A chip mounting device capable of mounting chips of various sizes

Abstract

The application provides a chip pasting device capable of pasting chips of various sizes, relates to the technical field of chip pasting, and comprises a pasting machine body, a point gluing mechanism, a pasting table, a chip pickup head and a chip pasting head which are installed above the pasting machine body, the point gluing mechanism is movably installed on the left edge above the pasting machine body through a guide rail and a magnetic coupling cylinder, the pasting table is movably installed on the front edge above the pasting machine body through a guide rail and a magnetic coupling cylinder, the chip pickup head is provided with two chip pickup heads capable of switching a plurality of different sizes of vacuum nozzles, the nozzle disc of the chip pickup head is integrated with a plurality of different sizes of vacuum nozzles in the circumferential direction, the nozzle disc can be programmably driven to rotate through a nozzle changing driving element and a synchronous belt transmission, the required size of vacuum nozzle can be quickly positioned to the working position and connected with a negative pressure suction device, the design realizes the quick switching of the nozzle, manual intervention is not needed for shutdown and replacement, and the problem of low replacement efficiency caused by the fixed size of the nozzle is solved.

Description

Technical Field

[0001] This invention relates to the field of chip mounting technology, and more particularly to a chip mounting apparatus capable of mounting chips of various sizes. Background Technology

[0002] Die bonding machines are key equipment in semiconductor packaging. Their function is to precisely mount chips onto substrates or lead frames using adhesives or solders to achieve fixation. This technology is widely used in the packaging of high-speed optical modules, integrated circuits, and power devices. Currently, with the continuous expansion of the global semiconductor industry and the advancement of related support policies, semiconductor packaging technology has ushered in an important development window. As a core process, die bonding technology has attracted much attention for its technological advancements and equipment upgrades.

[0003] In practical applications of traditional chip mounting equipment, the nozzles used by the pick-up mechanism of the dispensing mechanism are usually of a fixed size. This means that the same device can only efficiently process chips of a single specification. When multi-size chip mounting or eutectic processing of complex structures is required, the mismatch in component sizes will directly affect the uniformity of dispensing, the stability of picking, and the final placement accuracy and efficiency. Operators have to frequently stop the machine and manually change the dispensing head or nozzle, causing production interruptions and making it difficult to adapt to the modern manufacturing needs of multiple varieties. Summary of the Invention

[0004] This invention provides a chip mounting device capable of mounting chips of various sizes, addressing the problem that the dispensing needles used in the dispensing mechanism and the nozzles used in the pickup mechanism are usually of fixed size. This results in the same device being able to efficiently process chips of a single specification. When multi-size chip mounting or eutectic processing of complex structures is required, the mismatch in component dimensions will directly affect the uniformity of dispensing, the stability of pickup, and the final mounting accuracy and efficiency.

[0005] This invention provides a chip placement device capable of mounting chips of various sizes, specifically comprising: a chip placement machine body; a dispensing mechanism, a placement table, a chip pickup head, and a chip placement head mounted on the top of the chip placement machine body; the dispensing mechanism being movably mounted on the upper left edge of the chip placement machine body via guide rails and magnetic coupling cylinders; the placement table being movably mounted on the upper front edge of the chip placement machine body via guide rails and magnetic coupling cylinders; two chip pickup heads being provided, each movably mounted on the upper right edge of the chip placement machine body via magnetic coupling cylinders and guide rails; a precision dispensing head and a dipping head connected to the dispensing mechanism; a dipping tray fixedly connected to the top of the chip placement machine body, located directly behind the dipping head; and the chip pickup head being fixedly connected to... The chip pick-up head has a negative pressure suction device. A nozzle plate is rotatably connected to the bottom of the chip pick-up head. The nozzle plate has nozzle mounting ports distributed around its circumference. Vacuum nozzles of different sizes and models are fixedly connected inside different nozzle mounting ports. The bottom suction hole of the negative pressure suction device fits tightly with the upper interface of the vacuum nozzle. The bottom of the vacuum nozzle has a conical structure. The vacuum nozzle has a through hole that connects to the bottom suction hole of the negative pressure suction device. The chip placement head is movably mounted on the rear edge of the chip placement machine body via a magnetic coupling cylinder and guide rail. There are six chip blue films on the top of the chip placement head. A pusher is fixedly connected to the top of the chip placement machine body. The pusher is located below the chip blue films. A transfer table and a vision detector facing the transfer table are installed on the top of the chip placement machine body.

[0006] Furthermore, a pin magazine is installed above the main body of the pick and place machine. The pin magazine is installed above the main body of the pick and place machine via a screw drive mechanism. A pin mounting plate is fixedly connected to the base of the pin magazine. A pin placement port is opened on the outer periphery of the pin mounting plate, and a blue film pin is inserted into the pin placement port.

[0007] Furthermore, a reversing drive is fixedly connected above the base of the chip mounting head, and a chip placement rack is fixedly connected to the top of the rotating shaft of the reversing drive. The chip blue film is installed inside the chip placement rack, the ejector pin library is located to the right of the chip mounting head, and the pusher is located in front of the ejector pin library.

[0008] Furthermore, a spiral lifting drive is fixedly connected to the bottom of the pusher, a lead screw is connected to the shaft of the spiral lifting drive, a lifting slider is slidably connected inside the pusher, the lifting slider is spirally connected to the lead screw, and a pin assembler is connected to the front of the lifting slider.

[0009] Furthermore, the top of the ejector pin assembler is provided with an ejector pin insertion port with a tapered hole structure, and the ejector pin assembler is connected to an ejector pin vacuum connector and an ejector pin adsorption connector, with the ejector pin vacuum connector communicating with the bottom of the ejector pin insertion port.

[0010] Furthermore, the ejector pin adsorption connector is connected to the suction hole on the inner side wall of the ejector pin socket, and the outer ends of both the ejector pin vacuum connector and the ejector pin adsorption connector are connected to the pneumatic control system. The ejector pin socket is located directly in front of the axis of the ejector pin mounting plate.

[0011] Furthermore, the bottom of the blue film pin is provided with a tapered insertion block, which is inserted into the pin socket.

[0012] Furthermore, the blue film ejector pin has an air hole at the bottom and a vacuum suction hole at the top connected to the air hole at the bottom. The air hole at the bottom is connected to the ejector pin vacuum connector through the bottom channel inside the ejector pin insertion port.

[0013] Furthermore, a nozzle-changing drive component is fixedly connected to the outside of the chip pickup head. The bottom of the rotating shaft of the nozzle-changing drive component is connected to and drives the nozzle-changing pulley. The nozzle-changing pulley is a synchronous pulley. The outer periphery of the suction disc is machined with synchronous belt teeth. The nozzle-changing pulley and the suction disc are connected by a synchronous belt to form a synchronous belt drive.

[0014] Furthermore, a visual inspection camera is fixedly connected to both the front of the chip pickup head and the rear of the dispensing mechanism.

[0015] This invention provides a chip mounting device capable of mounting chips of various sizes, which has the following advantages: In the chip mounting device of this invention, the dispensing mechanism has two dispensing modes. For larger chips, the adhesive can be applied to the substrate surface using a precision dispensing head. For smaller chips, the adhesive can be applied using a dipping head. By moving the dispensing mechanism and extending and retracting the dipping head, the dipping needle of the dipping head picks up the adhesive located inside the dipping tray and then applies the adhesive to the substrate surface, thereby adapting to the dispensing of chips of different sizes.

[0016] In addition, the chip pickup head is equipped with a variety of vacuum nozzles of different sizes that can be switched. The nozzle disk of the chip pickup head integrates a variety of vacuum nozzles of different sizes around its circumference. Through the nozzle changing drive and synchronous belt drive, the nozzle disk can be programmed to rotate, quickly positioning the vacuum nozzle of the required size to the working position and docking with the negative pressure suction device. This design realizes rapid nozzle switching without manual intervention and machine stoppage for replacement, solving the problem of low changeover efficiency caused by fixed nozzle size.

[0017] In addition, the six chip blue films can hold chips of different specifications and types. The chip placement head drives the chip placement rack to rotate through the reversing drive, so that the six chip blue films can flow to the working position in sequence. When they arrive at the working position, the chip blue film containing the required chip is located directly below the blue film ejector pin. The lifting slider is driven by the spiral lifting drive to rise, so that the blue film ejector pin lifts the chip blue film located at the working position, raising the height of the wafer at that position. This reduces the vertical stroke during the chip pick-up head's chip picking process and improves the chip picking efficiency.

[0018] In addition, a pin magazine is provided for the pusher. Since different chip blue films have different sizes, the appropriate size and type of blue film pin can be selected when pushing different chip blue films. The pin mounting plate stores various sizes and types of blue film pins through multiple pin placement ports. When switching blue film pins in the pusher, the movement of the lifting slider, the pin magazine, and the pin changing drive control the rotation of the pin mounting plate to achieve the installation of different blue film pins in the pin socket. After the conical structure at the bottom of the blue film pin is inserted into the pin socket, the air control system connected to the pin adsorption pipe and the suction hole on the side wall of the socket creates a negative pressure inside the pin socket, which firmly locks the blue film pin in the pin assembler, realizing the automatic replacement of the blue film pin. The grasping, transfer, and release of the blue film pin can be reliably completed through air circuit control. The degree of automation is high, reducing the difficulty of manual operation and the risk of error. Attached Figure Description

[0019] To more clearly illustrate the technical solutions of the embodiments of the present invention, the accompanying drawings of the embodiments will be briefly described below.

[0020] The accompanying drawings described below are only related to some embodiments of the invention and are not intended to limit the invention.

[0021] In the attached diagram: Figure 1 A schematic diagram of the overall structure of this application is shown; Figure 2 This invention provides a structural schematic diagram from a rear view. Figure 3 A schematic diagram of the chip pickup head of this application is shown; Figure 4 This paper shows a schematic diagram of the structure at the bottom of the chip pickup head of this application; Figure 5 This diagram illustrates the structure of the chip mounting head of this application. Figure 6 A schematic diagram of the structure of the ejector pin library of this application is shown; Figure 7 A schematic diagram of the structure at the bottom of the ejector pin magazine of this application is shown; Figure 8A schematic diagram of the pusher of this application is shown; Figure 9 This diagram illustrates the structure of the blue film ejector pin when it is removed. Figure 10 A top view of the structure of this application is shown.

[0022] Figure label: 1. Pick and place machine body; 2. Dispensing mechanism; 201. Precision dispensing head; 202. Dipping head; 3. Dipping tray; 4. Placement table; 5. Chip pickup head; 501. Negative pressure suction device; 502. Nozzle tray; 503. Nozzle mounting port; 504. Vacuum nozzle; 505. Nozzle changing drive; 506. Nozzle changing pulley; 507. Synchronous belt; 6. Chip placement head; 601. Reversing drive; 602. Chip placement rack; 603. 7. Chip Blue Film; 8. Ejector Pin Library; 701. Ejector Pin Positioning Drive Component; 702. Ejector Pin Mounting Plate; 703. Ejector Pin Socket; 8. Pusher; 801. Lifting Slider; 802. Screw Lifting Drive Component; 803. Ejector Pin Assembler; 804. Ejector Pin Vacuum Connector; 805. Ejector Pin Seat Adsorption Connector; 806. Ejector Pin Socket; 807. Socket Side Wall Suction Hole; 808. Blue Film Ejector Pin; 809. Ejector Pin Bottom Air Hole; 9. Transfer Platform. Detailed Implementation

[0023] To make the objectives, technical solutions, and advantages of the embodiments of the present invention clearer, the technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some, not all, of the embodiments of the present invention. Based on the described embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0024] Example 1: Please refer to Figures 1 to 10 : This invention proposes a chip placement device capable of handling chips of various sizes, comprising: a chip placement machine body 1, a dispensing mechanism 2, a placement table 4, a chip pickup head 5, and a chip placement head 6 mounted on the top of the chip placement machine body 1; the dispensing mechanism 2 is movably mounted on the upper left edge of the chip placement machine body 1 via guide rails and magnetic coupling cylinders; the placement table 4 is movably mounted on the upper front edge of the chip placement machine body 1 via guide rails and magnetic coupling cylinders; two chip pickup heads 5 are provided, both of which are movably mounted on the upper right edge of the chip placement machine body 1 via magnetic coupling cylinders and guide rails; and a precision dispensing head 201 is connected to the dispensing mechanism 2. The adhesive applicator 202 is attached to the top of the pick-and-place machine body 1, and an adhesive tray 3 is fixedly connected to it. The adhesive tray 3 is located directly behind the adhesive applicator 202. A negative pressure suction device 501 is fixedly connected to the chip pickup head 5. A nozzle tray 502 is rotatably connected to the bottom of the chip pickup head 5. The nozzle tray 502 has nozzle mounting ports 503 distributed around its circumference. Vacuum nozzles 504 of different sizes and models are fixedly connected inside the different nozzle mounting ports 503. The bottom suction hole of the negative pressure suction device 501 is tightly fitted to the upper interface of the vacuum nozzle 504. The bottom of the vacuum nozzle 504 has a conical structure, and the vacuum nozzle 504 has a through-hole. A through-hole is connected to the bottom suction hole of the negative pressure suction device 501. The chip placement head 6 is movably mounted on the rear edge of the placement machine body 1 via a magnetic coupling cylinder and guide rail. Six chip blue films 603 are provided above the chip placement head 6. A pusher 8 is fixedly connected to the top of the placement machine body 1, and the pusher 8 is located below the chip blue films 603. A transfer table 9 and a vision detector facing the transfer table 9 are installed on the top of the placement machine body 1. The substrate is placed on the placement table 4, and glue is applied to the substrate by the dispensing mechanism 2. For larger chips, glue can be applied to the substrate surface by the precision dispensing head 201. For smaller chips, the adhesive dispensing head 202 can be used for dispensing. By moving the dispensing mechanism 2 and extending and retracting the adhesive dispensing head 202, the dispensing needle of the dispensing head 202 picks up the adhesive inside the dispensing tray 3 and then applies the adhesive to the substrate surface, thus adapting to the dispensing of chips of different sizes. After dispensing, the chip is transported to the right through the placement table 4, and then the chip pick-up head 5 located at the rear picks up the chip above the blue chip film 603 and transfers it to the transfer table 9. After the chip passes the visual detector, it is picked up and placed by another chip pick-up head 5.

[0025] In this embodiment, a reversing drive 601 is fixedly connected above the base of the chip mounting head 6. A chip placement rack 602 is fixedly connected to the top of the rotating shaft of the reversing drive 601. A chip blue film 603 is installed inside the chip placement rack 602. The ejector pin magazine 7 is located to the right of the chip mounting head 6. The pusher 8 is located in front of the ejector pin magazine 7. A spiral lifting drive 802 is fixedly connected to the bottom of the pusher 8. A lead screw is connected to the rotating shaft of the spiral lifting drive 802. A lifting slider 801 is slidably connected inside the pusher 8. The lifting slider 801 is spirally connected to the lead screw. An ejector pin assembler 803 is connected to the front of the lifting slider 801. The chip blue film 603 can hold chips of different specifications and types. The chip placement head 6 drives the chip placement rack 602 to rotate through the reversing drive 601, so that the six chip blue films 603 can flow to the working position in sequence. When it reaches the working position, the chip blue film 603 where the required chip is located is directly below the blue film ejector pin 808. The lifting slider 801 is raised by the drive of the spiral lifting drive 802, so that the blue film ejector pin 808 lifts the chip blue film 603 located at the working position, raising the height of the wafer at this position, so that the vertical stroke is reduced during the chip picking head 5 picking up the chip, thereby improving the chip picking efficiency.

[0026] In this embodiment, a pin magazine 7 is installed above the main body 1 of the pick-and-place machine. The pin magazine 7 is installed above the main body 1 of the pick-and-place machine via a screw drive mechanism. A pin mounting plate 702 is fixedly connected to the base of the pin magazine 7. A pin placement port 703 is provided on the outer periphery of the pin mounting plate 702. A blue film pin 808 is inserted into the pin placement port 703. A pin assembler 803 has a pin insertion port 806 with a tapered hole structure at its top. The pin assembler 803 is connected to a pin vacuum connector 804 and a pin seat adsorption connector 805. The pin vacuum connector 804 is connected to the top... Inside the bottom of the needle socket 806, the needle seat suction tube 805 connects to the side wall suction hole 807 on the inner side wall of the needle socket 806. Both the needle vacuum tube 804 and the outer end of the needle seat suction tube 805 are connected to the pneumatic control system. The needle socket 806 is located directly in front of the axis of the needle mounting plate 702. The bottom of the blue film needle 808 has a tapered insertion block, which inserts into the inside of the needle socket 806. The bottom of the blue film needle 808 has a needle bottom air hole 809, and the top has an opening connected to the needle bottom air hole 809. The vacuum suction port and the bottom air hole 809 of the ejector pin are connected to the ejector pin vacuum connector 804 through the bottom channel inside the ejector pin insertion port 806. Since different chip blue films 603 have different sizes, when pushing different chip blue films 603, blue film ejector pins 808 of corresponding size and type can be selected. The ejector pin mounting plate 702 stores various sizes and types of blue film ejector pins 808 through multiple ejector pin placement ports 703. When switching the blue film ejector pins 808 in the pusher 8, the movement of the lifting slider 801, the ejector pin magazine 7, and the ejector pin changing drive 701 are controlled. The rotation of the ejector mounting plate 702 enables the installation of different blue film ejector pins 808 in the ejector pin socket 806. After the tapered structure at the bottom of the blue film ejector pin 808 is inserted into the ejector pin socket 806, the pneumatic control system connected to the ejector seat adsorption pipe 805 and the suction hole 807 on the side wall of the socket creates a negative pressure inside the ejector pin socket 806, which firmly locks the blue film ejector pin 808 in the ejector pin assembler 803, realizing the automatic replacement of the blue film ejector pin 808. Through pneumatic control, the gripping, transfer and release of the blue film ejector pin 808 can be reliably completed, improving the degree of automation.

[0027] In this embodiment, a nozzle-changing drive unit 505 is fixedly connected to the chip pickup head 5. The bottom of the rotating shaft of the nozzle-changing drive unit 505 is connected to and drives a nozzle-changing pulley 506. The nozzle-changing pulley 506 is a synchronous pulley. The outer periphery of the nozzle disk 502 is machined with synchronous belt teeth. The nozzle-changing pulley 506 and the nozzle disk 502 are connected by a synchronous belt 507 to form a synchronous belt drive. Visual inspection cameras are fixedly connected to the front of the chip pickup head 5 and the rear of the dispensing mechanism 2. The nozzle disk 502 of the chip pickup head 5 integrates a variety of vacuum nozzles 504 of different sizes in the circumferential direction. Through the transmission of the nozzle-changing drive unit 505 and the synchronous belt 507, the nozzle disk 502 can be programmed to rotate, quickly positioning the vacuum nozzle 504 of the required size to the working position and docking with the negative pressure suction device 501. This design realizes the rapid switching of nozzles without manual intervention and machine shutdown for replacement.

[0028] The working principle of this embodiment is as follows: First, the substrate is placed above the placement stage 4, and adhesive is applied to the substrate by the dispensing mechanism 2. For larger chips, the precision dispensing head 201 can be used to apply adhesive to the substrate surface, while for smaller chips, the dipping head 202 can be used for dispensing. By moving the dispensing mechanism 2 and extending and retracting the dipping head 202, the dipping needle of the dipping head 202 picks up the adhesive located inside the dipping tray 3, and then applies the adhesive to the substrate surface, thereby adapting to the dispensing of chips of different sizes. After dispensing is completed, the substrate is moved to the right by the placement stage 4. The process involves conveying and placing various wafers above the chip blue film 603. The chip placement head 6 drives the chip placement rack 602 to rotate via the reversing drive 601, allowing the six chip blue films 603 to sequentially flow to the working position. Upon reaching the working position, the chip blue film 603 containing the required chip is located directly below the blue film ejector pin 808. The lifting slider 801 rises via the drive of the spiral lifting drive 802, causing the blue film ejector pin 808 to lift the chip blue film 603 at the working position, raising the height of the wafer at that position to facilitate chip pickup by the chip pick-up head 5. During the pickup process, the vertical stroke is reduced. For different blue film chips 603, different types of blue film ejector pins 808 need to be switched. At this time, the ejector pin mounting plate 702 can be rotated by the ejector pin changing drive 701, so that the required blue film ejector pin 808 is rotated to the position closest to the pusher 8. Then, through the cooperation of a series of transmission mechanisms, the ejector pin assembler 803 is transferred to the bottom of the required blue film ejector pin 808 and raised, so that the lower tapered structure of the blue film ejector pin 808 is inserted into the ejector pin socket 806. The air inside the ejector pin socket 806 is sucked away through the suction hole 807 on the side wall of the socket, so that... The blue film ejector pin 808 is fixedly installed inside the ejector pin socket 806. It is driven by the nozzle changer 505 and the synchronous belt 507 to programmatically drive the nozzle disk 502 to rotate, quickly positioning the vacuum nozzle 504 of the required size to the working position and docking with the negative pressure suction device 501. This design realizes the rapid switching of nozzles to pick up the chip above the chip blue film 603 and transfer it to the transfer station 9. The chip is inspected by a vision detector. After passing the inspection, the chip pick-up head 5 located in front picks up the chip and places it on the substrate above the placement stage 4 to complete the placement.

[0029] The following points should be noted in this article: 1. The accompanying drawings of the embodiments disclosed herein only relate to the structures involved in the embodiments disclosed herein; other structures can be referred to in a general design.

[0030] 2. Where there is no conflict, the embodiments of this disclosure and the features in the embodiments can be combined with each other to obtain new embodiments.

[0031] The above are merely specific embodiments of this disclosure, but the scope of protection of this disclosure is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art within the scope of the technology disclosed in this disclosure should be included within the scope of protection of this disclosure. Therefore, the scope of protection of this disclosure should be determined by the scope of the claims.

Claims

1. A chip mounting device capable of mounting chips of various sizes, comprising: The pick-and-place machine body (1) is characterized in that a dispensing mechanism (2), a placement table (4), a chip pickup head (5), and a chip placement head (6) are installed on the upper part of the pick-and-place machine body (1). The dispensing mechanism (2) is movably installed on the upper left edge of the pick-and-place machine body (1) via a guide rail and a magnetic coupling cylinder. The placement table (4) is movably installed on the upper front edge of the pick-and-place machine body (1) via a guide rail and a magnetic coupling cylinder. There are two chip pickup heads (5), and both chip pickup heads (5) are movably installed on the upper right edge of the pick-and-place machine body (1) via a magnetic coupling cylinder and a guide rail. A precision dispensing head (201) and a dipping head (202) are connected to the dispensing mechanism (2). A dipping tray (3) is fixedly connected to the upper part of the pick-and-place machine body (1). The dipping tray (3) is located directly behind the dipping head (202). A negative pressure suction device (501) is fixedly connected to the chip pickup head (5). The part is rotatably connected to a nozzle plate (502), and the nozzle plate (502) is provided with nozzle mounting ports (503) distributed around its circumference. Vacuum nozzles (504) of different sizes and models are fixedly connected inside different nozzle mounting ports (503). The bottom suction hole of the negative pressure suction device (501) is tightly fitted to the upper interface of the vacuum nozzle (504). The bottom of the vacuum nozzle (504) is a conical structure. The vacuum nozzle (504) is provided with a through hole connected to the bottom suction hole of the negative pressure suction device (501). The chip placement head (6) is movably installed on the rear edge above the chip placement machine body (1) via a magnetic coupling cylinder and a guide rail. Six chip blue films (603) are provided above the chip placement head (6). A pusher (8) is fixedly connected above the chip placement machine body (1). The pusher (8) is located below the chip blue film (603). A transfer station (9) and a vision detector facing the transfer station (9) are installed above the chip placement machine body (1).

2. The chip mounting apparatus for multiple chip sizes according to claim 1, characterized in that, A pin magazine (7) is installed on the top of the pick and place machine body (1). The pin magazine (7) is installed on the top of the pick and place machine body (1) through a screw drive mechanism. A pin mounting plate (702) is fixedly connected to the base of the pin magazine (7). A pin placement port (703) is opened on the outer periphery of the pin mounting plate (702). A blue film pin kit (808) is inserted into the pin placement port (703).

3. The chip mounting apparatus for various chip sizes according to claim 1, characterized in that, A reversing drive (601) is fixedly connected above the base of the chip mounting head (6), and a chip placement rack (602) is fixedly connected to the top of the rotating shaft of the reversing drive (601). The chip blue film (603) is installed inside the chip placement rack (602). The ejector pin library (7) is located to the right of the chip mounting head (6), and the pusher (8) is located in front of the ejector pin library (7).

4. The chip mounting apparatus for multiple chip sizes according to claim 3, characterized in that, The bottom of the pusher (8) is fixedly connected to a spiral lifting drive (802), the spiral lifting drive (802) is connected to a lead screw, the pusher (8) is slidably connected to a lifting slider (801), the lifting slider (801) is spirally connected to the lead screw, and the front of the lifting slider (801) is connected to a pin assembler (803).

5. The chip mounting apparatus for multiple chip sizes according to claim 4, characterized in that, The top of the ejector assembly (803) is provided with an ejector socket (806) with a tapered hole structure. The ejector assembly (803) is connected to an ejector vacuum connector (804) and an ejector adsorption connector (805). The ejector vacuum connector (804) is connected to the bottom of the ejector socket (806).

6. The chip mounting apparatus for multiple chip sizes according to claim 5, characterized in that, The ejector needle suction tube (805) is connected to the suction hole (807) on the inner side wall of the ejector needle socket (806). The outer ends of the ejector needle vacuum tube (804) and the ejector needle suction tube (805) are both connected to the pneumatic control system. The ejector needle socket (806) is located directly in front of the axis of the ejector needle mounting plate (702).

7. The chip mounting apparatus for multiple chip sizes according to claim 1, characterized in that, The bottom of the blue film pin assembly (808) is provided with a tapered plug block, and the plug block of the blue film pin assembly (808) is inserted into the pin socket (806).

8. The chip mounting apparatus for multiple chip sizes according to claim 7, characterized in that, The blue film ejector kit (808) has an ejector bottom air hole (809) at the bottom and a vacuum suction hole connected to the ejector bottom air hole (809) at the top. The ejector bottom air hole (809) is connected to the ejector vacuum connector (804) through the bottom channel inside the ejector insertion port (806).

9. The chip mounting apparatus for multiple chip sizes according to claim 1, characterized in that, The chip pickup head (5) is fixedly connected to a nozzle-changing drive unit (505). The bottom of the rotating shaft of the nozzle-changing drive unit (505) is connected to and drives the nozzle-changing pulley (506). The nozzle-changing pulley (506) is a synchronous pulley. The outer periphery of the suction disc (502) is machined with synchronous belt teeth. The nozzle-changing pulley (506) and the suction disc (502) are connected by a synchronous belt (507) to form a synchronous belt drive.

10. A chip mounting apparatus for multiple chip sizes according to claim 1, characterized in that, A visual inspection camera is fixedly connected to both the front of the chip pickup head (5) and the rear of the dispensing mechanism (2).

Images