Ultrasonic water meter transducer and method of processing the same

Abstract

This invention discloses an ultrasonic water meter transducer and its processing method, comprising: a transducer shell, which has a box-like structure with an internal cavity; a piezoelectric ceramic bonded inside the cavity; a PCB adapter board located inside the cavity and fixed above the piezoelectric ceramic; a centipede-shaped base fixed above the PCB adapter board; pin headers fixed above the centipede-shaped base and electrically connected to it; a silicone filling layer covering the area between the pin headers and the centipede-shaped base; and an epoxy potting compound layer covering the top surface of the silicone filling layer and the remaining outer wall of the pin headers. This design facilitates automated production, enabling the use of automated production processes or equipment such as reflow soldering and potting machines during manufacturing. This allows for automated production of the transducer, applicable to ultrasonic water meters of various diameters, achieving the goals of reducing production costs, improving production efficiency, and increasing yield.

Description

Technical Field

[0001] This invention relates to the technical field of ultrasonic water meter measurement, and particularly to an ultrasonic water meter transducer and its processing method. Background Technology

[0002] The ultrasonic transducer is one of the core components of an ultrasonic water meter. Its function is to convert ultrasonic signals into electrical signals. Currently, the structure of an ultrasonic water meter transducer is as follows: Figure 1 As shown, it includes a transducer housing 1, sealant 11, lead wire 12, PCB 13, adapter wire 14, piezoelectric ceramic component 15, and adhesive layer 16; the production process is as follows: (1) Use a soft wire as the adapter wire 14 and weld it to the positive and negative poles of the piezoelectric ceramic component 15 by manual welding to lead out the positive and negative poles; (2) Adhere the piezoelectric ceramic component 15 with the adapter wire 14 welded to it to the transducer housing 1 and wait for the glue to cure to form adhesive layer 16; (3) Place the PCB 13 for the adapter inside the transducer housing 1, and the adapter wire 14 welded on the piezoelectric ceramic component 15 extends from both sides of the PCB 13 and is welded above the PCB 13; (4) Weld the lead wire 12 on the PCB 13 to lead out the positive and negative poles; (5) Pot sealant 11. The difficulty in the automated production of ultrasonic water meter transducers lies in the use of flexible wires for connecting the piezoelectric ceramics. The connection method and structural design of the piezoelectric ceramics make it difficult to achieve automated production of ultrasonic transducers, resulting in defects in terms of cost, yield, and efficiency. Summary of the Invention

[0003] In view of this, the present invention provides an ultrasonic water meter transducer and its processing method. The transducer can be designed to facilitate automated production, enabling the use of automated production processes or equipment such as reflow soldering and glue dispensing machines during the production process. This allows for the automated production of the transducer, which can be applied to ultrasonic water meters of various diameters, thereby reducing production costs, improving production efficiency, and increasing yield. To achieve the above objectives, the present invention provides the following technical solution: An ultrasonic water meter transducer, comprising: The transducer housing has a box-shaped structure with an internal cavity; Piezoelectric ceramics are bonded to the inside of the cavity in a horizontally laid-out manner; The PCB adapter board is located inside the cavity and is fixed above the piezoelectric ceramic in a horizontally laid-out position. It is electrically connected to the piezoelectric ceramic. The PCB adapter board divides the cavity into an upper chamber that communicates with the outside world and a lower chamber that is sealed and independent and contains the piezoelectric ceramic. The centipede-shaped base is located inside the cavity, fixed above the PCB adapter board, and electrically connected to the PCB adapter board. The pin array is located inside the cavity, fixed above the centipede seat, and electrically connected to the centipede seat; A silicone filler layer is filled inside the cavity and covers the outer wall of the centipede seat and the top wall of the PCB adapter board. The silicone filler layer covers the area between the pin header and the centipede seat. An epoxy potting compound layer is filled inside the cavity and covers the top surface of the silicone filling layer and the remaining outer wall of the pin header.

[0004] Preferably, the centipede base has at least two sets of pins, and the two sets of pins extend from at least two opposite sides of the centipede base.

[0005] Preferably, the top surface of the piezoelectric ceramic has multiple solder points spaced apart along its edge contour, and the solder points are used to connect the PCB adapter board.

[0006] This application also provides a method for processing an ultrasonic water meter transducer, including the following steps: S100. Fix the centipede-shaped bracket to the PCB adapter board by reflow soldering; S200. The PCB adapter board with the centipede base soldered on it is fixed to the piezoelectric ceramic by reflow soldering. S300. Fix the piezoelectric ceramic inside the transducer housing, wherein the centipede base, the PCB adapter board, and the piezoelectric ceramic are distributed sequentially from top to bottom; S400, Insert the header pins into the centipede socket; S500: Fill the inside of the transducer housing with silicone to cover and seal the area between the centipede seat and the pin array. S600. Fill the inside of the transducer housing with epoxy potting compound and preferably cover the top surface of the pin header.

[0007] Preferably, the PCB adapter board and the centipede base are fixed with high-temperature solder, and the piezoelectric ceramic and the PCB adapter board are fixed with low-temperature solder.

[0008] Preferably, the silicone covers the top surface of the PCB adapter board, the outer wall of the centipede seat, and part of the side wall of the pin header.

[0009] Preferably, the height of the epoxy potting compound is lower than the upper edge of the transducer housing.

[0010] Preferably, the piezoelectric ceramic is connected to the transducer housing using adhesive, and the piezoelectric ceramic is cured under pressure after bonding.

[0011] As can be seen from the above technical solution, the ultrasonic water meter transducer provided by the present invention has a structure that facilitates automated production. This allows the use of automated production processes or equipment such as reflow soldering and glue dispensing machines during the production process, thereby achieving automated production of the transducer. It can be applied to ultrasonic water meters of various diameters, thereby reducing production costs, improving production efficiency and yield. Attached Figure Description

[0012] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0013] Figure 1 The accompanying drawings are background art illustrations based on an exemplary embodiment; Figure 2 This is a schematic diagram of an ultrasonic water meter transducer according to an exemplary embodiment; Figure 3 This is a schematic diagram illustrating the location of solder joints on a piezoelectric ceramic according to an exemplary embodiment; Figure 4 This is a flowchart illustrating a method for manufacturing an ultrasonic water meter transducer according to an exemplary embodiment.

[0014] Figure label: 1. Transducer housing; 11. Sealant; 12. Lead wire; 13. PCB adapter board; 14. Adapter wire; 15. Piezoelectric ceramic component; 16. Adhesive layer; 2. Transducer outer shell; 21. Epoxy potting layer; 22. Silicone filler layer; 23. Pin; 24. Pin header; 25. Centipede base; 26. PCB adapter board; 27. Piezoelectric ceramic; 271. Solder joint; 272. Positive silver electrode; 273. Negative silver electrode; 28. Adhesive layer. Detailed Implementation

[0015] This invention discloses an ultrasonic water meter transducer and its processing method. The transducer can be designed to facilitate automated production, enabling the use of automated production processes or equipment such as reflow soldering and glue dispensing machines during production. This allows for the automated production of the transducer, which can be applied to ultrasonic water meters of various diameters, thereby reducing production costs, improving production efficiency, and increasing yield.

[0016] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0017] This disclosure provides a method for processing an ultrasonic water meter transducer in exemplary embodiments, such as... Figure 1 As shown, Figure 1 The accompanying drawings are background art illustrations based on an exemplary embodiment; Figure 2 This is a schematic diagram of an ultrasonic water meter transducer according to an exemplary embodiment; Figure 3 This is a schematic diagram illustrating the location of solder joints on a piezoelectric ceramic according to an exemplary embodiment; Figure 4 This is a flowchart illustrating a manufacturing method for an ultrasonic water meter transducer according to an exemplary embodiment. The following is in conjunction with... Figures 2 to 4 To explain.

[0018] The specific embodiments described below are intended to help those skilled in the art understand this embodiment, but this embodiment is not limited to the specific embodiments described below.

[0019] Reference Figure 2 An exemplary embodiment of this disclosure provides an ultrasonic water meter transducer, which includes: The transducer housing 2 has a box-shaped structure with an internal cavity; The piezoelectric ceramic 27 is bonded to the inside of the cavity in a horizontally laid-out manner; The PCB adapter board 13 is located inside the cavity and is fixed above the piezoelectric ceramic 27 in a horizontally laid-out position. It is electrically connected to the piezoelectric ceramic 27. The PCB adapter board 13 divides the cavity into an upper chamber that is connected to the outside world and a lower chamber that is sealed and independent and contains the piezoelectric ceramic 27. Centipede base 25 is located inside the cavity, fixed above the PCB adapter board 13, and electrically connected to the PCB adapter board 13. The pin header 24 is located inside the cavity, fixed above the centipede seat 25, and electrically connected to the centipede seat 25; The silicone filling layer 22 fills the cavity and covers the outer wall of the centipede seat 25 and the top wall of the PCB adapter board 13. The silicone filling layer 22 covers the area between the pin header 24 and the centipede seat 25. An epoxy potting compound layer 21 fills the cavity and covers the top surface of the silicone filling layer 22 and the remaining outer wall of the pin header 24.

[0020] For example, refer to Figure 2 and Figure 3 The transducer housing 2 has a hollow interior and an open top box structure. The cavity is cubic and formed inside the transducer housing 2. The bottom surface of the piezoelectric ceramic 27 is bonded with an adhesive layer 28. The top surface of the adhesive layer 28 is fixed to the piezoelectric ceramic 27, and the bottom surface of the adhesive layer 28 is fixed to the bottom wall of the cavity inside the transducer housing 2. The piezoelectric ceramic 27 is fixed in the cavity by the adhesive layer 28 and is fixed horizontally in the middle position of the inner wall of the cavity.

[0021] Electrodes for electrical connection with the PCB adapter board 13 are sintered on the piezoelectric ceramic 27, specifically including a positive silver electrode 272 and a negative silver electrode 273. The positive silver electrode 272 and the negative silver electrode 273 are respectively located on opposite sides of the piezoelectric ceramic 27. The negative silver electrode 273 is flanged from the edge of the piezoelectric ceramic 27, that is, the edge of the negative silver electrode 273 covers the side wall of the piezoelectric ceramic 27 and then covers the edge of the positive silver electrode 272. When external pressure causes the piezoelectric ceramic 27 to deform, a voltage is generated between the positive silver electrode 272 and the negative silver electrode 273. When a voltage is applied between the positive silver electrode 272 and the negative silver electrode 273, the piezoelectric ceramic 27 will also deform. Multiple solder points 271 are distributed at intervals along the edge contour on the top surface of the piezoelectric ceramic 27. The solder points 271 are used to connect to the PCB adapter board 13. The piezoelectric ceramic 27 and the PCB adapter board 13 are connected by reflow soldering. The negative silver electrode 273 is designed with a folded edge, and the solder joints 271 are distributed in the edge area of ​​the piezoelectric ceramic 27, which can reduce the influence of the solder joints 271 on the vibration characteristics of the piezoelectric ceramic 27.

[0022] The PCB adapter board 13 is soldered to the top surface of the piezoelectric ceramic 27. The PCB adapter board 13 is horizontal, with its sidewalls abutting against the inner sidewall of the cavity. The PCB adapter board 13 covers the piezoelectric ceramic 27 in a vertically downward direction. The centipede base 25 has at least two sets of pins 23, for example, two sets of four pins 23. The four pins 23 are arranged in pairs on both sides of the centipede base 25, and the bottom ends of both sets of pins 23 extend from the bottom surface of the centipede base 25 and from opposite sides of the centipede base 25, respectively. The parts of the pins 23 extending from the bottom surface of the centipede base 25 are soldered to the PCB adapter board 13 to fix the centipede base 25 and the PCB adapter board 13. The top ends of the two sets of pins 23 extend from the top wall of the centipede base 25 and from the top opening of the cavity. The centipede base 25 with four pins 23 can maintain its stability during reflow soldering, reducing the possibility of tipping over due to slight bumps. When fixing the PCB adapter board 13, the centipede holder 25, and the piezoelectric ceramic 27, the PCB adapter board 13 and the centipede holder 25 are first soldered with high-temperature solder, and then the piezoelectric ceramic 27 and the PCB adapter board 13 are soldered with low-temperature solder. The purpose of this is twofold: first, to prevent the solder between the centipede holder 25 and the PCB adapter board 13 from melting during soldering; and second, to prevent the piezoelectric ceramic 27 from depolarizing due to high temperature, which would degrade its performance and further reduce the transducer's signal transmission and reception sensitivity.

[0023] The pin header 24 is inserted into the top of the centipede socket 25. The tip of the pin 23 extending from the top surface of the centipede socket 25 passes vertically through the pin header 24 and extends upward to above the opening of the cavity. Connecting the pin header 24 and the PCB adapter board 13 through the centipede socket 25 reduces the possibility of the pin header 24 tipping over when placed directly on the PCB 13 during reflow soldering. Furthermore, since the internal cavity of the reflow soldering equipment prioritizes height, longer pin headers 24 cannot enter the reflow soldering cavity. Using the centipede socket 25 reduces the height requirement of the equipment cavity. In addition, the piezoelectric ceramic 27 requires pressure curing when bonding to the transducer housing 2. The pin header 24 directly connected to the PCB adapter board 13 will affect the pressure process.

[0024] The silicone filler layer 22 fills the top of the PCB adapter board 13 and covers the exposed top surface of the PCB adapter board 13. The silicone filler layer 22 extends upward to the top surface of the centipede seat 25 and covers part of the side wall of the pin header 24, thereby sealing and covering the connection gap between the pin header 24 and the centipede seat 25.

[0025] The epoxy potting compound layer 21 fills the space above the silicone filler layer 22 and extends above the top surface of the pin header 24, thereby covering the top wall and remaining sidewalls of the pin header 24. The tips of the pins 23 extend from the top surface of the epoxy potting compound layer 21. The high-viscosity silicone can fill the gap between the PCB adapter board 13 and the transducer housing 2, but will not enter the area around the piezoelectric ceramic 27 through this gap. This prevents the low-viscosity epoxy potting compound from entering the area around and above the piezoelectric ceramic 27 through the gap between the PCB adapter board 13 and the transducer housing 2, thus affecting the vibration characteristics of the piezoelectric ceramic 27. In addition, the silicone filler layer 22 can also prevent the epoxy potting compound from entering the gap at the connection between the pin and the centipede seat 25, which could cause an open circuit. The epoxy potting compound layer 21 can compensate for the problem that some corners in the cavity cannot be filled due to the poor fluidity of high-viscosity silicone. In addition, since silicone has relatively low hardness, it does not have a good fixing effect on structures such as pin header 24. The epoxy potting compound layer 21 can make structures such as pin header 24 maintain a more stable posture.

[0026] In this embodiment, a structure is designed to facilitate automated production, enabling the use of automated production processes or equipment such as reflow soldering and glue dispensing machines during the production process. This allows for the automated production of transducers, which can be applied to ultrasonic water meters of various diameters, thereby reducing production costs, improving production efficiency, and increasing yield.

[0027] This disclosure also provides a method for processing an ultrasonic water meter transducer, including the following steps: Step S100: Fix the centipede holder to the PCB adapter board by reflow soldering; Step S200: Fix the PCB adapter board with the centipede base soldered on to the piezoelectric ceramic by reflow soldering; Step S300: Fix the piezoelectric ceramic inside the transducer housing. The centipede base, PCB adapter board and piezoelectric ceramic are distributed from top to bottom. Step S400: Insert the pin header into the centipede socket; Step S500: Fill the inside of the transducer housing with silicone to cover and seal the area between the centipede seat and the pin header; Step S600: Fill the inside of the transducer housing with epoxy potting compound and cover the top surface of the pin header.

[0028] In an exemplary embodiment of this disclosure, reference is made to Figure 4 .

[0029] For example, refer to Figure 4 In step S100, the PCB adapter board and the centipede base are fixed together using high-temperature solder. In step S200, the piezoelectric ceramic and the PCB adapter board are fixed together using low-temperature solder.

[0030] In step S300, the piezoelectric ceramic is connected to the transducer housing using adhesive, and pressure is applied to cure the piezoelectric ceramic after bonding.

[0031] In step S500, silicone covers the top surface of the PCB adapter board, the outer wall of the centipede socket, and part of the side wall of the pin header.

[0032] In step S600, the height of the epoxy potting compound is lower than the upper edge of the transducer housing.

[0033] The above description of the disclosed embodiments enables those skilled in the art to make or use the invention. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the general principles defined herein may be implemented in other embodiments without departing from the spirit or scope of the invention. Therefore, the invention is not to be limited to the embodiments shown herein, but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.

Claims

1. An ultrasonic water meter transducer, characterized in that, include: The transducer housing (2) has a box-shaped structure with an internal cavity; Piezoelectric ceramic (27) is bonded to the cavity in a horizontally laid-out manner; The PCB adapter board (26) is located inside the cavity and is fixed above the piezoelectric ceramic (27) in a horizontally laid-out position. It is electrically connected to the piezoelectric ceramic (27). The PCB adapter board (26) divides the cavity into an upper chamber that is connected to the outside and a lower chamber that is sealed and independent and contains the piezoelectric ceramic (27). Centipede seat (25) is located inside the cavity, fixed above the PCB adapter board (26), and electrically connected to the PCB adapter board (26); The pin header (24) is located inside the cavity, fixed above the centipede seat (25), and electrically connected to the centipede seat (25); A silicone filling layer (22) is filled inside the cavity and covers the outer wall of the centipede seat (25) and the top wall of the PCB adapter board (26). The silicone filling layer (22) covers the area between the pin header (24) and the centipede seat (25). An epoxy potting compound layer (21) is filled inside the cavity and covers the top surface of the silicone filling layer (22) and the remaining outer wall of the pin header (24).

2. The ultrasonic water meter transducer according to claim 1, characterized in that, The centipede base (25) has at least two sets of pins (23), and the two sets of pins (23) extend from at least the opposite sides of the centipede base (25).

3. The ultrasonic water meter transducer according to claim 2, characterized in that, The top surface of the piezoelectric ceramic (27) has a plurality of solder points (271) spaced apart along its edge contour, and the solder points (271) are used to connect the PCB adapter board (26).

4. A method for processing an ultrasonic water meter transducer, characterized in that, include: S100. Fix the centipede-shaped bracket to the PCB adapter board by reflow soldering; S200. The PCB adapter board with the centipede base soldered on it is fixed to the piezoelectric ceramic by reflow soldering. S300. Fix the piezoelectric ceramic inside the transducer housing, wherein the centipede base, the PCB adapter board, and the piezoelectric ceramic are distributed sequentially from top to bottom; S400, Insert the header pins into the centipede socket; S500: Fill the inside of the transducer housing with silicone to cover and seal the area between the centipede seat and the pin array. S600. Fill the inside of the transducer housing with epoxy potting compound and cover the top surface of the pin header.

5. The processing method of the ultrasonic water meter transducer according to claim 4, characterized in that, In step S100, the PCB adapter board and the centipede base are fixed together using high-temperature solder. In step S200, the piezoelectric ceramic and the PCB adapter board are fixed together using low-temperature solder.

6. The processing method of the ultrasonic water meter transducer according to claim 4, characterized in that, In step S500, the silicone covers the top surface of the PCB adapter board, the outer wall of the centipede seat, and part of the side wall of the pin header.

7. The processing method of the ultrasonic water meter transducer according to claim 4, characterized in that, In step S600, the height of the epoxy potting compound is lower than the upper edge of the transducer housing.

8. The processing method of the ultrasonic water meter transducer according to claim 4, characterized in that, In step S300, the piezoelectric ceramic is connected to the transducer housing using adhesive, and pressure is applied to cure the piezoelectric ceramic after it is bonded together.

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