Combination sensor and electronics

Abstract

The application discloses a kind of combination sensor and electronic equipment, it is related to combination sensor technical field, wherein, combination sensor includes fixed substrate, pickup unit and operation chip, pickup unit includes mounting substrate and the chip component and shell component of setting in mounting substrate, shell component includes multiple cavities isolated from each other in it, the number of chip component is at least two, the number of cavity is not less than the number of chip component, each chip component is located in different cavity respectively;Mounting substrate is installed to fixed substrate and is electrically connected with fixed substrate;Fixed substrate is provided with acoustic hole that penetrates fixed substrate and mounting substrate, and the number of acoustic hole and chip component is consistent and is set one by one corresponding.By stacking arrangement along vertical direction of operation chip and pickup unit, and guaranteeing the electrical connection of operation chip and chip component, it is realized that on the basis of maintaining data interaction between chip component and operation chip, the space occupied by combination sensor in application end substrate is reduced.

Description

Technical Field

[0001] This invention relates to the field of combined sensor technology, and in particular to a combined sensor and electronic device. Background Technology

[0002] In consumer electronics products, directional sound pickup and noise reduction can significantly improve the user experience. Therefore, directional sound pickup and noise reduction is gradually becoming a necessary technical requirement. Existing technologies generally use a flat array of acoustic sensors to achieve this. However, the arrangement of multiple acoustic sensors in the array usually occupies a large space on the application board, which is inconvenient for use in small and lightweight wearable products. Summary of the Invention

[0003] The main objective of this invention is to propose a combined sensor and electronic device that aims to reduce the space occupied by multiple acoustic sensors on the application substrate.

[0004] To achieve the above objectives, the present invention proposes a combined sensor comprising: Fixed base plate; The pickup unit includes a mounting substrate and a chip assembly and a housing assembly disposed on the mounting substrate. The housing assembly includes multiple mutually isolated cavities. The number of chip assemblies is at least two, and the number of cavities is not less than the number of chip assemblies. Each chip assembly is located in a different cavity. The mounting substrate is mounted on the fixed substrate and electrically connected to the fixed substrate. The fixed substrate has acoustic holes that penetrate the fixed substrate and the mounting substrate. The number of acoustic holes is the same as the number of chip components and they are arranged in a one-to-one correspondence. The computing chip and the pickup unit are stacked vertically, and each chip component is electrically connected to the computing chip through the mounting substrate and the fixing substrate.

[0005] In one embodiment, the computing chip is connected to the fixed substrate.

[0006] In one embodiment, the fixed substrate includes a first substrate, a connecting substrate, and a second substrate connected in sequence. The first substrate is electrically connected to the second substrate through the connecting substrate. The mounting substrate is connected to the first substrate. The first substrate has a sound hole that penetrates the first substrate and the mounting substrate. The computing chip is connected to the connecting substrate and / or the second substrate. The first substrate and / or the second substrate is provided with a fixed pad for electrical connection with the application terminal pad.

[0007] In one embodiment, the first substrate, the connecting substrate, and the second substrate form an opening groove, the pickup unit and the computing chip are both located in the opening groove, the computing chip is disposed on the second substrate, and the chip assembly is electrically connected to the computing chip through the mounting substrate and the fixing substrate.

[0008] In one embodiment, the end of the connecting substrate away from the first substrate is inclined outward to form a semi-enclosed structure surrounding the computing chip and the pickup unit. The computing chip is connected to the connecting substrate through an adhesive layer. The side of the second substrate away from the first substrate is flush with the side of the computing chip away from the housing assembly. The side of the second substrate away from the first substrate is provided with the fixing pad. The side of the computing chip away from the housing assembly is provided with the connecting pad for electrical connection with the application terminal pad.

[0009] In one embodiment, the fixing substrate is a flexible circuit board, and the first substrate, the connecting substrate, and the second substrate are integrally formed components; Alternatively, the first substrate, the connecting substrate, and the second substrate are all rigid circuit boards. The two ends of the connecting substrate are fixedly connected to the first substrate and the second substrate, respectively. The connecting substrate has through holes, and conductive elements connecting the first substrate and the second substrate are disposed in the through holes. The first substrate and the second substrate are electrically connected through the conductive elements.

[0010] In one embodiment, the connecting substrate extends along the vertical direction, and the connecting substrate is etched with lines of a radio frequency antenna.

[0011] In one embodiment, the side of the housing assembly away from the mounting substrate is connected to the computing chip via a thermally conductive adhesive layer; And / or, the combined sensor further includes a filter element disposed on the fixed substrate; And / or, the acoustic hole includes a first through hole and a second through hole that are interconnected, the fixed substrate has the first through hole, the mounting substrate has the second through hole, and the diameter of the first through hole is larger than the diameter of the second through hole; And / or, the chip assembly includes a MEMS chip and an ASIC chip disposed on the mounting substrate, and the acoustic aperture is disposed toward the diaphragm of the MEMS chip.

[0012] In one embodiment, the housing assembly includes a plurality of housings, each of which is connected to the mounting base and forms a cavity; Alternatively, the housing assembly includes a housing and a plurality of partitions connected to the housing, the housing being connected to the mounting base to form a receiving cavity, the plurality of partitions being located within the receiving cavity, and the plurality of partitions being used to divide the receiving cavity into a plurality of cavities.

[0013] The present invention also proposes an electronic device comprising an application-side substrate and the aforementioned combined sensor.

[0014] The technical solution of the present invention reduces the space occupied by the combined sensor on the application substrate by stacking the computing chip and the pickup unit in the vertical direction and ensuring the electrical connection between the computing chip and the chip assembly, while maintaining the data interaction between the chip assembly and the computing chip. Attached Figure Description

[0015] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on the structures shown in these drawings without creative effort.

[0016] Figure 1 This is a schematic diagram of the structure of an embodiment of the combined sensor provided by the present invention; Figure 2 This is a schematic diagram of the structure of another embodiment of the combined sensor provided by the present invention; Figure 3 This is a schematic diagram of an embodiment of a combined sensor provided by the present invention, in which a fixed pad is disposed on a first substrate. Figure 4 This is a cross-sectional structural schematic diagram of an embodiment of the combined sensor with a flexible circuit board as the fixed substrate provided by the present invention. Figure 5 This is a cross-sectional structural schematic diagram of an embodiment of the combined sensor with a rigid circuit board as the fixed substrate provided by the present invention; Figure 6 This is a cross-sectional structural schematic diagram of an embodiment of the combined sensor provided by the present invention; Figure 7 This is a cross-sectional structural schematic diagram of another embodiment of the combined sensor provided by the present invention; Figure 8 This is a schematic diagram of another embodiment of the combined sensor provided by the present invention; Figure 9 for Figure 8 A structural diagram from another perspective; Figure 10 for Figure 8 A cross-sectional structural diagram.

[0017] Explanation of icon numbers: 100. Combined sensor; 1. Fixed substrate; 11. First substrate; 111. Acoustic hole; 1111. First through hole; 1112. Second through hole; 12. Second substrate; 13. Connecting substrate; 131. Via; 14. Opening slot; 15. Fixing pad; 2. Pickup unit; 21. Mounting substrate; 22. Chip assembly; 221. MEMS chip; 222. ASIC chip; 23. Housing assembly; 231. Housing; 232. Housing; 233. Separator; 234. Cavity; 3. Computing chip; 31. Connecting pad; 4. Adhesive layer; 5. Filtering element; 6. Conductive component.

[0018] The realization of the objective, functional features and advantages of the present invention will be further explained in conjunction with the embodiments and with reference to the accompanying drawings. Detailed Implementation

[0019] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the scope of protection of the present invention.

[0020] It should be noted that if the embodiments of the present invention involve directional indicators (such as up, down, left, right, front, back, etc.), the directional indicators are only used to explain the relative positional relationship and movement of the components in a specific posture. If the specific posture changes, the directional indicators will also change accordingly.

[0021] Furthermore, if the embodiments of this invention involve descriptions such as "first" or "second," these descriptions are for descriptive purposes only and should not be construed as indicating or implying their relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined with "first" or "second" may explicitly or implicitly include at least one of those features. Additionally, the use of "and / or" or "and / or" throughout the text includes three parallel solutions. For example, "A and / or B" includes solution A, solution B, or a solution where both A and B are satisfied simultaneously. Furthermore, the technical solutions of the various embodiments can be combined with each other, but this must be based on the ability of those skilled in the art to implement them. When the combination of technical solutions is contradictory or impossible to implement, it should be considered that such a combination of technical solutions does not exist and is not within the scope of protection claimed by this invention.

[0022] In consumer electronics products, directional sound pickup and noise reduction can significantly improve the user experience. Therefore, directional sound pickup and noise reduction is gradually becoming a necessary technical requirement. Existing technologies generally use a flat array of acoustic sensors to achieve this. However, the arrangement of multiple acoustic sensors in the array usually occupies a large space on the application board, which is inconvenient for use in small and lightweight wearable products.

[0023] The inventors discovered that existing acoustic sensors and computing chips are mounted flatly on the substrate of the application end. Each acoustic sensor includes a substrate, a shell covering the substrate, a MEMS chip and an ASIC chip disposed on the substrate and located inside the shell. This arrangement undoubtedly occupies a large amount of space on the application end substrate. That is, a large area needs to be allocated on the application end substrate for mounting multiple acoustic sensors and application chips, which results in the need for a larger application end substrate to accommodate these components. The increase in the size of the application end substrate will cause it to occupy a large space in the application end, which is not conducive to the development trend of miniaturization and thinning of application end products.

[0024] The main objective of this invention is to propose a combined sensor and electronic device that aims to reduce the space occupied by multiple acoustic sensors on the application substrate.

[0025] Please see Figures 1 to 3 In one embodiment of the present invention, the combined sensor 100 includes a fixed substrate 1, a pickup unit 2, and a computing chip 3. The pickup unit 2 includes a mounting substrate 21 and a chip assembly 22 and a housing assembly 23 disposed on the mounting substrate 21. The housing assembly 23 includes a plurality of mutually isolated cavities 234. The number of chip assemblies 22 is at least two, and the number of cavities 234 is not less than the number of chip assemblies 22. Each chip assembly 22 is located in a different cavity 234. The mounting substrate 21 is mounted on the fixed substrate 1 and electrically connected to the fixed substrate 1. The fixed substrate 1 has a sound hole 111 that penetrates the fixed substrate 1 and the mounting substrate 21. The number of sound holes 111 is the same as the number of chip assemblies 22 and they are arranged in a one-to-one correspondence. The computing chip 3 and the pickup unit 2 are stacked in a vertical direction, and each chip assembly 22 is electrically connected to the computing chip 3 through the mounting substrate 21 and the fixed substrate 1.

[0026] The technical solution of this invention involves disposing multiple chip components 22 within different cavities 234 formed by the housing component 23 and the mounting substrate 21, ensuring that each chip component 22 has a corresponding cavity 234. Multiple chip components 22 are disposed on the mounting substrate 21, which is mounted on a fixed substrate 1. The fixed substrate 1 has sound holes 111 penetrating both the fixed substrate 1 and the mounting substrate 21. The number of sound holes 111 corresponds to the number of chip components 22, and they are arranged one-to-one. The computing chip 3 and the pickup unit 2 are stacked vertically, effectively reducing the space occupied by the application-side substrate. Specifically, if the computing chip 3 is positioned closer to the application-side substrate than the pickup unit 2 (i.e., below the pickup unit 2 and below the computing chip 3), only the computing chip 3 occupies space on the application-side substrate, while the pickup unit 2, stacked with the computing chip 3, does not occupy space on the application-side substrate. The application substrate does not require an additional area to house the microphone unit 2. Therefore, compared to the solution where the computing chip 3 and multiple acoustic sensors are all mounted on the application substrate, the combined sensor 100 of the present invention occupies less space on the application substrate, allowing the application substrate to be made smaller and better suited to the current trend of miniaturization and thinning of application devices. Similarly, if the computing chip 3 is on top, the microphone unit 2 is below, and the application substrate is below the microphone unit 2, then the application substrate also does not require an additional area to house the computing chip 3. Therefore, compared to the solution where the computing chip 3 and multiple acoustic sensors are all mounted on the application substrate, the combined sensor 100 of the present invention occupies less space on the application substrate, or in other words, occupies a smaller area on the application substrate, allowing the application substrate to be made smaller and better suited to the current trend of miniaturization and thinning of application devices. The vertical direction is the direction perpendicular to the surface of the application substrate.

[0027] Furthermore, in existing solutions, multiple acoustic sensors are mounted on the application substrate. Specifically, each existing acoustic sensor includes a substrate, a housing connected to the substrate, a MEMS chip and an ASIC chip disposed inside the housing and mounted on the substrate, and adjacent acoustic sensors are spaced apart, which results in them occupying a large space on the application substrate.

[0028] The technical solution of the present invention is that multiple chip components 22 share a mounting substrate 21, the mounting substrate 21 is mounted on a fixed substrate 1, and the fixed substrate 1 is set on the application substrate to realize the electrical connection between the chip components 22 and the application substrate. By sharing a mounting substrate 21, the distance between adjacent chip components 22 is smaller, the structure is more compact, and the space between the spaced substrates is eliminated, so that the combined sensor 100 of the present invention occupies less space on the application substrate and has better consistency.

[0029] It should be noted that the mounting substrate 21 has a first pad and a second pad on each side. The chip assembly 22 is soldered to the first pad, and the mounting substrate 21 is soldered to the pads on the fixed substrate 1 via the second pad. The fixed substrate 1 also has a fixed pad 15, which is soldered to the pads on the application substrate, so that the chip assembly 22 can be electrically connected to the application substrate via the mounting substrate 21 and the fixed substrate 1. Both the computing chip 3 and the chip assembly 22 are existing chips. The computing chip 3 can be directly mounted on the application substrate and electrically connected to the chip assembly 22 via the application substrate, the fixed substrate 1, and the mounting substrate 21. Alternatively, the computing chip 3 can be mounted on the fixed substrate 1 and electrically connected to the chip assembly 22 via the fixed substrate 1 and the mounting substrate 21; no restriction is placed here. The vertical direction is... Figure 10 The up and down directions are shown.

[0030] According to one embodiment of the present invention, the number of cavities 234 is consistent with the number of chip components 22 and is set in a one-to-one correspondence. The cavities 234 are not interconnected, ensuring that each chip component 22 has an independent cavity 234.

[0031] Please see Figure 1 and Figure 10 In one embodiment, the computing chip 3 is connected to the fixed substrate 1. In existing solutions, multiple acoustic sensors need to be mounted one by one on the application substrate; however, the technical solution of the present invention is that multiple chip components 22 share a mounting substrate 21, and both the mounting substrate 21 and the computing chip 3 are connected to the fixed substrate 1, thereby forming an integral structural component for assembly, which facilitates the assembly of the combined sensor 100 onto the application substrate.

[0032] Please see Figure 1 and Figure 10In one embodiment, the fixed substrate 1 includes a first substrate 11, a connecting substrate 13, and a second substrate 12 connected in sequence. The first substrate 11 is electrically connected to the second substrate 12 through the connecting substrate 13. The mounting substrate 21 is connected to the first substrate 11. The first substrate 11 has a sound hole 111 that penetrates the first substrate 11 and the mounting substrate 21. The computing chip 3 is connected to the connecting substrate 13 and / or the second substrate 12. The first substrate 11 and / or the second substrate 12 are provided with fixed pads 15 for electrical connection with the application terminal pads. One end of the connecting substrate 13 is connected to the first substrate 11, and the other end of the connecting substrate 13 is connected to the second substrate 12. The first substrate 11 and the second substrate 12 are electrically connected through the connecting substrate 13. The fixed pads 15 that are soldered to the pads on the application substrate can be provided on the first substrate 11, or fixed pads 15 that are soldered to the pads on the application substrate can be provided on the second substrate 12, or fixed pads 15 can be provided on both the first substrate 11 and the second substrate 12. Specifically, whether the fixed pads 15 on the first substrate 11 are soldered to the pads on the application substrate or the fixed pads 15 on the second substrate 12 are soldered to the pads on the application substrate can be selected according to actual needs, making the assembly of the combined sensor 100 more flexible and adaptable to the installation requirements of different installation scenarios.

[0033] Please see Figure 2 and Figure 3 In one embodiment, a first substrate 11, a connecting substrate 13, and a second substrate 12 form an opening groove 14. The pickup unit 2 and the computing chip 3 are both located within the opening groove 14. The computing chip 3 is disposed on the second substrate 12. The chip assembly 22 is electrically connected to the computing chip 3 via a mounting substrate 21 and a fixing substrate 1. The opening groove 14, formed by the first substrate 11, connecting substrate 13, and second substrate 12, accommodates the pickup unit 2 and the chip assembly 22. The chip assembly 22 is connected to the first substrate 11 via the mounting substrate 21, and the computing chip 3 is connected to the second substrate 12. This allows the pickup unit 2 and the computing chip 3 to be stacked vertically via the first substrate 11, connecting substrate 13, and second substrate 12. Furthermore, the entire combined sensor 100 can be assembled as a single structural component onto the application substrate. Compared to the prior art, which requires mounting multiple sound sensors individually onto the application substrate, the combined sensor 100 of this invention can be assembled onto the application substrate more conveniently, improving assembly efficiency. It should be noted that the first substrate 11 and the second substrate 12 are arranged in parallel; the opening groove 14 is U-shaped or approximately U-shaped.

[0034] Please see Figures 8 to 10In one embodiment, the end of the connecting substrate 13 away from the first substrate 11 is inclined outward to form a semi-enclosed structure surrounding the computing chip 3 and the pickup unit 2. The computing chip 3 is connected to the connecting substrate 13 through the adhesive layer 4. The side of the second substrate 12 away from the first substrate 11 is flush with the side of the computing chip 3 away from the housing assembly 23. The side of the second substrate 12 away from the first substrate 11 is provided with a fixing pad 15, and the side of the computing chip 3 away from the housing assembly 23 is provided with a connecting pad 31 for electrical connection with the application end pad. The connecting substrate 13 is inclined, forming a semi-enclosed structure with the first substrate 11. Specifically, the first substrate 11 is located above the pickup unit 2, and the connecting substrate 13 is located to the right of the pickup unit 2 and the computing chip 3. The computing chip 3 is bonded to the connecting substrate 13 through the adhesive layer 4, so that the entire combined sensor 100 can be assembled as a whole on the application substrate. Compared with the prior art, which requires multiple sound sensors to be attached to the application substrate one by one, the combined sensor 100 of the present invention can be assembled on the application substrate more conveniently, improving assembly efficiency. Furthermore, the lower side of the second substrate 12 is flush with the lower side of the computing chip 3, or the lower side of the second substrate 12 is slightly higher than the lower side of the computing chip 3, or the lower side of the second substrate 12 is slightly lower than the lower side of the computing chip 3, thereby facilitating the attachment of the second substrate 12 and the computing chip 3 to the application substrate. It should be noted that, since the computing chip 3 is soldered to the pads on the application substrate via the connecting pad 31, and the fixing pad 15 on the second substrate 12 is also soldered to the pads on the application substrate, the computing chip 3 can be electrically connected to the second substrate 12 via the application substrate. Furthermore, since the second substrate 12 is electrically connected to the first substrate 11 via the connecting substrate 13, and the first substrate 11 is electrically connected to the chip assembly 22 via the mounting substrate 21, the electrical connection between the chip assembly 22 and the computing chip 3 is achieved.

[0035] Please see Figure 3 and Figure 4 In one embodiment, the fixed substrate 1 is a flexible circuit board, and the first substrate 11, the connecting substrate 13, and the second substrate 12 are integrally formed components. The fixed substrate 1 can be a flexible circuit board, and the first substrate 11, the connecting substrate 13, and the second substrate 12 are three parts on the flexible circuit board. The first substrate 11, the connecting substrate 13, and the second substrate 12 are integrally formed components used for the assembly of the combined sensor 100, thereby making the assembly of the combined sensor 100 simpler.

[0036] Please see Figure 5In one embodiment, the first substrate 11, the connecting substrate 13, and the second substrate 12 are all rigid circuit boards. Both ends of the connecting substrate 13 are fixedly connected to the first substrate 11 and the second substrate 12, respectively. A through-hole 131 is provided inside the connecting substrate 13, and a conductive element 6 is provided within the through-hole 131 to connect the first substrate 11 and the second substrate 12. The first substrate 11 and the second substrate 12 are electrically connected through the conductive element 6. Specifically, by providing the through-hole 131 within the second substrate 12 and the conductive element 6 within the through-hole 131, with one end of the conductive element 6 electrically connected to the first substrate 11 and the other end electrically connected to the second substrate 12, the first substrate 11 and the second substrate 12 are electrically connected through the conductive element 6. It should be noted that the conductive element 6 can be a copper layer electroplated on the hole wall of the via 131, or it can be a copper layer with conductive material filled in the via 131 to form the conductive element 6. There is no limitation here. In addition, the first substrate 11 and the connecting substrate 13 can be connected and fixed by existing pressing or welding processes. Similarly, the second substrate 12 and the connecting substrate 13 can also be connected and fixed by existing pressing or welding processes. There is no limitation here.

[0037] In one embodiment, the connecting substrate 13 extends vertically, and the connecting substrate 13 is etched with the lines of a RF antenna. Since the connecting substrate 13 extends in a direction perpendicular to the application substrate, the RF antenna lines etched on the connecting substrate 13 have a three-dimensional spatial structure. Compared to the conventional design where the RF antenna lines are etched on a substrate parallel to the application substrate, the technical solution of the present invention has better signal transmission and reception performance. The RF antenna can be a Bluetooth antenna.

[0038] In one embodiment, the side of the housing assembly 23 away from the mounting substrate 21 is connected to the computing chip 3 via a thermally conductive adhesive layer; wherein one side of the thermally conductive adhesive layer is attached to the side of the housing assembly 23 away from the mounting substrate 21, and the other side of the thermally conductive adhesive layer is attached to the side of the computing chip 3 facing the chip assembly 22. By providing the thermally conductive adhesive layer, the computing chip 3 can transfer heat to the housing assembly 23 through the thermally conductive adhesive layer, thereby obtaining a larger contact area with air through the housing assembly 23, which facilitates heat dissipation of the computing chip 3 and improves the heat dissipation effect of the computing chip 3.

[0039] According to one embodiment of the present invention, the side of the housing assembly 23 away from the mounting substrate 21 is attached to the computing chip 3; the side of the housing assembly 23 away from the mounting substrate 21 is directly attached to the side of the computing chip 3 facing the chip assembly 22, which is also beneficial to the heat dissipation of the computing chip 3, that is, the computing chip 3 transfers heat to the housing assembly 23, and the housing assembly 23 is used to expand the contact area with the air, thereby improving the heat dissipation effect of the computing chip 3.

[0040] Please see Figure 1 and Figure 8 In one embodiment, the combined sensor 100 further includes a filter element 5 disposed on the fixed substrate 1; by disposing of the filter element 5 on the fixed substrate 1 for filtering, the filter element 5 can be an existing filter element such as a capacitor or resistor, and there is no limitation.

[0041] Please see Figure 4 and Figure 5 In one embodiment, the sound hole 111 includes a first through hole 1111 and a second through hole 1112 that are interconnected. The fixed substrate 1 has the first through hole 1111 and the mounting substrate 21 has the second through hole 1112. The diameter of the first through hole 1111 is larger than the diameter of the second through hole 1112. If the diameter of the first through hole 1111 is exactly the same as the diameter of the second through hole 1112, the mounting substrate 21 and the fixed substrate 1 need to be precisely matched to ensure that the second through hole 1112 is not blocked by the fixed substrate 1. This requires high installation accuracy. The technical solution of the present invention sets the diameter of the first through hole 1111 to be larger than the diameter of the second through hole 1112. The extra space of the first through hole 1111 compared to the second through hole 1112 can provide a certain installation margin when the mounting substrate 21 and the fixed substrate 1 are connected. Even if the center of the second through hole 1112 is slightly offset from the center of the first through hole 1111, the second through hole 1112 will not be blocked by the fixed substrate 1 due to the installation margin. This makes it easier to connect the fixed substrate 1 and the mounting substrate 21.

[0042] Please see Figure 2 and Figure 6 In one embodiment, the housing assembly 23 includes a plurality of housings 231, each housing 231 being connected to the mounting base plate 21 and forming a cavity 234; wherein the plurality of housings 231 share a mounting base plate 21, each housing 231 being connected to the mounting base plate 21 and forming a cavity 234 with the mounting base plate 21, thereby realizing that each cavity 234 is independent of each other and not interconnected.

[0043] Please see Figure 7In one embodiment, the housing assembly 23 includes a housing 232 and a plurality of partition plates 233 connected to the housing 232. The housing 232 is connected to the mounting substrate 21 to form a receiving cavity. The plurality of partition plates 233 are located within the receiving cavity and are used to divide the receiving cavity into a plurality of cavities 234. The housing 232 covers the mounting substrate 21 and forms a receiving cavity with the mounting substrate 21. The plurality of partition plates 233 are disposed within the housing 232, and the plurality of partition plates 233 divide the receiving cavity into a plurality of independent and non-communicating cavities 234. Compared to the scheme of using multiple housings 231 sharing a single mounting substrate 21 to form multiple independent cavities 234, using a single housing 232 can effectively eliminate the gaps between housings 231, allowing multiple chip components 22 to be arranged more compactly, further reducing the space they occupy. Furthermore, adjacent chip components 22 can be separated by only one partition plate 233. Compared to the scheme of using multiple housings 231 sharing a single mounting substrate 21 to form multiple independent cavities 234, adjacent chip components 22 must be separated by at least two side walls of housings 231. If the thickness of the partition plate 233 is the same as the thickness of the housing 231, then this scheme uses a single housing 232 in conjunction with the partition plate 233 to divide the accommodating cavity into multiple cavities 234. This not only reduces the gaps between adjacent housings 231, but also reduces the thickness of one side wall of housing 231, making the arrangement of chip components 22 more compact. Consequently, the pickup unit 2 occupies less space, which is more conducive to adapting to the trend of miniaturization in applications. It should be noted that the partition plate 233 and the outer shell 232 can be integrally molded parts; the partition plate 233 and the outer shell 232 can also be separate structural parts. One side wall of the partition plate 233 is sealed to the mounting base plate 21, and the other side wall of the partition plate 233 is sealed to the inner wall of the outer shell 232, so that the partition plate 233 divides the receiving cavity into multiple cavities 234.

[0044] Please see Figure 6 and Figure 7 In one embodiment, the chip assembly 22 includes a MEMS chip and an ASIC chip disposed on the mounting substrate 21, with the acoustic aperture 111 facing the diaphragm of the MEMS chip. The MEMS chip is electrically connected to the ASIC chip via gold wires, and the ASIC chip is electrically connected to the mounting substrate 21 via gold wires.

[0045] The present invention also proposes an electronic device, which includes an application-side substrate and the aforementioned combined sensor 100. The specific structure of the combined sensor 100 is as described in the above embodiments. Since this electronic device adopts all the technical solutions of all the above embodiments, it possesses at least all the beneficial effects brought about by the technical solutions of the above embodiments, and will not be elaborated further here. The electronic device can be a smart wearable device, such as a watch, headphones, smart glasses, VR (Virtual Reality) devices, AR (Augmented Reality) devices, etc.

[0046] The above description is merely an exemplary embodiment of the present invention and does not limit the scope of protection of the present invention. Any equivalent structural transformations made based on the technical concept of the present invention and the contents of the specification and drawings of the present invention, or direct / indirect applications in other related technical fields, are included within the scope of protection of the present invention.

Claims

1. A combined sensor, characterized in that, include: Fixed base plate; The pickup unit includes a mounting substrate and a chip assembly and a housing assembly disposed on the mounting substrate. The housing assembly includes multiple mutually isolated cavities. The number of chip assemblies is at least two, and the number of cavities is not less than the number of chip assemblies. Each chip assembly is located in a different cavity. The mounting substrate is mounted on the fixed substrate and electrically connected to the fixed substrate. The fixed substrate has acoustic holes that penetrate the fixed substrate and the mounting substrate. The number of acoustic holes is the same as the number of chip components and they are arranged in a one-to-one correspondence. The computing chip and the pickup unit are stacked vertically, and each chip component is electrically connected to the computing chip through the mounting substrate and the fixing substrate.

2. The combined sensor as described in claim 1, characterized in that, The computing chip is connected to the fixed substrate.

3. The combined sensor as described in claim 2, characterized in that, The fixed substrate includes a first substrate, a connecting substrate, and a second substrate connected in sequence. The first substrate is electrically connected to the second substrate through the connecting substrate. The mounting substrate is connected to the first substrate. The first substrate has a sound hole that penetrates through the first substrate and the mounting substrate. The computing chip is connected to the connecting substrate and / or the second substrate. The first substrate and / or the second substrate is provided with a fixed pad for electrical connection with the application terminal pad.

4. The combined sensor as described in claim 3, characterized in that, The first substrate, the connecting substrate, and the second substrate form an opening groove. The pickup unit and the computing chip are both located in the opening groove. The computing chip is disposed on the second substrate. The chip assembly is electrically connected to the computing chip through the mounting substrate and the fixing substrate.

5. The combined sensor as described in claim 3, characterized in that, The connecting substrate is inclined outward at the end away from the first substrate to form a semi-enclosed structure surrounding the computing chip and the pickup unit. The computing chip is connected to the connecting substrate through an adhesive layer. The side of the second substrate away from the first substrate is flush with the side of the computing chip away from the housing assembly. The fixing pad is provided on the side of the second substrate away from the first substrate. The connecting pad for electrical connection with the application terminal pad is provided on the side of the computing chip away from the housing assembly.

6. The combined sensor as described in claim 3, characterized in that, The fixed substrate is a flexible circuit board, and the first substrate, the connecting substrate, and the second substrate are integrally molded components. Alternatively, the first substrate, the connecting substrate, and the second substrate are all rigid circuit boards. The two ends of the connecting substrate are fixedly connected to the first substrate and the second substrate, respectively. The connecting substrate has through holes, and conductive elements connecting the first substrate and the second substrate are disposed in the through holes. The first substrate and the second substrate are electrically connected through the conductive elements.

7. The combined sensor as described in claim 3, characterized in that, The connecting substrate extends along the vertical direction, and the connecting substrate is etched with the lines of a radio frequency antenna.

8. The combined sensor as described in any one of claims 1 to 7, characterized in that, The side of the housing assembly away from the mounting substrate is connected to the computing chip via a thermally conductive adhesive layer; And / or, the combined sensor further includes a filter element disposed on the fixed substrate; And / or, the acoustic hole includes a first through hole and a second through hole that are interconnected, the fixed substrate has the first through hole, the mounting substrate has the second through hole, and the diameter of the first through hole is larger than the diameter of the second through hole; And / or, the chip assembly includes a MEMS chip and an ASIC chip disposed on the mounting substrate, and the acoustic aperture is disposed toward the diaphragm of the MEMS chip.

9. The combined sensor as described in any one of claims 1 to 7, characterized in that, The housing assembly includes multiple housings, each of which is connected to the mounting base plate and forms a cavity; Alternatively, the housing assembly includes a housing and a plurality of partitions connected to the housing, the housing being connected to the mounting base to form a receiving cavity, the plurality of partitions being located within the receiving cavity, and the plurality of partitions being used to divide the receiving cavity into a plurality of cavities.

10. An electronic device, characterized in that, The electronic device includes an application-side substrate and a combined sensor according to any one of claims 1 to 9.

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