Badge heat transfer mold assembly, mold, vacuum heat transfer machine and method

Abstract

The application belongs to the technical field of vacuum heat transfer printing equipment, and particularly relates to a badge heat transfer printing mold assembly, a mold, a vacuum heat transfer printing machine and a method. The badge heat transfer printing mold assembly is loaded into the vacuum heat transfer printing machine for use. The fixed component of the badge is loaded through the loading structure, and the badge is supported through the supporting part. In the vacuum heat transfer printing process, the transfer film can be uniformly attached to the surface of the badge under the action of negative pressure, the problem that the surface layer of the badge pressed by the traditional pressing mold is prone to edge lifting can be avoided, and the aesthetic appearance is improved. Meanwhile, multiple loading grooves and supporting parts can be configured according to needs to allow multiple badges to be processed at the same time, the material utilization rate is improved, and the cost is reduced.

Description

[0001] Cross-reference to related applications

[0002] This application claims priority to Chinese application CN 2025109509890, filed on July 9, 2025, entitled "Badge Heat Transfer Mold Assembly, Mold, Heat Transfer Machine and Method", and to Chinese application CN2025105397311, filed on April 25, 2025, entitled "Vacuum Heat Transfer Machine, Mold and Assembly Thereof, Wiring Mechanism, Masking Component and Method", the contents of which are considered part of the disclosure of this application and are incorporated herein by reference in their entirety. Technical Field

[0003] This application belongs to the technical field of vacuum heat transfer equipment, specifically relating to badge heat transfer mold assembly, mold, vacuum heat transfer machine and method. Background Technology

[0004] This section provides background information relevant to this application and is not necessarily prior art.

[0005] Badges, as common decorative accessories, feature patterns and colors on their surface and are attached to clothing or bags using pins or other fasteners. In their manufacturing process, badge machines typically use a molding process to integrate the badge surface onto the front of the badge body, thus showcasing the patterns and colors. Specifically, this molding process first positions the badge body in the lower mold, then covers the front of the badge body with the badge surface. Next, pressure is applied by the upper mold to fold and secure the edges of the badge surface towards the back of the badge body. Then, the badge base is placed in the lower mold, and the upper mold presses the combined badge surface and body firmly against the badge base, completing the badge production. However, badges produced using this traditional molding method are prone to edge curling and can only process one badge surface element at a time, resulting in low processing efficiency. Summary of the Invention

[0006] One objective of this application is to address the shortcomings of existing badge manufacturing processes that easily lead to edge lifting of badges, affecting their aesthetics. The application provides a badge mold assembly for vacuum heat transfer technology. This assembly uses vacuum to attach a transfer film to the badge surface supported by the mold assembly, and then transfers the elements on the transfer film to the badge surface under heating conditions. This results in a tight bond between the elements on the badge surface and the badge, reducing edge lifting, and enabling the heat transfer of multiple badges at a time, thus improving efficiency.

[0007] To solve the above-mentioned technical problems, this application adopts the following technical solution:

[0008] A badge heat transfer mold assembly includes a substrate, a mold detachably disposed on the surface of the substrate, the proximal end of the mold having a support portion for supporting the badge, and the support portion having a loading structure for mounting a fixing component for loading the badge.

[0009] The badge heat transfer mold assembly provided in this application is used in a vacuum heat transfer machine. The mounting structure holds the badge fixing components, and the support portion supports the badge. During the vacuum heat transfer process, the negative pressure ensures that the transfer film adheres evenly to the badge surface, avoiding the problem of edge lifting that often occurs with traditional compression molding methods, thus improving aesthetics. Furthermore, multiple mounting structures and support portions can be configured as needed, allowing for the simultaneous processing of multiple badges, improving processing efficiency, material utilization, and reducing costs. The mold-substrate separation design allows for the support of planar workpieces, such as coasters and cards, on the substrate surface after mold disassembly, facilitating vacuum heat transfer on these workpieces. Additionally, the mold creates a gap between the badge and the substrate, facilitating the adhesion of the transfer film to the bottom surface of the badge.

[0010] Furthermore, a positioning structure is constructed between the mold and the substrate. The positioning structure ensures that the mold and the substrate are aligned during assembly and prevents displacement during processing, thus guaranteeing transfer accuracy and edge integrity.

[0011] As one arrangement of the positioning structure, the positioning structure includes a pin hole positioning structure constructed between the mold and the substrate. The pin hole positioning structure has at least one set, and each set includes a protruding pin disposed on one of the mold and the substrate, and a pin hole disposed on the other. Specifically, the protruding pin is disposed on the bottom of the mold, and the pin hole is disposed on the substrate. The pin hole positioning structure provides mechanical locking, enhances the connection stability between the mold and the substrate, reduces the impact of vibration, and facilitates quick and easy assembly. With the protruding pin at the bottom of the mold and the pin hole on the substrate, the substrate can be used as a flat pad after the mold is detached from the substrate.

[0012] Furthermore, the lower side of the pin hole connecting the substrate has a loading structure for accommodating a loading slot for fixing components. The lower side of the mold has at least one air guide channel connecting the loading slot, which connects the side of the mold and / or the pin hole. Utilizing the pin hole connecting the lower side of the substrate as an air passage provides good concealment and enhances the aesthetics of the badge heat transfer mold assembly. Furthermore, the air guide channel connecting the loading slot and the side of the mold allows for air extraction from the side, improving the adhesion between the transfer film and the badge surface.

[0013] Furthermore, there are two or more air guide channels. At least one end of each air guide channel connects to the loading groove, and the other end extends to the side of the mold. And / or, at least part of the protrusion has an annular channel around its periphery, with one end of the air guide channel connecting to the loading groove, and the other end connecting to the annular channel before extending to the side of the mold. The annular channel allows for better communication between the air guide channel and the pin hole.

[0014] As another configuration of the positioning structure, the positioning structure includes a mold positioning groove formed on the surface of the substrate, and the bottom of the mold is fitted into the mold positioning groove. This positioning structure is easy and simple to assemble.

[0015] Furthermore, an orientation mechanism is constructed between the side of the mold positioning groove and the side of the mold to ensure that the mold installation orientation meets the requirements.

[0016] Furthermore, the orientation mechanism includes a protrusion constructed in one of the mold and the sidewall of the positioning groove, and a recess constructed in the other, the protrusion engaging into the recess in response to the engagement of the mold and the positioning groove.

[0017] Furthermore, the loading structure is a loading slot for accommodating and fixing components. The positioning groove is constructed with air holes that connect the lower side of the substrate and the loading slot, thereby providing an auxiliary air passage and enhancing the air extraction effect.

[0018] As another option for the positioning structure, the positioning structure includes a connecting hole in the substrate, a threaded hole in the lower side of the mold, and screws that connect the substrate and the mold through the connecting hole and the threaded hole. The screws fix the mold in place, facilitating disassembly and maintenance and extending the mold's lifespan.

[0019] Another aspect of this application provides a badge heat transfer mold assembly, including a mold detachably disposed on the surface of a substrate. The proximal end of the mold has a support portion for supporting badges, and the support portion has a loading structure for mounting a fixing component for loading badges. The side of the substrate opposite the support portion is configured as a supporting plane. When the supporting plane faces upward in response to the flipping of the substrate, it can be used to load planar workpieces. This badge heat transfer mold assembly of this application, in addition to being applicable in a vacuum heat transfer machine to support badges in a vacuum heat transfer process, also provides a supporting plane on one side of the substrate, thereby adapting to the support of planar workpieces, such as coasters and cards, so that these workpieces can be heat transferred in the transfer chamber. Therefore, the substrate can be flipped according to actual needs to support different types of workpieces.

[0020] Furthermore, a positioning structure is constructed between the mold and the substrate. The positioning structure ensures that the mold and the substrate are aligned during assembly and prevents displacement during processing, thus guaranteeing transfer accuracy and edge integrity.

[0021] As one arrangement of the positioning structure, the positioning structure includes a pin hole positioning structure constructed between the mold and the substrate. The pin hole positioning structure has at least one set, and each set includes a protruding pin disposed on one of the mold and the substrate, and a pin hole disposed on the other. Specifically, at least one set of protruding pins and pin holes is configured, with the protruding pin located at the bottom of the mold and the pin hole located on the substrate. The pin hole positioning structure provides mechanical locking, enhances the connection stability between the mold and the substrate, reduces the impact of vibration, and facilitates quick and easy assembly. With the protruding pin located at the bottom of the mold and the pin hole located on the substrate, the substrate can be used as a flat pad after the mold is detached from the substrate.

[0022] Furthermore, the lower side of the pin hole connecting the substrate has a loading structure for accommodating a loading slot for fixing components. The lower side of the mold has at least one air guide channel connecting the loading slot, which connects the side of the mold and / or the pin hole. Utilizing the pin hole connecting the lower side of the substrate as an air passage provides good concealment and enhances the aesthetics of the badge heat transfer mold assembly. Furthermore, the air guide channel connecting the loading slot and the side of the mold allows for air extraction from the side, improving the adhesion between the transfer film and the badge surface.

[0023] Furthermore, there are two or more air guide channels. At least one end of each air guide channel connects to the loading groove, and the other end extends to the side of the mold. And / or, at least part of the protrusion has an annular channel around its periphery, with one end of the air guide channel connecting to the loading groove, and the other end connecting to the annular channel before extending to the side of the mold. The annular channel allows for better communication between the air guide channel and the pin hole.

[0024] As another configuration of the positioning structure, the positioning structure includes a mold positioning groove formed on the surface of the substrate, and the bottom of the mold is fitted into the mold positioning groove. This positioning structure is easy and simple to assemble.

[0025] Furthermore, an orientation mechanism is constructed between the side of the mold positioning groove and the side of the mold to ensure that the mold installation orientation meets the requirements.

[0026] Furthermore, the orientation mechanism includes a protrusion constructed in one of the mold and the sidewall of the positioning groove, and a recess constructed in the other, the protrusion engaging into the recess in response to the engagement of the mold and the positioning groove.

[0027] Furthermore, the loading structure is a loading slot for accommodating and fixing components. The positioning groove is constructed with air holes that connect the lower side of the substrate and the loading slot, thereby providing an auxiliary air passage and enhancing the air extraction effect.

[0028] As another option for the positioning structure, the positioning structure includes a connecting hole in the substrate, a threaded hole in the lower side of the mold, and screws that connect the substrate and the mold through the connecting hole and the threaded hole. The screws fix the mold in place, facilitating disassembly and maintenance and extending the mold's lifespan.

[0029] Furthermore, the supporting surface of the substrate is roughened, for example, by setting the substrate to be manufactured using a frosted material.

[0030] Furthermore, the supporting surface of the substrate is provided with positioning marks, which facilitates the positioning of planar pads.

[0031] Furthermore, vents are provided around the positioning mark to connect the upper and lower surfaces of the substrate, thereby facilitating the positioning of planar pads and preventing their displacement.

[0032] Another aspect of this application provides a mold, applied to the badge heat transfer mold assembly of this application. It has a proximal end and a distal end arranged opposite each other. A support portion for supporting the badge is constructed at the proximal end, and a loading groove for loading a fixing component for mounting the badge is constructed on the support portion. The loading groove connects to the lower side of the distal end and / or the side of the mold to form an air passage. The mold is independently designed, with the support portion and loading groove integrated at the proximal end, providing a standardized unit and a support platform for each badge, enabling it to be fixed in a vacuum heat transfer machine for vacuum heat transfer processing. Furthermore, air passages for evacuation are integrated on the side and / or lower side, not only supporting vacuum heat transfer but also providing air passages to enhance gas flow, improve the heat transfer effect, and effectively prevent edge lifting.

[0033] Furthermore, the loading structure is a loading slot for accommodating the badge fixing components. The loading slot has a simple structure and is easy to manufacture.

[0034] As one configuration for the loading slot, the loading slot extends through the upper and lower surfaces of the badge heat transfer mold.

[0035] As another configuration of the loading slot, the loading slot is recessed to the lower side, and an airflow channel is constructed on the lower side of the distal end of the badge heat transfer mold. The loading slot is connected to the lower surface of the badge heat transfer mold through the airflow channel.

[0036] As another configuration of the loading slot, the loading slot is recessed to the lower side. The side of the badge heat transfer mold is provided with an airflow channel. The loading slot is connected to the side of the badge heat transfer mold through the airflow channel. One end of the airflow channel is connected to the loading slot, and the other end extends to the side of the mold near its lower surface and penetrates the lower surface of the badge heat transfer mold to form an air extraction port.

[0037] Furthermore, a protruding pin is provided on the lower distal side of the mold for mold installation and positioning.

[0038] Furthermore, the lower distal side of the badge heat transfer mold is provided with an air guide channel that connects to the loading groove, and there are two or more air guide channels; at least one end of the air guide channel is connected to the loading groove, and the other end extends to the side of the mold; at least a portion of the protrusion is provided with an annular channel around its periphery, and at least a portion of the air guide channel is connected to the loading groove at one end, and the other end is connected to the annular channel and then extends to the side of the mold.

[0039] Furthermore, the aforementioned air guiding channel can also be connected to the airflow channel.

[0040] Furthermore, the badge heat transfer mold is made of thermally conductive material to improve heat conduction efficiency and ensure uniform transfer.

[0041] Furthermore, the outer edge ring of the support is provided with an inclined portion that slopes downward or bends downward.

[0042] Another aspect of this application provides a vacuum heat transfer machine, including a body, a cover, a vacuum system, a heating element, and the badge heat transfer mold assembly of this application. The body is configured with a transfer cavity open on one side, the cover is used to open or close the transfer cavity, the vacuum system is connected to the transfer cavity, the heating element is used to provide heat to at least the transfer cavity, the substrate is detachably mounted in the transfer cavity, the transfer cavity cooperates with the badge heat transfer mold assembly, and the vacuum environment eliminates air bubbles between the badge and the transfer film to make them adhere. The detachable mounting of the substrate facilitates quick replacement of the mold assembly and improves production efficiency.

[0043] Another aspect of this application provides a vacuum heat transfer machine, including a body, a cover, a vacuum system, a heating element, and the badge heat transfer mold assembly of this application. The body is configured with a transfer cavity open on one side. The cover is used to open or close the transfer cavity. The vacuum system is connected to the transfer cavity. The heating element is used to provide heat to at least the transfer cavity. The substrate is detachably mounted in the transfer cavity with its supporting plane facing upwards or away from the opening side of the transfer cavity. This type of vacuum heat transfer machine can, according to actual needs, flip the substrate to a position with the supporting plane facing upwards and insert it into the transfer cavity, thereby adapting to the support of planar workpieces, such as coasters and cards, so that such workpieces can be heat transferred in the transfer cavity. Therefore, the substrate can be flipped according to actual needs to support different types of workpieces.

[0044] Another aspect of this application provides a vacuum heat transfer method using the vacuum heat transfer machine of this application, comprising the following steps: loading a badge heat transfer mold assembly containing badges into a transfer cavity; covering the transfer cavity with a transfer film; closing the transfer cavity; evacuating and heating the transfer cavity; and adhering the transfer film to the badge surface to transfer its elements to the badge surface under heating conditions. By eliminating the gas between the badge and the transfer film through vacuuming, combined with heating, the transfer elements are uniformly transferred to the badge surface, solving the problem of edge lifting; the vacuum environment improves material utilization and reduces the processing cost per piece.

[0045] The vacuum heat transfer method of this application, by loading the badge fixing component through the loading structure and supporting the badge through the support part, can ensure that the transfer film is evenly attached to the badge surface under the action of negative pressure during the vacuum heat transfer process. This can avoid the problem of easy edge lifting of the badge surface when the badge is pressed by the traditional molding method, thus improving the aesthetics. Attached Figure Description

[0046] Figure 1 This is a perspective view of one embodiment of the badge heat transfer mold assembly of this application;

[0047] Figure 2 This is a three-dimensional schematic diagram from another angle of one embodiment of the badge heat transfer mold assembly of this application;

[0048] Figure 3 This is a perspective view of one embodiment of the badge heat transfer mold assembly of this application before it is assembled into a vacuum heat transfer machine;

[0049] Figure 4 This is a three-dimensional schematic diagram of one embodiment of the badge heat transfer mold assembly of this application assembled into a vacuum heat transfer machine;

[0050] Figure 5 This is a three-dimensional schematic diagram of another embodiment of the badge heat transfer mold assembly of this application, assembled into a vacuum heat transfer machine;

[0051] Figure 6 This is a three-dimensional explosion of the second embodiment of the badge heat transfer mold assembly of this application. Figure 1 ;

[0052] Figure 7 This is a three-dimensional explosion of the second embodiment of the badge heat transfer mold assembly of this application. Figure 2 ;

[0053] Figure 8 This is a cross-sectional view of a third embodiment of the badge heat transfer mold assembly of this application;

[0054] Figure 9 This is a perspective view of the third embodiment of the badge heat transfer mold assembly of this application;

[0055] Figure 10 This is a three-dimensional explosion of the third embodiment of the badge heat transfer mold assembly of this application. Figure 1 ;

[0056] Figure 11 This is a three-dimensional explosion of the third embodiment of the badge heat transfer mold assembly of this application. Figure 2 ;

[0057] Figure 12 This is a perspective view of the third embodiment of the badge heat transfer mold assembly of this application;

[0058] Figure 13 This is a perspective view of another embodiment of the badge heat transfer mold assembly of this application;

[0059] Figure 14 This is a three-dimensional explosion of the fourth embodiment of the badge heat transfer mold assembly of this application. Figure 1 ;

[0060] Figure 15 This is a three-dimensional explosion of the fourth embodiment of the badge heat transfer mold assembly of this application. Figure 2 ;

[0061] Figure 16 This is a three-dimensional schematic diagram of the substrate with positioning marks.

[0062] Figure 17 This is a three-dimensional schematic diagram of a substrate with another type of positioning mark.

[0063] Figure 18 This is a three-dimensional schematic diagram of the heat transfer mold assembly of this application assembled in a vacuum heat transfer machine with the supporting plane facing upwards;

[0064] Figure 19 This is a perspective view of the heat transfer mold assembly with a supporting surface in this application. The dashed line indicates that the substrate is transparent.

[0065] Figure 20 This is a schematic diagram of the loading groove of the badge heat transfer mold assembly in this application when the badge is assembled on the mold;

[0066] Figure 21 This is a perspective view of another embodiment of the mold in this application (airflow channel connected to the bottom);

[0067] Figure 22 This is a three-dimensional schematic diagram from another angle of another embodiment of the mold of this application (airflow channel connected to the bottom);

[0068] Figure 23 This is a cross-sectional view of another embodiment of the mold in this application (airflow channel connected to the bottom);

[0069] Figure 24This is a perspective view of another embodiment of the mold in this application (airflow channel connected to the side);

[0070] Figure 25 This is a schematic diagram of the airflow channel connecting the bottom and side surfaces of the badge in the mold of this application;

[0071] Figure 26 This is a schematic diagram of the mold used in this application with a small badge mounted on it;

[0072] Figure 27 This is a schematic diagram of the mold used in this application, which is fitted with a large badge. Detailed Implementation

[0073] The specific embodiments of this application are described below with reference to the accompanying drawings.

[0074] See Figure 1 , Figure 3 , Figure 4 , Figure 20 , Figure 21 This application generally relates to a badge heat transfer mold assembly, mold 9, vacuum heat transfer machine, and vacuum heat transfer method, such as... Figure 20 As shown, the badge b includes a printing portion b1 for attaching patterns, colors, and other elements, and a fixing component b2 disposed at the bottom of the printing portion b1. The fixing component b2 is used to fix the badge b onto the surface of clothing, bags, or other objects. A common fixing component b2 is a pin. Of course, the badge heat transfer mold assembly of this application is not limited to the heat transfer process of badges; it can also be used for other workpieces with similar structures, such as brooches, hair clips, and other ornaments with fixing components. The heat transfer mold assembly, mold, vacuum heat transfer machine, and heat transfer method for this purpose are also within the protection scope of this application.

[0075] See Figure 3 and Figure 4The vacuum heat transfer machine of this application includes a body 1, a cover 2, a vacuum system (not shown), a heating element (not shown), and a badge heat transfer mold assembly of this application. The body 1 is constructed with a transfer cavity 100, which is open on the upper side. The cover 2 can cover the transfer cavity 100. In some specific embodiments, the cover 2 is rotatably connected to the body 1, and the user can open or close the transfer cavity 100 by flipping the cover 2. The heating element is used to provide heat to the transfer chamber 100. A vacuum system is configured inside the body 1. In some specific embodiments, the bottom of the transfer chamber 100 has a vacuum channel 106 communicating with the vacuum system. The badge heat transfer mold assembly is detachably mounted on the bottom wall of the transfer chamber 100. During operation, workpieces such as badges, flat pads, or cards are loaded onto the badge heat transfer mold assembly, and then a transfer film is placed over the upper side of the transfer chamber 100. Commonly used transfer films for heat transfer include film. The cover 2 is then closed, pressing the transfer film downwards onto the transfer chamber 100. The vacuum system is activated to evacuate the transfer chamber 100, causing the transfer film to wrap around the workpiece. The heat provided by the heating element transfers the elements of the transfer film to the workpiece. The vacuum system involved in this application includes a pump body and pipelines communicating with the pump body and the transfer chamber 100. The heating element involved in this application can be a heating tube or other heating elements applicable in the prior art.

[0076] The following description of this application is based on the badge heat transfer mold assembly and the mold itself.

[0077] See Figures 6-8 The badge heat transfer mold assembly includes a substrate 8 and a mold 9 as described in this application. The mold is detachably disposed on the surface of the substrate 8. One or more molds 9 may be disposed. The proximal end of the mold 9 is configured with a support portion 90 for supporting the badge. The support portion 90 is configured with a loading structure 900' for loading a fixing component b2 of the badge. By loading the fixing component b2 onto the loading structure 900', the badge can be positioned on the mold 9. In some embodiments, the loading structure 900' may be a magnetic element for adsorbing the fixing component, such as a magnet, or it may be a clip for holding the fixing component. Figure 1 The present application shows a specific embodiment in which the loading structure 900' is configured as a loading groove 900 constructed on the support 90.

[0078] like Figure 4 As shown, in one embodiment, the transfer cavity 100 is adapted to the shape of the substrate 8, for example, the substrate 8 and the transfer cavity 100 are configured in a rectangle, which can prevent the substrate 8 from shifting.

[0079] See Figures 2-5The substrate 8 has a removal recess 8' on its side. The removal recess 8' on the side of the substrate 8 facilitates the operator to quickly remove the mold, improving operational convenience and assembly speed.

[0080] Figure 3 A schematic diagram shows the heat transfer mold assembly being loaded into the transfer cavity 100. Figure 4 This is a schematic diagram of the heat transfer mold assembly after it has been loaded into the transfer cavity 100. Because it is equipped with a take-out recess 8', the user can easily take the heat transfer mold assembly out of the transfer cavity 100. For example, the user can use a pry pin to pry up the heat transfer mold assembly from the take-out recess 8' and then easily take it out of the transfer cavity 100.

[0081] Of course, in other embodiments, high-temperature resistant adhesive tape can also be adhered to the substrate 8, with a free portion retained on the tape, through which the heat transfer mold assembly can be extracted. It is preferable that the free portion of the high-temperature resistant adhesive tape is adjacent to the side of the substrate 8, especially the shorter side, for easier removal.

[0082] See Figures 6-10 A positioning structure is constructed between the mold 9 and the substrate 8. The positioning structure ensures that the mold 9 and the substrate 8 are easily aligned during assembly and prevents the mold 9 from shifting during the heat transfer process, thus ensuring the accuracy and edge integrity of the heat transfer.

[0083] See Figure 8 In some embodiments, the positioning structure includes a pin hole positioning structure 9.8 constructed between the mold 9 and the substrate 8. The pin hole positioning structure 9.8 provides mechanical locking, enhances the connection stability between the mold 9 and the substrate 8, reduces the impact of vibration, and facilitates quick and easy assembly.

[0084] In some embodiments, the pin hole positioning structure 9.8 is provided with at least one set, which may be one set, two sets, or more than two sets, to effectively and reliably position the mold 9. For example... Figure 8 As shown, the pin hole positioning structure 9.8 has two sets.

[0085] As one specific embodiment of the pin hole positioning structure (not shown), the pin hole positioning structure includes a pin hole provided at the bottom of the mold and a protruding pin provided on the substrate 8.

[0086] See Figure 7 and Figure 8 As another specific embodiment of the pin hole positioning structure 9.8, the pin hole positioning structure 9.8 includes a protruding pin 9.81 disposed at the bottom of the mold 9 and a pin hole 9.80 disposed on the substrate 8. The protruding pin 9.81 is disposed at the bottom of the mold 9, and the pin hole 9.80 is disposed on the substrate 8. When the mold 9 is removed from the substrate 8, the surface of the substrate 8 can remain flat, so it can be used as a flat pad for loading flat pads or cards for heat transfer.

[0087] See Figures 6-8 To facilitate the positioning of the mold 9 relative to the substrate 8, two sets of pin hole positioning structures 9.8 are constructed. The first set is the first pin hole positioning structure 9.8(a), and the second set is the second pin hole positioning structure 9.8(b). The loading groove 900 is constructed between the first pin hole positioning structure 9.8(a) and the second pin hole positioning structure 9.8(b). The first pin hole positioning structure 9.8(a) includes a protruding pin 9.81(a) constructed on the bottom of the mold 9 and a pin hole 9.80(a) constructed on the substrate 8. Similarly, the second pin hole positioning structure 9.8(b) includes a protruding pin 9.81(b) constructed on the bottom of the mold 9 and a pin hole 9.80(b) constructed on the substrate 8. Since there are two sets of pin hole positioning structures 9.8, the orientation of the mold 9 relative to the substrate 8 can be controlled by controlling the unique assembly relationship of each set of pin hole positioning structures 9.8. One positioning scheme of this application is as follows: the protruding pin 9.81(b) and the pin hole 9.80(b) are respectively constructed to be slightly larger than both the protruding pin 9.81(a) and the pin hole 9.80(a), so that the protruding pin 9.81(b) can only be assembled to the pin hole 9.80(b), and the protruding pin 9.81(a) can only be assembled to the pin hole 9.80(a), thus achieving the positioning of the mold 9 relative to the substrate 8. In other embodiments, the protruding pin 9.81(b) and the pin hole 9.80(b) can also be constructed to be slightly smaller than both the protruding pin 9.81(a) and the pin hole 9.80(a). Of course, in other embodiments, the pin hole positioning structure 9.8 can be configured with different shapes to position the mold 9.

[0088] See Figure 8 In some improvements, the pin hole 9.80 is a countersunk hole, and its bottom is connected to the lower side of the substrate 8 through the air hole 801. The air hole 801 at the bottom of the pin hole 9.80 is used to connect to the lower side of the substrate 8, serving as an air passage to connect the lower side of the substrate 8. The hole serves two purposes, has good concealment, and makes the badge heat transfer mold assembly more aesthetically pleasing.

[0089] See Figures 6-8 The lower side of the mold 9 has an air guide channel 10 that connects to the loading groove 900. The air guide channel 10 connects to the side of the mold 9 and / or the pin hole 9.80. There are one or more air guide channels 10. This configuration optimizes the vacuum adsorption efficiency, ensures uniform adsorption on the badge surface, and avoids edge lifting.

[0090] See Figure 7In one specific embodiment, the air guide channel 10 is configured with two or more, which may include one or more first air guide channels 10(a) that directly connect the loading groove 900 and the side of the mold 9; and may also include one or more second air guide channels 10(b) that connect the loading groove 900, the side of the mold 9, and at least one side of the protrusion 9.81(b) and the protrusion 9.81(a). When vacuuming, some air is drawn from the loading groove 900 to the side of the mold 9 through the second air guide channel 10(b); since the protrusion 9.81 is loaded into the corresponding pin hole 9.80, and the pin hole 9.80 is connected to the lower side of the substrate 8, some air is drawn from the loading groove 900 to at least one of the pin hole 9.80(a) and the pin hole 9.80(b) through the second air guide channel 10(b) to the lower side of the substrate 8 and the side of the mold 9.

[0091] See Figure 7 In order to better connect the air guide channel 10 with the pin hole 9.80, the outer periphery of the protruding pin 9.81(b) and / or 9.81(a) is constructed with an annular channel 101 surrounding the protruding pin 9.81(b) and / or 9.81(a). One end of the second air guide channel 10(b) is connected to the loading groove 900, and the other end is connected to the annular channel 101 and then extends to the side of the mold 9.

[0092] In other embodiments, the air passage 10 may include one or more first air passages 10(a) and one or more second air passages 10(b).

[0093] exist Figure 7 In the illustrated embodiment, the air guide channel 10 includes four first air guide channels 10(a) that directly connect the loading groove 900 and the side of the mold 9, and two second air guide channels 10(b) that connect the loading groove 900, the side of the protrusion 9.81(b) and the side of the protrusion 9.81(a) and the side of the mold 9.

[0094] See Figures 9-11 In other embodiments of this application, the positioning structure may also include a mold positioning groove 80 on the surface of the substrate 8, with the bottom of the mold 9 fitted into the positioning groove 80. In this case, the bottom of the mold 9 is directly fitted into the mold positioning groove 80, eliminating the need for a separate loading groove structure, resulting in a simple structure.

[0095] See Figures 9-11 In order to achieve the orientation of mold 9, an orientation mechanism 9.8' is constructed between the side of mold positioning groove 80 and the side of mold 9 to ensure that the installation orientation of mold 9 meets the requirements.

[0096] Specifically, one embodiment of the orientation mechanism 9.8' includes a protrusion 9.80' constructed on the bottom side of the mold 9 and a recess 9.81' constructed on the side wall of the positioning groove 8. When the mold 9 is assembled into the positioning groove 80, the protrusion 9.80' engages with the recess 9.81'. Of course, the protrusion 9.80' and the recess 9.81' can be interchanged.

[0097] The mold positioning groove 80 is constructed with an air hole 801 that connects the lower side of the substrate 8 and the loading groove 900. When the mold 9 is loaded into the mold positioning groove 80, the air hole 801 connects the lower side of the substrate 8 and the loading groove 900, providing an auxiliary air path and enhancing the vacuum effect.

[0098] See Figures 12-15 As an alternative, the positioning structure includes a connection hole 802 formed in the substrate 8, a threaded hole 902 formed on the underside of the mold 9, and a screw 903 connecting the substrate 8 and the mold 9 through the connection hole 802 and the threaded hole 902. The mold is fixed by the screw 903, facilitating disassembly and maintenance and improving the lifespan of the mold 9. Specifically, the connection hole 802 is a countersunk hole, and the screw 903 passes through the connection hole 802 from the underside and connects to the corresponding threaded hole 902 of the mold 9. Each mold 9 is preferably connected by two or more screws 903 to ensure the stability of positioning and connection.

[0099] See Figures 16-19 Another aspect of this application provides a badge heat transfer mold assembly, including a substrate 8 and a mold 9 detachably disposed on the surface of the substrate 8. The proximal end of the mold 9 has a support portion 90 for supporting badges, and the support portion 90 has a loading structure 900' for loading a fixing component for mounting the badge. The side of the substrate 8 opposite the support portion 90 is configured as a supporting plane 800, which, when facing upwards in response to the flipping of the substrate 8, is used to load planar workpieces. Planar workpieces involved in this application include planar pads or cards, such as coasters.

[0100] like Figure 5 and Figure 18 As shown, in the embodiment described above where the surface of the substrate 8 relative to the support portion 90 is set as a supporting plane 800, by flipping the substrate 8, the substrate 8 can be detachably mounted on the bottom wall of the transfer cavity 100 with the supporting plane 800 facing or away from the opening side of the transfer cavity 100, thereby making it suitable for loading badges or flat pads or cards, specifically, as... Figure 5 and Figure 18 The diagram shows another usage state of the heat transfer mold assembly. By flipping the substrate 8 so that its supporting plane 800 faces the opening side of the transfer cavity 100, it is loaded onto the bottom wall of the transfer cavity 100, thereby allowing flat pads or cards, such as coasters, to be loaded for heat transfer. Figure 4As shown, by flipping the substrate 8 so that its supporting plane 800 is opposite to the opening side of the transfer cavity 100, it can be loaded onto the bottom wall of the transfer cavity 100, thereby allowing workpieces such as badges to be loaded for heat transfer.

[0101] See Figure 16 and Figure 17 The substrate 8 has a support surface 800 with positioning marks s, which are used to indicate the position of loading flat pads or cards, so as to facilitate the user to install the relevant flat pads or cards.

[0102] See Figure 16 and Figure 17 As an improved embodiment, the supporting plane 800 of the substrate 8 has vents 801 connecting the upper and lower surfaces of the substrate 8 around the positioning mark s. Because the transfer mold shrinks towards the center during heat transfer of flat pads or cards, providing vents 801 around the flat pads or cards ensures that the transfer mold does not detach from the designated position of the flat pads or cards, achieving a positioning effect. The vents 801 are preferably connected to the loading groove 900.

[0103] like Figure 16 and Figure 17 Each of the following is a specific embodiment of a positioning marker s.

[0104] As an improved implementation, the supporting surface 800 of the substrate 8 is roughened, for example, by using a frosted material, which can increase the friction between the supporting surface 800 and the flat pad or card, and prevent the flat pad or card from shifting.

[0105] The substrate 8 in this application is a thermally conductive substrate, and may specifically use the materials described in other embodiments. The mold 9 is made of a thermally conductive material, such as metal, which can enhance the heating effect of the badge and thus ensure the quality of the heat transfer.

[0106] When using the heat transfer mold assembly of this application, if Figures 3-5 As shown, it is loaded into the transfer cavity 100, and then as follows: Figure 20 As shown, the badge is loaded into the loading slot 900 (or the badge can be loaded first, and then the heat transfer mold assembly is loaded into the transfer cavity 100). At this time, the badge fixing component b2 is located in the loading slot 900, and the lower side of the badge abuts against the support part 90. The heat transfer material (such as transfer film) is covered with the transfer mold assembly and the relevant heat transfer elements are ensured to correspond to each badge. The cover 2 is closed and the equipment is started to perform vacuuming. Under vacuum and heating conditions, the heat transfer elements of the heat transfer material are transferred to the surface of the badge.

[0107] See Figure 21In another aspect, the mold 9 provided in this application has a proximal end and a distal end disposed opposite to each other. A support portion 90 for supporting a badge is constructed at the proximal end, and a loading structure 900' for accommodating a badge fixing assembly is constructed in the support portion 90. For example... Figure 21 The illustrated embodiment of this application shows a loading structure 900' configured as a loading groove 900 constructed on a support 90. The mold 9 of this application is detachably mounted on the base plate 8 of the badge heat transfer mold assembly. The mold loads badges via the configured loading structure 900', thereby fixing the badges in the transfer chamber 100 of a vacuum heat transfer machine for heat transfer processing. The loading groove 900 connects to the lower side of the distal end and / or the side of the mold 9 to form an air passage.

[0108] See Figure 23 and Figure 24 In some embodiments, the loading groove 900 connects to the distal lower side of the mold 9 to form an air passage. Specifically, the loading groove 900 is recessed downwards, meaning it does not penetrate the mold 9. An airflow channel 901 is constructed on the distal lower side of the mold 9, and the loading groove 900 connects to the lower surface of the mold 9 through the airflow channel 901. This type of loading groove 900, which does not penetrate the mold 9, can provide support for the badge's fixing components.

[0109] See Figure 25 and Figure 24 In other embodiments, the loading groove 900 is recessed to the lower side, and the side of the mold 9 is provided with an airflow channel 901. The loading groove 900 is connected to the side of the mold 9 through the airflow channel 901. One end of the airflow channel 901 is connected to the loading groove 900, and the other end extends to the side of the mold 9 near its lower surface and penetrates the lower surface of the mold 9 to form an air extraction port 901'. The loading groove 900 in this configuration is not through the mold 9, which can provide support for the fixing components of the badge, and also allows the transfer mold to better adhere to the corner joint position between the side and bottom of the badge.

[0110] See Figure 8 In other embodiments, the loading groove 900 extends through the upper and lower surfaces of the mold 9. This configuration of the loading groove 900 can form a direct airflow path, thereby increasing the volume of gas flow per unit time in the loading groove 900, improving vacuuming efficiency and the adhesion effect of the transfer film.

[0111] See Figure 7 , Figure 19 and Figure 22 The lower side of the mold 9 has an air guide channel 10 that connects to the loading groove 900, and the air guide channel 10 connects to the side of the mold 9.

[0112] See Figure 22In some embodiments, the lower distal end of the mold 9 is provided with an air guide channel 10 that connects to the loading groove 900 and the air guide channel 10 connects to the airflow channel 901. By providing the air guide channel 10, the vacuum adsorption efficiency and uniformity can be effectively improved, and air bubbles can be avoided at the edges of the transfer film, making it fit better with the badge surface.

[0113] See Figure 7 In some embodiments, the air channel 10 is configured with one or more, which optimizes the vacuum adsorption efficiency, ensures uniform adsorption on the badge surface, and avoids edge lifting.

[0114] See Figure 7 and Figure 8 In one specific embodiment, a protruding pin 9.81 is constructed on the lower distal side of the mold 9. The protruding pin 9.81 is used to engage with the pin hole 9.80 of the substrate 8. The air guide channel 10 is configured with two or more, which may include one or more first air guide channels 10(a) that directly connect the loading groove 900 and the side of the mold 9; and may also include one or more second air guide channels 10(b) that connect the loading groove 900, the side of the mold 9, and the side of the protruding pin 9.81. When vacuuming, some air is drawn from the loading groove 900 to the side of the mold 9 through the first air guide channel 10(a); since the protruding pin 9.81 is used to be loaded into the corresponding pin hole 9.80, and the pin hole 9.80 is connected to the lower side of the substrate 8, some air is drawn from the loading groove 900 to the pin hole 9.80 to the lower side of the substrate 8 and the side of the mold 9 through the second air guide channel 10(b).

[0115] See Figure 7 In order to better connect the air guide channel 10 with the pin hole 9.80, the outer periphery of the protruding pin 9.81 is constructed with an annular channel 101 surrounding the protruding pin 9.81. One end of the second air guide channel 10(b) is connected to the loading groove 900, and the other end is connected to the annular channel 101 and then extends to the side of the mold 9.

[0116] In other embodiments, the air passage 10 may include one or more first air passages 10(a) and one or more second air passages 10(b).

[0117] exist Figure 7 In the illustrated embodiment, the air guide channel 10 includes four first air guide channels 10(a) that directly connect the loading groove 900 and the side of the mold 9, and two second air guide channels 10(b) that connect the loading groove 900, the side of the protrusion 9.81(b) and the side of the protrusion 9.81(a) and the side of the mold 9.

[0118] In some embodiments, mold 9 is made of a thermally conductive material.

[0119] The difference between the thermally conductive and non-thermally conductive materials referred to in the substrate 8 and mold 9 of this application lies in the strength of their thermal conductivity, which can be specifically defined by the thermal conductivity (λ).

[0120] Thermally conductive materials: such as the following metal or non-metal materials with thermal conductivity ≥1W / (m·K), such as metals (e.g., copper λ≈401, aluminum λ≈237), high thermal conductivity non-metals (e.g., graphene λ≈1000–5000, aluminum nitride ceramics λ≈170–280, silicon carbide λ≈120–200), etc.

[0121] Non-thermal conductive materials: such as non-metallic materials with thermal conductivity <0.12W / (m·K), such as rock wool board (λ<0.04), polyurethane foam (λ≈0.02–0.03), vacuum insulation board (λ≈0.004), etc.

[0122] That is, thermally conductive materials (λ≥1) accelerate heat transfer to dissipate heat, while non-thermally conductive materials (λ<0.12) impede heat transfer to provide insulation.

[0123] The thermally conductive material of this application can be aluminum or its alloys, copper or its alloys, or other materials with good thermal conductivity, such as stainless steel or its alloys, cast iron, or other known materials with good thermal conductivity, such as metals or non-metals.

[0124] See Figure 26 and Figure 27 The outer edge of the support portion 90 of the mold 9 is provided with a downwardly inclined portion 9a. The inclined portion 9a can provide clearance around the outer edge of the bottom surface of the badge 89, so that the film material can enter the inclined portion 9a under negative pressure to cover the outer edge surface of the bottom surface of the badge.

[0125] Figure 26 A schematic diagram shows mold 9 loading a badge 89 with a smaller diameter. Figure 27 A schematic diagram is shown of mold 9 loading a badge 89 with a larger diameter. For larger badges, the inclined part 9a is used to press against the inside of the bottom surface of the badge to prevent the badge from shifting; while for smaller badges, the inclined part 9a will avoid the edge of the lower surface of the badge.

[0126] Another aspect of this application provides a heat transfer method comprising the following steps: loading a badge heat transfer mold assembly containing badges into a transfer cavity 100; covering the transfer cavity 100 with a transfer film; closing the transfer cavity 100; evacuating and heating the transfer cavity 100; and attaching the transfer film to the badge surface to transfer its elements to the badge surface under heating conditions.

[0127] The badge heat transfer mold assembly provided in this application is used in the transfer cavity 100 of a vacuum heat transfer machine, specifically by means of a substrate 8 detachably mounted on the bottom wall of the transfer cavity 100. Figure 20 As shown, when the workpiece for heat transfer is a badge, the fixing component b2 of the badge is mounted by the loading structure 900', and the printing portion b1 of the badge is supported by the support portion 90. When the workpiece for heat transfer is a flat pad or card, it can be handled as follows: Figure 5 The badge heat transfer mold assembly is flipped so that the supporting surface 80° faces upward, thereby supporting this type of workpiece. Alternatively, it can be supported by means of... Figure 6 The mold 9 is separated from the substrate 8, thereby allowing the substrate 8 to support the workpiece. During the vacuum heat transfer process, the transfer chamber 100 is evacuated by a vacuum system. Under negative pressure, the transfer film can be evenly attached to the surface of the workpiece. Under the heating of the heating element, the elements on the transfer film are transferred to the surface of the substrate. Therefore, the elements formed on the surface of badges and other workpieces by heat transfer have stronger adhesion and a higher degree of bonding with the workpiece, making the connection between the two tight. This avoids the problem of easy edge lifting caused by traditional molding methods, improves the durability and aesthetics of the badge. At the same time, multiple loading slots 900 and support parts 90 can be configured as needed, allowing multiple badges to be processed simultaneously in one vacuum heat transfer process, improving material utilization and reducing costs.

[0128] The contents of the various embodiments of this application can be combined and referenced with each other, and all fall within the protection scope of this application.

[0129] Based on the disclosure and teachings of the foregoing specification, those skilled in the art can make changes and modifications to the above embodiments. Therefore, this application is not limited to the specific embodiments disclosed and described above, and some modifications and changes to this application should also fall within the protection scope of the claims of this application. Furthermore, although some specific terms are used in this specification, these terms are only for convenience of explanation and do not constitute any limitation on this application.

Claims

1. A badge heat transfer mold assembly, characterized in that, include: base(8); A mold (9) is detachably disposed on the surface of the substrate (8), the proximal end of the mold (9) being configured with a support portion (90) for supporting the badge, the support portion (90) being configured with a loading structure (900') for loading the fixing components of the badge.

2. A badge heat transfer mold assembly, characterized in that, include: base(8); A mold (9) is detachably disposed on the surface of the substrate. The proximal end of the mold (9) is provided with a support portion (90) for supporting the badge. The support portion (90) is provided with a loading structure (900') for loading the fixing component of the badge. The substrate (8) is configured as a support plane (800) on the side opposite to the support portion (90), and the support plane (800) can be used to load planar workpieces when it faces upward in response to the flipping of the substrate (8).

3. The badge heat transfer mold assembly according to claim 1 or 2, characterized in that, A positioning structure is constructed between the mold (9) and the substrate (8).

4. The badge heat transfer mold assembly according to claim 3, characterized in that, The positioning structure includes a pin hole positioning structure (9.8) constructed between the mold (9) and the substrate (8). The pin hole positioning structure (9.8) is provided in at least one set. Each set of pin hole positioning structures (9.8) includes a protruding pin (9.81) provided in one of the mold (9) and the substrate (8), and a pin hole (9.80) provided in the other.

5. The badge heat transfer mold assembly according to claim 4, characterized in that, The protruding pin (9.81) is disposed at the bottom of the mold (9), the pin hole (9.80) is disposed on the substrate (8), the pin hole (9.80) communicates with the lower side of the substrate (8), the loading structure (900') is a loading groove (900) for accommodating the fixing component, the lower side of the mold (9) is constructed with at least one air guide channel (10) communicating with the loading groove (900), the air guide channel (10) communicating with the side of the mold (9) and / or the pin hole (9.80).

6. The badge heat transfer mold assembly according to claim 5, characterized in that, The air guide channel (10) is configured with two or more; At least one end of the air guide channel (10) is connected to the loading groove (900), and the other end extends to the side of the mold (9); and / or, at least a portion of the protrusion (9.80) has an annular channel (101) around its periphery, at least a portion of the air guide channel (10) is connected to the loading groove (900) at one end, and the other end is connected to the annular channel (101) and then extends to the side of the mold (9).

7. The badge heat transfer mold assembly according to claim 3, characterized in that, The positioning structure includes a mold positioning groove (80) formed on the surface of the substrate (8), and the bottom of the mold (9) is fitted into the mold positioning groove (80).

8. The badge heat transfer mold assembly according to claim 7, characterized in that, An orientation mechanism (9.8') is constructed between the side of the mold positioning groove (80) and the side of the mold (9).

9. The badge heat transfer mold assembly according to claim 8, characterized in that, The orientation mechanism (9.8') includes a protrusion (9.80') constructed in one of the sidewalls of the mold (9) and the positioning groove (80), and a recess (9.81') constructed in the other, the protrusion (9.80') engaging into the recess (9.81') in response to the engagement of the mold (9) and the positioning groove (80).

10. The badge heat transfer mold assembly according to claim 7, characterized in that, The loading structure (900') is a loading groove (900) for accommodating the fixing component, and the positioning groove (80) is configured with an air hole (801) connecting the lower side of the substrate (8) and the loading groove (900).

11. The badge heat transfer mold assembly according to claim 3, characterized in that, The positioning structure includes a connection hole (802) formed on the substrate (8), a threaded hole (902) formed on the lower side of the mold (9), and a screw (903) connecting the substrate (8) and the mold (9) through the connection hole (802) and the threaded hole (902).

12. The badge heat transfer mold assembly according to claim 2, characterized in that, The supporting surface (800) of the substrate (8) is roughened; And / or, the supporting surface (800) of the substrate (8) is provided with positioning marks (s); And / or, the supporting plane (800) of the substrate (8) is provided with positioning marks (s), and vents (801) connecting the upper and lower surfaces of the substrate (8) are provided around the positioning marks (s).

13. A mold, characterized in that, It has a proximal end and a distal end arranged opposite to each other. A support portion (90) for supporting the badge is constructed at the proximal end. A loading groove (900) for loading a fixing component for the badge is constructed at the support portion (90). The loading groove (900) communicates with the lower side of the distal end and / or the side of the mold to form an air passage.

14. The mold according to claim 13, characterized in that, The loading groove (900) is recessed to the lower side, and an airflow channel (901) is constructed on the lower side of the distal end of the mold (9). The loading groove (900) is connected to the lower surface of the mold (9) through the airflow channel (901). Alternatively, the loading groove (900) is recessed to the lower side, and the side of the mold (9) is provided with an airflow channel (901). The loading groove (900) is connected to the side of the mold (9) through the airflow channel (901). One end of the airflow channel (901) is connected to the loading groove (900), and the other end extends to the side of the mold (9) near its lower surface and penetrates the lower surface of the mold (9) to form an air extraction port (901'). Alternatively, the loading groove (900) extends through the upper and lower surfaces of the mold (9); And / or, the lower distal end of the mold (9) is provided with an air guide channel (10) that connects to the airflow channel (901).

15. The mold according to claim 13, characterized in that, The lower part of the far end of the mold (9) has a protruding pin (9.81). And / or, the mold (9) is made of a thermally conductive material; And / or, the outer edge ring of the support portion (90) is provided with a downwardly inclined or downwardly curved inclined portion (9a).

16. The mold according to claim 13, characterized in that, The lower side of the distal end of the mold (9) is provided with a protruding pin (9.81). The lower side of the distal end of the mold (9) is also provided with an air guide channel (10) that connects to the loading groove (900). There are two or more air guide channels (10). At least one end of the air guide channel (10) is connected to the loading groove (900), and the other end extends to the side of the mold (9). At least one of the protruding pins (9.81) is provided with an annular channel (101). At least one end of the air guide channel (10) is connected to the loading groove (900), and the other end is connected to the annular channel (101) and then extends to the side of the mold (9).

17. The mold according to claim 16, characterized in that, The air guide channel (10) is provided with two or more; at least one end of the air guide channel (10) is connected to the loading groove (900), and the other end extends to the side of the mold (9); and / or, a protruding pin (9.8) is constructed on the lower side of the distal end of the mold (9), and an annular channel (101) is constructed around at least a portion of the protruding pin (9.80), and at least one end of the air guide channel (10) is connected to the loading groove (900), and the other end is connected to the annular channel (101) and then extends to the side of the mold (9).

18. A vacuum heat transfer printing machine, characterized in that, include: The body (1) is equipped with a transfer chamber (100) with an open side. Cover (2) for opening and closing the transfer cavity (100); A vacuum system is connected to the transfer chamber (100); A heating element for providing heat to at least the transfer chamber (100); The badge heat transfer mold assembly according to any one of claims 1 to 12, wherein the substrate (8) is detachably mounted in the transfer cavity (100).

19. A vacuum heat transfer printing machine, characterized in that, include: The body (1) is equipped with a transfer chamber (100) with an open side. Cover (2) for opening and closing the transfer cavity (100); A vacuum system is connected to the transfer chamber (100); A heating element for providing heat to at least the transfer chamber (100); The badge heat transfer mold assembly of claim 2, wherein the substrate (8) is detachably mounted in the transfer cavity (100) with the supporting plane (800) facing or away from the opening side of the transfer cavity.

20. A heat transfer method, characterized in that, The badge heat transfer mold assembly containing the badge is loaded into the transfer chamber (100) of the vacuum heat transfer machine as described in claim 18 or 19; a transfer film is placed over the transfer chamber (100); the transfer chamber (100) is closed; the transfer chamber (100) is evacuated and heated; the transfer film is attached to the badge surface to transfer its elements to the badge surface under heating conditions.

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