An ultrathin multi-directional conduction foldable copper foil adhesive tape

Abstract

This invention discloses an ultra-thin, multi-directional, foldable copper foil tape, comprising: a copper foil tape layer having opposing first and second surfaces; a peelable protective layer covering at least the first surface of the copper foil tape layer, the protective layer having at least one bending guide structure; and a peelable release film layer adhered to the second surface of the copper foil tape layer; wherein the release film layer has a folded positioning portion, the positioning portion corresponding spatially to the bending guide structure, together forming a positioning reference during mounting. This ultra-thin, multi-directional, foldable copper foil tape enables convenient mounting operations with precise positioning, controllable bending, and reliable grounding within the confined space of a laptop motherboard.

Description

Technical Field

[0001] This invention relates to the field of electronic materials technology, and in particular to an ultra-thin, multi-conductive, foldable copper foil tape. Background Technology

[0002] As laptop motherboards continue to evolve towards higher integration, narrower bezels, and lighter weight, internal space is being squeezed to the extreme, and the gaps between components are becoming increasingly minute. Electromagnetic shielding and grounding connections, as fundamental components for ensuring the electrical performance of the motherboard, are facing severe challenges in their implementation.

[0003] In existing technologies, although metal shielding covers can provide a stable shielding effect, their rigid structure is difficult to adapt to the unevenness and irregular contours of the motherboard surface. Moreover, welding or mounting operations in such a small space result in low production efficiency, which can hardly meet the requirements of modern electronic manufacturing for high yield and fast cycle time.

[0004] While ordinary conductive tape offers the advantage of flexible application, it reveals significant operational drawbacks in practical production applications. Firstly, due to the lack of intuitive physical positioning benchmarks, operators rely solely on visual alignment in high-density component layouts, leading to significant fluctuations in placement accuracy. Even slight errors can result in misalignment, wrinkles, or obstruction of surrounding pads. Secondly, when bending the tape around components of varying heights, existing products lack predefined guidance for bending positions, relying entirely on manual experience. This results in uncertain bending points, irregular creases, and difficulty in ensuring consistency during mass production. Furthermore, the shielding and grounding performance of ordinary tape may degrade over prolonged use.

[0005] In summary, the key technical problem that needs to be solved in this field is to provide a conductive shielding material that combines ultra-thin flexibility, high precision operability, and stable three-dimensional conductivity, so that it can be quickly, accurately, and consistently mounted and bent in the narrow environment of a laptop motherboard, while ensuring long-term electromagnetic shielding and grounding reliability. Summary of the Invention

[0006] To address the aforementioned technical problems, the present invention aims to provide an ultra-thin, multi-directional, foldable copper foil tape. This ultra-thin, multi-directional, foldable copper foil tape enables convenient mounting operations with precise positioning, controllable bending, and reliable grounding within the confined space of a laptop motherboard.

[0007] To achieve the above-mentioned technical objectives and effects, the present invention is implemented through the following technical solution: An ultra-thin, multi-directional, foldable copper foil tape includes: A copper foil tape layer having opposing first and second surfaces; A peelable protective layer covers at least the first surface of the copper foil tape layer, and the protective layer is provided with at least one bending guide structure; A peelable release film layer is attached to the second surface of the copper foil tape layer; The release film layer has a folded positioning portion, which corresponds to the bending guide structure in spatial position and together constitutes the positioning reference during mounting.

[0008] Furthermore, the copper foil tape layer includes a copper foil substrate and a conductive adhesive layer disposed on one side surface of the copper foil substrate, and a black conductive coating is provided on the other side surface of the copper foil substrate, forming a three-dimensional conductive path in the XY plane and the Z vertical direction.

[0009] Furthermore, the protective layer is a silicone protective film, and the bending guide structure is a dotted line-shaped cut on the silicone protective film.

[0010] Furthermore, the silicone protective film includes a PET substrate layer and a silicone layer disposed on the PET substrate layer.

[0011] Furthermore, the positioning portion of the release film layer is a stepped structure formed by folding the side region of the release film 180° toward the back side.

[0012] Furthermore, the ultra-thin multi-directional foldable copper foil tape also includes a process auxiliary spacer film, which is partially disposed between the protective layer and the release film layer.

[0013] Furthermore, the 180° peel force between the copper foil tape layer and the target mounting surface is greater than 1300 g / inch; the 180° peel force between the protective layer and the copper foil tape layer is 1~3 g / 2.5 cm.

[0014] Furthermore, the total thickness of the copper foil tape layer and the protective layer is no greater than 0.07 mm.

[0015] Furthermore, the thickness of the copper foil tape layer is 0.025 mm, the thickness of the protective layer is 0.044 mm, and the thickness of the release film layer is 0.025 mm.

[0016] Furthermore, the planar conduction resistance of the copper foil tape layer is less than 0.1Ω, and the vertical conduction resistance is less than 0.05Ω.

[0017] The beneficial effects of this invention are as follows: (1) The positioning part formed by folding in this invention serves as a physical step, which can form a dual positioning reference of visual and tactile sense with the reference edge or mark on the motherboard before mounting. Operators can quickly and accurately place the tape in the predetermined position without visual estimation, thereby achieving precise positioning and effectively avoiding misalignment, skewness or obscuring of surrounding pads.

[0018] (2) The bending guide structure (such as dotted line cut) on the protective layer in this invention provides a clear path guide for bending operation. Combined with the position correspondence of the positioning part, the bending point position is consistent and the crease is regular, realizing controllable bending. It overcomes the problem of uncertainty in bending caused by relying entirely on manual experience in traditional products, and the consistency in batch operations is significantly improved.

[0019] (3) The copper foil tape layer in this invention is covered with a peelable protective layer, which provides rigid support for the ultra-thin copper foil, preventing it from curling or sticking, and also assists in the operation during positioning and bending. At the same time, the design of the release film layer and the protective layer allows the operator to complete the pre-positioning and pre-bending without removing the release film in advance, simplifying the process and improving the mounting efficiency.

[0020] (4) The tape of the present invention has precise alignment and controllable bending, and the protective layer can be easily removed without damaging the tape after final application. This greatly reduces rework or scrap caused by positioning deviation, improper bending or operation contamination, and improves yield. It is especially suitable for mass production in small and high-density scenarios such as laptop motherboards. Attached Figure Description

[0021] Figure 1 This is an exploded structural diagram of the ultra-thin multi-directional foldable copper foil tape of the present invention.

[0022] Figure 2 This is a schematic diagram of the overall structure of the ultra-thin multi-directional foldable copper foil tape of the present invention.

[0023] In the figure, 10: copper foil tape layer; 20: protective layer; 201: dashed cut; 30: release film layer; 301: positioning part; 40: process auxiliary spacer film. Detailed Implementation

[0024] The technical solutions of the present invention will be clearly and completely described below with reference to specific embodiments. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0025] like Figure 1 and Figure 2As shown, the present invention provides an ultra-thin, multi-directional, foldable copper foil tape, comprising a copper foil tape layer 10, a peelable protective layer 20, and a peelable release film layer 30. The copper foil tape layer 10 has opposing first and second surfaces. The protective layer 20 at least covers the first surface of the copper foil tape layer 10 and has at least one bending guide structure thereon. The release film layer 30 is adhered to the second surface of the copper foil tape layer 10. Specifically, the release film layer 30 has a folded positioning portion 301, which corresponds spatially to the bending guide structure, together forming a positioning reference during mounting.

[0026] With the above settings, operators can obtain clear physical and visual benchmarks without relying on visual inspection during the application process. This allows them to quickly and accurately place the tape in the predetermined position and achieve controllable and consistent bending operations along the preset guide structure, thereby significantly improving application accuracy and work efficiency, and effectively avoiding defects such as misalignment, wrinkles, or improper bending.

[0027] The copper foil tape layer 10 includes a copper foil substrate and a conductive adhesive layer disposed on one side surface of the copper foil substrate. A black conductive coating is provided on the other side surface of the copper foil substrate. Through the cooperation of the black conductive coating and the conductive adhesive layer, the copper foil tape layer 10 forms a three-dimensional conductive path in the XY plane and the Z vertical direction. For example, the planar conductivity of the copper foil tape layer 10 is less than 0.1Ω, and the vertical conductivity is less than 0.05Ω. This ensures that the tape has excellent conductivity in multiple directions, meeting the stringent requirements of notebook motherboards for grounding reliability and shielding continuity. Simultaneously, the black conductive coating effectively prevents oxidation of the copper foil surface, ensuring conductive stability during long-term use.

[0028] Preferably, the protective layer 20 is a silicone protective film, and the bending guide structure is a dotted line cut 201 disposed on the silicone protective film. Further, the silicone protective film includes a PET substrate layer and a silicone layer disposed on the PET substrate layer. This protective layer 20 covers the copper foil tape layer 10, specifically contacting the side of the copper foil tape layer 10 with the black conductive coating, providing rigid support for the flexible and easily curled copper foil and preventing it from sticking or wrinkling during operation. The dotted line cut 201 pre-forms a mechanical weakening line at the bending position, guiding the operator to make precise and consistent bends along this line, thereby ensuring the uniformity of crease positions and the regularity of creases in mass production.

[0029] The release film layer 30 can be, for example, red for visual identification. Its positioning part 301 is preferably a stepped structure formed by folding the side area of ​​the release film 180° towards the back. This stepped structure can physically abut against the reference edge or pre-set mark on the motherboard during installation, creating a direct tactile and visual positioning reference. Operators can use the positioning part 301 to pre-align the tape without removing it beforehand. After the tape is placed in place and bent along the dotted cut 201, the release film is then peeled off for final attachment, greatly simplifying the operation and reducing the difficulty of operation in confined spaces.

[0030] The ultra-thin, multi-directional, foldable copper foil tape may also include a process auxiliary spacer film 40. This process auxiliary spacer film 40 is partially disposed between the protective layer 20 and the release film layer 30. Its function is to appropriately space the protective layer 20 and the release film layer 30, preventing adhesion between the layers due to static electricity or excessive tightness, thus avoiding difficulty in tearing the film. Simultaneously, this process auxiliary spacer film 40 can also reduce the entanglement effect on the edges of the copper foil tape layer 10 during die-cutting and waste removal processes, thereby improving manufacturing yield and operational smoothness.

[0031] Preferably, the 180° peel force between the copper foil tape layer 10 and the target mounting surface is greater than 1300 g / inch, thereby ensuring a strong bond between the tape and the motherboard pads or grounding points after application, meeting the anti-peeling requirements for long-term use. The 180° peel force between the protective layer 20 and the copper foil tape layer 10 is 1~3 g / 2.5 cm. This low-tack design allows the protective layer 20 to be easily peeled off by hand after positioning, guiding, and bending operations, and after applying final compaction to the copper foil tape layer 10, without leaving any adhesive residue on the surface of the copper foil tape layer 10 even at high temperatures. By differentiating and matching the peel forces of the two layers, the ease of operation and interface cleanliness during the process are considered while ensuring mounting reliability.

[0032] Considering the stringent requirements for thinness and lightness of laptop motherboards, preferably, the total thickness of the copper foil tape layer 10 and the protective layer 20 is no greater than 0.07 mm.

[0033] The present invention will be further described below through specific embodiments.

[0034] Example like Figure 1 and Figure 2 As shown, this embodiment provides an ultra-thin, multi-directional, foldable copper foil tape, the specific structure and materials of which are as follows: Copper foil tape layer 10: 3M 1020BC-25 copper foil tape is used, with a total thickness of 0.025mm. This copper foil tape layer 10 includes a copper foil substrate, with a conductive adhesive layer on one side and a black conductive coating on the other side.

[0035] Protective layer 20: Covering the first surface of the copper foil tape layer 10 (i.e., the surface where the black conductive coating is located), it uses a silicone protective film of model PET0036-02LEGB-25S with a total thickness of 0.044mm. This silicone protective film includes a PET substrate layer and a silicone layer disposed on the PET substrate layer. Dashed-line cuts 201 are provided on the silicone protective film at predetermined bending positions, with a cut depth of 50% to 70% of the total thickness of the silicone protective film, and are discontinuous perforations or half-cut structures.

[0036] Release film layer 30: Adhered to the second surface (i.e., the surface where the conductive adhesive layer is located) of the copper foil tape layer 10, using a red release film of model 23T020R with a thickness of 0.025mm. One edge region of this release film layer 30 is folded 180° towards the back side to form a stepped positioning part 301. This positioning part 301 corresponds spatially to the dotted line-shaped cut 201 on the silicone protective film.

[0037] Process auxiliary spacer 40: Near the folding area, a process auxiliary spacer 40 is locally placed between the silicone protective film and the red release film. This spacer is made of PET material, with a thickness of 0.012mm and a width of 2mm, and does not directly contact the copper foil tape layer 10. This spacer is attached along the edge of the folding positioning part 301, separating the upper and lower films in a localized area.

[0038] Peel force parameters: The 180° peel force between the conductive adhesive layer of the copper foil tape layer 10 and the surface to be applied is 1350g / inch; the 180° peel force between the protective layer 20 and the copper foil tape layer 10 is 2g / 2.5cm (test conditions: placed for 20 minutes after application, 180° peel speed 300mm / min).

[0039] Electrical properties: The planar conductivity of copper foil tape layer 10 is 0.05Ω, and the vertical conductivity is 0.02Ω (test pressure 500g, contact area 1cm²). 2 ).

[0040] It will be apparent to those skilled in the art that the present invention is not limited to the details of the exemplary embodiments described above, and that the invention can be implemented in other specific forms without departing from the spirit or essential characteristics of the invention. Therefore, the embodiments should be considered in all respects as exemplary and non-limiting, and the scope of the invention is defined by the appended claims rather than the foregoing description. Thus, it is intended that all variations falling within the meaning and scope of equivalents of the claims be included within the present invention.

[0041] Furthermore, it should be understood that although this specification describes embodiments, not every embodiment contains only one independent technical solution. This narrative style is merely for clarity. Those skilled in the art should consider the specification as a whole, and the technical solutions in each embodiment can also be appropriately combined to form other embodiments that can be understood by those skilled in the art.

Claims

1. An ultra-thin, multi-directional, foldable copper foil tape, characterized in that, include: A copper foil tape layer having opposing first and second surfaces; A peelable protective layer covers at least the first surface of the copper foil tape layer, and the protective layer is provided with at least one bending guide structure; A peelable release film layer is attached to the second surface of the copper foil tape layer; The release film layer has a folded positioning portion, which corresponds to the bending guide structure in spatial position and together constitutes the positioning reference during mounting.

2. The ultra-thin multi-directional foldable copper foil tape according to claim 1, characterized in that, The copper foil tape layer includes a copper foil substrate and a conductive adhesive layer disposed on one side of the copper foil substrate. The other side of the copper foil substrate is provided with a black conductive coating, forming a three-dimensional conductive path in the XY plane and the Z vertical direction.

3. The ultra-thin multi-directional foldable copper foil tape according to claim 1, characterized in that, The protective layer is a silicone protective film, and the bending guide structure is a dotted line-shaped cut on the silicone protective film.

4. The ultra-thin multi-directional foldable copper foil tape according to claim 3, characterized in that, The silicone protective film includes a PET substrate layer and a silicone layer disposed on the PET substrate layer.

5. The ultra-thin multi-directional foldable copper foil tape according to claim 1, characterized in that, The positioning part of the release film layer is a stepped structure formed by folding the side area of ​​the release film 180° towards the back side.

6. The ultra-thin multi-directional foldable copper foil tape according to claim 1, characterized in that, It also includes a process-aided spacer membrane, which is partially disposed between the protective layer and the release film layer.

7. The ultra-thin multi-directional foldable copper foil tape according to claim 1, characterized in that, The 180° peel force between the copper foil tape layer and the target mounting surface is greater than 1300 g / inch; the 180° peel force between the protective layer and the copper foil tape layer is 1~3 g / 2.5 cm.

8. The ultra-thin multi-directional foldable copper foil tape according to claim 1, characterized in that, The total thickness of the copper foil tape layer and the protective layer is no greater than 0.07 mm.

9. The ultra-thin multi-directional foldable copper foil tape according to claim 1 or 8, characterized in that, The thickness of the copper foil tape layer is 0.025 mm, the thickness of the protective layer is 0.044 mm, and the thickness of the release film layer is 0.025 mm.

10. The ultra-thin multi-directional foldable copper foil tape according to claim 2, characterized in that, The planar conduction resistance of the copper foil tape layer is less than 0.1Ω, and the vertical conduction resistance is less than 0.05Ω.

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