Patch multi-station collaborative automatic packaging equipment

Abstract

This invention provides a multi-station collaborative automated packaging equipment for PCB surface mount technology. It includes a worktable with a bidirectional moving module, a conveying assembly, and a clamping platform. The clamping platform is located in the middle of the conveying assembly. A mounting plate is fixedly installed on the output section of the bidirectional moving module. A CCD camera and a synchronous belt sliding assembly are arranged side-by-side on the front side of the mounting plate. A vacuum suction rod is installed on the output section of the synchronous belt sliding assembly. During the movement of the vacuum suction rod driven by the synchronous belt sliding assembly, the drive wheel drives the drive frame to move a swing arm, which in turn pushes a second swing arm under the action of a torsion spring. This achieves the coordinated operation of applying solder paste before mounting during the vacuum suction rod movement process. Simultaneously, the flow of solder paste through the flow obstruction of the solder paste delivery hose is achieved by a pry block in conjunction with an extrusion plate, thus achieving efficient control and reducing the requirements for solder paste flowability.

Description

Technical Field

[0001] This invention relates to the field of PCB surface mount technology, specifically to a multi-station collaborative automated packaging equipment for surface mount technology. Background Technology

[0002] Solder paste printing is the first step in the PCB placement process. Usually, a stencil is used to evenly apply solder paste to the pads on the PCB board. The fluidity of the solder paste and the accuracy of the stencil openings determine the placement effect. In addition, the force and speed of the squeegee are very important. If the force is too small, the solder paste will not cover the pads. If the force is too large, it will easily overflow and cause short circuits, thus increasing the scrap rate. Summary of the Invention

[0003] (a) Technical problems to be solved To address the shortcomings of existing technologies, this invention provides a multi-station collaborative automated packaging equipment for PCB placement, which solves the problem of high precision requirements for solder paste printing on stencils before PCB placement.

[0004] (II) Technical Solution To achieve the above objectives, the present invention provides the following technical solution: a multi-station collaborative automated packaging equipment for chip mounting, comprising a worktable, on which a bidirectional moving module, a conveying assembly, and a clamping platform are arranged, the clamping platform being located in the middle section of the conveying assembly, the output section of the bidirectional moving module being fixedly mounted with a mounting plate, and a CCD camera and a synchronous belt sliding assembly arranged side by side on the front side of the mounting plate, the output section of the synchronous belt sliding assembly being mounted with a vacuum suction rod; A connecting frame is fixed to the rear side of the mounting plate. An electromagnetic clutch for connecting a synchronous belt sliding assembly is provided on the inner side of the mounting plate and the connecting frame. A drive wheel is connected to the other side of the electromagnetic clutch. A push shaft and a lever are arranged at the same height on the drive wheel. A slide rod is slidably connected to the inner side of the connecting frame. A drive frame is fixed to the upper end of the slide rod. The push shaft extends into the drive frame. A reset guide assembly is provided between the drive frame and the connecting frame. A pressing plate that cooperates with the lever is provided below the drive wheel on the connecting frame. A solder paste delivery hose is provided on the upper side of the pressing plate. The pressing plate is used to block the flow of solder paste in the solder paste delivery hose. The slide bar is rotatably mounted with a second swing frame on the side facing the drive wheel. A torsion spring is provided between the second swing frame and the slide bar. An extrusion assembly connected to a solder paste delivery hose is fixed to the lower end of the second swing frame.

[0005] Preferably, the conveying assembly includes three sets of synchronous drive units, an upper limit plate is fixed on the upper side of the synchronous drive unit located in the middle section, and a cylinder with its output end connected to the clamping table is installed on the worktable.

[0006] Preferably, the timing belt sliding assembly includes two timing pulleys and a timing belt. Both timing pulleys are rotatably connected to the mounting plate. The timing belt engages with the outer side of the timing pulleys. A carriage is fixed to the outer side of the timing belt, and the vacuum suction rod is fixedly mounted on the carriage.

[0007] Preferably, a rotating shaft is fixedly connected to the middle of the synchronous pulley, and the rotating shaft is rotatably connected to the mounting plate. The rotating shaft of the synchronous pulley located on the lower side is connected to an electromagnetic clutch, and a motor is fixedly connected to the rotating shaft located on the upper side.

[0008] Preferably, the reset guide assembly includes a spring and a guide rod, the lower end of the guide rod is fixedly connected to the connecting frame, the drive frame is slidably connected to the guide rod, the spring is sleeved on the outside of the guide rod, and the drive frame and the connecting frame are fixed at both ends respectively.

[0009] Preferably, an annular groove for accommodating a solder paste delivery hose is provided at the center of the drive wheel in the height direction, and the depth of the annular groove is consistent with twice the wall thickness of the solder paste delivery hose.

[0010] Preferably, a rubber pad is provided in the middle of the bidirectional moving module, and a solder paste box is attached and fixed on the rubber pad. The solder paste box is connected to the solder paste delivery hose, and the upper part of the solder paste box includes a rotatable cover.

[0011] Preferably, the upper side of the cover plate is wavy, the rear side of the mounting plate is rotatably connected to a connecting plate, and the lower side of the connecting plate is fixedly connected to a toothed plate, the toothed plate cooperating with the wavy part of the cover plate.

[0012] Preferably, the extrusion assembly includes a swing frame, on one side of which an extrusion head and an air bladder are arranged vertically. The extrusion head is connected to a solder paste delivery hose, and the air bladder has an exhaust port on the side away from the extrusion head. The air bladder extends 0.5-1mm beyond the extrusion head.

[0013] Preferably, the extrusion head is provided with an inclined surface facing the airbag side, and the extrusion port of the extrusion head is located at the inclined surface.

[0014] (III) Beneficial Effects This invention provides a multi-station collaborative automated packaging equipment for surface mount technology (SMT). It has the following advantages: During the process of moving the vacuum suction rod by the synchronous belt sliding assembly, the drive wheel drives the drive frame to move the first swing frame, and under the action of the torsion spring, pushes the second swing frame to swing. This realizes the coordinated work of applying solder paste before placing the chip in the process of moving the vacuum suction rod. At the same time, the flow of solder paste is obstructed by the extrusion plate in conjunction with the paddle block, which achieves efficient control and also reduces the requirements for the flowability of solder paste. Attached Figure Description

[0015] Figure 1 This is a schematic diagram of the structure of the present invention; Figure 2 for Figure 1 Enlarged view of point A in the middle; Figure 3 For the present invention in Figure 1 A structural diagram on the other side; Figure 4 For the present invention to remove Figure 3 A schematic diagram of the structure behind a supporting side plate of the conveyor assembly; Figure 5 This is a schematic diagram of the structure of the synchronous belt sliding component in this invention; Figure 6 for Figure 5 Enlarged view of point B in the middle; Figure 7 For the present invention in Figure 6 A structural diagram of the other side; Figure 8 This is a schematic diagram of the structure of the reset guide assembly of the present invention.

[0016] The components are as follows: 1. Cabinet; 2. Workbench; 3. Conveying assembly; 4. Mounting platform; 5. Mounting plate; 6. Motor; 7. Synchronous pulley; 8. Synchronous belt; 9. Carriage; 10. Vacuum suction rod; 11. Auxiliary wheel; 12. Extrusion head; 13. Airbag; 14. Swing frame one; 15. Guide frame; 16. CCD camera; 17. Cover plate; 18. Toothed plate; 19. Connecting plate; 20. Clamping platform; 21. Solder paste box; 22. Extrusion plate; 23. Spring; 24. Slide rod; 25. Guide rod; 26. Drive frame; 27. Drive wheel; 28. Connecting frame; 29. ​​Swing frame two; 31. Pulley; 32. Electromagnetic clutch; 33. Torsion spring. Detailed Implementation

[0017] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0018] Example 1: like Figures 1-8As shown, this embodiment of the invention provides a multi-station collaborative automated packaging equipment for chip mounting, including a workbench 2. A cabinet 1 is fixedly installed on the lower side of the workbench 2. The bottom of the cabinet 1 is supported on the ground by feet. The workbench 2 is equipped with a bidirectional moving module, a conveying assembly 3, and a clamping table 20. The bidirectional moving module is a linear slide module with two-way movement, commonly used in the field of automation. The middle linear slide module is arranged at the output of another linear slide module to achieve horizontal movement in the X / Y axial directions. The clamping table 20 is arranged in the middle section of the conveying assembly 3. Specifically, the conveying assembly 3 includes three sets of synchronous drive units and support side plates. There are two support side plates, which are fixedly installed on the workbench 2. The three sets of synchronous drive units are equidistantly distributed along the length of the support side plates, and the structure of each section is the same. That is, the support side plates are provided with pulleys on the opposite side walls of each section. A conveyor belt is sleeved on the outside of the pulley on one of the support side plates. The conveyor belts in one section rotate synchronously. The conveyor belt moves by driving the active pulley shaft with the same motor. An upper limit plate is fixed on the upper side of the synchronous drive unit located in the middle section. A cylinder with its output end connected to the clamping table 20 is installed on the worktable 2. The clamping table 20 includes four support columns and a support platform. The output end of the cylinder is fixed to the support platform. The four support columns are fixed on the upper side of the support platform. An air source system that provides power to the cylinder is arranged in the cabinet 1. During the operation of the conveyor belt, a frame is placed on the conveyor belt. The frame is used to place the PCB board. After the PCB board is placed in the frame, the upper sides of the two are flat. The upper end of the support column is used to act on the lower side of the frame. After the cylinder pushes the support platform and moves the support column horizontally upward, it works with the upper limit plate to clamp the PCB board. In order to ensure the stable vertical rise of the support platform, a guide sleeve assembly is set on the support platform and the worktable 2. The guide sleeve assembly consists of a sleeve and a guide rod. The sleeve is fixed to the worktable 2, and the guide rod is fixed to the support platform. The sleeve and the guide rod are slidably connected. The output section of the bidirectional moving module is fixedly mounted with a mounting plate 5, that is, the mounting plate 5 is fixedly mounted with the output end of the linear slide module located in the middle. The front side of the mounting plate 5 is provided with a CCD camera 16 and a synchronous belt sliding assembly arranged side by side. The output section of the synchronous belt sliding assembly is equipped with a vacuum suction rod 10, which is connected to the air source system. The CCD camera 16 is used to obtain the position information of the chip to be placed on the PCB board and the position information of the vacuum suction rod 10 relative to the position of the chip after it is picked up. The information is processed by the arranged PC terminal. A COB light source is provided on the front side of the middle section of the conveying assembly 3 on the worktable 2. The aforementioned synchronous belt sliding assembly includes two synchronous pulleys 7 and a synchronous belt 8. Both synchronous pulleys 7 are rotatably connected to the mounting plate 5. The synchronous belt 8 meshes with the outer side of the synchronous pulleys 7. A slide 9 is fixed to the outer side of the synchronous belt 8. A guide frame 15 and a guide groove are provided on the front side of the mounting plate 5. One side of the slide 9 is slidably connected to the guide frame 15, and the other side is slidably connected to the guide groove. A vacuum suction rod 10 is fixedly installed on the slide 9. A rotating shaft is fixedly connected to the middle of the synchronous pulleys 7. The rotating shaft is rotatably connected to the mounting plate 5. A motor 6 is fixedly connected to the upper rotating shaft. The motor 6 is fixedly installed on the rear side of the mounting plate 5. The motor 6 drives the rotating shaft connected to it to rotate, which in turn drives the corresponding synchronous pulley 7 to rotate. The movement of the synchronous belt 8 causes the slide 9 to move up and down. As the slide 9 moves from its uppermost to its lowermost position, the synchronous belt pulley 7 rotates one revolution. At this time, the vacuum suction rod 10 moves down to pick up the patch from the carrier belt or place the patch on the PCB board. Specifically, a mounting platform 4 is installed on the workbench 2, and a chip feeder is installed on the mounting platform 4. The carrier belt on the chip feeder automatically feeds the patch. The height of the vacuum suction rod 10 in picking up and placing the patch is consistent, that is, the height of the vacuum suction rod 10 in picking up the patch from the carrier belt is consistent with the height of the upper side of the PCB board. This makes it easy to control the up and down movement distance of the vacuum suction rod 10. An encoder is installed on the inner side of the mounting plate 5 corresponding to the timing belt 8, and a roller is installed on the encoder that contacts the timing belt pulley 7 located on the lower side. A connecting bracket 28 is fixed to the rear side of the mounting plate 5. An electromagnetic clutch 32 for connecting the timing belt sliding assembly is provided on the inner side of the mounting plate 5 and the connecting bracket 28. That is, the shaft of the timing belt pulley 7 located on the lower side is connected to the electromagnetic clutch 32. A drive wheel 27 is connected to the other side of the electromagnetic clutch 32. Specifically, when the electromagnetic clutch 32 is closed, the rotating timing belt pulley 7 can drive the drive wheel 27 to rotate. Conversely, the drive wheel 27 is in a stopped state. The drive wheel 27 is provided with a push shaft and a lever 31 arranged at the same height. A slide rod 24 is slidably connected to the inner side of the connecting frame 28. The upper end of the slide rod 24 is fixed to the drive frame 26. The push shaft extends into the drive frame 26. A reset guide assembly is provided between the drive frame 26 and the connecting frame 28. The reset guide assembly includes a spring 23 and a guide rod 25. The lower end of the guide rod 25 is fixedly connected to the connecting frame 28. The drive frame 26 is slidably connected to the guide rod 25. The spring 23 is sleeved on the outer side of the guide rod 25, and the two ends are fixed to the drive frame 26 and the connecting frame 28 respectively. The spring 23 exerts a moving force on the drive frame 26. After the drive wheel 27 rotates, it will drive the push shaft to move the drive frame 26 up and down, and then drive the slide rod 24 to move up and down. The connecting frame 28 is provided with a pressing plate 22 that cooperates with the toggle block 31 below the drive wheel 27. A solder paste delivery hose is provided on the upper side of the pressing plate 22. The pressing plate 22 is used to block the flow of solder paste in the solder paste delivery hose. That is, the pressing plate 22 squeezes the solder paste delivery hose under the action of the pressing plate 22, thereby blocking the flow of solder paste in the solder paste delivery hose. After the drive wheel 27 is rotated to drive the toggle block 31 to push the pressing plate 22 away from the drive wheel 27, the solder paste can flow downward in the solder paste delivery hose. A swing frame 29 is rotatably mounted on the side of the slide rod 24 facing the drive wheel 27. A torsion spring 33 is provided between the swing frame 29 and the slide rod 24. An extrusion assembly connected to the solder paste delivery hose is fixed to the lower end of the swing frame 29. In the above, after the push shaft of the drive wheel 27 rotates to the lowest position, the slide rod 24 drives the swing frame 29 to extend downwards out of the connecting frame 28. Under the action of the torsion spring 33, the swing frame 29 swings to a horizontal state. Here, the swing frame 29 is in a horizontal state because the connecting frame 28 obstructs the swing frame 29.

[0019] A groove is provided in the middle of the drive wheel 27 in the height direction to accommodate the solder paste delivery hose. The depth of the groove is consistent with twice the wall thickness of the solder paste delivery hose, so that the extrusion plate 22 can extrude the solder paste delivery hose and obstruct the flow of solder paste.

[0020] A rubber pad is provided in the middle of the bidirectional moving module, and a solder paste box 21 is attached and fixed on the rubber pad. The solder paste box 21 is connected to the solder paste delivery hose. The upper part of the solder paste box 21 includes a rotating and opening cover 17. After opening the cover 17, solder paste with the fluidity required for surface mount application and the fluidity required for the solder paste delivery hose can be loaded into the solder paste box 21.

[0021] The extrusion assembly includes a swing frame 14, which is vertically fixed to a swing frame 29. An extrusion head 12 and an air bladder 13 are arranged vertically on one side of the swing frame 14. The extrusion head 12 is connected to a solder paste delivery hose. The air bladder 13 has an exhaust port on the side away from the extrusion head 12. The part of the air bladder 13 corresponding to the outlet of the extrusion head 12 is flush with the side of the outlet of the extrusion head 12. The other part of the air bladder 13 extends out of the extrusion head 12 by 0.5-1mm. When the swing frame 29 is in a vertical state, the swing frame 14 is in a side-standing state. When the swing frame 29 is in a horizontal state, the swing frame 14 rotates 90 degrees, so that the air bladder 13 is attached to the unattached area on the PCB board. During the process, the air bladder 13 is squeezed to expel air, thereby blowing away any dust that may be present on the unattached area. The solder paste flowing from the extrusion head 12 reaches the area to be attached.

[0022] The extrusion head 12 is provided with an inclined surface facing the airbag 13, and the extrusion port of the extrusion head 12 is located on the inclined surface.

[0023] Working principle: During the pick-up process, the PC terminal controls the electromagnetic clutch 32 to be in the disengaged state. The bidirectional moving module drives the vacuum suction rod 10 to move to the pick-up position. Then, the synchronous belt sliding assembly moves the carriage 9 from the uppermost position to the lowermost position. After picking up the component, the carriage 9 moves from the lowermost position to the uppermost position. Then, the bidirectional moving module drives the vacuum suction rod 10 to move directly above the area to be placed. At this time, the electromagnetic clutch 32 is in the closed state. When the bidirectional moving module drives the carriage 9 from the uppermost position to halfway through its stroke, the synchronous belt pulley 7 drives the drive wheel 27 to rotate through the electromagnetic clutch 32. During this process, the drive wheel 27 drives the drive frame 26 through the push shaft, causing the slide rod 24 to move downward. As a result, the swing frame 29 swings from a vertical state to a horizontal state, causing the swing frame 14 to rotate accordingly. As the push block 31 pushes the extrusion plate 22, the solder paste is extruded from the extrusion head 12. As the solder paste flows out to the area on the PCB to be mounted, when the slide 9 moves from the half position to the bottom position, the drive wheel 27 drives the push shaft to drive the frame 26, causing the slide bar 24 to move upward. Then, the shape constraint of the connecting frame 28 causes the swing frame 29 to change from a horizontal state to a vertical state. During this process, the air bag 13 sweeps across the area where the solder paste is extruded, thereby smoothing the solder paste and controlling the thickness of the solder paste. The residual solder paste in the gap between the air bag 13 and the extrusion head 12 can be cleaned periodically. Alternatively, a suction device can be installed to remove excess residual solder paste, improving the level of automation. As the drive wheel 27 continues to rotate, the swing frame 14 moves upward and the swing frame 19 rotates away from the PCB board. Finally, the vacuum suction rod 10 places the component in the area where the solder paste is applied. Finally, the electromagnetic clutch 32 is disengaged, and the synchronous belt sliding assembly moves the slide 9 from the bottom position to the top position. This process is repeated to complete the component mounting operation.

[0024] Example 2: Based on Embodiment 1, the upper side of the cover plate 17 is wavy, and the rear side of the mounting plate 5 is rotatably connected to the connecting plate 19. The lower side of the connecting plate 19 is fixedly connected to the toothed plate 18, which cooperates with the wavy part of the cover plate 17. In the above, during the movement of the linear slide module located in the middle, the connecting plate 19 drives the toothed plate 18 to contact the cover plate 17, and the resulting vibration is transmitted to the solder paste box 21, causing the solder paste box 21 to flow downward into the solder paste delivery hose, while also reducing the entry of air bubbles.

[0025] Although embodiments of the invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A multi-station collaborative automated packaging equipment for chip mounting, comprising a workbench (2), wherein the workbench (2) is provided with a bidirectional moving module, a conveying assembly (3), and a clamping platform (20), wherein the clamping platform (20) is arranged in the middle section of the conveying assembly (3), characterized in that: The output section of the bidirectional mobile module is fixedly mounted with a mounting plate (5). A CCD camera (16) and a synchronous belt sliding assembly are arranged side by side on the front side of the mounting plate (5). A vacuum suction rod (10) is installed on the output section of the synchronous belt sliding assembly. A connecting frame (28) is fixed to the rear side of the mounting plate (5). An electromagnetic clutch (32) for connecting the synchronous belt sliding assembly is provided on the inner side of the mounting plate (5) and the connecting frame (28). A drive wheel (27) is connected to the other side of the electromagnetic clutch (32). A push shaft and a lever (31) arranged at the same height are provided on the drive wheel (27). A slide rod (24) is slidably connected to the inner side of the connecting frame (28). A drive frame (26) is fixed to the upper end of the slide rod (24). The push shaft extends into the drive frame (26). A reset guide assembly is provided between the drive frame (26) and the connecting frame (28). A pressing plate (22) that cooperates with the lever (31) is provided below the drive wheel (27) of the connecting frame (28). A solder paste delivery hose is provided on the upper side of the pressing plate (22). The pressing plate (22) is used to block the flow of solder paste in the solder paste delivery hose. The slide bar (24) is rotatably provided with a second swing frame (29) on the side facing the drive wheel (27). A torsion spring (33) is provided between the second swing frame (29) and the slide bar (24). An extrusion assembly connected to the solder paste delivery hose is fixed at the lower end of the second swing frame (29).

2. The multi-station collaborative automated packaging equipment for chip mounting according to claim 1, characterized in that: The conveying assembly (3) includes three sets of synchronous drive units. An upper limit plate is fixed on the upper side of the synchronous drive unit located in the middle section. A cylinder with its output end connected to the clamping table (20) is installed on the worktable (2).

3. The multi-station collaborative automated packaging equipment for surface mount technology (SMT) according to claim 2, characterized in that: The synchronous belt sliding assembly includes two synchronous pulleys (7) and a synchronous belt (8). Both synchronous pulleys (7) are rotatably connected to the mounting plate (5). The synchronous belt (8) is engaged on the outside of the synchronous pulleys (7). A carriage (9) is fixed on the outside of the synchronous belt (8). The vacuum suction rod (10) is fixedly installed on the carriage (9).

4. The multi-station collaborative automated packaging equipment for surface mount technology (SMT) according to claim 3, characterized in that: The synchronous pulley (7) is fixedly connected to a rotating shaft in the middle. The rotating shaft is rotatably connected to the mounting plate (5). The rotating shaft of the synchronous pulley (7) located on the lower side is connected to an electromagnetic clutch (32). The rotating shaft located on the upper side is fixedly connected to a motor (6).

5. The multi-station collaborative automated packaging equipment for chip mounting according to claim 4, characterized in that: The reset guide assembly includes a spring (23) and a guide rod (25). The lower end of the guide rod (25) is fixedly connected to the connecting frame (28). The drive frame (26) is slidably connected to the guide rod (25). The spring (23) is sleeved on the outside of the guide rod (25), and the drive frame (26) and the connecting frame (28) are fixed at both ends respectively.

6. The multi-station collaborative automated packaging equipment for chip mounting according to claim 5, characterized in that: The drive wheel (27) has an annular groove at the center of its height direction to accommodate the solder paste delivery hose, and the depth of the annular groove is consistent with twice the wall thickness of the solder paste delivery hose.

7. The multi-station collaborative automated packaging equipment for chip mounting according to claim 6, characterized in that: A rubber pad is provided in the middle of the bidirectional moving module, and a solder paste box (21) is attached and fixed on the rubber pad. The solder paste box (21) is connected to the solder paste delivery hose, and the upper part of the solder paste box (21) includes a cover plate (17) that can be rotated and opened.

8. The multi-station collaborative automated packaging equipment for chip mounting according to claim 7, characterized in that: The upper side of the cover plate (17) is wavy, and the rear side of the mounting plate (5) is rotatably connected to a connecting plate (19). The lower side of the connecting plate (19) is fixedly connected to a toothed plate (18), and the toothed plate (18) cooperates with the wavy part of the cover plate (17).

9. The multi-station collaborative automated packaging equipment for surface mount technology (SMT) according to claim 8, characterized in that: The extrusion assembly includes a swing frame (14), on one side of which an extrusion head (12) and an air bag (13) are arranged vertically. The extrusion head (12) is connected to a solder paste delivery hose. The air bag (13) has an exhaust hole on the side away from the extrusion head (12). The air bag (13) extends 0.5-1mm beyond the extrusion head (12).

10. A multi-station collaborative automated packaging equipment for surface mount technology (SMT) according to claim 9, characterized in that: The extrusion head (12) is provided with an inclined surface facing the airbag (13), and the extrusion port of the extrusion head (12) is located on the inclined surface.

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