One end of the lead wire 142 is connected to the temperature sensing chip 141, and the other end of the lead wire 142 is connected to the temperature sensing pin 1321 of the pressure sensor.

[0038] In this embodiment, the temperature sensing element 140 adopts a split structure of temperature sensing chip 141 and lead wire 142. The temperature sensing chip 141 focuses on temperature signal acquisition, improving the sensitivity of temperature detection. The lead wire 142 realizes the connection between the temperature sensing chip 141 and the temperature sensing pin 1321 of the pressure plate, adapts to the internal space of the housing 110, and protects the temperature sensing chip 141. Furthermore, the temperature sensing element 140 is directly soldered to the ceramic core 130 through the lead wire 142, which can eliminate the need for traditional support components and additional sealing rings, simplify the design, reduce material and assembly costs, and eliminate the leakage risk and potential failure points of multi-component assembly from the root, thereby improving product reliability and process robustness.

[0039] In some embodiments, such as Figure 1As shown, the housing 110 has a groove 111 for placing the temperature sensing chip 141 and the lead wire 142. The groove 111 has thermally conductive adhesive, which at least covers the temperature sensing chip 141.

[0040] In this embodiment, the housing 110 is provided with a matching groove 111. The groove 111 positions and limits the temperature sensing element 140, preventing displacement or damage to the temperature sensing chip 141 and lead wire 142 due to shaking or collision during transportation and use, thus improving the stability of the structure. At the same time, the groove 111 is filled with thermally conductive adhesive and at least covers the temperature sensing chip 141. The thermally conductive adhesive has high thermal conductivity, which can quickly transfer the external temperature to the temperature sensing chip 141, improving the response speed of temperature detection. At the same time, the thermally conductive adhesive wraps and protects the temperature sensing chip 141, isolating it from external impurities and preventing it from being corroded. The thermally conductive adhesive also has adhesive properties, which can fix the temperature sensing chip 141 and lead wire 142 in the groove 111, replacing an additional fixing structure, simplifying the assembly process, and buffering the impact of external vibrations on the temperature sensing chip 141, thus improving the sensor's vibration resistance.

[0041] In some embodiments, such as Figure 1 , Figure 2 and Figure 4 As shown, the ceramic core pressure-sensitive sheet 132 is a concave pressure-sensitive sheet, which includes a middle part 1322, an edge part 1323, and a pressure-sensitive sheet sealing slope 1324 that connects the middle part 1322 and the edge part 1323 respectively. The thickness of the middle part 1322 is less than the thickness of the edge part 1323.

[0042] In this embodiment, the ceramic core pressure sensor 132 is a concave pressure sensor, which can be understood as a structure that is thin in the middle and thick at the edges. This makes the middle part 1322 of the ceramic core pressure sensor 132 a pressure-sensitive area. When external pressure is applied, the middle part 1322 is more likely to undergo elastic deformation, improving the sensitivity of pressure detection and meeting the requirements of high-precision pressure detection. For traditional pressure sensors using capacitive ceramic cores, when the pressure range decreases, the pressure sensor must be thinned accordingly. This directly leads to a decrease in its structural toughness and makes it prone to defects such as cracks. At the same time, an excessively thin pressure sensor is in direct contact with the metal shell, making it extremely sensitive to minor external stresses, causing distortion of the pressure signal and ultimately causing a shift in the overall accuracy of the sensor. By adopting a concave core design for the ceramic core pressure sensor 132, the overall thickness and the thickness around the perimeter of the ceramic core pressure sensor 132 are significantly increased, enhancing its mechanical strength. This makes it less prone to misalignment due to scratches during pre-assembly. The longer side provides a better guiding distance and reduces the direct interference of external stresses (such as riveting forces) on the pressure-sensing area. Furthermore, thanks to the internal space created by the concave structure, a larger and more sensitive temperature sensing element 140 can be integrated into the housing 110, thereby improving the response speed and accuracy of temperature measurement.

[0043] In some embodiments, such as Figure 2 and Figure 4 As shown, the housing 110 is provided with a housing sealing slope 112, which is directly opposite to and parallel to the pressure sensing sheet sealing slope 1324. A sealing ring 160 is provided between the housing sealing slope 112 and the pressure sensing sheet sealing slope 1324.

[0044] In this embodiment, the housing 110 is provided with a housing sealing slope 112 that is directly opposite to and parallel to the pressure-sensing sheet sealing slope 1324. The housing sealing slope 112 can improve the sealing effect and effectively prevent external liquid and gas media from entering the receiving cavity, thus avoiding corrosion of internal components. For example, the temperature sensing element 140 can be effectively isolated from the measuring medium through the sealing ring 160, preventing the temperature sensing element 140 from failing to be packaged or having abnormal resistance due to media intrusion. At the same time, the sealing structure of the slope can limit the sealing ring 160, preventing it from falling off, improving the reliability and pressure resistance of the seal, and also helping to improve assembly efficiency.

[0045] In some embodiments, such as Figure 2 As shown, the housing 110 is provided with a bearing surface 113 connected to the housing sealing inclined surface 112, and the bearing surface 113 is used to bear the sealing ring 160.

[0046] In this embodiment, the housing 110 is provided with a bearing surface 113 that is connected to the housing sealing slope 112 to provide a space for the placement and positioning of the sealing ring 160, so as to prevent the sealing ring 160 from shifting or falling off during assembly and use, and to ensure that the sealing ring 160 is always in an effective sealing position, thereby improving the stability of the sealing structure.

[0047] In some embodiments, such as Figure 1 As shown, one end of the housing 110 is connected to the electrical connector 120 by a riveting process, and the other end of the housing 110 is provided with a thread for external connection.

[0048] In this embodiment, the housing 110 and the electrical connector 120 are connected by riveting. Compared with threading, bonding and other methods, riveting has higher connection strength and better sealing performance, which can effectively prevent external media from entering the receiving cavity from the connection gap. At the same time, the riveting process does not require additional connecting parts, which simplifies the structure and improves the overall structural stability of the sensor. The other end of the housing 110 is provided with an external connection thread, which realizes quick and detachable connection between the sensor and external devices, which is highly convenient for assembly. Moreover, the threaded connection has excellent sealing performance and connection strength, which improves the installation stability of the sensor.

[0049] To better understand this invention, the following is combined with... Figures 1 to 6 The technical solution of the present invention will be described in detail below: In some embodiments, the temperature and pressure sensor 100 includes a housing 110, an electrical connector 120, a ceramic core 130, a temperature sensing element 140, and a flexible circuit board 150.

[0050] The housing 110 has a groove 111 for placing the temperature sensing chip 141 and the lead wire 142. The groove 111 has thermally conductive adhesive, which at least covers the temperature sensing chip 141. The housing 110 has a housing sealing slope 112 and a bearing surface 113. The housing sealing slope 112 is directly opposite to and parallel to the pressure sensing sheet sealing slope 1324. A sealing ring 160 is provided between the housing sealing slope 112 and the pressure sensing sheet sealing slope 1324. The bearing surface 113 is used to support the sealing ring 160.

[0051] The electrical connector 120 is connected to one end of the housing 110 by a riveting process, and the other end of the housing 110 is provided with a thread for external connection.

[0052] The ceramic core 130 includes an integrally connected ceramic core substrate 131 and ceramic core pressure sensing sheet 132. A cavity 133 is provided between the ceramic core substrate 131 and the ceramic core pressure sensing sheet 132. Metal layers are printed on the ceramic core substrate 131 and the ceramic core pressure sensing sheet 132 respectively. Conductive epoxy resin is injected into the cavity 133.

[0053] The ceramic core substrate 131 has a substrate temperature sensing pin 1311 and a substrate pressure sensing pin 1312 that extend through the thickness direction of the ceramic core 130. The first ends of the substrate temperature sensing pin 1311 and the substrate pressure sensing pin 1312 are respectively soldered to the flexible circuit board 150, and their second ends are respectively inserted into the cavity 133.

[0054] The ceramic core pressure sensor 132 has a pressure sensor temperature sensing pin 1321 that extends through the thickness direction of the ceramic core 130. The first end of the pressure sensor temperature sensing pin 1321 is welded to the lead wire 142, and the second end of the pressure sensor temperature sensing pin 1321 is inserted into the cavity 133 and is connected to the substrate temperature sensing pin 1311 through conductive epoxy resin and metal layer 135.

[0055] The ceramic core pressure-sensitive sheet 132 is a concave pressure-sensitive sheet, which includes a middle part 1322, an edge part 1323, and a pressure-sensitive sheet sealing slope 1324 that connects the middle part 1322 and the edge part 1323 respectively. The thickness of the middle part 1322 is less than the thickness of the edge part 1323.

[0056] In this embodiment, a concave pressure-sensing plate structure is used to suppress stress interference on the sensing area, ensuring measurement accuracy and overcoming the accuracy deviation problem caused by residual stress in traditional ceramic capacitive pressure sensors. A highly integrated packaging design is adopted to reduce the number of components and connection interfaces, thereby reducing leakage risk and simplifying assembly. This improves upon the shortcomings of traditional temperature and pressure sensors, which have complex structures and numerous components, resulting in complex assembly processes and high leakage risks. Ultimately, the temperature and pressure sensor 100, through its integrated design, improves product performance while reducing production costs and increasing manufacturing efficiency.

[0057] To further understand the present invention, the assembly method of the temperature and pressure sensor 100 will now be described, and the specific steps are as follows: Step 1, Preparation of the integrated ceramic core: Electrodes and metal layers 135 with preset patterns are printed on the ceramic core substrate 131 and the ceramic core pressure-sensitive sheet 132, respectively. Glass adhesive 134 is printed at predetermined positions on the ceramic core substrate 131. Subsequently, the ceramic core substrate 131, the ceramic core pressure-sensitive sheet 132, and the glass adhesive 134 are sintered through a high-temperature sealing sintering process to form an integrated ceramic core 130 with an internal cavity 133.

[0058] Step 2, pin fixing and electrical connection: Inject conductive epoxy resin into cavity 133. Insert the substrate temperature-sensing pin 1311, substrate pressure-sensing pin 1312, and pressure-sensing temperature-sensing pin 1321 into the corresponding cavities 133 respectively. After the conductive epoxy resin cures, electrical connection and mechanical fixing are achieved.

[0059] Step 3, temperature sensing element assembly: Solder the lead 142 of the temperature sensing element 140 to the temperature sensing pin 1321 of the pressure sensor.

[0060] Step 4, Electrical interconnection assembly: The substrate temperature sensing pin 1311 and substrate pressure sensing pin 1312 on the ceramic core 130 are soldered to the flexible circuit board 150 and electrical connector 120 respectively to complete the electrical interconnection.

[0061] Step 5, filling with thermally conductive adhesive: Pour thermally conductive adhesive into the groove 111 of the housing 110, and control the liquid level to at least cover the temperature sensing chip 141.

[0062] Step Six, Component Assembly, Encapsulation, and Fixing: Sequentially install the sealing ring 160, the pre-welded ceramic core 130, and the electrical connector 120 into the housing 110. Use a riveting process to complete the final encapsulation and fixation of all the above components within the housing 110.

[0063] The specific embodiments of the present invention described above do not constitute a limitation on the scope of protection of the present invention. Any other corresponding changes and modifications made in accordance with the technical concept of the present invention should be included within the scope of protection of the claims of the present invention.

Claims

1. A temperature and pressure sensor, characterized in that, include: The shell forms a receiving cavity with an opening; An electrical connector that covers an opening at one end of the housing; A ceramic core is located within the receiving cavity and together with the electrical connector, the receiving cavity is sealed. The ceramic core includes an integrally connected ceramic core substrate and a ceramic core pressure-sensitive sheet, as well as pins for connection. A temperature sensing element is located within the receiving cavity and is welded to the pins of the ceramic core; A flexible circuit board is located within the receiving cavity and is connected to the electrical connector and the ceramic core, respectively.

2. The temperature and pressure sensor according to claim 1, characterized in that, There is a cavity between the ceramic core substrate and the ceramic core pressure-sensitive sheet, and the ceramic core substrate has a substrate temperature-sensing pin that extends through the thickness direction of the ceramic core. The ceramic core pressure sensor has a pressure sensor temperature sensing pin that extends through the thickness of the ceramic core, and the substrate temperature sensing pin and the pressure sensor temperature sensing pin are connected through the cavity.

3. The temperature and pressure sensor according to claim 2, characterized in that, The ceramic core substrate and the ceramic core pressure-sensitive sheet are respectively printed with metal layers. The cavity is injected with conductive epoxy resin. The temperature-sensing pins of the substrate and the temperature-sensing pins of the pressure-sensitive sheet are connected through the conductive epoxy resin and the metal layers.

4. The temperature and pressure sensor according to claim 2, characterized in that, The ceramic core substrate has a substrate pressure-sensitive pin that extends through the thickness direction of the ceramic core. One end of the substrate pressure-sensitive pin and the substrate temperature-sensitive pin are respectively inserted into the cavity, and the other end of the substrate pressure-sensitive pin and the substrate temperature-sensitive pin are respectively soldered to the flexible circuit board.

5. The temperature and pressure sensor according to claim 2, characterized in that, The temperature sensing element includes a temperature sensing chip and a lead wire. One end of the lead wire is connected to the temperature sensing chip, and the other end of the lead wire is connected to the temperature sensing pin of the pressure plate.

6. The temperature and pressure sensor according to claim 5, characterized in that, The housing has a groove for placing the temperature sensing chip and the lead wire. The groove has thermally conductive adhesive that at least covers the temperature sensing chip.

7. The temperature and pressure sensor according to claim 1, characterized in that, The ceramic core pressure-sensitive sheet is a concave pressure-sensitive sheet, which includes a middle part, an edge part, and a pressure-sensitive sheet sealing slope connecting the middle part and the edge part respectively. The thickness of the middle part is less than the thickness of the edge part.

8. The temperature and pressure sensor according to claim 7, characterized in that, The housing is provided with a housing sealing slope, which is directly opposite to and parallel to the pressure-sensing sheet sealing slope, and a sealing ring is provided between the housing sealing slope and the pressure-sensing sheet sealing slope.

9. The temperature and pressure sensor according to claim 8, characterized in that, The housing is provided with a bearing surface that is connected to the housing sealing slope, and the bearing surface is used to support the sealing ring.

10. The temperature and pressure sensor according to claim 1, characterized in that, One end of the housing is connected to the electrical connector by a riveting process, and the other end of the housing is provided with a thread for external connection.

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