Image acquisition module and portable electronic device

Abstract

The present application provides an image acquisition module and a portable electronic device. The image acquisition module includes a circuit substrate, an image sensing chip and an insulating connecting structure. The image sensing chip is disposed in a through opening of the circuit substrate and is electrically connected to the circuit substrate. The insulating connecting structure is disposed in the through opening of the circuit substrate and is connected between the image sensing chip and the circuit substrate. A lower surface of the image sensing chip is not covered by the insulating connecting structure and is exposed. The circuit substrate has a flat surrounding structure close to and surrounding the through opening, and a lower surface of the flat surrounding structure is flush with the lower surface of the image sensing chip. Thus, during the filling of the insulating connecting structure in the through opening of the circuit substrate, the insulating connecting structure cannot overflow from the temporary supporting substrate and the flat surrounding structure, thereby avoiding the overflow or residue of the insulating connecting structure on the bottom end of the circuit substrate of the image acquisition module.

Description

Technical Field

[0001] This invention relates to an image sensor, and more particularly to an image acquisition module for acquiring images and a portable electronic device using the image acquisition module. Background Technology

[0002] In existing technologies, the image sensing chip of an image acquisition module can be mounted on the top of a circuit substrate without openings via wire bonding, or it can be mounted on the bottom of a circuit substrate with openings via flip-chip bonding. However, existing image acquisition modules still have room for improvement. Summary of the Invention

[0003] The problem that this invention aims to improve or solve is to provide an image acquisition module for acquiring images and a portable electronic device using the image acquisition module, addressing the shortcomings of the prior art.

[0004] To improve or solve the above-mentioned problems, one technical means adopted by the present invention is to provide an image acquisition module, which includes: a circuit board, an image sensing chip, and an insulating connection structure. The circuit board has an upper surface, a lower surface, and a through opening connecting the upper surface and the lower surface. The image sensing chip is disposed in the through opening of the circuit board and electrically connected to the circuit board. The insulating connection structure is disposed in the through opening of the circuit board and connects the image sensing chip and the circuit board. The lower surface of the image sensing chip is exposed and not covered by the insulating connection structure; the circuit board has a flat surrounding structure adjacent to and surrounding the through opening, and the lower surface of the flat surrounding structure is flush with the lower surface of the image sensing chip.

[0005] To improve or solve the above-mentioned problems, another technical means adopted by the present invention is to provide a portable electronic device configured to use an image acquisition module. The image acquisition module includes: a circuit board, an image sensing chip, and an insulating connection structure. The circuit board has an upper surface, a lower surface, and a through-hole connecting the upper and lower surfaces. The image sensing chip is disposed within the through-hole of the circuit board and electrically connected to the circuit board. The insulating connection structure is disposed within the through-hole of the circuit board and connects the image sensing chip and the circuit board. The lower surface of the image sensing chip is exposed and not covered by the insulating connection structure; the circuit board has a flat surrounding structure adjacent to and surrounding the through-hole, and the lower surface of the flat surrounding structure is flush with the lower surface of the image sensing chip.

[0006] One of the beneficial effects of the present invention is that the image acquisition module and portable electronic device provided by the present invention can achieve the following through technical solutions: "the image sensing chip is disposed in the through opening of the circuit substrate and electrically connected to the circuit substrate", "the insulating connection structure is disposed in the through opening of the circuit substrate and connected between the image sensing chip and the circuit substrate", "the lower surface of the image sensing chip is not covered by the insulating connection structure and is exposed", and "the circuit substrate has a flat surrounding structure close to and surrounding the through opening", so that the lower surface of the flat surrounding structure and the lower surface of the image sensing chip can be substantially (or completely) flush with each other.

[0007] To further understand the features and technical content of the present invention, please refer to the following detailed description and drawings of the present invention. However, the drawings provided are for reference and illustration only and are not intended to limit the present invention. Attached Figure Description

[0008] Figure 1 This is a cross-sectional schematic diagram of the image acquisition module provided in the first embodiment of the present invention (before the temporary support substrate is removed).

[0009] Figure 2 This is a cross-sectional schematic diagram of the flat surrounding structure and the insulating covering layer in cooperation provided in the first embodiment of the present invention. Figure 1 A cross-sectional view of section line II-II (before the temporary support substrate is removed).

[0010] Figure 3 This is a cross-sectional schematic diagram of the image acquisition module provided in the first embodiment of the present invention (after the temporary support substrate has been removed).

[0011] Figure 4 This is a cross-sectional schematic diagram of the flat surrounding structure and the insulating covering layer in cooperation provided in the first embodiment of the present invention. Figure 3 A cross-sectional view of the IV-IV section line (after the temporary support substrate has been removed).

[0012] Figure 5 This is a cross-sectional schematic diagram of the image acquisition module provided in the second embodiment of the present invention (before the temporary support substrate is removed).

[0013] Figure 6 This is a cross-sectional schematic diagram of the cooperation between the flat surrounding structure and the insulating covering layer provided in the second embodiment of the present invention. Figure 5 A cross-sectional view of the VI-VI section line (before the temporary support substrate is removed).

[0014] Figure 7This is a cross-sectional schematic diagram of the image acquisition module provided in the second embodiment of the present invention (after the temporary support substrate has been removed).

[0015] Figure 8 This is a cross-sectional schematic diagram of the cooperation between the flat surrounding structure and the insulating covering layer provided in the second embodiment of the present invention. Figure 7 A cross-sectional view of section line VIII-VIII (after the temporary support substrate has been removed).

[0016] Figure 9 This is a cross-sectional schematic diagram of the image acquisition module provided in the third embodiment of the present invention (before the insulating connection structure is filled).

[0017] Figure 10 This is a cross-sectional view of the image acquisition module provided in the third embodiment of the present invention (after the insulating connection structure has been filled).

[0018] Figure 11 This is a bottom view of the circuit board of the image acquisition module provided in the fourth embodiment of the present invention.

[0019] Figure 12 This is a cross-sectional schematic diagram of the image acquisition module provided in the fourth embodiment of the present invention (before the insulating connection structure is filled).

[0020] Figure 13 This is a cross-sectional schematic diagram of the image acquisition module provided in the fourth embodiment of the present invention (after the insulating connection structure has been filled).

[0021] Figure 14 This is a functional block diagram of a portable electronic device using an image acquisition module, provided in the fifth embodiment of the present invention. Detailed Implementation

[0022] The following specific embodiments illustrate the implementation of the "image acquisition module" and "portable electronic device" disclosed in this invention. Those skilled in the art can understand the advantages and effects of this invention from the content disclosed in this specification. This invention can be implemented or applied through other different specific embodiments, and the details in this specification can also be modified and changed based on different viewpoints and applications without departing from the concept of this invention. Furthermore, it should be stated in advance that the accompanying drawings of this invention are for simple illustrative purposes only and are not depictions based on actual dimensions. The following embodiments will further describe the relevant technical content of this invention in detail, but the disclosed content is not intended to limit the scope of protection of this invention. Additionally, the term "or" used herein may, depending on the actual situation, include any combination of any one or more of the associated listed items.

[0023] First Embodiment

[0024] See Figures 1 to 4 As shown, the first embodiment of the present invention provides an image acquisition module M (or an image sensing module, or an image capture module), which includes: a circuit board 1, an image sensing chip 2, an insulating connection structure 3, and a lens assembly 4. It is worth noting that... Figure 1 This is a front cross-sectional view of the image acquisition module provided in the first embodiment of the present invention before the temporary support substrate is removed. Figure 2 yes Figure 1 A partial side view sectional diagram. Additionally, Figure 3 This is a front cross-sectional view of the image acquisition module provided in the first embodiment of the present invention after the temporary support substrate has been removed. Figure 4 yes Figure 3 A partial side view sectional diagram.

[0025] Furthermore, in coordination Figure 1 , Figure 2 and Figure 3 As shown, the circuit board 1 may have an upper surface 1001, a lower surface 1002, and a through opening 1003 (or a through opening 1003 penetrating the circuit board 1) connecting the upper surface 1001 and the lower surface 1002. The image sensing chip 2 may be disposed within the through opening 1003 of the circuit board 1 and electrically connected to the circuit board 1. In addition, an insulating connection structure 3 may be disposed within the through opening 1003 of the circuit board 1 and connected between the image sensing chip 2 and the circuit board 1. The lens assembly 4 may include a lens carrier 41 disposed on the circuit board 1 and a lens module 42 (e.g., composed of multiple optical lenses) supported by the lens carrier 41. For example, the upper surface 1001 of the circuit board 1 may have multiple substrate conductive pads 10P, and the upper surface 2001 of the image sensing chip 2 may have an image sensing area 20S corresponding to the lens module 42 and multiple chip conductive pads 20P. The multiple chip conductive pads 20P of the image sensing chip 2 may be electrically connected to the multiple substrate conductive pads 10P of the circuit board 1 via multiple metal leads W (which can be any conductive metal material, such as gold, silver, or copper). Furthermore, depending on different application requirements, the image sensing chip 2 may be a charge-coupled device (CCD) or a complementary metal-oxide semiconductor (CMOS). However, the examples given above are merely one possible embodiment and are not intended to limit the present invention.

[0026] Furthermore, in coordination Figure 1 and Figure 2As shown, the circuit board 1 may have a flat surrounding structure 11 (shown schematically only) close to and surrounding the through opening 1003. Figure 2 and Figure 4 However, it was not displayed. Figure 1 and Figure 3 Furthermore, the lower surface 2002 of the image sensor chip 2 is exposed and not covered by the insulating connection structure 3, and the lower surface of the flat surrounding structure 11 and the lower surface 2002 of the image sensor chip 2 may be substantially (or completely) flush with each other. For example, the circuit board 1 may include a wiring layout layer 101 (e.g., a copper wiring layout layer) disposed on the lower surface 1002 of the circuit board 1 and an insulating cover layer 102 (e.g., a solder resist or solder mask layer) for covering the wiring layout layer 101, and the wiring layout layer 101 may have a plurality of conductive lines 1010 close to and surrounding the through opening 1003. Furthermore, the insulating cover layer 102 may include a plurality of first cover portions 102A, a plurality of second cover portions 102B, and a plurality of recessed spaces 102C. The plurality of first cover portions 102A may be disposed on the lower surface 1002 of the circuit board 1. The plurality of second cover portions 102B (each second cover portion 102B may be stepped or recessed) may be used to cover a plurality of conductive line portions 1010 respectively, and each recessed space 102C may be located between the corresponding first cover portion 102A and two adjacent second cover portions 102B. In addition, the flat surrounding structure 11 of the circuit board 1 may include a plurality of filling material layers 111 (e.g., a conductive material that does not generate electrical conductivity with the line layout layer 101, or a non-conductive material that is the same as or different from the material of the insulating cover layer 102), and the plurality of filling material layers 111 of the flat surrounding structure 11 may fill (completely fill) the plurality of recessed spaces 102C of the insulating cover layer 102 respectively. However, the examples given above are merely one possible embodiment and are not intended to limit the invention.

[0027] It is worth noting, for example, in conjunction with Figure 1 and Figure 2 As shown, the lower surface 1110 of each filler material layer 111 of the flat surrounding structure 11 and the lower surface 1020 of each second cover portion 102B of the insulating cover layer 102 can be substantially (or completely) flush with each other, and the lower surface 1110 of each filler material layer 111 of the flat surrounding structure 11 and the lower surface 2002 of the image sensing chip 2 can be substantially (or completely) flush with each other. Therefore, when the temporary carrier substrate C (e.g., flexible tape or any kind of carrier) is flatly attached to the lower surface 1110 of each filler material layer 111 of the flat surrounding structure 11 and the lower surface 1020 of each second cover portion 102B of the insulating cover layer 102 (e.g. Figure 1As shown, at this time, the lower surface 2002 of the image sensing chip 2 is also flatly attached to the temporary carrier substrate C by adhesive material. During the process of the insulating connection structure 3 being filled into the through opening 1003 of the circuit board 1, the insulating connection structure 3 is only filled into the through opening 1003 of the circuit board 1 and does not overflow from "between the temporary carrier substrate C and the lower surface 1110 of each filling material layer 111 of the flat surrounding structure 11" or "between the temporary carrier substrate C and the lower surface 1020 of each second covering portion 102B of the insulating covering layer 102" (that is, no gap is generated between the temporary carrier substrate C and the lower surface 1110 of each filling material layer 111 of the flat surrounding structure 11, and no gap is generated between the temporary carrier substrate C and the lower surface 1020 of each second covering portion 102B of the insulating covering layer 102), thereby avoiding glue overflow on the bottom (or back) of the circuit board 1 of the image acquisition module M. There may be overflow / overfill or residual glue. However, the examples given above are merely one possible embodiment and are not intended to limit the invention.

[0028] In this way, to cooperate Figure 3 and Figure 4 As shown, when the temporary carrier substrate C is detached from the circuit board 1 by "direct irradiation by laser light generated by a laser generator" or "indirect heating by heat source generated by a heater", the insulating connection structure 3 has a lower surrounding surface 3000 that is exposed and not covered. The lower surrounding surface 3000 of the insulating connection structure 3, the lower surface of the flat surrounding structure 11 (that is, the lower surface 1110 of each filling material layer 111 and the lower surface 1020 of each second cover portion 102B of the insulating cover layer 102), and the lower surface 2002 of the image sensing chip 2 can be substantially (or completely) flush with each other. For example, when the temporary carrier substrate C is detached from the circuit board 1 by "direct irradiation by laser light generated by a laser generator" or "indirect heating by heat source generated by a heater", the lower surrounding surface 3000 of the insulating connection structure 3 will produce a colloidal deformation mark (not shown) formed "after being heated by heat source generated by laser generator or heater". However, the examples given above are merely one possible embodiment and are not intended to limit the invention.

[0029] For example, such as Figure 1 or Figure 3As shown, in one feasible embodiment, the thickness of the insulating connection structure 3 can be less than or equal to the thickness of the image sensing chip 2, and the thickness of the insulating connection structure 3 can be less than or equal to the thickness of the circuit board 1. The insulating connection structure 3 can be tightly connected between an outer surrounding surface 2000 of the image sensing chip 2 and an inner surrounding surface 1004 of the through opening 1003 of the circuit board 1. Furthermore, in one feasible embodiment, when the inner surrounding surface 1004 of the through opening 1003 of the circuit board 1 can be configured as a roughened surrounding surface, the roughened surrounding surface can be used to increase the adhesion or contact area between the insulating connection structure 3 and the circuit board 1. Additionally, in one feasible embodiment, all or part of the outer surrounding surface 2000 of the image sensing chip 2 can be covered by the insulating connection structure 3, thereby adjusting the adhesion or contact area between the insulating connection structure 3 and the image sensing chip 2 (that is, the larger the area of ​​the outer surrounding surface 2000 of the image sensing chip 2 covered by the insulating connection structure 3, the larger the adhesion or contact area between the insulating connection structure 3 and the image sensing chip 2). However, the examples given above are merely one possible embodiment and are not intended to limit the invention.

[0030] For example, in one feasible embodiment, the insulating connection structure 3 may have an extended connection portion (not shown) extending to the upper surface 1001 of the circuit board 1, thereby increasing the adhesion or contact area between the insulating connection structure 3 and the circuit board 1. That is, the insulating connection structure 3 can overlap the upper surface 1001 of the circuit board 1 through the extension of the extended connection portion, thus increasing the contact area between the insulating connection structure 3 and the circuit board 1 (or providing more support to the insulating connection structure 3 from the circuit board 1). This makes the insulating connection structure 3 less susceptible to damage from external forces (e.g., Figure 4 As shown, the temporary support substrate C is removed from the circuit board 1 by an external force generated during removal of the circuit board 1, thus disengaging from the through opening 1003 of the circuit board 1. However, the example given above is only one possible embodiment and is not intended to limit the present invention.

[0031] It is worth noting, for example, such as Figure 1 or Figure 3As shown, the image acquisition module M provided in the first embodiment of the present invention further includes a filter component 5. The filter component 5 can be disposed above the image sensing chip 2 by being supported by multiple supports (unlabeled) or a surrounding support (unlabeled). The filter component 5 can be surrounded by multiple metal leads W, and the height of the filter component 5 relative to the image sensing chip 2 can be higher or lower than the height of the multiple metal leads W relative to the image sensing chip 2. However, the above examples are only one feasible embodiment and are not intended to limit the present invention.

[0032] Second Embodiment

[0033] See Figures 5 to 8 As shown, the second embodiment of the present invention provides an image acquisition module M. (The image acquisition module M is described in the original text.) Figure 6 and Figure 2 The comparison, and Figure 8 and Figure 4 A comparison reveals that the most significant difference between the second embodiment and the first embodiment of the present invention lies in the following: In the second embodiment, the flat surrounding structure 11 of the circuit board 1 may include multiple filling material layers 111 and a thickening material layer 112 (or a material thickening layer). The multiple filling material layers 111 of the flat surrounding structure 11 (e.g., conductive materials that do not electrically connect with the circuit layout layer 101, or non-conductive materials that are the same as or different from the material of the insulating cover layer 102) may respectively fill (completely fill) the multiple recessed spaces 102C of the insulating cover layer 102, and the thickening material layer 112 may be used to cover the multiple filling material layers 111 and the multiple second cover portions 102B. It is worth noting that the thickening material layer 112 of the flat surrounding structure 11 has a flat surface 1120, and the flat surface 1120 of the thickening material layer 112 of the flat surrounding structure 11 and the lower surface 2002 of the image sensing chip 2 may be substantially (or completely) flush with each other. Therefore, when a temporary carrier substrate C (e.g., flexible tape or any kind of carrier) is flatly attached to the flat surface 1120 of the thickened material layer 112 surrounding the structure 11 (e.g.) Figure 5As shown, at this time, the lower surface 2002 of the image sensing chip 2 is also flatly attached to the temporary support substrate C by adhesive material. During the process of the insulating connection structure 3 being filled into the through opening 1003 of the circuit board 1, the insulating connection structure 3 is only filled into the through opening 1003 of the circuit board 1 and does not overflow from the "between the temporary support substrate C and the flat surface 1120 of the thickened material layer 112 of the flat surrounding structure 11" (that is, no gap is generated between the temporary support substrate C and the flat surface 1120 of the thickened material layer 112 of the flat surrounding structure 11), thereby avoiding glue overflow / overfill or residual glue on the bottom (or back) of the circuit board 1 of the image acquisition module M. However, the above example is only one possible embodiment and is not intended to limit the present invention.

[0034] In this way, to cooperate Figure 7 and Figure 8 As shown, when the temporary support substrate C is detached from the circuit board 1 by "direct irradiation by laser light generated by a laser generator" or "indirect heating by a heat source generated by a heater", the insulating connection structure 3 has a lower surrounding surface 3000 that is exposed and not covered. The lower surrounding surface 3000 of the insulating connection structure 3, the lower surface of the flat surrounding structure 11 (that is, the flat surface 1120 of the thickened material layer 112 of the flat surrounding structure 11), and the lower surface 2002 of the image sensing chip 2 can be substantially (or completely) flush with each other. For example, when the temporary support substrate C is detached from the circuit board 1 by "direct irradiation by laser light generated by a laser generator" or "indirect heating by a heat source generated by a heater", the lower surrounding surface 3000 of the insulating connection structure 3 will produce a colloidal deformation mark (not shown) formed "after being heated by the heat source generated by the laser generator or the heater". However, the above example is only one possible embodiment and is not intended to limit the invention.

[0035] Third Embodiment

[0036] See Figure 9 and Figure 10As shown, the third embodiment of the present invention provides an image acquisition module M. The main difference between the third embodiment and the first and second embodiments is that, in the third embodiment, the insulating connection structure 3 may have a main filling layer 30A (or a first surrounding filling layer) disposed in the through opening 1003 of the circuit board 1 and a surrounding filling layer 30B (or a second surrounding filling layer, the maximum width of which may be any positive integer between 100μm and 150μm) surrounding and connected (e.g., integrally formed or non-integral formed) to the main filling layer 30A. The surrounding filling layer 30B may be configured as a flat surrounding structure 11, and the surrounding filling layer 30B may be disposed on the lower surface 1002 of the circuit board 1 and cover the plurality of conductive lines 1010 of the circuit layout layer 101. Therefore, when the temporary carrier substrate C (e.g., flexible tape or any kind of carrier) is flatly attached to the bottom surface of the circuit board 1 (at this time, the lower surface 2002 of the image sensing chip 2 is also flatly attached to the temporary carrier substrate C by adhesive material), during the process of the insulating connection structure 3 being filled into the through opening 1003 of the circuit board 1, the insulating connection structure 3 will only be filled into the through opening 1003 of the circuit board 1 and will not overflow from between the temporary carrier substrate C and the insulating cover layer 102 (that is, no gap will be generated between the temporary carrier substrate C and the insulating cover layer 102), thereby avoiding glue overflow / overfill or residual glue on the bottom (or back) of the circuit board 1 of the image acquisition module M. However, the above example is only one possible embodiment and is not intended to limit the present invention.

[0037] In this way, to cooperate Figure 10 As shown, when the temporary support substrate C is detached from the circuit board 1 by "direct irradiation by laser light generated by a laser generator" or "indirect heating by a heat source generated by a heater", the lower surface 3001 of the main filling layer 30A, the lower surface 3002 of the surrounding filling layer 30B (which serves as the flat surrounding structure 11), and the lower surface 2002 of the image sensing chip 2 can be substantially (or completely) flush with each other. For example, when the temporary support substrate C is detached from the circuit board 1 by "direct irradiation by laser light generated by a laser generator" or "indirect heating by a heat source generated by a heater", the lower surrounding surface of the insulating connection structure 3 (that is, the lower surface 3001 of the main filling layer 30A and the lower surface 3002 of the surrounding filling layer 30B) will have a colloidal deformation mark (not shown) formed after being "heated by a heat source generated by a laser generator or a heater". However, the above example is only one possible embodiment and is not intended to limit the present invention.

[0038] Fourth embodiment

[0039] See Figures 11 to 13 As shown, the fourth embodiment of the present invention provides an image acquisition module M. The main difference between the fourth embodiment and the first, second and third embodiments is that, in the fourth embodiment, the lower surface 1002 of the circuit substrate 1 may have a circuitless layout area 10020 (or a substrate clearance area, the maximum width of which may be any positive integer between 100μm and 150μm), the circuitless layout area 10020 of the circuit substrate 1 may be surrounded by a circuit layout layer 101 and an insulating cover layer 102, and the circuitless layout area 10020 of the circuit substrate 1 may be configured as a flat surrounding structure 11. Therefore, when the temporary carrier substrate C (e.g., flexible tape or any kind of carrier) is flatly attached to the bottom surface of the circuit board 1 (at this time, the lower surface 2002 of the image sensing chip 2 is also flatly attached to the temporary carrier substrate C by adhesive material), during the process of the insulating connection structure 3 being filled into the through opening 1003 of the circuit board 1, the insulating connection structure 3 will only be filled into the through opening 1003 of the circuit board 1 and will not overflow from the "between the temporary carrier substrate C and the wireless layout area 10020 of the circuit board 1" (that is, no gap will be generated between the temporary carrier substrate C and the wireless layout area 10020 of the circuit board 1), thereby avoiding glue overflow / overfill or residual glue on the bottom (or back) of the circuit board 1 of the image acquisition module M. However, the above example is only one possible embodiment and is not intended to limit the present invention.

[0040] In this way, to cooperate Figure 13 As shown, when the temporary support substrate C is detached from the circuit board 1 by "direct irradiation by laser light generated by a laser generator" or "indirect heating by a heat source generated by a heater", the insulating connection structure 3 has a lower surrounding surface 3000 that is exposed and not covered. The lower surrounding surface 3000 of the insulating connection structure 3, the circuitless layout area 10020 of the circuit board 1, and the lower surface 2002 of the image sensing chip 2 can be substantially (or completely) flush with each other. For example, when the temporary support substrate C is detached from the circuit board 1 by "direct irradiation by laser light generated by a laser generator" or "indirect heating by a heat source generated by a heater", the lower surrounding surface 3000 of the insulating connection structure 3 will produce a colloidal deformation mark (not shown) formed "after being heated by the heat source generated by the laser generator or the heater". However, the above example is only one possible embodiment and is not intended to limit the invention.

[0041] Fifth Embodiment

[0042] See Figure 14 As shown, the fifth embodiment of the present invention provides a portable electronic device P, which can be configured to use any of the image acquisition modules M provided in the first, second, third, and fourth embodiments. For example, the portable electronic device P can be a smartphone, desktop computer, laptop computer, tablet computer, or any kind of electronic device. However, the examples given above are merely one possible embodiment and are not intended to limit the present invention.

[0043] It is worth noting that, for example, in the first to fifth embodiments of the present invention, the present invention may further provide a method for manufacturing an image acquisition module M, which may include: first, bringing a circuit board 1 and a temporary support substrate C close to each other so that the circuit board 1 is disposed on the temporary support substrate C (or until the circuit board 1 and the temporary support substrate C are in complete contact), wherein the bottom end of the through opening 1003 of the circuit board 1 is closed by the temporary support substrate C; next, accommodating an image sensing chip 2 in the through opening 1003 of the circuit board 1 and disposed on the temporary support substrate C, and then forming an insulating connection structure 3 in the through opening 1003 of the circuit board 1 and connecting the image sensing chip 2 and the circuit board 1; then, removing the temporary support substrate C from the circuit board 1; next, electrically connecting the image sensing chip 2 to the circuit board 1 through a plurality of metal leads W; then, disposing of a lens assembly 4 on the circuit board 1, wherein the lens assembly 4 includes a lens carrier 41 disposed on the circuit board 1 and a lens module 42 carried by the lens carrier 41. Furthermore, depending on different processing requirements, the temporary support substrate C can be removed from the circuit board 1 after the step of "forming the insulating connection structure 3 within the through opening 1003 of the circuit board 1," or after the step of "electrically connecting the image sensing chip 2 to the circuit board 1 via multiple metal leads W," or after the step of "setting the lens assembly 4 on the circuit board 1." However, the examples given above are merely one possible embodiment and are not intended to limit the present invention.

[0044] It is worth noting that, for example, in the first to fifth embodiments of the present invention, the present invention may further provide a method for manufacturing an image acquisition module M, which may include: first, bringing a circuit board 1 and a temporary support substrate C close to each other, such that the circuit board 1 is disposed on the temporary support substrate C (or until the circuit board 1 and the temporary support substrate C are in complete contact), wherein the bottom end of the through opening 1003 of the circuit board 1 is closed by the temporary support substrate C; then, placing an image sensing chip 2 within the through opening 1003 of the circuit board 1 and disposed on the temporary support substrate C using an adhesive layer (such as double-sided tape or any type of adhesive layer). The image sensor chip 2 is then electrically connected to the circuit board 1 via multiple metal leads W (or a filter assembly 5 may be disposed above the image sensor chip 2 via multiple supports or a surrounding support). Next, an insulating connection structure 3 is formed within the through opening 1003 of the circuit board 1 and connected between the image sensor chip 2 and the circuit board 1. Then, the temporary carrier substrate C is removed from the circuit board 1. Next, a lens assembly 4 is disposed on the circuit board 1, wherein the lens assembly 4 includes a lens carrier 41 disposed on the circuit board 1 and a lens module 42 supported by the lens carrier 41. It is worth noting that, depending on different requirements, the “wire bonding step (or chip electrical connection step)” which uses multiple metal leads W to electrically connect the image sensing chip 2 to the circuit board 1 and the “insulating bonding step (chip limiting step)” which forms an insulating connection structure 3 in the through opening 1003 of the circuit board 1 and connects the image sensing chip 2 and the circuit board 1 can be two steps executed sequentially (that is, the filling step is performed first and then the wire bonding step) or two steps executed in reverse order (that is, the wire bonding step is performed first and then the filling step).

[0045] Beneficial effects of the embodiments

[0046] One of the beneficial effects of the present invention is that the image acquisition module M and the portable electronic device P provided by the present invention can achieve the following through the technical solutions: "the image sensing chip 2 is disposed in the through opening 1003 of the circuit substrate 1 and electrically connected to the circuit substrate 1", "the insulating connection structure 3 is disposed in the through opening 1003 of the circuit substrate 1 and connected between the image sensing chip 2 and the circuit substrate 1", "the lower surface 2002 of the image sensing chip 2 is not covered by the insulating connection structure 3 and is exposed", and "the circuit substrate 1 has a flat surrounding structure 11 close to and surrounding the through opening 1003", so that the lower surface of the flat surrounding structure 11 and the lower surface 2002 of the image sensing chip 2 can be substantially (or completely) flush with each other.

[0047] In this way, during the process of the insulating connection structure 3 being filled into the through opening 1003 of the circuit board 1, the insulating connection structure 3 will not overflow from between the temporary support substrate C and the flat surrounding structure 11, thereby avoiding glue overflow / overfill or residual glue on the bottom (or back) of the circuit board 1 of the image acquisition module M.

[0048] The content disclosed above is only a preferred and feasible embodiment of the present invention, and is not intended to limit the scope of protection of the claims of the present invention. Therefore, all equivalent technical changes made based on the content of the present invention specification and drawings are included within the scope of protection of the claims of the present invention.

Claims

1. An image acquisition module, characterized in that, The image acquisition module includes: A circuit board having an upper surface, a lower surface, and a through opening connecting the upper surface and the lower surface; An image sensing chip is disposed within the through-hole of the circuit substrate and electrically connected to the circuit substrate; and An insulating connection structure is disposed within the through opening of the circuit substrate and connected between the image sensing chip and the circuit substrate. In this embodiment, one surface of the image sensing chip is not covered by the insulating connection structure and is exposed. The circuit board has a flat surrounding structure close to and surrounding the through opening, and the lower surface of the flat surrounding structure is flush with the lower surface of the image sensing chip.

2. The image acquisition module according to claim 1, characterized in that, in, The circuit board includes a circuit layout layer disposed on the lower surface of the circuit board and an insulating cover layer for covering the circuit layout layer, and the circuit layout layer has a plurality of conductive lines close to and surrounding the through opening. The insulating cover layer includes a plurality of first cover portions, a plurality of second cover portions, and a plurality of recessed spaces. The plurality of first cover portions are disposed on the lower surface of the circuit board, the plurality of second cover portions are respectively used to cover the plurality of conductive lines, and each of the recessed spaces is located between the corresponding first cover portion and two adjacent second cover portions. The flat surrounding structure of the circuit board includes multiple filling material layers, and the multiple filling material layers of the flat surrounding structure respectively fill the multiple recessed spaces of the insulating cover layer. Wherein, the lower surface of each of the filling material layers of the flat surrounding structure and the lower surface of each of the second covering portions of the insulating covering layer are flush with each other, and the lower surface of each of the filling material layers of the flat surrounding structure and the lower surface of the image sensing chip are flush with each other; The insulating connection structure has a lower surrounding surface that is exposed and not covered, and the lower surrounding surface of the insulating connection structure, the lower surface of the flat surrounding structure, and the lower surface of the image sensing chip are flush with each other.

3. The image acquisition module according to claim 1, characterized in that, in, The circuit board includes a circuit layout layer disposed on the lower surface of the circuit board and an insulating cover layer for covering the circuit layout layer, and the circuit layout layer has a plurality of conductive lines close to and surrounding the through opening. The insulating cover layer includes a plurality of first cover portions, a plurality of second cover portions, and a plurality of recessed spaces. The plurality of first cover portions are disposed on the lower surface of the circuit board, the plurality of second cover portions are respectively used to cover the plurality of conductive lines, and each of the recessed spaces is located between the corresponding first cover portion and two adjacent second cover portions. The flat surrounding structure of the circuit board includes multiple filling material layers and a thickening material layer. The multiple filling material layers of the flat surrounding structure respectively fill the multiple recessed spaces of the insulating cover layer, and the thickening material layer is used to cover the multiple filling material layers and the multiple second cover portions. The thickened material layer of the flat surrounding structure has a flat surface, and the flat surface of the thickened material layer of the flat surrounding structure and the lower surface of the image sensing chip are flush with each other. The insulating connection structure has a lower surrounding surface that is exposed and not covered, and the lower surrounding surface of the insulating connection structure, the lower surface of the flat surrounding structure, and the lower surface of the image sensing chip are flush with each other.

4. The image acquisition module according to claim 1, characterized in that, in, The circuit board includes a circuit layout layer disposed on the lower surface of the circuit board and an insulating cover layer for covering the circuit layout layer, and the circuit layout layer has a plurality of conductive lines close to and surrounding the through opening. The insulating connection structure has a main filling layer disposed in the through opening of the circuit board and a surrounding filling layer connected to the main filling layer. The surrounding filling layer is configured as the flat surrounding structure and is disposed on the lower surface of the circuit board and covers a plurality of the conductive lines of the circuit layout layer. The lower surface of the main filling layer, the lower surface of the surrounding filling layer which serves as the flat surrounding structure, and the lower surface of the image sensing chip are flush with each other.

5. The image acquisition module according to claim 1, characterized in that, in, The circuit board includes a circuit layout layer disposed on the lower surface of the circuit board and an insulating cover layer for covering the circuit layout layer, and the circuit layout layer has a plurality of conductive lines close to and surrounding the through opening. The lower surface of the circuit board has a wireless layout area, which is surrounded by the wiring layout layer and the insulating cover layer, and the wireless layout area of ​​the circuit board is configured as the flat surrounding structure. The maximum width of the circuitless layout area of ​​the circuit substrate is between 100 μm and 150 μm. The insulating connection structure has a lower surrounding surface that is exposed and not covered, and the lower surrounding surface of the insulating connection structure, the wireless layout area of ​​the circuit board, and the lower surface of the image sensing chip are flush with each other. The circuit substrate has multiple substrate conductive pads on its upper surface, the image sensing chip has multiple chip conductive pads on its upper surface, and the multiple chip conductive pads of the image sensing chip are electrically connected to the multiple substrate conductive pads of the circuit substrate through multiple metal leads. The insulating connection structure is tightly connected between an outer surrounding surface of the image sensing chip and an inner surrounding surface of the through opening of the circuit substrate; The inner surrounding surface of the through opening of the circuit board is configured as a roughened surrounding surface to increase the adhesion or contact area between the insulating connection structure and the circuit board. In this embodiment, all or part of the outer surrounding surface of the image sensing chip is covered by the insulating connection structure, thereby adjusting the adhesion or contact area between the insulating connection structure and the image sensing chip; Wherein, the thickness of the insulating connection structure is less than or equal to the thickness of the image sensing chip, and the thickness of the insulating connection structure is less than or equal to the thickness of the circuit substrate; The image acquisition module further includes a lens assembly, which includes a lens carrier disposed on the circuit board and a lens module carried by the lens carrier, and an upper surface of the image sensing chip has an image sensing area corresponding to the lens module. The image acquisition module further includes a filter component, which is supported by multiple supports or a surrounding support to be disposed above the image sensing chip, and the filter component is surrounded by multiple metal leads.

6. A portable electronic device configured to use an image acquisition module, characterized in that, The image acquisition module includes: A circuit board having an upper surface, a lower surface, and a through opening connecting the upper surface and the lower surface; An image sensing chip is disposed within the through-hole of the circuit substrate and electrically connected to the circuit substrate; and An insulating connection structure is disposed within the through opening of the circuit substrate and connected between the image sensing chip and the circuit substrate. In this embodiment, one surface of the image sensing chip is not covered by the insulating connection structure and is exposed. The circuit board has a flat surrounding structure close to and surrounding the through opening, and the lower surface of the flat surrounding structure is flush with the lower surface of the image sensing chip.

7. The portable electronic device according to claim 6, characterized in that, in, The circuit board includes a circuit layout layer disposed on the lower surface of the circuit board and an insulating cover layer for covering the circuit layout layer, and the circuit layout layer has a plurality of conductive lines close to and surrounding the through opening. The insulating cover layer includes a plurality of first cover portions, a plurality of second cover portions, and a plurality of recessed spaces. The plurality of first cover portions are disposed on the lower surface of the circuit board, the plurality of second cover portions are respectively used to cover the plurality of conductive lines, and each of the recessed spaces is located between the corresponding first cover portion and two adjacent second cover portions. The flat surrounding structure of the circuit board includes multiple filling material layers, and the multiple filling material layers of the flat surrounding structure respectively fill the multiple recessed spaces of the insulating cover layer. Wherein, the lower surface of each of the filling material layers of the flat surrounding structure and the lower surface of each of the second covering portions of the insulating covering layer are flush with each other, and the lower surface of each of the filling material layers of the flat surrounding structure and the lower surface of the image sensing chip are flush with each other; The insulating connection structure has a lower surrounding surface that is exposed and not covered, and the lower surrounding surface of the insulating connection structure, the lower surface of the flat surrounding structure, and the lower surface of the image sensing chip are flush with each other.

8. The portable electronic device according to claim 6, characterized in that, in, The circuit board includes a circuit layout layer disposed on the lower surface of the circuit board and an insulating cover layer for covering the circuit layout layer, and the circuit layout layer has a plurality of conductive lines close to and surrounding the through opening. The insulating cover layer includes a plurality of first cover portions, a plurality of second cover portions, and a plurality of recessed spaces. The plurality of first cover portions are disposed on the lower surface of the circuit board, the plurality of second cover portions are respectively used to cover the plurality of conductive lines, and each of the recessed spaces is located between the corresponding first cover portion and two adjacent second cover portions. The flat surrounding structure of the circuit board includes multiple filling material layers and a thickening material layer. The multiple filling material layers of the flat surrounding structure respectively fill the multiple recessed spaces of the insulating cover layer, and the thickening material layer is used to cover the multiple filling material layers and the multiple second cover portions. The thickened material layer of the flat surrounding structure has a flat surface, and the flat surface of the thickened material layer of the flat surrounding structure and the lower surface of the image sensing chip are flush with each other. The insulating connection structure has a lower surrounding surface that is exposed and not covered, and the lower surrounding surface of the insulating connection structure, the lower surface of the flat surrounding structure, and the lower surface of the image sensing chip are flush with each other.

9. The portable electronic device according to claim 6, characterized in that, in, The circuit board includes a circuit layout layer disposed on the lower surface of the circuit board and an insulating cover layer for covering the circuit layout layer, and the circuit layout layer has a plurality of conductive lines close to and surrounding the through opening. The insulating connection structure has a main filling layer disposed in the through opening of the circuit board and a surrounding filling layer connected to the main filling layer. The surrounding filling layer is configured as the flat surrounding structure and is disposed on the lower surface of the circuit board and covers a plurality of the conductive lines of the circuit layout layer. The lower surface of the main filling layer, the lower surface of the surrounding filling layer which serves as the flat surrounding structure, and the lower surface of the image sensing chip are flush with each other.

10. The portable electronic device according to claim 6, characterized in that, in, The circuit board includes a circuit layout layer disposed on the lower surface of the circuit board and an insulating cover layer for covering the circuit layout layer, and the circuit layout layer has a plurality of conductive lines close to and surrounding the through opening. The lower surface of the circuit board has a wireless layout area, which is surrounded by the wiring layout layer and the insulating cover layer, and the wireless layout area of ​​the circuit board is configured as the flat surrounding structure. The maximum width of the circuitless layout area of ​​the circuit substrate is between 100 μm and 150 μm. The insulating connection structure has a lower surrounding surface that is exposed and not covered, and the lower surrounding surface of the insulating connection structure, the wireless layout area of ​​the circuit board, and the lower surface of the image sensing chip are flush with each other. The circuit substrate has multiple substrate conductive pads on its upper surface, the image sensing chip has multiple chip conductive pads on its upper surface, and the multiple chip conductive pads of the image sensing chip are electrically connected to the multiple substrate conductive pads of the circuit substrate through multiple metal leads. The insulating connection structure is tightly connected between an outer surrounding surface of the image sensing chip and an inner surrounding surface of the through opening of the circuit substrate; The inner surrounding surface of the through opening of the circuit board is configured as a roughened surrounding surface to increase the adhesion or contact area between the insulating connection structure and the circuit board. In this embodiment, all or part of the outer surrounding surface of the image sensing chip is covered by the insulating connection structure, thereby adjusting the adhesion or contact area between the insulating connection structure and the image sensing chip; Wherein, the thickness of the insulating connection structure is less than or equal to the thickness of the image sensing chip, and the thickness of the insulating connection structure is less than or equal to the thickness of the circuit substrate; The image acquisition module further includes a lens assembly, which includes a lens carrier disposed on the circuit board and a lens module carried by the lens carrier, and an upper surface of the image sensing chip has an image sensing area corresponding to the lens module. The image acquisition module further includes a filter component, which is supported by multiple supports or a surrounding support to be disposed above the image sensing chip, and the filter component is surrounded by multiple metal leads.

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