Modular electronic device detachable assembly system and method

Abstract

This invention relates to the field of modular electronic equipment technology, and proposes a detachable assembly system and method for modular electronic equipment. The system includes: configuring guide grooves on a modular skeleton frame to generate assembly paths for multiple standardized functional modules; establishing a spatial alignment relationship between a core processing module and a power module in the assembly path using a magnetic-assisted alignment unit of a multi-functional connector on the mating surface of the standardized functional modules; when the power module and the core processing module are in spatial alignment, constructing a resource mapping table for the standardized functional modules through an intelligent management unit built into the core processing module; and performing detachable assembly operations of the standardized functional modules based on the resource mapping table, the assembly path, and the intelligent management unit. This invention enables plug-and-play electrical connections and mechanical locking between modules, thereby significantly improving the maintainability, upgradeability, and resource utilization of electronic equipment.

Description

Technical Field

[0001] This invention relates to a detachable assembly system and method for modular electronic devices, belonging to the field of modular electronic device technology. Background Technology

[0002] The modular electronic device's detachable and assembleable design is essentially an open hardware architecture centered on standardized interfaces. It can provide underlying technical support for hardware decoupling and reconfiguration for both consumer electronics and industrial equipment. It can also foster new product forms with deep user participation and sustainable hardware evolution. Through the plug-and-play combination of functional modules, computing power, and interactive interfaces, it can accurately respond to the industrial development needs of personalized customization and green circularity.

[0003] The modular design of existing electronic devices mostly relies on non-standard connector connection methods. By using non-standard connectors to connect core components such as cables and batteries to the motherboard, electrical connections and structural fixation are achieved. Although this can ensure the initial stability and compactness of the core component connections, the lack of a unified standardized interface and convenient disassembly mechanism makes it impossible for users to safely and conveniently disassemble the device and reassemble the core components, thus limiting the flexible expansion value of modular design. Summary of the Invention

[0004] This invention provides a modular electronic device detachable assembly system and method, the main purpose of which is to achieve plug-and-play electrical connection and mechanical locking between modules, thereby significantly improving the maintainability, upgradeability and resource utilization of electronic devices.

[0005] To achieve the above objectives, the present invention provides a detachable assembly system for modular electronic devices, comprising: The path guidance module is used to configure guide slots on the modular skeleton frame and generate assembly paths for multiple standardized functional modules through the guide slots. The standardized functional modules have a unified multi-functional connector on their mating surface that includes mechanical latches, magnetic assisted alignment units and electrical interfaces. A magnetic alignment module is used to establish the spatial alignment relationship between the core processing module and the power module in the assembly path using the magnetic assisted alignment unit. A locking connection module is used to identify the mechanical locking state between the power module and the modular skeleton frame and establish the physical connection topology of the electrical interface when the power module and the core processing module are in the spatial alignment relationship. The resource configuration module is used to determine the electrical connection status between the core processing module and the power module through the physical connection topology, and, in combination with the mechanical locking status and the electrical connection status, construct the resource mapping table of the standardized functional modules through the intelligent management unit built into the core processing module; The operation execution module is used to perform the detachable assembly operation of the standardized functional module based on the resource mapping table, the assembly path and the intelligent management unit.

[0006] Optionally, the magnetic alignment unit is used to establish the spatial alignment relationship between the core processing module and the power module in the assembly path, including: Determine the initial spatial pose deviation between the core processing module and the power module at the termination position; Obtain the magnetic force distribution map and effective working distance corresponding to the magnetic attraction-assisted alignment unit from the preset magnetic parameter database; By combining the initial spatial pose deviation, the magnetic attraction force distribution map, and the effective action distance, a pre-alignment motion path between the core processing module and the power module under the action of magnetic attraction force is generated. Based on the pre-aligned motion path, a pre-engagement pose envelope is established between the core processing module and the power module; The spatial alignment relationship between the core processing module and the power module is determined by the pre-engagement pose envelope.

[0007] Optionally, the initial spatial pose deviation is determined based on the first preset assembly trajectory sequence of the core processing module and the second preset assembly trajectory sequence of the power supply module.

[0008] Optionally, by combining the initial spatial pose deviation, the magnetic force distribution map, and the effective action distance, a pre-alignment motion path is generated between the core processing module and the power module under magnetic attraction, including: Based on the initial spatial pose deviation, calculate the displacement vector and attitude adjustment angle between the core processing module and the power module; According to the magnetic attraction force distribution map, a magnetic gradient region that is consistent with the direction of the displacement vector and the attitude adjustment angle is matched within the effective action distance; Based on the magnetic gradient region, a pre-aligned motion path is generated between the core processing module and the power module under magnetic attraction.

[0009] Optionally, based on the pre-aligned motion path, a pre-engagement pose envelope is established between the core processing module and the power module, including: Calculate the pose tolerance domain of the core processing module and the power module at each path point on the pre-aligned motion path under the action of magnetic attraction; Based on the pose tolerance domain and the pre-alignment motion path, a continuous envelope between the core processing module and the power module is established. The continuous envelope is defined as the pre-engaged pose envelope.

[0010] Optionally, the assembly paths for multiple standardized functional modules are generated through the guide slots, including: The geometric configuration of the docking surface of the standardized functional module is matched and analyzed with the cross-sectional shape of the guide groove to generate a set of physical guide channels corresponding to each standardized functional module. Based on the set of physical guidance channels, a motion constraint network is constructed for the standardized functional modules during the assembly process, and the motion constraint network is determined as the assembly path of the standardized functional modules.

[0011] Optionally, the assembly path of the plurality of standardized functional modules includes at least a power module, a core processing module, at least one extended functional module, and a detachable cable module.

[0012] Optionally, combining the mechanical locking state and the electrical connection state, a resource mapping table for the standardized functional modules is constructed through the intelligent management unit built into the core processing module, including: The intelligent management unit parses the joint determination information of the mechanical locking state and the electrical connection state to extract the set of effective modules in the standardized functional modules; Query the type identifier, specification parameters, and current status of each module in the set of effective modules; Based on the type identifier, the specification parameters, and the current status, assign corresponding logical addressing information and power configuration strategy to each module; After structurally associating the logical addressing information of each module with the power configuration strategy, a resource mapping table for the standardized functional modules is obtained.

[0013] Optionally, the type identifier, specification parameters, and current status are metadata describing the core attributes of an active module, which are obtained by the intelligent management unit by querying the identity recognition circuit integrated within the module.

[0014] Compared to the problems described in the background art, the embodiments of the present invention, by configuring guide grooves on the modular skeleton frame and generating assembly paths for multiple standardized functional modules through the guide grooves, can ensure that each module moves along a unique and precise physical trajectory during assembly, thereby achieving automatic alignment and zero-error coupling of the connector; furthermore, the embodiments of the present invention, by utilizing the magnetic assisted alignment unit, establishes a spatial alignment relationship between the core processing module and the power module in the assembly path, enabling non-contact pre-alignment before the modules reach the mechanical locking position, effectively compensating for minor positional deviations caused by machining tolerances and assembly skew, thereby ensuring that the multi-functional connector can achieve zero misalignment engagement during final locking, greatly reducing the risk of physical damage and electrical failures caused by mis-insertion of the connector; the embodiments of the present invention, by identifying the mechanical locking state between the power module and the modular skeleton frame when the power module and the core processing module are in a spatial alignment relationship, can achieve real-time perception and closed-loop control of key physical interactions in the assembly process, ensuring that a firm mechanical interlock is obtained before the electrical connection is established; furthermore... Firstly, this embodiment of the invention determines the electrical connectivity status between the core processing module and the power module through the physical connection topology, providing real-time and accurate underlying connection basis for the intelligent management unit in the core processing module to perform dynamic power allocation and online power switching. Secondly, by combining the mechanical locking status and the electrical connectivity status, this embodiment of the invention constructs a resource mapping table for the standardized functional modules through the intelligent management unit built into the core processing module, providing a unique and reliable system-wide status basis for the intelligent management unit to automatically identify and dynamically configure assembled modules. Finally, by performing the detachable assembly operation of the standardized functional modules based on the resource mapping table, the assembly path, and the intelligent management unit, this embodiment of the invention achieves precise, orderly, and safe management of the hot-swapping of modules and the dynamic reconfiguration of the system, ensuring that the continuity and stability of system functions are not affected throughout the user's "plug-and-play" assembly operation, while effectively avoiding the risk of hardware damage or system downtime caused by resource conflicts or illegal operations. Therefore, the present invention can realize plug-and-play electrical connection and mechanical locking between modules, thereby significantly improving the maintainability, upgradeability and resource utilization of electronic equipment. Attached Figure Description

[0015] Figure 1 This is a schematic diagram of a modular electronic device detachable assembly system according to an embodiment of the present invention; Figure 2 This is a flowchart illustrating a method for detachable assembly of a modular electronic device according to an embodiment of the present invention. Figure 3A schematic diagram of a computer device for implementing a detachable assembly system for a modular electronic device according to an embodiment of the present invention; The objectives, features, and advantages of this invention will be further explained in conjunction with the embodiments and with reference to the accompanying drawings. Detailed Implementation

[0016] To make the objectives, technical solutions, and advantages of the embodiments of the present invention clearer, the technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0017] Furthermore, the timing of the steps in the following method embodiments is merely an example and not a strict limitation.

[0018] In practice, the server-side equipment deployed in the modular electronic device detachable assembly system may consist of one or more devices. This modular electronic device detachable assembly system can be implemented as: a business instance, a virtual machine, or hardware devices. For example, the modular electronic device detachable assembly system can be implemented as a business instance deployed on one or more devices in a cloud node. Simply put, the modular electronic device detachable assembly system can be understood as software deployed on a cloud node, used to provide detachable assembly services for modular electronic devices to various user terminals. Alternatively, the modular electronic device detachable assembly system can also be implemented as a virtual machine deployed on one or more devices in a cloud node. This virtual machine contains application software for managing various user terminals. Or, the modular electronic device detachable assembly system can also be implemented as a server composed of numerous identical or different types of hardware devices, with one or more hardware devices configured to provide detachable assembly services for modular electronic devices to various user terminals.

[0019] In terms of implementation, the detachable assembly system of a modular electronic device and the user terminal are mutually compatible. That is, if the detachable assembly system of a modular electronic device is implemented as an application installed on a cloud service platform, then the user terminal is implemented as a client that establishes a communication connection with the application; or if the detachable assembly system of a modular electronic device is implemented as a website, then the user terminal is implemented as a webpage; or if the detachable assembly system of a modular electronic device is implemented as a cloud service platform, then the user terminal is implemented as a mini-program in an instant messaging application.

[0020] Reference Figure 1The diagram shown is a modular schematic of a detachable assembly system for a modular electronic device according to an embodiment of the present invention. The system includes: The modular electronic device detachable assembly system 200 of this invention can be set in a cloud server. In terms of implementation, it can function as one or more service devices, or as an application installed in the cloud (e.g., a server for detachable assembly of modular electronic devices, a server cluster, etc.), or it can be developed into a website. Depending on the functions implemented, the modular electronic device detachable assembly system 200 includes a path guidance module 201, a magnetic alignment module 202, a locking connection module 203, a resource configuration module 204, and an operation execution module 205.

[0021] In this embodiment of the invention, during the tracking of the detachable assembly of modular electronic devices, each of the aforementioned modules can be implemented independently and called upon other modules. This "calling" can be understood as a module connecting to multiple modules of another type and providing corresponding services to those connected modules. In the detachable assembly system of modular electronic devices provided by this embodiment, the applicable scope of the detachable assembly architecture of the modular electronic devices can be adjusted by adding modules and directly calling them without modifying the program code, achieving cluster-based horizontal expansion to quickly and flexibly expand the detachable assembly system of modular electronic devices. In practical applications, the aforementioned modules can be set in the same device or different devices, or they can be set in a virtual device, such as a service instance in a cloud server.

[0022] The following describes, with reference to specific embodiments, each component of a modular electronic device's detachable assembly system and its specific workflow: The path guidance module 201 is used to configure guide grooves on the modular skeleton frame and generate assembly paths for multiple standardized functional modules through the guide grooves. The standardized functional modules integrate a unified multi-functional connector that includes mechanical latches, magnetic assisted alignment units, and electrical interfaces on their mating surfaces.

[0023] This invention, through the configuration of guide slots on a modular skeleton frame and the generation of assembly paths for multiple standardized functional modules via these guide slots, ensures that each module moves along a unique and precise physical trajectory during assembly, thereby achieving automatic alignment and zero-error coupling of the connector.

[0024] In detail, the modular skeleton frame refers to a mechanical carrier that provides overall structural support and module positioning reference for the detachable assembly system described in this solution. This frame has predefined installation positions, guide structures, and locking interfaces, used to physically support multiple standardized functional modules and ensure that each module maintains the correct relative position and posture during assembly. For example, in a modular smart speaker system, the modular skeleton frame can be a plastic or metal bracket with multiple longitudinal channels and transverse partitions. Each channel corresponds to the installation path of a standardized functional module, such as a power module, audio processing module, or wireless communication module, and the partitions are provided with slots corresponding to multi-functional connectors. The guide channel refers to a groove or track structure of a specific geometric shape set on the modular skeleton frame, used to guide the standardized functional modules along a predetermined path during module installation, limiting their displacement in unexpected directions, thereby achieving precise alignment of the connectors. For example, the guide groove can be a "T"-shaped or "dovetail" shaped cross-section groove, set on the inner wall of the modular skeleton frame. When the user pushes the power module into the groove, the flange on the side of the module engages with the groove, allowing the module to move only along the length of the groove, ensuring that its connector is aligned with the connector of the core processing module in the final position. The standardized functional module refers to a function that can be independently disassembled and replaced, following uniform external dimensions, electrical interfaces, and mechanical interface specifications. It includes at least a power module with a removable battery, a core processing module with a main printed circuit board assembly (PCBA), at least one extended functional module with an auxiliary PCBA, and a removable cable module. The assembly path refers to the physical path in the modular skeleton frame that is jointly defined by a set of guide grooves, allowing the standardized functional modules to be installed and disassembled. It is used to define the degrees of freedom of movement and final positioning points of each module in the frame, so as to form a spatial constraint system for system assembly.

[0025] Furthermore, as a core component for inter-module interconnection, the standardized functional module integrates a unified multi-functional connector on its mating surface. This connector aims to simultaneously complete electrical conduction and physical locking through a single interface, providing users with a safe, intuitive, and reliable "one-step" assembly experience. The multi-functional connector integrates a mechanical locking mechanism, a magnetic alignment unit, and an electrical interface. The electrical interface employs a symmetrical anti-misfit design with elastic contact pins and a contact array for simultaneously transmitting power and data signals. The mechanical locking mechanism incorporates a magnetic alignment unit and a slider-type latch, allowing users to securely lock or unlock the connector with a single push-pull action.

[0026] As an embodiment of the present invention, generating assembly paths for multiple standardized functional modules through the guide groove includes: performing matching analysis on the geometric configuration of the mating surface of the standardized functional modules and the cross-sectional shape of the guide groove to generate a set of physical guide channels corresponding to each standardized functional module; constructing a motion constraint network of the standardized functional modules during the assembly process based on the set of physical guide channels, and determining the motion constraint network as the assembly path of the standardized functional modules.

[0027] Furthermore, based on the set of physical guide channels, a motion constraint network for the standardized functional modules during the assembly process is constructed, including: parameterizing the length, direction, and termination position of each channel in the set of physical guide channels according to the spatial topology of the modular skeleton frame to form a preset assembly trajectory sequence for each standardized functional module; and constructing a motion constraint network for the standardized functional modules during the assembly process based on the parallel-intersection relationship between the trajectories in the preset assembly trajectory sequence.

[0028] The "docking surface geometry" refers to the shape, size, and contour features of the contact surfaces on the standardized functional module used for physical docking with other modules or the skeleton frame. The "cross-sectional shape" refers to the cross-sectional contour of the internal space of the guide groove on a plane perpendicular to its length. The "physical guide channel set" refers to a set of physical paths formed by all guide grooves on the modular skeleton frame and the specific modules they serve, where each channel uniquely corresponds to a standardized functional module and provides mechanical guidance for its entire journey from the assembly start point to the final locking position. For example, if the skeleton frame has three guide grooves guiding the power module, core processing module, and display module respectively, these three grooves with specific spatial positions, directions, and lengths together constitute a physical guide channel set containing three elements. The "termination position" refers to the final, determined spatial coordinates and orientation reached by each standardized functional module within the modular skeleton frame after assembly along its corresponding physical guide channel. The "spatial topology" describes the relative positional relationships, connection relationships, and constraint relationships formed in three-dimensional space between the physical guide channels and between the channels and the frame's fixed features within the modular skeleton frame. The preset assembly trajectory sequence refers to a set of ordered spatial poses that must be followed during the assembly process for each standardized functional module; the parallel-intersection relationship refers to the spatial relative motion relationship between the multiple preset assembly trajectory sequences, such as two or more trajectories maintaining a constant distance in space and extending in the same or different directions without interfering with each other, or two or more trajectories coinciding or intersecting at a certain point or region in space; the motion constraint network is a model formed by systematically integrating and digitally representing the physical guidance channel set, the preset assembly trajectory sequences of each module, and the parallel-intersection relationship between the trajectories.

[0029] For example, the motion constraint network can be represented as a directed graph, where nodes represent key spatial locations that the module must traverse during assembly, such as the module's assembly start position, final locking position, and necessary path turning positions; edges represent the single-direction movement that the module is allowed to perform between two adjacent key positions. The connection logic and attribute parameters of each edge in this directed graph, including the direction of movement, the required displacement distance, and the temporal dependencies of module assembly, are all determined by the parallel and intersection spatial relationships between the preset assembly trajectory sequences of each module.

[0030] Optionally, a three-dimensional geometric matching algorithm can be used to match and analyze the geometric configuration of the docking surface of the standardized functional module with the cross-sectional shape of the guide groove; the length, direction and termination position of each channel in the physical guide channel set can be parameterized according to the spatial topology of the modular skeleton frame through a kinematic simulation platform.

[0031] It should be explained that, based on the physical guidance defined by the above assembly path, users can push standardized functional modules, including the core processing module, power module and extended functional modules, into the modular skeleton frame along the corresponding guide slots in any order as needed. It should be understood that the technical solution of the present invention does not depend on a specific assembly order, but rather ensures that the system can automatically establish a reliable connection and complete resource configuration regardless of the order in which the modules are connected through subsequent magnetic alignment, status recognition and intelligent management mechanisms.

[0032] The magnetic alignment module 202 is used to establish the spatial alignment relationship between the core processing module and the power module in the assembly path using the magnetic assisted alignment unit.

[0033] This invention utilizes the magnetically assisted alignment unit to establish a spatial alignment relationship between the core processing module and the power module in the assembly path. This allows for non-contact pre-alignment before the modules reach their mechanical locking positions, effectively compensating for minor positional deviations caused by machining tolerances and assembly skew. This ensures that the multi-functional connector achieves zero misalignment engagement during final locking, greatly reducing the risk of physical damage and electrical failures caused by mis-insertion.

[0034] In detail, the magnetic attraction-assisted alignment unit refers to a component composed of permanent magnets and magnetic conductive materials integrated inside or around the multifunctional connector of the standardized functional module. It generates a controllable magnetic field attraction to provide auxiliary positioning and initial holding force when the modules approach each other, guiding the connector to reach a relative position and attitude close to the ideal docking state before mechanical snap-fit ​​engagement; the core processing module refers to the standardized functional module in the modular electronic device that undertakes main control, calculation and system management functions. This module integrates the main printed circuit board assembly, central processing unit, memory, and the aforementioned intelligent management unit, and provides a core platform for data exchange and coordinated control of other functional modules. The power module refers to the standardized functional module in the modular electronic device responsible for energy storage and supply. This module includes at least a rechargeable battery pack, charge and discharge management circuit, and necessary protection devices, and provides the core processing module and other extended functional modules with voltage and current that meet system requirements through the multi-functional connector. The spatial alignment relationship refers to a deterministic three-dimensional spatial relative state relationship that is automatically established and maintained by the magnetic assisted alignment unit integrated on the mating surfaces of the two components through physical magnetic interaction before the multi-functional connectors of the two components reach mechanical locking, during the process of the user pushing the power module into the core processing module along the guide groove.

[0035] It should be noted that a bidirectional fast charging protocol chip and a hardware isolation circuit are integrated between the multi-functional connector of the power module and the core processing module to support hot-swapping and online power switching functions, thereby ensuring that the core processing system can operate without power or perform a safe shutdown process when the power module is removed or replaced.

[0036] As an embodiment of the present invention, the spatial alignment relationship between the core processing module and the power module in the assembly path is established using the magnetically assisted alignment unit, including: determining the initial spatial pose deviation between the core processing module and the power module at the termination position; obtaining the magnetic force distribution map and effective action distance corresponding to the magnetically assisted alignment unit from a preset magnetic parameter database; generating a pre-alignment motion path between the core processing module and the power module under the action of magnetic force by combining the initial spatial pose deviation, the magnetic force distribution map, and the effective action distance; establishing a pre-engagement pose envelope between the core processing module and the power module based on the pre-alignment motion path; and determining the spatial alignment relationship between the core processing module and the power module through the pre-engagement pose envelope.

[0037] Further, determining the initial spatial pose deviation between the core processing module and the power module at the termination position includes: extracting the first spatial coordinates and first attitude information at the termination position from the first preset assembly trajectory sequence corresponding to the core processing module, and the second spatial coordinates and second attitude information at the termination position from the second preset assembly trajectory sequence corresponding to the power module; identifying the positional offset between the first spatial coordinates and the second spatial coordinates, and identifying the angular deviation between the first attitude information and the second attitude information; and determining the initial spatial pose deviation between the core processing module and the power module at the termination position based on the positional offset and the angular deviation.

[0038] Wherein, the first preset assembly trajectory sequence refers to a set of ordered spatial positions and postures that the core processing module must follow from the assembly start point to the final locked position within the modular skeleton framework, as defined in advance; the second preset assembly trajectory sequence refers to a set of ordered spatial positions and postures that the power module must follow from the assembly start point to the final locked position within the modular skeleton framework, as defined in advance; the termination position refers to the final spatial position and posture that the module should reach after assembly, as defined in the corresponding preset assembly trajectory sequence; the initial spatial pose deviation refers to the initial position deviation of the core processing module and the power module relative to the assembly process at the beginning of the assembly process. The preset termination positions of each have comprehensive differences in spatial position and attitude angle; the magnetic parameter database refers to a digital collection storing the physical characteristic parameters of various magnetic components (such as permanent magnets and magnetic sheets) in the magnetic attraction-assisted alignment unit. The parameters include at least the magnetic moment, coercivity, spatial magnetic field distribution model of the magnet, and the permeability of the magnetic material; the magnetic attraction force distribution map refers to the vector field visualization or digital representation of the magnitude and direction of the magnetic force in the three-dimensional space around the magnetic attraction-assisted alignment unit, which is calculated or measured based on the data in the magnetic parameter database. Specifically, the magnetic attraction force distribution map can be a three-dimensional mesh model, where each node of the mesh stores a force vector. For example, on a plane 20 mm from the connector end face of the core processing module, the force vector diagram shows that the magnetic force mainly points towards the center of the connector, and the closer to the center, the greater the horizontal component of the force, which helps with automatic alignment; the effective action distance refers to the maximum spatial interval at which the magnetic attraction-assisted alignment unit can generate a magnetic force sufficient to overcome the friction and inertia between modules and achieve effective pose guidance and correction; the pre-alignment motion path refers to a smooth and continuous spatial trajectory dynamically generated based on the magnetic attraction effect to correct the initial spatial pose deviation, from the initial pose of the module to the envelope boundary of the pre-engagement pose; The pre-engagement pose envelope refers to a continuous spatial region in three-dimensional space surrounding the pre-alignment motion path. When the relative pose between the core processing module and the power module is at any point within this envelope, the magnetic attraction ensures that they are automatically guided along the pre-alignment motion path to a precise alignment state that ultimately achieves interference-free mechanical locking engagement. The position offset refers to the vector difference between the first spatial coordinates and the second spatial coordinates in each axial component of the three-dimensional Cartesian coordinate system. The angular deviation refers to the difference in angular displacement between the first attitude information and the second attitude information around each rotation axis of the spatial coordinate system.

[0039] Optionally, the magnetic force distribution map corresponding to the magnetic attraction-assisted alignment unit can be obtained using a magnetic field interpolation algorithm based on data from a magnetic parameter database; the effective action distance can be determined using magnetic simulation software.

[0040] In another embodiment of the present invention, combining the initial spatial pose deviation, the magnetic attraction force distribution map, and the effective action distance, a pre-alignment motion path is generated between the core processing module and the power supply module under magnetic attraction, including: calculating the displacement vector and attitude adjustment angle between the core processing module and the power supply module based on the initial spatial pose deviation; matching a magnetic gradient region within the effective action distance that is consistent with the direction of the displacement vector and the attitude adjustment angle according to the magnetic attraction force distribution map; and generating the pre-alignment motion path between the core processing module and the power supply module under magnetic attraction based on the magnetic gradient region.

[0041] Specifically, based on the magnetic gradient region, a pre-alignment motion path is generated between the core processing module and the power module under magnetic attraction, including: determining a smooth guide trajectory along the magnetic gradient region from the starting position of the initial spatial pose deviation to the ending position, wherein the smooth guide trajectory is the pre-alignment motion path.

[0042] The displacement vector refers to a three-dimensional vector used to quantify the spatial positional difference between the core processing module and the power module. This vector points from the first spatial coordinate to the second spatial coordinate, its magnitude represents the magnitude of the positional offset, and its direction represents the orientation of the positional offset. Specifically, the displacement vector can be expressed by the formula: Calculation, where This represents the first spatial coordinates corresponding to the core processing module. The second spatial coordinates corresponding to the power module are represented by the following parameters: the attitude adjustment angle refers to an angle quantity or set of angles used to quantify the spatial attitude difference between the core processing module and the power module. This parameter describes the angle of rotation around one or more spatial coordinate axes required to transform the first attitude information to align with the second attitude information, and can be determined by a quaternion difference algorithm; the magnetic gradient region refers to a spatial sub-region in the three-dimensional vector field defined by the magnetic attraction distribution map, where the direction and magnitude of the magnetic vector change rate satisfy specific guidance conditions; the starting position of the initial spatial pose deviation refers to the actual spatial position of the core processing module and the power module before the start of magnetic alignment correction when describing the initial spatial pose deviation. Typically, this starting position is defined by the starting point of the first preset assembly trajectory sequence and the second preset assembly trajectory sequence, or the position where the user actually places the module; the smooth guidance trajectory refers to a spatial curve planned within the magnetic gradient region that extends continuously and without abrupt changes from the starting position of the initial spatial pose deviation to the ending position.

[0043] As another embodiment of the present invention, based on the pre-alignment motion path, a pre-engagement pose envelope between the core processing module and the power module is established, including: calculating the pose tolerance domain of the core processing module and the power module under magnetic attraction at each path point on the pre-alignment motion path; establishing a continuous envelope between the core processing module and the power module based on the pose tolerance domain and the pre-alignment motion path; and defining the continuous envelope as the pre-engagement pose envelope.

[0044] The pose tolerance domain refers to the allowable range of relative pose between the core processing module and the power module at each specific path point on the pre-aligned motion path. This domain is a six-degree-of-freedom spatial range, defining the maximum set of position and attitude deviations that can still ensure the module is successfully guided to the next path point without deviating from the correct alignment path under the effective action of magnetic attraction and system mechanical tolerance. The continuous envelope refers to a single, seamlessly connected volume space generated in three-dimensional space by sweeping and merging the pose tolerance domains at all path points on the pre-aligned motion path along the path.

[0045] Optionally, the pose tolerance domain of the core processing module and the power supply module at each path point on the pre-aligned motion path under the action of magnetic attraction can be calculated by Monte Carlo simulation combined with dynamic simulation; the continuous envelope between the core processing module and the power supply module can be established by three-dimensional CAD Boolean operations.

[0046] It should be understood that the above embodiments, from a system design perspective, illustrate how to ensure that the magnetically assisted alignment unit can reliably establish the spatial alignment relationship in actual operation by predefining the trajectory, analyzing the magnetic field, and calculating the tolerance envelope. It should be emphasized that this series of design processes is transparent to the end user. When actually assembling, the user only needs to push the module along the guide groove, and the magnetic force will automatically guide the module to complete the precise spatial alignment. Then, mechanical locking and electrical connection are achieved through a single action. The whole process does not require any tools, skills, or active fine-tuning.

[0047] The locking connection module 203 is used to identify the mechanical locking state between the power module and the modular skeleton frame and establish the physical connection topology of the electrical interface when the power module and the core processing module are in the spatial alignment relationship.

[0048] This invention, by identifying the mechanical locking state between the power module and the modular frame when the power module and the core processing module are in spatial alignment, can achieve real-time perception and closed-loop control of key physical interactions during the assembly process, ensuring a secure mechanical interlock before electrical connection is established. The mechanical locking state refers to the stable connection state achieved by the user pushing the mechanical locking mechanism integrated in the multi-functional connector of the power module and the corresponding locking hole on the modular frame, which is physically engaged and maintained.

[0049] Optionally, the mechanical locking state can be identified by a position sensor integrated into the modular skeleton frame or the power module connector.

[0050] Furthermore, by establishing the physical connection topology of the electrical interface when the power module and the core processing module are in a spatial alignment relationship, the embodiments of the present invention can realize the structured and digital representation of the electrical interconnection relationship between modules, thereby providing the intelligent management unit with an accurate and real-time queryable system-level electrical connection map.

[0051] In detail, the electrical interface refers to a physical interface component integrated within the unified multi-functional connector, specifically responsible for power transmission and data signal exchange. The electrical interface includes at least elastic contact pins and contact arrays with a symmetrical anti-misfit design, as well as necessary insulation structures and shielding layers to ensure the establishment and maintenance of multiple parallel electrical channels while mechanically locking. The physical connection topology refers to an abstract model of the systematic and structured electrical connection relationships formed after all the standardized functional modules assembled in the modular electronic device are interconnected through their electrical interfaces. This topology is represented in graph theory, where nodes represent each functional module, edges represent the actual physical connection channels established between modules through electrical interfaces, and each edge is attached with attributes such as connection type, electrical parameters, and real-time status.

[0052] Optionally, the physical connection topology of the electrical interface can be established by the intelligent management unit in the core processing module polling and decoding the preset identity recognition circuit in the electrical interface.

[0053] The resource configuration module 204 is used to determine the electrical connection status between the core processing module and the power supply module through the physical connection topology, and, in combination with the mechanical locking status and the electrical connection status, construct a resource mapping table for the standardized functional modules through the intelligent management unit built into the core processing module.

[0054] This invention determines the electrical connectivity status between the core processing module and the power module through the physical connection topology, providing real-time and accurate underlying connection basis for the intelligent management unit in the core processing module to perform dynamic power allocation and online power switching. The electrical connectivity status refers to the actual electrical connection status and attributes established between the core processing module and the power module through the electrical interface in the unified multi-functional connector.

[0055] As an embodiment of the present invention, determining the electrical connectivity state between the core processing module and the power supply module through the physical connection topology includes: extracting a target path connecting the core processing module and the power supply module in the physical connection topology; applying an electrical detection excitation signal to the target path and obtaining an electrical response signal of the target path to the electrical detection excitation signal; generating a connectivity determination result of the target path based on a comparison result of the electrical response signal and a preset threshold; and determining the electrical connectivity state between the core processing module and the power supply module through the connectivity determination result.

[0056] The target path refers to a complete electrical path in the physical connection topology, consisting of one or more series-connected electrical connection edges, from the electrical interface node of the core processing module to the electrical interface node of the power supply module. The electrical detection excitation signal refers to an electrical signal with a known characteristic, specifically generated and injected into the target path to test its electrical connectivity. For example, the electrical detection excitation signal can be a DC voltage pulse with an amplitude lower than the module's operating voltage (e.g., 0.5V, pulse width 10ms), or a small-amplitude AC signal of a specific frequency (e.g., 1kHz, 50mV sine wave). The electrical response signal refers to the electrical signal measured at the output end, return end, or specific monitoring point of the target path after the electrical detection excitation signal is applied. Specifically, when a DC voltage pulse is applied as excitation, the electrical response signal may be the voltage rise waveform and its steady-state value measured at the end of the path. If the path is open, the response signal is zero or close to zero; if the path is normal, the response signal will be close to the excitation voltage minus the path voltage drop; the preset threshold refers to one or more sets of electrical parameter reference values ​​that are preset and stored in the intelligent management unit of the core processing module; the comparison result refers to the logical conclusion obtained by quantitatively comparing one or more actual measured parameters of the electrical response signal, such as voltage value, current value, and signal amplitude, with the corresponding preset threshold; the connectivity determination result refers to the final qualitative judgment made on the overall electrical connection status of the target path after combining one or more of the comparison results.

[0057] Optionally, an electrical detection excitation signal can be applied to the target path using a digital signal generator; an analog-to-digital converter can be used to obtain the electrical response signal of the target path to the electrical detection excitation signal.

[0058] Furthermore, by combining the mechanical locking state and the electrical connection state, and through the intelligent management unit built into the core processing module, the embodiment of the present invention constructs a resource mapping table for the standardized functional modules, which can provide a unique and reliable system-wide status basis for the intelligent management unit to automatically identify and dynamically allocate resources of the assembled modules.

[0059] In detail, the intelligent management unit refers to a dedicated logic control and communication coprocessing circuit or embedded software module integrated on the main printed circuit board assembly of the core processing module. It should be noted that the intelligent management unit has hardware awareness, protocol parsing, and resource scheduling capabilities. Its core function is to automatically perform logical operations such as module identification, communication protocol negotiation, power path configuration, and system resource allocation based on the real-time collected system physical status information. It is the central control node for realizing the "plug-and-play" and intelligent management of the modular electronic device. The resource mapping table refers to a dynamic system configuration list automatically created and maintained by the intelligent management unit after detecting that the module has completed mechanical locking and electrical connection.

[0060] For example, when a user pushes a "sensor module" into the frame and completes locking and connection, the intelligent management unit identifies its type as a "temperature sensor" and its specification as "I²C interface, 3.3V power supply." Subsequently, the intelligent management unit creates a record in the resource mapping table, assigns an unused I²C slave address to the module, and configures its power supply link to 3.3V output. This real-time updated table allows the system to know that "there is currently a temperature sensor at address 0x48, using 3.3V power," thus correctly performing data reading and power management.

[0061] As an embodiment of the present invention, combining the mechanical locking state and the electrical connection state, a resource mapping table of the standardized functional modules is constructed through the intelligent management unit built into the core processing module. This includes: parsing the joint determination information of the mechanical locking state and the electrical connection state through the intelligent management unit to extract the set of active modules in the standardized functional modules; querying the type identifier, specification parameters, and current state of each module in the set of active modules; allocating corresponding logical addressing information and power configuration strategies to each module based on the type identifier, specification parameters, and current state; and obtaining the resource mapping table of the standardized functional modules by structurally associating the logical addressing information and power configuration strategies of each module.

[0062] The joint determination information refers to a composite status identifier generated by the intelligent management unit based on the logical synthesis of the mechanical lock status detection results and electrical connectivity status detection results of the same standardized functional module. The effective module set refers to a subset selected from all currently physically connected standardized functional modules. For each module in this subset, the corresponding joint determination information indicates that the module is in an effective state where both mechanical lock and electrical connectivity are valid. The type identifier, specification parameters, and current status are metadata describing the core attributes of an effective module, obtained by the intelligent management unit by querying the integrated identification circuit within the module. The type identifier refers to the module's functional classification, such as a power module, core processing module, sensor module, communication module, etc. The specification parameters refer to the module's specific electrical and performance parameters, such as those of a power module. Output voltage / current range, battery capacity; sensor module detection range, accuracy, interface type (e.g., I2C address), etc.; the current status refers to the real-time operating status of the module based on its activation status, such as the remaining power (SOC) of the power module, whether the output is normal; the calibration status of the sensor module, whether the data is ready, etc.; the logical addressing information refers to the unique identifier and access path assigned to each module in the set of activated modules at the software or logical level of the system; the power configuration strategy refers to the set of specific power supply management instructions formulated and issued by the intelligent management unit for each activated module according to its type and specifications; the structured association refers to the process of organizing and fixing the logical addressing information of each module and the power configuration strategy according to predefined, machine-readable key-value pairs, database records, XML / JSON objects, and other data structures.

[0063] Optionally, the logical addressing information of each module can be structurally associated with the power configuration strategy using a graph database.

[0064] As another embodiment of the present invention, according to the type identifier, the specification parameters, and the current state, corresponding logical addressing information and power configuration strategy are allocated to each module, including: matching the corresponding basic resource configuration template from the resource strategy library pre-stored in the intelligent management unit according to the type identifier; instantiating the basic resource configuration template based on the specification parameters to generate an initial configuration scheme; dynamically optimizing and adjusting the logical address segment and power parameters in the initial configuration scheme according to the current state to generate a target resource configuration scheme; and separating the logical addressing information and the power configuration strategy from the target resource configuration scheme.

[0065] The resource policy library refers to a data set stored in the non-volatile memory of the intelligent management unit, indexed by module type and containing default resource configuration rules for various modules. The basic resource configuration template is a parameterized framework retrieved from the resource policy library based on the input module type identifier. This template includes a prototype of the logical addressing structure and a prototype of the power management framework for that module type, but its key parameters, such as specific address values ​​and current limits, are still placeholders or default values ​​and need to be filled in according to the specifications of the specific module. The instantiation process refers to the process of assigning and specifying the parameterized placeholders or variable fields in the basic resource configuration template according to the specific values ​​provided in the specification parameters. The initial configuration scheme refers to the first complete resource configuration description for the current module obtained after completing the instantiation process. This scheme already includes configuration rules based on the module's general type and specific specifications. The initial configuration scheme defines all logical and power parameters, but these have not yet been adaptively adjusted to the real-time operating status of the module. The logical address segment refers to the addressing information portion defined in the initial or target resource configuration scheme for system access to the module. This logical address segment includes at least address types such as memory address, bus address, and IP address, and specific address values, and may contain related communication protocol parameters. The power parameters refer to the electrical parameters defined in the initial or target resource configuration scheme for managing the power supply characteristics of the module. These power parameters include at least operating voltage, maximum / typical operating current, enable / disable control mode, and dynamic power management strategy parameters such as sleep current and wake-up time. Dynamic optimization adjustment refers to the process by which the intelligent management unit performs online fine-tuning or strategy switching of the logical address segments and power parameters in the initial configuration scheme based on the current state. For example, if the module status shows "high load", the communication bus clock allocated to it will be increased from the standard speed to high speed mode; if the system temperature status is "too high", the maximum allowable current allocated to the module will be reduced, or it will be switched to a low-power power mode; if the module status reports "minor communication error", more lenient values ​​will be assigned to its communication retry count and timeout parameters without changing the logical address; the target resource configuration scheme refers to the final resource configuration description that is determined after the initial configuration scheme has been dynamically optimized and adjusted, and will be sent to the hardware and loaded into the resource mapping table.

[0066] Optionally, the basic resource configuration template can be instantiated using a script interpretation engine; the logical addressing information and the power configuration strategy can be separated from the target resource configuration scheme using a configuration file parser.

[0067] The operation execution module 205 is used to execute the detachable assembly operation of the standardized functional module based on the resource mapping table, the assembly path and the intelligent management unit.

[0068] This invention, through the resource mapping table, the assembly path, and the intelligent management unit, executes the detachable assembly operation of the standardized functional modules. This enables precise, orderly, and secure management of the hot-swapping of modules and the dynamic reconfiguration of the system. It ensures that the continuity and stability of the system functions are not affected throughout the user's "plug-and-play" assembly process, while effectively avoiding the risk of hardware damage or system downtime caused by resource conflicts or illegal operations.

[0069] The detachable assembly operation refers to a complete closed-loop behavior involving assembly and disassembly, in which the user strictly follows the physical path and spatial constraints defined by the assembly path and implements the standardized functional module according to the module identity and resource configuration logic specified by the resource mapping table, under the unified coordination of the intelligent management unit. Specifically, the execution process of the detachable assembly operation includes: the user pushes the target module into the corresponding guide slot along the modular skeleton frame, and its movement is guided by the space of the assembly path; when the module approaches the termination position, its magnetic assisted alignment unit is automatically activated to establish a spatial alignment relationship with the target module; under the guidance of the alignment relationship, the user continues to apply force to trigger the mechanical lock to complete the locking, the system synchronously identifies the mechanical locking state and establishes the electrical connection topology, and the intelligent management unit then verifies the electrical connection state; the intelligent management unit identifies the module identity by combining the mechanical locking and electrical connection states, dynamically updates the resource mapping table and completes the logical resource registration and driver loading, so that the module enters the ready state; when disassembly is required, the intelligent management unit safely unloads the module's logical resources and cuts off the power supply according to the resource mapping table, and then the user can operate the mechanical unlocking mechanism to move the module out in the reverse direction along the original path; after the module is removed, the intelligent management unit synchronously updates the resource mapping table and reconfigures the system resources, forming a complete and controllable closed loop from physical assembly to logical readiness and then to safe removal.

[0070] like Figure 2 The diagram shown is a flowchart illustrating a detachable assembly method for a modular electronic device according to an embodiment of the present invention. In this embodiment, the detachable assembly method for the modular electronic device includes: S1. A guide groove is configured on the modular skeleton frame, and an assembly path for multiple standardized functional modules is generated through the guide groove. The mating surface of the standardized functional modules integrates a unified multi-functional connector that includes a mechanical latch, a magnetic assisted alignment unit, and an electrical interface. S2. Using the magnetic assisted alignment unit, establish the spatial alignment relationship between the core processing module and the power module in the assembly path; S3. When the power module and the core processing module are in the spatial alignment relationship, identify the mechanical locking state between the power module and the modular skeleton frame, and establish the physical connection topology of the electrical interface; S4. Based on the physical connection topology, determine the electrical connection status between the core processing module and the power module. Combining the mechanical locking status and the electrical connection status, construct the resource mapping table of the standardized functional modules through the intelligent management unit built into the core processing module. S5. Based on the resource mapping table, the assembly path, and the intelligent management unit, perform the detachable assembly operation of the standardized functional module.

[0071] In one embodiment, a computer device is provided, which may be a server, and its internal structure diagram may be as follows: Figure 3 As shown, the computer device includes a processor, memory, network interface, and database connected via a system bus. The processor provides computing and control capabilities. The memory includes non-volatile and / or volatile storage media and internal memory. The non-volatile storage media stores the operating system, computer programs, and database. The internal memory provides an environment for the operation of the operating system and computer programs in the non-volatile storage media. The network interface is used to communicate with external clients via a network connection. When executed by the processor, the computer program implements the functions or steps of a modular electronic device's detachable assembly system server side.

[0072] In one embodiment, a computer device is provided, including a memory, a processor, and a computer program stored in the memory and executable on the processor, wherein the processor executes the computer program to perform the following steps: The path guidance module is used to configure guide slots on the modular skeleton frame and generate assembly paths for multiple standardized functional modules through the guide slots. The standardized functional modules have a unified multi-functional connector on their mating surface that includes mechanical latches, magnetic assisted alignment units and electrical interfaces. A magnetic alignment module is used to establish the spatial alignment relationship between the core processing module and the power module in the assembly path using the magnetic assisted alignment unit. A locking connection module is used to identify the mechanical locking state between the power module and the modular skeleton frame and establish the physical connection topology of the electrical interface when the power module and the core processing module are in the spatial alignment relationship. The resource configuration module is used to determine the electrical connection status between the core processing module and the power module through the physical connection topology, and, in combination with the mechanical locking status and the electrical connection status, construct the resource mapping table of the standardized functional modules through the intelligent management unit built into the core processing module; The operation execution module is used to perform the detachable assembly operation of the standardized functional module based on the resource mapping table, the assembly path and the intelligent management unit.

[0073] In one embodiment, a computer-readable storage medium is provided having a computer program stored thereon, the computer program performing the following steps when executed by a processor: The path guidance module is used to configure guide slots on the modular skeleton frame and generate assembly paths for multiple standardized functional modules through the guide slots. The standardized functional modules have a unified multi-functional connector on their mating surface that includes mechanical latches, magnetic assisted alignment units and electrical interfaces. A magnetic alignment module is used to establish the spatial alignment relationship between the core processing module and the power module in the assembly path using the magnetic assisted alignment unit. A locking connection module is used to identify the mechanical locking state between the power module and the modular skeleton frame and establish the physical connection topology of the electrical interface when the power module and the core processing module are in the spatial alignment relationship. The resource configuration module is used to determine the electrical connection status between the core processing module and the power module through the physical connection topology, and, in combination with the mechanical locking status and the electrical connection status, construct the resource mapping table of the standardized functional modules through the intelligent management unit built into the core processing module; The operation execution module is used to perform the detachable assembly operation of the standardized functional module based on the resource mapping table, the assembly path and the intelligent management unit.

[0074] It should be noted that the functions or steps that can be implemented by the computer-readable storage medium or computer device described above can be referred to the relevant descriptions on the server side and client side in the foregoing method embodiments. To avoid repetition, they will not be described one by one here.

[0075] Those skilled in the art will understand that all or part of the processes in the methods of the above embodiments can be implemented by a computer program instructing related hardware. The computer program can be stored in a non-volatile computer-readable storage medium. When executed, the computer program can include the processes of the embodiments of the above methods. Any references to memory, storage, databases, or other media used in the embodiments provided in this application can include non-volatile and / or volatile memory. Non-volatile memory may include read-only memory (ROM), programmable ROM (PROM), electrically programmable ROM (EPROM), electrically erasable programmable ROM (EEPROM), or flash memory. Volatile memory may include random access memory (RAM) or external cache memory. By way of illustration and not limitation, RAM is available in a variety of forms, such as static RAM (SRAM), dynamic RAM (DRAM), synchronous DRAM (SDRAM), dual data rate SDRAM (DDRSDRAM), enhanced SDRAM (ESDRAM), synchronous link DRAM (SLDRAM), RAMbus direct RAM (RDRAM), direct memory bus dynamic RAM (DRDRAM), and memory bus dynamic RAM (RDRAM), etc.

[0076] Those skilled in the art will clearly understand that, for the sake of convenience and brevity, the above-described division of functional units and modules is used as an example. In practical applications, the above functions can be assigned to different functional units and modules as needed, that is, the internal structure of the device can be divided into different functional units or modules to complete all or part of the functions described above.

[0077] It will be apparent to those skilled in the art that the present invention is not limited to the details of the exemplary embodiments described above, and that the present invention can be implemented in other specific forms without departing from the spirit or essential characteristics of the present invention.

[0078] Finally, it should be noted that in the above embodiments, each embodiment can be combined with each other or independent. Deleting any one of them will not affect the technical implementation of other embodiments. The above embodiments are only used to illustrate the technical solutions of the present invention and not to limit it. Although the present invention has been described in detail with reference to preferred embodiments, those skilled in the art should understand that modifications or equivalent substitutions can be made to the technical solutions of the present invention without departing from the spirit and scope of the technical solutions of the present invention.

Claims

1. A modular electronic device detachable assembly system, characterized in that, The system includes: The path guidance module is used to configure guide slots on the modular skeleton frame and generate assembly paths for multiple standardized functional modules through the guide slots. The standardized functional modules have a unified multi-functional connector on their mating surface that includes mechanical latches, magnetic assisted alignment units and electrical interfaces. A magnetic alignment module is used to establish the spatial alignment relationship between the core processing module and the power module in the assembly path using the magnetic assisted alignment unit. A locking connection module is used to identify the mechanical locking state between the power module and the modular skeleton frame and establish the physical connection topology of the electrical interface when the power module and the core processing module are in the spatial alignment relationship. The resource configuration module is used to determine the electrical connection status between the core processing module and the power module through the physical connection topology, and, in combination with the mechanical locking status and the electrical connection status, construct the resource mapping table of the standardized functional modules through the intelligent management unit built into the core processing module; The operation execution module is used to perform the detachable assembly operation of the standardized functional module based on the resource mapping table, the assembly path and the intelligent management unit.

2. The modular electronic device detachable assembly system as described in claim 1, characterized in that, Using the magnetic alignment unit, the spatial alignment relationship between the core processing module and the power module in the assembly path is established, including: Determine the initial spatial pose deviation between the core processing module and the power module at the termination position; Obtain the magnetic force distribution map and effective working distance corresponding to the magnetic attraction-assisted alignment unit from the preset magnetic parameter database; By combining the initial spatial pose deviation, the magnetic attraction force distribution map, and the effective action distance, a pre-alignment motion path between the core processing module and the power module under the action of magnetic attraction force is generated. Based on the pre-aligned motion path, a pre-engagement pose envelope is established between the core processing module and the power module; The spatial alignment relationship between the core processing module and the power module is determined by the pre-engagement pose envelope.

3. The modular electronic device detachable assembly system as described in claim 2, characterized in that, The initial spatial pose deviation is determined based on the first preset assembly trajectory sequence of the core processing module and the second preset assembly trajectory sequence of the power supply module.

4. The modular electronic device detachable assembly system as described in claim 2, characterized in that, Combining the initial spatial pose deviation, the magnetic force distribution map, and the effective action distance, a pre-alignment motion path is generated between the core processing module and the power module under magnetic attraction, including: Based on the initial spatial pose deviation, calculate the displacement vector and attitude adjustment angle between the core processing module and the power module; According to the magnetic attraction force distribution map, a magnetic gradient region that is consistent with the direction of the displacement vector and the attitude adjustment angle is matched within the effective action distance; Based on the magnetic gradient region, a pre-aligned motion path is generated between the core processing module and the power module under magnetic attraction.

5. The modular electronic device detachable assembly system as described in claim 2, characterized in that, Based on the pre-aligned motion path, a pre-engagement pose envelope is established between the core processing module and the power module, including: Calculate the pose tolerance domain of the core processing module and the power module at each path point on the pre-aligned motion path under the action of magnetic attraction; Based on the pose tolerance domain and the pre-alignment motion path, a continuous envelope between the core processing module and the power module is established. The continuous envelope is defined as the pre-engaged pose envelope.

6. The modular electronic device detachable assembly system as described in claim 1, characterized in that, The guide groove generates assembly paths for multiple standardized functional modules, including: The geometric configuration of the docking surface of the standardized functional module is matched and analyzed with the cross-sectional shape of the guide groove to generate a set of physical guide channels corresponding to each standardized functional module. Based on the set of physical guidance channels, a motion constraint network is constructed for the standardized functional modules during the assembly process, and the motion constraint network is determined as the assembly path of the standardized functional modules.

7. The modular electronic device detachable assembly system as described in claim 6, characterized in that, The assembly path of the multiple standardized functional modules includes at least a power module, a core processing module, at least one extended functional module, and a detachable cable module.

8. The modular electronic device detachable assembly system as described in claim 1, characterized in that, Combining the mechanical locking state and the electrical connection state, the core processing module's built-in intelligent management unit constructs a resource mapping table for the standardized functional modules, including: The intelligent management unit parses the joint determination information of the mechanical locking state and the electrical connection state to extract the set of effective modules in the standardized functional modules; Query the type identifier, specification parameters, and current status of each module in the set of effective modules; Based on the type identifier, the specification parameters, and the current status, assign corresponding logical addressing information and power configuration strategy to each module; After structurally associating the logical addressing information of each module with the power configuration strategy, a resource mapping table for the standardized functional modules is obtained.

9. The modular electronic device detachable assembly system as described in claim 8, characterized in that, The type identifier, specification parameters, and current status are metadata describing the core attributes of an active module, which are obtained by the intelligent management unit by querying the identity recognition circuit integrated within the module.

10. A method for detachable assembly of a modular electronic device, employing a detachable assembly system for a modular electronic device as described in any one of claims 1-9, characterized in that, The method includes: Guide slots are configured on the modular skeleton frame, and assembly paths for multiple standardized functional modules are generated through the guide slots. The mating surfaces of the standardized functional modules are integrated with a unified multi-functional connector that includes mechanical latches, magnetic assisted alignment units, and electrical interfaces. Using the magnetic alignment unit, the spatial alignment relationship between the core processing module and the power module in the assembly path is established; When the power module and the core processing module are in the spatial alignment relationship, the mechanical locking state between the power module and the modular skeleton frame is identified, and the physical connection topology of the electrical interface is established. Based on the physical connection topology, the electrical connection status between the core processing module and the power module is determined. Combining the mechanical locking status and the electrical connection status, a resource mapping table for the standardized functional modules is constructed through the intelligent management unit built into the core processing module. Based on the resource mapping table, the assembly path, and the intelligent management unit, the detachable assembly operation of the standardized functional module is performed.

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