Die cutting processing method for flexible protection film of 5G signal PC substrate

Abstract

The present application relates to the field of new generation information technology, especially to a die cutting processing method for the flexible protective film of PC substrate of 5G signal, the method selects the raw material film as polyimide through step S1, the method also carries out composite marking through step S2, the method also carries out microwave-laser synergistic irradiation through step S3, the method also calculates the target cutting path instantaneously through step S4, the method also collects the target cutting data through step S5, the method also adapts to the micro non-uniformity of material and the change of tool state through step S6, the method also outputs the dielectric performance value through step S7, the method also judges the state of the profile arithmetic average deviation through step S8, and the method also creates a digital identity file for each target flexible protective film through step S9.

Description

Technical Field

[0001] This invention relates to the field of next-generation information technology, and in particular to a die-cutting method for flexible protective films used in 5G signal PC substrates. Background Technology

[0002] In the 5G millimeter-wave band, the dielectric properties and edge processing precision of the flexible circuit protection film directly determine signal integrity. Traditional manufacturing processes have the following fundamental shortcomings: First, poor batch consistency of materials and large fluctuations in dielectric constant (often > ±0.1) lead to unstable signal transmission performance. Second, the die-cutting process relies on fixed parameters and cannot detect and compensate for material micro-inhomogeneities and tool wear in real time, making it difficult to stably control the edge roughness (Ra) at the sub-micron level (>1.0 µm), causing signal scattering loss. Furthermore, the quality traceability system is fragmented, with production, testing, and service data separated and easily tampered with, making it impossible to achieve a reliable closed loop throughout the entire life cycle.

[0003] Chinese patent application CN120209726A discloses a flexible high-barrier film for electronic packaging and its preparation method. The specific preparation steps include: substrate activation: activating the upper and lower surfaces of a polymer substrate to adjust the surface energy of the two surfaces to ≥50mN / m, thus obtaining an activated substrate; coating an organic buffer layer: coating the two surfaces of the activated substrate with an aqueous organic coating, followed by curing to obtain an organic buffer layer with a water content of 15-20%, a thickness of 10-15μm, and a roughness Ra of 0.08-0.12μm; depositing an inorganic layer: pulsed a gaseous mixture of trimethylaluminum and tetraethyl orthosilicate onto the surface of the organic buffer layer, followed by a water vapor pulse, repeating this pulse cycle to deposit an inorganic layer 15-20nm thick on the surface of the organic buffer layer; stacking and encapsulation: stacking the organic buffer layer and inorganic layer in this manner for 8-10 cycles, then covering with a UV-curable adhesive and annealing to obtain the flexible high-barrier film for electronic packaging. Therefore, this solution still suffers from problems such as poor product consistency and low transmission efficiency due to the lack of cutting path planning, as well as the lack of material composite marking and the failure to write material lifecycle data into the blockchain, resulting in the untraceability of product origin and processing. Summary of the Invention

[0004] To address these issues, this invention provides a die-cutting method for flexible protective films on 5G signal PC substrates, which overcomes the problems of poor product consistency and low transmission efficiency caused by the lack of cutting path planning in the prior art, as well as the lack of material composite marking and the inability to trace the product origin and processing process due to the absence of material lifecycle data in the blockchain.

[0005] To achieve the above objectives, the present invention provides a die-cutting process for a flexible protective film on a 5G signal PC substrate, the method comprising: Step S1: Obtain the raw material film; Step S2: Perform composite marking on the raw material film to obtain the marked material film; Step S3: The marked material film is subjected to microwave-laser synergistic irradiation to obtain the irradiated material film; Step S4: Plan the cutting path of the irradiated material film according to the cutting path planning method to obtain the target cutting path; Step S5: Collect target cutting data; Step S6: Construct a cutting control model, and use the cutting control model to cut the irradiated material film according to the target cutting data and the target cutting path to obtain the target flexible protective film. Step S7: The performance of the target flexible protective film is scanned by terahertz imaging technology to obtain dielectric performance values, and the irradiation process of microwave-laser synergistic irradiation is optimized based on the dielectric performance values. Step S8: Obtain the arithmetic mean deviation of the profile, and perform virtual calibration on the cutting process of the irradiated material film based on the arithmetic mean deviation of the profile. Step S9: Generate an NFT based on the target flexible protective film and write the NFT into the blockchain.

[0006] Furthermore, in step S2, when performing composite marking on the raw material film, an identification index code of the raw material film is generated, a composite physical feature mark is obtained based on the identification index code of the raw material film, and the composite physical feature mark is printed onto the surface of the raw material film to obtain the marked material film.

[0007] Further, in step S3, when the marked material film is subjected to microwave-laser synergistic irradiation, the microwave frequency is selected to obtain the target microwave, and the marked material film is irradiated with the target microwave to obtain the softened material film. At the same time, a picosecond laser pulse is emitted. The picosecond laser pulse passes through the titanium dioxide metasurface array to obtain the target structure light. The target structure light is irradiated onto the softened material film and irradiation is stopped after a preset time length to obtain the irradiated material film.

[0008] Further, in step S4, a cutting path is planned for the irradiated material film according to a cutting path planning method, the cutting path planning method including: Step A01: Use a quantum entanglement light source to generate entangled photon pairs, which include signal photons and idle photons. Inject the signal photons into the interior of the irradiated material film and use the idle photons as a reference. Step A02: Collect the change in the coincidence count rate of signal photons and idle photons, and obtain the three-dimensional coordinate distribution map of material defects based on the change in the coincidence count rate; Step A03: Preset the minimum safe distance threshold and path optimization target, and encode the three-dimensional coordinate distribution map of material defects, the minimum safe distance threshold and the path optimization target into a quadratic unconstrained binary optimization model; Step A04: Input the quadratic unconstrained binary optimization model into the quantum annealing machine for solution and output the spin configuration sequence; Step A05: Decode and sort the spin configuration sequence to generate the target cutting path.

[0009] Furthermore, in step S5, target cutting data is acquired, including cutting pressure, acoustic emission signal, optical reflection intensity, and processing area temperature; In step S6, a cutting control model is constructed, and when the irradiated material film is cut by the cutting control model according to the target cutting data and the target cutting path, the target cutting data is input into the cutting control model. The cutting control model updates the synaptic weights according to the peak time-dependent plasticity rule and generates dynamic control parameters. The composite energy field processing head is driven to cut the irradiated material film according to the target cutting path and the dynamic control parameters to obtain the target flexible protective film.

[0010] Furthermore, in step S7, when the target flexible protective film is scanned using terahertz imaging technology, the target flexible protective film is scanned using a compressed sensing terahertz time-domain spectroscopy system to obtain three-dimensional dielectric constant distribution data. The average dielectric constant is obtained based on the three-dimensional dielectric constant distribution data, and the average dielectric constant is output as the dielectric performance value Ys.

[0011] Further, in step S7, the dielectric performance value Ys is compared with the preset dielectric performance value Ys0. Based on the comparison result, the degree of compliance of the dielectric performance value is judged, and the microwave-laser synergistic irradiation process is optimized based on the judgment result, wherein: When Ys≤Ys0, the dielectric performance value is deemed to meet the standard, and no irradiation optimization is performed on the microwave-laser synergistic irradiation process. When Ys > Ys0, the dielectric performance value is determined to be substandard. The microwave-laser irradiation process is optimized by extending the preset time by 2 seconds and repeating steps S4 to S7. When the dielectric performance value is still substandard, the target flexible protective film is marked as abnormal and the quality traceability process is triggered.

[0012] Further, in step S8, when acquiring the profile arithmetic mean deviation Ra, edge extraction is performed on the three-dimensional dielectric constant distribution data to obtain a three-dimensional surface model of the cut edge, and the profile arithmetic mean deviation Ra is calculated along a specific evaluation length of the three-dimensional surface model of the cut edge according to the ISO 4287 standard.

[0013] Further, in step S8, the arithmetic mean deviation of the contour Ra ​​is compared with the preset arithmetic mean deviation of the contour Ra0. Based on the comparison result, the state of the arithmetic mean deviation of the contour is determined, and based on the determination result, the cutting process of the irradiated material film is virtually calibrated, wherein: When Ra≤Ra0, the state of the profile arithmetic mean deviation is determined to be smooth, and no virtual calibration is performed on the cutting process of the material film after irradiation; When Ra > Ra0, the state of the profile arithmetic mean deviation is determined to be rough, and virtual calibration is performed on the cutting process of the irradiated material film.

[0014] Furthermore, in step S9, a final NFT is generated based on the target flexible protective film, and the NFT is written into the blockchain.

[0015] Compared with the prior art, the beneficial effects of the present invention are as follows: the method selects a flexible protective film substrate made of polyimide as the raw material film in step S1, utilizing its robust and durable properties and its bendable and foldable characteristics to facilitate processing, thereby laying the foundation for improving signal transmission speed. The method also performs composite marking on the raw material film in step S2, combining film identity quantum dots, film DNA barcodes, and film identity graphene to achieve the uniqueness and non-replicability of the raw material film's identity from multiple dimensions, thus realizing precise, anti-counterfeiting, and reliable traceability of the raw material film throughout its entire lifecycle from production to use. In step S3, the marked material film is subjected to microwave-laser synergistic irradiation. Utilizing the coupling effect of microwave resonant softening and laser optical torque orientation, the molecular chains within the marked material film are neatly arranged, thereby improving the transmission rate of 5G signals. The method further utilizes quantum entanglement in step S4 to instantaneously calculate the target cutting path under complex constraints, pre-avoiding defects during cutting and achieving nearly 100% material utilization and zero-defect contact processing. This fundamentally eliminates batch quality problems and performance fluctuations caused by internal microscopic defects. The method also collects target cutting data in step S5. This method facilitates the feedback of real-time cutting status to the cutting control model, allowing for real-time matching of operational states to adjust the cutting method, thereby improving the environmental adaptability and robustness of the cutting process. Furthermore, step S6 utilizes the millisecond-level online learning capability of a spiking neural network to form a closed loop of perception, decision-making, and execution in the cutting process, enabling process parameters to adapt to changes in material micro-uniformity and tool state, thus ensuring consistent cutting quality at the molecular level. Step S7 also outputs dielectric performance values ​​to quantitatively assess the dielectric properties of the target flexible protective film. When the dielectric performance value fails to meet the standard, the cutting time is extended... The method presets the time length to improve the alignment of molecular chains in the irradiated material film. In step S8, the method also judges the state of the profile arithmetic mean deviation and performs virtual calibration of the cutting process of the irradiated material film through a digital twin model. This is to control the profile arithmetic mean deviation at an ultra-precise level, thereby improving the yield and tool life of the target flexible protective film. In step S9, the method creates a globally unique and tamper-proof digital identity file for each target flexible protective film, further realizing the full life cycle of reliable traceability from materials, production, testing to service data, and improving quality trust and traceability. Attached Figure Description

[0016] Figure 1 This is a schematic flowchart of the die-cutting process for the flexible protective film of a 5G signal PC substrate in this embodiment. Figure 2 This is a flowchart illustrating the cutting path planning method in this embodiment. Detailed Implementation

[0017] To make the objectives and advantages of the present invention clearer, the present invention will be further described below with reference to embodiments; it should be understood that the specific embodiments described herein are merely for explaining the present invention and are not intended to limit the present invention.

[0018] Preferred embodiments of the present invention will now be described with reference to the accompanying drawings. Those skilled in the art should understand that these embodiments are merely illustrative of the technical principles of the present invention and are not intended to limit the scope of protection of the present invention.

[0019] It should be noted that in the description of this invention, the terms "upper", "lower", "left", "right", "inner", "outer", etc., which indicate directions or positional relationships, are based on the directions or positional relationships shown in the accompanying drawings. This is only for the convenience of description and is not intended to indicate or imply that the device or element must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, it should not be construed as a limitation of this invention.

[0020] Furthermore, it should be noted that, in the description of this invention, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "linking" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this invention according to the specific circumstances.

[0021] Please see Figure 1 The diagram shown is a flowchart illustrating the die-cutting process for a flexible protective film on a 5G signal PC substrate according to this embodiment. The method includes: Step S1: Obtain the raw material film; Step S2: Perform composite marking on the raw material film to obtain the marked material film; Step S3: The marked material film is subjected to microwave-laser synergistic irradiation to obtain the irradiated material film; Step S4: Plan the cutting path of the irradiated material film according to the cutting path planning method to obtain the target cutting path; Step S5: Collect target cutting data; Step S6: Construct a cutting control model, and use the cutting control model to cut the irradiated material film according to the target cutting data and the target cutting path to obtain the target flexible protective film. Step S7: The performance of the target flexible protective film is scanned by terahertz imaging technology to obtain dielectric performance values, and the irradiation process of microwave-laser synergistic irradiation is optimized based on the dielectric performance values. Step S8: Obtain the arithmetic mean deviation of the profile, and perform virtual calibration on the cutting process of the irradiated material film based on the arithmetic mean deviation of the profile. Step S9: Generate an NFT based on the target flexible protective film and write the NFT into the blockchain.

[0022] Specifically, the die-cutting method for flexible protective films on 5G signal PC substrates is applied to processing control equipment for flexible protective films on 5G signal PC substrates. In step S1, the method selects the raw material film as a flexible protective film substrate made of polyimide, utilizing its robust, durable, and bendable properties for easy processing, thus laying the foundation for improving signal transmission speed. In step S2, the method further performs composite marking on the raw material film, combining film identity quantum dots, film DNA barcodes, and film identity graphene to achieve the uniqueness and non-replicability of the raw material film's identity from multiple dimensions, thereby realizing the transformation of the raw material film from production to... The method provides precise, anti-counterfeiting, and reliable traceability throughout its entire lifecycle. In step S3, the marked material film undergoes microwave-laser synergistic irradiation. Utilizing the coupling effect of microwave resonant softening and laser optical torque orientation, the molecular chains within the marked material film are neatly arranged, thereby improving the transmission rate of 5G signals. In step S4, the method utilizes quantum entanglement to instantaneously calculate the target cutting path under complex constraints, pre-avoiding defects during cutting and achieving nearly 100% effective material utilization and zero-defect contact processing. This fundamentally eliminates batch quality problems and performance fluctuations caused by internal microscopic defects. The method also... Step S5 collects target cutting data to feed the real-time cutting status back to the cutting control model, matching the operation status in real time to adjust the cutting method, thereby improving the environmental adaptability and robustness of the cutting. Step S6 further utilizes the millisecond-level online learning capability of a spiking neural network to form a closed loop of perception, decision-making, and execution in the cutting process, enabling process parameters to adapt to changes in material micro-uniformity and tool state, thus ensuring consistent cutting quality at the molecular level. Step S7 outputs dielectric performance values ​​to quantitatively judge the dielectric properties of the target flexible protective film. The method also outputs dielectric performance values ​​to determine the degree to which the dielectric performance values ​​meet the standards. If the standard is not met, the preset time length is extended to improve the neatness of the molecular chain arrangement in the irradiated material film. The method also judges the state of the profile arithmetic mean deviation in step S8, and performs virtual calibration of the cutting process of the irradiated material film through a digital twin model, so as to control the profile arithmetic mean deviation at an ultra-precision level, thereby improving the yield and tool life of the target flexible protective film. The method also creates a globally unique and tamper-proof digital identity file for each target flexible protective film in step S9, further realizing the full life cycle reliable traceability from materials, production, testing to service data, and improving quality trust and traceability.

[0023] Specifically, in step S1, the raw material film is obtained.

[0024] Specifically, the raw material film refers to a flexible protective film substrate made of polyimide and used to protect 5G circuit boards, with a thickness of 50 µm, such as a polyimide film.

[0025] Specifically, in step S1, the raw material film is selected as a flexible protective film substrate made of polyimide. Its robust and durable properties, as well as its bendable and foldable characteristics, facilitate processing, thereby laying the foundation for improving the speed of signal transmission.

[0026] Specifically, in step S2, when performing composite marking on the raw material film, an identification index code of the raw material film is generated, a composite physical feature mark is obtained based on the identification index code of the raw material film, and the composite physical feature mark is printed onto the surface of the raw material film to obtain the marked material film.

[0027] Specifically, the identity index code of the raw material film refers to a unique, purely digital identity identifier that can accurately retrieve all relevant data of the raw material film in the blockchain. All relevant data of the raw material film refers to the entire process data related to the raw material film from entering the production line to generating the NFT and writing it into the blockchain, such as the material batch number and the timestamp of entering the production line. This embodiment does not limit the specific method of generating the identity index code of the raw material film; those skilled in the art can freely choose according to actual needs. For example, all relevant data of the raw material film can be input into a preset encrypted hash function, such as SHA-256, to obtain the hash value output by the encrypted hash function, and the hash value can be used as the identity index code of the raw material film. SHA-256 refers to a 256-bit Secure Hash Algorithm. The 256-bit composite physical feature marker includes thin-film identity quantum dots, thin-film DNA barcodes, and thin-film identity graphene. The thin-film identity quantum dots are optical beacons that emit unique and specific fluorescent colors and intensities to represent the identity index code of the raw material film. The thin-film DNA barcodes are preset base sequence codes used to represent the identity index code of the raw material film. The thin-film identity graphene is a Raman spectral tag used to represent the identity index code of the raw material film. In this embodiment, the thin-film identity quantum dots, thin-film DNA barcodes, and thin-film identity graphene are assembled by bio-covalent bonding to obtain the composite physical feature marker. This embodiment does not limit the specific method of printing the composite physical feature marker onto the surface of the raw material film. Those skilled in the art can freely choose according to actual needs, such as printing using a printhead array based on the principle of electro-jet printing and equipped with an independent ink path.

[0028] Specifically, in step S2, by composite marking the raw material film, the film identity quantum dots, film DNA barcode and film identity graphene are combined to realize the uniqueness and non-replicability of the raw material film identity in multiple dimensions, thereby realizing accurate, anti-counterfeiting and reliable traceability of the raw material film throughout its entire life cycle from production to use.

[0029] Specifically, in step S3, when the marked material film is subjected to microwave-laser synergistic irradiation, the microwave frequency is selected to obtain the target microwave, and the marked material film is irradiated with the target microwave to obtain the softened material film. At the same time, a picosecond laser pulse is emitted. The picosecond laser pulse passes through the titanium dioxide metasurface array to obtain the target structure light. The target structure light is irradiated onto the softened material film and irradiation is stopped after a preset time length to obtain the irradiated material film.

[0030] Specifically, microwaves refer to the electromagnetic spectrum between radio waves and infrared radiation, with frequencies typically between 300 MHz and 300 GHz. Frequency selection refers to the process of choosing the microwave frequency. In this embodiment, based on the polyimide material of the raw material film, experimental measurements show that a microwave frequency of 24.125 GHz avoids interference with industrial, scientific, and medical frequency bands and can penetrate a 50µm thick marked material film. Therefore, this embodiment selects a microwave frequency of 24.125 GHz. The target microwave refers to a frequency of 24.125 GHz. The microwave frequency is GHz. The picosecond laser pulse refers to a laser that emits green ultrashort pulses with a wavelength of 532 nm, a pulse width of 10 picoseconds, a single pulse energy of 1 microjoule, and a repetition frequency of 1000 Hz. The titanium dioxide metasurface array refers to a two-dimensional structure consisting of multiple titanium dioxide nanopillars arranged on a planar substrate. This embodiment does not limit the choice of the planar substrate, such as glass or silicon wafer. This embodiment obtains the arrangement of nanopillars of the titanium dioxide metasurface array through a titanium dioxide metasurface array acquisition method. The titanium dioxide metasurface array acquisition method includes: setting the refractive target, such as achieving the molecular chain of polyimide. The optical field angular momentum distribution necessary for highly ordered alignment along the 100 crystal orientation is determined using electromagnetic field simulation software. The optimal shape, such as an ellipse or H-shape, along with the rotation angle and size, of the titanium dioxide nanopillars on the planar substrate is derived based on the refraction target. This is then etched onto the titanium dioxide thin film using electron beam lithography to obtain a titanium dioxide metasurface array. The target structured light refers to the structured light with a specific angular momentum obtained after a picosecond laser pulse passes through the titanium dioxide metasurface array. The preset time length refers to the pre-set irradiation time of the softened material film. In this embodiment, the preset time length is set to 3 seconds based on experimental measurements.

[0031] Specifically, in step S3, by subjecting the labeled material film to microwave-laser synergistic irradiation, the molecular chains inside the labeled material film are neatly arranged by utilizing the coupling effect of microwave resonant softening and laser optical torque orientation, so as to reduce the dielectric constant and thereby improve the transmission rate of 5G signals.

[0032] Specifically, in step S4, the cutting path of the irradiated material film is planned according to the cutting path planning method to obtain the target cutting path.

[0033] Specifically, in step S5, target cutting data is collected, including cutting pressure, acoustic emission signal, optical reflection intensity, and processing area temperature.

[0034] Specifically, the cutting pressure refers to the force exerted on a unit area of ​​the irradiated material film by the cutting edge during the process of the tool cutting into and cutting the irradiated material film. In this embodiment, the cutting pressure is measured by a piezoelectric micro-force sensor. The acoustic emission signal refers to the acoustic signal generated when the internal strain energy of the irradiated material film is released in the form of transient elastic waves during micro-deformation or cracking, such as micro-crack propagation and grain fracture. In this embodiment, the acoustic emission signal is collected by a high-frequency acoustic emission sensor. The optical reflection intensity refers to the light intensity value of the reflected light after the picosecond laser pulse irradiates the cutting area. In this embodiment, the optical reflection intensity is collected by a photodetector. The processing area temperature refers to the real-time temperature of the contact point between the tool and the irradiated material film. In this embodiment, the processing area temperature is collected by a non-contact infrared thermal imager.

[0035] Specifically, in step S5, target cutting data is collected to feed back the real-time status during cutting to the cutting control model, and the cutting method is adjusted in real time to match the operation status, thereby improving the environmental adaptability and robustness of cutting.

[0036] Specifically, in step S6, a cutting control model is constructed, and when the irradiated material film is cut by the cutting control model according to the target cutting data and the target cutting path, the target cutting data is input into the cutting control model. The cutting control model updates the synaptic weights according to the peak time-dependent plasticity rule and generates dynamic control parameters. The composite energy field processing head is driven to cut the irradiated material film according to the target cutting path and the dynamic control parameters to obtain the target flexible protective film.

[0037] Specifically, the cutting control model refers to a memristor-based pulse neural network controller that takes target cutting data as input data and dynamic control parameters as output data. It contains multiple neurons and synaptic connections. The dynamic control parameters include cutting speed, tool entry angle, ultrasonic vibration frequency, and laser-assisted power. The laser-assisted power refers to the real-time output power of the pulsed laser beam synchronously emitted from the composite energy field processing head to assist the cutting process.

[0038] Specifically, in step S6, the millisecond-level online learning capability of the spiking neural network is used to form a closed loop of perception, decision-making and execution in the cutting process, so that the process parameters can adapt to the microscopic inhomogeneity of the material and the changes in the state of the tool, thereby ensuring the consistency of cutting quality at the molecular level.

[0039] Specifically, in step S7, when the target flexible protective film is scanned using terahertz imaging technology, the target flexible protective film is scanned using a compressed sensing terahertz time-domain spectroscopy system to obtain three-dimensional dielectric constant distribution data. The average dielectric constant is obtained based on the three-dimensional dielectric constant distribution data, and the average dielectric constant is output as the dielectric performance value Ys.

[0040] Specifically, the three-dimensional dielectric constant distribution data refers to a structured dataset organized in the form of a three-dimensional grid, output by a compressed sensing terahertz time-domain spectroscopy system, where each voxel corresponds to a complex dielectric constant value, and the average dielectric constant refers to the arithmetic mean of all dielectric constants in the three-dimensional dielectric constant distribution data.

[0041] Specifically, in step S7, the dielectric performance value is output to monitor the dielectric performance of the target flexible protective film in real time, so that the system can make timely adaptive adjustments to ensure the performance of the target flexible protective film.

[0042] Specifically, in step S7, the dielectric performance value Ys is compared with the preset dielectric performance value Ys0. Based on the comparison result, the degree of compliance of the dielectric performance value is judged, and the microwave-laser synergistic irradiation process is optimized based on the judgment result, wherein: When Ys≤Ys0, the dielectric performance value is deemed to meet the standard, and no irradiation optimization is performed on the microwave-laser synergistic irradiation process. When Ys > Ys0, the dielectric performance value is determined to be substandard. The microwave-laser irradiation process is optimized by extending the preset time by 2 seconds and repeating steps S4 to S7. When the dielectric performance value is still substandard, the target flexible protective film is marked as abnormal and the quality traceability process is triggered.

[0043] Specifically, the preset dielectric property value refers to a preset value for optimizing the microwave-laser synergistic irradiation process. This embodiment does not limit the specific numerical setting of the preset dielectric property value; those skilled in the art can freely choose it according to actual needs. For example, based on the physical requirements of 5G millimeter-wave signal transmission, the intrinsic properties of polyimide materials, and the limits of process capability, Ys0 can be experimentally verified to determine Ys0=2.7 to achieve a balance between the performance and process capability of the target flexible protective film. When Ys0<2.7, it does not meet the limits of process capability; when Ys0>2.7, the performance of the target flexible protective film is not... This can easily lead to low 5G signal transmission efficiency. The degree of compliance of the dielectric performance value includes compliance and non-compliance. In this embodiment, the preset time length is extended by 2 seconds based on experimental measurements. When the preset time length is extended to 1 second, the change in dielectric constant is not obvious, resulting in insufficient adjustment force and wasting adjustment resources. After 2 seconds, the change in dielectric constant also tends to remain unchanged, and it consumes system processing time. Therefore, the extension step of the preset time length is set to 2 seconds. The quality traceability process refers to the process of tracing the entire process of the target flexible protective film from production to processing and performing quality verification based on the composite physical feature marks on the target flexible protective film.

[0044] Specifically, in step S7, the dielectric properties of the target flexible protective film are quantitatively judged by judging the degree of compliance of the dielectric property value. When the degree of compliance of the dielectric property value is not met, the preset time length is extended to improve the neatness of the molecular chain arrangement in the irradiated material film, thereby improving the performance of the target flexible protective film.

[0045] Specifically, in step S8, when acquiring the profile arithmetic mean deviation Ra, edge extraction is performed on the three-dimensional dielectric constant distribution data to obtain a three-dimensional surface model of the cutting edge, and the profile arithmetic mean deviation Ra is calculated along a specific evaluation length for the three-dimensional surface model of the cutting edge according to the ISO 4287 standard.

[0046] Specifically, edge extraction refers to the process of individually extracting the cut surface from the three-dimensional dielectric constant distribution data of the target flexible protective film. This embodiment does not limit the specific method of edge extraction, and those skilled in the art can freely choose according to actual needs. For example, the curved surface can be projected along the normal direction of the cutting path to generate a two-dimensional surface height map, where each pixel value represents the height of the point relative to the ideal plane. By utilizing the phase information of terahertz waves, the surface contour reconstruction accuracy of the two-dimensional surface height map is improved to the sub-micron level, and the two-dimensional surface height map is output as a three-dimensional surface model of the cut edge. The ISO 4287 standard refers to Geometrical Product Specifications - Surface texture: Profile method - Terms, definitions and surface texture parameters. The specific evaluation length refers to the ideal sampling length of the three-dimensional surface model of the cut edge obtained according to the ISO 4287 standard, and the specific evaluation length is 4.0 mm. In this embodiment, the arithmetic mean deviation of the contour is calculated along the specific evaluation length of the three-dimensional surface model of the cut edge through the arithmetic mean deviation evaluation of the contour.

[0047] Specifically, in step S8, the arithmetic mean deviation of the profile is obtained to assess the cutting roughness of the target flexible protective film surface in real time, so as to facilitate the subsequent adaptive calibration of the cutting process.

[0048] Specifically, in step S8, the arithmetic mean deviation of the contour Ra ​​is compared with the preset arithmetic mean deviation Ra0. Based on the comparison result, the state of the arithmetic mean deviation is determined, and based on the determination result, the cutting process of the irradiated material film is virtually calibrated, wherein: When Ra≤Ra0, the state of the profile arithmetic mean deviation is determined to be smooth, and no virtual calibration is performed on the cutting process of the material film after irradiation; When Ra > Ra0, the state of the profile arithmetic mean deviation is determined to be rough, and virtual calibration is performed on the cutting process of the irradiated material film.

[0049] Specifically, the profile arithmetic mean deviation refers to a numerical value used to quantify the degree of unevenness of the target flexible protective film's edge and surface at a microscale. The preset profile arithmetic mean deviation refers to a preset value for judging the state of the profile arithmetic mean deviation. In this embodiment, the specific evaluation length is 4.0 according to the ISO 4287 standard. The arithmetic mean deviation of the profile corresponding to mm is 0.8µm, so Ra0=0.8µm is set. The state of the arithmetic mean deviation of the profile refers to the edge roughness of the target flexible protective film reflected by the arithmetic mean deviation of the profile, including smoothness and roughness. The virtual calibration refers to the process of obtaining the optimal parameter combination that can make the edge roughness meet the standard through the joint digital twin model of the protective film-5G signal system. Specifically, the real-time processing data that causes the edge roughness to exceed the standard, including target cutting data, dynamic control parameters and the identity index code of the raw material film, are synchronously input into the joint digital twin model of the protective film-5G signal system. The joint digital twin model of the protective film-5G signal system reproduces the measured cutting process that exceeds the standard to obtain the cause of the roughness of the target flexible protective film. In the model, multivariate automatic optimization simulation is performed on the key process parameters to obtain the optimal parameter combination that can make the edge roughness meet the standard. The optimal parameter combination is then updated to the strategy library of the cutting control model. The joint digital twin model of the protective film-5G signal system refers to the digital twin model constructed based on the target flexible protective film.

[0050] Specifically, in step S8, the state of the profile arithmetic mean deviation is judged. When the state of the profile arithmetic mean deviation is rough, the cutting process of the irradiated material film is virtually calibrated through a digital twin model so as to control the profile arithmetic mean deviation at an ultra-precision level, thereby improving the yield of the target flexible protective film and the tool life.

[0051] Specifically, in step S9, a final NFT is generated based on the target flexible protective film, and the NFT is written into the blockchain.

[0052] Specifically, the final NFT refers to a digital rights certificate that integrates data from the entire process of generating the target flexible protective film. The NFT refers to a non-fungible token.

[0053] Specifically, in step S9, a final NFT is generated and written into the blockchain to create a globally unique and tamper-proof digital identity file for each target flexible protective film, enabling reliable traceability throughout the entire lifecycle from materials, production, testing to service data, thereby improving quality trust and traceability.

[0054] Please see Figure 2As shown, this is a flowchart illustrating the cutting path planning method of this embodiment. The cutting path planning method includes: Step A01: Use a quantum entanglement light source to generate entangled photon pairs, which include signal photons and idle photons. Inject the signal photons into the interior of the irradiated material film and use the idle photons as a reference. Step A02: Collect the change in the coincidence count rate of signal photons and idle photons, and obtain the three-dimensional coordinate distribution map of material defects based on the change in the coincidence count rate; Step A03: Preset the minimum safe distance threshold and path optimization target, and encode the three-dimensional coordinate distribution map of material defects, the minimum safe distance threshold and the path optimization target into a quadratic unconstrained binary optimization model; Step A04: Input the quadratic unconstrained binary optimization model into the quantum annealing machine for solution and output the spin configuration sequence; Step A05: Decode and sort the spin configuration sequence to generate the target cutting path.

[0055] Specifically, the three-dimensional coordinate distribution map of material defects refers to a digital three-dimensional model reconstructed from quantum detection results, which precisely marks the spatial location and size information of minute defects located below the surface of the irradiated material film and not detected by conventional optical methods, such as nanoscale voids, cracks, and impurities. This embodiment does not limit the specific representation method of the spatial location. Those skilled in the art can freely choose according to actual needs, such as by establishing a spatial rectangular coordinate system and representing the spatial location in coordinate form. The minimum safe distance threshold refers to the minimum physical interval that the tool center trajectory must maintain with any known defect location when planning the target cutting path, such as 20 micrometers. The path optimization target refers to the pre-set optimization target used to quantitatively measure the quality of a cutting path, such as taking the shortest total path length and the minimum number of turns as the path optimization target. The path sorting refers to connecting and sorting the spin configuration sequence into a physically continuous and reasonable tool center trajectory according to the principle of spatial adjacency.

[0056] Specifically, in step S4, the target cutting path is instantaneously calculated under complex constraints through quantum entanglement, so as to avoid defects in advance during cutting, achieve nearly 100% effective material utilization and zero-defect contact processing, and fundamentally eliminate batch quality problems and performance fluctuations caused by internal micro-defects.

[0057] The technical solution of the present invention has been described above with reference to the preferred embodiments shown in the accompanying drawings. However, it will be readily understood by those skilled in the art that the scope of protection of the present invention is obviously not limited to these specific embodiments. Without departing from the principles of the present invention, those skilled in the art can make equivalent changes or substitutions to the relevant technical features, and the technical solutions after these changes or substitutions will all fall within the scope of protection of the present invention.

Claims

1. A die-cutting method for a flexible protective film on a 5G signal PC substrate, characterized in that, The method includes: Step S1: Obtain the raw material film; Step S2: Perform composite marking on the raw material film to obtain the marked material film; Step S3: The marked material film is subjected to microwave-laser synergistic irradiation to obtain the irradiated material film; Step S4: Plan the cutting path of the irradiated material film according to the cutting path planning method to obtain the target cutting path; Step S5: Collect target cutting data; Step S6: Construct a cutting control model, and use the cutting control model to cut the irradiated material film according to the target cutting data and the target cutting path to obtain the target flexible protective film. Step S7: The performance of the target flexible protective film is scanned by terahertz imaging technology to obtain dielectric performance values, and the irradiation process of microwave-laser synergistic irradiation is optimized based on the dielectric performance values. Step S8: Obtain the arithmetic mean deviation of the profile, and perform virtual calibration on the cutting process of the irradiated material film based on the arithmetic mean deviation of the profile. Step S9: Generate an NFT based on the target flexible protective film and write the NFT into the blockchain.

2. The die-cutting method for a flexible protective film for a 5G signal PC substrate according to claim 1, characterized in that, In step S2, when performing composite marking on the raw material film, an identification index code of the raw material film is generated, a composite physical feature mark is obtained based on the identification index code of the raw material film, and the composite physical feature mark is printed onto the surface of the raw material film to obtain the marked material film.

3. The die-cutting method for a flexible protective film for a 5G signal PC substrate according to claim 2, characterized in that, In step S3, when the marked material film is subjected to microwave-laser synergistic irradiation, the microwave frequency is selected to obtain the target microwave. The marked material film is irradiated with the target microwave to obtain a softened material film. At the same time, a picosecond laser pulse is emitted. The picosecond laser pulse passes through the titanium dioxide metasurface array to obtain the target structured light. The target structured light is irradiated onto the softened material film and irradiation is stopped after a preset time length to obtain the irradiated material film.

4. The die-cutting method for a flexible protective film for a 5G signal PC substrate according to claim 3, characterized in that, In step S4, a cutting path is planned for the irradiated material film according to a cutting path planning method, the cutting path planning method including: Step A01: Use a quantum entanglement light source to generate entangled photon pairs, which include signal photons and idle photons. Inject the signal photons into the interior of the irradiated material film and use the idle photons as a reference. Step A02: Collect the change in the coincidence count rate of signal photons and idle photons, and obtain the three-dimensional coordinate distribution map of material defects based on the change in the coincidence count rate; Step A03: Preset the minimum safe distance threshold and path optimization target, and encode the three-dimensional coordinate distribution map of material defects, the minimum safe distance threshold and the path optimization target into a quadratic unconstrained binary optimization model; Step A04: Input the quadratic unconstrained binary optimization model into the quantum annealing machine for solution and output the spin configuration sequence; Step A05: Decode and sort the spin configuration sequence to generate the target cutting path.

5. The die-cutting method for a flexible protective film for a 5G signal PC substrate according to claim 4, characterized in that, In step S5, target cutting data is collected, including cutting pressure, acoustic emission signal, optical reflection intensity, and processing area temperature. In step S6, a cutting control model is constructed, and when the irradiated material film is cut by the cutting control model according to the target cutting data and the target cutting path, the target cutting data is input into the cutting control model. The cutting control model updates the synaptic weights according to the peak time-dependent plasticity rule and generates dynamic control parameters. The composite energy field processing head is driven to cut the irradiated material film according to the target cutting path and the dynamic control parameters to obtain the target flexible protective film.

6. The die-cutting method for a flexible protective film for a 5G signal PC substrate according to claim 5, characterized in that, In step S7, when the target flexible protective film is scanned using terahertz imaging technology, the target flexible protective film is scanned using a compressed sensing terahertz time-domain spectroscopy system to obtain three-dimensional dielectric constant distribution data. The average dielectric constant is obtained based on the three-dimensional dielectric constant distribution data, and the average dielectric constant is output as the dielectric performance value Ys.

7. The die-cutting method for a flexible protective film for a 5G signal PC substrate according to claim 6, characterized in that, In step S7, the dielectric property value Ys is compared with the preset dielectric property value Ys0. Based on the comparison result, the degree of compliance of the dielectric property value is judged, and the microwave-laser synergistic irradiation process is optimized based on the judgment result, wherein: When Ys≤Ys0, the dielectric performance value is deemed to meet the standard, and no irradiation optimization is performed on the microwave-laser synergistic irradiation process. When Ys > Ys0, the dielectric performance value is determined to be substandard. The microwave-laser irradiation process is optimized by extending the preset time by 2 seconds and repeating steps S4 to S7. When the dielectric performance value is still substandard, the target flexible protective film is marked as abnormal and the quality traceability process is triggered.

8. The die-cutting method for a flexible protective film for a 5G signal PC substrate according to claim 7, characterized in that, In step S8, when acquiring the profile arithmetic mean deviation Ra, edge extraction is performed on the three-dimensional dielectric constant distribution data to obtain a three-dimensional surface model of the cutting edge. The profile arithmetic mean deviation Ra is calculated along a specific evaluation length of the three-dimensional surface model of the cutting edge according to the ISO 4287 standard.

9. The die-cutting method for a flexible protective film for a 5G signal PC substrate according to claim 8, characterized in that, In step S8, the arithmetic mean deviation of the contour Ra ​​is compared with the preset arithmetic mean deviation Ra0. Based on the comparison result, the state of the arithmetic mean deviation is determined, and based on the determination result, the cutting process of the irradiated material film is virtually calibrated, wherein: When Ra≤Ra0, the state of the profile arithmetic mean deviation is determined to be smooth, and no virtual calibration is performed on the cutting process of the material film after irradiation; When Ra > Ra0, the state of the profile arithmetic mean deviation is determined to be rough, and virtual calibration is performed on the cutting process of the irradiated material film.

10. The die-cutting method for a flexible protective film for a 5G signal PC substrate according to claim 9, characterized in that, In step S9, a final NFT is generated based on the target flexible protective film, and the NFT is written into the blockchain.

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