Preparation method of Cu-Nd alloy interconnection material and application thereof

By using non-aqueous electrodeposition solutions and precise electrical signal control, the problem of Cu-Nd alloy co-deposition was solved, enabling the preparation of low-temperature and high-efficiency alloy thin films, which are suitable for large-scale production.

CN122189783APending Publication Date: 2026-06-12SHANGHAI JIAOTONG UNIV
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
SHANGHAI JIAOTONG UNIV
Filing Date
2026-03-17
Publication Date
2026-06-12

AI Technical Summary

Technical Problem

Existing technologies struggle to achieve uniform co-deposition of Cu-Nd alloys under mild conditions, and traditional methods suffer from high energy consumption, expensive equipment, and compositional segregation.

Method used

A non-aqueous electrodeposition solution formulation was adopted, using 1,3-dimethyl-2-imidazolinone as the solvent, with the addition of a supporting electrolyte and a metal source. Electrodeposition was carried out at 50°C by constant or pulsed electrical signals, and the potential and duty cycle were controlled to achieve high-quality co-deposition of Cu-Nd alloys.

Benefits of technology

Efficient and low-cost Cu-Nd alloy deposition was achieved at low temperatures, reducing equipment investment and operating costs, and improving the density and uniformity of the alloy film, making it suitable for large-scale production.

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Abstract

The application relates to the technical field of semiconductor production, and discloses a preparation method of Cu-Nd alloy interconnection material and application of the Cu-Nd alloy interconnection material, which comprises the following steps: preparing a non-aqueous electrodeposition solution: taking 1,3-dimethyl-2-imidazolidinone as a solvent, adding a supporting electrolyte, a copper source and a neodymium source into the solvent, stirring until the system is completely clarified, and obtaining the non-aqueous electrodeposition solution; electrode assembly: taking a conductive substrate as a cathode, taking a soluble metal anode or an inert insoluble anode as an anode, and immersing the cathode and the anode into the non-aqueous electrodeposition solution; electrodeposition reaction: heating the non-aqueous electrodeposition solution to 25 DEG C-80 DEG C, applying an electric signal between the cathode and the anode for electrodeposition, and preparing a Cu-Nd alloy interconnection material coating on the surface of the cathode. The application improves the problems of serious hydrogen evolution side reaction in a water system and difficulty in uniform co-deposition of copper and neodymium due to too large reduction potential difference.
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