Photoresist coating pretreatment method

Abstract

The application provides a photoresist coating pretreatment method, comprising the following steps: introducing N-methyl pyrrolidone into selected photoresist conveying pipelines to bubble the pipelines and spraying according to a first preset frequency; introducing photoresist diluent into the photoresist conveying pipelines to bubble the pipelines and spraying according to a second preset frequency; introducing photoresist into the photoresist conveying pipelines to bubble and exhaust the pipelines and spraying according to a third preset frequency; after the photoresist spraying, spraying the photoresist onto a test substrate to obtain an automatic coating result of the test substrate; judging whether the automatic coating result of the test substrate meets the requirements; if not, continuing to execute the photoresist spraying, automatic coating and judging steps until the automatic coating result of the test substrate meets the requirements; if yes, ending the photoresist coating pretreatment. In this way, the amount of photoresist can be greatly saved during the photoresist installation process, and the cost can be significantly reduced.

Description

Technical Field

[0001] This invention relates to the field of integrated circuit manufacturing technology, and more specifically to a photoresist coating pretreatment method. Background Technology

[0002] In the manufacturing process of integrated circuits (ICs), photolithography is a crucial module, and photoresist is one of the key materials in photolithography technology and a core material in semiconductor manufacturing. Typically, photoresist is uniformly coated onto a substrate using a photoresist coating and developing machine (also known as a track). The working principle is as follows: a gallon bottle of photoresist is installed on the coating and developing machine stage, the tubing is connected, and the substrate to be coated is placed in the coating chamber (CUP). The back of the substrate is vacuum-held by a suction cup. Then, an electronic pump sprays the photoresist from the tubing onto the center of the substrate. Simultaneously, the suction cup rotates, causing the substrate to rotate at high speed, spreading the photoresist evenly onto the substrate. In existing technology, before the actual coating process, to ensure the photoresist quickly and thoroughly fills the tubing and fully wets the filter, a large amount of continuous photoresist air spraying is performed during the installation of the gallon bottle. The advantage is that the photoresist can be installed and used in a short time, but the disadvantage is that it consumes a large amount of photoresist, such as at least two to four bottles, resulting in very high costs.

[0003] It should be noted that the information disclosed in the background section of this application is intended only to enhance the understanding of the general background of this application, and should not be construed as an admission or in any way implying that the information constitutes prior art known to those skilled in the art. Summary of the Invention

[0004] To address the above technical problems, the present invention aims to provide a photoresist coating pretreatment method that can significantly reduce the amount of photoresist used before the formal coating of the substrate, thereby greatly reducing costs.

[0005] To achieve the above objectives, the present invention provides a photoresist coating pretreatment method, comprising the following steps:

[0006] S01: Introduce N-methylpyrrolidone into the selected photoresist delivery pipeline to bubble the tube, and spray the current photoresist delivery pipeline dry at the first preset frequency;

[0007] S02: Introduce photoresist diluent into the photoresist delivery pipeline after step S01 to bubble the pipeline, and then spray the current photoresist delivery pipeline at a second preset frequency.

[0008] S03: Introduce photoresist into the photoresist delivery pipeline after step S02 to remove air bubbles, and spray the current photoresist delivery pipeline with air at a third preset frequency.

[0009] S04: After using the photoresist air jet photoresist delivery pipeline, the photoresist is sprayed onto the test substrate to obtain the automatic coating result of the test substrate;

[0010] S05: Determine whether the automatic adhesive coating result of the test substrate meets the requirements;

[0011] If not, return to steps S03 to S05 until the automatic adhesive coating result of the test substrate meets the requirements;

[0012] If so, end the photoresist coating pretreatment.

[0013] Optionally, the step S05 of determining whether the automatic adhesive coating result of the test substrate meets the requirements includes the following steps:

[0014] Provide the results of manual adhesive application on the test substrate;

[0015] Based on the manual adhesive coating results of the test substrate, determine whether the film thickness and appearance of the automatic adhesive coating results of the test substrate meet the requirements.

[0016] If not, return to steps S03 to S05;

[0017] If yes, continue to determine whether the particles and defects in the automatic photoresist coating result of the test substrate meet the requirements. If no, return to steps S03 to S05. If yes, end the photoresist coating pretreatment.

[0018] Optionally, the total time for passing N-methylpyrrolidone into the photoresist delivery pipeline for bubble treatment in step S01 shall not be less than 48 hours.

[0019] Optionally, the total time for passing photoresist diluent into the photoresist delivery pipeline for soaking in step S02 shall not be less than 48 hours.

[0020] Optionally, the total time for air-spraying photoresist into the photoresist delivery pipeline in step S03 shall not be less than 24 hours.

[0021] Optionally, before step S01, the method further includes: installing a storage container containing N-methylpyrrolidone onto the photoresist delivery pipeline, connecting the storage container containing N-methylpyrrolidone to a pressurizing device, and then applying pressure to the storage container containing N-methylpyrrolidone through the pressurizing device to deliver N-methylpyrrolidone into the photoresist delivery pipeline.

[0022] Optionally, before step S02, the method further includes: removing the storage container containing N-methylpyrrolidone, installing the storage container containing the photoresist diluent onto the photoresist delivery pipeline, connecting the storage container containing the photoresist diluent to a pressurizing device, and then applying pressure to the storage container containing the photoresist diluent through the pressurizing device to deliver the photoresist diluent into the photoresist delivery pipeline.

[0023] Optionally, before step S03, the method further includes: removing the storage container containing the photoresist diluent, installing the storage container containing the photoresist onto the photoresist delivery pipeline, and connecting the storage container containing the photoresist to a pressurizing device to apply pressure to the storage container containing the photoresist through the pressurizing device, thereby delivering the photoresist into the photoresist delivery pipeline.

[0024] Optionally, the photoresist coating pretreatment method further satisfies at least one of the following:

[0025] The amount of photoresist used in step S03 is 1 / 4 gallon to 1 / 3 gallon;

[0026] The amount of photoresist used in step S04 is 1 / 2 gallon to 3 / 4 gallon.

[0027] Compared with the prior art, the technical solution provided by the present invention has at least the following beneficial effects:

[0028] The photoresist coating pretreatment method described above first uses N-methylpyrrolidone to effectively remove impurities, especially poorly soluble impurities, from the photoresist delivery pipeline and filter, ensuring the purity of the photoresist. Then, a photoresist diluent is used to further remove impurities, especially fine impurities, from the photoresist delivery pipeline and filter, while simultaneously ensuring thorough wetting of the pipeline and filter to facilitate subsequent photoresist flow and filling. Next, the photoresist is used to remove air bubbles and perform air spraying on the photoresist delivery pipeline and filter, further removing impurities and purifying and filling the pipeline and filter. Finally, the photoresist is sprayed onto the test substrate, allowing for the determination and adjustment of photoresist consumption based on the automatic coating results on the test substrate. This significantly saves photoresist and substantially reduces costs.

[0029] In particular, the photoresist coating pretreatment method provided above also provides the manual coating results of the test substrate. Based on the manual coating results of the test substrate, it is possible to determine whether the film thickness and appearance of the automatic coating results of the test substrate meet the requirements. This allows for an objective determination and evaluation of the rationality of the photoresist usage setting in the coating pretreatment, thereby more accurately controlling the amount of photoresist consumed and thus more effectively saving costs. Attached Figure Description

[0030] Those skilled in the art will understand that the accompanying drawings are provided to better understand the invention and do not constitute any limitation on the scope of the invention. Wherein:

[0031] Figure 1 This is a schematic diagram illustrating the structural principle of applying photoresist to a substrate in some application scenarios.

[0032] Figure 2 This is a flowchart of a photoresist coating pretreatment method provided in an embodiment of the present invention.

[0033] In the diagram: 1-Photoresist, 2-Substrate, 3-Process cavity, 4-Stage, 5-Suction cup, 6-Photoresist nozzle, 7-Additional nozzle, 8-Front-side cleaning station, 9-Back-side cleaning station, 11-Photoresist delivery pipeline. Detailed Implementation

[0034] The technical solutions of the embodiments of the present invention will be described below with reference to the accompanying drawings. In the description of the embodiments of the present invention, the terminology used in the following embodiments is for the purpose of describing specific embodiments only and is not intended to limit the present invention. As used in the specification and appended claims of the present invention, the singular expressions “a,” “the,” “the,” “the,” and “this” are intended to also include expressions such as “one or more,” unless the context clearly indicates otherwise. It should also be understood that in the following embodiments of the present invention, “at least one” and “one or more” refer to one or more (including two). The term “and / or” is used to describe the relationship between related objects, indicating that three relationships can exist; for example, A and / or B can represent: A alone, A and B simultaneously, or B alone, where A and B can be singular or plural. The character “ / ” generally indicates that the preceding and following related objects are in an “or” relationship.

[0035] References to "one embodiment" or "some embodiments" as used in this specification mean that a particular feature, structure, or characteristic described in connection with that embodiment is included in one or more embodiments of the invention. Therefore, the phrases "in one embodiment," "in some embodiments," "in other embodiments," "in still other embodiments," etc., appearing in different parts of this specification do not necessarily refer to the same embodiment, but rather mean "one or more, but not all, embodiments," unless otherwise specifically emphasized. The terms "comprising," "including," "having," and variations thereof mean "including, but not limited to," unless otherwise specifically emphasized. The term "connection" includes both direct and indirect connections, unless otherwise stated. "First" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features.

[0036] In embodiments of the present invention, the terms "exemplarily" or "for example" are used to indicate examples, illustrations, or descriptions. Any embodiment or design described as "exemplarily" or "for example" in embodiments of the present invention should not be construed as being more preferred or advantageous than other embodiments or designs. Specifically, the use of the terms "exemplarily" or "for example" is intended to present the relevant concepts in a specific manner.

[0037] The purpose of this invention is to provide a photoresist coating pretreatment method to solve the problem that a large amount of photoresist needs to be air-sprayed before the formal coating of photoresist on the substrate (preferably a wafer), resulting in a large waste of photoresist.

[0038] Figure 1 The following illustrates the coating process of applying photoresist 1 onto substrate 2 in several application scenarios. For example... Figure 1 As shown, photoresist 1 is typically applied to substrate 2 using a photoresist coating and developing machine (also known as a track). This machine includes a process chamber 3 and a stage 4 located within the process chamber 3. The stage 4 typically uses a chuck 5 to vacuum-adsorb substrate 2. A photoresist nozzle 6 is positioned above the stage 4, through which photoresist 1 is sprayed onto the center of substrate 2. Simultaneously, the stage 4 rotates, causing substrate 2 to rotate at high speed, spreading the photoresist 1 evenly onto substrate 2. Generally, before coating, a photoresist thinner is sprayed onto substrate 2 through an additional nozzle 7 to pre-wet the surface of substrate 2, facilitating the subsequent even spreading of photoresist 1 on substrate 2. After photoresist 1 is coated, edge removal of the front side and removal of the back side photoresist are performed, respectively by... Figure 1The front cleaning station 8 and the back cleaning station 9 are used for this purpose. Furthermore, excess photoresist 1 ejected from the substrate 2 is removed by recovery devices on both sides of the process chamber 3, with the removal path shown by arrow a in the figure. Additionally, the photoresist nozzle 6 is connected to the photoresist delivery pipeline 11, and those skilled in the art will understand that a filter (not shown) is typically installed on the photoresist delivery pipeline 11. The filter ensures the purity of the photoresist 1 by filtering out impurities and particles, thereby ensuring the quality and stability of product manufacturing.

[0039] The above describes the normal photoresist coating process for substrate 2. Currently, to ensure product quality, a photoresist dry spray test (also known as a dummy test) is performed before formal photoresist coating. The substrate can only be used normally after the dummy test meets the requirements. Traditionally, the dummy test requires continuous photoresist dry spraying with a large amount of photoresist. Specifically, at least 2-4 gallons of photoresist are fed into the photoresist delivery line 11 until the film thickness, grain size, and defects of the substrate meet the requirements. While this operation allows for quick photoresist application, it consumes a large amount of photoresist, resulting in very high costs.

[0040] This invention aims to solve the problem of waste caused by the excessive use of photoresist in existing dummy testing processes, such as... Figure 2 As shown, a photoresist coating pretreatment method is provided, including the following steps:

[0041] Step S01: N-methylpyrrolidone (NMP) is bubbled into the selected photoresist delivery pipeline, and the current photoresist delivery pipeline is air-sprayed at a first preset frequency; in this step S01, the strong dissolving ability of NMP is used to dissolve impurities in the photoresist delivery pipeline and filter, especially insoluble impurities, to ensure the purity of the photoresist; the concentration of NMP is usually 99.5% or 99.9%;

[0042] Step S02: A photoresist thinner is introduced into the photoresist delivery pipeline processed in step S01 to create a bubble tube, and the current photoresist delivery pipeline is then air-sprayed at a second preset frequency. The main purpose of this step S02 is to further remove impurities from the photoresist delivery pipeline and filter, especially small impurities, to further ensure the purity of the photoresist. Simultaneously, the photoresist thinner can fully wet the photoresist delivery pipeline and filter, especially for photoresists with higher viscosity, thus facilitating the subsequent flow and filling of the photoresist in the pipeline and filter. It should also be noted that the main components of the photoresist thinner include 70% PGME (propanediol monomethyl ether) and 30% PGMEA (propylene glycol methyl ether acetate).

[0043] Step S03: Introduce photoresist into the photoresist delivery pipeline processed in step S02 to remove air bubbles, and perform air spraying on the current photoresist delivery pipeline at a third preset frequency; Here, after introducing the photoresist, the air bubble removal action is performed first, and then the air spraying frequency is set to perform air spraying. The air spraying further removes impurities in the pipeline and filter, allowing the photoresist to be purified and fill the pipeline.

[0044] Step S04: After using the photoresist air jet photoresist delivery pipeline, the photoresist is sprayed onto the test substrate to obtain the automatic coating result of the test substrate;

[0045] Step S05: Determine whether the automatic adhesive coating result of the test substrate meets the requirements;

[0046] If not, return to steps S03 to S05 until the automatic adhesive coating result of the test substrate meets the requirements;

[0047] If so, end the photoresist coating pretreatment.

[0048] Through steps S04 and S05, the pretreatment effect of photoresist mounting can be verified. Ultimately, the consumption of photoresist during dry spraying can be judged and adjusted based on the automatic coating results of the test substrate. This significantly saves photoresist and substantially reduces costs.

[0049] In particular, this application has undergone extensive simulation experiments, demonstrating that the above five steps consume approximately 1 / 2 to 1 gallon of photoresist, saving 50% to 75% in costs compared to the 2 to 4 gallons consumed in traditional methods. Therefore, the photoresist coating pretreatment method provided in this application can control the photoresist consumption for photoresist installation to within 1 gallon, saving 1 to 3 gallons of photoresist compared to industry norms, significantly reducing costs.

[0050] It should also be noted that the "bubbling" step mentioned above refers to dissolving some impurities in the pipes and filters, while "dry spraying" refers to purging the liquid from the pipes and filters to remove impurities and air bubbles. During dry spraying, a pump (such as an electric pump) built into the machine is usually used to purge the liquid from the pipes through the photoresist nozzle 6, thus achieving the purpose of purging the pipes and filters.

[0051] Furthermore, the aforementioned first, second, and third preset frequencies are typically set to occur every few minutes; that is, the interval between air sprays cannot be too long, affecting efficiency, nor can it be too short, resulting in material waste. Therefore, preferably, at least one of the first, second, and third preset frequencies is once every 5 to 10 minutes, and the first to third preset frequencies can be the same or different; this invention does not limit this.

[0052] Preferably, the above photoresist coating pretreatment method further includes: manually coating the photoresist onto the test substrate to obtain the manual coating result of the test substrate.

[0053] Thus, the step S05 of determining whether the automatic adhesive coating result of the test substrate meets the requirements includes the following steps:

[0054] Provide the results of manual adhesive application on the test substrate;

[0055] Based on the manual adhesive coating results of the test substrate, determine whether the film thickness and appearance of the automatic adhesive coating results of the test substrate meet the requirements.

[0056] If not, return to steps S03 to S05;

[0057] If yes, continue to determine whether the particles and defects in the automatic photoresist coating result of the test substrate meet the requirements. If no, return to steps S03 to S05. If yes, end the photoresist coating pretreatment.

[0058] Thus, this embodiment uses the appearance and film thickness of the test substrate obtained by manual photoresist coating as a benchmark to check the appearance and film thickness of the test substrate obtained by automatic photoresist coating. It can objectively determine and evaluate the rationality of the photoresist usage setting in the above steps. Compared with relying on experience, it can more accurately control the amount of photoresist consumed, avoid the occurrence of too much or too little photoresist spraying, improve the accuracy of photoresist dry spraying, and thus save costs more effectively.

[0059] It should be noted that both manual and automatic photoresist coating use the same stage speed and the same photoresist composition. This eliminates the influence of stage speed and photoresist composition on the coating results. Therefore, if there is a difference between the automatic and manual coating results for the test substrate, simply continue with step S03 until the automatic and manual coating results are the same, indicating that the photoresist delivery pipeline and filter have been cleaned.

[0060] In this embodiment, in step S03, before the photoresist is sprayed dry, it is convenient to directly take a certain amount of photoresist (e.g., 100ml) from the photoresist gallon bottle to be installed as a sample for subsequent manual spraying. Then, the appearance and film thickness differences of the test substrate (preferably a bare silicon wafer) are compared between the automatic and manual spraying coating. If there is a significant difference between the two, it indicates that the photoresist delivery pipeline is not cleaned properly, and photoresist dry spraying needs to continue until the appearance and film thickness of the two are basically or exactly the same.

[0061] Furthermore, through extensive theoretical research and simulation experiments, this invention has determined that the total time for bubble-forming N-methylpyrrolidone into the selected photoresist delivery pipeline in step S01 should be no less than 48 hours. This processing time ensures that impurities, especially poorly soluble impurities, are thoroughly cleaned from the photoresist delivery pipeline and filter. Simultaneously, the total time for bubble-forming N-methylpyrrolidone into the photoresist delivery pipeline should not be excessively long, with optimal time used to avoid reducing production efficiency.

[0062] Preferably, before step S01, the method further includes: installing a storage container (preferably a gallon bottle) containing N-methylpyrrolidone onto the photoresist delivery pipeline, connecting the storage container containing N-methylpyrrolidone to a pressurizing device, and then applying pressure to the gallon bottle containing N-methylpyrrolidone through the pressurizing device to deliver N-methylpyrrolidone into the photoresist delivery pipeline.

[0063] In practice, various commonly used storage containers can be used to store N-methylpyrrolidone; for example, gallon bottles are more suitable. Furthermore, the method of delivering NMP to the photoresist delivery line is not limited to pressurized nitrogen. Here, given the widespread use of nitrogen in the photoresist coating process, nitrogen pressurization is directly used to deliver NMP. The pressurization device mentioned in the following embodiments can also employ nitrogen pressurization for delivery.

[0064] Furthermore, through extensive theoretical research and simulation experiments, this invention has determined that the total soaking time for introducing photoresist diluent into the photoresist delivery pipeline in step S02 should be no less than 48 hours. This processing time ensures that fine impurities in the photoresist delivery pipeline and filter are thoroughly cleaned, and that the photoresist delivery pipeline and filter are adequately wetted. Similarly, the time for introducing photoresist diluent into the photoresist delivery pipeline should not be too long to avoid reducing production efficiency.

[0065] Preferably, before step S02, the method further includes: removing the storage container containing N-methylpyrrolidone, installing the storage container containing the photoresist diluent onto the photoresist delivery pipeline, connecting the storage container containing the photoresist diluent to a pressurizing device, and then applying pressure to the storage container containing the photoresist diluent through the pressurizing device to deliver the photoresist diluent into the photoresist delivery pipeline. Similarly, the present invention is not limited to using gallon bottles to store the photoresist diluent; it can also use various other commonly used storage containers.

[0066] Furthermore, based on extensive theoretical research and simulation experiments, this invention has determined that the total time for air-spraying photoresist into the photoresist delivery pipeline in step S03 above shall not be less than 24 hours, so as to eliminate air bubbles and impurities in the pipeline and filter as much as possible, thereby purifying the photoresist and filling the pipeline and fully wetting the filter.

[0067] In this embodiment, the photoresist is generally sprayed in the air outside the process chamber 3. At this time, no substrate is used, and the photoresist can be sprayed directly in the air.

[0068] Preferably, before step S03, the method further includes: removing the storage container containing the photoresist diluent, installing the storage container containing the photoresist onto the photoresist delivery pipeline, and connecting the storage container containing the photoresist to a pressurizing device to apply pressure to the storage container containing the photoresist, thereby delivering the photoresist into the photoresist delivery pipeline. Preferably, the storage container containing the photoresist is a gallon bottle.

[0069] Finally, after extensive theoretical research and simulation testing, it was determined that the amount of photoresist used in step S03 is approximately 1 / 4 gallon to 1 / 3 gallon, meaning that 1 / 4 to 1 / 3 of a bottle of photoresist is typically consumed. Simultaneously, it was determined that the amount of photoresist used in step S04 is approximately 1 / 2 gallon to 3 / 4 gallon, meaning that 1 / 2 to 3 / 4 of a bottle of photoresist is typically consumed. In other words, with these photoresist consumption levels, the test substrate meets the requirements in terms of film thickness, appearance, particle size, and defect detection, and can then be used normally to begin the normal photoresist coating process.

[0070] In summary, the technical solution provided by this invention removes impurities from the photoresist delivery pipeline and filter using N-methylpyrrolidone and a photoresist diluent, ensuring the purity of the subsequent photoresist. The photoresist diluent also thoroughly wets the photoresist delivery pipeline and filter, improving the flowability of the photoresist and facilitating its filling within the pipeline and filter. Next, the photoresist is used to remove air bubbles and perform air spraying on the photoresist delivery pipeline and filter, further removing impurities, purifying the photoresist, and filling the pipeline and filter. Finally, the photoresist is sprayed onto the test substrate. The consumption of photoresist can then be judged and adjusted based on the automatic coating results of the test substrate. This significantly saves photoresist and substantially reduces costs.

[0071] In particular, the technical solution provided by the present invention uses the manual coating result of the test substrate as a benchmark to determine whether the film thickness and appearance of the automatic coating result of the test substrate meet the requirements. This can objectively determine and evaluate the rationality of the photoresist usage setting in the coating pretreatment, thereby more accurately controlling the amount of photoresist consumed and thus more effectively saving costs.

[0072] Specific embodiments of the present invention have been described above. It should be understood that the present invention is not limited to the specific embodiments described above, and those skilled in the art can make various changes or modifications within the scope of the present invention, which do not affect the essential content of the present invention. Unless otherwise specified, the embodiments and features of the present invention can be arbitrarily combined with each other.

Claims

1. A method for pretreatment of photoresist coating, characterized in that, Includes the following steps: S01: Introduce N-methylpyrrolidone into the selected photoresist delivery pipeline to bubble the tube, and spray the current photoresist delivery pipeline dry at the first preset frequency; S02: Introduce photoresist diluent into the photoresist delivery pipeline after step S01 to bubble the pipeline, and then spray the current photoresist delivery pipeline at a second preset frequency. S03: Introduce photoresist into the photoresist delivery pipeline after step S02 to remove air bubbles, and spray the current photoresist delivery pipeline with air at a third preset frequency. S04: After using the photoresist air jet photoresist delivery pipeline, the photoresist is sprayed onto the test substrate to obtain the automatic coating result of the test substrate; S05: Determine whether the automatic adhesive coating result of the test substrate meets the requirements; If not, return to steps S03 to S05 until the automatic adhesive coating result of the test substrate meets the requirements; If so, end the photoresist coating pretreatment.

2. The photoresist coating pretreatment method according to claim 1, characterized in that, The step S05, determining whether the automatic adhesive coating result of the test substrate meets the requirements, includes the following steps: Provide the results of manual adhesive application on the test substrate; Based on the manual adhesive coating results of the test substrate, determine whether the film thickness and appearance of the automatic adhesive coating results of the test substrate meet the requirements. If not, return to steps S03 to S05; If yes, continue to determine whether the particles and defects in the automatic photoresist coating result of the test substrate meet the requirements. If no, return to steps S03 to S05. If yes, end the photoresist coating pretreatment.

3. The photoresist coating pretreatment method according to claim 1 or 2, characterized in that, The total time for bubble-forming the photoresist in step S01 by introducing N-methylpyrrolidone into the photoresist delivery pipeline shall not be less than 48 hours.

4. The photoresist coating pretreatment method according to claim 1 or 2, characterized in that, The total duration of bubbling the photoresist in step S02, where photoresist diluent is introduced into the photoresist delivery pipeline, shall not be less than 48 hours.

5. The photoresist coating pretreatment method according to claim 1 or 2, characterized in that, The total time for air-spraying photoresist into the photoresist delivery pipeline in step S03 shall not be less than 24 hours.

6. The photoresist coating pretreatment method according to claim 1 or 2, characterized in that, At least one of the first preset frequency, the second preset frequency, and the third preset frequency is once every 5 to 10 minutes.

7. The photoresist coating pretreatment method according to claim 1 or 2, characterized in that, Before step S01, the method further includes: installing a storage container containing N-methylpyrrolidone onto the photoresist delivery pipeline, connecting the storage container containing N-methylpyrrolidone to a pressurizing device, and then applying pressure to the storage container containing N-methylpyrrolidone through the pressurizing device to deliver N-methylpyrrolidone into the photoresist delivery pipeline.

8. The photoresist coating pretreatment method according to claim 1 or 2, characterized in that, Before step S02, the method further includes: removing the storage container containing N-methylpyrrolidone, installing the storage container containing the photoresist diluent on the photoresist delivery pipeline, connecting the storage container containing the photoresist diluent to a pressurizing device, and then applying pressure to the storage container containing the photoresist diluent through the pressurizing device to deliver the photoresist diluent into the photoresist delivery pipeline.

9. The photoresist coating pretreatment method according to claim 1 or 2, characterized in that, Before step S03, the method further includes: removing the storage container containing the photoresist diluent, installing the storage container containing the photoresist on the photoresist delivery pipeline, and connecting the storage container containing the photoresist to a pressurizing device to apply pressure to the storage container containing the photoresist through the pressurizing device, thereby delivering the photoresist into the photoresist delivery pipeline.

10. The photoresist coating pretreatment method according to claim 1 or 2, characterized in that, It also meets at least one of the following conditions: The amount of photoresist used in step S03 is 1 / 4 gallon to 1 / 3 gallon; The amount of photoresist used in step S04 is 1 / 2 gallon to 3 / 4 gallon.

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