Substrate processing apparatus and processing vessel internal condition detection method

Abstract

The present disclosure relates to a substrate processing apparatus and a processing container inner condition detection method that efficiently detect a condition inside a processing container. The substrate processing apparatus includes a processing container, an imaging section, and a control section. The processing container has a processing space capable of housing a substrate and a carry-in / out port for carrying in and out the substrate with respect to the processing space. The imaging section captures an imaging region including the carry-in / out port and the processing space inside the processing container exposed from the carry-in / out port. The control section detects a state of the substrate inside the processing container based on a luminance value of an imaging image captured by the imaging section.

Description

Technical Field

[0001] This disclosure relates to a substrate processing apparatus and a method for detecting the condition inside a processing container. Background Technology

[0002] Patent Document 1 discloses the following technology: when a substrate is being moved into a processing container, a camera provided on a conveying arm for moving the substrate is used to capture images of the substrate being moved into and out of the processing container, and the captured images are compared with reference images to detect the condition inside the processing container.

[0003] Existing technical documents

[0004] Patent documents

[0005] Patent Document 1: Japanese Patent Application Publication No. 2005-175083 Summary of the Invention

[0006] The problem the invention aims to solve

[0007] This disclosure provides a technique for properly detecting and processing conditions inside a container.

[0008] Solution for solving the problem

[0009] One aspect of the substrate processing apparatus disclosed herein includes a processing container, a camera unit, and a control unit. The processing container has a processing space capable of accommodating a substrate and a loading / unloading outlet for moving the substrate into and out of the processing space. The camera unit captures images of a camera area including the loading / unloading outlet and the processing space within the processing container exposed from the loading / unloading outlet. The control unit detects the state of the substrate within the processing container based on the brightness values ​​of the images captured by the camera unit.

[0010] The effects of the invention

[0011] According to this disclosure, the condition inside the processing container can be detected and processed efficiently. Attached Figure Description

[0012] Figure 1 This is a diagram showing the structure of the substrate processing apparatus according to the embodiment.

[0013] Figure 2 This is a diagram showing the structure of the liquid treatment unit according to the embodiment.

[0014] Figure 3 This is a side cross-sectional view schematically showing the structure of the drying unit involved in the embodiment.

[0015] Figure 4 This is a side cross-sectional view schematically showing the structure of the drying unit involved in the embodiment.

[0016] Figure 5 This is a side cross-sectional view schematically showing the structure of the drying unit involved in the embodiment.

[0017] Figure 6 yes Figure 3 A cross-sectional view at line VI-VI.

[0018] Figure 7 This is a diagram showing, in an enlarged view, the structure of the lighting unit and its surroundings according to the embodiment.

[0019] Figure 8 yes Figure 7 A cross-sectional view at line VIII-VIII.

[0020] Figure 9 This is a flowchart illustrating the process performed by the substrate processing apparatus according to the embodiment.

[0021] Figure 10 This is a flowchart illustrating the process of detecting the condition inside the first processing container according to the embodiment.

[0022] Figure 11 This is a flowchart illustrating the process of detecting whether a substrate is present or not, performed by the control unit involved in the embodiment.

[0023] Figure 12 This is a diagram used to illustrate the first process involved in the implementation method.

[0024] Figure 13 This is a diagram used to illustrate the first process involved in the implementation method.

[0025] Figure 14 This is a diagram used to illustrate the first process involved in the implementation method.

[0026] Figure 15 This is a diagram used to illustrate the second process involved in the implementation method.

[0027] Figure 16 This is a diagram used to illustrate the third process involved in the implementation method.

[0028] Figure 17 This is a diagram used to illustrate the third process involved in the implementation method.

[0029] Figure 18 This is a flowchart illustrating the process of condition detection processing within the second processing container according to the embodiment.

[0030] Figure 19 This is a flowchart illustrating the process of detecting whether a substrate has detached, performed by the control unit involved in the embodiment.

[0031] Figure 20 This is a diagram illustrating another example of the third process involved in the implementation method.

[0032] Figure 21 This is a diagram illustrating another example of the third process involved in the implementation method.

[0033] Figure 22 This is a flowchart illustrating the process of detecting whether a substrate is present or not, performed by the control unit according to a variation of embodiment 1.

[0034] Figure 23 This is a diagram illustrating the fourth process involved in Variation 1 of the implementation method.

[0035] Figure 24 This is a diagram illustrating the fifth process involved in Variation 1 of the implementation method.

[0036] Figure 25 This is a diagram illustrating the sixth process involved in Variation 1 of the implementation method.

[0037] Figure 26 This is a diagram illustrating the seventh process involved in Variation 1 of the implementation method.

[0038] Figure 27 This is a diagram illustrating the eighth process involved in Variation 1 of the implementation method.

[0039] Figure 28 This is a flowchart illustrating the process of detecting whether a substrate has detached, performed by the control unit according to a modified example 2 of the embodiment.

[0040] Figure 29 This is a diagram illustrating the ninth process involved in Modification 2 of the implementation method.

[0041] Figure 30 This is a diagram illustrating the tenth process involved in Modification 2 of the implementation method. Detailed Implementation

[0042] Hereinafter, with reference to the accompanying drawings, a method for implementing the substrate processing apparatus and the method for detecting the condition inside the processing container of the present disclosure will be described in detail (hereinafter referred to as "Embodiments"). However, the present disclosure is not limited by these embodiments. Furthermore, the various embodiments can be appropriately combined without contradicting the processing content. In the following embodiments, the same reference numerals are used to label the same parts, and repeated descriptions are omitted.

[0043] Furthermore, in the embodiments shown below, expressions such as "constant," "orthogonal," "perpendicular," or "parallel" are sometimes used, but these expressions need not be strictly "constant," "orthogonal," "perpendicular," or "parallel." That is, the above-mentioned expressions, for example, allow for errors and tolerances in manufacturing precision, setting precision, etc.

[0044] Furthermore, in the accompanying figures referred to below, an orthogonal coordinate system is sometimes shown, defining mutually orthogonal X-axis, Y-axis, and Z-axis directions, with the positive Z-axis direction set as the vertically upward direction, to facilitate understanding of the explanation. Additionally, the direction of rotation about the vertical axis is sometimes referred to as the θ direction.

[0045] Patent Document 1 discloses the following technology: when a substrate is being moved into a processing container, a camera provided on a conveying arm for moving the substrate is used to capture images of the substrate being moved into and out of the processing container, and the captured images are compared with reference images to detect the condition inside the processing container.

[0046] However, techniques that compare camera images with reference images suffer from limitations in high-speed processing and efficient detection of conditions within the processing container. Therefore, a technique for efficiently detecting conditions within the processing container is desired.

[0047] (Implementation Method)

[0048] <Structure of the substrate processing system>

[0049] First, refer to Figure 1 The structure of the substrate processing apparatus involved in the embodiments will be described. Figure 1 This is a diagram showing the structure of the substrate processing apparatus according to the embodiment.

[0050] like Figure 1 As shown, the substrate processing apparatus 1 includes a loading / unloading station 2 and a processing station 3. The loading / unloading station 2 and the processing station 3 are arranged adjacent to each other.

[0051] The loading / unloading station 2 includes a carrier placement section 11 and a transport section 12. In the carrier placement section 11, multiple carriers C are placed to hold multiple semiconductor wafers (hereinafter referred to as "wafers W") in a horizontal position.

[0052] The conveying section 12 is arranged adjacent to the carrier placement section 11. The conveying device 13 and the transfer section 14 are arranged inside the conveying section 12.

[0053] The conveying device 13 is equipped with a wafer holding mechanism for holding the wafer W. In addition, the conveying device 13 is capable of moving in the horizontal and vertical directions and rotating around the vertical axis, and uses the wafer holding mechanism to convey the wafer W between the carrier C and the junction 14.

[0054] Processing station 3 is located adjacent to conveying unit 12. Processing station 3 includes conveying block 4, first processing block 5, and second processing block 6.

[0055] The transfer block 4 includes a transfer area 15 and a transfer device 16. The transfer area 15 is, for example, a cuboid region extending along the arrangement direction (X-axis direction) of the transfer in / out station 2 and the processing station 3. The transfer device 16 is arranged in the transfer area 15.

[0056] The conveying device 16 is equipped with a wafer holding mechanism for holding the wafer W. The conveying device 16 is capable of moving in the horizontal and vertical directions and rotating around the vertical axis, and uses the wafer holding mechanism to convey the wafer W between the junction 14, the first processing block 5 and the second processing block 6.

[0057] The first processing block 5 and the second processing block 6 are arranged adjacent to the transfer area 15 on both sides of the transfer area 15. Specifically, the first processing block 5 is arranged on one side (the negative Y-axis side) of the transfer area 15 in a direction orthogonal to the arrangement direction (X-axis direction) of the transfer-in / transfer-out station 2 and the processing station 3. The second processing block 6 is arranged on the other side (the positive Y-axis side) of the transfer area 15 in a direction orthogonal to the arrangement direction (X-axis direction) of the transfer-in / transfer-out station 2 and the processing station 3.

[0058] The first processing block 5 has a liquid processing unit 17.

[0059] The liquid processing unit 17 performs a cleaning process on the upper surface of the wafer W, which serves as the patterning surface. Additionally, the liquid processing unit 17 performs a liquid film formation process to form a liquid film on the upper surface of the cleaned wafer W. The structure of the liquid processing unit 17 will be described later.

[0060] The second processing block 6 includes a drying unit 18 and a supply unit 19.

[0061] Drying unit 18 performs supercritical drying on the wafer W after liquid film formation treatment. Specifically, drying unit 18 dries the wafer W by contacting it with a supercritical processing fluid (hereinafter also referred to as "supercritical fluid"). The structure of drying unit 18 will be described later.

[0062] The supply unit 19 supplies processing fluid to the drying unit 18. Specifically, the supply unit 19 includes a supply device assembly comprising a flow meter, a flow regulator, a back pressure valve, a heater, etc., and a housing containing the supply device assembly. In this embodiment, the supply unit 19 supplies CO2 to the drying unit 18 as the processing fluid.

[0063] The substrate processing apparatus 1 includes a control device 7. The control device 7 is, for example, a computer, and includes a control unit 71 and a storage unit 72.

[0064] The control unit 71 includes a microcomputer with a CPU (Central Processing Unit), ROM (Read Only Memory), RAM (Random Access Memory), input / output ports, and various circuits. The CPU of the microcomputer reads and executes programs stored in the ROM to control the conveying devices 13 and 16, the liquid treatment unit 17, the drying unit 18, and the supply unit 19.

[0065] The program can also be recorded on a computer-readable recording medium and installed from that recording medium into the storage unit 72 of the control device 7. Examples of computer-readable recording media include hard disks (HD), floppy disks (FD), optical disks (CD), magneto-optical disks (MO), and memory cards.

[0066] The storage unit 72 is implemented, for example, by semiconductor memory elements such as RAM and flash memory, or storage devices such as hard disks and optical disks.

[0067] <Structure of the liquid treatment unit>

[0068] Next, refer to Figure 2 To illustrate the structure of the liquid treatment unit 17. Figure 2 This is a diagram showing the structure of the liquid processing unit 17 according to the embodiment. The liquid processing unit 17 is configured, for example, as a monolithic cleaning device that cleans wafer W one by one by rotating the cleaning process.

[0069] like Figure 2 As shown, the liquid treatment unit 17 holds the wafer W approximately horizontally by means of a wafer holding mechanism 25 disposed within the outer chamber 23 forming the processing space, and rotates the wafer W by rotating the wafer holding mechanism 25 about a vertical axis. Furthermore, the liquid treatment unit 17 performs surface cleaning of the wafer W by bringing the nozzle arm 26 above the rotating wafer W and supplying a chemical solution and rinsing solution from a chemical nozzle 26a disposed at the front end of the nozzle arm 26 in a predetermined sequence.

[0070] In the liquid processing unit 17, a gas supply path 25a is formed inside the wafer holding mechanism 25. The liquid processing unit 17 supplies a gas, such as nitrogen or other inactive gas, from the gas supply path 25a to the center of the back side of the wafer W.

[0071] In the cleaning process, for example, particulate and organic pollutants are first removed using SC1 solution (a mixture of ammonia and hydrogen peroxide water), which is an alkaline solution. This is followed by rinsing with deionized water (hereinafter referred to as "DIW"). Next, the natural oxide film is removed using a dilute hydrofluoric acid solution (hereinafter referred to as "DHF"), which is an acidic solution. Finally, rinsing is performed using DIW.

[0072] The aforementioned liquid medicines are fed into the outer chamber 23 and the inner cup 24 disposed within the outer chamber 23, and discharged from the drain port 23a at the bottom of the outer chamber 23 and the drain port 24a at the bottom of the inner cup 24. Furthermore, the atmosphere within the outer chamber 23 is vented from the exhaust port 23b at the bottom of the outer chamber 23.

[0073] The liquid film formation process is performed after the rinsing process in the cleaning process. Specifically, the liquid treatment unit 17 supplies IPA liquid to the front and back surfaces of the wafer W while rotating the wafer holding mechanism 25. As a result, the DIW remaining on both surfaces of the wafer W is replaced with IPA.

[0074] At this time, the liquid processing unit 17 supplies gas from the gas supply path 25a to the center of the back side of the wafer W. The gas supplied to the center of the back side of the wafer W flows along the back side of the wafer W toward the outer periphery of the back side of the wafer W. As a result, it is possible to prevent the IPA supplied to the surface of the wafer W during the liquid film formation process in the liquid processing unit 17 from wrapping around to the back side of the wafer W. Afterwards, the liquid processing unit 17 slowly stops the rotation of the wafer holding mechanism 25.

[0075] After the liquid film formation process is completed, the wafer W, with an IPA liquid film formed on its surface, is transferred to the transport device 16 by the transfer mechanism provided in the wafer holding mechanism 25 and is removed from the liquid processing unit 17. The liquid film formed on the wafer W prevents pattern collapse due to liquid evaporation (vaporization) on the surface of the wafer W during the transfer of the wafer W from the liquid processing unit 17 to the drying unit 18 and during the transfer into the drying unit 18.

[0076] <Structure of the drying unit>

[0077] Next, refer to Figures 3-8 To illustrate the structure of drying unit 18. Figures 3-5 This is a side cross-sectional view schematically showing the structure of the drying unit 18 according to the embodiment. Figure 6 yes Figure 3 A cross-sectional view at line VI-VI. Furthermore, in Figure 3The image shows the cover 32 in the standby position. Figure 4 The image shows the cover 32 in its open position. Figure 5 The cover 32 is shown in the blocked position.

[0078] like Figures 3-5 As shown, the drying unit 18 includes a processing container 31, a cover 32, 33 and a plurality of support pins 34.

[0079] The processing container 31 has a processing space 31a inside, for example, capable of accommodating a wafer W with a diameter of 300 mm. During the supercritical drying process for the wafer W, the processing space 31a inside the processing container 31 is pressurized.

[0080] The processing container 31, for example, has a rectangular shape when viewed from above, and has inlet / outlet ports 31b on one of its multiple (four in this case) sides facing the transfer area 15 for loading and unloading wafers W relative to the processing space 31a. The processing container 31 has a maintenance port 31c at a position opposite the inlet / outlet ports 31b, separated from the processing space 31a. The maintenance port 31c communicates the processing space 31a with the outside. The maintenance port 31c is used, for example, for maintenance of the processing container 31.

[0081] The cover 32 is disposed on one end side (negative Y-axis direction side) of the processing container 31 in the transport direction (Y-axis direction) of the wafer W.

[0082] The cover 32 is configured to block the inlet / outlet 31b of the processing container 31. That is, the cover 32 is connected to both the rotating mechanism 32a and the direct-acting mechanism 32b. Through the rotating mechanism 32a, the cover 32 is able to... Figure 3 The standby position shown is Figure 4 The cover 32 can rotate between the shown open positions. Via the direct-acting mechanism 32b, the cover 32 is able to... Figure 4 The open location shown is... Figure 5 The cover 32 moves between the indicated blocking positions. This causes the inlet / outlet 31b to open or close. The blocking position is where the cover 32 blocks the inlet / outlet 31b via the sealing member 321. The opening position is a position away from the blocking position in the transport direction (e.g., the negative Y-axis direction) relative to the process space 31a from which the wafer W is transported. The standby position is when the cover 32 does not move along the transport path R (refer to...) of the wafer W transported relative to the process space 31a. Figure 6The location where interference occurs. By placing the cover 32 in the standby position, thus preventing the cover 32 from blocking the inlet / outlet 31b, the conveying device 16 can move the held wafer W from the inlet / outlet 31b into the processing space 31a. Furthermore, by placing the cover 32 in the standby position, a portion of the sealing member 321 faces the second through-hole 31g, described later. For example, an O-ring can be used as the sealing member 321.

[0083] The cover 33 is disposed on the other end (positive Y-axis direction) of the processing container 31 in the wafer W transport direction (Y-axis direction). The cover 33 blocks the maintenance port 31c of the processing container 31. The cover 33 blocks the maintenance port 31c via a sealing member 331. An O-ring can be used, for example, as the sealing member 321.

[0084] In this way, the processing space 31a is a space that is open at both ends in the transport direction of the wafer W. The processing space 31a is sealed by blocking the loading and unloading outlets 31b and the maintenance port 31c with covers 32 and 33 respectively.

[0085] A supply port 35 is provided in the cover 33. The supply port 35 is connected to a supply line (not shown) for supplying supercritical fluid to the drying unit 18. In addition, an outlet 36 is provided in the processing space 31a. The outlet 36 is connected to a discharge line (not shown) for discharging supercritical fluid and other fluids from the drying unit 18.

[0086] The supply port 35 opens horizontally toward the processing space 31a. Supercritical fluid supplied from a supply line not shown flows horizontally within the processing space 31a from the maintenance port 31c toward the inlet / outlet 31b.

[0087] The outlet 36 is located near the inlet / outlet 31b. For example, the outlet 36 may open into the bottom surface of the processing space 31a near the inlet / outlet 31b. The supercritical fluid flowing into the processing space 31a toward the inlet / outlet 31b is discharged from the outlet 36 to the outside of the processing space 31a via a discharge line (not shown). Furthermore, the supercritical fluid discharged to the outside of the processing space 31a may also include IPA liquid, which is supercritical fluid dissolved from the surface of the wafer W in a supercritical state.

[0088] Multiple support pins 34 are disposed on the bottom surface of the processing space 31a to support the wafer W in a manner that separates it from the bottom surface of the processing space 31a.

[0089] Within the drying unit 18, the IPA liquid formed between the patterns on the wafer W gradually dissolves in the supercritical fluid due to contact with the supercritical fluid under high pressure (e.g., 16 MPa), and the IPA liquid between the patterns is gradually replaced by the supercritical fluid. Ultimately, the spaces between the patterns are filled only by the supercritical fluid.

[0090] Furthermore, after removing the IPA liquid from between the patterns, the pressure inside the processing container 31 is reduced from a high-pressure state to atmospheric pressure. This causes the CO2 to change from a supercritical state to a gaseous state, leaving the spaces between the patterns occupied solely by gas. In this way, the IPA liquid between the patterns is removed, and the drying process of wafer W is completed.

[0091] Besides having lower viscosity and higher dissolving power compared to liquids (such as IPA liquid), supercritical fluids also lack an interface with liquids or gases in equilibrium. Therefore, in drying processes using supercritical fluids, the liquid can be dried without being affected by surface tension. Consequently, according to the embodiment, pattern collapse can be suppressed during the drying process.

[0092] Furthermore, in the embodiments, an example is shown where IPA liquid is used as the liquid for preventing desiccation and supercritical CO2 is used as the processing fluid. However, liquids other than IPA can also be used as the liquid for preventing desiccation, and fluids other than supercritical CO2 can also be used as the processing fluid.

[0093] The processing container 31 has a first protrusion 31d and a second protrusion 31e that protrude toward the removal direction (in this case, the negative Y-axis direction) of the wafer removal space 31 relative to the loading / unloading outlet 31b. The first protrusion 31d protrudes from the lower part of the loading / unloading outlet 31b toward the negative Y-axis direction, and the second protrusion 31e protrudes from the upper part of the loading / unloading outlet 31b toward the negative Y-axis direction.

[0094] A first through hole 31f is formed in the first protrusion 31d, communicating between the upper and lower surfaces of the first protrusion 31d. Furthermore, a second through hole 31g is formed in the second protrusion 31e, at a position facing the first through hole 31f in the vertical direction, communicating between the upper and lower surfaces of the second protrusion 31e. The locking member 51, described later, is inserted through the first through hole 31f and the second through hole 31g.

[0095] Additionally, the processing container 31 has a shielding plate 42 that covers the space 311 between the first protrusion 31d and the second protrusion 31e from the negative Y-axis direction. The shielding plate 42 has a recess that is recessed toward the space 311, in which the camera unit 41 and the lighting unit 44, described later, are housed.

[0096] The shielding plate 42 has an opening 42a for the wafer W to pass through at a position facing the loading / unloading outlet 31b across the space 311. In addition, the processing container 31 may also have other shielding plates (not shown) that shield the two sides of the space 311 (here, the side facing the positive X-axis direction and the side facing the negative X-axis direction).

[0097] like Figure 3 and Figure 6 As shown, the drying unit 18 includes a camera unit 41. The camera unit 41 captures images of the imaging area, including the loading / unloading outlet 31b and the processing space 31a inside the processing container 31 exposed from the loading / unloading outlet 31b, when the loading / unloading outlet 31b is not blocked by the cover 32.

[0098] The camera unit 41 is positioned so as not to overlap with the transport path R of the wafer W being transported relative to the processing space 31a via the loading / unloading outlet 31b when viewed from above. Specifically, the camera unit 41 is positioned on the outer surface of the shielding plate 42 that does not face the space 311 and is adjacent to the opening 42a along the width direction (here, the X-axis direction) of the transport path R of the wafer W.

[0099] On the shielding plate 42, a through hole 42b is formed adjacent to the opening 42a along the width direction of the transport path R of the wafer W. This through hole 42b is blocked by a transparent member 42c. The camera unit 41 captures images of the camera area from the outer surface of the shielding plate 42 through the transparent member 42c.

[0100] In this way, in the drying unit 18 according to the embodiment, the camera unit 41 is used to capture an image of the imaging area including the loading / unloading outlet 31b and the processing space 31a inside the processing container 31 exposed from the loading / unloading outlet 31b, thereby enabling appropriate detection of the condition inside the processing container 31. As a result, the drying unit 18 can, for example, detect the presence or absence of other wafers left in the processing container 31 when loading the wafer W relative to the processing container 31, thereby reducing the possibility of wafer W breakage due to collisions with other wafers.

[0101] Furthermore, since the camera unit 41 is positioned so as not to overlap with the transport path R of the wafer W when viewed from above, interference between the camera unit 41 and the wafer W can be avoided even when the transport device 16 transports the wafer W from the transport inlet / outlet 31b into the processing space 31a.

[0102] Furthermore, the camera unit 41 captures images of the camera area through the transparent member 42c from the outer surface of the shielding plate 42. This allows the camera unit 41 to perform imaging without contacting the atmosphere within the space 311 between the first protrusion 31d and the second protrusion 31e, thus suppressing malfunctions of the camera unit 41 caused by contact with the atmosphere within the space 311.

[0103] A partition wall 43 is provided on the shielding plate 42. The partition wall 43 is located on the outer periphery of the opening 42a on the outer surface of the shielding plate 42, isolating the opening 42a from the camera unit 41. As a result, the camera unit 41 can perform imaging processing without contacting the atmosphere in the space 311 between the first protrusion 31d and the second protrusion 31e, and can suppress malfunctions of the camera unit 41 caused by contact with the atmosphere in the space 311.

[0104] like Figures 3-5 As shown, the drying unit 18 includes an illumination unit 44. The illumination unit 44 illuminates a predetermined area around the loading / unloading outlet 31b within the imaging area captured by the imaging unit 41. Specifically, the illumination unit 44 illuminates a predetermined area located above the loading / unloading outlet 31b within the imaging area. If the entire imaging area captured by the imaging unit 41 is illuminated, the imaging accuracy of the imaging process may be reduced because reflected light from the imaging area may hinder the imaging processing of the imaging unit 41.

[0105] In this regard, in the drying unit 18 of the embodiment, the illumination unit 44 illuminates not the entire imaging area, but a designated area around the loading / unloading outlet 31b within the imaging area. As a result, reflected light from the imaging area is reduced, thus improving the imaging accuracy of the imaging unit 41. Consequently, the condition inside the processing container 31 can be detected more appropriately.

[0106] Here, refer to Figure 7 and Figure 8 To explain the structure of the lighting section 44 and its surroundings. Figure 7 This is a diagram showing, in an enlarged view, the structure of the lighting unit 44 and its surrounding area according to the embodiment. Figure 8 yes Figure 7 A cross-sectional view at line VIII-VIII. Furthermore, in Figure 7 For ease of explanation, the illustration of the partition wall 43 on the shielding plate 42 is omitted.

[0107] like Figure 7 and Figure 8 As shown, the shielding plate 42 has a plurality of through holes 42d arranged along the width direction (here, the X-axis direction) of the transport path R of the wafer W at a position opposite to a designated area P around the transport outlet 31b illuminated by the illumination unit 44.

[0108] The lighting unit 44 includes a fixing plate 441, a light source 442, and a light diffusion unit 443.

[0109] The fixing plate 441 is a plate-shaped component extending along the width direction of the transport path R of the wafer W, and faces the plurality of through holes 42d in the shielding plate 42. A light diffuser 443 is sandwiched between the fixing plate 441 and the shielding plate 42, and is connected to the shielding plate 42, for example, by a connecting member (not shown) such as a bolt. A recess for fixing the light source 442 is formed on the facing surface of the fixing plate 441 facing the shielding plate 42.

[0110] The light source 442 is fixed to the fixing plate 441 and emits light. The light source 442 is, for example, fixed to the bottom surface of the recess formed in the fixing plate 441.

[0111] The light diffusion section 443 is a plate-shaped component extending along the width direction of the transport path R of the wafer W, and is disposed between the fixing plate 441 and the shielding plate 42. The light diffusion section 443 diffuses the light emitted from the light source 442 in the width direction of the transport path R of the wafer W, and a portion of the diffused light irradiates a predetermined area P around the loading and unloading outlet 31b through a plurality of through holes 42d.

[0112] In this manner, the illumination unit 44 of the embodiment uses a light diffusion unit 443 to diffuse light in the width direction of the transport path R of the wafer W, and a portion of the diffused light is directed through multiple through-holes 42d to illuminate a predetermined area P around the loading / unloading outlet 31b. Therefore, the predetermined area P around the loading / unloading outlet 31b can be illuminated uniformly throughout.

[0113] like Figures 3-5 As shown, the drying unit 18 includes a locking member 51. The locking member 51 is inserted into a first through hole 31f formed in the first protrusion 31d. A lifting mechanism 51a is connected to the locking member 51 to raise and lower it.

[0114] Here, the operation of the locking member 51 is explained. The drying unit 18 first performs a wafer W loading process. During the loading process, the transport device 16 transfers the wafer W, held in the wafer holding mechanism, to the support pin 34. Then, the drying unit 18 uses the rotation mechanism 32a to move the cover 32 from the standby position (see reference 1). Figure 3 Rotate to the open position (see reference) Figure 4 And a direct-acting mechanism 32b is used to move the cover 32 from the open position to the blocked position (see reference). Figure 5 Thus, the loading / unloading outlet 31b of the processing container 31 is blocked by the cover 32, sealing the processing space 31a. Afterwards, the drying unit 18 uses the lifting mechanism 51a to raise the locking member 51, so that the locking member 51 is inserted into the second insertion hole 31g formed in the second protrusion 31e.

[0115] The locking member 51 is inserted through the second through hole 31g and abuts against the side of the cover 32 opposite to the side of the blockage inlet / outlet 31b, restricting the movement of the cover 32 from the blocked position to the open position. Therefore, the locking member 51 can overcome the internal pressure brought by the supercritical fluid supplied to the processing space 31a and press the cover 33 toward the processing space 31a. Thus, the state in which the processing space 31a is sealed by the cover 33 can be maintained.

[0116] The drying unit 18 includes an exhaust duct 52. The exhaust duct 52 is positioned above the second through hole 31g. The exhaust duct 52 communicates with the space 311 between the first protrusion 31d and the second protrusion 31e via an exhaust port (not shown) formed in the second protrusion 31e. The exhaust duct 52 is connected to a pump (not shown) and discharges the atmosphere from the processing space 31a via the space 311 and the exhaust port.

[0117] In the exhaust pipe 52, through holes 52a and 52b are formed at positions corresponding to the second through hole 31g. Through hole 52a is formed at the bottom of the exhaust pipe 52, and through hole 52b is formed at the top of the exhaust pipe 52. Through holes 52a and 52b are respectively blocked by transparent member 52c.

[0118] The drying unit 18 is equipped with another camera unit 53. The other camera unit 53 photographs the sealing member 321 when the loading and unloading outlet 31b is not blocked by the cover 32. Specifically, when the cover 32 is in the standby position, the other camera unit 53 photographs the sealing member 321 from above the exhaust pipe 52 through the transparent member 52c and the second insertion hole 31g.

[0119] In this way, in the drying unit 18 according to the embodiment, another camera 53 is used to photograph the sealing member 321, thereby enabling proper detection of abnormalities in the sealing member 321. This allows for the suppression of leakage of processing fluid from the processing container 31 due to deterioration of the sealing member 321.

[0120] In this way, in the drying unit 18 according to the embodiment, the camera unit 41 is used to capture an image of the imaging area including the loading / unloading outlet 31b and the processing space 31a inside the processing container 31 exposed from the loading / unloading outlet 31b, thereby enabling appropriate detection of the condition inside the processing container 31. As a result, the drying unit 18 can, for example, detect the presence or absence of other wafers left in the processing container 31 when loading the wafer W relative to the processing container 31, thereby reducing the possibility of wafer W breakage due to collisions with other wafers.

[0121] <Specific Operations of the Substrate Processing Device>

[0122] Next, refer to Figure 9To explain the specific operation of substrate processing device 1. Figure 9 This is a flowchart illustrating the processing procedure performed by the substrate processing apparatus 1 according to the embodiment. Furthermore, in Figure 9 An example of the processing procedure from the moment wafer W is moved into the liquid processing unit 17 to the moment wafer W is moved out of the drying unit 18 is shown. Figure 9 Each processing step shown is executed under the control of the control unit 71.

[0123] In the substrate processing apparatus 1, firstly, the transfer device 13 removes the wafer W housed in the carrier C and places it in the transfer section 14. Next, after removing the wafer W from the transfer section 14, the transfer device 16 transfers the removed wafer W into the liquid processing unit 17 (step S101).

[0124] Next, in the substrate processing apparatus 1, the liquid processing unit 17 performs liquid processing on the wafer W (step S102). Specifically, after the liquid processing unit 17 cleans the surface of the wafer W using a chemical solution and a rinsing solution, it performs a liquid film formation process by supplying IPA liquid to the surface of the wafer W to form a liquid film.

[0125] Next, in the substrate processing apparatus 1, the liquid-processed wafer W, i.e. the wafer W with a liquid film formed, is transferred from the liquid processing unit 17 to the transfer device 16 (step S103).

[0126] Next, in the substrate processing apparatus 1, a condition detection process inside the first processing container is performed (step S104). Details of this condition detection process inside the first processing container will be described later.

[0127] Next, in the substrate processing apparatus 1, the wafer W is transferred into the drying unit 18 (step S105).

[0128] Specifically, the transport device 16 removes the wafer W from the liquid processing unit 17 while it is held in place by the wafer holding mechanism. Then, the transport device 16 moves the wafer W, held in the wafer holding mechanism, from the inlet / outlet 31b of the drying unit 18 into the processing space 31a within the processing container 31. Next, the transport device 16 transfers the wafer W to the support pin 34 within the processing container 31. Afterward, the transport device 16 retracts the wafer holding mechanism.

[0129] Next, in the substrate processing apparatus 1, a condition detection process inside the second processing container is performed (step S106). Details of this condition detection process inside the second processing container will be described later.

[0130] Next, in the substrate processing apparatus 1, the drying unit 18 blocks the loading and unloading outlet 31b with the cover 32 (step S107).

[0131] Specifically, the drying unit 18 uses a rotating mechanism 32a to move the cover 32 from the standby position (see reference 18). Figure 3 Rotate to the open position (see reference) Figure 4 And using the direct-acting mechanism 32b, the cover 32 is moved from the open position to the blocked position (see reference). Figure 5 Therefore, the inlet / outlet 31b of the processing container 31 is blocked with the cover 32, thus sealing the processing space 31a. Afterwards, the drying unit 18 uses the lifting mechanism 51a to raise the locking member 51, setting the locking member 51 to a state where it is inserted into the second through hole 31g formed in the second protrusion 31e.

[0132] Next, in the substrate processing apparatus 1, a supercritical drying process is performed (step S108). Specifically, the drying unit 18 dries the wafer W by contacting the wafer W after the liquid film formation process with a processing fluid in a supercritical state.

[0133] Next, in the substrate processing apparatus 1, the transport device 16 removes the wafer W from the drying unit 18 (step S109). Specifically, the transport device 16 uses a wafer holding mechanism to hold the wafer W after supercritical drying and removes the held wafer W from the drying unit 18. Then, the transport device 16 places the wafer W on the transfer section 14, and the transport device 13 removes the wafer W from the transfer section 14 and returns it to the carrier C. Thus, the series of substrate processing steps for one wafer W is completed.

[0134] <Details of the condition detection and processing inside the first processing container>

[0135] Next, refer to Figure 10 To explain the details of the condition detection process inside the first processing container in step S104. Figure 10 This is a flowchart illustrating the process of detecting the condition inside the first processing container according to the embodiment. Figure 10 The condition detection process inside the first processing container shown is performed before step S105, that is, before the wafer W is moved into the processing space 31a via the loading / unloading outlet 31b.

[0136] The control unit 71 uses the lighting unit 44 to illuminate a designated area P around the loading / unloading exit 31b in the camera area (step S201).

[0137] Next, the control unit 71 uses the camera unit 41 to capture images of the camera area (step S202). Specifically, the control unit 71 captures images of the camera area, including the loading / unloading outlet 31b and the processing space 31a inside the processing container 31 exposed from the loading / unloading outlet 31b, without blocking the loading / unloading outlet 31b with the cover 32.

[0138] Next, the control unit 71 performs detection processing to detect whether there is a substrate of wafer W in the processing container 31 based on the brightness value of the image captured by the camera unit 41 (step S203).

[0139] Here, refer to Figures 11-17 This will explain the details regarding whether or not the substrate underwent testing or processing. Figure 11 This is a flowchart illustrating the process of detecting whether a substrate is present or not, performed by the control unit 71 according to the embodiment.

[0140] like Figure 11 As shown, in the substrate presence / absence detection process, firstly, the control unit 71 performs a first process (step S301) to extract the loading / unloading outlet area corresponding to the loading / unloading outlet 31b from the imaging area based on the brightness value of the imaging image captured by the imaging unit 41.

[0141] Figures 12-14 This is a diagram used to illustrate the first process involved in the implementation method. Furthermore, in Figures 12-14 The example described below illustrates the case where there is a wafer W inside the processing container 31.

[0142] For example, in the first process, such as Figure 12 As shown, the control unit 71 performs trialicization on a first region R1 within the camera area, which includes at least the upper edge UE and the lower edge LE of the loading / unloading outlet 31b, based on the brightness value of the camera image IM captured by the camera unit 41. Furthermore, in Figure 12 In the illustration, a shading line is applied to the wafer W, and a pattern fill is applied to the processing container 31.

[0143] Next, as Figure 13 As shown, the control unit 71 determines the upper edge UE and lower edge LE of the loading / unloading outlet 31b from the ternary first region R1. Figure 13 In this example, the control unit 71 sets a pair of adjacent frames in the height direction D1 (e.g., the Z-axis direction) in a plurality of columns (10 columns in this case) arranged along the width direction D2 (e.g., the X-axis direction). Then, while causing the pair of frames to descend along the height direction D1, the control unit 71 determines the positions of pixels whose average brightness value difference within the pair of frames is greater than or equal to a threshold as the upper edge UE and lower edge LE of the loading / unloading outlet 31b.

[0144] Next, as Figure 14As shown, the control unit 71 cuts out a second region R2 from the first region R1 based on the determined upper edge UE and lower edge LE of the loading / unloading outlet 31b, and performs trapezoidal correction on the second region R2 to extract the loading / unloading outlet region R3. Specifically, the control unit 71 performs trapezoidal correction on the second region R2 to correct the distortion of the second region R2 caused by the position of the camera unit 41, and extracts the loading / unloading outlet region R3. Figure 14 In the example, trapezoidal correction is used to correct the second region R2, which is distorted into a trapezoidal shape due to the position of the camera unit 41, and the rectangular loading / unloading region R3 is extracted. Thus, the first process ends.

[0145] return Figure 11 The explanation continues. Next, in the substrate presence / absence detection process, the control unit 71 calculates the height direction D1 of the loading / unloading outlet region R3 (refer to...). Figure 13 The second processing (step S302) of the distribution of brightness values.

[0146] Figure 15 This is a diagram used to illustrate the second process involved in the implementation method. Figure 15 The diagram shows the distribution of luminance values ​​LD along the height direction D1 in the loading / unloading area R3. Figure 15 In the example, the average brightness values ​​at each location along the height direction D1 of the loading / unloading area R3 are plotted on a two-dimensional coordinate plane with the location along the height direction D1 as the horizontal axis and the brightness value as the vertical axis, thereby obtaining the brightness value distribution LD. In the brightness value distribution LD along the height direction D1 of the loading / unloading area R3, the brightness value corresponding to the location of wafer W is greater than the brightness values ​​at other locations. Therefore, the location along the height direction D1 of the loading / unloading area R3 corresponding to the maximum value in the brightness value distribution LD is estimated to be the location of wafer W.

[0147] return Figure 11 The following is an explanation. Next, in the substrate presence or absence detection process, the control unit 71 performs a third process (step S303) to detect whether there is a wafer W in the processing container 31 based on the distribution LD of the brightness value along the height direction D1 of the loading and unloading area R3.

[0148] Figure 16 and Figure 17 This diagram illustrates the third process involved in the implementation method. Figure 16 The diagram shows the distribution of luminance values ​​LD when a wafer W is present within the processing container 31. Figure 17 The figure shows the distribution of luminance values ​​LD when there is no wafer W inside the processing container 31.

[0149] like Figure 16 and Figure 17As shown, when there is a wafer W in the processing container 31, the maximum value M in the brightness distribution LD becomes larger compared to when there is no wafer W in the processing container 31.

[0150] Therefore, the control unit 71 detects whether there is a wafer W in the processing container 31 based on the maximum value M in the brightness value distribution LD. Specifically, the control unit 71 compares the maximum value M in the brightness value distribution LD with a predetermined threshold, and if the threshold is exceeded, it detects that there is a wafer W in the processing container 31.

[0151] return Figure 11 Explanation. If the result of step S303 is that a wafer W is detected in the processing container 31 (step S304: "Yes"), the control unit 71 outputs an alarm (step S305) and the process ends.

[0152] On the other hand, if it is detected that there is no wafer W in the processing container 31 (step S304: "No"), the control unit 71 does not output an alarm and ends the processing.

[0153] Alternatively, if the control unit 71 detects that there is a wafer W inside the processing container 31, it may stop the execution of the supercritical drying process and output an alarm. For example, the control unit 71 may stop... Figure 9 The processing after step S105, and the output of an alarm.

[0154] As explained above, in the substrate presence / absence detection process according to the embodiment, the control unit 71 detects whether there is a wafer W in the processing container 31 based on the brightness value of the image captured by the camera unit 41.

[0155] Therefore, compared with existing technologies that compare camera images with reference images, the condition inside the processing container 31 can be detected more efficiently. That is, in the prior art, multiple reference images need to be switched according to the condition inside the processing container 31 while the camera image is compared with each reference image multiple times, which makes it difficult to efficiently detect the condition inside the processing container 31.

[0156] In this regard, during the substrate presence / absence detection process according to the embodiment, the control unit 71 detects the presence or absence of wafer W within the processing container 31 based on the brightness value of the image captured by the camera unit 41. Therefore, the presence or absence of wafer W within the processing container 31 can be detected using the brightness value of the image without switching between multiple reference images or comparing the image with each reference image. Thus, according to the embodiment, the condition within the processing container can be detected efficiently.

[0157] <Details of the condition detection and processing inside the second processing container>

[0158] Next, refer to Figure 18 To explain the details of the condition detection process inside the second processing container in step S106. Figure 18 This is a flowchart illustrating the process of condition detection processing within the second processing container according to the embodiment. Figure 18 The condition detection process inside the second processing container shown is performed after the wafer W is loaded into the processing space 31a via the loading / unloading outlet 31b and before the loading / unloading outlet 31b is blocked with the cover 32.

[0159] The control unit 71 uses the lighting unit 44 to illuminate a designated area P around the loading / unloading exit 31b in the camera area (step S401).

[0160] Next, the control unit 71 uses the camera unit 41 to capture images of the camera area (step S402). Specifically, the control unit 71 captures images of the camera area, including the loading / unloading outlet 31b and the processing space 31a inside the processing container 31 exposed from the loading / unloading outlet 31b, without blocking the loading / unloading outlet 31b with the cover 32.

[0161] Next, the control unit 71 performs a detection process based on the brightness value of the image captured by the camera unit 41 to detect whether there is a substrate in the processing container 31 where the wafer W has detached from the support pin 34 (step S403).

[0162] Here, refer to Figures 19-21 This section details the detection and treatment process for substrate detachment. Figure 19 This is a flowchart illustrating the process of detecting whether a substrate has detached, performed by the control unit 71 according to the embodiment. Figure 19 Steps S501 and S502 are the same as those described above. Figure 11 Steps S301 and S302 are identical, so their detailed descriptions are omitted here.

[0163] Following step S502, the control unit 71 performs a third process (step S503) to detect whether a wafer W has fallen off the support pin 34 within the processing container 31 based on the distribution LD of the brightness value along the height direction D1 of the loading and unloading area R3.

[0164] Figure 20 and Figure 21 This is a diagram illustrating another example of the third process involved in the implementation method. Figure 20 The image shows the distribution of brightness values ​​(LD) when the wafer W has not detached from the support pin 34 within the processing container 31. Figure 21 The distribution of luminance values ​​LD is shown when the wafer W detaches from the support pin 34 inside the processing container 31.

[0165] like Figure 20 and Figure 21 As shown, when the wafer W falls off the support pin 34 in the processing container 31, compared with the case where the wafer W does not fall off, the position of the loading and unloading area R3 corresponding to the maximum value M in the height direction D1 is close to the upper edge UE.

[0166] Therefore, the control unit 71 compares the position of the loading / unloading area R3 in the height direction D1 corresponding to the maximum value M in the distribution of brightness values ​​LD with a predetermined normal range. If it deviates from the normal range, it detects that the wafer W has fallen off the support pin 34 in the processing container 31.

[0167] return Figure 19 Explanation: If the result of step S503 is that the wafer W is detected to have fallen off the support pin 34 inside the processing container 31 (step S504: "Yes"), the control unit 71 outputs an alarm (step S505) and ends the process.

[0168] On the other hand, if it is detected that the wafer W has not fallen off the support pin 34 in the processing container 31 (step S504: "No"), the control unit 71 will not output an alarm and will end the processing.

[0169] Alternatively, if the control unit 71 detects that the wafer W has detached from the support pin 34 within the processing container 31, it may stop the execution of the supercritical drying process and output an alarm. For example, the control unit 71 may stop... Figure 9 The processing after step S107, and the output of an alarm.

[0170] (Modified Example)

[0171] Next, refer to Figures 22-30 Various variations of the implementation method will be explained. Figure 22 This is a flowchart illustrating the process of detecting whether a substrate is present or not, performed by the control unit 71 according to a variation of the embodiment 1.

[0172] like Figure 22 As shown, in the substrate presence or absence detection process, firstly, the control unit 71 performs a fourth process (step S601) to cut out a first search area from the camera area for searching the upper edge UE of the loading / unloading outlet 31b based on the brightness value of the camera image captured by the camera unit 41.

[0173] Figure 23 This is a diagram illustrating the fourth process involved in Modification 1 of the implementation method. Furthermore, in Figure 23 The following figures illustrate an example of a case where a wafer W is located within the processing container 31.

[0174] For example, in the fourth process, such as Figure 23As shown, the control unit 71 binarizes the camera area based on the brightness value of the camera image IM captured by the camera unit 41, and cuts out a first search area R4 from the binarized camera area for searching the upper edge UE of the loading / unloading outlet 31b. Furthermore, in Figure 23 In the illustration, the wafer W and the processing container 31 are shaded.

[0175] return Figure 22 The explanation continues. Next, in the substrate presence / absence detection process, the control unit 71 performs a fifth process (step S602) to search the first search area R4 that has been cut out to determine the position of the upper edge UE of the loading / unloading outlet 31b.

[0176] Figure 24 This is a diagram illustrating the fifth process involved in Modification 1 of the implementation method. Figure 24 In this example, the control unit 71 sets brightness measurement points in multiple columns (10 columns in this case) arranged along the width direction D2 (e.g., the X-axis direction). Then, while lowering the brightness measurement points along the height direction D1, the control unit 71 measures the brightness value at each brightness measurement point for each pixel, and obtains the positions of pixels whose difference in measured brightness values ​​is above a threshold. Then, the control unit 71 determines the average value of the obtained pixel positions as the position UE1 of the upper edge UE of the loading / unloading outlet 31b.

[0177] return Figure 22 The explanation is as follows. Next, in the substrate presence or absence detection process, the control unit 71 performs a sixth process (step S603) to determine the second search area for searching the upper and lower surfaces of the wafer W based on the determined position UE1 of the upper edge UE of the loading / unloading outlet 31b.

[0178] Figure 25 This diagram illustrates the sixth process involved in Modification 1 of the embodiment. The control unit 71 sets an upper edge US at a position UE1 offset downwards in the height direction D1 by a first number of pixels from the upper edge UE of the loading / unloading outlet 31b, and sets a lower edge LS at a position offset downwards in the height direction D1 by a second number of pixels, exceeding the first number of pixels, from the upper edge US. The control unit 71 determines the area between the upper edge US and the lower edge LS as the second search area R5.

[0179] return Figure 22 The explanation is as follows. Next, in the substrate presence / absence detection process, the control unit 71 performs a seventh process (step S604) to search the second search area R5 to determine the upper and lower surfaces of the wafer W.

[0180] Figure 26This diagram illustrates the seventh process involved in Modification 1 of the embodiment. The control unit 71 sets brightness measurement points in a plurality of columns (10 columns in this case) arranged along the width direction D2 (e.g., the X-axis direction). Then, while moving the brightness measurement points downwards along the height direction D1 from the top edge US of the second search area R5, the control unit 71 measures the brightness value at each brightness measurement point for each pixel, and obtains the positions of pixels whose difference in measured brightness values ​​is above a threshold. Then, the control unit 71 determines the average value of the obtained pixel positions as the position UW of the upper surface of the wafer W (refer to...). Figure 27 Furthermore, while raising the brightness measurement point from the lower edge LS of the second search area R5 along the height direction D1, the control unit 71 measures the brightness value at the brightness measurement point for each pixel, and obtains the position of the pixel whose difference between the measured brightness values ​​is above a threshold. Then, the control unit 71 determines the average value of the obtained pixel positions as the position LW of the lower surface of the wafer W (refer to...). Figure 27 Furthermore, when a brightness measurement point descending from the upper edge US of the second search area R5 overlaps with a brightness measurement point ascending from the lower edge LS of the second search area R5, the control unit 71 sets common position coordinates for the positions of the upper and lower surfaces of the wafer W. For example, the position coordinates of the midpoint of a line segment orthogonal to the upper edge US and the lower edge LS are used as the common position coordinates.

[0181] return Figure 22 The explanation continues. Next, in the substrate presence / absence detection process, the control unit 71 performs an eighth process (step S605) to detect whether there is a wafer W in the processing container 31 based on the determined position difference between the upper and lower surfaces of the wafer W.

[0182] Figure 27 This diagram illustrates the eighth process involved in Modification 1 of the embodiment. The control unit 71 determines whether the position difference d1 (=|position UW - position LW|) between the upper and lower surfaces of the wafer W is greater than 0. If the difference d1 is greater than 0, the control unit 71 detects that the wafer W is present in the processing container 31. On the other hand, if the position difference d1 between the upper and lower surfaces of the wafer W is 0, the control unit 71 detects that the wafer W is not present in the processing container 31. For example, when the upper and lower surfaces of the wafer W share common position coordinates, the difference d1 is 0, therefore the control unit 71 detects that the wafer W is not present in the processing container 31.

[0183] return Figure 22 Explanation: If the result of step S605 is that a wafer W is detected in the processing container 31 (step S606: "Yes"), the control unit 71 outputs an alarm (step S607) and the process ends.

[0184] On the other hand, if it is detected that there is no wafer W in the processing container 31 (step S606: "No"), the control unit 71 does not output an alarm and ends the processing.

[0185] Figure 28 This is a flowchart illustrating the process of detecting whether a substrate has detached, performed by the control unit 71 in Modified Example 2 of the embodiment. Figure 28 Steps S701 to S704 are the same as those described above. Figure 22 The steps S601 to S604 are the same, so their detailed descriptions are omitted here.

[0186] Following step S704, in the substrate detachment detection process, the control unit 71 calculates the average value of the positions of the upper and lower surfaces of the wafer W as the ninth process for determining the position of the wafer W (step S705).

[0187] Figure 29 This is a diagram illustrating the ninth process involved in Modification 2 of the embodiment. The control unit 71 calculates the average value of the position UW of the upper surface of the wafer W and the position LW of the lower surface of the wafer W as the position WP of the wafer W.

[0188] return Figure 28 The explanation continues. Next, in the substrate detachment detection process, the control unit 71 performs a tenth process (step S706) to calculate the distance from the position UE1 of the upper edge UE of the loading / unloading outlet 31b to the position WP of the wafer W.

[0189] Figure 30 This is a diagram illustrating the tenth process involved in Modification 2 of the embodiment. The control unit 71 calculates the distance d2 from the position UE1 of the upper edge UE of the loading / unloading outlet 31b to the position WP of the wafer W.

[0190] return Figure 28 The following is an explanation. Next, in the substrate presence / absence detection process, the control unit 71 performs an eleventh process (step S707) to detect whether a wafer W has detached from the support pin 34 within the processing container 31 based on a calculated distance d2. Specifically, the control unit 71 compares the distance d2 with a predetermined normal range, and if it deviates from the normal range, it detects that the wafer W has detached from the support pin 34 within the processing container 31.

[0191] If the result of step S707 is that the wafer W is detected to have fallen off the support pin 34 inside the processing container 31 (step S708: "Yes"), the control unit 71 outputs an alarm (step S709) and the processing ends.

[0192] On the other hand, if it is detected that the wafer W has not fallen off the support pin 34 in the processing container 31 (step S708: "No"), the control unit 71 will not output an alarm and will end the processing.

[0193] As described above, the substrate processing apparatus according to the embodiment (for example, substrate processing apparatus 1) includes a processing container (for example, processing container 31), an imaging unit (for example, imaging unit 41), and a control unit (for example, control unit 71). The processing container has a processing space (for example, processing space 31a) capable of accommodating a substrate (for example, wafer W) and a loading / unloading outlet (for example, loading / unloading outlet 31b) for loading and unloading the substrate relative to the processing space. The imaging unit captures images of an imaging area including the loading / unloading outlet and the processing space within the processing container exposed from the loading / unloading outlet. The control unit detects the state of the substrate within the processing container based on the brightness values ​​of the images captured by the imaging unit.

[0194] Therefore, the substrate processing apparatus according to the embodiment can efficiently detect the condition inside the processing container.

[0195] <Other>

[0196] In the above embodiment, an example was described where the camera unit 41 is positioned so as not to overlap with the transport path R of the wafer W when viewed from above. However, the camera unit 41 can also be configured to move between a camera position on the transport path R of the wafer W and a retraction position that deviates from the transport path R of the wafer W. In this case, before the wafer W is loaded into the processing space 31a via the loading / unloading outlet 31b, the camera unit 41 moves from the retraction position to the camera position and takes an image of the camera area at the camera position.

[0197] Alternatively, the camera unit 41 may be installed on the conveying device 16. In this case, the conveying device 16 first moves the wafer W from the inlet / outlet 31b of the drying unit 18 into the processing space 31a within the processing container 31. Before blocking the inlet / outlet with the cover 32, the camera unit 41 installed on the conveying device 16 takes pictures of the imaging area.

[0198] It should be considered that the embodiments disclosed herein are illustrative in all respects and not restrictive. In fact, the above-described embodiments can be implemented in various ways. Furthermore, the above-described embodiments can be omitted, substituted, or modified in various ways without departing from the appended claims and their spirit.

[0199] Explanation of reference numerals in the attached figures

[0200] 1: Substrate processing device

[0201] 7: Control device

[0202] 18: Drying Unit

[0203] 31: Handling Containers

[0204] 31a: Processing space

[0205] 31b: Moving in and out

[0206] 31d: First protrusion

[0207] 31e: Second protrusion

[0208] 31f: First through hole

[0209] 31g: Second insertion hole

[0210] 32: Cover

[0211] 32a: Rotating mechanism

[0212] 32b: Direct-acting mechanism

[0213] 34: Support pin

[0214] 41: Camera Department

[0215] 42: Shielding panel

[0216] 42a: Opening

[0217] 42b: Through hole

[0218] 42c: Transparent component

[0219] 42d: Through hole

[0220] 43: Partition wall

[0221] 44: Lighting Department

[0222] 51: Locking component

[0223] 51a: Lifting mechanism

[0224] 52: Exhaust pipe

[0225] 52a: Through hole

[0226] 52b: Through hole

[0227] 52c: Transparent component

[0228] 53: Camera Department

[0229] 71: Control Department

[0230] 72: Storage Department

[0231] 321: Sealing component

[0232] 441: Fixing plate

[0233] 442: Light source

[0234] 443: Light diffusion section

[0235] W: Wafer

Claims

1. A substrate processing apparatus comprising: A processing container having a processing space capable of accommodating a substrate and a loading / unloading outlet for moving the substrate into and out of the processing space. A camera unit that captures images of a camera area including the loading / unloading outlet and the processing space within the processing container exposed from the loading / unloading outlet; and The control unit detects the state of the substrate inside the processing container based on the brightness value of the image captured by the camera unit.

2. The substrate processing apparatus according to claim 1, wherein, The control unit performs the following processing: The first process involves extracting the loading / unloading outlet area corresponding to the loading / unloading outlet from the camera area based on the brightness value of the camera image; The second process involves determining the distribution of brightness values ​​along the height direction in the extracted loading and unloading areas; as well as The third process involves detecting the state of the substrate within the processing container based on the distribution of brightness values ​​along the height direction in the loading and unloading areas.

3. The substrate processing apparatus according to claim 2, wherein, In the third process, the control unit detects whether the substrate is present in the processing container, which is the state of the substrate, based on the maximum value of the distribution of brightness values ​​along the height direction in the loading and unloading areas.

4. The substrate processing apparatus according to claim 1, wherein, Before the substrate is moved into the processing space via the loading / unloading outlet, the control unit detects whether the substrate is present in the processing container, which is the state of the substrate, based on the brightness value of the image captured by the camera unit.

5. The substrate processing apparatus according to claim 2, wherein, The processing container has a support pin disposed on the bottom surface of the processing space for supporting the substrate. In the third process, the control unit detects whether the substrate has detached from the support pin within the processing container, which is the state of the substrate, based on the position of the loading / unloading area in the height direction corresponding to the maximum value in the distribution of brightness values ​​along the height direction of the loading / unloading area.

6. The substrate processing apparatus according to claim 5, wherein, It also includes a cover configured to block the inlet and outlet ports. After the substrate is loaded into the processing space via the loading / unloading outlet and before the loading / unloading outlet is blocked by the cover, the control unit detects whether the substrate has detached from the support pin in the processing container, which is the state of the substrate, based on the brightness value of the image captured by the camera unit.

7. The substrate processing apparatus according to claim 2, wherein, In the first process, the control unit ternary-values ​​a first region in the camera area, which includes at least the upper and lower edges of the loading and unloading outlet, based on the brightness value of the camera image. The control unit then determines the upper and lower edges of the loading and unloading outlet from the ternary-valued first region, cuts out a second region from the first region based on the determined upper and lower edges of the loading and unloading outlet, and performs trapezoidal correction on the second region to extract the loading and unloading outlet region.

8. The substrate processing apparatus according to claim 7, wherein, The camera unit is positioned so as not to overlap with the transport path of the substrate being transported relative to the processing space via the inlet and outlet ports when viewed from above. The control unit performs trapezoidal correction on the second region to correct the distortion in the second region caused by the position of the camera unit, in order to extract the loading / unloading area.

9. The substrate processing apparatus according to claim 1, wherein, The camera unit is positioned so as not to overlap with the transport path of the substrate being transported relative to the processing space via the loading / unloading outlet when viewed from above.

10. The substrate processing apparatus according to claim 9, wherein, The processing container has: A first protrusion protrudes from the lower part of the loading / unloading outlet towards the unloading direction relative to the processing space for unloading the substrate, relative to the loading / unloading outlet. The second protrusion protrudes from the upper part of the loading / unloading outlet towards the unloading direction relative to the processing space for unloading the substrate, relative to the loading / unloading outlet. as well as A shielding plate that covers the space between the first protrusion and the second protrusion. The shielding plate has an opening at a position opposite to the loading / unloading outlet, separated by the space, for the substrate to pass through. The camera unit is disposed on the outer surface of the shielding plate that does not face the space and is adjacent to the opening along the width direction of the transport path of the substrate.

11. The substrate processing apparatus according to claim 10, wherein, The shielding plate has the following characteristics: A through hole is formed at a position adjacent to the opening along the width direction of the transport path of the substrate; as well as A transparent component that blocks the through hole. The camera unit captures images of the camera area through the transparent component from the outer surface of the shielding plate.

12. The substrate processing apparatus according to claim 10, wherein, The shielding plate has a partition wall disposed on the outer periphery of the outer surface of the shielding plate surrounding the opening, thereby isolating the opening from the camera unit.

13. The substrate processing apparatus according to claim 10, wherein, The system includes a lighting unit that illuminates a designated area around at least the loading / unloading exits in the camera area.

14. The substrate processing apparatus according to claim 13, wherein, The shielding plate has a plurality of through holes arranged along the width direction of the conveying path of the substrate, forming at positions opposite to a predetermined area around the inlet and outlet of the shielding plate. The lighting unit has: A fixing plate that faces the plurality of through holes on the shielding plate; The light source is fixed on the mounting plate; as well as A light diffusion section is disposed between the fixing plate and the shielding plate to diffuse light emitted from the light source in the width direction of the transport path of the substrate, and to allow a portion of the diffused light to irradiate a predetermined area around the transport inlet and outlet through the plurality of through holes.

15. A method for detecting the condition inside a container, comprising the following steps: A substrate processing apparatus includes a processing container having a processing space capable of accommodating a substrate and a loading / unloading outlet for loading and unloading the substrate relative to the processing space; and the imaging unit for capturing images of the imaging area including the loading / unloading outlet and the processing space exposed from the loading / unloading outlet within the processing container; and the imaging unit for capturing images of the imaging area including the loading / unloading outlet and the processing space within the processing container. The state of the substrate inside the processing container is detected based on the brightness value of the image captured by the camera unit.

Images