A resin composition and use thereof

Abstract

This invention provides a resin composition and its application. The resin composition, by weight, comprises the following components: (A) 1-10 parts of a nitrogen-containing polyether resin containing unsaturated double bonds; (B) 45-75 parts of filler; and (C) 1-10 parts of a compounded free radical initiator. The compounded free radical initiator (C) comprises an organic peroxide free radical initiator and a carbon-based free radical initiator in a mass ratio of (0.2-5):1. By introducing free radical initiators with different half-lives into the resin composition, combined with the nitrogen-containing polyether resin containing unsaturated double bonds and filler, the prepreg prepared from this resin composition exhibits thick copper filler properties, and its cured product has high Tg, low XY-CTE, and good electrical and PS properties. It can be applied in thin HDI, carrier plates, and high-speed applications, showing broad application prospects.

Description

Technical Field

[0001] This invention belongs to the field of metal foil laminate technology, and relates to a resin composition and its application, specifically to a resin composition and a prepreg containing the same, a metal foil laminate, and a printed circuit board. Background Technology

[0002] Current high-frequency and high-speed materials generally have high coefficients of thermal expansion (CTE), primarily designed using polyphenylene oxide (PPO) and hydrocarbon resins. However, they lack low CTE. PPO resins contain numerous benzene rings in their main chain, exhibiting excellent physical and mechanical properties, as well as low dielectric constant and dielectric loss. However, when large amounts of filler are used to improve CTE, poor flowability occurs during multilayer board lamination, leading to insufficient filling effect. In the packaging field, bismaleimide or BT systems are currently the mainstream choice. While these achieve excellent CTE performance, their electrical properties are poor. Introducing low-dielectric resins can improve electrical performance, but current printed circuit boards (PCBs) require high-temperature operation. Simply reducing the dielectric properties of PCBs is insufficient; they must also maintain their low dielectric characteristics even after thermo-oxidative treatment.

[0003] Therefore, it is desirable in the art to develop a resin composition that combines excellent electrical properties, low CTE, good fillerability, and high Tg. Summary of the Invention

[0004] In view of the shortcomings of the prior art, the purpose of this invention is to provide a resin composition and its application.

[0005] To achieve this objective, the present invention adopts the following technical solution:

[0006] In a first aspect, the present invention provides a resin composition comprising, by weight parts, the following components:

[0007] (A) 1-10 parts of nitrogen-containing polyether resin with unsaturated double bonds, (B) 45-75 parts of filler, (C) 1-10 parts of compounded free radical initiator;

[0008] The (C) compound free radical initiator comprises an organic peroxide free radical initiator and a carbon-based free radical initiator in a mass ratio of (0.2 to 5):1 (for example, it can be 0.2:1, 0.4:1, 0.6:1, 0.8:1, 1:1, 1.2:1, 1.4:1, 1.6:1, 1.8:1, 2:1, 2.2:1, 2.4:1, 2.6:1, 2.8:1, 3:1, 3.2:1, 3.4:1, 3.6:1, 3.8:1, 4:1, 4.2:1, 4.4:1, 4.6:1, 4.8:1 or 5:1, and specific values ​​between the above values; due to space limitations and for the sake of brevity, the present invention will not exhaustively list the specific values ​​included in the range).

[0009] In this invention, the initiation temperature of the organic peroxide free radical initiator is 110-150℃ (e.g., 110℃, 115℃, 120℃, 125℃, 130℃, 135℃, 140℃, 145℃, 150℃, etc.), and the half-life at 110-150℃ is 1 hour; the initiation temperature of the carbon-based free radical initiator is 200-250℃ (e.g., 200℃, 205℃, 210℃, 215℃, 220℃, 225℃, 230℃, 235℃, 240℃, 245℃, 250℃, etc.), and the half-life at 200-250℃ is 1 hour.

[0010] The resin composition provided by this invention introduces free radical initiators with different half-lives (i.e., high and low temperature initiators combined), along with nitrogen-containing polyether resin containing unsaturated double bonds and fillers, so that the prepreg prepared by this resin composition has thick copper filling properties, its cured product has high Tg, low XY-CTE, and good electrical properties (e.g., low dielectric loss) and PS properties. It can be used in thin HDI, carrier plates, and high-speed applications, and has broad application prospects.

[0011] In this invention, the amount of the resin composition, based on the weight parts, (A) of the nitrogen-containing polyether resin containing unsaturated double bonds, can be, for example, 1 part, 2 parts, 3 parts, 4 parts, 5 parts, 6 parts, 7 parts, 8 parts, 9 parts, or 10 parts, as well as specific values ​​between the above points. Due to space limitations and for the sake of brevity, this invention will not exhaustively list the specific values ​​included in the range.

[0012] In this invention, the amount of filler (B) in the resin composition, based on parts by weight, can be, for example, 45 parts, 46 parts, 47 parts, 48 ​​parts, 49 parts, 50 parts, 52 parts, 54 parts, 56 parts, 58 parts, 60 parts, 62 parts, 64 parts, 66 parts, 68 parts, 70 parts, 72 parts, 74 parts, or 75 parts, as well as specific values ​​between the above-mentioned values. Due to space limitations and for the sake of brevity, this invention will not exhaustively list the specific values ​​included in the range.

[0013] In this invention, the amount of the resin composition, according to the weight parts, (C) the amount of the compounded free radical initiator can be, for example, 1 part, 2 parts, 3 parts, 4 parts, 5 parts, 6 parts, 7 parts, 8 parts, 9 parts or 10 parts, and specific values ​​between the above points. Due to space limitations and for the sake of brevity, this invention will not exhaustively list the specific values ​​included in the range.

[0014] Preferably, the organic peroxide radical initiator includes bis(tert-butylperoxyisopropylbenzene), tert-butyl peroxyacetate, tert-butyl peroxymaleate, 1,1-di(tert-butylperoxy)cyclohexane, 2,2-di(tert-butylperoxy)butane, 1,1-bis(tert-pentylperoxy)cyclohexane, 1,1-bis(tert-pentylperoxy)-3,3,5-trimethylcyclohexane, tert-pentyl peroxyhexyl carbonate, tert-pentyl peroxyacetate, tert-butyl peroxy-3,5,5-trimethylhexanoate, tert-butyl peroxybenzoate, and tert-pentyl peroxybenzoate. The mixture of any one or at least two of the following: 2-ethylhexyl carbonate tert-butyl peroxide, 2,5-dimethyl-2,5-bis(tert-butylperoxide)hexane, ethyl 3,3-bis(tert-pentylperoxide)butyrate, ethyl 3,3-bis(tert-butylperoxide)butyrate, dicumyl peroxide, bis(tert-butylperoxide isopropyl)benzene, ditert-pentyl peroxide, 2,5-dimethyl-2,5-bis(tert-butylperoxide)-3-hexyne, 3,6,9-triethyl-3,6,9-trimethyl-1,4,7-triperoxidenonane, or tert-butyl isopropyl peroxide.

[0015] Preferably, the carbon-based free radical initiator includes any one or a combination of at least two of 2,3-dimethyl-2,3-diphenylbutane, 2,3-dimethyl-2,3-bis(4-methylphenyl)butane, 2,3-dimethyl-2,3-bis(4-isopropylphenyl)butane, 3,4-dimethyl-3,4-diphenylhexane, or poly(1,4-diisopropylbenzene).

[0016] Preferably, the nitrogen-containing polyether resin molecule containing unsaturated double bonds in (A) contains at least one of the following structural units:

[0017] R1, R2, R3, R4, R5, and R6 may be the same or different, and each is independently selected from hydrogen atoms, C1-C5 (e.g., C1, C2, C3, C4, or C5) alkyl, aryl (e.g., phenyl), or aralkyl.

[0018] The nitrogen-containing polyether resin containing unsaturated double bonds (A) can be obtained by mixing polyphenolic compounds, nitrogen-containing aromatic halides, end-capping agents and organic solvents evenly, and then reacting them in the presence of alkali metal compounds. It can also be obtained commercially, such as HC-G0037, HC-G0021, HC-G0030, HC-G0024, HC-9307 or HC-9204 from JSR Japan.

[0019] For example, the nitrogen-containing polyether resin containing unsaturated double bonds (A) can be of the following structural formula, where n is an integer from 1 to 100.

[0020]

[0021] Preferably, the (B) packing material is an inorganic packing material and / or an organic packing material, and more preferably an inorganic packing material.

[0022] Preferably, the inorganic filler includes any one or a combination of at least two of the following: silicon dioxide, aluminum hydroxide, aluminum oxide, talc, aluminum nitride, boron nitride, silicon carbide, barium sulfate, barium titanate, strontium titanate, calcium carbonate, calcium silicate, or mica.

[0023] Preferably, the organic filler includes any one or a combination of at least two of polytetrafluoroethylene filler, polyetheretherketone filler, polyphenylene sulfide filler, or polyethersulfone filler.

[0024] Preferably, the median particle size of the filler is 0.01-50 μm, for example, it can be 0.01 μm, 0.05 μm, 0.08 μm, 0.1 μm, 0.5 μm, 1 μm, 3 μm, 5 μm, 8 μm, 10 μm, 15 μm, 20 μm, 25 μm, 30 μm, 35 μm, 40 μm, 45 μm or 50 μm, as well as specific values ​​between the above values. Due to space limitations and for the sake of brevity, the present invention will not exhaustively list the specific values ​​included in the range, and 0.1-40 μm is further preferred.

[0025] In this invention, the particle size was obtained using an MS3000 Malvern laser particle size analyzer.

[0026] Preferably, the filler comprises a surface-treated filler.

[0027] Preferably, the surface treatment agent for the surface treatment includes any one or a combination of at least two of silane coupling agents, organosilicon oligomers, and titanate coupling agents.

[0028] Preferably, based on 100 parts of the filler to be treated, the mass of the surface treatment agent is 0.1-5 parts, for example, 0.1 parts, 0.3 parts, 0.5 parts, 0.8 parts, 1 part, 2 parts, 3 parts, 4 parts or 5 parts, and specific values ​​between the above values. Due to space limitations and for the sake of brevity, the present invention will not exhaustively list the specific values ​​included in the range.

[0029] Preferably, the resin composition further includes thermosetting polyphenylene ether.

[0030] Preferably, the amount of thermosetting polyphenylene ether used is 10 to 20 parts, for example, 10 parts, 12 parts, 14 parts, 16 parts, 18 parts or 20 parts, and specific values ​​between the above values. Due to space limitations and for the sake of brevity, the present invention will not exhaustively list the specific values ​​included in the range.

[0031] Preferably, the resin composition further includes a thermosetting hydrocarbon resin.

[0032] Preferably, the amount of the thermosetting hydrocarbon resin is 5 to 10 parts, for example, 5 parts, 6 parts, 7 parts, 8 parts, 9 parts or 10 parts, and specific values ​​between the above points. Due to space limitations and for the sake of brevity, the present invention will not exhaustively list the specific values ​​included in the range.

[0033] Preferably, the resin composition further includes SEBS resin.

[0034] As a preferred embodiment of the present invention, introducing thermosetting hydrocarbon resin and SEBS resin into the resin composition can further improve the electrical properties and PS properties of the resin composition.

[0035] Preferably, the amount of SEBS resin used is 1 to 10 parts, for example, 1 part, 2 parts, 3 parts, 4 parts, 5 parts, 6 parts, 7 parts, 8 parts, 9 parts or 10 parts, as well as specific values ​​between the above-mentioned values. Due to space limitations and for the sake of brevity, the present invention will not exhaustively list the specific values ​​included in the range.

[0036] Preferably, the resin composition further includes a flame retardant.

[0037] Preferably, the flame retardant includes a bromine-containing flame retardant and / or a phosphorus-containing flame retardant.

[0038] Preferably, the amount of flame retardant is 5 to 15 parts, for example, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14 or 15 parts, as well as specific values ​​between the above values. Due to space limitations and for the sake of brevity, the present invention will not exhaustively list the specific values ​​included in the range.

[0039] The "parts" and "parts by weight" used in this invention are calculated based on solid content and do not include solvents, dispersants, etc.

[0040] Solvents may also be added to the above-mentioned resin composition. The amount of solvent added is selected by those skilled in the art based on experience and process requirements, so that the resin composition reaches a suitable viscosity for use, facilitating coating and other processes. During subsequent drying, semi-curing, or full curing stages, the solvent in the resin composition will partially or completely evaporate.

[0041] The solvent used in this invention is not particularly limited, and generally can be ketones such as acetone, butanone, and cyclohexanone; aromatic hydrocarbons such as toluene and xylene; esters such as ethyl acetate and butyl acetate; alcohols such as methanol, ethanol, or butanol; alcohols such as ethyl cellosolve, butyl cellosolve, ethylene glycol monomethyl ether, carbitol, or butyl carbitol; and nitrogen-containing solvents such as N,N-dimethylformamide, N,N-dimethylacetamide, or N-methyl-2-pyrrolidone. The solvent can be used alone or in mixtures of two or more. Preferably, ketones such as acetone, butanone, and cyclohexanone, and aromatic hydrocarbons such as toluene and xylene are used.

[0042] The resin composition provided by the present invention is prepared by the following method, the preparation method comprising: mixing and dispersing the components in the resin composition evenly to obtain the resin composition.

[0043] In a second aspect, the present invention provides a prepreg, the prepreg comprising a substrate and a resin composition as described in the first aspect, which is attached to the substrate by impregnation and drying.

[0044] Preferably, the substrate comprises any one of glass fiber cloth, organic fiber cloth, or glass fiber paper.

[0045] Thirdly, the present invention provides a metal foil laminate, the metal foil laminate comprising at least one prepreg as described in the second aspect, and metal foil disposed on one or both sides of the prepreg.

[0046] Preferably, the metal foil is a copper foil.

[0047] Fourthly, the present invention provides a printed circuit board comprising at least one prepreg as described in the second aspect or a metal foil laminate as described in the third aspect.

[0048] Compared with the prior art, the present invention has at least the following beneficial effects:

[0049] The resin composition provided by this invention introduces free radical initiators with different half-lives (i.e., high and low temperature initiators combined), along with nitrogen-containing polyether resin containing unsaturated double bonds and fillers, so that the prepreg prepared by this resin composition has thick copper filling properties, its cured product has high Tg, low XY-CTE, and good electrical properties (e.g., low dielectric loss) and PS properties. It can be used in thin HDI, carrier plates, and high-speed applications, and has broad application prospects. Detailed Implementation

[0050] The technical solution of the present invention will be further illustrated below through specific embodiments. Those skilled in the art should understand that the embodiments described are merely illustrative of the present invention and should not be construed as limiting the invention in any way.

[0051] The experimental materials involved in the following embodiments and comparative examples of this invention are as follows:

[0052] (1) Thermosetting polyphenylene ether

[0053] OPE-2ST 1200: Japanese Mitsubishi gas;

[0054] MX9000: Saudi Arabia's Sabic.

[0055] (2) Thermosetting hydrocarbon resins

[0056] B-3000: Japan's Soda-Taku;

[0057] TAIC, Triallyl Isocyanurate: Sartoma, USA.

[0058] (3) Nitrogen-containing polyether resins containing unsaturated double bonds

[0059] HC-9307: Japan JSR;

[0060] HC-9204: Japan JSR.

[0061] (4) SEBS resin

[0062] D-1118: Kraton (USA);

[0063] D-411K: Asahi Kasei of Japan.

[0064] (5) Flame retardants

[0065] HP-8010, containing brominated flame retardant: Albemarle, USA;

[0066] JH-100, phosphorus-containing flame retardant: Guangdong Juhang New Materials Research Institute Co., Ltd.

[0067] (6) Packing

[0068] HM102YJ: Silica, particle size (D50) is 1μm, Jiangsu Huimai;

[0069] SC2300-SVJ: Silica, particle size (D50) of 0.5μm, made by Yatoma, Japan.

[0070] (7) Organic peroxide free radical initiators

[0071] Di-tert-butylperoxyisopropylbenzene: Hunan Fangruida;

[0072] Diisopropylbenzene peroxide: Jiangsu Daoming Chemical.

[0073] (8) Carbon-based free radical initiators

[0074] Poly(1,4-diisopropylbenzene): United Initiators;

[0075] 2,3-Dimethyl-2,3-diphenylbutane: Wuxi Zhufeng.

[0076] Example 1

[0077] This embodiment provides a resin composition comprising, by weight, the following components: 13 parts of thermosetting polyphenylene ether (MX-9000), 8 parts of thermosetting hydrocarbon resin (TAIC), 6 parts of nitrogen-containing polyether resin with unsaturated double bonds (HC-9204), 3 parts of SEBS resin (D-411K), 55 parts of filler (HM102YJ), 10 parts of flame retardant (HP-8010), 1.5 parts of organic peroxide free radical initiator (di-tert-butylperoxyisopropylbenzene), and 3.5 parts of carbon-based free radical initiator (2,3-dimethyl-2,3-diphenylbutane).

[0078] This embodiment also provides a prepreg and a copper-clad laminate, the specific preparation method of which includes the following steps:

[0079] (1) Mix thermosetting polyphenylene ether, thermosetting hydrocarbon resin, nitrogen-containing polyether resin containing unsaturated double bonds, SEBS resin, organic peroxide free radical initiator, carbon free radical initiator and toluene, stir evenly at room temperature, then add flame retardant and filler, mix evenly to form a resin liquid with a solid content of 65%.

[0080] (2) Low D k The resin solution obtained by impregnation step (1) of fiberglass cloth (model 2116, Taiwan Hubel) is heated and dried in an impregnation machine oven at 140°C for 3 minutes to transform the resin composition in the varnish state into a semi-cured resin composition, and a semi-cured sheet with a thickness of 0.1 mm is obtained.

[0081] (3) Stack the two semi-cured sheets obtained in step (2) between two 18μm thick HVLP copper foils, and heat them at 30kg / cm². 2 The copper-clad laminate was cured for 120 minutes at 200°C with pressure and a heating rate of 3.5°C / min, followed by slow cooling to 50°C, to obtain a copper-clad laminate with a thickness of 0.2 mm, which was used to test its dielectric properties. k / D f Ten semi-cured sheets obtained in step (2) were stacked layer by layer between two 18μm thick HVLP copper foils and heated at 30kg / cm². 2 The copper-clad laminate was cured for 120 minutes at 200°C with pressure and a heating rate of 3.5°C / min, and then slowly cooled to 50°C to obtain a copper-clad laminate with a thickness of 1.0 mm, which was used to test properties such as CTE, Tg, and heat resistance.

[0082] The performance of the aforementioned copper-clad laminates or prepregs was tested using the following methods:

[0083] (1)D k D f The copper-clad laminate was tested according to IPC-TM-650 2.5.5.13 at a frequency of 10GHz.

[0084] (2) D after thermo-oxidation treatment f After baking the sample in an oven at 150℃ under aerobic conditions for 4 weeks, the copper-clad laminate was tested at a frequency of 10GHz according to IPC-TM-6502.5.5.13.

[0085] (3) XY-CTE: The copper-clad laminate was tested according to the CTE test standard specified in IPC-TM-6502.4.24.1 using a thermomechanical analyzer (TMA instrument);

[0086] (4) Glass transition temperature Tg: The copper-clad laminate was tested using a dynamic viscosity analyzer (DMA, Rheometric RSAIII) according to IPC-TM-650 2.4.24.4.

[0087] (5) Copper foil circuit filling performance: 4OZ copper foil was etched into circuits, and then 3 sheets of 0.10mm thick prepreg were applied for filling. No voids were observed when the PCB inner layer circuit was inspected to evaluate the thick copper filling performance.

[0088] (6) Peel strength of copper foil (PS): The peel strength of the board was tested according to the experimental conditions of “after thermal stress” in IPC-TM-650 2.4.8.

[0089] The test results are shown in Table 1.

[0090] Examples 2-4, Comparative Examples 1-4

[0091] A resin composition and a prepreg and copper-clad laminate containing the same are different from those in Example 1 in that the formulation of the resin composition is different, as shown in Tables 1 and 2; wherein, the unit of measurement for each component is "parts"; the preparation method and performance testing method of the prepreg and copper-clad laminate are the same as those in Example 1.

[0092] Table 1

[0093]

[0094]

[0095] Table 2

[0096]

[0097] As can be seen from Table 1, the resin compositions of Examples 1-4 of this application have thick copper filler properties, their cured products have high Tg (218-225℃), low XY-CTE (11.5-12.7ppm / ℃), and good electrical properties (D). k 3.42-3.47, D f : 0.00201-0.00213, D after thermo-oxidative treatment f : 0.00241-0.00255, PS performance (0.57-0.66N / mm).

[0098] Compared to Example 1, Comparative Example 1 had too little organic peroxide initiator and too much carbon-based initiator, which led to excessively high curing temperature and insufficient curing of the board, resulting in deteriorated performance (low Tg, high CTE, poor electrical properties, especially after thermo-oxidative treatment). f (Significantly larger); In Comparative Example 2, there was too much organic peroxide initiator and too little carbon-based initiator, which led to insufficient thick copper filling capacity of the prepreg, resulting in defects such as substrate voids and poor electrical properties.

[0099] Compared to Example 3, Comparative Example 3 did not use nitrogen-containing polyether resin, resulting in a lower Tg, worse electrical properties, and poorer thick copper filling ability.

[0100] Comparative Example 4 achieved a lower CTE with a large amount of filler, but this resulted in insufficient thick copper filling capacity of the prepreg, reduced peel strength, and deteriorated electrical properties.

[0101] The applicant declares that the above embodiments illustrate the resin composition and its application, but the present invention is not limited to the above embodiments, that is, it does not mean that the present invention must rely on the above embodiments to be implemented. Those skilled in the art should understand that any improvements to the present invention, equivalent substitutions of the raw materials of the product of the present invention, addition of auxiliary components, and selection of specific methods, etc., all fall within the protection scope and disclosure scope of the present invention.

Claims

1. A resin composition, characterized in that, The resin composition comprises the following components in parts by weight: (A) 1-10 parts of nitrogen-containing polyether resin with unsaturated double bonds, (B) 45-75 parts of filler, (C) 1-10 parts of compounded free radical initiator; The (C) compound free radical initiator includes an organic peroxide free radical initiator and a carbon-based free radical initiator in a mass ratio of (0.2 to 5):

1.

2. The resin composition according to claim 1, characterized in that, The organic peroxide radical initiators include bis(tert-butylperoxyisopropylbenzene), tert-butyl peroxyacetate, tert-butyl peroxymaleate, 1,1-di(tert-butylperoxy)cyclohexane, 2,2-di(tert-butylperoxy)butane, 1,1-bis(tert-pentylperoxy)cyclohexane, 1,1-bis(tert-pentylperoxy)-3,3,5-trimethylcyclohexane, tert-pentyl peroxy2-ethylhexyl carbonate, tert-pentyl peroxyacetate, tert-butyl peroxy-3,5,5-trimethylhexanoate, tert-butyl peroxybenzoate, tert-pentyl peroxybenzoate, and peroxy... The mixture of any one or at least two of the following: 2-ethylhexyl tert-butyl carbonate, 2,5-dimethyl-2,5-bis(tert-butylperoxy)hexane, ethyl 3,3-bis(tert-pentylperoxy)butyrate, ethyl 3,3-bis(tert-butylperoxy)butyrate, dicumyl peroxide, bis(tert-butylperoxyisopropyl)benzene, ditert-pentyl peroxide, 2,5-dimethyl-2,5-bis(tert-butylperoxy)-3-hexyne, 3,6,9-triethyl-3,6,9-trimethyl-1,4,7-triperoxynonane or tert-butylisopropyl peroxide.

3. The resin composition according to claim 1 or 2, characterized in that, The carbon-based free radical initiator includes any one or a combination of at least two of 2,3-dimethyl-2,3-diphenylbutane, 2,3-dimethyl-2,3-di(4-methylphenyl)butane, 2,3-dimethyl-2,3-di(4-isopropylphenyl)butane, 3,4-dimethyl-3,4-diphenylhexane, or poly(1,4-diisopropylbenzene).

4. The resin composition according to any one of claims 1-3, characterized in that, The nitrogen-containing polyether resin molecule containing unsaturated double bonds in (A) contains at least one of the following structural units: Among them, R1, R2, R3, R4, R5, and R6 may be the same or different, and each is independently selected from hydrogen atoms, C1-C5 alkyl, aryl, or aralkyl.

5. The resin composition according to any one of claims 1-4, characterized in that, The packing material (B) is an inorganic packing material and / or an organic packing material, with inorganic packing material being more preferred; Preferably, the inorganic filler includes any one or a combination of at least two of the following: silicon dioxide, aluminum hydroxide, aluminum oxide, talc, aluminum nitride, boron nitride, silicon carbide, barium sulfate, barium titanate, strontium titanate, calcium carbonate, calcium silicate, or mica. Preferably, the organic filler includes any one or a combination of at least two of polytetrafluoroethylene filler, polyetheretherketone filler, polyphenylene sulfide filler, or polyethersulfone filler; Preferably, the median particle size of the filler is 0.01-50 μm, more preferably 0.1-40 μm; Preferably, the filler comprises a surface-treated filler; Preferably, the surface treatment agent for the surface treatment includes any one or a combination of at least two of silane coupling agents, organosilicon oligomers, and titanate coupling agents; Preferably, the surface treatment agent is 0.1-5 parts by weight, based on 100 parts of the filler to be treated.

6. The resin composition according to any one of claims 1-5, characterized in that, The resin composition also includes thermosetting polyphenylene ether; Preferably, the amount of the thermosetting polyphenylene ether is 10 to 20 parts; Preferably, the resin composition further includes a thermosetting hydrocarbon resin; Preferably, the amount of the thermosetting hydrocarbon resin is 5 to 10 parts; Preferably, the resin composition further includes SEBS resin; Preferably, the amount of SEBS resin used is 1 to 10 parts.

7. The resin composition according to any one of claims 1-6, characterized in that, The resin composition also includes a flame retardant; Preferably, the flame retardant includes a brominated flame retardant and / or a phosphorus-containing flame retardant; Preferably, the amount of the flame retardant is 5 to 15 parts.

8. A semi-cured sheet, characterized in that, The prepreg includes a substrate and a resin composition as described in any one of claims 1-7, which is attached to the substrate by impregnation and drying. Preferably, the substrate comprises any one of glass fiber cloth, organic fiber cloth, or glass fiber paper.

9. A metal foil-coated laminate, characterized in that, The metal foil laminate includes at least one prepreg as described in claim 8, and metal foil disposed on one or both sides of the prepreg. Preferably, the metal foil is a copper foil.

10. A printed circuit board, characterized in that, The printed circuit board includes at least one prepreg as described in claim 8 or a metal foil laminate as described in claim 9.

Images