Temperature regulating device and coating apparatus

Abstract

This application relates to a temperature regulation device for a heating plate. Several assembly areas are positioned opposite the lower surface of the heating plate. Temperature control elements are movably mounted on the main plate, and each element is movably mounted in one of the assembly areas of the main plate. Each temperature control element is used to exchange heat with a different area of ​​the lower surface of the heating plate. When the main plate and the heating plate are aligned vertically, each temperature control element can be aligned with a specific area of ​​the heating plate. By matching the temperature control elements with different areas of the heating plate, each element is used to exchange heat with a different area of ​​the lower surface of the heating plate, thereby specifically regulating the temperature of different areas of the heating plate. This achieves temperature uniformity adjustment of the heating plate, ensuring that the wafer on the heating plate receives uniform heating. This regulation method has low cost, requires minimal equipment modification, and ensures more uniform temperature across all areas of the wafer.

Description

Technical Field

[0001] This application relates to the field of semiconductor technology, and in particular to temperature control devices and coating equipment. Background Technology

[0002] In semiconductor coating equipment, many factors affect the wafer deposition rate, such as temperature, airflow distribution, and radio frequency field strength. The influencing factors vary depending on the coating process. In temperature-sensitive coating processes, conventional methods use heating pads made of metal or ceramic to heat the wafer. The arrangement of the heating wires in the heating pad significantly affects the temperature uniformity of the heated wafer. Moreover, even the same heating pad may exhibit different temperature characteristics depending on the chamber environment.

[0003] Therefore, in temperature-sensitive coating processes, existing heating plates cannot provide precise heating effects, which may result in temperature-sensitive process results that exceed requirements. Thus, heating plates with higher heating precision are needed to solve the above-mentioned technical problems. Summary of the Invention

[0004] Therefore, it is necessary to provide a temperature regulation device and a coating equipment to address the aforementioned technical problems.

[0005] This application provides a temperature regulating device suitable for a heating plate, the temperature regulating device comprising:

[0006] The main plate has several assembly areas, which are positioned opposite to the lower surface of the heating plate.

[0007] A temperature control device is movably mounted on the main body plate. The number of temperature control devices is configured to be several, and the several temperature control devices are respectively movably mounted on several assembly areas of the main body plate. Each temperature control device is used to exchange heat with different areas of the lower surface of the heating plate, thereby adjusting the temperature of the heating plate to a uniform temperature state.

[0008] In one embodiment, at least a portion of the temperature control device has a fluid channel inside, through which fluid flows to adjust the temperature of the temperature control device, thereby adjusting the heat exchange between the temperature control device and the lower surface of the heating plate.

[0009] In one embodiment, the temperature regulating device includes:

[0010] A flow control unit is connected to the fluid channels of at least a portion of the temperature control unit. The flow control unit is used to control the fluid state of the fluid flowing through at least a portion of the fluid channels, the fluid state including at least one of fluid temperature and fluid velocity.

[0011] In one embodiment, the flow control unit is used to individually adjust the fluid state of the fluid flowing through each of the fluid channels;

[0012] Alternatively, the flow control unit is used to synchronously adjust the fluid state of the fluid flowing through all the fluid channels.

[0013] In one embodiment, the temperature regulating device includes:

[0014] A temperature control unit is provided, wherein the temperature control device is a semiconductor cooling device. The temperature control unit is connected to the temperature control device and is used to control the temperature of the temperature control device, thereby adjusting the heat exchange between the temperature control device and the lower surface of the heating plate.

[0015] In one embodiment, the temperature control active assembly on the main body includes:

[0016] The temperature control device is detachable relative to the main body plate; and / or, the temperature control device is adjustable in height relative to the main body plate on the upper surface of the main body plate.

[0017] In one embodiment, the main body disk has an assembly hole that extends through the thickness direction of the disk body. The number of assembly holes is configured to be several, with one assembly hole provided in each assembly area, and a temperature control device is movably assembled in each assembly hole.

[0018] In one embodiment, the temperature regulating device includes:

[0019] A temperature measuring unit is used to acquire temperature data of a target object, wherein the target object is configured to be disposed on the upper surface of the heating plate, and the temperature data includes different temperature values ​​of several different areas of the target object.

[0020] A calculation unit is used to acquire the temperature data and generate temperature field information of the target object based on the temperature data. The temperature field information is used as a basis for adjusting several temperature control devices relative to the main body and controlling the temperature of the temperature control devices.

[0021] In one embodiment, the temperature regulating device includes:

[0022] A control unit, which is connected to the computing unit, is used to control at least one temperature control device to adjust its height on the upper surface of the main plate according to the temperature field information.

[0023] In one embodiment, the control unit includes:

[0024] A lifting component, wherein the number of the lifting components is configured to be several, each of the lifting components is connected to a temperature control component, and the lifting component is used to adjust the height of the temperature control component on the upper surface of the main plate;

[0025] A driver, which is driven and connected to at least one of the lifting components, and is connected to the computing unit, is used to drive the lifting components to adjust the height of the temperature control on the upper surface of the main plate according to the temperature field information.

[0026] This application provides a coating apparatus, the coating apparatus comprising:

[0027] A heating plate, the upper surface of which is used to set the target object;

[0028] The temperature regulating device is located below the heating plate.

[0029] In one embodiment, the temperature regulating device can adjust the distance relative to the lower surface of the heating plate.

[0030] In the aforementioned temperature control device and coating equipment, when the main plate and the heating plate are aligned vertically, each temperature control element can be aligned vertically with a specific area of ​​the heating plate. By matching the temperature control elements with different areas of the heating plate, each element is used to exchange heat with a different area on the lower surface of the heating plate, thereby specifically controlling the temperature of different areas of the heating plate. This achieves temperature uniformity adjustment of the heating plate, ensuring that the wafer on the heating plate receives uniform heating. This method has low cost, requires minimal equipment modification, and can directly improve existing equipment to ensure more uniform temperature across all areas of the wafer. Attached Figure Description

[0031] Figure 1 This is a schematic diagram showing the usage state of the temperature regulating device and the heating plate provided in one embodiment of this application.

[0032] Figure 2 For example Figure 1 The temperature control device and heating plate are shown in a perspective view in use.

[0033] Figure 3This is a schematic diagram of the assembly structure of the temperature control and flow control unit provided in one embodiment of this application.

[0034] Figure 4 This is a schematic diagram of the assembly structure of the temperature control device and temperature control unit provided in another embodiment of this application.

[0035] Figure 5 This is a schematic diagram illustrating the usage state and coordination of the temperature control and heating plate provided in one embodiment of this application.

[0036] Icon labels:

[0037] 100. Heating plate; 200. Vacuum chamber;

[0038] 1000, Main panel; 2000, Temperature control unit; 3000, Control unit; 4000, Flow control unit; 5000, Temperature control unit;

[0039] 1000a, Assembly Area;

[0040] 2100, fluid channel;

[0041] 3100, Lifting component. Detailed Implementation

[0042] To make the above-mentioned objectives, features, and advantages of this application more apparent and understandable, the specific embodiments of this application are described in detail below with reference to the accompanying drawings. Many specific details are set forth in the following description to provide a thorough understanding of this application. However, this application can be implemented in many other ways different from those described herein, and those skilled in the art can make similar modifications without departing from the spirit of this application. Therefore, this application is not limited to the specific embodiments disclosed below.

[0043] In the description of this application, it should be understood that if terms such as "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential" appear, these terms indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application.

[0044] Furthermore, where the terms "first" and "second" appear, these terms are for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined with "first" or "second" may explicitly or implicitly include at least one of that feature. In the description of this application, where the term "multiple" appears, "multiple" means at least two, such as two, three, etc., unless otherwise explicitly specified.

[0045] In this application, unless otherwise expressly specified and limited, the terms "installation," "connection," "joining," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components, unless otherwise expressly limited. Those skilled in the art can understand the specific meaning of the above terms in this application based on the specific circumstances.

[0046] In this application, unless otherwise expressly specified and limited, the use of descriptions such as "above" or "below" the second feature indicates that the first and second features are in direct contact or indirect contact via an intermediate medium. Furthermore, "above," "on top of," and "over" the second feature can mean that the first feature is directly above or diagonally above the second feature, or simply that the first feature is at a higher horizontal level than the second feature. Similarly, "below," "below," and "under" the second feature can mean that the first feature is directly below or diagonally below the second feature, or simply that the first feature is at a lower horizontal level than the second feature.

[0047] It should be noted that if an element is referred to as being "fixed to" or "set on" another element, it can be directly on the other element or there may be an intervening element. If an element is considered to be "connected to" another element, it can be directly connected to the other element or there may be an intervening element. If so, the terms "vertical," "horizontal," "upper," "lower," "left," "right," and similar expressions used in this application are for illustrative purposes only and do not represent the only possible implementation.

[0048] like Figure 1 and Figure 2As shown, this application provides a temperature regulating device for a heating plate 100. This device is used in conjunction with the heating plate 100 for heating wafers to compensate for uneven heating during the wafer heating process. This is because the heating plate 100 dissipates heat to its surroundings while maintaining a certain temperature, which means it cannot maintain the expected ideal temperature during the heat preservation process, thus affecting the uniform heating of the wafer. Furthermore, due to the good thermal conductivity of the material used in the heating plate 100 and its small thickness in the vertical direction, the temperature changes rapidly, especially in the vertical direction.

[0049] Therefore, when the above-mentioned temperature regulation device is used, when the temperature of a certain area or some areas of the heating plate 100 is too high or too low, the temperature regulation device can adjust the temperature of a certain area or some areas of the heating plate 100 accordingly, thereby ensuring that the heat preservation state of the heating plate 100 can be maintained at the expected ideal temperature state, thereby ensuring uniform heating of the wafer.

[0050] The temperature regulating device can be configured to match the temperature changes of the heating plate 100 and can adopt a suitable temperature regulating method. For example, in one embodiment, the temperature regulating device includes a main plate 1000. The shape of the main plate 1000 can be circular, elliptical, polygonal, etc. The main plate 1000 needs to be vertically aligned with the heating plate 100. Therefore, when the main plate 1000 is vertically aligned with the heating plate 100, it should cover the entire area of ​​the heating plate 100 in the vertical direction, thereby regulating the temperature of any area of ​​the heating plate 100.

[0051] The main plate 1000 is provided with several assembly areas 1000a. Each assembly area 1000a is a region divided from the upper surface of the main plate 1000. The assembly areas 1000a are opposite to the lower surface of the heating plate 100. The division of the assembly areas 1000a is used to set the temperature control 2000 according to the region division. Therefore, the assembly areas 1000a can be virtual divisions or solid divisions formed on the assembly areas 1000a by lines, solid structures, etc. Those skilled in the art can choose the formation method of the assembly areas 1000a according to actual needs, and no limitation is made here.

[0052] Temperature control devices 2000 are movably assembled on the main body disk 1000. The number of temperature control devices 2000 is configured to be several, and based on the formation of several assembly areas 1000a, the several temperature control devices 2000 can be movably assembled on the main body disk 1000 in several assembly areas 1000a respectively, so that the several temperature control devices 2000 are regularly arranged on the main body disk 1000 based on the division of the several assembly areas 1000a. In one embodiment, at least one annular distribution track is provided on the upper surface of the main body disk 1000, and the several assembly areas 1000a are distributed along the at least one annular distribution track on the upper surface of the main body disk 1000, with each temperature control device 2000 movably assembled in one assembly area 1000a.

[0053] like Figure 2 As shown, two annular distribution trajectories are set, so several assembly areas 1000a can be distributed into two annularities of different sizes, and several temperature control elements 2000 are also distributed on the upper surface of the main body disk 1000 in two annularities of different sizes. In addition, the several assembly areas 1000a and several temperature control elements 2000 can also be distributed on the main body disk 1000 in various regular or irregular shapes such as rectangles and ellipses, which is not limited here.

[0054] In one embodiment, the upper surface of the main plate 1000 is flat. The material of the temperature control device 2000 can be metal, ceramic, or glass, etc. The temperature control device 2000 has a first surface and a second surface facing opposite directions. The first surface faces the heating plate 100, and the second surface faces away from the heating plate 100. The first surface is provided with a heat-reflective film, such as a reflective heat-insulating film, which can be used for heat preservation. The second surface is provided with a heat-absorbing film, which can be used for heat absorption and cooling.

[0055] At this time, when the main plate 1000 and the heating plate 100 are aligned vertically, each temperature control unit 2000 can be aligned vertically with a specific area of ​​the heating plate 100. By matching the temperature control unit 2000 with different areas on the heating plate 100, each temperature control unit 2000 is used to exchange heat with different areas on the lower surface of the heating plate 100, thereby specifically controlling the temperature of different areas of the heating plate 100. In this way, the temperature of the heating plate 100 is adjusted to a uniform temperature state, thereby achieving the adjustment of the temperature uniformity of the heating plate 100, thus ensuring that the wafer on the heating plate 100 can receive a uniform heating state.

[0056] The heat exchange between the temperature control unit 2000 and different areas of the heating plate 100 includes transferring heat to the heating plate 100 to raise its temperature, or absorbing heat from the heating plate 100 to lower its temperature. In one embodiment, at least a portion or all of the temperature control units 2000 are provided with a fluid channel 2100. The fluid channel 2100 of the temperature control unit 2000 is used for the flow of a fluid, including a liquid or a gas, which has a certain temperature. Therefore, the fluid can be used to adjust the temperature of the temperature control unit 2000, making the temperature of the temperature control unit 2000 higher or lower than a specific area of ​​the heating plate 100. Thus, the heat exchange between the temperature control unit 2000 and the lower surface of the heating plate 100 is adjusted by controlling the flow of the fluid.

[0057] Since heat transfer primarily occurs through conduction, thermal radiation, and thermal convection, the relative importance of these three mechanisms varies across different temperature ranges. Conduction refers to the main mode of heat transfer in solids, achieved through molecular vibrations and the migration of free electrons. Below 100°C, conduction is typically the dominant heat transfer mechanism because thermal convection and thermal radiation are relatively weak. Thermal convection primarily occurs in fluids; when a fluid is heated, the denser, hotter fluid rises while the denser, colder fluid sinks, creating a convective cycle. In environments between 100°C and 500°C, thermal convection may become the dominant heat transfer mechanism, especially when fluid flow is rapid. Thermal radiation refers to the emission of electromagnetic waves by an object due to its temperature; it can occur in a vacuum without a medium. The intensity of thermal radiation increases with temperature. Above 500°C, thermal radiation may become the dominant heat transfer mechanism, especially in the absence of a medium or when the medium's contribution to heat transfer is minimal.

[0058] For applications in environments below 100°C, in one embodiment, such as Figure 3 As shown, the temperature control device may include a flow control unit 4000, which is connected to the fluid channel 2100 of at least a portion of the temperature control unit 2000. The flow control unit 4000 includes, but is not limited to, a pipe for connecting the fluid channel 2100, a pump for controlling the flow of fluid, a controller for controlling parameters such as the temperature and flow rate of the fluid, and a storage device for storing fluid. All of these components may be located outside the vacuum chamber 200.

[0059] Therefore, the flow control unit 4000 can be used to control the fluid state of the fluid flowing through at least a portion or all of the fluid channels 2100, wherein the fluid state includes at least one of the fluid temperature and fluid velocity. For example, the flow control unit 4000 can be used to adjust the fluid state of the fluid flowing through each fluid channel 2100 individually, or the flow control unit 4000 can be used to simultaneously adjust the fluid state of the fluid flowing through all the fluid channels 2100. Those skilled in the art can select a suitable control method according to actual needs, and no limitation is made here.

[0060] Or, in one embodiment, such as Figure 4 As shown, the temperature regulating device may also include a temperature control unit 5000. The temperature control unit 2000 is a semiconductor refrigeration element, also called a thermoelectric cooler. The semiconductor refrigeration element utilizes the Peltier effect of semiconductor materials. The Peltier effect refers to the phenomenon that when direct current passes through a thermocouple composed of two different semiconductor materials connected in series, heat can be absorbed and released at the two ends of the thermocouple, achieving both cooling and heating. For example, one side of the temperature control unit 2000 can be used for cooling, and the other side can be used for heating. Therefore, the temperature control unit 5000 is connected to the temperature control unit 2000 and can be used to supply direct current to the temperature control unit 2000, thereby controlling the temperature of the temperature control unit 2000 and adjusting the heat exchange between the temperature control unit 2000 and the lower surface of the heating plate 100.

[0061] Each thermoelectric cooler chip can be encapsulated to prevent it from detaching or dropping impurities in the low-pressure vacuum environment of the vacuum chamber 200, thus avoiding contamination of the chamber environment. Each thermoelectric cooler chip can be precisely temperature-controlled by the temperature control unit 5000, requiring only the control of its voltage and current. The wires of the temperature control unit 5000 and the temperature control device 2000 can be integrated with the circuitry in the heating plate 100, resulting in a simple structure that requires no major modifications to the equipment or disassembly, enabling uniform adjustment of different temperature fields.

[0062] In addition, for operating environments below 100°C, the spatial position of the temperature control unit 2000 can be adjusted as needed based on any of the above temperature adjustment methods to further regulate and control the heat exchange. Those skilled in the art can choose whether to adjust the spatial position of the temperature control unit 2000 relative to the heating plate 100 as needed, which is not limited here.

[0063] For example, the temperature adjustment of different areas of the heating plate 100 by the temperature control 2000 can also be achieved based on the movable assembly of the temperature control 2000 relative to the main plate 1000. In one embodiment, the movable assembly of the temperature control 2000 on the main plate 1000 includes: the temperature control 2000 can be separated from the main plate 1000, that is, the temperature control 2000 can be assembled on the main plate 1000 relative to a specific assembly area 1000a of the main plate 1000. At the same time, when it is not necessary to heat or cool down a specific area of ​​the heating plate 100, the corresponding temperature control 2000 can be removed from the main plate 1000.

[0064] Alternatively, the temperature control 2000 can be movably mounted on the main plate 1000, allowing adjustment of its height relative to the main plate 1000's upper surface. Specifically, when a specific area of ​​the heating plate 100 dissipates more heat and requires more heat transfer, the height of the temperature control 2000 can be adjusted to bring it closer to the specific area of ​​the heating plate 100, thereby transferring more heat to the heating plate 100. Conversely, if a specific area of ​​the heating plate 100 dissipates less heat and does not require much heat transfer, the height of the temperature control 2000 can be adjusted to move it further away from the specific area of ​​the heating plate 100, reducing the amount of heat transferred to the heating plate 100. Similarly, cooling can also be achieved by adjusting the distance relative to the heating plate 100, which will not be elaborated upon here.

[0065] For example, when the temperature control unit 2000 transfers heat to the heating plate 100, if the temperature of a certain area of ​​the heating plate 100 is too high during the cooling process, the temperature control unit 2000 at the corresponding position on the main plate 1000 can be removed to cool that area of ​​the heating plate 100. During the heating process of the heating plate 100, all temperature control units 2000 are first removed. Then, if the temperature of a certain area of ​​the heating plate 100 is too low, a temperature control unit 2000 can be installed at the corresponding position on the main plate 1000 to heat that area of ​​the heating plate 100.

[0066] Similarly, during the cooling and heating processes described above, the cooling or heating of the heating plate 100 can be adjusted by adjusting the distance between a certain temperature control 2000 and a certain area on the heating plate 100. In one embodiment, the adjustable distance between the temperature control 2000 and the lower surface of the heating plate 100 can be set between 0.5mm and 5mm. Those skilled in the art can adjust this adjustable distance according to actual needs, and no limitation is made here.

[0067] During the temperature regulation process described above, the temperature regulation device mainly changes the heat transfer rate of the corresponding area by replacing or adding / removing the temperature control 2000 of the corresponding area, so that the heat transfer rate of the corresponding area differs from that of the other areas, thereby making the temperature field more uniform.

[0068] The temperature control device 2000 can be installed on the main body disk 1000 in various ways. For example, the main body disk 1000 can have mounting slots or mounting holes for accommodating the temperature control device 2000. For instance, in one embodiment, the main body disk 1000 has mounting holes that extend through its thickness direction. The number of mounting holes is configured to be several, with one mounting hole provided in each mounting area 1000a. Each mounting hole can movably mount a temperature control device 2000. Based on the shape, size, and other structural features of the temperature control device 2000, the mounting holes can be adapted to accommodate the shape and size of the temperature control device 2000, as long as the temperature control device 2000 can be flexibly mounted in the mounting holes, facilitating installation and removal. No limitation is imposed here.

[0069] Adjustments to the temperature control units 2000 on the main plate 1000, such as installation, removal, and height adjustment, can be performed manually or automatically. In one embodiment, the temperature control device may further include a temperature measuring unit and a calculation unit. The temperature measuring unit can use the wafer as the target object for measurement and can be used to acquire temperature data of the target object, i.e., the temperature data of the wafer. The target object is configured to be placed on the upper surface of the heating plate 100, and the temperature data includes different temperature values ​​of several different regions of the target object. The calculation unit acquires the obtained temperature data and performs simulation calculations based on the temperature data to calculate a simulated temperature field, thereby generating temperature field information of the target object. This temperature field information serves as the basis for adjusting the temperature control units 2000 relative to the main plate 1000 and controlling the temperature of the temperature control units 2000.

[0070] Therefore, by knowing the temperature field information of the wafer, the heating uniformity of the wafer during the heating process can be known. If the temperature of a certain area of ​​the wafer is too high or too low, the vacuum chamber 200 can be opened, and the temperature control 2000 at the corresponding position on the main plate 1000 can be manually adjusted, such as by installation, removal, and height adjustment, to change the heat convection and heat radiation of the corresponding area of ​​the heating plate 100, thereby increasing or decreasing the amount of heat loss downward in the corresponding area of ​​the heating plate 100, thus adjusting the temperature uniformity of the heating plate 100, thereby ensuring that the wafer on the heating plate 100 can be heated uniformly.

[0071] In an automatic control method, for example, in one embodiment, the temperature regulation device may further include a control unit 3000. The control unit 3000 is connected to a computing unit. The control unit 3000 is used to control at least one temperature control element 2000 to adjust its height on the upper surface of the main disk 1000 based on temperature field information. That is, the control unit 3000 can know the heating uniformity of the wafer during the heating process based on the wafer's temperature field information. If the temperature of a certain area of ​​the wafer is too high or too low, the control unit 3000 can automatically adjust the temperature control element 2000 at the corresponding position on the main disk 1000, such as by installation, removal, and height adjustment, instead of manually adjusting it by opening the vacuum chamber 200. The control unit 3000 can change the heat convection and heat radiation of the corresponding area of ​​the heating disk 100 by adjusting the temperature control element 2000, thereby increasing or decreasing the amount of heat loss downward in the corresponding area of ​​the heating disk 100, thereby adjusting the temperature uniformity of the heating disk 100 and ensuring that the wafer on the heating disk 100 receives a uniform heating state.

[0072] The control unit 3000 can employ various mechanisms for automatic control, such as... Figure 5 As shown, in one embodiment, the control unit 3000 includes a lifting member 3100 and a driver. The number of lifting members 3100 is configured to be several, and each lifting member 3100 is connected to a temperature control 2000. The lifting member 3100 is used to adjust the height of the temperature control 2000 on the upper surface of the main body disk 1000. The driver is driven to at least one lifting member 3100 and is connected to a computing unit. The driver is used to drive the lifting member 3100 to adjust the height of the temperature control 2000 on the upper surface of the main body disk 1000 according to the temperature field information.

[0073] The main plate 1000 of the temperature regulating device can be located in the vacuum chamber 200 at the same time as the heating plate 100. In addition, other structures and units in the temperature regulating device, such as the control unit 3000 and the calculation unit, can be set outside the vacuum chamber 200 as needed. Those skilled in the art can choose a suitable setting method according to actual needs, and no limitation is made here.

[0074] In the embodiment of the control unit 3000 described above, each temperature control 2000 may correspond to a lifting member 3100, so that the lifting members 3100 can adjust the temperature control 2000 on the main body plate 1000 one-to-one. The lifting members 3100 may be disposed inside the vacuum chamber 200, thereby controlling the linear movement of the temperature control 2000, i.e., the movement in the height direction, inside the vacuum chamber 200.

[0075] In addition, when the sealing design meets the requirements, the lifting member 3100 can also be movably inserted through the vacuum chamber 200 from the outside to the inside of the vacuum chamber 200. The part of it inserted through the vacuum chamber 200 is connected to the temperature control unit 2000. The lifting member 3100 can form a sealed assembly with the vacuum chamber 200, and the sealed assembly can adopt a variety of sealing methods.

[0076] For example, a retractable bellows can be fitted around the outer periphery of the lifting member 3100. One end of the bellows is sealed to the temperature control unit 2000, and the other end is sealed to the chamber shell of the vacuum chamber 200. In this case, the actuator can be located outside the vacuum chamber 200, driving the lifting member 3100 to perform lifting and lowering movements from the outside. This embodiment allows for temperature adjustment without opening the vacuum chamber 200, saving time and improving efficiency.

[0077] This application provides a coating apparatus, which includes a heating plate 100 and the aforementioned temperature regulating device. The upper surface of the heating plate 100 is used to set the target object, i.e., a wafer. The temperature regulating device is located below the heating plate 100. Since the specific structure, functional principle, and technical effects of the aforementioned temperature regulating device have been described in detail above, they will not be repeated here. Any technical details regarding the aforementioned temperature regulating device can be found in the foregoing description.

[0078] In one embodiment, the temperature regulating device can adjust the distance relative to the lower surface of the heating plate 100. After the temperature regulating device adjusts the relative distance with respect to the lower surface of the heating plate 100, the relative distance between all temperature control devices 2000 and the lower surface of the heating plate 100 can be adjusted. This can also be used to adjust the degree of temperature regulation of the heating plate 100 by the temperature regulating device. Those skilled in the art can select a suitable relative distance between the temperature regulating device and the heating plate 100 for temperature regulation according to their needs, which is not limited here.

[0079] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0080] The embodiments described above are merely illustrative of several implementation methods of this application, and while the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the patent application. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this application, and these all fall within the protection scope of this application. Therefore, the protection scope of this patent application should be determined by the appended claims.

Claims

1. A temperature regulating device suitable for a heating plate, characterized in that, The temperature regulating device includes: The main plate has several assembly areas, which are positioned opposite to the lower surface of the heating plate. A temperature control device is movably mounted on the main body plate. The number of temperature control devices is configured to be several, and the several temperature control devices are respectively movably mounted on several assembly areas of the main body plate. Each temperature control device is used to exchange heat with different areas of the lower surface of the heating plate, thereby adjusting the temperature of the heating plate to a uniform temperature state.

2. The temperature regulating device according to claim 1, characterized in that, At least a portion of the temperature control device has a fluid channel inside, through which fluid flows to adjust the temperature of the temperature control device, thereby adjusting the heat exchange between the temperature control device and the lower surface of the heating plate.

3. The temperature regulating device according to claim 2, characterized in that, The temperature regulating device includes: A flow control unit is connected to the fluid channels of at least a portion of the temperature control unit. The flow control unit is used to control the fluid state of the fluid flowing through at least a portion of the fluid channels, the fluid state including at least one of fluid temperature and fluid velocity.

4. The temperature regulating device according to claim 3, characterized in that, The flow control unit is used to individually adjust the fluid state of the fluid flowing through each of the fluid channels; Alternatively, the flow control unit is used to synchronously adjust the fluid state of the fluid flowing through all the fluid channels.

5. The temperature regulating device according to claim 1, characterized in that, The temperature regulating device includes: A temperature control unit is provided, wherein the temperature control device is a semiconductor cooling device. The temperature control unit is connected to the temperature control device and is used to control the temperature of the temperature control device, thereby adjusting the heat exchange between the temperature control device and the lower surface of the heating plate.

6. The temperature regulating device according to claim 1, characterized in that, The temperature control device is dynamically assembled on the main body panel, including: The temperature control device is detachable relative to the main body plate; and / or, the temperature control device is adjustable in height relative to the main body plate on the upper surface of the main body plate.

7. The temperature regulating device according to claim 1, characterized in that, The main body disk has an assembly hole that runs through its thickness direction. The number of assembly holes is configured to be several, with one assembly hole provided in each assembly area, and a temperature control device being movably assembled in each assembly hole.

8. The temperature regulating device according to claim 1, characterized in that, The temperature regulating device includes: A temperature measuring unit is used to acquire temperature data of a target object, wherein the target object is configured to be disposed on the upper surface of the heating plate, and the temperature data includes different temperature values ​​of several different areas of the target object. A calculation unit is used to acquire the temperature data and generate temperature field information of the target object based on the temperature data. The temperature field information is used as a basis for adjusting several temperature control devices relative to the main body and controlling the temperature of the temperature control devices.

9. The temperature regulating device according to claim 8, characterized in that, The temperature regulating device includes: A control unit, which is connected to the computing unit, is used to control at least one temperature control device to adjust its height on the upper surface of the main plate according to the temperature field information.

10. The temperature regulating device according to claim 9, characterized in that, The control unit includes: A lifting component, wherein the number of the lifting components is configured to be several, each of the lifting components is connected to a temperature control component, and the lifting component is used to adjust the height of the temperature control component on the upper surface of the main plate; A driver, which is driven and connected to at least one of the lifting components, and is connected to the computing unit, is used to drive the lifting components to adjust the height of the temperature control on the upper surface of the main plate according to the temperature field information.

11. A coating apparatus, characterized in that, The coating equipment includes: A heating plate, the upper surface of which is used to set the target object; The temperature regulating device as described in any one of claims 1-10, wherein the temperature regulating device is disposed below the heating plate.

12. The coating equipment according to claim 11, characterized in that, The temperature regulating device can adjust the distance relative to the lower surface of the heating plate.

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