A kind of electroplating device for ultra-thin high-low copper boss PCB
By improving the electroplating equipment and utilizing the adjustment mechanism of the fixed and moving clamping blocks, the problems of substrate misalignment and wear during the gantry electroplating process were solved, achieving stable substrate clamping and simplified operation.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- YIYANG MINGZHENGHONG ELECTRONICS CO LTD
- Filing Date
- 2026-05-25
- Publication Date
- 2026-06-26
AI Technical Summary
In the gantry electroplating process, the substrate is prone to tilting during the clamping, fixing and disassembly process, which can cause adjacent substrates to overlap and wear, affecting the electroplating effect and increasing the complexity of the operation.
An electroplating device was designed. By coordinating the fixed clamping block and the moving clamping block in the clamping unit with the adjustment mechanism, the substrate can be stably clamped and disassembled. The substrate state is sensed by the relative sliding of the electroplating head and the slider, reducing the reliance on the fixed tension spring and enhancing the stability of the substrate fixation.
It improves the ease of substrate clamping and disassembly, reduces the probability of substrate misalignment and wear, and ensures the stability of electroplating effect and ease of operation.
Smart Images
Figure CN122279710A_ABST
Abstract
Description
Technical Field
[0001] This invention relates to the field of printed circuit board processing technology, and in particular to an electroplating apparatus for ultra-thin PCBs with high and low copper bosses. Background Technology
[0002] Ultra-thin high and low copper boss PCBs (printed circuit boards) are circuit boards with copper boss structures of different heights fabricated on an extremely thin substrate. They are used to achieve high-density, low-stress three-dimensional heterogeneous integration and electrical interconnection. The production process includes processes such as material cutting, drilling, black hole forming, electroplating, and dry film forming. Among them, the electroplating process is mainly divided into two categories: gantry line electroplating and vertical continuous electroplating (VCP electroplating). Gantry line electroplating has an irreplaceable position in the industry's technical route due to its unique advantages in special scenarios such as ultra-large board processing, thick copper processes, and local thickening.
[0003] In the gantry electroplating process, multiple clamps are first used to hold and fix the PCB substrate. Then, the substrate is driven through multiple tanks for reaction, such as pickling, water washing, micro-etching, copper plating, acid immersion, and tin plating. However, during the fixing of the substrate and the disassembly after electroplating, all the clamps corresponding to the substrate need to be clamped or released in sequence while keeping the substrate position unchanged. Since the two actions of keeping the substrate stable and operating the clamps are performed simultaneously, the substrate is prone to tilting during the operation. This not only causes the substrate to twist relative to the clamps, resulting in substrate wear, but also causes the substrate to overlap between adjacent substrates due to the tilt, affecting the electroplating effect. In this case, the position of the substrate needs to be adjusted, which increases the complexity of the operation. Summary of the Invention
[0004] This invention provides an electroplating apparatus for ultra-thin PCBs with high and low copper bosses, which overcomes the disadvantages of substrate skewing during the clamping, fixing and disassembly process of the substrate in the gantry electroplating process, which can lead to overlapping of adjacent substrates and substrate wear.
[0005] The technical solution is as follows: An electroplating device for ultra-thin PCBs with high and low copper bosses includes: an electroplating gantry frame, on which a support rod is provided, and on which a clamping unit for clamping and fixing the PCB substrate is provided; the clamping unit includes: a fixing frame fixed to the support rod, the fixing frame being detachably connected to a connector, two sliding rods being slidably connected within the connector, the two sliding rods being fixedly connected to a fixed clamping block, the fixed clamping block being hinged to a movable clamping block, a fixed tension spring being fixedly connected between the movable clamping block and the connector, electroplating heads being provided on opposite sides of the fixed clamping block and the movable clamping block, an abutment being fixedly connected to the side of the fixed clamping block near the movable clamping block, the abutment being used to limit the extreme position of the PCB substrate and the fixed clamping block, and an adjustment mechanism being provided on the sliding rod for adjusting its relative position with the corresponding connector.
[0006] Furthermore, the adjustment mechanism includes: an adjustment member, which is limited to slide and rotatably connected to the upper end of the slide rod; a guide block is fixedly connected to the adjustment member; a ring of evenly distributed guide wedges is fixedly connected to the upper end of the slide rod; the guide wedges are used to press the guide block; a limiting member is fixedly connected inside the connecting member; and a return spring is provided between the adjustment member and the fixing frame.
[0007] Furthermore, the limiting member is provided with annularly distributed long limiting grooves and annularly distributed short limiting grooves. The number of long limiting grooves is equal to the number of short limiting grooves, and the sum of the two is equal to the number of guide wedges. All the short limiting grooves and all the long limiting grooves on the same limiting member are staggered. Both the short limiting grooves and the long limiting grooves are used for the sliding of the adjusting member. On the horizontal plane projection, the short limiting grooves and the long limiting grooves correspond to the middle of the adjacent guide wedges. The upper side of the limiting member is provided with annularly distributed guide slopes, which are used to guide the adjusting member.
[0008] Furthermore, the part of the electroplating head that comes into contact with the PCB is cylindrical.
[0009] Furthermore, a damper is installed between the fixed clamping block and the adjacent movable clamping block, the damper being used to slow down the swing speed of the movable clamping block.
[0010] Furthermore, two symmetrically distributed slide rails are fixedly connected to the opposing sides of both the fixed clamping block and the moving clamping block. The two symmetrically distributed slide rails are slidably connected to a slider. The electroplating head is slidably connected to the adjacent slider. In the top-to-bottom direction, the slide rail on the fixed clamping block is inclined toward the direction corresponding to the moving clamping block.
[0011] Furthermore, locking pins are slidably connected to both the fixed clamping block and the movable clamping block near the corresponding slider. The slider is provided with a groove for accommodating the corresponding locking pin. The locking pin limits the corresponding slider through the groove on the corresponding slider. The electroplating head is used to press the corresponding locking pin. A locking spring is fixedly connected to the side of the locking pin away from the corresponding slider. The fixed clamping block and the movable clamping block are respectively fixedly connected to the corresponding locking spring. A force-increasing spring is fixedly connected to the side of the slider near the connector. The fixed clamping block and the movable clamping block are respectively fixedly connected to the corresponding force-increasing spring.
[0012] Furthermore, the lower end of the connector is fixedly connected to an extrusion bar, and the fixed clamping block is rotatably connected to an elastic column near the position where it is hinged to the corresponding movable clamping block. The extrusion bar is used to extrude the corresponding elastic column to limit its deformation, and a one-way bearing is installed between the elastic column and the corresponding movable clamping block.
[0013] Furthermore, a shielding spring is fixedly connected to the slider, the electroplating head is located inside the corresponding shielding spring, and the cylinder on the electroplating head is located inside the corresponding shielding spring.
[0014] Furthermore, the shielding spring is provided with an annular groove for accommodating the electroplating head, and the thickness of the shielding spring near the position corresponding to the slider is less than the thickness of the other positions, so as to facilitate the deformation of the shielding spring.
[0015] Compared with the prior art, the present invention has the following advantages: The present invention pushes the fixed clamping block and the moving clamping block together by the substrate, changing the traction direction of the fixed tension spring on the moving clamping block, thereby keeping the fixed clamping block and the moving clamping block in a clamped or open state. Thus, when fixing and disassembling the substrate, it is only necessary to push the fixed clamping block with the substrate to achieve the clamping, fixing and disassembling of the substrate, improving the convenience of operation and reducing the probability of substrate skew and wear.
[0016] The adjustment component is guided to rotate in one direction by the guide wedge and guide ramp, so that the protrusions on the adjustment component enter the long limit groove and the short limit groove in sequence. In this way, when the substrate pushes the fixed clamping block for the first time, the fixed clamping block and the moving clamping block will clamp the substrate. When the substrate pushes the fixed clamping block again, the fixed clamping block and the moving clamping block will release the substrate.
[0017] The state of the substrate is sensed by the relative sliding of the electroplating head and the slider. After the electroplating head contacts the substrate and the fixed and moving clamps clamp the substrate, the limit on the slider is released by the sliding of the electroplating head. The slider slides down the slide rail under the action of the force-increasing spring. The inclined slide rail increases the squeezing force of the electroplating head on the substrate, improving the stability of the substrate fixation. At the same time, the squeezing force provided by the slider sliding along the slide rail can reduce the elastic coefficient required by the fixed tension spring and the return spring. It is not necessary to rely entirely on the tension of the fixed tension spring to fix the substrate, reducing the force required for the substrate to push the fixed clamping block to move and improving the convenience of operation. Attached Figure Description
[0018] Figure 1 This is a three-dimensional structural diagram of the present invention; Figure 2 This is a three-dimensional structural diagram of the support rod and fixing frame of the present invention; Figure 3 This is a three-dimensional structural diagram of the connector and clamping block of the present invention; Figure 4 This is a three-dimensional structural diagram of the fixed clamping block and the movable clamping block of the present invention; Figure 5 This is a three-dimensional structural cross-sectional view of the connector and the movable clamping block of the present invention; Figure 6 This is a three-dimensional structural cross-sectional view of the shielding spring and slider of the present invention; Figure 7 This is a three-dimensional structural diagram of the slide bar and limiting member of the present invention; Figure 8 This is a three-dimensional structural diagram of the adjusting component and guide wedge of the present invention; Figure 9 This is an exploded view of the connector, slide bar, and movable clamping block of the present invention; Figure 10 This is a three-dimensional structural cross-sectional view of the clamping block and elastic column of the present invention.
[0019] In the attached diagram, the following are the reference numerals: 1-Electroplated gantry frame, 2-Support rod, 3-Fixed frame, 4-Connector, 5-Slide rod, 6-Fixed clamping block, 7-Moving clamping block, 8-Fixed tension spring, 9-Electroplated head, 10-Abutting part, 11-Adjusting part, 12-Guide block, 13-Guide wedge, 14-Limiting part, 141-Long limiting groove, 142-Short limiting groove, 143-Guide inclined surface, 15-Reset spring, 16-Damper, 17-Blocking spring, 18-Slide rail, 19-Slider, 20-Locking pin, 21-Locking spring, 22-Force-increasing spring, 23-Extrusion bar, 24-Elastic pin, 25-One-way bearing. Detailed Implementation
[0020] The technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present invention. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments.
[0021] Examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and intended to explain the invention, and should not be construed as limiting the invention.
[0022] Example 1: This example provides an electroplating device for ultra-thin high and low copper boss PCBs, which solves the problem that the substrate is easily tilted during the clamping and disassembly process of the gantry electroplating process, causing the overlapping of adjacent substrates and substrate wear.
[0023] See Figures 1 to 6 An electroplating apparatus for ultra-thin PCBs with high and low copper bosses includes: an electroplating gantry 1, a support rod 2 on the electroplating gantry 1, and a clamping unit on the support rod 2 for clamping and fixing the PCB substrate.
[0024] See Figures 3 to 6 The clamping unit includes: a fixed frame 3, fixedly connected to a support rod 2; a connector 4 is detachably connected to the fixed frame 3; the connector 4 is inserted into the fixed frame 3 by a plug-in connection, and the fixed frame 3 and the connector 4 are detachably connected by a connecting rod passing through both the fixed frame 3 and the connector 4; two sliding rods 5 are slidably connected within the connector 4, and a fixed clamping block 6 is fixedly connected to the lower ends of the two sliding rods 5; a movable clamping block 7 is hinged to the upper part of the fixed clamping block 6, and the movable clamping block 7 is located in front of the fixed clamping block 6; the movable clamping block 7 is connected to the connector 4. A fixed tension spring 8 is fixedly connected to the movable clamping block 7 and the connecting member 4. The fixed tension spring 8 is always in a stretched and stored state when it is located on the movable clamping block 7 and the connecting member 4. Electroplating heads 9 are provided on the opposite sides of the fixed clamping block 6 and the movable clamping block 7. The electroplating heads 9 are used to directly contact the substrate, make electrical connections with the substrate, and squeeze and fix the substrate. An abutment member 10 is fixedly connected to the front side of the fixed clamping block 6. The abutment member 10 is used to limit the extreme positions of the substrate and the fixed clamping block 6. The two slide rods 5 in the same connecting member 4 are provided with adjustment mechanisms for adjusting their relative positions with the corresponding connecting member 4.
[0025] The above configuration enables the fixed clamping block 6 and the movable clamping block 7 to move together by pushing the fixed clamping block 6 with the substrate, thereby changing the traction direction of the fixed tension spring 8 on the movable clamping block 7, and thus keeping the fixed clamping block 6 and the movable clamping block 7 in a clamped or open state. In this way, when fixing and disassembling the substrate, it is only necessary to push the fixed clamping block 6 with the substrate to achieve the clamping, fixing and disassembling of the substrate, improving the convenience of operation and reducing the probability of substrate skew and wear.
[0026] See Figure 5 and Figures 7 to 9 The adjustment mechanism includes: an adjustment component 11, which is limited, slidably, and rotatably connected to the upper end of the slide rod 5; three evenly distributed annular protrusions are provided on the upper circumference of the adjustment component 11; a guide block 12 is fixedly connected to the lower circumference of the adjustment component 11; six evenly distributed annular guide wedges 13 are fixedly connected to the upper end of the slide rod 5, and the guide wedges 13 are used to squeeze the guide blocks 12 to guide the adjustment component 11 to rotate; a limiting component 14 is fixedly connected inside the connecting component 4; a return spring 15 is provided between the adjustment component 11 and the fixed frame 3; the return spring 15 is always in a compressed and stored state when it is located between the adjustment component 11 and the fixed frame 3; the limiting component 14 is provided with three evenly distributed annular long limiting grooves 141 and annular evenly distributed... When the fixed clamping block 6 and the moving clamping block 7 are in the open state, the three short limiting grooves 142 of the cloth, the three protrusions on the adjusting member 11 are respectively located in the three long limiting grooves 141; all the short limiting grooves 142 and all the long limiting grooves 141 on the same limiting member 14 are staggered, and both the short limiting grooves 142 and the long limiting grooves 141 are used for the protrusions of the adjusting member 11 to slide. On the horizontal projection, the short limiting grooves 142 and the long limiting grooves 141 correspond to the middle of the adjacent guide wedges 13 in their respective locations. The upper side of the limiting member 14 is provided with six evenly distributed guide slopes 143 in a ring. The guide slopes 143 are used to guide the adjusting member 11 into the corresponding short limiting groove 142 or long limiting groove 141.
[0027] The above configuration enables the adjustment member 11 to rotate unidirectionally by relying on the guide wedge 13 and the guide inclined surface 143, so that the protrusions on the adjustment member 11 enter the long limiting groove 141 and the short limiting groove 142 in sequence. In this way, when the substrate pushes the fixed clamping block 6 for the first time, the fixed clamping block 6 and the moving clamping block 7 will clamp the substrate. When the substrate pushes the fixed clamping block 6 again, the fixed clamping block 6 and the moving clamping block 7 can release the clamping of the substrate.
[0028] See Figure 6 and Figure 9 The part of the electroplating head 9 that is used to contact the PCB is cylindrical, so that when the electroplating head 9 clamps the substrate, no matter how the thickness of the substrate changes, the electroplating head 9 can ensure that the electroplating head 9 and the substrate are in line contact, reducing the probability of stress concentration between the electroplating head 9 and the substrate.
[0029] See Figures 3 to 6 and Figure 9 A damper 16 is installed between the fixed clamping block 6 and the adjacent movable clamping block 7. The damper 16 is used to slow down the swing speed of the movable clamping block 7 and limit the limit angle when the movable clamping block 7 and the fixed clamping block 6 are in the open state (see attached figure). Figure 3 (The state shown).
[0030] The PCB electroplating process is as follows: The substrate is moved to the bottom of the corresponding multiple clamping units. Then, the edges of the substrate are kept horizontal and moved upward, so that the substrate is moved between the fixed clamping block 6 and the corresponding movable clamping block 7 and contacts the corresponding multiple abutting members 10. Then, the substrate is moved upward, so that the substrate pushes the abutting members 10. The abutting members 10 drive the fixed clamping block 6, the movable clamping block 7 and the slide rod 5 to move upward. The slide rod 5 first moves upward relative to the adjusting member 11 until the guide block 12 contacts the middle of the corresponding guide wedge 13 below it. As the slide rod 5 continues to move upward, the slide rod 5 pushes the adjusting member 11 upward through the guide wedge 13 and the guide block 12, so that the protrusion on the adjusting member 11 slides upward along the long limiting groove 141 and compresses the reset spring 15.
[0031] As the fixed clamping block 6 slides upward, when the lower end of the connecting piece 4 contacts the fixed clamping block 6, the fixed clamping block 6 can no longer move upward. At the same time, the protrusion on the adjusting piece 11 moves out of the long limiting groove 141. Under the pressure of the reset spring 15, the adjusting piece 11 causes the guide block 12 to slide obliquely downward along the corresponding guide wedge block 13, and drives the adjusting piece 11 to rotate counterclockwise, so that the protrusion on the adjusting piece 11 moves to the position corresponding to the guide inclined surface 143.
[0032] As the adjusting member 11 moves within the long limiting groove 141, the rear end of the fixed tension spring 8 gradually moves to below the hinge point between the fixed clamping block 6 and the moving clamping block 7. At this time, the moving clamping block 7 swings under the traction of the fixed tension spring 8 and drives the corresponding electroplating head 9 to move. The moving clamping block 7 moves slowly under the action of the damper 16, so that the front electroplating head 9 slowly approaches the substrate, reducing the collision force when the electroplating head 9 contacts the substrate.
[0033] After the fixed clamping block 6 can no longer move upward, the substrate is released. At this time, the substrate is clamped and fixed by the corresponding multiple electroplating heads 9. The adjusting member 11 moves downward under the elastic action of the reset spring 15. The protrusion on the adjusting member 11 contacts the corresponding guide slope 143 and slides along the guide slope 143 into the short limiting groove 142. After the adjusting member 11 moves to the end of the short limiting groove 142, the adjusting member 11 stops moving. In this state, the rear end of the fixed tension spring 8 is still located below the hinge of the fixed clamping block 6 and the moving clamping block 7, that is, the fixed clamping block 6 and the moving clamping block 7 still maintain the clamping state of the substrate.
[0034] Start the electroplating gantry 1, causing it to move the substrate sequentially through multiple tanks for pickling, washing, micro-etching, copper plating, acid immersion, and tin plating. Finally, after electroplating is complete, remove the substrate. Push the substrate upwards, causing the protrusion on the adjusting member 11 to move out of the short limiting groove 142. Repeat the above steps. After the adjusting member 11 rotates counterclockwise again to align with the guide slope 143, move the substrate downwards. The adjusting member 11 then returns to its original position using the return spring 15. Under the thrust of the substrate, the adjustment member 11 moves downward and enters the long limiting groove 141 under the guidance of the guide slope 143. After the protrusion of the adjustment member 11 moves to the end of the long limiting groove 141, the fixed clamping block 6 and the moving clamping block 7 are reset relative to the connecting member 4. The rear end of the fixed tension spring 8 moves back to above the hinge of the fixed clamping block 6 and the moving clamping block 7. At this time, the fixed tension spring 8 pulls the moving clamping block 7 to swing, so that the fixed clamping block 6 and the moving clamping block 7 open and release the clamping of the substrate.
[0035] Example 2: This example is a further optimization based on Example 1.
[0036] See Figure 5 , Figure 6 and Figure 9 Two symmetrically distributed slide rails 18 are fixed to the opposing sides of both the fixed clamping block 6 and the movable clamping block 7. The two symmetrically distributed slide rails 18 are slidably connected to a slider 19. The electroplating head 9 is slidably connected to the adjacent slider 19. The electroplating head 9 is provided with a stepped surface (see...). Figure 9 The stepped surface of the electroplating head 9 is used to limit its extreme state with the slider 19: when the side of the electroplating head 9 close to the corresponding fixed clamping block 6 or moving clamping block 7 is coplanar with the corresponding slider 19, it is the extreme state of relative movement between the electroplating head 9 and the corresponding slider 19; when the fixed clamping block 6 and the moving clamping block 7 are holding the substrate, the horizontal distance between the slide rail 18 on the fixed clamping block 6 and the slide rail 18 on the corresponding moving clamping block 7 gradually decreases, so that the distance between the two sliders 19 gradually decreases during the downward movement of the two sliders 19, and the squeezing force on the substrate increases.
[0037] It should be noted that in this embodiment, there is friction between the electroplating head 9 and the corresponding slider 19 to prevent the electroplating head 9 from slipping out of the corresponding slider 19. In subsequent embodiments, there is no need for friction between the electroplating head 9 and the corresponding slider 19.
[0038] The above configuration enables the fixed clamping block 6 and the movable clamping block 7 to clamp the substrate, so that the substrate tends to move downward under its own gravity. The inclined slide rail 18 converts this tendency into a further squeezing force on the substrate, thereby further enhancing the stability of the substrate fixation.
[0039] See Figure 6 and Figure 9Locking pins 20 are slidably connected to the fixed clamping block 6 and the movable clamping block 7 near the corresponding slider 19. The slider 19 is provided with a groove for accommodating the corresponding locking pin 20. The locking pin 20 limits the corresponding slider 19 through the groove on the corresponding slider 19. When the fixed clamping block 6 and the movable clamping block 7 are in the open state, the locking pin 20 is located in the groove of the corresponding slider 19 to limit the slider 19 to the upper limit position of the fixed clamping block 6 and the movable clamping block 7. The electroplating head 9 is used to press the corresponding locking pin 20. A locking spring 21 is fixedly connected to the side of the locking pin 20 away from the corresponding slider 19. The fixed clamping block 6 and the movable clamping block 7 are respectively fixedly connected to the corresponding locking spring 21. A force-increasing spring 22 is fixedly connected to the upper side of the slider 19. The force-increasing spring 22 is in a compressed and stored state. Under the action of the force-increasing spring 22, the slider 19 always has the tendency to slide downward along the corresponding slide rail 18. The fixed clamping block 6 and the movable clamping block 7 are respectively fixedly connected to the corresponding force-increasing spring 22.
[0040] The above configuration enables the electroplating head 9 to sense the state of the substrate through the relative sliding of the electroplating head 9 and the slider 19. After the electroplating head 9 contacts the substrate and the fixed clamping block 6 and the moving clamping block 7 clamp the substrate, the electroplating head 9 slides into the corresponding slider 19 and presses the corresponding locking post 20, causing the locking post 20 to move out of the groove of the corresponding slider 19 and release the limitation on the slider 19. At this time, the slider 19 slides down along the slide rail 18 under the action of the force-increasing spring 22. The inclined slide rail 18 increases the pressing force of the electroplating head 9 on the substrate, improving the stability of the substrate fixation. At the same time, the pressing force provided by the slider 19 sliding along the slide rail 18 can reduce the elastic coefficient required by the fixed tension spring 8 and the return spring 15, so that the substrate does not have to rely entirely on the tension of the fixed tension spring 8 to fix it, reducing the force required for the substrate to push the fixed clamping block 6 to move, and improving the ease of operation.
[0041] See Figure 9 and Figure 10 A pressing strip 23 is fixedly connected to the lower right side of the connector 4. An elastic column 24 is rotatably connected to the fixed clamping block 6 near the pressing strip 23. The left side of the elastic column 24 is made of elastic rubber and can be deformed by the pressing strip 23. The pressing strip 23 is used to compress the corresponding elastic column 24 to limit its position. When the fixed clamping block 6 and the movable clamping block 7 clamp the substrate, the pressing strip 23 contacts the corresponding elastic column 24 and restricts the rotation of the elastic column 24. A one-way bearing 25 is installed between the elastic column 24 and the corresponding movable clamping block 7. The inner and outer rings of the one-way bearing 25 are fixedly connected to the elastic column 24 and the movable clamping block 7, respectively. When the elastic column 24 is limited by the pressing strip 23, the one-way bearing 25 allows the movable clamping block 7 to swing only towards the fixed clamping block 6.
[0042] The above setup enables the pressing of the elastic column 24 by the pressing strip 23 to restrict the movable clamping block 7 to swing only in one direction. Thus, after the fixed clamping block 6 and the movable clamping block 7 clamp the substrate through the electroplating head 9, the slider 19 moves under the action of the force-increasing spring 22 and increases the pressing force of the electroplating head 9 on the substrate. When removing the substrate, the substrate is pushed upward. The substrate first moves the two sliders 19 upward under the action of the friction between it and the electroplating head 9 and compresses the two force-increasing springs 22. Then, during the opening of the fixed clamping block 6 and the movable clamping block 7, the electroplating head 9 first maintains contact with the substrate under the push of the locking column 20 and the locking spring 21 until the electroplating head 9 resets relative to the slider 19. The locking column 20 then limits the slider 19. Then, the steps of removing the substrate in Embodiment 1 are repeated.
[0043] Example 3: This example is a further optimization based on Example 2.
[0044] See Figure 5 , Figure 6 and Figure 9 A shielding spring 17 is fixedly attached to the slider 19. The shielding spring 17 is made of elastic rubber and has a high coefficient of friction with the substrate. The cylinder on the electroplating head 9 is located inside the corresponding shielding spring 17. The maximum distance between the shielding spring 17 and the corresponding slider 19 is greater than the maximum distance between the electroplating head 9 and the corresponding slider 19. That is, the cylinder of the electroplating head 9 is completely wrapped inside the shielding spring 17, so that the shielding spring 17 contacts the substrate before the electroplating head 9. Then, after the shielding spring 17 is compressed and deformed, the electroplating head 9 contacts the substrate. The shielding spring 17 blocks the electroplating head 9 from the electroplating solution, reducing the impact of electroplating on the service life of the electroplating head 9. An annular groove is provided to accommodate the cylindrical shape of the electroplating head 9, allowing the shielding spring 17 to swing around the axis of the cylindrical shape of the electroplating head 9. The thickness of the shielding spring 17 near the corresponding slider 19 is less than the thickness of the other parts, so as to facilitate the deformation of the shielding spring 17. When the fixed clamping block 6 and the movable clamping block 7 clamp substrates of different thicknesses, one side of the shielding spring 17 can first contact the substrate, and then under the pressure of the substrate, the shielding spring 17 swings around the axis of the cylindrical shape of the electroplating head 9. The part of the shielding spring 17 with the smaller thickness will wrinkle and deform, and a seal will be formed between the shielding spring 17 and the substrate, thereby improving the protection effect of the electroplating head 9.
[0045] The above description is only a preferred embodiment of the present invention, but the scope of protection of the present invention is not limited thereto. Any equivalent substitutions or modifications made by those skilled in the art within the scope of the technology disclosed in the present invention, based on the technical solution and inventive concept of the present invention, should be covered within the scope of protection of the present invention.
Claims
1. An electroplating apparatus for ultra-thin PCBs with high and low copper bosses, characterized in that, include: Electroplating gantry (1), on which a support rod (2) is provided, and on which a clamping unit for clamping and fixing a PCB substrate is provided; The clamping unit includes: A fixed frame (3) is fixedly connected to the support rod (2). The fixed frame (3) is detachably connected to a connector (4). Two slide rods (5) are slidably connected to the connector (4). The two slide rods (5) are fixedly connected to a fixed clamping block (6). The fixed clamping block (6) is hinged to a movable clamping block (7). A fixed tension spring (8) is fixed between the movable clamping block (7) and the connector (4). Electroplating heads (9) are provided on the opposing sides of the fixed clamping block (6) and the movable clamping block (7). An abutment (10) is fixedly connected to the side of the fixed clamping block (6) near the movable clamping block (7). The abutment (10) is used to limit the extreme position of the PCB substrate and the fixed clamping block (6). An adjustment mechanism is provided on the slide rod (5) for adjusting its relative position with the corresponding connector (4).
2. The electroplating apparatus for ultra-thin high and low copper boss PCBs according to claim 1, characterized in that, The adjustment mechanism includes: An adjusting component (11) is limited to slide and rotate connected to the upper end of the slide rod (5). A guide block (12) is fixedly connected to the adjusting component (11). A ring-shaped guide wedge (13) is fixedly connected to the upper end of the slide rod (5). The guide wedge (13) is used to squeeze the guide block (12). A limiting component (14) is fixedly connected inside the connecting component (4). A reset spring (15) is provided between the adjusting component (11) and the fixing frame (3).
3. The electroplating apparatus for ultra-thin high and low copper boss PCBs according to claim 2, characterized in that, The limiting member (14) is provided with annularly distributed long limiting grooves (141) and annularly distributed short limiting grooves (142). The number of long limiting grooves (141) is equal to the number of short limiting grooves (142), and the sum of the two is equal to the number of guide wedges (13). All the short limiting grooves (142) and all the long limiting grooves (141) on the same limiting member (14) are staggered. Both the short limiting grooves (142) and the long limiting grooves (141) are used for the sliding of the adjusting member (11). On the projection of the horizontal plane, the short limiting grooves (142) and the long limiting grooves (141) correspond to the middle of the adjacent guide wedges (13) in their respective locations. The upper side of the limiting member (14) is provided with annularly distributed guide slopes (143), which are used to guide the adjusting member (11).
4. The electroplating apparatus for ultra-thin high and low copper boss PCBs according to claim 1, characterized in that, The electroplating head (9) has a cylindrical part that is used to contact the PCB.
5. The electroplating apparatus for ultra-thin high and low copper boss PCBs according to claim 1, characterized in that, A damper (16) is installed between the fixed clamping block (6) and the adjacent moving clamping block (7), the damper (16) being used to slow down the swing speed of the moving clamping block (7).
6. The electroplating apparatus for ultra-thin high-low copper boss PCBs according to claim 5, characterized in that, The fixed clamping block (6) and the moving clamping block (7) are each fixed with two symmetrically distributed slide rails (18). The two symmetrically distributed slide rails (18) are slidably connected to a slider (19). The electroplating head (9) is slidably connected to the adjacent slider (19). In the direction from top to bottom, the slide rails (18) on the fixed clamping block (6) are inclined in the direction corresponding to the moving clamping block (7).
7. The electroplating apparatus for ultra-thin high and low copper boss PCBs according to claim 6, characterized in that, Locking pins (20) are slidably connected to the fixed clamping block (6) and the movable clamping block (7) near the corresponding slider (19). The slider (19) is provided with a groove for accommodating the corresponding locking pin (20). The locking pin (20) limits the corresponding slider (19) through the groove on the corresponding slider (19). The electroplating head (9) is used to squeeze the corresponding locking pin (20). A locking spring (21) is fixedly connected to the side of the locking pin (20) away from the corresponding slider (19). The fixed clamping block (6) and the movable clamping block (7) are respectively fixedly connected to the corresponding locking spring (21). A force-increasing spring (22) is fixedly connected to the side of the slider (19) near the connector (4). The fixed clamping block (6) and the movable clamping block (7) are respectively fixedly connected to the corresponding force-increasing spring (22).
8. The electroplating apparatus for ultra-thin high and low copper boss PCBs according to claim 7, characterized in that, The lower end of the connector (4) is fixedly connected to an extrusion strip (23). The fixed clamping block (6) is rotatably connected to an elastic column (24) near the position where it is hinged to the corresponding movable clamping block (7). The extrusion strip (23) is used to extrude the corresponding elastic column (24) to deform it and limit its position. A one-way bearing (25) is installed between the elastic column (24) and the corresponding movable clamping block (7).
9. The electroplating apparatus for ultra-thin high and low copper boss PCBs according to claim 7, characterized in that, A shielding spring (17) is fixedly attached to the slider (19), the electroplating head (9) is located inside the corresponding shielding spring (17), and the cylinder on the electroplating head (9) is located inside the corresponding shielding spring (17).
10. The electroplating apparatus for ultra-thin high-low copper boss PCBs according to claim 9, characterized in that, The shielding spring (17) is provided with an annular groove for accommodating the electroplating head (9). The thickness of the shielding spring (17) near the corresponding slider (19) is less than the thickness of the other positions, so as to facilitate the deformation of the shielding spring (17).