Special cover device for traceless low-dust closed bearing based on vacuum cleanliness requirement

Abstract

This invention discloses a non-marking, low-dust-generating sealed bearing capping device based on vacuum cleanliness requirements. It includes a base and a rotating body. The base is used to insert into the inner ring of a semiconductor bearing. The rotating body is rotatably mounted on the upper end of the base. The upper end of the rotating body has a gripping part for hand handling and rotation. The lower side of the rotating body has a lever for pressing the outer edge of the dust cover into the mounting groove of the outer ring of the semiconductor bearing. This invention has a simple and compact structure, low cost, and is more suitable for the rapid installation of semiconductor bearing dust covers in cleanrooms. It is less likely to generate tiny particles or impurities during capping, meeting the high cleanliness requirements of semiconductor bearings.

Description

Technical Field

[0001] This invention relates to a special pressure cap device for non-marking, low-dust closed bearings based on vacuum cleanliness requirements. Background Technology

[0002] Semiconductor bearings are components specifically developed for semiconductor equipment, capable of meeting high cleanliness requirements and operating stably in complex environments. In practical applications of bearings, the cleanliness of the internal channels directly affects the service life of the equipment; therefore, sealing caps are essential to strictly prevent dust, moisture, and other external impurities.

[0003] In conventional semiconductor bearings, the outer ring usually has an annular mounting groove. When pressing the cover, the dust cover needs to be placed on top of the outer ring first. The pressing head of the pressing equipment then presses downwards, causing the outer edge of the dust cover to deform and be pressed into the mounting groove, thereby fixing the two together.

[0004] According to industry standards, the assembly and capping processes for these types of bearings are typically strictly limited to cleanrooms of Class 100,000 or higher. However, current mainstream capping equipment often relies on servo motors or hydraulic systems for power, resulting in a large overall footprint, relatively high investment costs, and cumbersome operation procedures. More importantly, capping equipment inevitably generates some tiny particles or impurities during operation. These particles easily disperse and adhere to the bearing surface, affecting the cleanliness of the semiconductor bearing and ultimately impacting its reliability. Summary of the Invention

[0005] To overcome the shortcomings of the prior art, the present invention provides a non-marking, low-dust closed bearing capping device based on vacuum cleanliness requirements. It has a simple and compact structure, low cost, and is more suitable for the rapid installation of dust covers for semiconductor bearings in cleanrooms. It is less likely to generate tiny particles or impurities during capping, thus meeting the high cleanliness requirements of semiconductor bearings.

[0006] This invention relates to a non-marking, low-dust-generating closed bearing pressure cap device based on vacuum cleanliness requirements. It includes a base and a rotating body. The base is used to insert into the inner ring of a semiconductor bearing. The rotating body is rotatably disposed on the upper end of the base. The upper end of the rotating body has a gripping part that can be held by hand and operated to rotate it. The lower side of the rotating body is provided with a lever that can press the outer edge of the dust cover into the mounting groove of the outer ring of the semiconductor bearing.

[0007] This invention employs a manual capping method, eliminating the need for any external power source such as a motor or hydraulic system. This minimizes the generation of microparticles and impurities during capping, ensuring the high cleanliness of the semiconductor bearing. In use, the base is inserted into the inner ring of the semiconductor bearing for positioning, while a lever presses against the outer edge of the dust cover. By gripping and pressing down on the rotating body, it is driven to rotate, causing the lever to press down and rotate, thus pressing the dust cover into the mounting groove of the outer ring for riveting positioning. This invention features a simple overall structure, small footprint, and low cost, allowing for use in confined cleanrooms and offering high capping efficiency.

[0008] Furthermore, a connecting hole is provided at the center of the lower end of the rotating body, and a protrusion is provided at the upper end of the base to be inserted and rotated in conjunction with the connecting hole. A bearing is provided between the protrusion and the connecting hole.

[0009] The insertion and connection of the protrusion and the connecting hole improves the relative rotation effect between the rotating body and the base. The bearing reduces the frictional resistance during rotation, making it easier to use and reducing the generation of tiny impurity particles.

[0010] Furthermore, the rotating body includes an upper cover and an annular ring. The annular ring is fixedly installed on the lower end of the upper cover, and the lever is fixed on the annular ring. The connecting hole is formed by splicing an upper hole section on the upper cover and a lower hole section on the annular ring. The inner ring of the bearing is fitted onto a protrusion. The upper end of the protrusion has a first annular recess for fitting the inner ring of the bearing. The lower end of the first annular recess has a first annular stepped surface that abuts against the lower end of the inner ring of the bearing. The lower end of the upper hole section has a second annular recess for fitting the outer ring of the bearing. The upper end of the second annular recess has a second annular stepped surface that abuts against the upper end of the outer ring of the bearing. The inner edge of the annular ring has an annular support surface that abuts against the lower end of the outer ring of the bearing. The upper cover and the annular ring are locked and fixed together by multiple bolts passing through along the axial direction.

[0011] Based on the above solution, the fit between the bearing, the top cover, and the ring can be improved, and bearing displacement can be avoided. In addition, the base can be easily disassembled and replaced to adapt to semiconductor bearings with different inner ring bore diameters.

[0012] Furthermore, the annular ring includes an upper annular ring and a lower annular ring disposed at the lower end of the upper annular ring. The upper annular ring and the lower annular ring are locked and fixed by the bolt. The annular support surface is disposed on the upper annular ring. The lever is pressed and fixed by the bolt at the junction between the lower end of the upper annular ring and the upper end of the lower annular ring.

[0013] Based on the above structure, the connection reliability between the paddle and the ring can be improved. The paddle is not easy to loosen or shift during the capping operation, and the paddle can be easily disassembled and assembled.

[0014] Furthermore, the lower end of the upper annular ring is provided with a conical concave surface and a first horizontal surface connected to the radial inner side of the conical concave surface, and the upper end of the lower annular ring is respectively provided with a conical convex surface and a second horizontal surface connected to the radial inner side of the conical convex surface. The paddle is clamped and fixed between the conical concave surface and the conical convex surface.

[0015] Based on the above scheme, the paddle can be securely clamped and fixed between the conical concave surface and the conical convex surface, and when the paddle is clamped, it can deform into an arc-shaped paddle, which can improve the strength of the paddle; the setting of the first horizontal surface and the second horizontal surface can form a limit with the rear end of the paddle, preventing it from moving in the direction of the axis of the ring.

[0016] Furthermore, the width of the paddle gradually narrows from front to back, and the front end and the two side edges of the paddle are connected by a convex arc-shaped contour. The rear end of the paddle has an arc-shaped notch.

[0017] In the above scheme, the structure of the paddle can improve its structural strength and prevent scratching of the dust cover surface during pressing, reducing the generation of tiny debris. The arc-shaped notch at the rear end of the paddle can make way for the first and second horizontal planes, increasing its contact area with the upper and lower annular rings, thereby further improving the reliability of its connection with the annular rings.

[0018] Furthermore, the lower end of the base extends horizontally outward to form a disc-shaped support portion, and the lower end of the lower annular ring has a recess.

[0019] The support portion provides stable support for the present invention and prevents the semiconductor bearing from shifting or tilting during the press-fitting process.

[0020] Furthermore, the outer peripheral wall of the gripping part is provided with anti-slip texture.

[0021] To prevent hands from slipping during operation. Attached Figure Description

[0022] Figure 1 This is a structural diagram of an embodiment of the present invention; Figure 2 This is an exploded view of an embodiment of the present invention; Figure 3 This is a cross-sectional view of an embodiment of the present invention; Figure 4 The structure of the lower annular ring in this embodiment of the invention. Figure 1 ; Figure 5 The structure of the lower annular ring in this embodiment of the invention. Figure 2 ; Figure 6This is a structural diagram of the upper annular ring according to an embodiment of the present invention; Figure 7 This is a structural diagram of the paddle in an embodiment of the present invention; Figure 8 This is a schematic diagram illustrating the working principle of the pressure cap of the present invention. Detailed Implementation

[0023] The structure of the traceless, low-dust-generating closed bearing cap device based on vacuum cleanliness requirements in this embodiment of the invention is as follows: Figure 1-7 As shown, it includes a base 1 and a rotating body 2. The base 1 is used to insert into the inner ring of the semiconductor bearing. The rotating body 2 is rotatably disposed on the upper end of the base 1. The upper end of the rotating body 2 has a gripping part 21 that can be gripped by a hand and operated to rotate it. The lower side of the rotating body 2 is provided with a paddle 5 that can press the outer edge of the dust cover 3 into the mounting groove 41 of the outer ring 4 of the semiconductor bearing.

[0024] This invention employs a manual capping method, eliminating the need for any external power source such as a motor or hydraulic system. This method minimizes the generation of microparticles and impurities during capping, ensuring the high cleanliness of the semiconductor bearing. In use, the dust cover 3 is first placed above the outer ring of the semiconductor bearing. The base 1 is then inserted into the inner ring of the semiconductor bearing for positioning. The lever 5 presses against the outer edge of the dust cover 3. By gripping and pressing down on the rotating body 2, it is driven to rotate. The rotating body 2 drives the lever 5 to press down and rotate, pressing the dust cover 3 into the mounting groove 41 of the outer ring 4 for riveting and positioning. Figure 8 As shown.

[0025] Compared with existing capping equipment, the present invention has a simpler overall structure, occupies less space, is less expensive, can be used in small cleanrooms, and has higher capping efficiency.

[0026] The rotating body 2 has a connecting hole at its lower center, and the base 1 has a protruding post 11 at its upper end that is inserted and rotated in conjunction with the connecting hole. A bearing 6 is provided between the protruding post 11 and the connecting hole. The relative rotation effect between the rotating body 2 and the base 1 is improved by the insertion and connection of the protruding post 11 and the connecting hole. The bearing 6 reduces the frictional resistance during rotation, making it easier to use and reducing the generation of tiny impurity particles.

[0027] The rotating body 2 includes an upper cover 22 and an annular ring. The annular ring is fixedly installed at the lower end of the upper cover 22. The paddle 5 is fixed on the annular ring. The connecting hole is composed of an upper hole section 201 on the upper cover 22 and a lower hole section 202 on the annular ring. The upper end of the upper hole section 201 is a closed structure, and the lower hole section 202 is a through hole. The inner ring of the bearing 6 is fitted onto the protrusion 11. The upper end of the protrusion 11 has a first annular recess 11a for embedding the inner ring of the bearing 6. The lower end of the first annular recess 11a has a first annular stepped surface 11b that abuts against the lower end of the inner ring of the bearing 6. The protrusion 11 can be easily dislodged downward from the bearing 6. The upper hole section 201... The lower end of the base 1 is provided with a second annular recess 22a for mounting the outer ring of the bearing 6. The upper end of the second annular recess 22a has a second annular stepped surface 22b that abuts against the upper end of the outer ring of the bearing 6. The inner edge of the annular ring has an annular support surface 231a that abuts against the lower end of the outer ring of the bearing 6. The upper cover 22 and the annular ring are locked together by a plurality of bolts 24 passing through along the axial direction, which can improve the fit between the bearing 6, the upper cover 22 and the annular ring and prevent the bearing 6 from shifting. In addition, the base 1 can be easily plugged in, unplugged and replaced without disassembling the bearing 6, the upper cover 22 and the annular ring, so as to adapt it to semiconductor bearings with different inner ring diameters.

[0028] The annular ring includes an upper annular ring 231 and a lower annular ring 232 located at the lower end of the upper annular ring 231. The upper annular ring 231 and the lower annular ring 232 are locked and fixed by the bolt 24. That is, the upper cover 22, the upper annular ring 231 and the lower annular ring 232 share the bolt 24. The annular support surface 231a is located on the upper annular ring 231. The paddle 5 is pressed and fixed by the bolt 24 at the junction between the lower end of the upper annular ring 231 and the upper end of the lower annular ring 232, which can improve the reliability of the connection between the paddle 5 and the annular ring. During the cover pressing operation, the paddle 5 is not easy to loosen or shift, and the paddle 5 can be easily disassembled and assembled.

[0029] The lower end of the upper annular ring 231 is provided with a conical concave surface 231b and a first horizontal surface 231c connected to the radially inner side of the conical concave surface 231b. The upper end of the lower annular ring 232 is respectively provided with a conical convex surface 232a and a second horizontal surface 232b connected to the radially inner side of the conical convex surface 232a. The lever 5 is clamped and fixed between the conical concave surface 231b and the conical convex surface 232a, and the lever 5 can be securely clamped and fixed on the conical concave surface 231b. Between the conical convex surface 232a and the plate 5, the plate 5 can remain tilted when clamped and fixed; when a flat plate 5 is used, it can deform when clamped, so that it is deformed into an arc-shaped plate 5 (matching the shape of the conical surface), which can improve the strength of the plate 5; the setting of the first horizontal surface 231c and the second horizontal surface 232b can form a limit with the rear end of the plate 5, prohibiting it from moving in the direction of the axis of the ring, and preventing its rear end from moving and inserting into the connecting hole when under force.

[0030] The width of the paddle 5 gradually narrows from front to back. The front end and the two side edges of the paddle 5 are connected by a convex arc-shaped contour 5a. The rear end of the paddle 5 has an arc-shaped notch 5b. The paddle 5 with the aforementioned structure can improve the structural strength and avoid scratching the surface of the dust cover 3 when pressing the cover, reducing the generation of small debris. The arc-shaped notch at the rear end of the paddle 5 can make way for the first horizontal plane 231c and the second horizontal plane 232b, which can increase its contact area with the upper annular ring 231 and the lower annular ring 232, thereby further improving the reliability of its connection with the annular ring.

[0031] The lower end of the base 1 extends horizontally outward to form a disc-shaped support portion 12. The support portion 12 can improve the positioning effect with the inner ring of the semiconductor bearing, provide a stable support for the present invention, and prevent the semiconductor bearing from shifting or tilting during the press-fitting process.

[0032] The outer peripheral wall of the gripping part 21 is provided with anti-slip texture to prevent the hand from slipping during operation.

[0033] The above embodiments are merely one preferred embodiment of the present invention. Ordinary variations and substitutions made by those skilled in the art within the scope of the technical solution of the present invention are all included within the protection scope of the present invention.

Claims

1. A traceless, low-dust-generating closed-type bearing cap device based on vacuum cleanliness requirements, characterized in that: It includes a base and a rotating body. The base is used to be inserted into the inner ring of a semiconductor bearing. The rotating body is rotatably disposed on the upper end of the base. The upper end of the rotating body has a gripping part that can be held by hand and operated to rotate it. The lower side of the rotating body is provided with a lever that can press the outer edge of the dust cover into the mounting groove of the outer ring of the semiconductor bearing.

2. The non-marking, low-dust-generating closed bearing pressure cap device based on vacuum cleanliness requirements according to claim 1, characterized in that: The lower end of the rotating body is provided with a connecting hole at its center, and the upper end of the base is provided with a protruding post that mates with the connecting hole and rotates. A bearing is provided between the protruding post and the connecting hole.

3. The traceless, low-dust-generating closed bearing cap device based on vacuum cleanliness requirements according to claim 2, characterized in that: The rotating body includes a top cover and an annular ring. The annular ring is fixedly installed on the lower end of the top cover. The paddle is fixed on the annular ring. The connecting hole is formed by splicing an upper hole section on the top cover and a lower hole section on the annular ring. The inner ring of the bearing is fitted onto a protruding post. The upper end of the protruding post has a first annular recess for fitting the inner ring of the bearing. The lower end of the first annular recess has a first annular stepped surface that abuts against the lower end of the inner ring of the bearing. The lower end of the upper hole section has a second annular recess for fitting the outer ring of the bearing. The upper end of the second annular recess has a second annular stepped surface that abuts against the upper end of the outer ring of the bearing. The inner edge of the annular ring has an annular support surface that abuts against the lower end of the outer ring of the bearing. The top cover and the annular ring are locked and fixed together by multiple bolts passing through along the axial direction.

4. The traceless, low-dust-generating closed bearing pressure cap device based on vacuum cleanliness requirements according to claim 3, characterized in that: The annular ring includes an upper annular ring and a lower annular ring disposed at the lower end of the upper annular ring. The upper annular ring and the lower annular ring are locked and fixed by the bolt. The annular support surface is disposed on the upper annular ring. The lever is pressed and fixed by the bolt at the junction between the lower end of the upper annular ring and the upper end of the lower annular ring.

5. The traceless, low-dust-generating closed bearing pressure cap device based on vacuum cleanliness requirements according to claim 4, characterized in that: The lower end of the upper annular ring is provided with a conical concave surface and a first horizontal surface connected to the radial inner side of the conical concave surface. The upper end of the lower annular ring is respectively provided with a conical convex surface and a second horizontal surface connected to the radial inner side of the conical convex surface. The paddle is clamped and fixed between the conical concave surface and the conical convex surface.

6. The traceless, low-dust-generating closed bearing pressure cap device based on vacuum cleanliness requirements as described in claim 5, characterized in that: The width of the paddle gradually narrows from front to back, and the front end and the two side edges of the paddle are connected by a convex arc-shaped contour. The rear end of the paddle has an arc-shaped notch.

7. The non-marking, low-dust-generating closed bearing pressure cap device based on vacuum cleanliness requirements according to claim 1, characterized in that: The lower end of the base extends horizontally outward to form a disc-shaped support.

8. The traceless, low-dust-generating closed bearing cap device based on vacuum cleanliness requirements according to claim 1, characterized in that: The outer peripheral wall of the gripping part is provided with anti-slip texture.

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