Mounting frame and method of a semiconductor testing device with embedded water cooling structure
By embedding a water-cooling structure into the mounting frame of the semiconductor testing equipment, a closed-loop cooling fluid circulation loop and a fixed housing for protection are constructed. This solves the problems of low equipment integration, uneven temperature control, and vibration interference in existing technologies, achieving high integration, miniaturization, and testing stability. It also reduces the risk of condensate contamination and ensures the accuracy of test results and equipment safety.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- JIANGSU JINGYITONG PRECISION TECH CO LTD
- Filing Date
- 2026-03-31
- Publication Date
- 2026-06-12
AI Technical Summary
The external water cooling system of existing semiconductor testing equipment results in low equipment integration and poor space utilization, making it unable to meet the requirements of high integration and miniaturization, and also poses risks of uneven temperature control, vibration interference, and condensate contamination.
In the mounting frame of the semiconductor testing equipment with embedded water-cooling structure, a closed-loop cooling fluid circulation circuit is constructed by integrating a cooling shell, connecting components and a circulating pump body on the frame body. This achieves uniform temperature control and vibration suppression across the entire area, and a fixed shell is set up to protect against condensate, forming an independent condensate collection and storage branch.
It achieves high integration and miniaturization of semiconductor testing equipment, ensures temperature uniformity and testing stability, reduces the risk of vibration interference and condensate contamination, and guarantees the accuracy of test results and the long-term safe and stable operation of the equipment.
Smart Images

Figure CN122193853A_ABST