Spray head for post-cmp cleaning of wafers and cleaning method

Abstract

This application provides a nozzle fixture and cleaning method for post-CMP cleaning of wafers, belonging to the field of semiconductor manufacturing. The nozzle fixture includes: a connecting part for connecting to a support structure within the cleaning chamber to fix the nozzle fixture; and a liquid outlet part including a liquid outlet pipe and a nozzle connected to the liquid outlet pipe. The liquid outlet pipe has at least a certain length that is a variable diameter pipe. The cross-section of one end of the variable diameter pipe is a centrally symmetric shape, and the cross-section of the other end of the variable diameter pipe connected to the nozzle is an axisymmetric shape formed by symmetrical compression of the centrally symmetric shape in at least one direction. The nozzle fixture for post-CMP cleaning of wafers in this application increases the amplitude of the cleaning fluid sprayed onto the wafer surface, improving the flatness of the wafer surface.

Description

Technical Field

[0001] This application relates to the field of semiconductor manufacturing, and more particularly to a nozzle firmware and cleaning method for post-CMP cleaning of wafers. Background Technology

[0002] Chemical mechanical polishing (CMP) is a planarization process that generates particles, metals, and organic contaminants during CMP. Post-CMP cleaning is crucial to ensure the cleanliness of the wafer surface.

[0003] CMP equipment operates in conjunction with cleaning equipment, removing particles from the wafer surface through mechanical scrubbing and chemical etching. In the chemical etching process, nozzles within the cleaning chamber of the cleaning equipment loosen and remove particles from the wafer surface by spraying an alkaline cleaning solution. Therefore, the spraying effect of the nozzles significantly impacts the micro-roughness of the wafer surface in the post-CMP cleaning stage. In existing technologies, the spray amplitude from the cleaning chamber nozzles is relatively small, failing to cover a large area of ​​the wafer, leading to abnormal markings on the wafer surface after CMP cleaning.

[0004] Improving the uniformity of micro-roughness on the wafer surface after CMP cleaning is a technical problem that urgently needs to be solved by those skilled in the art. Summary of the Invention

[0005] To address the problems existing in the prior art, this application provides a nozzle fixture and cleaning method for post-CMP cleaning.

[0006] This application provides a nozzle firmware for post-CMP cleaning, including:

[0007] The connecting part is used to connect with the support structure inside the cleaning chamber and fix the nozzle fastener;

[0008] The liquid outlet section includes a liquid outlet pipe and a nozzle connected to the liquid outlet pipe. The liquid outlet pipe has at least a certain length of a variable diameter pipe. The cross-section of one end of the variable diameter pipe is a centrally symmetric figure, and the cross-section of the other end of the variable diameter pipe connected to the nozzle is an axisymmetric figure formed by symmetrical compression of the centrally symmetric figure in at least one direction.

[0009] According to the nozzle firmware provided in this application for post-CMP cleaning of wafers, one end of the variable diameter tube has a circular cross-section, and the other end of the variable diameter tube has an elliptical first elliptical cross-section.

[0010] According to the present application, a nozzle firmware for post-CMP cleaning of wafers is provided, wherein the first elliptical cross section is formed by symmetrical compression of the circular cross section in two mutually perpendicular directions, and the major axis of the first elliptical cross section is smaller than the diameter of the circular cross section.

[0011] According to the nozzle firmware provided in this application for post-CMP cleaning of wafers, the major axis of the first elliptical cross section is at least half the diameter of the circular cross section.

[0012] According to the nozzle firmware provided in this application for post-CMP cleaning of wafers, the entire outlet pipe is a variable diameter pipe.

[0013] According to the nozzle firmware provided in this application for post-CMP cleaning of wafers, the variable diameter tube gradually contracts in the direction of cleaning fluid outflow.

[0014] According to the nozzle firmware provided in this application for post-CMP cleaning of wafers, the nozzle cross-section is an elliptical second elliptical cross-section, and the major axis of the second elliptical cross-section and the major axis of the first elliptical cross-section have a non-zero preset angle in the vertical plane.

[0015] According to the present application, a nozzle firmware for post-CMP cleaning of wafers is provided, wherein the preset angle is 90 degrees.

[0016] According to the nozzle firmware provided in this application for post-CMP cleaning of wafers, the minor axis of the second elliptical cross section is at least half of the minor axis of the first elliptical cross section.

[0017] According to the present application, a nozzle firmware for post-CMP cleaning of wafers is provided, the nozzle firmware further includes a linear transmission pipeline, one end of which is connected to an external liquid supply device and the other end is connected to the liquid outlet, for transmitting the cleaning fluid from the external liquid supply device to the liquid outlet.

[0018] According to the present application, a nozzle fastener for post-CMP cleaning of wafers is provided, wherein the connecting part is hinged to the support structure inside the cleaning chamber.

[0019] This application also provides a cleaning method, implemented based on the nozzle firmware for post-CPM cleaning of wafers as described in any of the above claims, including:

[0020] The processing time of the cleaning solution is set based on the machine end;

[0021] Based on the processing time, the cleaning fluid is sprayed through the nozzle firmware used for post-CMP cleaning of the wafer to clean the wafer surface.

[0022] According to a cleaning method provided in this application, the cleaning solution is ozone-deionized water or deionized water.

[0023] The nozzle fixture for post-CMP cleaning of wafers provided in this application includes a connecting part and a liquid outlet part. The connecting part is connected to a support structure inside the cleaning chamber to fix the position of the nozzle fixture. The liquid outlet part includes a liquid outlet pipe and a nozzle connected to the liquid outlet pipe. The liquid outlet pipe has at least a certain length of a variable diameter pipe. The cross-section of one end of the variable diameter pipe is a centrally symmetric figure, and the cross-section of the other end of the variable diameter pipe connected to the nozzle is an axisymmetric figure formed by symmetrical compression of the centrally symmetric figure in one direction. The reduction of the cross-section of the liquid outlet pipe constrains the cleaning liquid in the liquid outlet pipe, increases the flow rate of the cleaning liquid, increases the amplitude of the cleaning liquid sprayed by the nozzle on the wafer surface, and reduces the difference in micro-roughness of the wafer surface. Attached Figure Description

[0024] To more clearly illustrate the technical solutions in this application or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0025] Figure 1 This is a schematic diagram of the structure of a nozzle firmware according to an embodiment of this application;

[0026] Figure 2 This is one of the internal structure diagrams of the nozzle firmware according to an embodiment of this application;

[0027] Figure 3a and Figure 3b This is a second schematic diagram of the internal structure of the nozzle firmware according to an embodiment of this application;

[0028] Figure 4 This is one of the partial cross-sectional views of a nozzle firmware according to an embodiment of this application;

[0029] Figure 5 This is a second partial cross-sectional view of a nozzle firmware according to an embodiment of this application;

[0030] Figure 6a This is a top view of the spraying effect of a nozzle structure based on existing technology;

[0031] Figure 6b This is a top view of the spraying effect of a nozzle firmware according to an embodiment of this application;

[0032] Figure 7a This is a test diagram of the cleaning effect of the nozzle structure in the existing technology;

[0033] Figure 7b This is a side view of the cleaning effect of a nozzle firmware according to an embodiment of this application;

[0034] Figure 8This is a schematic flowchart of a cleaning method according to an embodiment of this application. Detailed Implementation

[0035] To make the objectives, technical solutions, and advantages of this application clearer, the technical solutions of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0036] It should be noted that, in this embodiment, the nozzle firmware is disposed in the cleaning chamber after wafer CMP cleaning and is connected to the support structure of the chamber.

[0037] After the wafer CMP process, a large amount of polishing fluid or industrial debris remains on the wafer surface. These particulate contaminants include a large amount of organic matter, causing the wafer surface to become hydrophobic, which reduces the cleaning effect of subsequent wet chemical cleaning. In existing processes, ozone-deionized water solution and deionized water are usually used for oxidation before wet chemical cleaning. The strong oxidizing properties of ozone-deionized water solution deactivate the organic matter on the wafer surface, thereby making the wafer surface hydrophilic, which is beneficial for subsequent wet chemical cleaning.

[0038] In this embodiment, both ozone-deionized water and deionized water are sprayed onto the wafer surface through nozzles within the cleaning chamber. Haze is a light scattering phenomenon caused by the irregularity of the microscopic surface profile and can characterize the micro-roughness of the wafer surface. The greater the difference in micro-roughness between different regions of the wafer surface, the more obvious the markings on the haze map.

[0039] The technical problem this application aims to solve is to improve the structure of the nozzle fixture and the corresponding cleaning method in the post-CMP cleaning process of wafers in order to enhance the uniformity of the micro-roughness of the wafer surface.

[0040] See Figure 1 As shown in Figure 7, this application provides a nozzle firmware for post-CMP cleaning of wafers.

[0041] refer to Figure 1 The nozzle fastener includes a body 10, a connector 101, and a linear transmission conduit 102. Figure 1 (Not shown) and liquid outlet 103.

[0042] In one embodiment, the nozzle firmware is configured as a single unit.

[0043] In another embodiment, the nozzle fastener is assembled. A connecting portion 101 is provided on one surface of the body 10 for connecting with a support structure inside the cleaning chamber of the cleaning device to fix the position of the nozzle fastener. A liquid outlet portion 103 is provided on the other surface of the body 10. Figure 1 The dashed arrows indicate the direction of cleaning fluid flow inside the body 10. The straight transmission pipeline 102 runs through the inside of the body 10, as shown in the following figures.

[0044] along Figure 1 The cross-sectional view of body 10 can be obtained from the section indicated by the dashed line L in the figure. See [link / reference]. Figure 2 One end of the linear transmission pipeline 102 (lower left end in the figure) is the inlet, connected to the external liquid supply device, and the other end (lower right end in the figure) is connected to the outlet 103. That is, the linear transmission pipeline 102 is used to transmit the cleaning fluid supplied by the external liquid supply device to the outlet 103. The linear transmission pipeline 102 enables a linear supply of cleaning fluid from the external liquid supply device to the outlet 103. With the total flow rate of the cleaning fluid supplied by the external liquid supply device remaining constant, compared to the right-angled transmission pipeline in the existing nozzle structure, the linear transmission pipeline 102 between the external liquid supply device and the outlet 103 in this application enables a linear liquid supply, reduces the resistance of the cleaning fluid in the linear transmission pipeline 102, and increases the flow rate of the cleaning fluid in the linear transmission pipeline 102.

[0045] The nozzle firmware for post-CMP cleaning of wafers provided in this application includes a liquid outlet section 103 comprising a liquid outlet pipe 1031 and a nozzle 1032. It should be noted that one end of the liquid outlet pipe 1031 is connected to a straight transmission line 102, and the other end of the liquid outlet pipe 1031 is fixedly connected to the nozzle 1032. The liquid outlet pipe 1031 of this application has at least a certain length that is a variable diameter pipe.

[0046] refer to Figure 3a In one embodiment, the inner wall of the outlet pipe 1031 gradually narrows from the connection point A with the straight transmission pipe 102 to the connection point B with the nozzle 1032, and the entire length of the outlet pipe 1031 is a variable diameter pipe along the direction of the cleaning fluid flow. (Reference) Figure 3b In another embodiment, along the direction of the cleaning fluid outflow, the inner diameter of the outlet pipe 1031 begins to narrow from a certain distance from the connection point C with the straight transmission pipeline 102, that is, part of the outlet pipe 1031 is a variable diameter pipe.

[0047] The cross-section of one end of the liquid outlet pipe 1031 is a centrally symmetric figure, that is, the cross-section at the connection between the liquid outlet pipe 1031 and the straight transmission pipe 102 is a centrally symmetric figure. The cross-section of the other end of the liquid outlet pipe 1031, that is, the end connected to the nozzle, is an axisymmetric figure formed by symmetrical compression of the centrally symmetric figure in at least one direction.

[0048] In one embodiment, the inner wall cross-section of the pipe at the connection between the outlet pipe 1031 and the straight transmission pipe 102 is circular, while the inner wall cross-section of the pipe at the connection between the outlet pipe 1031 and the nozzle 1032 is elliptical. The specific method of shrinking from a circular pipe to an elliptical pipe is as follows: keeping the center position unchanged, starting from the side of the circular cross-section towards the nozzle 1032, using any diameter of the circular cross-section as the shrinkage centerline, the circular cross-section is divided into two semicircles. The inner diameter of the outlet pipe 1031 is gradually shrunk symmetrically towards the shrinkage centerline along the two arcs of the semicircles until the shrinkage at the connection between the outlet pipe 1031 and the nozzle 1032 ends. At this point, the inner wall of the pipe at the connection between the outlet pipe 1031 and the nozzle 1032 forms an elliptical cross-section with a major axis equal to the diameter of the circular cross-section. In addition to symmetrical shrinkage along the shrinkage centerline, to increase the pressure of the cleaning fluid, the length of the shrinkage centerline can also be shortened symmetrically around the centerline starting from the side of the circular cross-section towards the nozzle 1032, ultimately resulting in the first elliptical cross-section. In one specific embodiment, the major axis of the first elliptical cross section is smaller than the diameter of the circular cross section, and is at least half the diameter of the circular cross section.

[0049] In another embodiment, the cross-section of the inner wall of the outlet pipe 1031 along the direction of the cleaning fluid outflow can also be achieved by compressing a square into a rectangle or other axisymmetric shapes symmetrically along the direction of the cleaning fluid outflow.

[0050] The outlet pipe 1031 of this application has a variable diameter structure for at least a certain length. Along the flow direction of the cleaning fluid in the outlet pipe 1031, the cross-section of the inner wall of the outlet pipe 1031 gradually shrinks from a circle to an ellipse. The major axis of the elliptical cross-section at the end of the shrinkage is at least half the diameter of the circular cross-section at the beginning of the shrinkage. When the cleaning fluid enters the outlet pipe 1031 from the external supply device through the straight transmission pipeline 102, due to the variable diameter structure inside the outlet pipe 1031, the cross-section of the outlet pipe 1031 gradually shrinks from a circle to an ellipse. The cross-sectional area gradually decreases, the flow of the cleaning fluid is gradually constrained, the pressure gradually increases, and thus further increases the flow velocity of the cleaning fluid in the outlet pipe 1031.

[0051] refer to Figure 4 In one embodiment, the cross-section at the connection between the liquid outlet pipe 1031 and the linear transmission pipe 102 is circular, and the diameter L1 of the circular cross-section is 6 mm. The cross-section at the connection between the liquid outlet pipe 1031 and the nozzle 1032 is elliptical, referred to herein as the first elliptical cross-section, with a major axis L2 of 3 mm and a minor axis L3 of 2 mm.

[0052] The nozzle 1032 provided in this application is fixedly connected to the liquid outlet pipe 1031. The cross-section of the nozzle 1032 is a second elliptical cross-section, and the minor axis of the second elliptical cross-section is at least half of the minor axis of the first elliptical cross-section of the liquid outlet pipe 1031.

[0053] The nozzle 1032 provided in this application is a flat elliptical nozzle. The major axis of the second elliptical cross-section of the nozzle 1032 and the major axis of the first elliptical cross-section of the outlet pipe 1031 form a certain angle in the vertical plane, that is, the major axes of the first and second elliptical cross-sections do not overlap, which can increase the pressure of the cleaning fluid entering the nozzle 1032. In order to make the pressure of the cleaning fluid entering the nozzle 1032 even greater, the nozzle 1032 and the outlet pipe 1031 are vertically fixedly connected in the vertical plane, that is, the major axis of the second elliptical cross-section of the nozzle 1032 and the major axis of the first elliptical cross-section of the outlet pipe 1031 are perpendicular to each other, further increasing the pressure of the cleaning fluid entering the nozzle 1032.

[0054] refer to Figure 5 In one embodiment, the major axis of the ellipse of the nozzle 1032 cross-section is the same as the minor axis L3 of the ellipse of the outlet pipe 1031, while the minor axis L4 of the ellipse of the nozzle 1032 cross-section is 1 mm.

[0055] In one embodiment, when using the nozzle firmware provided in this application to clean a wafer, it is necessary to ensure that the nozzle 1032 is parallel to the wafer surface in a vertical plane to maximize the contact area of ​​the cleaning fluid ejected from the nozzle 1032 on the wafer surface. Simultaneously, it is necessary to ensure that the second elliptical cross-section of the nozzle 1032 is perpendicular to the first elliptical cross-section of the outlet pipe 1031 to maximize the pressure of the cleaning fluid ejected from the nozzle 1032. Therefore, the major axis of the first elliptical cross-section at the point where the outlet pipe 1031 contracts needs to be perpendicular to the horizontal line.

[0056] It should also be noted that the shape of the outlet pipe 1031 in this application is not limited; it can be a hexagonal structure or a cylindrical structure. Only the inner wall of the outlet pipe 1031 has a variable diameter structure. Figure 4 and Figure 5 The hexagonal cross section is the cross section of the outer protective pipe of the liquid outlet pipe 1031.

[0057] In one embodiment, the connecting part 101 can be a universal ball structure, hinged to the support structure inside the cavity, enabling three-dimensional position adjustment. Based on the universal ball, further adjustment of the relative position of the nozzle fixture and the wafer plane, and the relative angle between the nozzle 1032 and the wafer plane, facilitates a larger area coverage of the wafer surface by the cleaning fluid sprayed by the nozzle 1032.

[0058] The nozzle firmware provided in this application uses a straight transmission pipeline 102 for transmitting the cleaning fluid, achieving linear fluid supply. While maintaining a constant total flow rate of cleaning fluid supplied by an external fluid supply device, this reduces the resistance of the cleaning fluid within the transmission pipeline and increases its velocity within the straight transmission pipeline 102. Furthermore, the outlet pipe 1031 of the outlet section 103 has a variable diameter structure, with its inner wall gradually narrowing from a large-diameter cylinder to a small-diameter ellipse, further increasing the pressure of the cleaning fluid as it approaches the nozzle 1032. The nozzle 1032 provided in this application also has an elliptical cross-section, and the major axis of the second elliptical cross-section of the nozzle 1032 is perpendicular to the major axis of the first elliptical cross-section of the outlet pipe 1031, further increasing the pressure of the cleaning fluid entering the nozzle 1032. Compared to existing elliptical cross-section nozzles, the nozzle in this application further compresses the minor axis distance, achieving a large-amplitude fan-shaped spray and increasing the surface area of ​​the cleaning fluid ejected from the nozzle.

[0059] The cleaning fluid in this embodiment can be ozone-deionized water or deionized water. The method for switching the type of cleaning fluid supplied by the external liquid supply device is not specifically limited here.

[0060] refer to Figure 6a and Figure 6b , Figure 6a This is a top view of the spraying effect of an existing nozzle structure on a wafer surface. The cleaning fluid is sprayed in a small fan shape at approximately 60 degrees on the wafer surface. The contact line between the cleaning fluid and the wafer surface is... Figure 6a The middle dashed line. Figure 6b This is a top view of the spraying effect of the nozzle firmware according to an embodiment of this application on the wafer surface. Compared with the existing nozzle structure, the contact line between the cleaning fluid and the wafer surface is as follows: Figure 6b As shown by the dashed line, the nozzle firmware of this application embodiment can achieve a large fan-shaped liquid spray of 100-120 degrees on the wafer surface.

[0061] In this embodiment of the nozzle firmware, the linear transmission pipeline 102, the outlet pipe 1031, and the nozzle 1032 have all been optimized. With the flow rate of the cleaning fluid supplied from the inlet remaining constant, the linear transmission pipeline 102 reduces the resistance of the cleaning fluid within the pipeline, resulting in a faster flow rate and increased pressure of the cleaning fluid within the nozzle firmware. When the cleaning fluid passes through the outlet pipe 1031 of the outlet section 103, the outlet pipe 1031 has a variable diameter structure, with its cross-section gradually decreasing and its shape shrinking from circular to elliptical, increasing the pressure of the cleaning fluid inside the outlet pipe 1031. Then, based on the flat elliptical nozzle 1032 perpendicular to the elliptical cross-section of the outlet pipe 1031, the cleaning fluid is sprayed onto the wafer surface, increasing the amplitude of the cleaning fluid sprayed from the nozzle 1032, improving the uniformity of the micro-roughness of various areas on the wafer surface, and further enhancing the flatness of the wafer surface.

[0062] In one specific embodiment, the straight transmission pipeline 102 and the liquid outlet pipe 1031 can both be located inside the main body 10.

[0063] refer to Figure 7a and Figure 7b Several sample wafers were cleaned by CMP using existing nozzle structures and nozzle firmware of the present application embodiment, and then the haze of the sample wafers was detected based on a patternless inspection system.

[0064] Figure 7a The process test results after cleaning the sample wafer using the existing nozzle structure show obvious dumbbell-shaped marks in the haze map of the sample wafer, indicating that the micro-roughness of different areas of the sample wafer varies greatly and the flatness of the wafer surface is poor. Figure 7b The process test results of the sample wafer after cleaning with the nozzle firmware of this application embodiment show that there are no obvious marks on the surface of the sample wafer. That is, using the nozzle firmware of this application embodiment to clean the wafer surface reduces the difference in micro-roughness in different areas of the wafer surface and improves the overall flatness of the wafer surface.

[0065] This application also provides a cleaning method based on the above-mentioned nozzle firmware, the specific steps of which are as follows:

[0066] S801, The processing time of the cleaning fluid is set based on the machine tool;

[0067] S802. Based on the processing time, the cleaning fluid is sprayed through the nozzle firmware to clean the wafer surface.

[0068] In the specific implementation of the cleaning method described in this application, the treatment time of ozone deionized water or deionized water solution can be set based on the machine-side recipe to achieve the best cleaning effect on the wafer surface.

[0069] In the description of this application, it should be understood that the terms "center," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," and "outer," etc., indicating orientation or positional relationships based on the orientation or positional relationships shown in the accompanying drawings, are used only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application. The terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this application, unless otherwise stated, "a plurality of" means two or more.

[0070] In the description of this application, it should be noted that, unless otherwise expressly specified and limited, the terms "installation," "connection," and "joining" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection between two components. Those skilled in the art can understand the specific meaning of the above terms in this application based on the specific circumstances.

[0071] In the description of this specification, specific features, structures, materials, or characteristics may be combined in any suitable manner in one or more embodiments or examples.

[0072] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of this application, and are not intended to limit them. Although this application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of this application.

Claims

1. A nozzle firmware for post-CMP cleaning of wafers, characterized in that, include: A connecting part is used to connect with the support structure inside the cleaning chamber to fix the nozzle fastener; The liquid outlet section includes a liquid outlet pipe and a nozzle connected to the liquid outlet pipe. The liquid outlet pipe has at least a certain length of a variable diameter pipe. The cross-section of one end of the variable diameter pipe is a centrally symmetric figure, and the cross-section of the other end of the variable diameter pipe connected to the nozzle is an axisymmetric figure formed by symmetrical compression of the centrally symmetric figure in at least one direction.

2. The showerhead for post-CMP cleaning of a wafer of claim 1, wherein, The cross-section at one end of the reducing pipe is circular, and the cross-section at the other end of the reducing pipe is an elliptical first elliptical cross-section.

3. The showerhead for post-CMP cleaning of a wafer of claim 2, wherein, The first elliptical cross section is formed by symmetrical compression of the circular cross section in two mutually perpendicular directions, and the major axis of the first elliptical cross section is smaller than the diameter of the circular cross section.

4. The showerhead for post-CMP cleaning of a wafer of claim 3, wherein, The major axis of the first elliptical cross section is at least half the diameter of the circular cross section.

5. The nozzle firmware for post-CMP cleaning of wafers according to claim 1, characterized in that, The entire outlet pipe is a variable diameter pipe.

6. The nozzle firmware for post-CMP cleaning of wafers according to claim 1, characterized in that, The reducing pipe gradually narrows in the direction of the cleaning fluid outflow.

7. The nozzle firmware for post-CMP cleaning of wafers according to claim 4, characterized in that, The nozzle cross-section is an elliptical second elliptical cross-section, and the major axis of the second elliptical cross-section and the major axis of the first elliptical cross-section have a non-zero preset angle in the vertical plane.

8. The nozzle firmware for post-CMP cleaning of wafers according to claim 7, characterized in that, The preset angle is 90 degrees.

9. The nozzle firmware for post-CMP cleaning of wafers according to claim 7, characterized in that, The minor axis of the second elliptical cross section is at least half of the minor axis of the first elliptical cross section.

10. The nozzle firmware for post-CMP cleaning of wafers according to claim 1, characterized in that, The nozzle fixture also includes a linear transmission pipeline, one end of which is connected to an external liquid supply device and the other end of which is connected to the liquid outlet, for transmitting the cleaning fluid from the external liquid supply device to the liquid outlet.

11. The nozzle firmware for post-CMP cleaning of wafers according to claim 1, characterized in that, The connecting part is hinged to the support structure inside the cleaning chamber.

12. A cleaning method, implemented based on the nozzle firmware for post-CPM cleaning of wafers as described in any one of claims 1-11, characterized in that, include: The processing time of the cleaning fluid is set based on the machine end; Based on the processing time, the cleaning fluid is sprayed through the nozzle firmware used for post-CMP cleaning of the wafer to clean the wafer surface.

13. The cleaning method according to claim 12, characterized in that, The cleaning solution is ozone-deionized water or deionized water.

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