Silicon wafer cleaning structure, semiconductor cleaning apparatus, and cleaning method

Abstract

This invention discloses a silicon wafer cleaning structure, a semiconductor cleaning apparatus, and a cleaning method, relating to the field of semiconductor cleaning and processing technology. The silicon wafer cleaning structure achieves initial static equilibrium through two discrete support points provided by a first support component. The second support component, with its high and low side supports, provides space for the silicon wafer's slight displacement under subsequent flow field action. During the cleaning process, when the resultant force of the ultrasonic radiation pressure in the vertical direction briefly exceeds the silicon wafer's weight, the wafer overcomes its own weight and instantaneously separates from the two first supports, exposing the previously shielded bottom support area to the cleaning fluid, eliminating cleaning blind spots. Simultaneously, the high side support, through its higher spatial position and preset tilt angle, uses lateral force and downward positive pressure to lock the silicon wafer's upward or lateral instability, preventing collisions or edge chipping due to disordered drift, thus improving the cleaning effect and ensuring the quality of the silicon wafer.

Description

Technical Field

[0001] This invention relates to the field of semiconductor cleaning and processing technology, specifically to a silicon wafer cleaning structure, a semiconductor cleaning apparatus, and a cleaning method. Background Technology

[0002] Silicon wafer cleaning is an indispensable and fundamental process in semiconductor manufacturing. Its purpose is to remove particulate contaminants, organic residues, and metal ions from the silicon wafer surface before critical processes such as photolithography, etching, and deposition, ensuring consistency and device yield in subsequent processes. In existing technologies, silicon wafer cleaning typically relies on wet cleaning or ultrasonic cleaning equipment. This usually involves a support structure within the cleaning tank, using multiple fixed or semi-fixed placement baskets to position the silicon wafer and maintain a relatively stable posture in the cleaning solution. During the cleaning process, the surface of the silicon wafer is decontaminated through the flow of the cleaning solution, chemical reactions, and ultrasonic cavitation effects.

[0003] Specifically, this can be understood as a fixed or semi-fixed placement basket mechanically constraining the silicon wafer through multiple support points. This type of structure inevitably creates cleaning blind spots at the contact points between the silicon wafer and the support points, making it difficult for the cleaning fluid to fully contact these areas. This results in particle or metal ion residue, especially noticeable at the edges of the silicon wafer. For those skilled in the art, an easily conceivable improvement is to reduce the number of support points (e.g., using a U-shaped groove structure) or adopt a suspended structure (e.g., immersing the silicon wafer in a small container) to expose as much of the silicon wafer as possible to the cleaning fluid. However, under ultrasonic action, the silicon wafer is prone to uncontrolled vibration or displacement. This is especially true for large, thin silicon wafers, which are more susceptible to mechanical damage such as cracking or edge chipping due to localized stress concentration, collisions, or contact with the rigid structure of the equipment.

[0004] In summary, when existing cleaning equipment is used for silicon wafer cleaning, it is difficult to ensure the cleaning effect of the silicon wafer while avoiding the risk of damage to the silicon wafer. Summary of the Invention

[0005] The purpose of this invention is to provide a silicon wafer cleaning structure, a semiconductor cleaning device, and a cleaning method, which solves the technical problem that it is difficult to simultaneously ensure the cleaning effect and quality of silicon wafers when the existing cleaning equipment is applied to silicon wafer cleaning.

[0006] To achieve this objective, the present invention adopts the following technical solution: A silicon wafer cleaning structure includes a cleaning rack, on which a first support component and a second support component are provided. Along the direction of gravity, the second support component is located above the first support component; the first support component and the second support component each abut against the silicon wafer. The first support assembly includes at least two spaced-apart first supports for supporting the silicon wafer; the second support assembly includes a low side support on one side of the silicon wafer and a high side support on the other side of the silicon wafer; the low side support is pre-installed on the cleaning rack and cooperates with the first support assembly to form a cleaning mounting position for positioning the silicon wafer; the high side support is used to abut against the silicon wafer from the other side at a preset tilt angle after the silicon wafer is positioned in the cleaning mounting position; the high side support is higher than the low side support.

[0007] Optionally, the cleaning rack includes two cleaning plates arranged opposite each other, with the first support assembly and the second support assembly disposed between the two cleaning plates; The cleaning plate is provided with a plurality of horizontal mounting positions spaced apart in the horizontal direction. The first support body is movably mounted on one of the horizontal mounting positions, and the horizontal mounting positions corresponding to each first support body are different. The cleaning plate has multiple spaced-apart low mounting positions on one side, and the low mounting support can be movably installed on one of the low mounting positions; the cleaning plate has multiple spaced-apart high mounting positions along the inclined direction on the other side, and the high mounting support can be movably installed on one of the high mounting positions; the area between the low mounting positions and the high mounting positions is the cleaning area.

[0008] Optionally, the tilt direction is set such that the height of the side-mounted mounting position that is away from the cleaning position in the horizontal direction is greater than the height of the side-mounted mounting position that is close to the cleaning position in the horizontal direction.

[0009] Optionally, an inclined groove is provided on the other side of the cleaning plate corresponding to the positions of the plurality of side-height mounting positions. The end of the side-height support is detachably connected to the inclined groove so that the side-height support can be positioned on one of the side-height mounting positions along the inclined groove. The distance between the inclined groove and the horizontal mounting position decreases in the direction of gravity along the direction closer to the cleaning position.

[0010] Optionally, an inclined groove is provided on one side of the cleaning plate corresponding to the positions of the plurality of side low mounting positions, and the end of the side low support is detachably connected to the inclined groove so that the side low support can be positioned on one of the side low mounting positions along the inclined groove; the distance between the inclined groove and the horizontal mounting position in the direction of gravity decreases along the direction close to the cleaning position.

[0011] Optionally, the tilt angle of the inclined low groove relative to the horizontal direction is less than or equal to the tilt angle of the inclined high groove relative to the horizontal direction.

[0012] Optionally, the first support, the lower side support, and the higher side support each include a support body, and each support body passes through the cleaning space of the cleaning rack in parallel to each other to form a cleaning mounting position for positioning silicon wafers in the cleaning space; the end of the support body is detachably provided with a support locking part, and the support body is detachably mounted on the cleaning rack through the support locking part.

[0013] Optionally, the support body is provided with a plurality of cleaning and mounting grooves at intervals along its extension direction. Each cleaning and mounting groove includes a bottom wall portion and a side wall portion that is inclined relative to the bottom wall portion. The bottom wall portion is disposed between two side wall portions, and the distance between the two side wall portions increases in the direction away from the bottom wall portion, so that the cleaning and mounting groove is open. The width of the bottom wall portion is greater than the width of the silicon wafer.

[0014] Optionally, the support body is provided with a plurality of cleaning and mounting grooves at intervals along its extension direction. Each cleaning and mounting groove includes two groove sidewalls that are connected to each other. The distance between the two groove sidewalls increases in the direction away from the axis of the support body, so that the cleaning and mounting groove is open.

[0015] Optionally, the sidewall of the tank is frustum-shaped, and the two sidewalls of the cleaning installation tank are connected at a first end with a smaller radius; between two adjacent cleaning installation tanks, one sidewall of the tank and the other sidewall of the tank are spaced apart at a second end with a larger radius, and the two second ends are spaced apart by a transition portion.

[0016] A semiconductor cleaning apparatus includes an ultrasonic cleaning tank and a silicon wafer cleaning structure as described above, wherein the silicon wafer cleaning structure is movably placed in the ultrasonic cleaning tank.

[0017] A cleaning method, employing the silicon wafer cleaning structure described above, includes: The first support assembly and the side support body are pre-set according to the size of the silicon wafer to form a cleaning installation position; Place the silicon wafer into the cleaning mounting position; The side support is placed against the silicon wafer at a preset tilt angle; Silicon wafers are cleaned using ultrasonic cleaning.

[0018] Compared with the prior art, the present invention has the following beneficial effects: The silicon wafer cleaning structure provided by this invention uses two discrete support points provided by the first support component to counteract the weight of the silicon wafer, forming an initial static balance. The higher side support is positioned higher than the lower side support, creating an asymmetrical installation layout, which reserves space for the silicon wafer's slight displacement under the subsequent flow field. Specifically, during the cleaning process, when the resultant force of the buoyancy, scouring force, or ultrasonic radiation pressure of the cleaning fluid in the vertical direction briefly exceeds the weight of the silicon wafer, the silicon wafer will overcome its own weight and instantaneously separate from the two first supports, completely exposing the previously obscured bottom support area to the cleaning fluid, thereby eliminating cleaning blind spots. At the same time, the high-profile support, through its higher spatial position and preset tilt angle, uses lateral force and downward positive pressure to lock the silicon wafer's freedom of upward or lateral instability. This ensures that when the silicon wafer experiences a "brief separation," its displacement is limited to a controllable space, preventing the silicon wafer from colliding or chipping due to disordered drift. Ultimately, in the dynamic "contact-separation-rebalancing" cycle, the cleaning effect on the silicon wafer is improved and the quality of the silicon wafer is guaranteed. Attached Figure Description

[0019] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0020] The structures, proportions, sizes, etc., shown in the accompanying drawings of this specification are only for the purpose of assisting those skilled in the art in understanding and reading the content disclosed in the specification, and are not intended to limit the conditions under which the present invention can be implemented. Therefore, they have no substantial technical significance. Any modifications to the structure, changes in the proportions, or adjustments to the size, without affecting the effects and objectives that the present invention can produce, should still fall within the scope of the technical content disclosed in the present invention.

[0021] Figure 1 This is a schematic diagram of the overall structure of the semiconductor cleaning apparatus provided in an embodiment of the present invention; Figure 2 This is a schematic diagram of the overall structure of the silicon wafer cleaning structure provided in an embodiment of the present invention; Figure 3 This is a front view schematic diagram of the silicon wafer cleaning structure provided in an embodiment of the present invention; Figure 4 This is a side view of the silicon wafer cleaning structure provided in an embodiment of the present invention; Figure 5 This is a top view of the silicon wafer cleaning structure provided in an embodiment of the present invention; Figure 6This is a partial structural diagram of the silicon wafer cleaning structure provided in an embodiment of the present invention; Figure 7 This is a schematic diagram of the first state structure of a silicon wafer cleaning structure provided in an embodiment of the present invention; Figure 8 This is a schematic diagram of the second state structure of another silicon wafer cleaning structure provided in an embodiment of the present invention; Figure 9 This is a schematic diagram of the third state structure of a silicon wafer cleaning structure provided in an embodiment of the present invention; Figure 10 This is a schematic diagram of the fourth state structure of a silicon wafer cleaning structure provided in an embodiment of the present invention; Figure 11 This is a schematic diagram of the fifth state structure of another silicon wafer cleaning structure provided in an embodiment of the present invention; Illustration descriptions: 001, Silicon wafer; 002, Cleaning space; 003, Cleaning mounting position; 100. Cleaning rack; 110. Cleaning plate; 111. First horizontal trough; 112. Second horizontal trough; 113. Inclined low trough; 114. Inclined high trough; 120. Horizontal mounting position; 130. Side low mounting position; 140. Side high mounting position; 150. Cleaning position; 200, First support assembly; 210, First support body; 300, Second support assembly; 310, Lower side support body; 320, Higher side support body; 410, Support body; 411, Cleaning installation tank; 4111, Tank bottom wall; 4112, Tank side wall; 412, Transition section; 420, Support locking section; 500, Ultrasonic cleaning tank. Detailed Implementation

[0022] To make the objectives, features, and advantages of this invention more apparent and understandable, the technical solutions of the embodiments of this invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the embodiments described below are only some embodiments of this invention, and not all embodiments. Based on the embodiments of this invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this invention.

[0023] In the description of this invention, it should be understood that the terms "upper," "lower," "top," "bottom," "inner," and "outer," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing the invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of the invention. It should be noted that when a component is considered to be "connected" to another component, it can be directly connected to the other component or there may be a component positioned centrally in the connection.

[0024] The technical solution of the present invention will be further described below with reference to the accompanying drawings and specific embodiments.

[0025] Example 1: This solution is primarily applicable to wet cleaning and ultrasonic cleaning of silicon wafers in semiconductor manufacturing processes, especially suitable for cleaning large, thin silicon wafers under conditions requiring both high cleanliness and high safety. Addressing the issues of existing cleaning structures where silicon wafer support points obscure the cleaning area, easily creating cleaning blind spots, and the potential for disordered displacement, collisions, or edge chipping after reducing support constraints, this application improves the silicon wafer support method and stress state. This allows the silicon wafer to achieve a stable static equilibrium in its initial state and allows for controlled micro-displacement during cleaning. By utilizing the transient effects of the cleaning fluid flow field and ultrasonic pressure, the silicon wafer can briefly detach from the bottom support, exposing the previously obscured contact area and eliminating cleaning blind spots. Thus, without increasing structural complexity, it simultaneously improves the overall cleaning uniformity and safety of the silicon wafer, effectively improving cleaning results and reducing the risk of silicon wafer damage.

[0026] like Figure 2 and Figure 3 As shown, the silicon wafer cleaning structure in this embodiment includes a cleaning rack 100, on which a first support component 200 and a second support component 300 are provided. Along the direction of gravity, the second support component 300 is located above the first support component 200; the first support component 200 and the second support component 300 each abut against the silicon wafer 001. Figure 3 As shown, the first support assembly 200 includes at least two spaced first supports 210 for supporting the silicon wafer 001; the second support assembly 300 includes a side low support 310 located on one side of the silicon wafer 001 and a side high support 320 located on the other side of the silicon wafer 001.

[0027] Understandably, in this embodiment, the silicon wafer cleaning structure, by setting a first support component 200 on the cleaning rack 100 and a second support component 300 above it, creates a spatial constraint relationship of "lower support and upper limit" for the silicon wafer 001 in the direction of gravity. The first support component 200 undertakes the main function of gravity support, while the second support component 300 does not directly press against the silicon wafer 001, but rather abuts against the silicon wafer 001 in a lateral and inclined manner. This avoids problems such as the inability of the silicon wafer 001 to move due to symmetrical clamping and stress concentration caused by multi-point hard contact, ensuring that the silicon wafer 001 can be detached from the first support component 200 to a limited extent.

[0028] Specifically, the first support assembly 200 includes at least two spaced-apart first support bodies 210 for supporting the silicon wafer 001. Since the number of first support bodies 210 is limited to "at least two" and they are spaced apart, it ensures stable support for the silicon wafer 001 under gravity, preventing it from sinking or tipping over. Furthermore, compared to a grooved structure, it significantly reduces the contact area and number of contact points at the bottom of the silicon wafer 001, thereby significantly reducing cleaning blind spots caused by bottom support. This allows cleaning fluid and ultrasonic waves to more easily cover the bottom and edge areas of the silicon wafer 001, improving overall cleaning uniformity. In this embodiment, there are two first support bodies 210. In other optional embodiments, when the number of first support bodies 210 is three, four, or other numbers, the first support bodies 210 are spaced apart along the lower arc edge of the silicon wafer 001, thus providing stable support for the silicon wafer 001.

[0029] like Figure 2 , Figure 7 and Figure 8 As shown, the lower side support 310 is pre-installed on the cleaning rack 100 and cooperates with the first support assembly 200 to form a cleaning mounting position 003 for positioning the silicon wafer 001; the higher side support 320 is used to abut against the silicon wafer 001 from the other side at a preset tilt angle after the silicon wafer 001 is positioned in the cleaning mounting position 003; the higher side support 320 is higher than the lower side support 310.

[0030] Specifically, the second support assembly 300 consists of a lower side support 310 on one side of the silicon wafer 001 and a higher side support 320 on the other side. The lower side support 310 is pre-installed on the cleaning rack 100 and cooperates with the first support assembly 200 to form a cleaning mounting position 003, allowing the silicon wafer 001 to naturally settle into a stable initial positioning state upon placement. The higher side support 320 is located on the other side of the silicon wafer 001 and, after the silicon wafer 001 is positioned in the cleaning mounting position 003, abuts against it at a preset tilt angle, with its height exceeding that of the lower side support 310. By configuring the higher side support 320, the silicon wafer 001 can temporarily detach from the support of the first support assembly 200 during subsequent cleaning processes, while ensuring that the silicon wafer 001 does not excessively displace, remaining confined by the second support assembly 300. After temporarily detaching from the support of the first support assembly 200, it can then return to the first support assembly 200.

[0031] Further analysis reveals that if a scheme is adopted in which two symmetrically arranged pillars clamp the silicon wafer 001 from both sides, the symmetrical clamping forces make it easier for the silicon wafer 001 to undergo partial deformation, making it difficult for the silicon wafer 001 to detach from the support of the first support component 200. If the second support component 300 is not provided, the position of the silicon wafer 001 cannot be restricted after it detaches from the support of the first support component 200, making it difficult to ensure that the silicon wafer 001 returns to the first support component 200. In the silicon wafer cleaning structure of this embodiment, since the high-side support 320 abuts against the silicon wafer 001 at an angle and its height differs from that of the low-side support 310, there is no symmetrical clamping force. Therefore, this prevents the silicon wafer 001 from being unable to detach from the support of the first support assembly 200, allowing the silicon wafer 001 to temporarily separate from the first support assembly 200 under the buoyancy, scouring force, or ultrasonic radiation pressure of the cleaning fluid. Furthermore, the high-side support 320 abuts against the silicon wafer 001 at an angle, meaning that... Figure 9 or Figure 11 As shown, after the silicon wafer 001 is initially positioned in the cleaning mounting position 003, the side support 320 approaches the cleaning mounting position 003 in an inclined direction until the side support 320 contacts the silicon wafer 001. At this time, the force relationship between the side support 320 and the silicon wafer 001 is that the side support 320 applies a force to the silicon wafer 001 in an inclined direction. Part of this force acts on the silicon wafer 001 in the form of friction, preventing the silicon wafer 001 from detaching significantly from the cleaning mounting position 003. When the silicon wafer 001 is subjected to the buoyancy, scouring force, or ultrasonic radiation pressure of the cleaning fluid, it can be displaced along the surface of the side support 320, thereby rising briefly relative to the first support assembly 200. This allows the silicon wafer 001 to achieve a "contact-separation-rebalancing" cycle within a controllable range.

[0032] In summary, the two discrete support points provided by the first support component 200 counteract the weight of the silicon wafer 001, forming an initial static balance. The higher side support 320 is positioned higher than the lower side support 310, creating an asymmetrical installation layout. This provides space for the slight displacement of the silicon wafer 001 under the subsequent flow field. Specifically, during the cleaning process, when the resultant force of the buoyancy, scouring force, or ultrasonic radiation pressure of the cleaning fluid in the vertical direction briefly exceeds the weight of the silicon wafer 001, the silicon wafer 001 will overcome its own weight and momentarily separate from the two first supports 210, completely exposing the previously obscured bottom support point area to the cleaning fluid, thereby eliminating the cleaning blind spot. At the same time, the side support 320, through its higher spatial position and preset tilt angle, uses lateral force and downward positive pressure to lock the degree of freedom of silicon wafer 001 in the upward or lateral instability, ensuring that when silicon wafer 001 experiences "brief detachment", its displacement is restricted to a controllable space, preventing silicon wafer 001 from colliding or chipping due to disordered drift. Ultimately, in the dynamic "contact-separation-rebalancing" cycle, the cleaning effect of silicon wafer 001 is improved and the quality of silicon wafer 001 is guaranteed.

[0033] Furthermore, the cleaning rack 100 includes two cleaning plates 110 arranged opposite to each other, with a first support assembly 200 and a second support assembly 300 disposed between the two cleaning plates 110; the two cleaning plates 110 can be connected by a connecting column, which is welded to the cleaning plates 110. One side of the cleaning plate 110 has multiple spaced-apart low-mounting positions 130, and a low-mounting support 310 is movably mounted on one of the low-mounting positions 130; the other side of the cleaning plate 110 has multiple spaced-apart high-mounting positions 140 arranged along an inclined direction, and a high-mounting support 320 is movably mounted on one of the high-mounting positions 140; the area between the low-mounting positions 130 and the high-mounting positions 140 is the cleaning position 150.

[0034] like Figure 7 and Figure 8 As shown, the cleaning plate 110 is provided with a plurality of horizontal mounting positions 120 spaced apart in the horizontal direction. The first support 210 is movably mounted on a horizontal mounting position 120, and the horizontal mounting positions 120 corresponding to each first support 210 are different. Taking the two first supports 210 in this embodiment as an example, a plurality of horizontal mounting positions 120 are provided on one side of the cleaning plate 110, and one first support 210 is installed in one of the plurality of horizontal mounting positions 120 on the other side of the cleaning plate 110. A plurality of horizontal mounting positions 120 are provided on the other side of the cleaning plate 110, and another first support 210 is installed in one of the plurality of horizontal mounting positions 120 on the other side of the cleaning plate 110. This allows the spacing between the two first supports 210 to be adjusted to match silicon wafers 001 of different sizes.

[0035] Similarly, such as Figures 7 to 11 As shown, the side-low support 310 can be installed corresponding to the side-low mounting position 130, thereby forming a cleaning position 150. After the silicon wafer 001 is placed in the cleaning position 150, the side-high support 320 can be moved along the multiple side-high mounting positions 140, so that the side-high support 320 approaches the cleaning mounting position 003 in the inclined direction until the side-high support 320 contacts the silicon wafer 001. It should be noted that in order for the side-high support 320 to approach the cleaning mounting position 003 in the inclined direction, the multiple side-high mounting positions 140 should be arranged continuously, such as a groove structure or a guide rail structure; while the arrangement of the horizontal mounting position 120 and the side-low mounting position 130 is not limited, and can be continuous or spaced out, such as multiple hole structures spaced out.

[0036] In this embodiment, such as Figure 9 and Figure 11 As shown, the tilting direction is such that the height of the side-mounted mounting position 140, which is farther away from the cleaning position 150 in the horizontal direction, is greater than the height of the side-mounted mounting position 140, which is closer to the cleaning position 150 in the horizontal direction. It can be understood that through this arrangement, the side-mounted mounting position 140 closer to the cleaning position 150 has a smaller distance from the horizontal mounting position 120 in the direction of gravity. That is, for smaller silicon wafers 001, the side-mounted mounting position 140 of the side-mounted support 320 is positioned closer to the horizontal mounting position 120. Thus, the mounting height of the side-mounted support 320 can be adjusted according to the size of the silicon wafer 001.

[0037] It is understandable that the above settings allow the side height support 320 to change synchronously with the center of the silicon wafer 001, making the side height support 320 level with the center of the silicon wafer 001, or making the side height support 320 lower than the center of the silicon wafer 001, so as to ensure that the silicon wafer 001 can temporarily detach from the first support component 200, thereby matching silicon wafers 001 of different sizes, and avoiding the side height support 320 being set on the upper side of the silicon wafer 001, which would restrict the silicon wafer 001.

[0038] Specifically, in this embodiment, an inclined groove 114 is provided on the other side of the cleaning plate 110 corresponding to the positions of multiple side-mounted positions 140. The end of the side-mounted support 320 is detachably connected to the inclined groove 114, so that the side-mounted support 320 can be positioned on one of the side-mounted positions 140 along the inclined groove 114. Along the direction close to the cleaning position 150, the distance between the inclined groove 114 and the horizontal mounting position 120 decreases in the direction of gravity. That is, in this embodiment, by providing an inclined groove 114 on the cleaning plate 110, the side-mounted support 320 can slide along the inclined groove 114 and be positioned on one of the side-mounted positions 140.

[0039] In this embodiment, an inclined groove 113 is formed on one side of the cleaning plate 110 corresponding to the positions of multiple side low mounting positions 130. The end of the side low support 310 is detachably connected to the inclined groove 113, so that the side low support 310 can be positioned on one of the side low mounting positions 130 along the inclined groove 113. Along the direction close to the cleaning position 150, the distance between the inclined groove 113 and the horizontal mounting position 120 decreases in the direction of gravity. As another optional embodiment, mounting holes can be formed on one side of the cleaning plate 110 corresponding to the positions of the multiple side low mounting positions 130, and the end of the side low support 310 is detachably connected to the mounting holes.

[0040] Based on the above embodiments, the tilt angle of the inclined low groove 113 relative to the horizontal direction is less than or equal to the tilt angle of the inclined high groove 114 relative to the horizontal direction. For example, the inclined low groove 113 is set with a tilt angle close to the horizontal direction, or with a tilt angle close to that of the inclined high groove 114. For example, if the inclined high groove 114 is tilted at 45° relative to the horizontal direction, the inclined low groove 113 is tilted at 40° relative to the horizontal direction. This ensures that the side high support 320 is set higher than the side low support 310.

[0041] As a supplementary explanation, a first horizontal groove 111 is provided on one side of the cleaning plate 110, and a second horizontal groove 112 is provided on the other side. The first horizontal groove 111 is provided with multiple horizontal mounting positions 120 on one side, and the second horizontal groove 112 is provided with multiple horizontal mounting positions 120 on the other side.

[0042] Furthermore, such as Figures 1 to 6 As shown, the first support body 210, the lower side support body 310 and the higher side support body 320 all include a support body 410. Each support body 410 passes through the cleaning space 002 of the cleaning rack 100 in parallel with each other to form a cleaning mounting position 003 for positioning the silicon wafer 001 in the cleaning space 002. The end of the support body 410 is detachably provided with a support locking part 420, and the support body 410 is detachably mounted on the cleaning rack 100 through the support locking part 420.

[0043] The support locking part 420 includes, but is not limited to, mounting bolts, mounting nuts, and other structures, so that the support body 410 can be detachably installed on the cleaning rack 100.

[0044] As an optional implementation, the support body 410 is provided with a plurality of cleaning mounting grooves 411 spaced apart along its extension direction. Each cleaning mounting groove 411 includes two adjacent groove sidewall portions 4112, the distance between the two groove sidewall portions 4112 increasing in the direction away from the axis of the support body 410, making the cleaning mounting groove 411 open. At this time, the silicon wafer 001 is essentially engaged with the groove sidewall portion 4112 by its edge, thus limiting the silicon wafer 001. This arrangement can reduce the force on the main surface and side surface of the silicon wafer 001 (the main surface refers to the plane with the largest area of ​​the silicon wafer 001, the side surface refers to the connecting surface between the two main surfaces of the silicon wafer 001, and the edge refers to the junction of the main surface and the side surface), which helps to reduce the cleaning dead corners of the silicon wafer 001, thereby improving the cleaning effect. Furthermore, this arrangement results in a smaller contact area, which helps the silicon wafer 001 to temporarily separate from the first support assembly 200.

[0045] As a supplementary explanation, the support body 410 can be directly formed by 3D printing. The stacking direction of the 3D printing of the support body 410 is parallel to the axis of the support body 410. As a result, the side wall portion 4112 of the groove is truncated cone-shaped. The side wall portion 4112 of the groove is formed by stacking multiple layers of plastic with gradually changing diameters. There is a diameter difference between the plastic layers to form a stepped surface. This stepped surface is used for the edge positioning of the silicon wafer 001. This ensures the initial static balance while preventing the silicon wafer 001 from being inserted obliquely into the cleaning installation groove 411, so as to effectively reduce the cleaning dead angle of the silicon wafer 001.

[0046] As another optional implementation, the support body 410 is provided with a plurality of cleaning mounting grooves 411 at intervals along its extension direction. Each cleaning mounting groove 411 includes a bottom wall portion 4111 and a side wall portion 4112 that is inclined relative to the bottom wall portion 4111. The bottom wall portion 4111 is disposed between the two side wall portions 4112. The distance between the two side wall portions 4112 increases in the direction away from the bottom wall portion 4111, so that the cleaning mounting groove 411 is open. The width of the bottom wall portion 4111 is greater than the width of the silicon wafer 001. At this time, the silicon wafer 001 is equivalent to its side surface engaging with the bottom wall portion 4111.

[0047] Furthermore, such as Figure 5 As shown, the sidewall portion 4112 of the cleaning mounting tank 411 is frustum-shaped. Two sidewall portions 4112 in the cleaning mounting tank 411 are connected at their first ends with a smaller radius. Between two adjacent cleaning mounting tanks 411, one sidewall portion 4112 and the other sidewall portion 4112 are spaced apart at their second ends with a larger radius, and the two second ends are separated by a transition portion 412. The transition portion 412 provides a certain space for two adjacent silicon wafers 001, preventing the silicon wafers 001 from colliding with each other.

[0048] Example 2: like Figures 1 to 11As shown, the semiconductor cleaning apparatus in this embodiment includes an ultrasonic cleaning tank 500 and a silicon wafer cleaning structure as described in Embodiment 1. The silicon wafer cleaning structure is movably placed in the ultrasonic cleaning tank 500. That is, after the silicon wafer 001 is installed on the silicon wafer cleaning structure, the silicon wafer cleaning structure is placed in the ultrasonic cleaning tank 500 to complete the cleaning operation.

[0049] Example 3; One cleaning method in this embodiment uses the silicon wafer cleaning structure in Embodiment 1, including: The first support assembly 200 and the side support 310 are pre-set according to the size of the silicon wafer 001 to form the cleaning mounting position 003; Place silicon wafer 001 into cleaning mounting position 003; The side support 320 is placed against the silicon wafer 001 at a preset tilt angle. Silicon wafer 001 is cleaned using ultrasonic cleaning.

[0050] The above-described embodiments are only used to illustrate the technical solutions of the present invention, and are not intended to limit it. Although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of the present invention.

Claims

1. A structure for cleaning a silicon wafer, characterized by comprising: The device includes a cleaning rack (100), on which a first support assembly (200) and a second support assembly (300) are provided. Along the direction of gravity, the second support assembly (300) is located above the first support assembly (200). The first support assembly (200) and the second support assembly (300) are each in contact with a silicon wafer (001). The first support assembly (200) includes at least two spaced-apart first supports (210) for supporting the silicon wafer (001); the second support assembly (300) includes a low side support (310) on one side of the silicon wafer (001) and a high side support (320) on the other side of the silicon wafer (001); the low side support (310) is pre-installed on the cleaning rack (100) and cooperates with the first support assembly (200) to form a cleaning mounting position (003) for positioning the silicon wafer (001); the high side support (320) is used to abut against the silicon wafer (001) from the other side at a preset tilt angle after the silicon wafer (001) is positioned in the cleaning mounting position (003); the high side support (320) is higher than the low side support (310).

2. The wafer cleaning structure of claim 1, wherein The cleaning rack (100) includes two cleaning plates (110) arranged opposite to each other, and the first support assembly (200) and the second support assembly (300) are disposed between the two cleaning plates (110); The cleaning plate (110) is provided with a plurality of horizontal mounting positions (120) spaced apart along the horizontal direction. The first support (210) is movably mounted on one of the horizontal mounting positions (120), and the horizontal mounting positions (120) corresponding to each first support (210) are different. The cleaning plate (110) has a plurality of spaced-apart low mounting positions (130) on one side, and the low mounting support (310) is movably mounted on one of the low mounting positions (130); the cleaning plate (110) has a plurality of spaced-apart high mounting positions (140) along the inclined direction on the other side, and the high mounting support (320) is movably mounted on one of the high mounting positions (140); the area between the low mounting position (130) and the high mounting position (140) is the cleaning position (150).

3. The silicon wafer cleaning structure according to claim 2, characterized in that, The tilting direction is set such that the height of the side-high mounting position (140) that is away from the cleaning position (150) in the horizontal direction is greater than the height of the side-high mounting position (140) that is close to the cleaning position (150) in the horizontal direction.

4. The silicon wafer cleaning structure according to claim 2, characterized in that, An inclined groove (114) is provided on the other side of the cleaning plate (110) corresponding to the positions of the multiple side height mounting positions (140). The end of the side height support (320) is detachably connected to the inclined groove (114) so ​​that the side height support (320) can be positioned on one of the side height mounting positions (140) along the inclined groove (114). The distance between the inclined groove (114) and the horizontal mounting position (120) in the direction of gravity decreases along the direction close to the cleaning position (150).

5. A silicon wafer cleaning structure according to claim 4, characterized in that, An inclined groove (113) is provided on one side of the cleaning plate (110) corresponding to the positions of the plurality of side low mounting positions (130). The end of the side low support (310) is detachably connected to the inclined groove (113) so that the side low support (310) can be positioned on one of the side low mounting positions (130) along the inclined groove (113). The distance between the inclined groove (113) and the horizontal mounting position (120) in the direction of gravity decreases along the direction close to the cleaning position (150).

6. The silicon wafer cleaning structure according to claim 5, characterized in that, The tilt angle of the inclined low groove (113) relative to the horizontal direction is less than or equal to the tilt angle of the inclined high groove (114) relative to the horizontal direction.

7. The silicon wafer cleaning structure according to claim 1, characterized in that, The first support body (210), the lower side support body (310) and the higher side support body (320) each include a support body (410). Each support body (410) passes through the cleaning space (002) of the cleaning rack (100) in parallel to each other, so as to form a cleaning mounting position (003) for positioning the silicon wafer (001) in the cleaning space (002). The end of the support body (410) is provided with a support locking part (420). The support body (410) is detachably mounted on the cleaning rack (100) through the support locking part (420).

8. A silicon wafer cleaning structure according to claim 7, characterized in that, The support body (410) is provided with a plurality of cleaning mounting grooves (411) spaced apart along its extension direction. Each cleaning mounting groove (411) includes a bottom wall portion (4111) and a side wall portion (4112) that is inclined relative to the bottom wall portion (4111). The bottom wall portion (4111) is located between the two side wall portions (4112). The distance between the two side wall portions (4112) increases in the direction away from the bottom wall portion (4111), so that the cleaning mounting groove (411) is open. The width of the bottom wall portion (4111) is greater than the width of the silicon wafer (001).

9. A silicon wafer cleaning structure according to claim 7, characterized in that, The support body (410) is provided with a plurality of cleaning installation grooves (411) spaced apart along its extension direction. Each cleaning installation groove (411) includes two groove sidewall portions (4112) connected together. The distance between the two groove sidewall portions (4112) increases in the direction away from the axis of the support body (410), so that the cleaning installation groove (411) is open.

10. A silicon wafer cleaning structure according to claim 9, characterized in that, The sidewall portion (4112) of the tank is frustum-shaped. Two sidewall portions (4112) of the cleaning installation tank (411) are connected at a first end with a smaller radius. Between two adjacent cleaning installation tanks (411), one sidewall portion (4112) and another sidewall portion (4112) are spaced apart at a second end with a larger radius. The two second ends are spaced apart by a transition portion (412).

11. A semiconductor cleaning apparatus, characterized in that, It includes an ultrasonic cleaning tank (500) and a silicon wafer cleaning structure as described in any one of claims 1-10, wherein the silicon wafer cleaning structure is movably placed in the ultrasonic cleaning tank (500).

12. A cleaning method, characterized in that, The silicon wafer cleaning structure as described in any one of claims 1-10 includes: The first support assembly and the side support body are pre-set according to the size of the silicon wafer to form a cleaning installation position; Place the silicon wafer into the cleaning mounting position; The side support is placed against the silicon wafer at a preset tilt angle. Silicon wafers are cleaned using ultrasonic cleaning.

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