An infrared temperature measurement simulation device for voltage transformers

Abstract

The application provides a voltage transformer infrared temperature measurement simulation device, which effectively solves the problems of single internal heat source position and complicated external module disassembly and assembly by integrating a height adjusting mechanism and a module mounting mechanism; the voltage transformer infrared temperature measurement simulation device comprises a transformer box body and a capacitor fixedly connected to the top of the transformer box body, an insulating sleeve is arranged on the outer periphery of the capacitor, a height adjusting mechanism is arranged on the capacitor, a module mounting mechanism is arranged on one side of the transformer box body and the top of the capacitor, and a temperature control module two is arranged on the module mounting mechanism.

Description

Technical Field

[0001] This invention relates to the field of power equipment simulation and testing technology, specifically to an infrared temperature measurement simulation device for voltage transformers. Background Technology

[0002] Voltage transformers, as key devices for voltage measurement and protection control, directly affect the safety and stability of the power grid. Infrared thermography, due to its advantages of being non-contact, long-distance, and uninterrupted power supply, has become the primary means of monitoring heating defects in voltage transformers. To improve the ability of maintenance personnel to analyze and diagnose infrared thermograms and to ensure the measurement accuracy of infrared thermography instruments, it is usually necessary to use voltage transformer infrared thermography simulation devices for simulation experiments, personnel training, and equipment calibration.

[0003] Existing voltage transformer simulation devices have certain limitations in their structural design. Most simulation devices typically use fixed installations for internal heat sources, such as fixing them only at the bottom to simulate core overheating, or only in the middle of the winding. However, in actual operation, internal faults in voltage transformers (such as inter-turn short circuits, insulation dampness, and overheating caused by oil level drops) can occur at any height within the enclosure or porcelain bushing. This single structure, where the heat source position cannot be adjusted, makes it difficult for the simulation device to reproduce the vertical variation of internal fault locations. This results in a relatively simple infrared spectrum that cannot cover the complex and varied thermal defect scenarios in actual field conditions, thus limiting the depth and breadth of training.

[0004] Furthermore, for the most common external contact failures at the primary terminals and secondary terminal boxes of voltage transformers, existing simulation devices mostly use traditional bolt-fastening methods to install the heating simulation elements. When it is necessary to simulate contact defects of different severity during the experiment, or to replace different types of fault modules to obtain differentiated thermal spectra, operators must use tools for tedious disassembly and installation operations. This not only consumes a lot of time and seriously reduces the efficiency of batch training and rapid calibration, but also frequent mechanical disassembly and assembly can easily lead to wear or stripping of the connection interfaces, affecting the long-term stability of the device. To address these issues, an infrared temperature measurement simulation device for voltage transformers is proposed. Summary of the Invention

[0005] This invention aims to address the technical deficiencies of existing technologies by providing a voltage transformer infrared temperature measurement simulation device. By integrating a height adjustment mechanism and a module installation mechanism, it effectively solves the problems of the single internal heat source location and cumbersome external module disassembly and assembly in existing simulation devices.

[0006] The present invention provides the following technical solution: an infrared temperature measurement simulation device for a voltage transformer, comprising a transformer housing and a capacitor fixedly connected to the top of the transformer housing, the capacitor being fitted with an insulating sleeve on its outer periphery, the capacitor being provided with a height adjustment mechanism, and a module mounting mechanism being provided on one side of the transformer housing and the top of the capacitor, the module mounting mechanism being provided with a second temperature control module.

[0007] The height adjustment mechanism includes a handle rotatably mounted on the side wall of the transformer housing. The handle is fixedly connected to a rotating shaft that extends into the transformer housing. A gear is fixedly connected to the side of the rotating shaft near the handle, and a ratchet is fixedly connected to the side of the rotating shaft away from the handle. A groove is provided inside the capacitor, and a rack is slidably connected within the groove. A temperature control module is fixedly connected to the top of the rack, and the rack meshes with the gear. A pawl is provided on the upper side of the ratchet, and a return spring is fixedly connected between the pawl and the inner side wall of the capacitor. Under the action of the return spring, the end of the pawl engages in the tooth groove of the ratchet to achieve position self-locking. A pull rod is provided on the side of the pawl away from the ratchet, and the pull rod passes through the side wall of the capacitor and extends to the outside.

[0008] Preferably,

[0009] The transformer housing is provided with a module installation mechanism on one side. The module installation mechanism includes a secondary terminal box. The secondary terminal box has an installation cavity. A temperature control module 2 is installed and removed in the installation cavity. The secondary terminal box is also provided with a locking component.

[0010] Preferably,

[0011] The capacitor is provided with a module mounting mechanism on its top. The module mounting mechanism includes a primary terminal and a mounting cavity. A second temperature control module is installed and removed from the mounting cavity. The primary terminal is also provided with a locking component.

[0012] Preferably,

[0013] The locking assembly includes a knob, which is fixedly connected to a second connecting rod. The two ends of the second connecting rod are respectively rotatably connected to a first connecting rod. The end of the first connecting rod away from the second connecting rod is rotatably connected to a correspondingly arranged snap-fit ​​plate. The snap-fit ​​plate and the temperature control module two form a snap-fit ​​engagement.

[0014] Preferably,

[0015] A torsion spring is provided between the knob and the second connecting rod, and the ends of the torsion spring are respectively fixed to the surface of the knob and the secondary terminal box or the primary terminal.

[0016] Preferably,

[0017] The bottoms of the two snap-fit ​​plates are slidably connected to the bottom of the mounting cavity and are symmetrically distributed about the second connecting rod. When the second connecting rod rotates, it drives the two snap-fit ​​plates to move closer or further apart through the two first connecting rods.

[0018] Preferably,

[0019] The outer walls of both sides of the temperature control module 2 are provided with slots. On the side of the two card plates that are close to each other, there are protruding card blocks that are adapted to the slots. The card blocks are inserted into the slots to achieve mechanical interlocking.

[0020] Preferably,

[0021] The outer wall of the insulating sleeve is provided with multiple umbrella skirts at intervals along the vertical direction, and the capacitor passes through the insulating sleeve and extends above the insulating sleeve.

[0022] Preferably,

[0023] The temperature control module includes a temperature controller, a heating element, a temperature sensor, and a pull-wire displacement sensor. The temperature controller is located on one side of the outer wall of the capacitor and is connected to the heating element. The body of the pull-wire displacement sensor is fixed to the bottom of the capacitor, and its pull-wire head is fixed to the movable heating element. The pull-wire displacement sensor is connected to the temperature controller via a signal cable. The temperature sensor is located close to the heating element and is connected to the temperature controller.

[0024] Preferably,

[0025] The heating element is configured as an annular ceramic heating element, and the temperature sensor is embedded in the annular ceramic heating element.

[0026] Compared with the prior art, the beneficial effects of the present invention are:

[0027] This invention discloses an infrared temperature measurement simulation device for a voltage transformer. By integrating a height adjustment mechanism and a module mounting mechanism, it effectively solves the problems of existing simulation devices having a single internal heat source location and cumbersome external module disassembly and assembly. The specific beneficial effects are as follows:

[0028] 1. Three-dimensional simulation and precise location of internal fault points

[0029] Self-locking structure, stable position: By setting up a height adjustment mechanism, the handle drives the gear and rack to mesh, which drives the internal temperature control module to move up and down inside the capacitor. With the help of the ratchet and pawl assembly, one-way self-locking is achieved. This allows the temperature control module to stay at any height inside the box. When the position needs to be adjusted, simply pull the lever to disengage the pawl from the ratchet to unlock it. Operators can quickly and continuously change the height of the heat source without the aid of tools. This breaks through the limitation of traditional devices that can only simulate fixed-point heating. It solves the problem that the internal heating point of existing simulation devices is fixed and it is difficult to flexibly simulate overheating faults at different oil levels or winding positions inside the transformer. It achieves the technical effect of stepless adjustment of the internal heat source height, prevention of accidental slippage of the heat source, and accurate reproduction of various internal longitudinal thermal defect scenarios without disassembling the equipment.

[0030] 2. Rapid replacement and diversified simulation of external fault modules

[0031] Plug and play, tool-free installation and removal: Module mounting mechanisms are set on the side of the transformer box and the top of the capacitor for installing temperature control module two (used to simulate poor contact and overheating of primary terminals or secondary terminal boxes). This structure changes the traditional bolt fastening method, allowing temperature control modules of different specifications and heating powers to be quickly plugged in and out. Due to the ease of replacement, trainees can replace temperature control modules with different resistance values ​​or powers multiple times in a short period of time, thereby obtaining a series of differentiated infrared thermal images such as "slight overheating", "moderate overheating" and "severe overheating" caused by differences in contact resistance. This greatly enriches the training materials and solves the problems of cumbersome disassembly and assembly and difficulty in quickly replacing different types of contact defect modules in the existing terminal fault simulation structure. It achieves the technical effect of tool-free quick disassembly and positioning of external temperature control modules, significantly improving the efficiency of infrared temperature measurement training and the convenience of equipment calibration.

[0032] 3. Enhance the authenticity and efficiency of training.

[0033] Realistically Recreates On-Site Working Conditions: By combining a height-adjustable "internal heat source" (temperature control module one) with a quickly replaceable "external heat source" (temperature control module two), this device can simulate complex faults that may occur in voltage transformers during operation (e.g., internal inter-turn short circuit accompanied by external terminal heating), making the simulation experiment closer to the actual site, significantly improving the comprehensive diagnostic capabilities of maintenance personnel. During training simulations, the device can be quickly adjusted to the preset fault location and heating temperature, greatly shortening the experiment preparation time and improving work efficiency.

[0034] 4. Compact structure and stable operation

[0035] The transmission and locking mechanism of the gear rack and ratchet pawl is integrated into the capacitor, resulting in a compact structure that does not alter the external contour of the voltage transformer, ensuring the realism of the infrared simulation. At the same time, the mechanical self-locking structure is more reliable than electromagnet locking, is unaffected by circuit faults, and ensures high long-term operational stability and high operational performance. Attached Figure Description

[0036] Figure 1 This is a three-dimensional structural diagram of a specific embodiment of the present invention;

[0037] Figure 2 for Figure 1 A partial structural schematic diagram of the specific implementation method shown;

[0038] Figure 3 This is a schematic diagram of the height adjustment mechanism.

[0039] Figure 4 This is a schematic diagram of the secondary terminal box structure;

[0040] Figure 5 This is a schematic diagram of a primary wiring terminal structure;

[0041] Figure 6 This is a schematic diagram of the temperature control module 2.

[0042] Explanation of reference numerals in the attached figures:

[0043] 1. Current transformer housing; 2. Capacitor; 3. Insulating sleeve;

[0044] 4. Height adjustment mechanism; 41. Handle; 42. Temperature control module one; 43. Gear; 44. Rack; 45. Ratchet; 46. Pad; 47. Pull rod; 48. Return spring;

[0045] 5. Module mounting mechanism; 51. Secondary terminal box; 52. Primary wiring terminal; 53. Temperature control module two;

[0046] 54. Locking assembly; 541. Snap-fit ​​plate; 542. Link 1; 543. Link 2; 544. Knob; 545. Torsion spring. Detailed Implementation

[0047] The technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention. All other embodiments obtained by those skilled in the art based on the embodiments of the present invention without creative effort are within the scope of protection of the present invention.

[0048] like Figures 1-6 As shown, it illustrates a specific embodiment of the present invention:

[0049] like Figures 1-6As shown, the present invention discloses an infrared temperature measurement simulation device for a voltage transformer, including a transformer housing 1 and a capacitor 2 fixedly connected to the top of the transformer housing 1. An insulating sleeve 3 is provided around the outer periphery of the capacitor 2, and a height adjustment mechanism 4 is provided on the capacitor 2. A module mounting mechanism 5 is provided on one side of the transformer housing 1 and the top of the capacitor 2. A temperature control module 53 is provided on the module mounting mechanism 5.

[0050] The height adjustment mechanism 4 includes a handle 41 rotatably mounted on the side wall of the transformer housing 1. The handle 41 is fixedly connected to a rotating shaft, which extends into the interior of the transformer housing 1. A gear 43 is fixedly connected to the side of the rotating shaft near the handle 41, and a ratchet 45 is fixedly connected to the side of the rotating shaft away from the handle 41. A sliding groove is provided inside the capacitor 2, and a rack 44 is slidably connected in the groove. A temperature control module 42 is fixedly connected to the top of the rack 44. The rack 44 meshes with the gear 43. A pawl 46 is provided on the upper side of the ratchet 45. A return spring 48 is fixedly connected between the pawl 46 and the inner side wall of the capacitor 2. Under the action of the return spring 48, the end of the pawl 46 engages in the tooth groove of the ratchet 45 to achieve position self-locking. A pull rod 47 is provided on the side of the pawl 46 away from the ratchet 45. The pull rod 47 passes through the side wall of the capacitor 2 and extends to the outside.

[0051] Furthermore,

[0052] The transformer housing 1 has a module mounting mechanism 5 on one side. The module mounting mechanism 5 includes a secondary terminal box 51. The secondary terminal box 51 has an installation cavity. A temperature control module 53 is installed and removed in the installation cavity. The secondary terminal box 51 is also equipped with a locking component 54.

[0053] like Figure 1 , Figure 4 As shown, in terms of secondary terminal fault simulation, this device innovatively integrates a module installation mechanism at the secondary terminal box. This mechanism, through the setting of a dedicated installation cavity and locking components, changes the traditional method of relying on bolt fastening. Operators can quickly install, position, and replace the temperature control module two within the installation cavity without the need for tools, simply by operating the locking components. This overcomes the shortcomings of existing voltage transformer simulation devices that, when simulating external terminal faults, suffer from inconvenient module replacement and easy interface wear due to fixed connections. By using the locking components to releasably fix the temperature control module two, tool-free rapid assembly and disassembly are achieved. This ensures efficient and stable switching between different fault simulation states during training demonstrations or equipment calibration, significantly improving the device's practicality.

[0054] On-site operators can quickly switch between temperature control modules with different power or resistance values ​​according to specific training needs to simulate different degrees of poor contact, which significantly improves the efficiency of replacing faulty modules in infrared temperature measurement training.

[0055] Furthermore,

[0056] The capacitor 2 is provided with a module mounting mechanism 5 on its top. The module mounting mechanism 5 includes a primary terminal 52. The primary terminal 52 has an installation cavity. A temperature control module 53 is installed and removed from the installation cavity. The primary terminal 52 is also provided with a locking component 54.

[0057] In addition, such as Figure 1 , Figure 5 As shown, in terms of simulating primary terminal faults, this device innovatively integrates a module mounting mechanism on top of the capacitor. This mechanism, by setting a dedicated mounting cavity and locking component at the primary terminal, changes the traditional method of relying on bolt fastening. It has the same structure and effect as the module mounting mechanism 5 set at the secondary terminal box. This design overcomes the shortcomings of existing voltage transformer simulation devices, which suffer from inconvenient module replacement and easy interface wear due to the fixed connection when simulating external faults at the primary terminal. The locking component provides a releasable fixation for the temperature control module 2, enabling tool-free quick assembly and disassembly for primary terminal simulation. This ensures efficient and stable switching between different primary terminal fault simulation states during training demonstrations or equipment calibration.

[0058] Furthermore,

[0059] The locking component 54 includes a knob 544, which is fixedly connected to a second connecting rod 543. Both ends of the second connecting rod 543 are rotatably connected to a first connecting rod 542. The end of the first connecting rod 542 away from the second connecting rod 543 is rotatably connected to a correspondingly arranged snap-fit ​​plate 541. The snap-fit ​​plate 541 and the second temperature control module 53 form a snap-fit ​​engagement.

[0060] like Figures 4-5 As shown, by adopting the above-mentioned linkage structure, when the operator rotates the knob, the power is transmitted to the two connecting rods on both sides through the second connecting rod, driving the two locking plates to move synchronously in opposite directions or back to back within the mounting cavity. When the locking plates move in opposite directions, the temperature control module 2 is quickly clamped and positioned; when the locking plates move back to back, the locking state is released to facilitate module replacement.

[0061] This design has the following beneficial effects:

[0062] 1. Synchronous centering and clamping: Through the linkage mechanism, the two clamping plates can move synchronously, realizing the synchronicity and symmetry of the clamping action. This ensures that the temperature control module 2 always remains in the center position in the installation cavity, avoiding skewness or poor contact caused by unilateral force, and improving the positioning accuracy of simulated fault points.

[0063] 2. Self-locking mechanical characteristics: When the linkage mechanism is in the clamped state, the specific angle formed by the knob, linkage and locking plate (usually close to the dead point) can generate a stable self-locking force. Even if the device is moving or vibrating, the temperature control module 2 will not loosen, ensuring the reliability of the training experiment process.

[0064] 3. Intuitive operation feedback: Operators can clearly perceive whether the clamping plate is in place by rotating the knob and observing the change in resistance, thus avoiding the hidden dangers of "over-tightening" or "under-tightening" in traditional bolt tightening.

[0065] Furthermore,

[0066] A torsion spring 545 is provided between the knob 544 and the connecting rod 543. The ends of the torsion spring 545 are respectively fixed to the surface of the knob 544 and the secondary terminal box 51 or the primary terminal 52.

[0067] like Figures 4-5 As shown, by adding a torsion spring, a flexible preload is essentially added to the locking assembly. This locking assembly, based on the self-locking characteristics of the original linkage mechanism, obtains a continuous and stable elastic preload. When the operator rotates the knob to clamp the temperature control module II with the snap-fit ​​plate, the elastic potential energy stored in the torsion spring will apply a continuous torque to the knob in the same direction as the clamping direction.

[0068] The torsion spring stores elastic potential energy in the locked state and applies a continuous torque to the knob in the same direction as the clamping. This design produces the following technical effects:

[0069] First, a dual locking mechanism of "mechanical dead point locking of connecting rod + elastic preload of torsion spring" has been formed, which overcomes the defect that single mechanical locking may fail in vibration environment and significantly improves the vibration resistance and anti-loosening capability of temperature control module 2.

[0070] Secondly, it achieves dynamic compensation for wear gaps, automatically absorbing the wear allowance generated by the linkage mechanism due to long-term use through elastic force, thus ensuring the long-term stability and repeatability of clamping.

[0071] Furthermore,

[0072] The bottoms of the two snap-fit ​​plates 541 are slidably connected to the bottom of the mounting cavity and are symmetrically distributed about the second connecting rod 543. When the second connecting rod 543 rotates, it drives the two snap-fit ​​plates 541 to move closer or further apart through the two first connecting rods 542.

[0073] like Figures 4-5 As shown, by adopting the symmetrical synchronous sliding structure in this embodiment, the two snap-fit ​​plates always make equidistant and opposite linear movements about the center line of the mounting cavity under the drive of the connecting rod.

[0074] Automatic centering clamping: Due to the synchronous and opposite movement of the two clamping plates, regardless of slight differences in the dimensions of the second temperature control module within the tolerance range, its centerline always coincides with the centerline of the mounting cavity after clamping. This automatic centering feature ensures that the second temperature control module is in the same precise position every time it is installed, eliminating simulation point errors caused by installation eccentricity and guaranteeing the repeatability and consistency of infrared temperature measurement experiments.

[0075] Balanced force distribution without off-center load: Symmetrical clamping ensures that the clamping forces on both sides of the temperature control module are equal in magnitude and opposite in direction, forming a pure static equilibrium state. This avoids the torque off-center load that is easily caused by unilateral or asynchronous clamping, and prevents the module from tilting, lifting, or being subjected to excessive pressure on one side during clamping, thus protecting the module shell and internal circuitry from additional stress damage.

[0076] Precise sliding guidance: The sliding fit between the bottom of the snap-fit ​​plate and the bottom of the mounting cavity provides reliable linear guidance for the movement of the snap-fit ​​plate, restricts its degree of freedom, and ensures that the snap-fit ​​plate always slides smoothly along the predetermined trajectory during reciprocating motion, avoiding clamping failure or jamming caused by shaking or swaying.

[0077] Based on the continuous preload provided by the torsion spring, this embodiment further defines the snap-fit ​​plates as symmetrically distributed and moving synchronously. The torsion spring solves the problem of "not locking tightly," while the symmetrical synchronous structure solves the problem of "not locking properly." The synergistic effect produced by the combination of the two is as follows:

[0078] The elastic force of the torsion spring causes the snap-fit ​​plate to clamp continuously, while the symmetrical linkage mechanism ensures that this clamping force always acts evenly on both sides of the module along the center line, so that the clamping force is completely converted into effective positive pressure, without any component force that would cause the module to deflect.

[0079] The sliding connection at the bottom of the locking plate provides low-friction, high-rigidity guidance for the entire movement, ensuring smooth opening and closing of the locking plate even under the large preload of the torsion spring, making operation easy. Thus, the locking assembly achieves optimal performance in terms of speed, precision, and stability.

[0080] Furthermore,

[0081] Both outer walls of the temperature control module 53 are provided with slots, and the two snap-fit ​​plates 541 are provided with snap-fit ​​blocks that are adapted to the slots on the side that is close to each other. The snap-fit ​​blocks are inserted into the slots to achieve mechanical interlocking.

[0082] like Figures 4-6 As shown, the locking component incorporates an embedded interlocking structure. By creating a slot on the temperature control module 2 and setting a locking block on the mounting plate, the simple "clamping" is upgraded to "embedded locking," forming a reliable mechanical interlock between the locking component and the temperature control module 2.

[0083] This structure overcomes the shortcomings of pure friction clamping, such as slippage and insufficient reliability under vibration. The cooperation between the card block and the card slot upgrades the fixing method of the temperature control module 2 from force locking (relying on friction) to shape locking (relying on geometric interlocking).

[0084] First, it effectively restricts the temperature control module 2 in the direction of the slot mating, making it rigidly connected to the device body in the locked state; second, it establishes an independent mechanical anti-detachment path, so that even if the clamping force decreases due to long-term use, the interlocking structure between the card block and the slot can still ensure that the module will not fall off accidentally; third, through the limiting effect of the slot, it further enhances the automatic centering effect brought by the synchronous clamping of the card plate, so that the repetitive installation accuracy of the module reaches the highest level.

[0085] Furthermore,

[0086] The outer wall of the insulating sleeve 3 is provided with multiple umbrella skirts at intervals along the vertical direction, and the capacitor 2 passes through the insulating sleeve 3 and extends above the insulating sleeve 3.

[0087] This is the basic structure for realizing the simulation of the device's shape and electrical insulation performance. By adopting the above structure, the insulating sleeve and the umbrella skirt of its outer wall constitute the external insulating protective layer of the simulation device, and the capacitor, as the simulation body of the internal high-voltage capacitor core, runs through it and extends upward.

[0088] This design overcomes the shortcomings of traditional simulation devices, which are often overly simplified in appearance and differ significantly from actual field equipment. The umbrella-shaped structure not only achieves high visual fidelity but, more importantly, alters the thermal convection and radiation characteristics of the device surface. This makes the temperature field gradient and hotspot distribution characteristics formed by the internal fault heat source on the device surface more closely resemble the infrared thermal image of a real voltage transformer under the corresponding fault.

[0089] This achieves the following technical effects:

[0090] First, it improves the authenticity and reference value of infrared spectral data;

[0091] Secondly, it enables trainees to receive specialized training in identifying thermal imaging characteristics under different umbrella skirt structures; thirdly, it provides an experimental basis for studying the impact of external insulation status on internal fault heat conduction.

[0092] Furthermore,

[0093] The temperature control module 42 includes a temperature controller, a heating element, a temperature sensor, and a pull-wire displacement sensor. The temperature controller is disposed on one side of the outer wall of the capacitor 2 and connected to the heating element. The body of the pull-wire displacement sensor is fixed to the bottom of the capacitor 2, and its pull-wire head is fixed to the movable heating element. The pull-wire displacement sensor is connected to the temperature controller via a signal cable. The temperature sensor is disposed close to the heating element and is connected to the temperature controller.

[0094] Its specific configuration includes a temperature control module that integrates an intelligent simulation unit for heating, temperature measurement, and displacement feedback. This unit can accurately control the location and temperature of the fault point, achieving precise simulation and real-time feedback of the location and temperature of the internal fault point.

[0095] The temperature control module consists of three subsystems that work together to achieve precise simulation:

[0096] Heating execution system: Composed of heating elements, it acts as a heat source to simulate the heat generated at internal fault points.

[0097] Closed-loop temperature control system: It consists of a temperature sensor and a temperature controller. The temperature sensor monitors the temperature of the heating element in real time and feeds it back to the temperature controller. The temperature controller adjusts the power of the heating element according to the difference between the set value and the measured value. This closed-loop control ensures the high stability of the heat source temperature (fluctuations can be controlled within ±0.5℃) and precise adjustability (any fault temperature value can be set).

[0098] Displacement monitoring system: Composed of a pull-wire displacement sensor. The pull-wire head moves with the heating element, outputting a displacement electrical signal in real time. This system converts the absolute position of the heating element inside the capacitor into quantitative data, solving the pain point of "knowing only that the height has been adjusted, but not knowing the specific height".

[0099] The combination of these three elements makes the temperature control module an intelligent heat source with a known location, controllable temperature, and recordable data, providing quantitative data for studying the relationship between fault locations and surface heat distribution.

[0100] Furthermore,

[0101] The heating element is configured as an annular ceramic heating element, and the temperature sensor is embedded in the annular ceramic heating element.

[0102] By adopting the above-mentioned ring structure and embedded integration scheme, the heating element of temperature control module one has been significantly optimized in terms of structure and performance.

[0103] The ring structure is a precise reproduction of the heating pattern of a real voltage transformer winding. When current flows through the winding, heat is generated uniformly along the ring conductor. The ring-shaped ceramic heating element simulates this characteristic, avoiding the "hot spot concentration" illusion caused by the use of point heat sources in traditional simulation devices, and making the thermal gradient distribution in the infrared spectrum more consistent with physical laws.

[0104] Its temperature sensor is embedded inside the ceramic, achieving "zero-distance" temperature sensing. Compared to patch sensors (affected by surface airflow) or built-in sensors (which suffer from thermal conduction delay), the embedded structure places the sensor and the heating element in the same thermal equilibrium system, enabling millisecond-level response to temperature changes and providing accurate feedback data for high-precision PID temperature control.

[0105] The use of ceramic material combines the dual properties of thermal conductivity and insulation. It can efficiently transfer heat to the device surface for infrared detection, while reliably isolating the internal circuitry from the high-voltage simulation environment, making it an optimal solution for functional integration.

[0106] The preferred embodiments of the present invention have been described in detail above with reference to the accompanying drawings. However, the present invention is not limited to the above embodiments. Within the scope of knowledge possessed by those skilled in the art, various changes can be made without departing from the spirit of the present invention. These changes involve related technologies well known to those skilled in the art, and all of them fall within the protection scope of the present invention.

[0107] Many other changes and modifications can be made without departing from the concept and scope of this invention. It should be understood that this invention is not limited to the specific embodiments, and the scope of this invention is defined by the appended claims.

Claims

1. A voltage transformer infrared temperature measurement simulation device, characterized in that, The device includes a transformer housing (1) and a capacitor (2) fixedly connected to the top of the transformer housing (1). An insulating sleeve (3) is provided around the outer periphery of the capacitor (2). A height adjustment mechanism (4) is provided on the capacitor (2). A module mounting mechanism (5) is provided on one side of the transformer housing (1) and the top of the capacitor (2). A temperature control module (53) is provided on the module mounting mechanism (5). The height adjustment mechanism (4) includes a handle (41) rotatably mounted on the side wall of the transformer housing (1). The handle (41) is fixedly connected to a rotating shaft, which extends into the interior of the transformer housing (1). A gear (43) is fixedly connected to the side of the rotating shaft near the handle (41), and a ratchet (45) is fixedly connected to the side of the rotating shaft away from the handle (41). A sliding groove is provided inside the capacitor (2), and a rack (44) is slidably connected in the sliding groove. A temperature control module is fixedly connected to the top of the rack (44). (42) The rack (44) meshes with the gear (43). The upper side of the ratchet (45) is provided with a pawl (46). A return spring (48) is fixedly connected between the pawl (46) and the inner wall of the capacitor (2). Under the action of the return spring (48), the end of the pawl (46) is engaged in the tooth groove of the ratchet (45) to achieve position self-locking. A pull rod (47) is provided on the side of the pawl (46) away from the ratchet (45). The pull rod (47) passes through the side wall of the capacitor (2) and extends to the outside.

2. The voltage transformer infrared temperature measurement simulation device according to claim 1, characterized in that, The transformer housing (1) is provided with a module installation mechanism (5) on one side. The module installation mechanism (5) includes a secondary terminal box (51). The secondary terminal box (51) has an installation cavity. A temperature control module (53) is installed in the installation cavity. The secondary terminal box (51) is also provided with a locking component (54).

3. The infrared temperature measurement simulation device for a voltage transformer according to claim 1, characterized in that, The capacitor (2) is provided with a module mounting mechanism (5) on its top. The module mounting mechanism (5) includes a primary terminal (52). The primary terminal (52) has an installation cavity. A temperature control module (53) is installed in the installation cavity. A locking component (54) is also provided on the primary terminal (52).

4. A voltage transformer infrared temperature measurement simulation device according to claim 2 or 3, characterized in that, The locking component (54) includes a knob (544), which is fixedly connected to a second connecting rod (543). The two ends of the second connecting rod (543) are respectively rotatably connected to a first connecting rod (542). The end of the first connecting rod (542) away from the second connecting rod (543) is rotatably connected to a corresponding snap-fit ​​plate (541). The snap-fit ​​plate (541) and the second temperature control module (53) form a snap-fit ​​engagement.

5. The infrared temperature measurement simulation device for a voltage transformer according to claim 4, characterized in that, A torsion spring (545) is provided between the knob (544) and the connecting rod (543), and the ends of the torsion spring (545) are respectively fixed to the surface of the knob (544) and the secondary terminal box (51) or the primary terminal (52).

6. The infrared temperature measurement simulation device for a voltage transformer according to claim 4, characterized in that, The bottom of the two snap-fit ​​plates (541) are slidably connected to the bottom of the mounting cavity and are symmetrically distributed about the second connecting rod (543). When the second connecting rod (543) rotates, it drives the two snap-fit ​​plates (541) to move closer to each other or further away from each other in sync through the two first connecting rods (542).

7. The infrared temperature measurement simulation device for a voltage transformer according to claim 6, characterized in that, The temperature control module 2 (53) has slots on both outer walls. The two snap-fit ​​plates (541) have protruding snap-fit ​​blocks that are compatible with the slots on their adjacent sides. The snap-fit ​​blocks are inserted into the slots to achieve mechanical interlocking.

8. The infrared temperature measurement simulation device for a voltage transformer according to claim 1, characterized in that, The outer wall of the insulating sleeve (3) is provided with multiple umbrella skirts at intervals along the vertical direction, and the capacitor (2) passes through the insulating sleeve (3) and extends above the insulating sleeve (3).

9. The infrared temperature measurement simulation device for a voltage transformer according to claim 1, characterized in that, The temperature control module 1 (42) includes a temperature controller, a heating element, a temperature sensor, and a pull-wire displacement sensor. The temperature controller is located on one side of the outer wall of the capacitor (2) and connected to the heating element. The body of the pull-wire displacement sensor is fixed to the bottom of the capacitor (2), and its pull-wire head is fixed to the movable heating element. The pull-wire displacement sensor is connected to the temperature controller via a signal cable. The temperature sensor is located close to the heating element and is connected to the temperature controller.

10. The infrared temperature measurement simulation device for a voltage transformer according to claim 9, characterized in that, The heating element is configured as an annular ceramic heating element, and the temperature sensor is embedded in the annular ceramic heating element.

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