Dispensing insulation method and system for 3D printed circuits

Abstract

The application discloses a dispensing insulation method and system for 3D printed circuits, the method comprising model analysis and path planning, wire laying, dispensing operation, curing treatment and subsequent wire laying, and the system comprising a modeling and planning unit, a 3D printing unit, a dispensing unit, a curing unit and a control unit. The application uses non-insulated bare metal wires as printing materials, pre-identifies intersection points, and uses a dispensing needle to dispense insulating glue at the positions before laying wires pass through the intersection points, so as to form a local insulation layer, thereby omitting the process and materials of coating insulating paint, effectively reducing production cost, avoiding problems such as poor welding caused by incomplete paint removal or wire damage, improving the reliability of the connection point, reducing the paint removal process and shortening the production cycle, and the type of insulating glue can be flexibly selected according to requirements, and the thickness and shape of the glue layer can be accurately controlled through dispensing parameters, so that the flexibility is high.

Description

Technical Field

[0001] This invention relates to the field of 3D printed electronics, and more specifically, to a dispensing insulation method and system for 3D printed circuits. Background Technology

[0002] With the development of 3D printing technology, it has become possible to directly print embedded circuits (such as wireless charging coils, sensors, and antennas) on three-dimensional structural parts. Currently, a common technique is to use thin metal wires (such as enameled copper wires) as printing materials, and embed or lay the wires on the substrate through methods such as fusion bonding or adhesive fixation to form a three-dimensional circuit network.

[0003] Existing technologies typically employ enameled wires fully encased in insulating varnish. The advantage of this approach is that the insulating varnish itself prevents short circuits regardless of how the conductors cross or overlap in three-dimensional space. However, this method has significant drawbacks: high cost and material waste. The entire conductor needs to be insulated, increasing material costs. For circuit structures requiring insulation only at a few points, this is an over-treatment, resulting in unnecessary material waste. Subsequent processes are cumbersome and prone to introducing defects. At the points where the circuit needs to make electrical connections with external components (such as soldering), the insulating varnish on the surface of the enameled wire must be removed beforehand. Varnish removal processes typically include scraping, laser ablation, or chemical treatment, which are cumbersome and can easily damage the conductor itself or result in incomplete varnish removal, leading to reliability issues such as poor soldering and increased contact resistance. Furthermore, this method lacks manufacturing flexibility. This technical solution is a "one-size-fits-all" solution with full insulation, unable to be flexibly adjusted according to the actual needs of the circuit design (insulation only at intersections), lacking manufacturing flexibility.

[0004] Therefore, there is an urgent need in the field for a 3D printed circuit manufacturing solution that can achieve precise local insulation of wires to simplify the process, reduce costs and improve reliability. Summary of the Invention

[0005] The main objective of this invention is to provide a dispensing insulation method and system for 3D printed circuits. The method uses uninsulated bare metal wires as printing material. The software pre-identifies the intersections of the wires in the circuit model where short circuits may occur. Before laying the wires through these intersections, an integrated dispensing needle is used to precisely apply insulating adhesive at these locations to form a local insulating layer. This achieves precise local insulation of the wires, eliminating the need for full insulation and subsequent paint removal processes.

[0006] To achieve the above objectives, a dispensing insulation method for 3D printed circuits according to the present invention includes the following steps: S1: Model analysis and path planning; The target three-dimensional circuit model is imported into the printing control software. The control software analyzes the spatial trajectory of all wires in the three-dimensional circuit model, identifies all overlapping areas that are too close in the vertical direction and have a risk of short circuit, and generates a list of dispensing positions for each overlapping area. S2: Wire laying; controlling the print head of the 3D printing device, using non-insulated bare metal wires as printing material, and laying the lower layer of wires according to the planned printing path; S3: Dispensing operation; Before the 3D printing device lays the upper layer wires through the cross-overlapping area, control the dispensing mechanism integrated on the 3D printing device to move to the coordinate position of the cross point of the corresponding cross-overlapping area according to the dispensing position list, and apply insulating glue to the cross point. S4: Curing treatment; Curing treatment is performed on the dotted insulating adhesive to form a local insulating layer with a preset thickness at the intersection of the overlapping areas; S5: Subsequent wire laying; control the print head of the 3D printing device, continue to use non-insulated bare metal wires as printing material, and lay the upper wires on the surface of the local insulation layer according to the planned printing path to achieve electrical isolation between the lower and upper wires in the overlapping area.

[0007] Preferably, in step S1, the trajectories of all conductors in three-dimensional space are analyzed, the spatial distance between any two conductors is calculated, and the area where the spatial distance is less than a preset safety distance threshold and there is vertical projection overlap is determined as an overlapping area with short-circuit risk.

[0008] Preferably, the bare metal wire is a bare copper wire, a bare silver wire, or a bare alloy metal wire.

[0009] Preferably, in step S3, the insulating adhesive is applied by any one of spraying, contact dripping, or screw pump extrusion.

[0010] Preferably, the dispensing needle of the dispensing mechanism and the print head of the 3D printing device adopt a coaxial integrated structure. The movement trajectory of the dispensing needle and the print head are synchronized. After the print head lays the lower layer of wires, it can directly drive the dispensing needle to the corresponding intersection position to perform the dispensing operation.

[0011] Preferably, the insulating adhesive is any one of UV-curable insulating adhesive, thermosetting insulating adhesive, anaerobic curing insulating adhesive, and vulcanized silicone rubber insulating adhesive.

[0012] Preferably, when the insulating adhesive is a UV-curable insulating adhesive, the curing process in step S4 adopts a real-time curing method that is synchronized with the dispensing operation. After the dispensing at the cross points is completed, the insulating adhesive is irradiated with UV light for 0.5 to 10 seconds.

[0013] Preferably, before laying the lower layer of conductors in step S2 and / or before laying the subsequent conductors in step S5, the method further includes the following steps: applying adhesive to the conductor path or heating to melt and bond the conductors to the substrate to fix the conductors.

[0014] Preferably, for multi-layer three-dimensional circuits containing three or more layers of conductors, except for the initial lower layer conductors, the overlapping areas of each subsequent layer conductors with the previous layer conductors are sequentially subjected to the dispensing operation of step S3, the curing process of step S4, and the subsequent conductor laying of step S5 to complete the insulation treatment of the corresponding overlapping areas.

[0015] A dispensing insulation system for 3D printed circuits includes a modeling and planning unit, a 3D printing unit, a dispensing unit, a curing unit, and a control unit. The modeling and planning unit is used to import the three-dimensional circuit model and identify intersections, and generate collaborative instructions that include wire laying and dispensing sequence. The 3D printing unit is used to clamp and transport bare metal wires and move along a planned path to lay the wires. The dispensing unit is integrated into the 3D printing unit and is used to apply insulating material at specified coordinates according to the cooperative instructions. The curing unit is used to apply energy to the coated insulating material to cure it. The control unit is communicatively connected to the modeling and planning unit, the 3D printing unit, the dispensing unit, and the curing unit, respectively, and is used to coordinate the control of each unit to execute the dispensing insulation method for 3D printing circuits.

[0016] The advantages and beneficial effects of this invention are as follows: This invention uses uninsulated bare metal wires as printing material, pre-identifies the intersections in the circuit model where short circuits may occur, and applies insulating adhesive at these intersections using an integrated dispensing needle before laying the wires, forming a local insulating layer. This eliminates the need for full insulation coating of the entire wire, saving the process and materials of applying insulating varnish, effectively reducing production costs. Since the wires at the welding endpoints are in a bare metal state, problems such as poor welding caused by incomplete varnish removal or wire damage are avoided, improving the reliability of the connection points, reducing the varnish removal process, and shortening the production cycle. The type of insulating adhesive used in this invention can be flexibly selected according to requirements, and the thickness and shape of the adhesive layer can be precisely controlled through dispensing parameters, improving the compatibility and controllability of the process. Attached Figure Description

[0017] To more clearly illustrate the technical solutions in the embodiments of the present invention, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the accompanying drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0018] Figure 1 This is a flowchart of the dispensing insulation method for 3D printed circuits according to the present invention; Figure 2 This is a schematic diagram of the wire laying and dispensing process in the dispensing insulation method for 3D printed circuits according to the present invention. Figure 3 This is a schematic diagram of the subsequent wire laying process in the adhesive insulation method for 3D printed circuits according to the present invention. The labels in each of the attached figures are as follows: 1--3D printing device, 2--lower layer wires, 3--dispensing mechanism, 4--upper layer wires, 5--local insulation layer. Detailed Implementation

[0019] This invention discloses a dispensing insulation method and system for 3D printed circuits. It uses uninsulated bare metal wires as printing material. The software pre-identifies the intersections of the wires in the circuit model where short circuits may occur. Before laying the wires through these intersections, an integrated dispensing needle is used to precisely apply insulating glue at these locations to form a local insulating layer. This enables precise local insulation of the wires, eliminating the need for full insulation and subsequent paint removal processes.

[0020] The technical solutions of the embodiments of the present invention will be clearly and thoroughly described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of the present invention, and not all of them. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0021] Please see Figures 1 to 3 This invention provides a dispensing insulation method for 3D printed circuits, comprising the following steps: S1: Model analysis and path planning; The target three-dimensional circuit model is imported into the printing control software. The control software analyzes the spatial trajectory of all wires in the three-dimensional circuit model, identifies all overlapping areas that are too close in the vertical direction and have a risk of short circuit, and generates a list of dispensing positions for each overlapping area. In this step, the designed target 3D circuit model is imported into 3D printing-specific control software. The software analyzes and plans the spatial coordinates, direction, and interlayer relationships of all wires within the model. Using a spatial distance algorithm, the software automatically identifies overlapping areas where wires are too close together in the vertical direction, posing a direct contact short-circuit risk. It marks the 3D coordinates of each intersection point and generates a dispensing location list according to the printing sequence, providing precise positioning for subsequent dispensing operations. This process enables pre-identification and automatic positioning of short-circuit risk areas, avoiding omissions or errors from manual judgment. Pre-generating the dispensing location list enables digital and programmed precise control, laying the foundation for subsequent integrated printing. Furthermore, this step only plans insulation treatment for localized areas with genuine short-circuit risks, avoiding material waste and process redundancy caused by nationwide insulation.

[0022] S2: Wire laying; control the print head of the 3D printing device 1, using non-insulated bare metal wires as printing material, and lay the lower wires 2 according to the planned printing path; In this step, the 3D printing device 1 drives the print head to move along a preset trajectory according to the path planning results. Simultaneously, non-insulated bare metal wires are used as the conductive printing material, eliminating the need for pre-coating with an insulating layer, resulting in smoother wire extrusion and higher printing accuracy. During wiring, the lower layer wires 2 are deposited and formed on the substrate or the already printed structure, ensuring the positional accuracy, conductive continuity, and structural stability of the lower layer wires 2. The bare metal wires used in this step have a complete conductive cross-section, low contact resistance, and stable conductivity, which improves the electrical performance of the circuit. During laying, the lower layer wires 2 are laid first, i.e., the initial laying of the lower-layer wiring, providing a stable foundation structure for subsequent local insulation and cross-laying of the upper layer wires 4.

[0023] S3: Dispensing operation; Before the upper wire 4 passing through the cross-overlapping area is laid in the 3D printing device 1, the dispensing mechanism 3 integrated on the 3D printing device 1 is controlled to move to the coordinate position of the cross point of the corresponding cross-overlapping area according to the dispensing position list, and insulating glue is applied to the cross point. In this step, before the 3D printing device 1 begins printing the upper layer conductor 4 that crosses the overlapping area, the control software calls the dispensing position list generated by S1, driving the dispensing mechanism 3 to quickly move to the corresponding three-dimensional coordinates of the intersection point. Insulating adhesive is applied precisely and quantitatively at the intersection point of the lower layer conductor 2, completing the local insulation coating. The dispensing mechanism 3 is integrated with the 3D printing device 1, eliminating the need for secondary clamping and offline processing, and ensuring high positioning accuracy. Furthermore, by using a localized dispensing method, adhesive is applied only at the intersection point, resulting in minimal adhesive usage and significantly reducing material costs. This step completes the insulation coating before the upper layer conductor 4 is laid, fundamentally preventing direct contact and short circuits between the upper and lower layer conductors 2 from the outset.

[0024] S4: Curing treatment; Curing treatment is performed on the dotted insulating adhesive to form a local insulating layer 5 with a preset thickness at the intersection of the overlapping areas; In this step, the applied insulating adhesive undergoes a curing process. This can be achieved through heating, ultraviolet irradiation, or natural curing, allowing the insulating adhesive to quickly solidify and form a uniformly thick, controllable, and stable local insulating layer 5 at the intersection points. The thickness of this insulating layer meets the preset electrical clearance and withstand voltage requirements. After curing, a stable and reliable local insulating layer 5 is formed, providing clear and consistent electrical isolation. The controllable thickness of the cured insulating layer ensures insulation safety without excessively raising the height of the upper conductor 4, maintaining the overall structural compactness. Because this invention employs local insulation, the area and range of the insulating layer are controllable, and the local curing speed is fast, without significantly increasing the overall printing time, thus ensuring the efficiency of continuous 3D printing operations.

[0025] S5: Subsequent wire laying; control the print head of the 3D printing device 1, continue to use non-insulated bare metal wires as printing material, and lay the upper wire 4 on the surface of the local insulation layer 5 according to the planned printing path to achieve electrical isolation between the lower wire 2 and the upper wire 4 in the overlapping area.

[0026] In this step, after the local insulation layer 5 has cured, the 3D printing device 1 resumes the wire printing process. The print head continues to use uninsulated bare metal wires, and according to a preset path, the upper wire 4 is directly laid on top of the local insulation layer 5, so that the upper wire 4 and the lower wire 2 are physically and electrically isolated through the local insulation layer 5, thereby completing the printing of the three-dimensional cross structure circuit. The advantage of this step is that the upper wire 4 still uses bare metal wires, maintaining consistency in the printing process and excellent conductivity. Furthermore, local insulation at the intersection does not affect heat dissipation or structural strength in other areas of the wire. The method provided by this invention enables high-density wiring with three-dimensional crossover of wires that do not short-circuit, breaking through the limitations of traditional planar circuit layouts.

[0027] This invention addresses the core problem of short circuits easily occurring when upper and lower layer wires (2) intersect during the 3D printing of three-dimensional circuits. Utilizing software algorithms, it pre-locates areas of intersecting wires in the 3D circuit where vertical distances are too close, posing a short-circuit risk. Insulation is applied only to these localized areas. A thin local insulating layer (5) is formed at the intersection point through dispensing and curing, physically separating the upper and lower bare wires and achieving local electrical isolation. By layering the lower layer wires (2), the local insulating layer (5), and the upper layer wires (4) in a specific order, short circuits in the three-dimensional intersecting wires are avoided at the source without covering the entire wire with an insulating layer, while simultaneously considering printing efficiency, material cost, and circuit conductivity.

[0028] Preferably, in step S1, the trajectories of all wires in three-dimensional space are analyzed, the spatial distance between any two wires is calculated, and areas where the spatial distance is less than a preset safety distance threshold and there is vertical projection overlap are identified as overlapping areas with short-circuit risk. In this embodiment, when judging overlapping areas, both spatial distance and vertical projection overlap are considered, rather than a single dimension. Only when the spatial distance between two wires is less than the preset safety distance threshold (meeting the physical conditions for a short circuit) and their vertical projections overlap (forming a three-dimensional intersection, rather than planar misalignment), is it identified as a risk area. This avoids misjudgment due to simple proximity (no projection overlap, no actual intersection) and also eliminates invalid judgments due to projection overlap but sufficient distance (no short-circuit risk), ensuring the accuracy of risk identification. Furthermore, by setting a preset safety distance threshold, the threshold parameters can be flexibly adjusted according to the actual needs of the 3D printed circuit, such as wire specifications, operating voltage, and insulating adhesive performance, adapting to the short-circuit protection needs of different types of three-dimensional circuits, thus enhancing versatility.

[0029] Preferably, the bare metal wire is bare copper wire, bare silver wire, or bare alloy metal wire. Bare copper wire, bare silver wire, and bare alloy metal wire are all high conductivity materials with low resistivity and strong current carrying capacity, which can effectively reduce wire resistance and heat generation, meet the stringent conductivity requirements of 3D printed circuits, and ensure stable and reliable circuit operation.

[0030] Preferably, in step S3, the insulating adhesive is applied using any one of spraying, contact dripping, or screw pump extrusion. In this embodiment, three application methods can be flexibly selected according to actual working conditions to cover different dispensing requirements. For example, for applications that do not require contact with the underlying conductor 2 and are suitable for high-precision, low-dose dispensing, spraying can be used. This method allows for precise control of droplet size, is suitable for thin conductors and dense intersections, and avoids damage to the surface of bare metal conductors. Contact dripping provides stable adhesive volume control, is suitable for high-viscosity insulating adhesives, adheres to the surface of intersections, and improves the bonding force between the insulating adhesive and the conductor. Screw pump extrusion provides uniform and continuous output flow, is suitable for high-dose dispensing scenarios, and can quickly form an insulating layer of a preset thickness, improving dispensing efficiency. Multiple methods are available, expanding the applicability of the solution and adapting to different conductor specifications, adhesive characteristics, and dispensing accuracy requirements.

[0031] Preferably, the dispensing needle of the dispensing mechanism 3 and the print head of the 3D printing device 1 adopt a coaxial integrated structure. The movement trajectory of the dispensing needle and the print head are synchronized. After the print head lays the lower layer of wires 2, it can directly drive the dispensing needle to the corresponding intersection position for dispensing. In this embodiment, the coaxial integrated structure keeps the relative position of the dispensing needle and the print head fixed and their movement trajectories completely synchronized. After the print head lays the lower layer of wires 2, there is no need to recalibrate and reposition the dispensing position. It can directly drive the dispensing needle to the intersection point, avoiding the errors of misalignment between the independent dispensing equipment and the print head, and secondary clamping and positioning. This ensures that the dispensing position is accurately aligned with the wire intersection point, avoiding glue overflow, glue leakage or dispensing deviation, and ensuring the accurate forming of the local insulating layer 5.

[0032] Preferably, the insulating adhesive is any one of UV-curable insulating adhesive, thermosetting insulating adhesive, anaerobic curing insulating adhesive, and vulcanized silicone rubber insulating adhesive.

[0033] Preferably, when the insulating adhesive is a UV-curable insulating adhesive, the curing process in step S4 adopts a real-time curing method synchronized with the dispensing operation. After the dispensing at the cross points is completed, the insulating adhesive is irradiated with UV light for 0.5~10 seconds. In this embodiment, Employing a real-time curing method synchronized with dispensing, UV curing is performed immediately after dispensing, eliminating the need for machine downtime, workpiece transfer, and offline secondary curing. This enables continuous and automated operation of the entire process, including wire laying, dispensing, curing, and upper-layer wire laying, resulting in more compact process connections that align with the integrated 3D printing process design.

[0034] Preferably, before laying the lower layer conductor 2 in step S2 and / or before laying the subsequent conductors in step S5, the following steps are further included: applying adhesive to the conductor path or heating to melt and bond the conductor to the substrate to fix the conductor. In this embodiment, applying adhesive or heating to melt and bond the conductor to the substrate before laying the lower layer conductor 2 and the subsequent upper layer conductor 4 can firmly fix the conductor when it is just formed, avoiding displacement or lifting during subsequent processes such as movement, dispensing, and curing. This ensures that the conductor trajectory in three-dimensional space is highly consistent with the planned path, improving the overall forming accuracy of the circuit.

[0035] Preferably, for multi-layer three-dimensional circuits containing three or more layers of conductors, except for the initial lower layer conductor 2, the overlapping areas of each subsequent layer of conductors with the previous layer of conductors are sequentially subjected to the dispensing operation of step S3, the curing process of step S4, and the subsequent conductor laying of step S5 to complete the insulation treatment of the corresponding overlapping areas.

[0036] In this embodiment, for multi-layer circuit structures, the overlapping areas of each subsequent layer of conductors with the previous layer are treated sequentially, layer by layer, with dispensing, curing, and conductor laying. This ensures that the intersections between any two adjacent conductors are locally insulated, achieving short-circuit risk prevention across all layers and intersections, resulting in higher circuit safety and reliability. The same dispensing process is reused in all layer intersection areas, ensuring consistent process logic and universal control programs. Increasing the number of layers does not require process refactoring; it only requires cyclical execution according to the plan, facilitating automation and mass production, and demonstrating strong process stability and reproducibility.

[0037] A dispensing insulation system for 3D printed circuits includes a modeling and planning unit, a 3D printing unit, a dispensing unit, a curing unit, and a control unit. The modeling and planning unit is used to import the three-dimensional circuit model and identify intersections, and generate collaborative instructions that include wire laying and dispensing sequence. The 3D printing unit is used to clamp and transport bare metal wires and move along a planned path to lay the wires. The dispensing unit is integrated into the 3D printing unit and is used to apply insulating material at specified coordinates according to the cooperative instructions. The curing unit is used to apply energy to the coated insulating material to cure it. The control unit is communicatively connected to the modeling and planning unit, the 3D printing unit, the dispensing unit, and the curing unit, respectively, and is used to coordinate the control of each unit to execute the dispensing insulation method for 3D printing circuits.

[0038] In this embodiment, the system integrates five core units: modeling and planning, 3D printing, dispensing, curing, and control. Its functions cover the entire process of model analysis, path planning, wire laying, local dispensing, insulation curing, and multi-layer continuous printing. No additional offline equipment is required, enabling integrated operation of 3D printed circuit insulation forming, significantly simplifying equipment layout and reducing production investment. The control unit communicates with the other four units, receiving coordinated instructions from the modeling and planning unit and synchronously controlling the action rhythm of the 3D printing, dispensing, and curing units. This ensures seamless connection between processes, avoids disjointed actions and timing errors, eliminates errors from manual coordination, and improves the overall automation and process consistency. The system structure can flexibly adapt to the production needs of two-layer or multi-layer 3D circuits. The modeling and planning unit can automatically plan the laying and dispensing sequence of multi-layer wires. The control unit can coordinate with each unit to execute the dispensing, curing, and wire laying processes layer by layer without reconstructing the system structure or replacing core units; only the coordinated instructions need to be adjusted, demonstrating strong scalability.

[0039] Furthermore, the dispensing unit includes a high-precision dispensing needle, a glue cartridge, a pressure controller, and a vision positioning module. The vision positioning module is used to calibrate the position of the wires and the position of the intersections before dispensing.

[0040] Furthermore, the curing unit is one of the following: ultraviolet LED point light source, miniature hot air generator, infrared heating lamp, or resistance heating element.

[0041] The advantages and beneficial effects of this invention are as follows: This invention uses uninsulated bare metal wires as printing material, pre-identifies the intersections in the circuit model where short circuits may occur, and applies insulating adhesive at these intersections using an integrated dispensing needle before laying the wires, forming a local insulating layer. This eliminates the need for full insulation coating of the entire wire, saving the process and materials of applying insulating varnish, effectively reducing production costs. Since the wires at the welding endpoints are in a bare metal state, problems such as poor welding caused by incomplete varnish removal or wire damage are avoided, improving the reliability of the connection points, reducing the varnish removal process, and shortening the production cycle. The type of insulating adhesive used in this invention can be flexibly selected according to requirements, and the thickness and shape of the adhesive layer can be precisely controlled through dispensing parameters, improving the compatibility and controllability of the process.

Claims

1. A dispensing insulation method for 3D printed circuits, characterized in that, It includes the following steps: S1: Model analysis and path planning; The target three-dimensional circuit model is imported into the printing control software. The control software analyzes the spatial trajectory of all wires in the three-dimensional circuit model, identifies all overlapping areas that are too close in the vertical direction and have a risk of short circuit, and generates a list of dispensing positions for each overlapping area. S2: Wire laying; control the print head of the 3D printing device (1), use non-insulated bare metal wires as printing material, and lay the lower wires (2) according to the planned printing path. S3: Dispensing operation; Before the 3D printing device lays the upper wire (4) through the cross-over area, control the dispensing mechanism (3) integrated on the 3D printing device to move to the coordinate position of the cross point of the corresponding cross-over area according to the dispensing position list, and apply insulating glue to the cross point; S4: Curing treatment; Curing treatment is performed on the applied insulating adhesive to form a local insulating layer with a preset thickness at the intersection of the overlapping areas (5). S5: Subsequent wire laying; control the print head of the 3D printing device, continue to use non-insulated bare metal wires as printing material, and lay the upper wires on the surface of the local insulation layer according to the planned printing path to achieve electrical isolation between the lower and upper wires in the overlapping area.

2. The dispensing insulation method for 3D printed circuits according to claim 1, characterized in that, In step S1, the trajectories of all conductors in three-dimensional space are analyzed, the spatial distance between any two conductors is calculated, and the area where the spatial distance is less than a preset safety distance threshold and there is vertical projection overlap is identified as an overlapping area with short-circuit risk.

3. The dispensing insulation method for 3D printed circuits according to claim 1, characterized in that, The bare metal conductor is a bare copper wire, a bare silver wire, or a bare alloy metal wire.

4. The dispensing insulation method for 3D printed circuits according to claim 1, characterized in that, In step S3, the insulating adhesive is applied by any one of spraying, contact dripping, or screw pump extrusion.

5. The dispensing insulation method for 3D printed circuits according to claim 1, characterized in that, The dispensing needle of the dispensing mechanism and the print head of the 3D printing device adopt a coaxial integrated structure. The movement trajectory of the dispensing needle and the print head are synchronized. After the print head lays the lower layer of wires, it can directly drive the dispensing needle to the corresponding intersection position to perform the dispensing operation.

6. The dispensing insulation method for 3D printed circuits according to claim 1, characterized in that, The insulating adhesive is any one of UV-curable insulating adhesive, thermosetting insulating adhesive, anaerobic curing insulating adhesive, and vulcanized silicone rubber insulating adhesive.

7. The dispensing insulation method for 3D printed circuits according to claim 6, characterized in that, When the insulating adhesive is a UV-curable insulating adhesive, the curing process in step S4 adopts a real-time curing method that is synchronized with the dispensing operation. After the dispensing at the cross points is completed, the insulating adhesive is irradiated with UV light for 0.5 to 10 seconds.

8. The dispensing insulation method for 3D printed circuits according to claim 1, characterized in that, Before laying the lower layer of conductors in step S2 and / or before laying the subsequent conductors in step S5, the following steps are also included: applying adhesive to the conductor path or heating to melt and bond the conductors to the substrate to fix the conductors.

9. The dispensing insulation method for 3D printed circuits according to claim 1, characterized in that, For multi-layer three-dimensional circuits containing three or more layers of conductors, except for the initial lower layer conductors, each subsequent layer of conductors and the previous layer of conductors will sequentially perform the dispensing operation in step S3, the curing process in step S4, and the subsequent conductor laying in step S5 to complete the insulation treatment of the corresponding overlapping areas.

10. A dispensing insulation system for 3D printed circuits, used to perform the dispensing insulation method for 3D printed circuits according to any one of claims 1 to 9, characterized in that, It includes a modeling and planning unit, a 3D printing unit, an adhesive dispensing unit, a curing unit, and a control unit; The modeling and planning unit is used to import the three-dimensional circuit model and identify intersections, and generate collaborative instructions that include wire laying and dispensing sequence. The 3D printing unit is used to clamp and transport bare metal wires and move along a planned path to lay the wires. The dispensing unit is integrated into the 3D printing unit and is used to apply insulating material at specified coordinates according to the cooperative instructions. The curing unit is used to apply energy to the coated insulating material to cure it. The control unit is communicatively connected to the modeling and planning unit, the 3D printing unit, the dispensing unit, and the curing unit, respectively, and is used to coordinate the control of each unit to execute the dispensing insulation method for 3D printing circuits.

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