Camera module and manufacturing method thereof

Abstract

The application provides a camera module, which comprises a photosensitive chip, a circuit board, an optical lens, a motor and a base. The photosensitive chip is mounted on the circuit board and electrically connected with the circuit board. The optical lens is arranged on a photosensitive path of the photosensitive chip. The base is integrally formed on the circuit board and encapsulates at least a part of the circuit board. The photosensitive chip is exposed through a window area defined by the base. The motor is assembled on the base. The base is provided with a plurality of anti-shake through grooves and a plurality of mutually independent anti-shake conductive pieces. The plurality of anti-shake through grooves are arranged on the same side of the base. The anti-shake conductive pieces are arranged in the anti-shake through grooves, one end of each of the anti-shake conductive pieces is electrically connected with the circuit board, and the other end is electrically connected with the motor.

Description

Camera module and manufacturing method thereof Technical Field

[0001] The present application relates to the field of camera modules, and more specifically to a camera module and a method for manufacturing the same. Background Art

[0002] Camera modules are an essential component of mobile electronic devices. With the advancement of camera module technology, user demands for these modules are becoming increasingly sophisticated and demanding. Camera product development must not only meet high performance requirements but also meet the requirements for miniaturization, lightness, and compactness.

[0003] The camera module consists of a lens, a motor, and a photosensitive component. Light passes through the lens and reaches the photosensitive component, where it is received by the photosensitive chip. The motor is used to drive the lens to adjust its position.

[0004] In order to further improve the image quality and realize more imaging functions, the camera module is usually equipped with auto focus function (Auto Focus, AF function) and optical image stabilization (Optical Image Stabilization, OIS function). The AF function is usually achieved by a motor driving the lens to move linearly along the optical axis. The OIS function is achieved by compensating for the jitter displacement by the motor. The jitter of the camera module includes translation in the direction perpendicular to the optical axis (translation in the x-axis and y-axis directions) and rotation (referring to rotation in the xoy plane, and its axis direction can be roughly the same as the optical axis), as well as tilt jitter (referring to rotation around the x-axis and y-axis. In the field of camera modules, tilt jitter is also called tilt jitter). When the gyroscope (or other position sensing element) of the camera module detects jitter in a certain direction, it can issue a command to drive the motor to move a certain distance in the opposite direction to compensate for the jitter of the lens. As the requirements for imaging quality become higher, the number of lenses in optical lenses increases and the weight becomes heavier, which requires a corresponding increase in the driving force of the motor, resulting in an increase in the size of the motor, which is contrary to the compact requirements of the camera module.

[0005] The motor usually has a base for supporting the focus carrier and the anti-shake carrier. The focus carrier supports the lens for focusing movement, and the anti-shake carrier supports the lens for shake compensation movement. The design and assembly of the base, focus carrier, and anti-shake carrier will affect the size of the motor, which in turn affects the size of the camera module. However, the installation space of the camera module in the electronic device is very limited, and the increase in the size of the motor is limited, making it impossible to effectively increase the driving force. For example, the thickness of the mobile phone is strictly limited, resulting in a serious limitation on the height of the camera module. Under the condition of limited height, how to design increasingly complex motors to meet the requirements of higher imaging quality and smaller size is a major problem for those skilled in the art.

[0006] The current market demand for camera modules with higher image quality and increasingly larger lenses requires motors with higher driving force. However, the installation space for camera modules within electronic devices is severely limited. The limited increase in motor size prevents effective increases in driving force. For example, the thickness of mobile phones is strictly restricted, which severely limits the height of camera modules. Within this height constraint, designing increasingly complex motors to meet the requirements of higher image quality and smaller size presents a major challenge for those skilled in the art. Furthermore, the performance of the circuit board can also affect the imaging quality of the camera molding. The packaging of the circuit board can cause deformation and warping of the circuit board, affecting the installation of the photosensitive chip and its smoothness after installation. Summary of the Invention

[0007] One advantage of the present application is that it provides a camera module in which the molded base of the photosensitive component of the camera module integrates the function of the base of the motor of the camera module, which can reduce the size and height of the camera module.

[0008] One advantage of the present application is that it provides a camera module that uses a base formed by a molding process to replace an independent motor component, thereby reducing parts, saving assembly steps, improving consistency between components, reducing the difficulty of assembling the camera module, and improving assembly accuracy.

[0009] One advantage of the present application is that it provides a camera module that forms a base with a support arm and a guide portion through a molding process, eliminating the need for a separate support and guide structure, further reducing the height, and saving assembly steps.

[0010] One advantage of the present application is that it provides a camera module in which the support arm and the guide part are formed by a molding process, with higher precision, smaller assembly tolerance, and more stable structure, which is conducive to improving the performance and precision of the camera module.

[0011] One advantage of the present application is that it provides a camera module, in which a guide component is accommodated between the guide part and the motor carrier of the camera module. The guide part is formed by a molding process, which improves the flatness and precision, reduces the movement resistance, makes the guiding movement more precise and flexible, improves the precision of the guiding movement, and increases the movement stroke.

[0012] One advantage of the present application is that it provides a camera module in which the magnetic element and the position sensing element are built into the base during molding, saving assembly steps.

[0013] One advantage of the present application is that it provides a camera module, wherein the base is provided with a conductive structure, which connects the circuit board of the motor and the photosensitive component so that the photosensitive component can supply power to the motor.

[0014] One advantage of the present application is that it provides a camera module, the conductive structure of which includes a conductive component of a support arm built into the base, which is used to form a focus conduction circuit, and also includes a conductive component arranged at the base, which is used to conduct to form an anti-shake conduction circuit, thereby enabling the motor to be driven to perform focus adjustment movement and anti-shake compensation movement, and the conductive component is small in size and simple to assemble.

[0015] One advantage of the present application is that it provides a camera module, a position sensing element and an anti-shake conduction circuit with a common conductive structure, which simplifies the conductive design.

[0016] One advantage of the present application is that it provides a camera module and a manufacturing method thereof, wherein the base of the photosensitive component integrally forms a motor mounting portion and a filter mounting portion, thereby reducing the height of the camera module.

[0017] One advantage of the present application is that it provides a camera module and a manufacturing method thereof, wherein the base replaces the independent motor base structure and filter bracket structure, reducing assembly parts, saving assembly steps, and improving assembly accuracy and efficiency.

[0018] One advantage of the present application is that it provides a camera module and a manufacturing method thereof, in which the motor mounting portion of the base integrally forms a support and guide structure of the motor, further eliminating the need for independent support components and guide components of the motor, thereby further improving assembly accuracy and efficiency.

[0019] One advantage of the present application is that it provides a camera module and a manufacturing method thereof, wherein the base forms a two-layer molding structure, and the circuit board is placed between the two side moldings, thereby enhancing the strength of the circuit board and reducing the warping of the circuit board.

[0020] One advantage of the present application is that it provides a camera module and a manufacturing method thereof, wherein a first packaging body is formed on the top of the circuit board, and the first packaging body forms a sunken filter mounting portion to reduce the installation height of the filter, which is beneficial to reducing the height of the camera module.

[0021] One advantage of the present application is that it provides a camera module and a manufacturing method thereof, wherein the support arm of the first package body is formed in one step and has a certain height that matches the height of the motor.

[0022] One advantage of the present application is that it provides a camera module and a manufacturing method thereof, wherein a second package body is formed at the bottom of the circuit board, and the second package body forms an installation area sunken relative to the circuit board for installing a photosensitive chip to reduce the installation height of the photosensitive chip.

[0023] One advantage of the present application is that it provides a camera module and a manufacturing method thereof, wherein a reinforcing plate is provided at the bottom of the second package body, the reinforcing portion strengthens the strength of the bottom and forms support for the photosensitive chip, thereby improving the reliability of the camera module.

[0024] One advantage of the present application is that it provides a camera module and a manufacturing method thereof, in which the circuit board is covered with two layers of molded structure, has high strength, and can meet the requirements of the chip flip-chip process.

[0025] One advantage of the present application is that it provides a camera module and a manufacturing method thereof, in which the photosensitive chip can be installed after the motor is assembled, and the motor can be tested without the photosensitive chip to avoid damage to the photosensitive chip.

[0026] According to one aspect of the present application, the present application provides a camera module, comprising:

[0027] A photosensitive chip, a circuit board, and an optical lens, wherein the photosensitive chip is mounted on the circuit board and is conductively connected to the circuit board, and the optical lens is arranged in the light sensing path of the photosensitive chip; and

[0028] a motor and a base, wherein the base is integrally formed with the circuit board and encapsulates at least a portion of the circuit board, the photosensitive chip is exposed through a window area defined by the base, and the motor is assembled on the base;

[0029] The base is provided with a plurality of anti-shake conductive grooves and a plurality of independent anti-shake conductive parts. The plurality of anti-shake conductive grooves are arranged on the same side of the base. The anti-shake conductive part is arranged in the anti-shake conductive groove, one end of which is connected to the circuit board and the other end is connected to the motor.

[0030] A photosensitive chip, a circuit board, an optical lens, and a motor, wherein the photosensitive chip is connected to the circuit board, and the optical lens and the motor are arranged in the photosensitive path of the photosensitive chip;

[0031] Also includes:

[0032] a base, the motor being assembled on the base, the base being integrally formed with the circuit board, encapsulating at least a portion of the circuit board, and forming a first encapsulation body and a second encapsulation body on a first surface and a second surface of the circuit board, respectively;

[0033] The circuit board includes an external pressing part and an internal pressing part. The external pressing part extends outward from between the first packaging body and the second packaging body and is located on the outside of the base. The internal pressing part is formed around the circuit board through hole of the circuit board and extends from between the first packaging body and the second packaging body in the direction of the optical axis. The photosensitive chip is located below the internal pressing part, and the projections of the photosensitive chip and the internal pressing part in the direction of the optical axis overlap. BRIEF DESCRIPTION OF THE DRAWINGS

[0034] FIG1 is an exploded schematic diagram of a camera module according to some examples of the present application.

[0035] FIG2 is a schematic cross-sectional view of a camera module according to some examples of the present application.

[0036] FIG3 is a schematic diagram of a photosensitive component of a camera module according to some examples of the present application.

[0037] FIG4 is an exploded schematic diagram of a photosensitive component according to some examples of the present application.

[0038] FIG5A is a schematic diagram of an embodiment of a conductive structure of a motor of a camera module according to some examples of the present application.

[0039] FIG5B is a schematic diagram of another embodiment of the conductive structure of the motor of the camera module according to some examples of the present application.

[0040] Figure 6A is a cross-sectional schematic diagram at one angle of the motor and photosensitive components of the camera module according to some examples of the present application.

[0041] Figure 6B is a cross-sectional schematic diagram of the motor and photosensitive component of the camera module according to some examples of the present application at another angle.

[0042] Figure 6C is a schematic diagram of the motor and photosensitive components of the camera module according to some examples of the present application at one angle.

[0043] Figure 6D is a schematic diagram of the motor and photosensitive components of the camera module according to some examples of the present application from another angle.

[0044] FIG7 is a schematic diagram of a photosensitive component provided with a conductive structure according to some examples of the present application.

[0045] FIG8 is a schematic diagram of a motor of a camera module according to some examples of the present application.

[0046] FIG9 is an exploded schematic diagram of a motor of a camera module according to some examples of the present application.

[0047] FIG10 is a schematic diagram of the molding manufacturing of the base of the photosensitive component according to some examples of the present application.

[0048] FIG11 is a schematic diagram and a partially enlarged view of a camera module according to some examples of the present application.

[0049] FIG12 is a schematic cross-sectional view and a partially enlarged view of a camera module according to some examples of the present application.

[0050] Figure 13 is a schematic diagram and a partially enlarged view of the photosensitive component of the camera module according to some examples of the present application.

[0051] FIG14 is an exploded schematic diagram of a photosensitive component of a camera module according to some examples of the present application.

[0052] Figure 15A is a schematic diagram of a top perspective of a first package body of a camera module according to some examples of the present application.

[0053] Figure 15B is a schematic diagram of a bottom perspective of the first package body of the camera module according to some examples of the present application.

[0054] FIG16 is an exploded schematic diagram of a partial structure of a photosensitive component of a camera module according to some examples of the present application.

[0055] Figure 17 is a schematic diagram of the conductive structure of the photosensitive component and motor of the camera module according to some examples of the present application.

[0056] Figure 18A is a schematic diagram of an exemplary embodiment of a motor of a camera module according to some examples of the present application.

[0057] FIG18B is another schematic diagram of an illustrative embodiment of a motor of a camera module according to some examples of the present application.

[0058] Figure 19 is a schematic diagram of an exemplary embodiment of a motor of a camera module according to some examples of the present application. DETAILED DESCRIPTION

[0059] Below, the present application is further described in conjunction with specific implementation methods. It should be noted that, under the premise of no conflict, the various embodiments or technical features described below can be arbitrarily combined to form new embodiments.

[0060] In the description of this application, it should be noted that for directional words, such as the terms "center", "horizontal", "longitudinal", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise" and so on, the directions and positional relationships indicated are based on the directions or positional relationships shown in the accompanying drawings, which are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific direction, be constructed and operated in a specific direction, and cannot be understood as limiting the specific scope of protection of this application.

[0061] It should be noted that the terms "first", "second", etc. in the description and claims of this application are used to distinguish similar objects, and are not necessarily used to describe a specific order or sequence.

[0062] The terms "comprises" and "having" and any variations thereof in the specification and claims of this application are intended to cover non-exclusive inclusions. For example, a process, method, system, product or apparatus that includes a series of steps or elements is not necessarily limited to those steps or elements expressly listed, but may include other steps or elements not expressly listed or inherent to such process, method, product or apparatus.

[0063] The present application provides a camera module suitable for assembly into electronic equipment for imaging. The camera module's motor base is integrally molded with the photosensitive component, forming a molded base for the photosensitive component. This allows the motor base and the molded base of the photosensitive component to be integrated into a single design, i.e., a single structure. This reduces the height of the camera module and avoids the need to glue the motor base to the photosensitive component, thus simplifying assembly. Furthermore, the base is integrally molded with support arms and ball bearing grooves, further reducing the height of the camera module, reducing the number of components, and simplifying assembly.

[0064] 1 , the camera module includes a photosensitive component 10, a motor 20, and an optical lens 30 arranged along an optical axis. The optical lens 30 is held in the light sensing path of the photosensitive component 10, and the motor 20 is configured to drive at least one of the optical lens 30 and the photosensitive component 10 to move.

[0065] Among them, according to actual needs, the motor 20 can be configured to drive the optical lens 30 to move along the optical axis to adjust the focus of the camera module, realize AF function or optical zoom, etc.; the motor can be configured to drive the optical lens 30 to translate, rotate, tilt and shake in a direction perpendicular to the optical axis to compensate for the shake and realize the OIS function; the motor can be configured to drive the photosensitive chip of the photosensitive component 10 to move in a direction perpendicular to the optical axis to compensate for the shake and realize the OIS function; the motor can also be configured to drive the photosensitive chip to move along the optical axis to realize focus adjustment.

[0066] The photosensitive component generally includes a base for supporting the motor and the optical lens. The motor also includes a base as a supporting structure for the main body of the motor. The base of the motor is usually assembled to the base of the photosensitive component, and the optical lens is assembled to the motor to form a camera module. Therefore, conventional camera modules usually have two base structures.

[0067] In order to reduce the height of the camera module while ensuring or improving the driving force of the motor, the present application designs the base of the camera module motor and the base of the photosensitive component to be the same structure, and uses a molding process to integrally form the base with the photosensitive component, eliminating the need for a separate motor base structure, reducing parts, reducing height, and reducing assembly difficulty. Furthermore, the technical solution of the present application integrally forms the motor and the base's support and guide structure on the base of the photosensitive component, facilitating the assembly of the motor in the photosensitive component, while saving motor parts and reducing assembly tolerances.

[0068] Specifically, referring to the schematic diagrams of Figures 2 and 3, the photosensitive component 10 includes a circuit board 11, a photosensitive chip 12 and a base 13. The photosensitive chip 12 is mounted on the circuit board 11 and is conductively connected to the circuit board 11. The base 13 is integrally formed on the circuit board 11 and has a window area 130. The photosensitive chip 12 can be exposed through the window area 130. The photosensitive chip 12 has a photosensitive area 120 and a non-photosensitive area.

[0069] The base 13 includes a base 131, a support arm 132 and a guide portion 133, and the base 131, the support arm 132 and the guide portion 133 are integrally formed on the circuit board 14. The base 131 forms the base of the base 13, and is extended and formed on the circuit board 11 along the extension direction of the circuit board 11. It has a certain thickness, and a window area 130 is defined in the middle position of the base 131. The base 131 encapsulates the electronic components located on the circuit board 11, forming a molded base for the photosensitive component 10, protecting the electronic components of the circuit board 11, and can support other components to form a support base for other parts. The motor 20 and the optical lens 30 of the camera module are installed on the photosensitive component 10 and supported by the base 131. The base 13 forms the base of the motor 20.

[0070] After the base 13 is formed by molding, the electronic components of the circuit board 11 are encapsulated inside the base 13, so that the top of the base 13 forms the top of the photosensitive component 10, thereby improving the flatness, precision and strength of the photosensitive component 10.

[0071] The periphery of the base 131 covers the periphery of the circuit board 11. The base 131 has an upper surface 1311, and the motor 20 has a bottom surface 201. The motor 20 is assembled to the photosensitive component 10, and the bottom surface 201 is abutted against the upper surface 1311. The upper surface 1311 of the base 131 has high flatness, which facilitates assembly with the motor 20 and reduces assembly tolerance. The bottom surface 201 of the motor 20 and the circuit board 11 are opposite to each other with the base 131 spaced apart. The distance from the bottom surface 201 of the motor 20 to the circuit board 11 is mainly affected by the thickness of the base 131, so that the assembly height of the motor 20 in the photosensitive component 10 is greatly reduced, thereby reducing the height of the camera module.

[0072] The base 131 is molded over most of the circuit board 11, reducing warping and improving its flatness. In some embodiments, the base 131 extends over the circuit board 11, with a portion of the circuit board 11 exposed at the window area 130, leaving a certain distance between the base 131 and the photosensitive chip 12 mounted on the circuit board 11. That is, the base 131 is integrally molded over most of the circuit board 11, not the central area. In other embodiments, the base 131 is distributed over the non-photosensitive areas of the circuit board 11 and the photosensitive chip 12. That is, the base 131 is molded in the non-photosensitive areas of the photosensitive chip 12 and the circuit board 11, with the photosensitive area 120 exposed at the window area 130.

[0073] In the example shown in FIG. 3 , the circuit board 11 includes an outer portion 111 and an inner portion 112 . The outer portion 111 surrounds the inner portion 112 , the base 13 is molded on the outer portion 111 , and the inner portion 112 is exposed from the window area 130 .

[0074] Among them, the outline of the window area 130 is roughly square, which is adapted to the shape of the photosensitive chip 12, or the shape of the photosensitive chip 12 installed on the circuit board 11, and is convenient for the subsequent setting of the filter and the bracket; in other examples of the present application, the outline of the window area 130 is roughly circular, which is adapted to the outline shape of the motor 20 and / or the optical lens 30.

[0075] Base 131 has an outer surface 1312 and an inner surface 1313. Outer surface 1312 is formed along the outer periphery of base 131, while inner surface 1313 defines window region 130. Inner surface 1313 extends upward and outward from circuit board 11 at a predetermined angle, i.e., its extension direction has a predetermined inclination with the optical axis, facilitating demolding after molding.

[0076] Furthermore, the circuit board 11 has a circuit board through hole 110, which is connected to the window area 130 and is fully exposed in the window area 130. The photosensitive chip 12 is installed in the circuit board through hole 110, thereby reducing the installation height of the photosensitive chip 12 on the circuit board 11 and saving space.

[0077] The support arm 132 and the guide portion 133 are formed to protrude from the base portion 131 along the optical axis. The support arm 132 and the guide portion 133 are disposed adjacent to each other and are formed at a corner of the base portion 131.

[0078] The top end of the support arm 132 has a first top surface 1321, and the top end of the guide portion 133 has a second top surface 1331. The first top surface 1321 is higher than the second top surface 1331, and the second top surface 1331 is higher than the upper surface 1311 of the base 131, that is, higher than the bottom surface 201 of the motor 20 abutting against the upper surface 1311, thereby reducing the installation height of the motor 20 on the base 13.

[0079] The outer contour of the cross-section of the base 131 perpendicular to the optical axis is roughly square with four corners. There are four support arms 132 and four guide portions 133 , each of which is formed at the four corners of the base 131 .

[0080] The support arm 132 is located at the corner of the base 131, and the guide portion 133 is located on the side of the support arm 132. Furthermore, the guide portion 133 is arranged rotationally symmetrically around the optical axis, so that a guide portion 133 is arranged on each side edge of the base 131 perpendicular to the optical axis, thereby avoiding occupying too much space on one side edge.

[0081] An assembly space is defined between the support arms 132 at the four corners, which is suitable for assembling the motor 20. The height of the support arms 132 is higher than the height of the base 131, and is adapted to the height of the motor 20. The bottom of the motor 20 is provided with a lower guide portion, which cooperates with the guide portion of the base 13 to accommodate the guide member. The bottom surface 201 of the motor 20 is abutted against the upper surface 1311 of the base 131, and the top corner of the motor 20 is positioned and installed on the top of the support arm 132. The lower guide portion of the motor 20 corresponds to the guide portion 133 of the base 13, so that the motor 20 is quickly positioned and installed on the base 13, thereby improving the assembly speed between the motor 20 and the photosensitive component 10, and the photosensitive chip 12 is positioned and installed on the circuit board 11, fixed in the relative position of the window area 130, and the warping of the circuit board 11 is low, which reduces the alignment steps or alignment time during assembly and improves assembly efficiency.

[0082] The camera module further includes a housing 40 , which is assembled to the photosensitive component 10 and the motor 20 to cover the photosensitive component 10 and the motor 20 . The top end of the support arm 132 is close to or abuts against the housing 40 .

[0083] 4 and 5A , the base 13 is provided with a magnetic element 134, which is built into the base 13. In one embodiment, the magnetic element 134 is attached to the circuit board 11, and the base 13 is then molded onto the circuit board 11, so that the magnetic element 134 is built into the base 13.

[0084] The base 13 is provided with a position sensing element 135, which is built into the base 13. In one embodiment, the position sensing element 135 is attached to the circuit board 11 and electrically connected to the circuit board 11, and then the base 13 is molded on the circuit board 11 so that the position sensing element 135 is built into the base 13.

[0085] As shown in FIG5A , the magnetic element 134 and the position sensing element 135 are disposed on the circuit board 11 , and the base 13 is molded on the circuit board 11 , so that the magnetic element 134 and the position sensing element 135 are built into the base 13 , eliminating the need for subsequent assembly steps, avoiding occupying additional space, and allowing for more precise position settings.

[0086] When molding the base 13, the electronic components on the circuit board 11 and components such as the magnetic element 134 and the position sensing element 135 arranged on the circuit board 11 can be packaged together so as to be built into the base 13 to avoid being exposed on the base 13, thereby improving the flatness of the base 13, and improving the installation accuracy of the aforementioned components and reducing assembly tolerances.

[0087] 2 and 4 , the photosensitive assembly 10 further includes a bracket 14 and a filter 15. The bracket 14 is disposed in the area of ​​the circuit board 11 exposed at the window area 130 of the base 13, i.e., the inner portion 112. The base 131 of the base 13 surrounds the bracket 14, and the bracket 14 surrounds the photosensitive chip 12. In other examples, the bracket 14 is disposed around the area of ​​the circuit board 11 where the photosensitive chip 12 is mounted. In other examples, the bracket 14 is disposed around the photosensitive area 120 of the photosensitive chip 12. The filter 15 is mounted on the bracket 14, which supports the filter 15 so that the filter 15 is retained in the light sensing path of the photosensitive chip 12.

[0088] Window region 130 forms a recessed mounting space from the top of base 131, reducing the mounting height of bracket 14 and optical filter 15. Circuit board through-hole 110 is formed in inner portion 112, lowering the mounting height of photosensitive chip 12. This further reduces the height of bracket 14 while ensuring a certain distance between optical filter 15 and photosensitive chip 12.

[0089] The bracket 14 has a bracket through-hole 140, through which the photosensitive area 120 of the photosensitive chip 12 is exposed. The bracket 14 includes a step 141, a boss 142, and a recess 143. The step 141 forms a structure that supports the optical filter 15 and defines the bracket through-hole 140 around the optical axis. The boss 141 extends protrudingly from the step 141. Its height is higher than the step 141 and approaches the height of the top of the optical filter 15 placed on the step 141, thus surrounding the optical filter 15 and forming a protective structure for the optical filter 15. The recess 143 is formed on the other side of the boss 142, located between the step 141 and the photosensitive chip 12. It is recessed from the bottom of the bracket 14 toward the step 141, giving the bottom of the step 141 a certain height. This raises the position of the step 141 and creates a gap on the side of the photosensitive chip 12 where light enters.

[0090] Connecting components (e.g., gold wires, solder pads, etc.) between the photosensitive chip 12 and the circuit board 11 can be accommodated in the aforementioned gap, so that the electronic components disposed on the inner portion 112 of the circuit board 11, which is exposed through the window area 130, are shielded by the bracket 14 and the filter 15, forming a protective structure to prevent exposure. Meanwhile, the electronic components on the outer portion 111 of the circuit board 11 are built into the base 13, providing the photosensitive component 13 with a smooth mounting surface for assembling the motor 20, thereby improving assembly precision and efficiency.

[0091] In addition, the height of the top of the boss 141 matches the height of the upper surface 1311 of the base 131 , or is higher than the upper surface 1311 of the base 131 .

[0092] Furthermore, bosses 142 are formed around the filter 15 , forming avoidance spaces 1420 at the corners.

[0093] More preferably, the bracket 14 is integrally formed through a molding process, and then the bracket 14 is attached to the circuit board 11 , and the filter is mounted on the bracket 14 .

[0094] There are various embodiments for disposing the bracket 14 on the photosensitive assembly 10. In the aforementioned embodiment, the bracket 14 is attached to the window area 130 of the base 13. In one embodiment, the bracket 14 is directly disposed on the base 13, optionally by secondary molding on the base 13 through a molding process, or alternatively, the base 13 and bracket 14 are directly formed through a single molding process.

[0095] In other examples of the present application, the optical filter 15 is implemented as being directly mounted on the base 13. The base 131 is provided with a mounting portion formed at least around the photosensitive area 120 of the photosensitive chip 12, suitable for mounting the optical filter 15 so that the optical filter 15 is retained in the photosensitive path of the photosensitive chip 120.

[0096] That is, the filter 15 can be indirectly mounted on the photosensitive path of the photosensitive chip 12 through the bracket 14 , or can be directly mounted on the base 13 and held in the photosensitive path of the photosensitive chip 12 .

[0097] In addition, optionally, the photosensitive component 10 further includes a reinforcing plate 16, which is disposed at the bottom of the circuit board 11 to reinforce the structure of the circuit board 11. Referring to the schematic diagram of Figure 4, the reinforcing plate 16 is disposed on the bottom surface of the circuit board 11 opposite to the base 13. The reinforcing plate 16 is mounted on the bottom of the circuit board 11, and the photosensitive chip 12 is mounted at the circuit board through hole 110 and is supported and maintained at the circuit board through hole 110 by the reinforcing plate 16.

[0098] Next, an implementation of the assembly formed by the photosensitive component 10 and the motor 20 provided in the present application is described to further illustrate the advantage of the photosensitive component 10 provided in the present application using a molded base instead of a motor base.

[0099] Motor 20 requires electrical connection to photosensitive assembly 10, extracting electrical energy from the photosensitive assembly 10 and converting it into kinetic energy. Electrical connection is established between the circuit board 11 of photosensitive assembly 10 and motor 20 via conductive member 17. Preferably, conductive member 17 is disposed on base 13, with at least one end of conductive member 17 conductively connected to circuit board 11 and at least one end connected to motor 20. At least one conductive portion extends from motor 20 and is conductively connected to conductive member 17.

[0100] More preferably, the conductive component 17 is integrally built into the base 13, the conductive component 17 and the circuit board 11 are fixed to form a conductive connection, and the base 13 is molded on the circuit board 11 so that the conductive component 17 is built into the base 13; in one embodiment, after the base 13 is formed by molding, the conductive component 17 is installed to the base 13, and a portion of the circuit board 11 is exposed at the base 13 and conductively connected to at least one end of the conductive component 17; in one embodiment, the conductive structure can be designed in combination with the above two embodiments.

[0101] Next, an embodiment in which a portion of the circuit board 11 is exposed on the base 13 will be described. The base 13 is provided with a conducting groove, and the circuit board 11 has contacts 113 , which are exposed through the conducting groove and are suitable for conducting with the conductive member 17 .

[0102] In some examples of the present application, a conductive groove is formed by extending downward from the upper surface 1311 at the outer edge of the base 131 along the edge of the base 131 to the circuit board 11. In some examples of the present application, a conductive groove is formed by extending downward from the upper surface 1311 of the base 131 near the inner window area 130 to the circuit board 11. In some examples of the present application, a conductive groove is formed by extending downward from the first top surface 1321 of the support arm 132 to the circuit board 11.

[0103] The actuator assembly 21 leads out a conductive portion, which is aligned with the conductive groove, and connects the conductive portion and the circuit board 11 through the conductive member 17 to form a conductive connection between the motor 20 and the circuit board 11.

[0104] Next, in conjunction with the schematic diagrams of Figures 5A to 9, a schematic embodiment of a camera module using the photosensitive assembly 10 provided by this application is described. The motor 20 is mounted on the photosensitive assembly 10, and the base 13 supports the motor 20, replacing a separate motor base component, reducing the number of parts and lowering the height of the motor 20. The bottom surface 201 of the motor 20 contacts the upper surface 1311 of the base 131, and the motor 20 is assembled in the assembly space defined between the support arms 132 at the four corners.

[0105] The four corners of the motor 20 form clearance spaces 200 to allow clearance between the support arm 132 and the guide portion 133. The clearance spaces 200 are defined as a first clearance space 2001 for the support arm 132 and a second clearance space for the guide portion 133. When the motor 20 is mounted to the base 13, the support arm 132 is positioned in the first clearance space 2001 and the guide portion 133 is positioned in the second clearance space. This prevents structural interference, reduces installation height, and facilitates positioning and installation.

[0106] The motor 20 includes an actuating assembly 21, a supporting mechanism, and a suspension member. The supporting mechanism is mounted on the base 13 and is suitable for supporting the optical lens 30. The suspension member suspends the supporting mechanism on the base 13. The actuating assembly 21 drives the supporting mechanism to move relative to the base 13.

[0107] Schematically, the motor 20 includes a flexible circuit board 211, an anti-shake carrier 22, a focus carrier 23, an upper spring 24, and a lower spring 25. The flexible circuit board 211 is adapted to be electrically connected to the circuit board 11. The anti-shake carrier 22 and the focus carrier 23 form a support mechanism for the optical lens 30. The support mechanism and the base 13 move relative to each other, enabling relative movement between the optical lens 30 and the photosensitive chip 12. The relative movement between the anti-shake carrier 22 and the base 13 enables the camera module to perform shake compensation movement; the relative movement between the focus carrier 23 and the base 13 enables the camera module to perform focusing movement.

[0108] The flexible circuit board 211 is mounted on the upper surface of the base 13 and further disposed on the upper surface 1311 of the base 131. The corners of the flexible circuit board 211 are clear of the support arms 132 and the guides 133. In this embodiment, the bottom of the flexible circuit board 211 forms the bottom surface 201 of the motor 20 and contacts the upper surface 1311 of the base 131. In other embodiments, the bottom of the support mechanism of the motor 20 forms the bottom surface 201 of the motor and contacts the upper surface 1311 of the base 131.

[0109] The anti-shake carrier 22 is disposed on a side of the flexible circuit board 211 opposite to the base 13 along the optical axis. A first escape space 2001 for escaping the support arm 132 and a second escape space 2002 for escaping the guide portion 133 are provided at a corner of the anti-shake carrier 22 .

[0110] The motor 20 also includes a guide member 26, mounted between the anti-shake carrier 22 and the base 13, to guide relative movement between the two. The bottom surface of the anti-shake carrier 22, facing the second clearance space 220, forms an upper guide portion 221. The upper guide portion 221 opposes the guide portion 133, defining a space for accommodating the guide member 26. The guide member 26 is mounted on the guide portion 133, and the anti-shake carrier 22 is mounted on the base 13, supported by the guide member 26.

[0111] The actuator assembly 21 drives the anti-shake carrier 22 and the focus carrier 23 to achieve shake compensation and focus adjustment functions. The actuator assembly 21 is electrically connected to the photosensitive assembly 10 to obtain electrical energy from the photosensitive assembly 10 and convert it into kinetic energy. In one embodiment of the actuation system of the present application, the actuator assembly 21 utilizes electromagnetic actuation and includes an anti-shake coil 212 and a magnet 213. The anti-shake coil 212 and the magnet 213 interact to cause one to move relative to the other. One of the anti-shake coil 212 and the magnet 213 is mounted on the base 13, while the other is mounted on the anti-shake carrier. The interaction between the anti-shake coil 212 and the magnet 213 causes one of the base 13 and the anti-shake carrier to move relative to the other. A guide member 26 is located between the anti-shake carrier 22 and the base 13 to guide the relative movement of either the base 13 or the anti-shake carrier 22.

[0112] The upper spring plate 24 and the lower spring plate 25 form the motor suspension structure, mounted on the upper side (opposite to the photosensitive component 10 along the optical axis) and the lower side (toward the photosensitive component 10 along the optical axis) of the anti-shake carrier 22 and the focus carrier 23, respectively. The upper spring plate 24 and the lower spring plate 25 suspend the anti-shake carrier 22 and the focus carrier 23 relative to the base 13, allowing relative movement between the anti-shake carrier 22 and the focus carrier 23. The optical lens 30 is mounted on the support mechanism and supported by the anti-shake carrier 22 and the focus carrier 23.

[0113] Taking lens movement for shake compensation as an example, the actuator assembly 21 drives the anti-shake carrier 22 to move relative to the base 13 to implement the OIS function. The anti-shake coil 212 is integrated into the flexible circuit board 211 and arranged along the XY plane. The magnet 213 is located on one side of the anti-shake coil along the Z axis.

[0114] Specifically, the anti-shake coil 212 is mounted on the base 13 along the Z axis, and the magnet 213 is positioned opposite the base 13 along the Z axis. Referring to Figure 7 , the anti-shake coil 212 is formed directly on the flexible circuit board 211, minimizing its height. The magnet 213 is located within or within the mounting space created by the anti-shake carrier 22, interacting with the anti-shake coil 212 to cause the carrier 22 to move.

[0115] The guide portion 133 defines a lower guide groove 1330, within which the guide member 26 moves. The upper guide portion 221 defines an upper guide groove 2210, which accommodates at least a portion of the guide member 26 and is positioned to align with the lower guide groove 1330. The guide member 26 moves within the space defined by the upper and lower guide grooves 2210 and 1330. When the anti-shake carrier 22 is driven by the actuating assembly 21 to perform shake compensation motion, the guide member 26 guides the anti-shake carrier 22, reducing friction between the anti-shake carrier 22 and the base 13, lowering the motion resistance of the anti-shake carrier 22, improving motion parallelism, and increasing the travel range of the shake compensation motion.

[0116] The guide member 26 is implemented as a spherical object such as a ball, or as a cylindrical object, a conical object, or the like.

[0117] Optionally, at least one lower guide groove 1330 has a length along the X-axis direction, allowing the guide member 26 to move along the X-axis direction to guide the anti-shake carrier 22 and the base 13 to move relative to each other along the X-axis direction. At least one lower guide groove 1330 has a length along the Y-axis direction, allowing the guide member 26 to move along the Y-axis direction to guide the anti-shake carrier 22 and the base 13 to move relative to each other along the Y-axis direction.

[0118] 6C , the guide portions 133 are rotationally symmetrically arranged around the optical axis. A diagonal set of guide grooves 1330 has a length along the X-axis direction, and another diagonal set of guide grooves 1330 has a length along the Y-axis direction.

[0119] Optionally, the upper guide portion 2221 is rotationally symmetrically arranged around the optical axis at the bottom of the anti-shake carrier 22, and one diagonal group of upper guide grooves 2210 has a length along the X-axis direction, and another diagonal group of upper guide grooves 2210 has a length along the Y-axis direction.

[0120] 6B , a magnetic element 134 is disposed on the base 13. At least a portion of the magnetic element 134 and at least a portion of the magnet 213 are aligned along the optical axis to generate a magnetic attraction force, thereby retaining the motor 20 on the base 13 and preventing the guide member 26 from falling off. In some examples, after relative displacement between the anti-shake carrier 22 and the base 13 occurs, the magnetic attraction force between the magnetic element 134 and the magnet 213 can restore the relative position between the anti-shake carrier 22 and the base 13 to its initial state.

[0121] In one embodiment of the magnetic element 134, referring to FIG5A , it includes a first portion 1341, a second portion 1342, and a third portion 1343. The first portion 1341 and the third portion 1342 extend in perpendicular directions, and the second portion 1342 bends to connect the first portion 1341 and the third portion 1343. The first portion 1341 and the third portion 1342 are at least partially adjacent to the magnet 213 along the optical axis to generate magnetic attraction.

[0122] In one embodiment, the magnetic element 134 is positioned adjacent to a corner of the base 131. Alternatively, the magnetic element 134 is positioned adjacent to each of the four corners of the base 131. Furthermore, the two ends of the magnet interact with at least a portion of the two magnetic elements 134 to generate two opposite magnetic forces, causing movement or resetting in the two opposite directions.

[0123] The actuator assembly 21 also includes a focus coil 214. Referring to Figure 9, the focus coil 214 is arranged on the focus carrier 23. The magnet 213 and the focus coil 214 interact with each other to drive the focus carrier 23 to move. The shake compensation movement and the focus adjustment movement share the magnet to save space and reduce the size. Furthermore, the focus coil 214 is arranged around the focus carrier 23. The focus carrier 23 is arranged on the inner side of the anti-shake carrier 22 perpendicular to the optical axis. A portion of the upper spring piece 24 is assembled on the anti-shake carrier 22, and a portion is assembled to the focus carrier 23. A portion of the lower spring piece 25 is assembled on the anti-shake carrier 22, and a portion is assembled to the focus carrier 23. Through elastic deformation, the anti-shake carrier 22 and the focus carrier 23 are guided to move and / or reset.

[0124] A positioning column 1322 is provided at the top of the support arm 132, and a positioning hole 240 is provided at the corner of the upper spring piece 24. The positioning hole 240 and the positioning column 1322 cooperate with each other, so that the upper spring piece 24 is installed on the support arm 132, and then the anti-shake carrier 22 and the focus carrier 23 can be suspended on the base 13, located between the support arms 132 at the corners.

[0125] In addition, a position sensing element 135 is built into the base 13 to detect the relative position change between the supporting mechanism and the base 13 to control the motor 20 to drive the supporting mechanism and the base 13 to move relative to each other to adjust the focus and / or compensate for jitter.

[0126] Furthermore, the position sensing element 135 includes a first position sensing element 1351 and a second position sensing element 1352. The first position sensing element 1351 and the second position sensing element 1352 are configured in different directions and are positioned relative to the magnets 213 in different directions, respectively, to detect displacement in different directions, such as displacement in the X and Y directions. The position sensing element 135 is communicatively connected to the actuator assembly 21 to control the actuation of the actuator assembly 21 based on the detection results, thereby improving the flexibility and accuracy of the shake compensation movement. Figure 5A shows an example in which the first position sensing element 1351 detects displacement in the X-axis direction and the second position sensing element 1352 detects displacement in the Y-axis direction.

[0127] Figure 5A shows the conductive structure of the motor 20 and the photosensitive component 10 of the camera module of the present application. Specifically, the camera module includes a conductive component 17, which connects the photosensitive component 10 and the motor 20, specifically, the circuit board 11 and the actuator component 21.

[0128] The conductive member 17 conducts electricity between the circuit board 11 and the actuator assembly 21 to form a focus conduction circuit and an anti-shake conduction circuit, so that the motor 20 can drive the supporting mechanism and the base 13 to move relative to each other, thereby realizing the AF function and the OIS function.

[0129] In some examples, the conductive member 17 is built into the base 13. During the molding process, the conductive member 17 is built into the base 13 and is electrically connected to the circuit board 11. At least a portion of the conductive member 17 is exposed on the base 13 and electrically connected to the motor 20, thereby electrically connecting the motor 20 to the photosensitive assembly 10. In some embodiments, at least a portion of the conductive member 17 is exposed at the top of the support arm 132 and electrically connected to the upper spring plate 24. This is then electrically connected to the focus coil 214 through the upper spring plate 24, forming a focus conductive loop. At least a portion of the conductive member 17 is electrically connected to the flexible circuit board 211 at the base 131, and further electrically connected to the anti-shake coil 212, forming an anti-shake conductive loop.

[0130] In some embodiments, the flexible circuit board 211 extends a conductive portion outward from the base 131 and is directly conductively connected to the circuit board 11 to form an anti-shake conductive loop.

[0131] In some examples, referring to the schematic diagram of Figure 5A, the conductive member 17 includes a focusing conductive member 171 and an anti-shake conductive member 172. The focusing conductive member 171 is built into the support arm 132, extending from the circuit board 11 along the focusing conductive groove 1320 of the support arm 132 and exposed at the top of the support arm 132, adjacent to the positioning column 1322. The corner of the upper spring piece 24 forms a conductive terminal 241, and the conductive terminal 241 is adjacent to the positioning hole 240. The positioning hole 240 and the positioning column 1322 cooperate with each other to install the upper spring piece 24 to the support arm 132. The conductive terminal 241 serves as a conductive part and contacts the focusing conductive member 171, so that the upper spring piece 24 and the circuit board 11 are conductive.

[0132] In other words, the support arm 132 is provided with a focusing conductive groove 1320 for the built-in focusing conductive member 171. The conductive terminal 241 of the upper spring 24 forms the conductive part of the actuator assembly 21 and is aligned with the focusing conductive groove 1320. The focusing conductive member 171 conducts the circuit board 11 and the conductive terminal 241 to form a conductive loop.

[0133] A focus conductive member 171 is disposed in at least one of the support arms 132. As shown in an example in FIG6C, focus conductive members 171 are disposed in two support arms 132 at opposite corners.

[0134] The focusing conductive member 171 is a metal component. In one embodiment, the focusing conductive member 171 is first fixed to the circuit board 11, such as by soldering it to the circuit board 11. It is then molded onto the circuit board 11 to form the base 13, so that the focusing conductive member 171 is built into the base 13. One end of the focusing conductive member 171 is fixed to the circuit board 11 and is electrically connected to the circuit board 11. The other end is exposed at the top of the support arm 132 and contacts the conductive terminal 241 of the upper spring 24.

[0135] A portion of the upper spring 24 is mounted on the focus carrier 23, and the focus coil 214 is mounted on the focus carrier 224. The upper spring 24 and the focus coil 214 are electrically connected. Therefore, the circuit board 11, the focus conductive member 171, the upper spring 24, and the focus coil 214 are electrically connected, forming a focus conductive loop.

[0136] Anti-shake conductive member 172 is attached to base 131, providing electrical continuity between flexible circuit board 211 and circuit board 11. Flexible circuit board 211 and circuit board 11 are located on opposite sides of base 131 parallel to the optical axis. Base 131 is thin to minimize the conductive distance between flexible circuit board 211 and circuit board 11.

[0137] Specifically, in the example shown in FIG5A , a groove 1310 is formed on the upper surface 1311 of the base 131. The anti-shake conductive member 172 is mounted within the groove 1310. The groove 1310 extends along the upper surface 1311 of the base 131 to the outer edge of the base 131, then bends downward and extends along the outer surface 1312 of the base 131 until it reaches the circuit board 11. The portion of the groove 1310 located on the upper surface 1311 forms a receiving groove 13101, and the portion located on the outer surface 1312 forms an anti-shake conductive groove 13102.

[0138] Anti-shake conductive member 172 includes a main body 1721, a first end 1722, and a second end 1723. First end 1722 is adapted for conductive connection with flexible circuit board 211, and second end 1723 is adapted for conductive connection with circuit board 11. Main body 1721 connects first end 1722 and second end 1723. First end 1722 and main body 1721 extend into receiving slot 13101, while second end 1723 extends into anti-shake conductive slot 13102 and is conductively connected to circuit board 11.

[0139] At least a portion of circuit board 11 is exposed through anti-shake conductive groove 13102, allowing for conductive connection with the contact of conductive member 17. Second end portion 1723 of anti-shake conductive member 172 extends from anti-shake conductive groove 13102 to the exposed portion of circuit board 11, providing conductive connection with circuit board 11, thereby providing conductive connection between flexible circuit board 211 and circuit board 11. In other words, circuit board 11 includes contact 113, which is exposed through anti-shake conductive groove 13102 and adapted for conductive connection with second end portion 1723.

[0140] The anti-shake coil 212 is integrated into the flexible circuit board 211 and is connected to the circuit board 11 via the flexible circuit board 211 and the anti-shake conductive member 172 to form an anti-shake conductive loop.

[0141] Since the anti-shake conductive member 172 has a certain thickness, a groove 1310 is provided on the base 131 to accommodate the anti-shake conductive member 172 , so that the anti-shake conductive member 172 can be kept flat with the base 131 , and the flexible circuit board 211 can be laid on the base 131 , and the flexible circuit board 211 can be kept flat.

[0142] Furthermore, an anti-shake conductive member 172 is provided on the edge of the same side of the base 131 to conduct the flexible circuit board 211 and the circuit board 11. The anti-shake conductive member 172 has a smaller volume and is accommodated in the groove 1310 in an evasive manner, without occupying other space, which is conducive to reducing the volume and saving space.

[0143] 5A , flexible circuit board 211 is provided with a via 2110 that runs parallel to the optical axis and serves as a conductive portion for leading out motor 20. Via 2110 and anti-shake coil 212 are arranged to avoid spatial overlap.

[0144] The position of the conductive hole 211 matches the position of the first end 1722 of the anti-shake conductive member 172 on the base 111. After the flexible circuit board 211 is assembled to the base 131, the first end 1722 is exposed within the conductive hole 211. The first end 1722 is welded to the peripheral wall of the conductive hole 211, thereby conductively connecting the first end 1722 and the flexible circuit board 211. The second end 1723 of the anti-shake conductive member 172 is conductively connected to the circuit board 11, thus achieving electrical connection between the actuator assembly 21 and the photosensitive assembly 10.

[0145] The walls of the vias 2110 are plated with a conductive metal layer, such as copper. The leads of the anti-shake coil 212 are routed to the walls defining the vias 2110. Furthermore, there are four vias 2110 and four anti-shake conductive members 172. The four anti-shake conductive members 172 are independent of each other, and the vias 2110 and anti-shake conductive members 172 are electrically connected in a one-to-one correspondence. The anti-shake coil 212 includes two first anti-shake coils 2121 extending along the X-axis and two second anti-shake coils 2122 extending along the Y-axis. The two first anti-shake coils 2121 are connected in series, each leading to a positive terminal and a negative terminal, each leading to a respective via 2110. The two second anti-shake coils 2122 are connected in series, each leading to a positive terminal and a negative terminal, each leading to a respective via 2110.

[0146] The base 131 includes two opposing first portions 1314 arranged along the X-axis and two opposing second portions 1315 arranged along the Y-axis. The anti-shake conductive member 172 is centrally located on one of the first portions 1314 or one of the second portions 1315. Accordingly, the four conductive vias 2110 are located on the same side of the flexible circuit board 211 to centrally connect the conductive structures and reduce space. In other words, the anti-shake conductive member 172 is located on the same side of the base 13 and the base 131.

[0147] Furthermore, four vias 2110 are arranged in pairs on the flexible circuit board 211. The two groups of vias 2110 each include two adjacent vias 2110, with a certain interval between them, and are close to two adjacent corners of the flexible circuit board 211.

[0148] In another embodiment of the present application, referring to FIG5B , an anti-shake conductive groove 13102A is formed by extending downward from the upper surface 1311 of the base 131 to the circuit board 11. The anti-shake conductive groove 13102A can be implemented to be located at a non-edge position of the base 111. Furthermore, a plurality of anti-shake conductive grooves 13102A are centrally arranged in one of the first parts 1314 or one of the second parts 1315. The position of the conductive hole 2110 of the flexible circuit board 211 matches the position of the anti-shake conductive groove 13102. After the flexible circuit board 211 is assembled on the base 131, the conductive hole 2110 and the anti-shake conductive groove 13102A are aligned. The anti-shake conductive member 172A is implemented in a columnar shape, suitable for being embedded in the anti-shake conductive groove 13102A. The upper end of the anti-shake conductive member 172A is fixed to the peripheral wall defining the conductive hole 2110 and is conductively connected to the flexible circuit board 211 , and the lower end of the anti-shake conductive member 172A is conductively connected to the circuit board 11 .

[0149] In one embodiment of the anti-shake conductive member 172A, the anti-shake conductive member 172A is first soldered to the circuit board 11, and then a base 13 is molded on the circuit board 11, so that at least a portion of the anti-shake conductive member 172 is embedded in the base 13. In another embodiment, a base 13 with an anti-shake conductive groove 13102A is molded on the circuit board 11, and the contacts of the circuit board 11 are exposed in the anti-shake conductive groove 13102A. The anti-shake conductive member 172A is embedded in the anti-shake conductive groove 13102A. The upper end of the anti-shake conductive member 172 is exposed in the anti-shake conductive groove 13102 of the base 13. The cross-section of the anti-shake conductive member 172 can be exposed from the upper surface 1311, or the end of the anti-shake conductive member can be exposed from the upper surface 1311, so as to be conductively connected to the flexible circuit board 211.

[0150] The conductive hole 2110 of the flexible circuit board 211 is positioned to avoid the anti-shake coil 212. Referring to Figure 5A, two first anti-shake coils 2121 are positioned in the first portion 1314 of the base 131, extending along the X-axis. Two second anti-shake coils 2122 are positioned in the second portion 1315 of the base 131, extending along the Y-axis. For example, with the anti-shake conductive element positioned in one of the second portions 1315, the shapes of the remaining first portion 1314 and the other second portion 1315 match those of the first and second anti-shake coils 2121 and 2122. The second portion 1315, where the anti-shake conductive element is positioned, extends a certain distance toward the window area 130 relative to the remaining portions, so as to be positioned below the conductive hole 2110 of the flexible circuit board 211.

[0151] 7 , a corner of the bracket 14 is provided with an escape space 1420 to avoid the flexible circuit board 211 and avoid structural interference.

[0152] The boss 142 is divided into a plurality of raised portions 1421 by the avoidance space 1420. Each raised portion 1421 is adjacent to the two first portions 1314 and the two second portions 1315 of the base 131. One of the raised portions 1421 is adjacent to the anti-shake conductive groove 13102. The anti-shake conductive groove 13102 avoids the anti-shake coil 212 and is located on the inner side of the anti-shake coil 212, closer to the window area 130 of the base 131. This makes the corresponding second portion 1315 provided with the anti-shake conductive groove 13102 larger than the other second portion 1315 and the first portion 1314. The raised portion 1421 adjacent to the anti-shake conductive groove 13102 is larger than the other raised portions 1421.

[0153] Furthermore, position sensing elements 135 are built into the base 131, located below the anti-shake coil 212. One of the position sensing elements 135 is located near the anti-shake conductive slot 13102 and adjacent to the anti-shake conductive element 172. Furthermore, one of the position sensing elements 135 is located outside the anti-shake conductive slot 13102, and accordingly, one of the position sensing elements 135 is located between the anti-shake conductive elements 172; alternatively, one of the position sensing elements 135 is located outside the anti-shake conductive element 172. The first position sensing element 1351 and the second position sensing element 1352 are arranged along the X-axis and the Y-axis, located within one of the first portions 1314 and one of the second portions 1315. For example, in the case where the second position sensing element 1352 is located near the anti-shake conductive slot 13102, the second position sensing element 1352 is adjacent to the anti-shake conductive slot 13102 and the anti-shake conductive element 172. In the example shown in FIG. 5A , the second position sensing element 1352 is located between the anti-shake conductive elements 172. In the example shown in FIG. 5B , the second position sensing element 1352 is located outside the anti-shake conductive member 172 .

[0154] The position sensing element 135 is disposed on the circuit board 11 and is conductively connected to the circuit board 11. The anti-shake conductive member 172 is conductively connected to the circuit board 11, and the position sensing element 135 is conductively connected to the anti-shake conductive member 172 to be conductively connected to the flexible circuit board 211. In one embodiment, a wire is provided between the circuit board 11 and the position sensing element 135, wherein the first position sensing element 1351 and the second position sensing element 1352 respectively lead out a positive electrode and a negative electrode, and the two positive electrodes and the two negative electrodes are respectively conductively connected to the four anti-shake conductive members 172. The anti-shake conductive members 172 are fixed to the inner wall defining the conductive hole 2110 and are conductively connected to the flexible circuit board 211.

[0155] The position sensing element 135 and the anti-shake conductive circuit share conductive components, simplifying the design of the conductive structure and reducing leads. In addition, the base 13 replaces the motor base, shortening the distance between the position sensing element 135 and the motor 20, facilitating the design of the conductive structure.

[0156] The base 13 of the present application is formed on the circuit board 11 in one step using a molding process. During manufacturing, referring to the schematic diagram of Figure 10, a flow channel 501 is provided on the side of the circuit board of the photosensitive component panel. Molding material is injected into the molding space 502 formed by the upper mold and the lower mold through the flow channel to form the base 13. It is understood that the installation of the photosensitive chip 12 can be completed before the molding process, or it can be installed after the molding process.

[0157] 4 , the circuit board 11 is provided with a circuit board through hole 110, through which the photosensitive chip 12 can be exposed. The reinforcing plate 16 covers the circuit board 11 and the photosensitive chip 12 to strengthen the support. The reinforcing plate 16 can be implemented to include a reinforcing element covering the circuit board 11 and a reinforcing element covering the circuit board 11 and the photosensitive chip 12. The photosensitive chip 12 is conductively connected to the connector provided on the circuit board 11 to fix and conduct with the circuit board 11. The circuit board 11 also includes a lead-out connecting strip 114 and a connector 115, which are connected to external electronic components. The reinforcing plate 1616 may also include a reinforcing element to strengthen the connector 115.

[0158] The base 13 of the photosensitive component 10 of the present application replaces the independent motor base component and is integrally formed on the circuit board 11 using a molding process, avoiding the glue reliability problem caused by the adhesive assembly of the motor base. While reducing the height of the camera module, due to the characteristics of the molding process, the molded base 13 has high temperature resistance and strong impact resistance, which can greatly enhance the reliability of the camera module.

[0159] While molding the base 13, the support arm 132 and the guide portion 133 are integrally formed to form a support and guide structure for the motor, saving assembly steps and reducing assembly difficulty. The support arm 132 forms the mounting support structure for the motor's shrapnel, avoiding the need to separately set up a mounting structure for the shrapnel, and a conductive structure is provided inside the support arm 132 to directly connect the shrapnel and the circuit board of the photosensitive component. The guide portion 133 forms a ball guide structure for the ball motor. The molding process is used to reduce the height, improve the flatness and precision, improve the accuracy of the jitter compensation movement, reduce the movement resistance, and increase the jitter compensation movement stroke.

[0160] The electronic components, magnetic elements 134, position sensing elements 135, etc. of the circuit board 11 are integrally encapsulated by the base 13, making the surface of the base 13 smoother, reducing assembly steps, improving assembly efficiency, saving internal space, improving positioning accuracy, and also helping to improve the performance of the camera module.

[0161] The present application provides a camera module suitable for assembly into electronic equipment for imaging. The camera module's motor base is integrally molded with the photosensitive component, forming a molded base for the photosensitive component. This allows the motor base and the molded base of the photosensitive component to be integrated into a single design, i.e., a single structure. This reduces the height of the camera module and avoids the need to glue the motor base to the photosensitive component, thus simplifying assembly. Furthermore, the base is integrally molded with support arms and ball bearing grooves, further reducing the height of the camera module, reducing the number of components, and simplifying assembly.

[0162] 11 , the camera module includes a photosensitive component 10a, a motor 20a, and an optical lens 30a arranged along an optical axis. The motor 20a and the optical lens 30a are arranged in the light-sensing path of the photosensitive component 10a, and the motor 20a is configured to drive at least one of the optical lens 30a and the photosensitive component 10a to move.

[0163] Among them, according to actual needs, the motor 20a can be configured to drive the optical lens 30a to move along the optical axis to adjust the focus of the camera module, realize AF function or optical zoom, etc.; the motor can be configured to drive the optical lens 30a to translate, rotate, tilt and shake in a direction perpendicular to the optical axis to compensate for the shake and realize the OIS function; the motor can be configured to drive the photosensitive chip of the photosensitive component 10a to move in a direction perpendicular to the optical axis to compensate for the shake and realize the OIS function; the motor can also be configured to drive the photosensitive chip to move along the optical axis to realize focus adjustment.

[0164] The photosensitive component generally includes a base for supporting the motor and the optical lens. The motor also includes a base as a supporting structure for the main body of the motor. The base of the motor is usually assembled to the base of the photosensitive component, and the optical lens is assembled to the motor to form a camera module. Therefore, conventional camera modules usually have two base structures.

[0165] In order to reduce the height of the camera module while ensuring or improving the driving force of the motor, this application designs the base of the camera module motor and the base of the photosensitive component to be the same structure, and uses a molding process to integrally form the base with the photosensitive component, eliminating the need for an independent motor base structure, reducing parts, reducing height, and reducing assembly difficulty.

[0166] Furthermore, the technical solution of this application integrates the motor mounting portion and the filter mounting portion into the base of the photosensitive component, eliminating the motor base and filter holder, saving multiple parts, reducing assembly steps, and further reducing the height of the base. The motor mounting portion integrates the support structure and guide structure, further reducing motor assembly parts and steps, and improving assembly precision and efficiency.

[0167] Specifically, referring to the schematic diagrams of Figures 11 to 19, the implementation of the photosensitive component 10a of the present application is explained.

[0168] The photosensitive component 10a includes a circuit board 11a and a photosensitive chip 12a, and the photosensitive chip 12a and the circuit board 11a are conductively connected.

[0169] Photosensitive assembly 10a also includes a base 13a, which is integrally formed with circuit board 11a to encapsulate at least a portion of circuit board 11a. Base 13a includes a first encapsulating body 131a and a second encapsulating body 132a. First encapsulating body 131a is formed on first surface 1101a of circuit board 11a, and second encapsulating body 132a is formed on second surface 1102a of circuit board 11a.

[0170] The first surface 1101a is the upper surface of the circuit board 11a, facing the motor 20a. The second surface 1102a is the lower surface of the circuit board 11a, opposite to the first surface 1101a.

[0171] That is, the base 13a forms a two-layer molded structure, and the circuit board 11a is placed between the two-layer molded structures, with both the top and bottom being molded, so that the structural strength of the circuit board 11a is higher and the warping is lower.

[0172] Referring to Figures 11 to 15A , a first package body 131a is integrally formed on the first surface 1101a of the circuit board 11a. First package body 131a integrally forms a base 1311a, a filter mounting portion 1312a, a support arm 1313a, and a guide portion 1314a. Base 1311a forms the bottom of first package body 131a. Filter mounting portion 1312a is formed on the inner periphery of base 1311a for mounting filter 14a. Support arm 1313a protrudes from a corner of base 1311a. Guide portion 1314a and support arm 1313a are positioned adjacent to each other.

[0173] The base 1311a, support arms 1313a, and guide 1314a form a motor mounting portion. The motor 20a is mounted in the mounting space defined between the support arms 1313a, with the bottom resting against the base 1311a. The camera module also includes a filter 14a, which is mounted on the filter mounting portion 1312a.

[0174] The circuit board 11a has a circuit board through hole 110a. The bottom shape of the first package body 131a is adapted to the shape of the circuit board 11a, and a first window area 1310a is defined around the circuit board through hole 110a.

[0175] In some examples, the first window area 1310a is roughly square in shape; in some examples, the first window area 1310a is circular in shape.

[0176] The base 1311a encapsulates most of the area of ​​the circuit board 11a and covers most of the area of ​​the first surface 1101a. The electronic components (such as resistors, capacitors, etc.) arranged on the first surface 1101a of the circuit board 11a are encapsulated in the base 1311a.

[0177] The base 1311a has a top surface 13111a and an inner peripheral side surface 13112a. The bottom surface 201a of the motor 20a is pressed against the top surface 13111a, and the inner peripheral side surface 13112a faces the first window area 1310a.

[0178] The filter mounting portion 1312a extends a certain distance from the inner peripheral side surface 13112a of the motor mounting portion along the first surface 1101a of the circuit board 11a toward the optical axis, forming a stepped structure located on the inner periphery of the base 1311a. The top of the filter mounting portion 1312a is lower than the top surface 13111a of the base 1311a, forming a sunken mounting area 13120a. The filter 14a is disposed in the mounting area 13120a, with the bottom surface of the filter 14a resting against the top of the filter mounting portion 1312a to securely connect the filter mounting portion 1312a and the filter 14a, thereby securing the filter 14a to the first package body 131a.

[0179] The filter mounting portion 1312a has a certain height to raise the height of the filter 14a to a certain extent to avoid contact with the circuit board 11a. The top of the filter mounting portion 1312a is lower than the top surface 13111a of the base 1311a, and the height difference between the two is greater than the height of the filter 15a, so that the base 1311a is higher than the filter 14a, surrounding the outer peripheral side of the filter 14a, forming a protective structure for the filter 14a to avoid impact and improve reliability.

[0180] The height of the filter mounting portion 1312a is lower than the bottom height of the motor mounting portion, and the filter 14a is lower than the bottom surface 201a of the motor 20a, thereby avoiding interference between the filter 14a and the motor 20a.

[0181] In summary, the first package body 131a integrally forms a motor mounting portion and a filter mounting portion on the upper surface of the circuit board 11a, thereby eliminating the need for an independent motor base structure and a filter bracket structure, reducing assembly steps, and lowering the mounting height of the motor and filter, thereby reducing the height of the camera module. In addition, the first package body 131a is integrally formed on the circuit board 11a using a molding process. Based on the characteristics of the molding process, the first package body 131a has a high flatness characteristic. The motor 20a and the subsequent optical lens 30a are assembled with the first package body 131a as the base, reducing the inclination of the motor 20a and the optical lens 30a relative to the photosensitive component, which helps to achieve a function similar to active alignment. In addition, the first package body 131a provides a high-flatness mounting surface for the motor 20a and the filter 14a, which can reduce the tilt of the camera module and the assembly tolerance, and the assembly position is more precise, eliminating the need for assembly calibration and improving assembly accuracy.

[0182] 11 to 14 and 15B , the second package body 132 a is integrally formed on the second surface 1102 a of the circuit board 11 a to further improve the strength of the circuit board 11 a and reduce deformation of the circuit board 11 a .

[0183] The second package body 132a has a second window region 1320a. The opening size of the second window region 1320a is larger than the opening size of the circuit board through hole 110a, so that a portion of the circuit board 11a surrounding the circuit board through hole 110a is exposed in the second window region 1320a.

[0184] A first window area 1310 a , a circuit board through hole 110 a and a second window area 1320 a are formed in sequence from top to bottom along the optical axis.

[0185] The photosensitive chip 12a is disposed in the second window area 1320a and is located below the circuit board through hole 110a. Its installation height is lower than that of the circuit board 11a, so that the photosensitive chip 12a is sunken relative to the circuit board 11a, thereby reducing the height of the photosensitive chip 12a.

[0186] The photosensitive chip 12a includes a photosensitive area 1201a and a non-photosensitive area 1202a. The photosensitive area 1201a is exposed through the first window area 1310a, the circuit board through hole 110a and the second window area 1320a.

[0187] As shown in Figure 12, conductive portion 11021a is provided in the area surrounding circuit board through hole 110a on second surface 1102a. Conductive portion 11021a is exposed from second window region 1320a. Conductive portion 11021a faces non-photosensitive region 1202a, and their projections along the optical axis at least partially overlap. This means that the projections of circuit board 11a and photosensitive chip 12a along the optical axis overlap.

[0188] The photosensitive chip 12a is electrically connected to the circuit board 11a. Connecting elements are provided in the non-photosensitive area 1202a and the conductive portion 11021a, and connectors are provided for electrical connection. Alternatively, the photosensitive chip 12a and the circuit board 11a are connected using a flip chip (FC) process.

[0189] That is, the photosensitive chip 12a is located below the circuit board 11a, so that the photosensitive chip 12a and the circuit board 11a are electrically connected through the flip-chip process. The projections of the photosensitive chip 12a and the circuit board 11a along the optical axis overlap, which helps to reduce the size of the circuit board 11a in the direction perpendicular to the optical axis, and thus reduce the size of the photosensitive component 10a in the direction perpendicular to the optical axis.

[0190] Furthermore, photosensitive chip 12a is positioned beneath circuit board 11a, allowing it to be installed last. A base 13a is molded onto circuit board 11a. Base 13a serves as the base for motor 20a and is assembled with its components for testing motor 20's performance. Testing motor 20a's performance requires removing photosensitive chip 12a to avoid damage and minimize losses. After testing is complete, photosensitive chip 12a is assembled onto base 13a and flip-chip bonded to circuit board 11a.

[0191] Furthermore, the second packaging body 132a has a certain height, which is higher than the height of the photosensitive chip 12a, forming a protection structure for the photosensitive chip 12a.

[0192] The second package body 132a has a second inner side surface 1321a, and there is a certain distance between the second inner side surface 1321a and the photosensitive chip 12a. In other words, the second window area 1320a of the second package body 132a is larger than the photosensitive chip 12a, thereby avoiding interference fit with the photosensitive chip 12a when installing the photosensitive chip 12a, and also avoiding damage to the photosensitive chip 12a.

[0193] A reinforcing plate 15a is provided at the bottom of the second package body 132a, covering the second package body 132a and the second window area 1320a to further strengthen the circuit board 11a. The reinforcing plate 15a is provided after the photosensitive chip 12a is installed to cover the second package body 132a and the photosensitive chip 12a.

[0194] 11, 12 and 16, the structure of the motor mounting portion of the base 13a is described in detail. The motor mounting portion includes an integrally formed base portion 1311a, a support arm 1313a and a guide portion 1312a.

[0195] The base 1311a forms the bottom of the motor mounting portion. The cross-section of the base 1311a perpendicular to the optical axis has a generally square outer profile with four corners. There are four support arms 1313a and four guides 1314a, each formed at one of the four corners of the base 1311a.

[0196] The support arm 1313a is located at the corner of the base 1311a, and the guide portion 1314a is located on the side of the support arm 1313a. Furthermore, the guide portion 1314a is arranged rotationally symmetrically around the optical axis, so that a guide portion 1314a is arranged on each side edge of the base 1311a perpendicular to the optical axis, thereby avoiding occupying too much space on one side edge.

[0197] An assembly space is defined between the support arms 1313a at the four corners, suitable for assembling the motor 20a. The height of the support arms 1313a is higher than the height of the base 1311a, and is compatible with the height of the motor 20a. The bottom of the motor 20a is provided with a lower guide portion, which cooperates with the guide portion of the base 13a to accommodate the guide member. The bottom surface 201a of the motor 20a is abutted against the top surface 13111a of the base 1311a, and the top corners of the motor 20a are positioned and installed on the top of the support arms 1313a. The lower guide portion of the motor 20a corresponds to the guide portion 1314a of the base 13a, so that the motor 20a can be quickly positioned and installed on the base 13a, thereby improving the assembly speed between the motor 20a and the photosensitive component 10a, and the photosensitive chip 12a is positioned and installed on the circuit board 11a, and the warping of the circuit board 11a is low, which reduces the alignment steps or alignment time during assembly and improves assembly efficiency.

[0198] The height of the support arm 1313a is higher than that of the guide portion 1314a, determining the installation height of the top of the motor 20a. When the first package body 131a is formed in one step, the support arm 1313a also needs to be formed in one step. Therefore, the outer surface 13131a of the support arm 1313a is designed to extend continuously and smoothly.

[0199] The housing 40a of the camera module is mounted on a base 13a to cover the motor 20a. The base 13a needs to be designed with a supporting structure for the housing 40a. Furthermore, a step 13113a is provided on the outside of the base 13a to form a supporting structure for the housing 40a. Furthermore, the step 13113a and the support arm 1313a need to be designed to avoid the step 13113a extending to the outer surface 13131a of the support arm 1313a. Therefore, steps 13113a are formed around the base 13a, and channels 100a are provided between adjacent steps 13113a to avoid the support arm 1313a.

[0200] Specifically, the circuit board 11a includes a main body 111a and corner portions 112a. The corner portions 112a are formed at the four corners of the main body 111a. The outer edge of the main body 111a protrudes away from the optical axis relative to the outer edge of the corner portions 112a to form an air avoidance space 1120a on the outside of the corner portions 112a.

[0201] The corners of the first and second package bodies 131a and 132a correspond to the shape of the circuit board 11a to form first and second spaces 13100a and 13200a, respectively. The outer peripheral side surface 1103a of the main body 111a is exposed between the first and second package bodies 131a and 132a.

[0202] The support arm 1313a is located above the corner portion 112a. The outer surface 13131a of the support arm 1313a is flush with the outer edge of the corner portion 112a. The base 1311a extends upward from the main body 111a, and the outer peripheral side of the base 1311a is flush with the outer peripheral side surface 1103a of the main body 111a. A step 13113a protruding outward is formed on the periphery of the base 1311a. The outermost surface of the step 13113a forms the first outer peripheral side surface 1315a of the first package body 131a. The first outer peripheral side surface 1315a is flush with the outer peripheral side surface 1103a of the main body 111a. The step 13113a is formed on the periphery of the base 1311a and / or the periphery of the base 1311a and the guide portion 1314a.

[0203] The bottom of the housing 40a is pressed against the step 13113a. Further, as shown in Figure 12, the bottom surface 401a of the housing is pressed against the step 13113a. The steps 13113a are located around the base 1311a, and the first space 13100a is located between two adjacent steps 13113a.

[0204] The outer contour of the second package body 132a matches the outer contours of the circuit board 11a and the first package body 131a. A second space 13200a is formed at the corner of the second package body 132a. The second outer side surface 1322a of the second package body 132a is flush with the outer side surface 1103a of the main body 111a.

[0205] Correspondingly, the outer peripheral contour shape of the reinforcing plate 15a is adapted to the outer peripheral contour shape of the circuit board 11a, the first package body 131a and the second package body 132a, forming a third air avoidance space 150a at the corner of the reinforcing plate 15a, and the third outer peripheral side surface 151a of the reinforcing plate 15a is flush with the outer peripheral side surface of the main body 111a.

[0206] The corners of the photosensitive component 10a form a first air-avoidance space 13100a, an air-avoidance space 1120a, a second air-avoidance space 13200a, and a third air-avoidance space 150a from top to bottom along the optical axis. Finally, the corners of the photosensitive component 10a form a channel 100a. The channel 100a is located between adjacent steps 13113a and extends from the upper surface of the photosensitive component 10a (the top surface 13111a of the base 1311a) to the lower surface of the photosensitive component 10a (the lower surface of the reinforcing plate 15a).

[0207] The housing bottom surface 401a of the housing 40a abuts against the step 13113a, and the bottom surface 201a of the motor 20a abuts against the top surface 13111a of the base 1311a.

[0208] Channel 100a is formed around the periphery of support arm 1313a. Alternatively, first air-avoidance space 13100a is formed around the periphery of support arm 1313a. In some examples, the outer edge of corner 112a is encapsulated by first encapsulation body 131a. Specifically, first encapsulation body 131a covers the outer edge of corner 112a of circuit board 11a.

[0209] When molding the first package body 131a, the support arm 1313a is formed in one step above the corner 112a of the circuit board 11a. The outer surface 1313a of the support arm 1313a is configured to extend continuously and smoothly to allow the molding material to be fully filled, thereby allowing the support arm 1313a to be molded in one step.

[0210] As shown in Figures 11 and 12, and Figures 15A and 15B, circuit board 11a includes an outer press-fit portion 113a and an inner press-fit portion 114a. A base 13a is formed in the space between the outer press-fit portion 113a and the inner press-fit portion 114a. Furthermore, a first package body 131a is integrally formed on a first surface 1101a between the outer press-fit portion 113a and the inner press-fit portion 114a, and a second package body 132a is integrally formed on a second surface 1102a between the outer press-fit portion 113a and the inner press-fit portion 114a.

[0211] The external press-fit portion 113a extends outward from the edge of one side of the main body 111a. After the first and second encapsulating bodies 131a and 132a are molded, the external press-fit portion 113a extends between the first and second encapsulating bodies 131a and 132a and is located on one side of the base 13a. Furthermore, the external press-fit portion 113a extends outward from between the step 13113a and the second outer peripheral side surface 1322a of the second encapsulating body 132a.

[0212] The photosensitive component 10a also includes a connecting component 16a, one end of which is connected to the external pressing portion 113a and is conductively connected to the circuit board 11a, and the other end is suitable for connecting to an external device to conduct the circuit board 11a and the external device. The connecting component 16a includes a connecting strip 161a and a connector 162a. One end of the connecting strip 161a is connected to the external pressing portion 113a, or in other words, the connecting strip 161a extends outward from the external pressing portion 113a and is conductively connected to the circuit board 11a. The connector 162a is connected to the other end of the connecting strip 161a and is suitable for connecting to an external device. The external device is an electronic component of an electronic device. The camera module is installed in the electronic device, and the external device and the circuit board 11a are conductively connected through the connecting component 16a, so that the camera module is connected to the electronic device.

[0213] Further, the connector 162a is provided with a connector reinforcement plate 163a adapted to reinforce the structure of the connector 162a.

[0214] As shown in Figures 12 and 15A, the opening of first window region 1310a is larger than the opening of circuit board through-hole 110a. A portion of circuit board 11a surrounding circuit board through-hole 110a is exposed in first window region 1310a. A portion of first surface 1101a of circuit board 11a is exposed in first window region 1310a, forming a first inner press-fit portion 1141a.

[0215] In other words, when forming the first package body 131a, the mold abuts against the first inner pressing portion 1141a and the outer pressing portion 113a, and forms a first pressing space between the circuit board 11a and the mold at the first surface 1101a between the first inner pressing portion 1141a and the outer pressing portion 113a, so as to integrally form the first package body 131a on the first surface 1101a of the circuit board 11a.

[0216] The first packaging body 131 a is integrally formed with a motor mounting portion and a filter mounting portion 1312 a . The filter mounting portion 1312 a is located between the motor mounting portion and the first inner pressing portion 1141 a .

[0217] As shown in Figures 12 and 15B , the exposed portion of second surface 1102a of circuit board 11a faces second window region 1320a, forming second inner press-fit portion 1142a. In other words, when forming second package body 132a, the mold abuts against outer press-fit portion 113a and second inner press-fit portion 1142a, forming a second press-fit space on second surface 1102a between outer press-fit portion 113a and second inner press-fit portion 1142a, thereby integrally forming second package body 132a on second surface 1102a of circuit board 11a.

[0218] The conductive portion 11021a is disposed on the second inner press-fit portion 1142a, and the projection of the second inner press-fit portion 1142a along the optical axis is larger than the projection of the first inner press-fit portion 11021a along the optical axis.

[0219] Furthermore, the projection of the second inner press-fit portion 1142a along the optical axis covers the projection of the first inner press-fit portion 11021a along the optical axis. The projection of the first package body 131a along the optical axis covers the projection of the second package body 132a along the optical axis.

[0220] In one example, after forming the first package body 131 a , a connector is provided on the conductive portion 11021 a , and then a second package body 132 a is formed on the second surface 1102 a to obtain the base 13 a .

[0221] 14 and 17 , the base 13a is provided with a magnetic element 133a, which is built into the base 13a. In one embodiment, the magnetic element 133a is attached to the circuit board 11a, and the base 13a is then molded onto the circuit board 11a, so that the magnetic element 133a is built into the base 13a.

[0222] The base 13a is provided with a position sensing element 134a, which is built into the base 13a. In one embodiment, the position sensing element 134a is attached to the circuit board 11a and electrically connected to the circuit board 11a. The base 13a is then molded onto the circuit board 11a, so that the position sensing element 134a is built into the base 13a.

[0223] The magnetic element 133a and the position sensing element 134a are arranged on the first surface 1101a of the circuit board 11a. The first package body 131a is molded on the circuit board 11a, so that the magnetic element 133a and the position sensing element 134a are built into the base 13a, eliminating subsequent assembly steps, avoiding occupying additional space, and making the position setting more precise.

[0224] When molding the base 13a, the electronic components on the circuit board 11a, and components such as the magnetic element 133a and the position sensing element 134a arranged on the circuit board 11a can be packaged together so as to be built into the base 13a to avoid being exposed on the base 13a, thereby improving the flatness of the base 13a, and improving the installation accuracy of the aforementioned components and reducing assembly tolerances.

[0225] Next, the structure of the motor 20 a of the present application will be further described with reference to the schematic diagrams of FIG. 11 to FIG. 19 .

[0226] As shown in Figure 18A, the four corners of motor 20a form clearance spaces 200a to accommodate support arm 1313a and guide portion 1314a. Clearance spaces 200a are defined as a first clearance space 2001a for support arm 1313a and a second clearance space 2002a for guide portion 1314a. When motor 20a is mounted to base 13a, support arm 1313a is positioned in first clearance space 2001a, and guide portion 1314a is positioned in second clearance space. This prevents structural interference, reduces installation height, and facilitates positioning and installation.

[0227] The motor 20a includes an actuating assembly 21a, a supporting mechanism, and a suspension member. The supporting mechanism is mounted on the base 13a and is suitable for supporting the optical lens 30a. The suspension member suspends the supporting mechanism from the base 13a. The actuating assembly 21a drives the supporting mechanism, causing the supporting mechanism to move relative to the base 13a.

[0228] Schematically, referring to Figure 19, the motor 20a includes a flexible circuit board 211a, an anti-shake carrier 22a, a focus carrier 23a, an upper spring plate 24a and a lower spring plate 25a. The flexible circuit board 211a is suitable for being conductively connected to the circuit board 11a. The anti-shake carrier 22a and the focus carrier 23a form a supporting mechanism for the optical lens 30a. The supporting mechanism and the base 13a move relative to each other, so that the optical lens 30a and the photosensitive chip 12a move relative to each other. Among them, the anti-shake carrier 22a and the base 13a move relative to each other to enable the camera module to perform shake compensation movement; the focus carrier 23a and the base 13a move relative to each other to enable the camera module to perform focusing movement.

[0229] As shown in Figures 12 and 17 , the flexible circuit board 211a is mounted on the upper surface of the base 13a and further disposed on the top surface 13111a of the base 1311a. The corners of the flexible circuit board 211a are positioned away from the support arms 1313a and the guides 1314a. In this embodiment, the bottom of the flexible circuit board 211a forms the bottom surface 201a of the motor 20a and contacts the top surface 13111a of the base 1311a. In other embodiments, the bottom of the support mechanism of the motor 20a forms the bottom surface 201a of the motor and contacts the top surface 13111a of the base 1311a.

[0230] The anti-shake carrier 22a is disposed on the side of the flexible circuit board 211a opposite to the base 13a along the optical axis. A first escape space 2001a for escaping the support arm 1313a and a second escape space 2002a for escaping the guide portion 1314a are set at the corner of the anti-shake carrier 22a.

[0231] As shown in Figure 18A, the motor 20a also includes a guide member 26a, which is mounted between the anti-shake carrier 22a and the base 13a to guide relative movement between the two. The bottom of the anti-shake carrier 22a, facing the surface of the second avoidance space 2002a, forms an upper guide portion 221a. The upper guide portion 221a and the guide portion 1314a are positioned opposite each other, defining a space for accommodating the guide member 26a. The guide member 26a is mounted on the guide portion 1314a, and the anti-shake carrier 22a is mounted on the base 13a and supported by the guide member 26a.

[0232] The actuating assembly 21a drives the anti-shake carrier 22a and the focus carrier 23a to move to achieve the shake compensation function and the focus adjustment function. The actuating assembly 21a is electrically connected to the photosensitive assembly 10a to obtain electrical energy from the photosensitive assembly 10a and convert it into kinetic energy. In one embodiment of the actuation of the present application, as shown in Figure 17, the actuating assembly 21a adopts an electromagnetic actuation form, including an anti-shake coil 212a and a magnet 213a. The anti-shake coil 212a and the magnet 213a interact with each other, causing one of them to move relative to the other. One of the anti-shake coil 212a and the magnet 213a is installed on the base 13a, and the other is installed on the anti-shake carrier. Under the interaction between the anti-shake coil 212a and the magnet 213a, one of the base 13a and the anti-shake carrier moves relative to the other. The guide member 26 a is located between the anti-shake carrier 22 a and the base 13 a , and guides one of the base 13 a and the anti-shake carrier 22 a to move relative to the other.

[0233] The upper spring plate 24a and the lower spring plate 25a form the motor suspension structure, respectively mounted on the upper side (opposite to the photosensitive component 10a along the optical axis) and the lower side (toward the photosensitive component 10a along the optical axis) of the anti-shake carrier 22a and the focus carrier 23a. The upper spring plate 24a and the lower spring plate 25a suspend the anti-shake carrier 22a and the focus carrier 23a relative to the base 13a, allowing relative movement between the anti-shake carrier 22a and the focus carrier 23a. The optical lens 30a is mounted on the support structure and supported by the anti-shake carrier 22a and the focus carrier 23a.

[0234] Taking lens movement for shake compensation as an example, actuator assembly 21a drives the anti-shake carrier 22a to move relative to base 13a to implement OIS. Anti-shake coil 212a is integrated into flexible circuit board 211a and arranged along the XY plane. Magnet 213a is positioned to one side of the anti-shake coil along the Z axis.

[0235] Specifically, the anti-shake coil 212a is mounted on the base 13a along the Z axis, with the magnet 213a facing the base 13a along the Z axis. The anti-shake coil 212a is directly molded onto the flexible circuit board 211a, minimizing its height. The magnet 213a is located within or within the mounting space created by the anti-shake carrier 22a, interacting with the anti-shake coil 212a to cause the carrier 22a to move.

[0236] Guide portion 1314a defines a lower guide groove 13140a, within which guide member 26a moves. Upper guide portion 221a defines an upper guide groove 2210a, which accommodates at least a portion of guide member 26a and is positioned to align with lower guide groove 13140a. Guide member 26a moves within the space defined by upper and lower guide grooves 2210a and 13140a. When the anti-shake carrier 22a is driven by actuator assembly 21a to perform shake compensation motion, guide member 26a guides the motion of the anti-shake carrier 22a, reducing friction between the anti-shake carrier 22a and base 13a, lowering the motion resistance of the anti-shake carrier 22a, improving motion parallelism, and increasing the shake compensation travel.

[0237] The guide member 26a is implemented as a spherical object such as a ball, or as a cylindrical object, a conical object, or the like.

[0238] Optionally, at least one lower guide groove 13140a has a length along the X-axis, allowing the guide member 26a to move along the X-axis to guide the anti-shake carrier 22a and the base 13a in relative movement along the X-axis. At least one lower guide groove 13140a has a length along the Y-axis, allowing the guide member 26a to move along the Y-axis to guide the anti-shake carrier 22a and the base 13a in relative movement along the Y-axis.

[0239] The guide portions 1314a are rotationally symmetrically arranged around the optical axis. A diagonal group of guide grooves 13140a has a length along the X-axis direction, and another diagonal group of guide grooves 13140a has a length along the Y-axis direction.

[0240] Optionally, the upper guide portions 221a are rotationally symmetrically arranged about the optical axis at the bottom of the anti-shake carrier 22a. A diagonal set of upper guide grooves 2210a has a length along the X-axis, while another diagonal set of upper guide grooves 2210a has a length along the Y-axis. Furthermore, the upper guide grooves 221a and the lower guide grooves 13140a form a cross-track groove.

[0241] The magnetic element 133a is disposed on the base 13a. At least a portion of the magnetic element 133a and at least a portion of the magnet 213a are aligned along the optical axis to generate a magnetic attraction force, thereby retaining the motor 20a on the base 13a and preventing the guide member 26a from falling off. In some examples, after relative displacement between the anti-shake carrier 22a and the base 13a occurs, the magnetic attraction force between the magnetic element 133a and the magnet 213a can restore the relative position between the anti-shake carrier 22a and the base 13a to its initial state.

[0242] The actuator assembly 21a also includes a focus coil 214a, which is arranged on the focus carrier 23a. The magnet 213a and the focus coil 214a interact with each other to drive the focus carrier 23a to move. The shake compensation movement and the focus adjustment movement share the magnet to save space and reduce the size. Furthermore, the focus coil 214a is arranged around the focus carrier 23a. The focus carrier 23a is arranged on the inner side of the anti-shake carrier 22a perpendicular to the optical axis. A portion of the upper spring piece 24a is assembled to the anti-shake carrier 22a, and a portion is assembled to the focus carrier 23a. A portion of the lower spring piece 25a is assembled to the anti-shake carrier 22a, and a portion is assembled to the focus carrier 23a. Through elastic deformation, the anti-shake carrier 22a and the focus carrier 23a are guided to move and / or reset.

[0243] As shown in Figure 18B, a positioning column 13132a is provided at the top of the support arm 1313a, and a positioning hole 240a is provided at the corner of the upper spring piece 24a. The positioning hole 240a and the positioning column 13132a cooperate with each other, so that the upper spring piece 24a is installed on the support arm 1313a, and then the anti-shake carrier 22a and the focusing carrier 23a can be suspended on the base 13a, located between the support arms 1313a at the corners.

[0244] In addition, the position sensing element 134a is built into the base 13a to detect the relative position change between the supporting mechanism and the base 13a to control the motor 20a to drive the supporting mechanism and the base 13a to move relative to each other to adjust the focus and / or compensate for jitter.

[0245] Furthermore, the position sensing element 134a includes a first position sensing element 1341a and a second position sensing element 1342a. The first position sensing element 1341a and the second position sensing element 1342a are configured in different directions and are positioned relative to the magnet 213a in different directions, respectively, to detect displacement in different directions, such as displacement in the X and Y directions. The position sensing element 134a is communicatively connected to the actuator assembly 21a to control the actuation of the actuator assembly 21a based on the detection results, thereby improving the flexibility and accuracy of the shake compensation movement. Figure 17 shows an example in which the first position sensing element 1341a detects displacement in the X-axis direction and the second position sensing element 1342a detects displacement in the Y-axis direction.

[0246] The motor 20a needs to be electrically connected to the photosensitive component 10a, obtaining electrical energy from the photosensitive component 10a and converting it into kinetic energy. The camera module includes a conductive member 17a, which electrically connects the circuit board 11a of the photosensitive component 10a and the motor 20a. Preferably, the conductive member 17a is disposed on the base 13a, with at least one end of the conductive member 17a electrically connected to the circuit board 11a and at least one end connected to the motor 20a. At least one conductive portion extends from the motor 20a and is electrically connected to the conductive member 17a.

[0247] Referring to the schematic diagrams of Figures 17 to 18B, the conductive member 17a includes a focusing conductive member 171a and an anti-shake conductive member 172a. The focusing conductive member 171a is built into the support arm 1313a, extending from the circuit board 11a along the focusing conductive groove 13130a of the support arm 1313a and exposed at the top of the support arm 1313a, adjacent to the positioning column 13132a. The corner of the upper spring piece 24a forms a conductive terminal 241a, and the conductive terminal 241a is adjacent to the positioning hole 240a. The positioning hole 240a and the positioning column 13132a cooperate with each other to install the upper spring piece 24a to the support arm 1313a. The conductive terminal 241 serves as a conductive portion and contacts the focusing conductive member 171a, so that the upper spring piece 24a and the circuit board 11a are conductive.

[0248] In other words, the support arm 1313a is provided with a focusing conductive groove 13130a for the built-in focusing conductive member 171a. The conductive terminal 241a of the upper spring piece 24a forms the conductive part of the actuator component 21a, which is aligned with the focusing conductive groove 13130a. The focusing conductive member 171a conducts the circuit board 11a and the conductive terminal 241a to form a conductive loop.

[0249] A focus conductive member 171a is disposed in at least one of the support arms 1313a. In one example, focus conductive members 171a are disposed in two diagonally opposed support arms 1313a.

[0250] A portion of the upper spring piece 24a is mounted on the focus carrier 23a, and the focus coil 214a is mounted on the focus carrier 224a. The upper spring piece 24a and the focus coil 214a are electrically connected. Therefore, the circuit board 11a, the focus conductive member 171a, the upper spring piece 24a, and the focus coil 214a are electrically connected, forming a focus conductive loop.

[0251] Anti-shake conductive member 172a is attached to base 1311a, providing electrical continuity between flexible circuit board 211a and circuit board 11a. Flexible circuit board 211a and circuit board 11a are located on opposite sides of base 1311a, parallel to the optical axis. Base 1311a is thin, shortening the conductive distance between flexible circuit board 211a and circuit board 11a.

[0252] Specifically, in combination with the examples of Figures 13 and 17, a groove 13110a is formed on the top surface 13111a of the base 1311a. The anti-shake conductive member 172a is installed in the groove 13110a. The groove 13110a extends along the top surface 13111a of the base 1311a to the outer edge of the base 1311a, then bends downward and extends along the step 13113a of the base 1311a until it extends to the circuit board 11a. The portion of the groove 13110a located on the top surface 13111a forms a receiving groove 131101a, and the portion located on the step 13113a forms an anti-shake conductive groove 131102a.

[0253] The anti-shake conductive member 172a includes a main body 1721a, a first end 1722a, and a second end 1723a. The first end 1722a is adapted to be electrically connected to the flexible circuit board 211a, and the second end 1723a is adapted to be electrically connected to the circuit board 11a. The main body 1721a connects the first end 1722a and the second end 1723a. The first end 1722a and the main body 1721a extend to the receiving groove 131101a, and the second end 1723a extends to the anti-shake conductive groove 131102a and is electrically connected to the circuit board 11a.

[0254] At least a portion of circuit board 11a is exposed through anti-shake conductive groove 131102a, allowing for conductive connection with the contact of conductive member 17a. Second end portion 1723a of anti-shake conductive member 172a extends from anti-shake conductive groove 131102a to the exposed portion of circuit board 11a, providing conductive connection with circuit board 11a, thereby providing conductive connection between flexible circuit board 211a and circuit board 11a. In other words, circuit board 11a includes contact 115a, which is exposed through anti-shake conductive groove 131102a and adapted for conductive connection with second end portion 1723a.

[0255] The anti-shake coil 212a is integrated into the flexible circuit board 211a and is connected to the circuit board 11a via the flexible circuit board 211a and the anti-shake conductive member 172a, forming an anti-shake conductive loop.

[0256] Since the anti-shake conductive component 172a has a certain thickness, a groove 13110a is set on the base 1311a to accommodate the anti-shake conductive component 172a, so that the anti-shake conductive component 172a can be kept flat with the base 1311a, and the flexible circuit board 211a is laid on the base 1311a, and the flexible circuit board 211a can be kept flat.

[0257] Furthermore, an anti-shake conductive member 172a is provided on the edge of the same side of the base 1311a to conduct the flexible circuit board 211a and the circuit board 11a. The anti-shake conductive member 172a has a smaller volume and is accommodated in the groove 13110a in an evasive manner, without occupying other space, which is conducive to reducing the volume and saving space.

[0258] The flexible circuit board 211a is provided with a conductive hole 2110a, which runs parallel to the optical axis and serves as a conductive portion for leading out the motor 20a. The conductive hole 2110a and the anti-shake coil 212a are arranged to avoid each other and do not overlap in space.

[0259] The position of the conductive hole 2110a matches the position of the first end 1722a of the anti-shake conductive member 172a on the base 111a. After the flexible circuit board 211a is assembled to the base 1311a, the first end 1722a is exposed within the conductive hole 2110a. The first end 1722a is welded to the peripheral wall defining the conductive hole 2110a, thereby conductively connecting the first end 1722a to the flexible circuit board 211a. The second end 1723a of the anti-shake conductive member 172a is conductively connected to the circuit board 11a, thereby achieving electrical continuity between the actuator assembly 21a and the photosensitive assembly 10a.

[0260] The walls of the via 2110a are plated with a conductive metal layer, such as copper. The leads of the anti-shake coil 212a are routed to the walls defining the via 2110a. Furthermore, there are four vias 2110a and four anti-shake conductive members 172a. The four anti-shake conductive members 172a are independent of each other, and the vias 2110a and anti-shake conductive members 172a are electrically connected in a one-to-one correspondence. The anti-shake coil 212a includes two first anti-shake coils 2121a extending along the X-axis and two second anti-shake coils 2122a extending along the Y-axis. The two first anti-shake coils 2121a are connected in series, each leading to a positive terminal and a negative terminal, each leading to a respective via 2110a. The two second anti-shake coils 2122a are connected in series, each leading to a positive terminal and a negative terminal, each leading to a respective via 2110a.

[0261] The base 1311a includes two opposing first portions arranged along the X-axis and two opposing second portions arranged along the Y-axis. The anti-shake conductive member 172a is centrally located in one of the first portions or one of the second portions. Accordingly, the four conductive vias 2110a are located on the same side of the flexible circuit board 211a, centrally connecting the conductive structures and minimizing space. In other words, the anti-shake conductive member 172a is located on the same side of the base 13a as the base 1311a.

[0262] Furthermore, four vias 2110a are arranged in groups of two on the flexible circuit board 211a. Each group includes two adjacent vias 2110a, with a certain interval between the two groups of vias 2110a, and are respectively close to two adjacent corners of the flexible circuit board 211a.

[0263] According to another aspect of the present application, in conjunction with the schematic diagrams of Figures 11 to 19, the present application also provides a method for manufacturing the aforementioned camera module, comprising the steps of: integrally forming a first package body 131a on the first surface 1101a of the circuit board 11a. The mold is pressed against the first inner pressing portion 1141a and the outer pressing portion 113a to form a first pressing space between the first surface 1101a and the mold, and a molding material is injected to form the first package body 131a on the first surface 1101a.

[0264] Furthermore, the method further includes the steps of: disposing a magnetic element 133a and a position sensing element 134a on the first surface 1101a so as to be integrally packaged inside the first package body 131a after the first package body 131a is formed.

[0265] Furthermore, the step of forming steps 13113a around the base 13a is included. Steps 13113a are formed around the first package body 131a, and first spaces 13100a are defined between adjacent steps 13113a. Furthermore, the housing 40a is mounted to the base 13a so that the bottom surface 401a of the housing abuts against the steps 13113a.

[0266] The manufacturing method further includes the steps of integrally forming a second package body 132a on the second surface 1102a of the circuit board 11a. The mold is pressed against the outer pressing portion 113a and the second inner pressing portion 1142a, forming a second pressing space between the second surface 1102a and the mold. Molding material is then injected to form the second package body 132a on the second surface 1102a. The first package body 131a and the second package body 132a are respectively formed on the first surface 1101a and the second surface 1102a of the circuit board 11a to form the base 13a.

[0267] The method further includes the steps of providing a conductive portion 11021a on the second surface 1102a in an area surrounding the circuit board through hole 110a, and providing a connector on the conductive portion 11021a. Thereafter, a second package body 132a is molded on the second surface 1102a. Accordingly, a space is provided in the mold to avoid the conductive portion 11021a, so that the second inner press-fit portion 1142a and the conductive portion 11021a avoid each other.

[0268] Furthermore, the process further includes the step of flattening the circuit board 11a to improve the flatness of the conductive portion 11021a. After forming the first package body 131a, a pressurized baking process is performed to flatten the circuit board 11a and improve the flatness of the conductive portion 11021a.

[0269] The manufacturing method further includes the step of assembling the optical filter 14a to the optical filter mounting portion 1312a of the first package body 132a.

[0270] The manufacturing method further includes the step of mounting the motor 20a to the base 13a.

[0271] Specifically, the bottom surface 201a of the motor 20a is placed against the top surface 13111a of the base 1311a, connecting the motor 20a and the circuit board 11a. The support arm 1313a supports the motor 20a. The corner of the upper spring piece 24a of the suspending member is assembled to the top of the support arm 1313a to suspend the supporting mechanism of the motor 20a. The guide portion 1314a and the upper guide portion 221a are opposite each other, and the guide member 26a is assembled between the guide portion 1314a and the guide portion 221a.

[0272] Before installing the motor 20a, the process further includes the steps of: flattening the first package body 132a. Furthermore, the support arms 1313a and the guide portions 1314a of the first package body 131a are flattened by pressure baking to improve the flatness of the motor mounting portion.

[0273] The manufacturing method further includes the steps of assembling the photosensitive chip 12a into the second window region 1320a of the second package body 132a and flip-chip bonding the chip to the circuit board 11a. Prior to this step, the method may also include assembling the motor 20a to the base 13a, then testing the motor 20a using the base 13a as a motor base. After the test is complete, the photosensitive chip 12a is installed.

[0274] The manufacturing method further includes the step of installing a reinforcing plate 15a to the bottom of the second package body 132a. The reinforcing plate 15a covers the second package body 132a and the photosensitive chip 12a.

[0275] The above describes the basic principles, main features, and advantages of the present application. Those skilled in the art should understand that the present application is not limited to the above-described embodiments. The above-described embodiments and the specification merely illustrate the principles of the present application. Various changes and improvements may be made to the present application without departing from the spirit and scope of the present application. These changes and improvements fall within the scope of the present application for which protection is sought. The scope of protection claimed by the present application is defined by the appended claims and their equivalents.

Claims

1. A camera module, characterized in that: include: A photosensitive chip, a circuit board and an optical lens, wherein the photosensitive chip is mounted on the circuit board and is conductively connected to the circuit board, and the optical lens is arranged in the photosensitive path of the photosensitive chip; as well as A motor and a base, wherein the base is integrally formed on the circuit board and encapsulates at least a portion of the circuit board, the photosensitive chip is exposed through a window area defined by the base, and the motor is assembled on the base; Among them, the base is provided with multiple anti-shake conductive grooves and multiple independent anti-shake conductive parts, and the multiple anti-shake conductive grooves are arranged on the same side of the base. The anti-shake conductive part is arranged in the anti-shake conductive groove, one end of which is connected to the circuit board, and the other end of which is connected to the motor.

2. The camera module according to claim 1, wherein: The motor includes a flexible circuit board, the base includes a base, the flexible circuit board is mounted on the upper surface of the base, and the other end of the anti-shake conductive member is connected to the flexible circuit board.

3. The camera module according to claim 2, wherein: The actuating assembly includes an anti-shake coil, which is integrated in the flexible circuit board. The flexible circuit board is provided with a conducting hole. The lead end of the anti-shake coil is led to the inner wall defining the conducting hole. The other end of the anti-shake conductive part and the inner wall defining the conducting hole are fixed and conductively connected, so that the circuit board and the anti-shake coil are conductively connected, wherein the conducting hole and the anti-shake coil are arranged in an avoidance manner.

4. The camera module according to claim 3, wherein: The anti-shake conducting groove is formed by extending downward from the upper surface of the base portion facing the conducting hole to the circuit board.

5. The camera module according to claim 3, wherein: An anti-shake conductive groove is formed on the outer surface of the base, and an upper surface of the base is provided with a receiving groove whose two ends are respectively connected to the anti-shake conductive groove and the conductive hole. The anti-shake conductive part is accommodated in the receiving groove, one end of which extends to the outer surface of the base and extends along the anti-shake conductive groove to the circuit board and is conductive to the circuit board, and the other end is aligned with the conductive hole and is conductive to the flexible circuit board.

6. The camera module according to claim 1, wherein: The camera module includes a focusing conductive member, and the base includes a plurality of supporting arms, at least one of the supporting arms being provided with a focusing conductive groove, the focusing conductive groove being formed by extending downward from the top of at least one of the supporting arms to the circuit board, and the focusing conductive member being arranged in the focusing conductive groove, with one end being conducted to the circuit board and the other end being exposed from the top of the supporting arm.

7. The camera module according to claim 6, wherein: The motor includes a focus coil, a focus carrier and an upper spring sheet, wherein the upper spring sheet is installed on the upper side of the focus carrier, and a corner thereof is installed on the top of the support arm to suspend the focus carrier, and the focus coil is installed on the focus carrier and is conductively connected to the focus coil, wherein at least one of the corners of the upper spring sheet forms at least one conductive terminal, and the conductive terminal and the focus conductive member are conductively connected.

8. The camera module according to claim 1, wherein: The base is integrally formed to form a base, a plurality of support arms and a plurality of guide portions, each of the support arms protrudingly extending from a corner of the base in a direction parallel to the optical axis, each of the guide portions and each of the support arms being adjacently arranged, each of the guide portions being rotationally symmetrically arranged around the optical axis, and respectively defining at least one lower guide groove, wherein extension directions of at least two of the lower guide grooves are orthogonal and perpendicular to the optical axis of the camera module.

9. The camera module according to claim 8, wherein: The motor also includes a guiding member and an anti-shake carrier. The bottom of the anti-shake carrier is provided with a plurality of upper guiding parts, each defining at least one upper guiding groove. The guiding member is assembled between the upper guiding groove and the lower guiding groove to guide the relative movement of the anti-shake carrier and the base.

10. The camera module according to claim 1, wherein: The camera module also includes a bracket and a filter, wherein the bracket is located in a window area defined by the base, and the filter is installed on the bracket, wherein the bracket has a bracket through hole, and the photosensitive area of ​​the photosensitive chip is exposed through the window area and the bracket through hole, and the filter is held in the photosensitive path of the photosensitive chip.

11. The camera module according to claim 10, wherein: The bracket includes a step portion, a boss and a recessed portion, the filter is installed on the step portion, the boss is extended from the step portion and surrounds the filter, and the recessed portion is recessed from the bottom of the bracket to the step portion, forming a certain gap between the filter and the photosensitive chip.

12. The camera module according to claim 11, wherein: An escape space is provided at a corner of the bracket, and the boss is divided into a plurality of raised portions by the escape space, and the raised portion adjacent to the anti-shake conductive groove is smaller than the other raised portions.

13. The camera module according to claim 1, wherein: The camera module also includes a magnetic element, which is arranged on the circuit board and is built into the base after the base is integrally formed on the circuit board.

14. The camera module according to claim 1, wherein: The camera module also includes a position sensing element, which is arranged on the circuit board, is conductively connected to the circuit board, and is built into the base after the base is integrally formed on the circuit board.

15. The camera module according to claim 14, wherein: The position sensing element is conductively connected to the anti-shake conductive member and conductively connected to the motor, wherein at least one position sensing element is located outside the anti-shake conductive groove.

16. A camera module, characterized in that: include: A photosensitive chip, a circuit board, an optical lens and a motor, wherein the photosensitive chip is connected to the circuit board, and the optical lens and the motor are arranged in the photosensitive path of the photosensitive chip; Also includes: A base, the motor is mounted on the base, the base is integrally formed with the circuit board, encapsulates at least a portion of the circuit board, and forms a first encapsulation body and a second encapsulation body on a first surface and a second surface of the circuit board, respectively; The circuit board includes an external pressing portion and an internal pressing portion. The external pressing portion extends outward from between the first packaging body and the second packaging body and is located on the outside of the base. The internal pressing portion is formed around the circuit board through hole of the circuit board and extends from between the first packaging body and the second packaging body in the direction of the optical axis. The photosensitive chip is located below the internal pressing portion, and the projections of the photosensitive chip and the internal pressing portion in the direction of the optical axis overlap.

17. The camera module according to claim 16, wherein: The first surface has a first inner pressing portion, which surrounds the circuit board through hole and is exposed from a first window area of ​​the first package body.

18. The camera module according to claim 17, wherein: The first packaging body integrally forms a motor mounting part and a filter mounting part, the motor mounting part encapsulates most of the area of ​​the first surface, and the filter mounting part extends from the inner circumferential side of the motor mounting part toward the optical axis direction and is located between the motor mounting part and the first internal pressing part.

19. The camera module according to claim 18, wherein: The camera module also includes a filter, which is installed on the filter installation portion, the top of the filter is lower than the top surface of the base, and the bottom of the filter is higher than the first surface.

20. The camera module according to claim 16, wherein: The second surface has a second internal pressing portion, which surrounds the through hole of the circuit board and is exposed from the second window area of ​​the second package body. The photosensitive chip is arranged in the second window area, wherein the second internal pressing portion is provided with a conductive portion, the conductive portion is opposite to the non-photosensitive area of ​​the photosensitive chip, and the non-photosensitive area is connected to the conductive portion, so that the photosensitive chip and the circuit board are flip-chip bonded.

21. The camera module according to claim 16, wherein: The corner of the circuit board has an escape space, steps are arranged around the first packaging body, the escape space is located between adjacent steps, and the external pressing part extends outward from between the step on one side and the second packaging body.

22. The camera module according to claim 21, wherein: The first package body is integrally formed with a base, a plurality of support arms and a plurality of guide portions, the base is formed by protrudingly extending from the first surface of the circuit board, a plurality of support arms are formed by protrudingly extending from the corners of the base, the guide portions and the support arms are adjacently arranged, the motor is installed in the assembly space defined between the support arms, and the bottom surface of the motor is abutted against the top surface of the base.

23. The camera module according to claim 22, wherein: The steps are formed by extending outward from the four sides of the base, the top of the steps is lower than the top surface of the base, and a first avoidance space is formed between adjacent steps. The first avoidance space is located outside the support arm and above the avoidance space.

24. The camera module according to claim 21, wherein: A second air-avoiding space is formed at a corner of the second packaging body, and the second air-avoiding space is located below the air-avoiding space.

25. The camera module according to claim 16 or 21, wherein: The camera module also includes a reinforcing plate, which is installed on the bottom of the second package body and covers the second package body and the photosensitive chip.

26. The camera module according to claim 16 or 21, wherein: The camera module also includes a connecting component, which is connected to the external pressing part.

27. According to the camera module according to claim 16 or 22, the base is provided with a plurality of anti-shake conductive grooves and a plurality of independent anti-shake conductive parts, the plurality of anti-shake conductive grooves are arranged on the same side of the base, the anti-shake conductive part is arranged in the anti-shake conductive groove, one end of which is connected to the circuit board, and the other end of which is connected to the motor.

28. A method for manufacturing a camera module, characterized in that: The following steps are involved: A circuit board molding base, wherein an external pressing part and an internal pressing part are provided on the circuit board, a first packaging body is integrally molded on a first surface between the external pressing part and the internal pressing part, and a second packaging body is integrally molded on a second surface between the external pressing part and the internal pressing part; Assembling the motor and the filter to the motor mounting portion and the filter mounting portion integrally formed on the first packaging body respectively; And, a photosensitive chip is mounted on the second window area of ​​the second package body and is conductively connected to the circuit board.

29. The camera module according to claim 28, wherein: Also includes the steps: After forming the first package body, flattening the circuit board; and A conductive portion is provided at a second inner press-fit portion exposed from the second window area.

30. The camera module according to claim 28, wherein: Also includes the steps: Before assembling the motor, the support arm and the guide portion integrally formed with the first packaging body are leveled.

31. The camera module according to claim 28, wherein: Also includes the steps: Steps are formed around the first packaging body, with a first escape space between adjacent steps; and the bottom of the housing is pressed against the steps.

Images