A hotspot-resistant micro-channel heat sink based on a serpentine flow channel and honeycomb needle fin hybrid and a processing method thereof

Abstract

This invention discloses a microchannel heat sink with hot spot resistance based on a hybrid of serpentine flow channels and honeycomb needle fins, and its processing method, relating to the field of thermal management technology for electronic devices. It includes a microchannel cover plate and a microchannel base plate, with the cover plate and base plate sealed together. A composite flow channel structure is provided on the base plate, divided into a background heat exchange zone and a high heat flux dissipation zone along the fluid flow direction. A serpentine flow channel is arranged in the background heat exchange zone. This invention integrates the serpentine flow channel and honeycomb needle fin array onto the same microchannel base plate, thereby enhancing heat exchange in the background area under low flow resistance and achieving efficient suppression of local hot spots. The synergistic effect of the two allows the heat sink to control the temperature of the hot spot area within a reliable range under extreme non-uniform heat loads, while maintaining overall temperature uniformity and reducing pumping power consumption; ensuring the integrated molding precision and long-term operational reliability of the complex microstructure.

Description

Technical Field

[0001] This invention relates to the field of thermal management technology for electronic devices, and in particular to an anti-hot spot microchannel heat sink based on a hybrid of serpentine flow channels and honeycomb needle fins, and its processing method. Background Technology

[0002] With the rapid development of 5G mobile communication, high-performance computing, artificial intelligence, and power electronics, the integration and power density of electronic components continue to rise. Chip heat flux density has exceeded the level of hundreds of watts per square centimeter. More seriously, the heat flux distribution generated by modern high-performance chips exhibits significant non-uniformity during operation—local functional modules form "hot spots" with high heat flux density, reaching several times or even an order of magnitude higher than the background area, while the rest of the chip is at a relatively low heat flux density level. This non-uniform heat distribution pattern poses a severe challenge to thermal management technology: if the heat in the hot spots cannot be dissipated effectively and in a timely manner, it will lead to a sharp increase in the local temperature of the device, causing thermal stress mismatch, performance drift, decreased reliability, and even thermal failure, severely restricting the improvement of electronic device performance and miniaturization. Microchannel heat sinks, due to their compact structure, high heat transfer coefficient, and strong heat dissipation capacity per unit volume, have become the mainstream technology solution for heat dissipation of high-power electronic devices. First, a typical microchannel heat sink consists of a substrate, a cover plate, and microscale flow channels arranged on the substrate. When the cooling fluid flows through the microchannel, it removes heat through convection heat transfer. Traditional microchannel heat sinks mostly adopt a straight, through-flow rectangular or trapezoidal flow channel structure, and the fluid is usually in a laminar flow state within the channel. To meet the heat dissipation requirements of hot spots, it is usually necessary to significantly increase the overall flow rate to enhance local heat transfer. However, this will lead to overcooling of the background area, causing unnecessary heat loss. The increase in flow rate will significantly increase pumping power consumption and reduce the system energy efficiency ratio, which is contrary to the development direction of green energy saving. Some studies have attempted to introduce discrete needle fins or columnar turbulence elements into the microchannel to enhance local heat transfer by disrupting the development of the thermal boundary layer and inducing flow separation. However, the conventional needle fin structure has a relatively simple disturbance form to the fluid, and it is easy to form a stable backflow zone behind the needle fin, resulting in a large flow resistance loss. Moreover, it is difficult to achieve an optimal balance between heat transfer area and flow resistance in a limited space, which restricts its application in compact heat sinks.

[0003] However, current common solutions have many drawbacks, including: existing microchannel heat sink technology suffers from insufficient heat transfer efficiency in the background area due to the continuous thickening of the thermal boundary layer and weak lateral mixing ability of the fluid in straight microchannels; the practice of forcing an increase in overall flow rate to meet the heat dissipation needs of local hot spots will lead to overcooling of the background area and a surge in pumping power consumption; and some improved solutions that introduce discrete needle fins are difficult to achieve an optimal balance between heat transfer enhancement and flow resistance control in a limited space due to the single form of turbulence and the tendency to form a backflow zone, ultimately restricting the synergistic improvement of heat dissipation performance and system energy efficiency. Summary of the Invention

[0004] The purpose of this section is to outline some aspects of embodiments of the present invention and to briefly describe some preferred embodiments. Simplifications or omissions may be made in this section, as well as in the abstract and title of this application, to avoid obscuring the purpose of these documents; however, such simplifications or omissions should not be construed as limiting the scope of the invention.

[0005] In view of the problems existing in the current anti-hot spot microchannel heat sink based on a mixture of serpentine flow channels and honeycomb needle fins and its processing method, the present invention is proposed.

[0006] Therefore, the purpose of this invention is to provide a hot-spot-resistant microchannel heat sink based on a hybrid of serpentine flow channels and honeycomb needle fins, and its processing method. This invention is applicable to solving the problems of insufficient heat transfer efficiency in the background area caused by the continuous thickening of the thermal boundary layer and weak lateral mixing ability of the fluid in existing microchannel heat sink technologies; the forced increase of the overall flow rate to meet the heat dissipation needs of local hot spots, which leads to overcooling of the background area and a sharp increase in pumping power consumption; and the improvement scheme that partially introduces discrete needle fins, due to the single turbulence form and the easy formation of backflow zone, makes it difficult to achieve an optimal balance between heat transfer enhancement and flow resistance control in a limited space, ultimately restricting the synergistic improvement of heat dissipation performance and system energy efficiency.

[0007] To solve the above-mentioned technical problems, the present invention provides the following technical solution: In a first aspect, embodiments of the present invention provide a hot-spot-resistant microchannel heat sink based on a hybrid of serpentine flow channels and honeycomb needle fins, comprising a microchannel cover plate (1) and a microchannel base plate (2), wherein the microchannel cover plate (1) and the microchannel base plate (2) are sealed together, characterized in that: a composite flow channel structure is provided on the microchannel base plate (2), the composite flow channel structure being divided into a background heat exchange zone and a high heat flux heat dissipation zone along the fluid flow direction; a serpentine flow channel (3) is arranged in the background heat exchange zone, the serpentine flow channel (3) extending in a periodic wave shape along the fluid flow direction; and a honeycomb needle fin array (5) is arranged in the high heat flux heat dissipation zone, the honeycomb needle fin array (5) being composed of several columnar needle fins arranged in a topological pattern.

[0008] As a preferred embodiment of the anti-hot spot microchannel heat sink based on a hybrid of serpentine flow channel and honeycomb needle fins described in this invention, wherein: the centerline trajectory of the serpentine flow channel (3) satisfies a sine curve function: ; in, Let be the coordinates along the direction of fluid flow. The coordinates are perpendicular to the direction of fluid flow. For amplitude, ω is the angular frequency.

[0009] As a preferred embodiment of the anti-hotspot microchannel heat sink based on a hybrid of serpentine flow channels and honeycomb needle fins described in this invention, wherein: the amplitude The angular frequency is 0.125 mm. For π, a complete oscillation cycle of the serpentine channel (3) is 2 mm.

[0010] As a preferred embodiment of the anti-hot spot microchannel heat sink based on the combination of serpentine flow channel and honeycomb needle fins described in this invention, wherein: the cross-sectional width of the serpentine flow channel (3) is 0.25 mm and the depth is 0.5 mm.

[0011] As a preferred embodiment of the anti-hot spot microchannel heat sink based on the combination of serpentine flow channel and honeycomb needle fins described in this invention, wherein: the honeycomb needle fin array (5) is located at the geometric center of the microchannel base plate (2), the columnar needle fins are arranged in a hexagonal topology, and the distance between two adjacent columnar needle fins is 0.24 mm.

[0012] Secondly, in order to further solve the above-mentioned technical problems, the present invention provides a processing method for a hot spot-resistant microchannel heat sink based on a mixture of serpentine flow channels and honeycomb needle fins. The method is characterized by the following steps: Step 1: Establish a three-dimensional model of the microchannel heat sink and perform layer-by-layer slicing; Step 2: Use powder bed fusion additive manufacturing technology, use metal powder as raw material, and stack it layer by layer to integrally form the serpentine flow channel (3) and honeycomb needle fin array (5) on the microchannel base plate (2); Step 3: Perform powder cleaning treatment on the formed microchannel base plate (2) to remove unfused powder in the flow channels and needle fin gaps; Step 4: Bond and encapsulate the microchannel cover plate (1) and the microchannel base plate (2).

[0013] As a preferred embodiment of the anti-hot spot microchannel heat sink and its processing method based on the hybrid of serpentine flow channel and honeycomb needle fin described in this invention, wherein: in step two, the layer thickness is set to 20-50μm; in step three, high-pressure gas backflushing or ultrasonic cleaning technology is used for powder removal.

[0014] As a preferred embodiment of the anti-hot spot microchannel heat sink and its processing method based on the serpentine flow channel and honeycomb needle fin hybrid described in this invention, the upper surface of the microchannel base plate (2) and the lower surface of the microchannel cover plate (1) are ground and polished before the bonding and packaging in step four.

[0015] As a preferred embodiment of the anti-hot spot microchannel heat sink and its processing method based on the serpentine flow channel and honeycomb needle fins of the present invention, in step three, after the powder cleaning process is completed, a microscope is used to check whether there is any unfused powder remaining in the gap between the serpentine flow channel (3) and the honeycomb needle fin array (5).

[0016] As a preferred embodiment of the anti-hot spot microchannel heat sink and its processing method based on the hybrid of serpentine flow channel and honeycomb needle fins described in this invention, after the bonding and encapsulation in step four, the microchannel heat sink is further subjected to a hydraulic test to verify its sealing performance.

[0017] Thirdly, embodiments of the present invention provide a computer device, including a memory and a processor, wherein the memory stores a computer program, wherein: when the computer program is executed by the processor, it implements any step of the anti-hot spot microchannel heat sink and its processing method based on a hybrid of serpentine flow channel and honeycomb needle fins as described in the first aspect of the present invention.

[0018] Fourthly, embodiments of the present invention provide a computer-readable storage medium having a computer program stored thereon, wherein: when the computer program is executed by a processor, it implements any step of the anti-hot spot microchannel heat sink and its processing method based on a hybrid of serpentine flow channel and honeycomb needle fins as described in the first aspect of the present invention.

[0019] The beneficial effects of this invention are as follows: By integrating a serpentine flow channel and a honeycomb needle-fin array onto the same microchannel substrate, this invention forms a composite flow channel structure consisting of a background heat exchange zone and a high heat flux heat dissipation zone. The serpentine flow channel utilizes periodic wavy extension to induce secondary fluid flow, continuously disrupting the thermal boundary layer and thus enhancing heat exchange in the background area under low flow resistance. The honeycomb needle-fin array, through its high-density micro-pillar structure arranged in a hexagonal topology, significantly increases the heat exchange area and induces multiple micro-jet impacts, achieving efficient suppression of local hot spots. The synergistic effect of the two allows the heat sink to control the temperature of the hot spot area within a reliable range under extreme non-uniform heat loads, while maintaining overall temperature uniformity and reducing pumping power consumption. Simultaneously, combined with powder bed fusion additive manufacturing processes and subsequent powder cleaning, testing, and packaging steps, the integrated molding precision and long-term operational reliability of the complex microstructure are ensured. Attached Figure Description

[0020] To more clearly illustrate the technical solutions of the embodiments of the present invention, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort. Wherein: Figure 1 This is a schematic diagram of the overall structure of the microchannel heat sink of the present invention in Example 1.

[0021] Figure 2 This is a schematic diagram of the microchannel substrate in Example 1.

[0022] Figure 3This is the overall temperature cloud map and the base plate temperature cloud map of the present invention under extreme non-uniform heat load.

[0023] Figure 4 This is a temperature cloud map of the fluid domain along the center of the Y-axis and a streamline distribution diagram of the honeycomb needle fins.

[0024] Figure 5 This is a pressure distribution cloud map of the fluid domain in this invention.

[0025] Figure 6 This is a field-cooperative angle cloud map of the fluid domain of this invention. Detailed Implementation

[0026] To make the above-mentioned objects, features and advantages of the present invention more apparent and understandable, the specific embodiments of the present invention will be described in detail below with reference to the accompanying drawings.

[0027] Many specific details are set forth in the following description in order to provide a full understanding of the invention. However, the invention may also be practiced in other ways different from those described herein, and those skilled in the art can make similar extensions without departing from the spirit of the invention. Therefore, the invention is not limited to the specific embodiments disclosed below.

[0028] Secondly, the term "one embodiment" or "embodiment" as used herein refers to a specific feature, structure, or characteristic that may be included in at least one implementation of the present invention. The phrase "in one embodiment" appearing in different places in this specification does not necessarily refer to the same embodiment, nor is it a single or selective embodiment that is mutually exclusive with other embodiments.

[0029] Example 1 Reference Figure 1 and Figure 2 This is the first embodiment of the present invention, which provides a hot-spot-resistant microchannel heat sink based on a hybrid of serpentine flow channels and honeycomb needle fins, including the following: The microchannel cover plate (1) and the microchannel base plate (2) are sealed together, characterized in that: The microchannel base plate (2) is provided with a composite flow channel structure, which is divided into a background heat exchange zone and a high heat flux heat dissipation zone along the fluid flow direction. The background heat exchange zone is arranged with a serpentine flow channel (3), which extends in a periodic wave shape along the fluid flow direction; The high heat flux heat dissipation area is equipped with a honeycomb needle fin array (5), which consists of several columnar needle fins arranged in a topological pattern.

[0030] Furthermore, the centerline trajectory of the serpentine flow channel (3) satisfies a sine curve function: ; in, Let be the coordinates along the direction of fluid flow. The coordinates are perpendicular to the direction of fluid flow. For amplitude, ω is the angular frequency.

[0031] Furthermore, amplitude 0.125 mm, angular frequency For π, a complete oscillation cycle of the serpentine channel (3) is 2 mm.

[0032] Specifically, the cross-sectional width of the serpentine channel (3) is 0.25 mm and the depth is 0.5 mm.

[0033] Preferably, the honeycomb needle fin array (5) is located at the geometric center of the microchannel base plate (2), and the columnar needle fins are arranged in a hexagonal topology, with a spacing of 0.24 mm between two adjacent columnar needle fins.

[0034] Specifically, the microchannel cover plate (1) and the microchannel base plate (2) are made of metal materials with high thermal conductivity, such as oxygen-free copper (thermal conductivity of about 398 W / (m·K)), aluminum alloy (such as AlSi10Mg, thermal conductivity of about 150-180 W / (m·K)) or nickel-based alloy. The specific material is selected according to the heat dissipation requirements and the compatibility with the additive manufacturing process. When oxygen-free copper is used, the best heat dissipation performance can be obtained, but the influence of its reflectivity on laser absorption needs to be considered; when aluminum alloy is used, it has the advantages of lightweight and cost.

[0035] Example 2, an embodiment of the present invention, provides a processing method for an anti-hot spot microchannel heat sink based on a hybrid of serpentine flow channels and honeycomb needle fins, comprising the following steps: Step 1: Establish a three-dimensional model of the microchannel heat sink and perform layered slicing. Step 2: Using powder bed fusion additive manufacturing technology, metal powder is used as raw material and is stacked layer by layer to form a serpentine flow channel (3) and a honeycomb needle fin array (5) on the microchannel base plate (2). Step 3: Perform a powder cleaning process on the molded microchannel base plate (2) to remove unfused powder from the flow channels and needle fin gaps; Step 4: Bond and encapsulate the microchannel cover plate (1) and the microchannel base plate (2).

[0036] Furthermore, in step two, the layer thickness is set to 20-50 μm; In step three, high-pressure gas backflushing or ultrasonic cleaning technology is used to remove the powder.

[0037] Preferably, before the bonding and packaging in step four, the upper surface of the microchannel substrate (2) and the lower surface of the microchannel cover plate (1) are ground and polished.

[0038] Specifically, in step three, after the powder cleaning process is completed, a microscope is used to check whether there is any unfused powder remaining in the gaps between the serpentine flow channel (3) and the honeycomb needle fin array (5).

[0039] Specifically, after the bonding and encapsulation in step four, a hydraulic test is performed on the microchannel heat sink to verify its sealing performance.

[0040] It should be noted that the powder bed melting (PBF) technology is adopted, and the specific process parameters are adjusted according to the selected equipment and materials. Taking copper alloy as an example, the laser power can be selected as 200-400W, the scanning speed is 600-1200mm / s, the scanning distance is 0.08-0.12mm, the layer thickness is 20-50μm, and the powder layer thickness is consistent with the set layer thickness. The molding chamber is filled with high-purity argon gas for protection, and the oxygen content is controlled below 100 ppm to prevent metal oxidation. The above parameters can ensure the accurate molding of the continuous curved surface of the serpentine flow channel (3) and the fine columnar structure of the honeycomb needle fin array (5), and the dimensional tolerance is controlled within ±0.02mm.

[0041] Specifically, in step three, the powder removal process is carried out using the following combination of methods: First, compressed air (pressure 0.5-0.8MPa) is used to backflush from the inlet of the flow channel to remove most of the loose powder; then, the flow channel is immersed in anhydrous ethanol and cleaned for 10-15 minutes using an ultrasonic cleaner (frequency 40 kHz, power 200 W) to ensure that the residual powder in the needle-fin gap (0.24 mm) is fully removed; finally, the flow channel and needle-fin gap are observed with a microscope (magnification 50× or higher) to confirm that there is no powder residue before proceeding to the next step. If local residue is found, ultrasonic cleaning can be repeated or a micro-probe can be used to assist in cleaning.

[0042] Furthermore, before step four, the upper surface of the microchannel base plate (2) and the lower surface of the microchannel cover plate (1) are precision ground and polished to ensure that the surface roughness Ra≤0.4μm and the flatness ≤0.01mm, so as to ensure that the bonding interface is tightly fitted and to avoid leakage.

[0043] Specifically, in step four, bonding and encapsulation can be performed using high-temperature resistant structural adhesive (such as epoxy resin, with a working temperature range of -55℃ to 200℃) or vacuum brazing. If structural adhesive is used, it needs to be evenly applied to the joint surface between the cover plate and the base plate, and a pressure of 0.1-0.2 MPa should be applied. It should then be cured at 120℃ for 2 hours. If brazing is used, the temperature needs to be raised to above the melting point of the brazing filler metal (such as silver-based brazing filler metal, approximately 650℃) in a vacuum furnace and held for 10-20 minutes. After encapsulation, a hydraulic test is performed: deionized water is introduced into the heat sink, and the pressure is gradually increased to 1.5 times the design working pressure (e.g., 1.5 MPa). The pressure is held for 5 minutes, and any pressure drop or leakage is observed to ensure reliable sealing performance.

[0044] It should be noted that the structural parameters of this embodiment (serpentine flow channel amplitude 0.125 mm, period 2 mm, honeycomb needle fin spacing 0.24 mm, etc.) were obtained through multi-objective optimization design. Computational fluid dynamics (CFD) was used to minimize hotspot temperature and overall pressure drop. Parameter scanning was performed under a Reynolds number of 800, and the above parameter combination was ultimately selected. Figure 3-6 It was shown in 2×10 6 W / m 2 Hotspot heat flow and 5×10 5 W / m 2 Temperature, pressure, and field coordination angle distribution under background heat flux are shown. The results indicate that the average hotspot temperature is only 316.67 K, the overall pressure drop is 2491 Pa, and the field coordination angle approaches 0 in the honeycomb region. 。 This verifies the effectiveness of the design. Those skilled in the art can adjust the parameters according to the actual heat load and still achieve similar results.

[0045] In summary, this invention integrates a serpentine flow channel and a honeycomb needle-fin array onto the same microchannel substrate, forming a composite flow channel structure that integrates a background heat exchange zone and a high heat flux heat dissipation zone. The serpentine flow channel utilizes periodic wavy extension to induce secondary fluid flow, continuously disrupting the thermal boundary layer and thus enhancing heat exchange in the background region under low flow resistance. The honeycomb needle-fin array, through its high-density micro-pillar structure arranged in a hexagonal topology, significantly increases the heat exchange area and induces multiple micro-jet impacts, achieving efficient suppression of local hot spots. The synergistic effect of the two allows the heat sink to control the temperature of the hot spot area within a reliable range under extreme non-uniform heat loads, while maintaining overall temperature uniformity and reducing pumping power consumption. Simultaneously, combined with powder bed fusion additive manufacturing processes and subsequent powder cleaning, testing, and packaging steps, the integrated molding precision and long-term operational reliability of the complex microstructure are ensured.

[0046] Example 3 is an embodiment of the present invention, which differs from the previous embodiment in that: If a function is implemented as a software functional unit and sold or used as an independent product, it can be stored in a computer-readable storage medium. Based on this understanding, the technical solution of this invention, or the part that contributes to the prior art, or a part of the technical solution, can be embodied in the form of a software product. This computer software product is stored in a storage medium and includes several instructions to cause a computer device (which may be a personal computer, server, or network device, etc.) to execute all or part of the steps of the methods of the various embodiments of this invention. The aforementioned storage medium includes various media capable of storing program code, such as USB flash drives, portable hard drives, read-only memory (ROM), random access memory (RAM), magnetic disks, or optical disks.

[0047] The logic and / or steps represented in the flowchart or otherwise described herein, for example, can be considered as a sequenced list of executable instructions for implementing logical functions, and can be embodied in any computer-readable medium for use by, or in conjunction with, an instruction execution system, apparatus, or device (such as a computer-based system, a processor-including system, or other system that can fetch and execute instructions from, an instruction execution system, apparatus, or device). For the purposes of this specification, "computer-readable medium" can be any means that can contain, store, communicate, propagate, or transmit programs for use by, or in conjunction with, an instruction execution system, apparatus, or device.

[0048] More specific examples (a non-exhaustive list) of computer-readable media include: electrical connections (electronic devices) having one or more wires, portable computer disk drives (magnetic devices), random access memory (RAM), read-only memory (ROM), erasable and editable read-only memory (EPROM or flash memory), fiber optic devices, and portable optical disc read-only memory (CDROM). Furthermore, computer-readable media can even be paper or other suitable media on which programs can be printed, because programs can be obtained electronically, for example, by optically scanning the paper or other media, followed by editing, interpreting, or otherwise processing as necessary, and then stored in computer memory.

[0049] It should be understood that various parts of the present invention can be implemented in hardware, software, firmware, or a combination thereof. In the above embodiments, multiple steps or methods can be implemented in software or firmware stored in memory and executed by a suitable instruction execution system. For example, if implemented in hardware, as in another embodiment, it can be implemented using any one or a combination of the following techniques known in the art: discrete logic circuits having logic gates for implementing logical functions on data signals, application-specific integrated circuits (ASICs) having suitable combinational logic gates, programmable gate arrays (PGAs), field-programmable gate arrays (FPGAs), etc.

[0050] It should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention and are not intended to limit it. Although the present invention has been described in detail with reference to preferred embodiments, those skilled in the art should understand that modifications or equivalent substitutions can be made to the technical solutions of the present invention without departing from the spirit and scope of the technical solutions of the present invention, and all such modifications or substitutions should be covered within the scope of the claims of the present invention.

Claims

1. A hot-spot-resistant microchannel heat sink based on a hybrid of serpentine flow channels and honeycomb needle fins, comprising: A microchannel cover plate (1) and a microchannel base plate (2), wherein the microchannel cover plate (1) and the microchannel base plate (2) are sealed together, characterized in that: The microchannel base plate (2) is provided with a composite flow channel structure, which is divided into a background heat exchange zone and a high heat flux heat dissipation zone along the fluid flow direction. The background heat exchange zone is provided with a serpentine flow channel (3), which extends in a periodic wave shape along the fluid flow direction. The high heat flux heat dissipation area is provided with a honeycomb needle fin array (5), which is composed of several columnar needle fins arranged in a topological pattern.

2. The anti-hot spot microchannel heat sink based on a hybrid of serpentine flow channels and honeycomb needle fins as described in claim 1, characterized in that: The centerline trajectory of the serpentine flow channel (3) satisfies a sine curve function: ； in, Let be the coordinates along the direction of fluid flow. The coordinates are perpendicular to the direction of fluid flow. For amplitude, ω is the angular frequency.

3. The anti-hot spot microchannel heat sink based on a hybrid of serpentine flow channels and honeycomb needle fins as described in claim 2, characterized in that: The amplitude The angular frequency is 0.125 mm. For π, a complete oscillation cycle of the serpentine channel (3) is 2 mm.

4. The anti-hot-point microchannel heat sink based on a hybrid of serpentine flow channels and honeycomb needle fins as described in claim 1, characterized in that: The cross-sectional width of the serpentine channel (3) is 0.25 mm and the depth is 0.5 mm.

5. The anti-hot-point microchannel heat sink based on a hybrid of serpentine flow channels and honeycomb needle fins as described in claim 1, characterized in that: The honeycomb needle fin array (5) is located at the geometric center of the microchannel base plate (2), and the columnar needle fins are arranged in a hexagonal topology, with a spacing of 0.24 mm between two adjacent columnar needle fins.

6. A processing method for an anti-hot spot microchannel heat sink based on a hybrid of serpentine flow channels and honeycomb needle fins as described in any one of claims 1 to 5, characterized in that, Includes the following steps: Step 1: Establish a three-dimensional model of the microchannel heat sink and perform layered slicing. Step 2: Using powder bed fusion additive manufacturing technology, metal powder is used as raw material and is stacked layer by layer to form the serpentine flow channel (3) and honeycomb needle fin array (5) integrally formed on the microchannel base plate (2). Step 3: Perform a powder cleaning process on the molded microchannel base plate (2) to remove unfused powder from the flow channels and needle fin gaps; Step 4: Bond and encapsulate the microchannel cover plate (1) and the microchannel base plate (2).

7. The anti-hot spot microchannel heat sink based on a hybrid of serpentine flow channel and honeycomb needle fins as described in claim 6, characterized in that: In step two, the layer thickness is set to 20-50 μm; In step three, high-pressure gas backflushing or ultrasonic cleaning technology is used to remove the powder.

8. The anti-hot spot microchannel heat sink based on a hybrid of serpentine flow channel and honeycomb needle fins as described in claim 6, characterized in that: Before the bonding and packaging in step four, the upper surface of the microchannel substrate (2) and the lower surface of the microchannel cover plate (1) are ground and polished.

9. The anti-hot spot microchannel heat sink based on a hybrid of serpentine flow channel and honeycomb needle fins as described in claim 6, characterized in that: In step three, after the powder cleaning process is completed, a microscope is used to check whether there is any unfused powder remaining in the gaps between the serpentine flow channel (3) and the honeycomb needle fin array (5).

10. The anti-hot spot microchannel heat sink based on a hybrid of serpentine flow channel and honeycomb needle fins as described in claim 6, characterized in that: Following the bonding and encapsulation in step four, a hydraulic test is performed on the microchannel heat sink to verify its sealing performance.

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