A stress release and modal coupling mechanism and accelerometer sensitive structure
By using a stress relief and modal coupling mechanism, the accuracy and stability issues caused by thermal mismatch stress in MEMS accelerometers are resolved, enabling high-precision accelerometer detection.
CN122193627APending Publication Date: 2026-06-12NAT UNIV OF DEFENSE TECH
View PDF 0 Cites 0 Cited by
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- NAT UNIV OF DEFENSE TECH
- Filing Date
- 2025-07-11
- Publication Date
- 2026-06-12
Smart Images

Figure CN122193627A_ABST
Abstract
The application belongs to the technical field of micro-electro-mechanical system manufacturing, and relates to a stress release and modal coupling mechanism and an accelerometer sensitive structure, which comprises differential mass blocks and a stress release assembly; the two differential mass blocks are distributed in an interval axial symmetry to form an air band gap, and a first symmetry axis and a second symmetry axis are defined; the stress release assembly is arranged on the first symmetry axis and connected with the two differential mass blocks; the stress release assembly comprises a stress release beam, an elastic connecting beam, an elastic supporting beam and a compensation anchor point; the stress release beam is in an "H" shape structure; the elastic connecting beam is in a strip structure perpendicular to the first symmetry axis; the elastic supporting beam is in a strip structure arranged between the two groups of stress release beams; the two groups of elastic supporting beams are connected with the two groups of elastic connecting beams respectively, and are connected with the center of the stress release assembly to form the compensation anchor point in the center of the stress release assembly. The application can improve the detection precision and temperature stability.
Need to check novelty before this filing date? Find Prior Art