Aging test system, method, storage medium, and communication device

Abstract

This application discloses an aging test system, method, storage medium, and communication device. The aging test system includes a first host computer, an automatic loading and unloading device, and an aging chamber. The aging chamber includes a processor and a circuit board. The first host computer controls the automatic loading and unloading device to install test modules onto the circuit board in the aging chamber via installation commands. Then, the first host computer controls the processor in the aging chamber to perform aging tests on the test modules via test commands, obtaining aging test results. After obtaining the aging test results, the first host computer sends a disassembly command carrying the aging test results to the automatic loading and unloading device, controlling the device to disassemble the test modules from the circuit board according to the aging test results. This application can improve the efficiency of aging tests and facilitates the import of a large number of test modules at once, enabling batch aging tests.

Description

Technical Field

[0001] This application relates to the field of aging test technology, specifically to an aging test system, method, storage medium, and communication device. Background Technology

[0002] Electronic modules are widely used in industrial automation, communications, and vehicles to achieve control and communication functions. Due to the complexity of manufacturing processes, differences in raw materials, and other factors, some electronic modules may contain foreign objects or performance defects when initially shipped. These problems gradually emerge after the electronic modules are put into use, potentially causing short circuits or performance degradation, resulting in the modules failing to meet expected efficiency. This not only increases maintenance costs but also affects the user experience. To avoid these problems, aging testing has become a crucial part of the electronic module production process. By simulating real-world usage environments and applying appropriate stress, aging testing can accelerate the exposure of potential defects in electronic modules, effectively screening out defective products and preventing them from entering the market. Therefore, with the continuous expansion of electronic module production scale, improving the efficiency of aging testing has become a key technical issue that the industry is committed to researching. Summary of the Invention

[0003] This application provides an aging test system, method, storage medium, and communication device, which can improve the efficiency of aging tests and facilitate the import of a large number of test modules at once, enabling batch aging tests.

[0004] On one hand, this application provides an aging test system, which includes: a first host computer, an automatic loading and unloading device, and an aging chamber. The aging chamber includes a processor and a circuit board. The first host computer is used to: send an installation command to the automatic loading and unloading device. The automatic loading and unloading device is used to: install a test module onto the circuit board in response to the installation command. The first host computer is also used to: send a test command to the processor. The processor is used to: perform an aging test on the test module mounted on the circuit board in response to the test command, obtain an aging test result, and send the aging test result to the first host computer. The first host computer is also used to: send a disassembly command to the automatic loading and unloading device, the disassembly command including the aging test result. The automatic loading and unloading device is also used to: disassemble the test module from the circuit board according to the aging test result in response to the disassembly command.

[0005] Optionally, the automatic loading and unloading equipment is further configured to: if the aging test result indicates that the test module has passed the aging test, remove the test module from the circuit board to a first tray; if the aging test result indicates that the test module has failed the aging test, remove the test module from the circuit board to a second tray different from the first tray.

[0006] Optionally, the first host computer is further configured to: identify the test parameters of the test module from the production work order; and send the test instruction to the processor in response to a test enable operation; wherein the test instruction includes the test parameters. The processor is further configured to: perform the aging test on the test module on the circuit board according to the test parameters in response to the test instruction.

[0007] Optionally, the processor is further configured to: in response to the test instruction, send a forced transmission instruction to the test module according to the test parameters, the forced transmission instruction including signal transmission parameters; the test module is configured to: in response to the forced transmission instruction, perform a signal transmission operation according to the signal transmission parameters, and send the execution result of the signal transmission operation to the processor; the processor is further configured to: during the process of the test module performing the signal transmission operation, monitor the operating status parameters of the test module, and send the operating status parameters of the test module to the first host computer.

[0008] Optionally, the aging chamber further includes a power module; wherein, the first host computer is further configured to: send a power-on command to the processor; the processor is further configured to: in response to the power-on command, control the power module to supply power to the circuit board, control the test module on the circuit board to power on, and send the module identification data of the test module to the first host computer.

[0009] Optionally, the first host computer is further configured to: send an installation instruction for the test module to the automatic loading and unloading equipment when the test module meets the target conditions.

[0010] Optionally, the target conditions include at least one of the following: passing the previous station test, or the number of tests in the aging test being less than a first threshold.

[0011] Optionally, the aging test system further includes a second host computer; wherein the second host computer is used to forward data related to the aging test between the first host computer and the processor.

[0012] On the other hand, this application provides an aging test method applied to a first host computer; the aging test method includes: sending an installation command to an automatic loading and unloading device, the installation command being used to trigger the automatic loading and unloading device to install a test module onto a circuit board in an aging chamber; sending a test command to a processor of the aging chamber, the test command being used to trigger an aging test on the test module installed on the circuit board; and, upon receiving an aging test result from the processor, sending a disassembly command to the automatic loading and unloading device, the disassembly command including the aging test result, the disassembly command being used to trigger the automatic loading and unloading device to disassemble the test module from the circuit board according to the aging test result.

[0013] On the other hand, embodiments of this application provide a computer-readable storage medium having a computer program or instructions stored thereon, wherein the computer program or instructions, when executed by a processing unit, implement the steps in the aging test method described above.

[0014] On the other hand, embodiments of this application provide a communication device, including a storage unit and a processing unit. The storage unit stores a computer program or instructions. When the computer program or instructions are executed by the processing unit, the processing unit performs the following steps: sending an installation instruction to an automatic loading and unloading device, the installation instruction being used to trigger the automatic loading and unloading device to install a test module onto a circuit board in an aging chamber; sending a test instruction to a processor of the aging chamber, the test instruction being used to trigger an aging test on the test module installed on the circuit board; and, upon receiving an aging test result from the processor, sending a disassembly instruction to the automatic loading and unloading device, the disassembly instruction including the aging test result, the aging test result being used to trigger the automatic loading and unloading device to disassemble the test module from the circuit board by category.

[0015] On the other hand, embodiments of this application also provide a computer program product, including a computer program or instructions, which, when executed by a processing unit, implement the steps in the aging test method described above.

[0016] In summary, the technical solution provided in this application involves a first host computer controlling an automatic loading and unloading device to install test modules onto the circuit board in an aging chamber via installation commands. Then, the first host computer controls the processor in the aging chamber to perform aging tests on the test modules via test commands, obtaining aging test results. After obtaining the aging test results, the first host computer sends a disassembly command carrying the aging test results to the automatic loading and unloading device, controlling the device to disassemble the test modules from the circuit board according to the aging test results. This application, by introducing an automatic loading and unloading device, achieves automated and intelligent installation and disassembly of test modules, improving the efficiency of test module loading and unloading, further enhancing the efficiency of aging tests, and facilitating the import of a large number of test modules at once for batch aging tests. Furthermore, in this application, the disassembly command sent by the first host computer to the automatic loading and unloading device carries the aging test results, enabling the device to disassemble the test modules according to the results, removing them from the circuit board to trays matching the aging test results, thus achieving categorized storage of the test modules for subsequent production and shipping. Attached Figure Description

[0017] To more clearly illustrate the technical solutions in the embodiments of this application, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the accompanying drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0018] Figure 1 This is a schematic diagram of an aging test system provided in an embodiment of this application; Figure 2 This is a flowchart of an aging test method provided in an embodiment of this application; Figure 3 This is a flowchart of another aging test method provided in the embodiments of this application; Figure 4 This is a flowchart of another aging test method provided in the embodiments of this application; Figure 5 This is a flowchart of another aging test method provided in the embodiments of this application; Figure 6 This is a flowchart of another aging test method provided in the embodiments of this application. Detailed Implementation

[0019] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0020] In the following description, specific embodiments of this application will be illustrated with reference to steps and symbols performed by one or more computers, unless otherwise stated. Therefore, these steps and operations will be referred to several times as being performed by a computer. Computer performance as referred to in this application includes operations performed by a computer processing unit on electronic signals represented by data in a structured format. This operation transforms the data or maintains it at a location in the computer's memory system, which can be reconfigured or otherwise alter the operation of the computer in a manner well known to those skilled in the art. The data structure maintained by the data is the physical location of the memory, which has specific characteristics defined by the data format. However, the principles of this application are illustrated with specific embodiments and are not intended to be limiting. Those skilled in the art will understand that many of the steps and operations described below can also be implemented in hardware.

[0021] The terms "module" or "unit" as used in this application can be considered as software objects executing on the computing system. The different components, modules, engines, and services described in this application can be considered as implementation objects on the computing system. While the apparatus and methods described in this application are preferably implemented in software, they can also be implemented in hardware, both of which are within the scope of protection of this invention.

[0022] Those skilled in the art will understand that, unless specifically stated otherwise, the singular forms “a,” “an,” “the,” and “the” used in the embodiments of this application may also include the plural forms. It should be further understood that the term “comprising” as used in the specification of this application means the presence of the stated features, integers, steps, operations, elements, and / or components, but does not exclude the presence or addition of one or more other features, integers, steps, operations, elements, components, and / or combinations thereof. It should be understood that when an element is “connected” or “coupled” to another element, it may be directly connected or coupled to the other element, or there may be intermediate elements. Furthermore, “connected” or “coupled” as used herein may include wireless connection or wireless coupling. The term “and / or” as used herein includes all or any unit and all combinations of one or more associated listed items.

[0023] Please see Figure 1 , Figure 1 This is a schematic diagram of an aging test system provided in an embodiment of this application. Figure 1As shown, the aging test system includes: a first host computer 100, an automatic loading and unloading device 200, and an aging chamber 300.

[0024] The first host computer 100 can be implemented as a communication device. For example, the first host computer 100 can be a computer device, or other devices with computing and communication capabilities, such as servers, embedded devices, etc. The first host computer 100 is the control center of the aging test system, used to initiate operations such as installation, testing, power-on, and disassembly of the test modules, and is responsible for storing data related to aging tests, such as aging test results and the operating status parameters of the test modules during the aging test.

[0025] The automatic loading and unloading device 200 is used for installing and removing test modules. The device can utilize structures such as robotic arms to perform loading and unloading functions. In this embodiment, the automatic loading and unloading device 200 can also utilize a cover-opening machine system to automatically open and close the circuit board, further enabling automatic loading and unloading of the test modules. In some embodiments, the automatic loading and unloading device 200 is connected to a first host computer 100. This connection can be a hardwired connection, or a wired network or wireless network communication connection; this embodiment does not limit this. In some embodiments, the first host computer 100 and the automatic loading and unloading device 200 can communicate based on TCP (Transmission Control Protocol).

[0026] The aging chamber 300, also known as an aging furnace, provides a controlled environment for aging tests of electronic modules. The aging chamber 300 can simulate the actual operating conditions of the test module or apply additional stress, accelerating the exposure of potential defects in the test module. Figure 1 As shown, the aging chamber 300 may include a processor 310 and a circuit board ( Figure 1 (Not shown in the image). The processor 310, which can be implemented as a Micro Processor Unit (MCU), is the core control component of the aging chamber 300. It is used to perform functions such as control, data acquisition, instruction execution, and communication to achieve aging tests. The circuit board, also known as the burn-in board (BIB), is the physical carrier of the test modules. It provides a platform for installing and connecting the test modules to ensure their operation. The automatic loading and unloading device 200 can install the test modules onto the circuit board and remove them from the circuit board.

[0027] The first host computer 100 and the processor 310 of the aging chamber 300 can be directly or indirectly connected. This connection can be a hard-wired connection, or a wired or wireless network communication connection; this embodiment does not limit this. In some embodiments, such as Figure 1 As shown, the aging test system may further include a second host computer 400. The second host computer 400 can also be a communication device; for example, it can be a computer or other devices with computing and communication capabilities, such as servers or embedded devices. The second host computer 400 is located between the first host computer 100 and the processor 310, communicating with both, thus indirectly connecting the first host computer 100 and the processor 310. The second host computer 400 is used to forward aging test-related data between the first host computer 100 and the processor 310. In some embodiments, the first host computer 100 and the second host computer 400 can communicate based on UDP (User Datagram Protocol), and the second host computer 400 and the processor 310 can also communicate based on UDP.

[0028] It should be understood that the test module described in this application embodiment can be an electronic module, and the type of test module can be flexibly set according to requirements in practical applications. For example, when applied in the vehicle field, the test module can be an on-board chip module, such as a controller, power management chip, communication module, data acquisition module, etc., or it can be set as an electronic module that needs to operate at high temperatures, etc., according to requirements. It should also be understood that this application embodiment does not limit the number of aging chambers 300 in the aging test system or the number of circuit boards in each aging chamber 300, and one or more can be flexibly set according to requirements in practical applications; this application embodiment also does not limit the number of test modules that can be installed on each circuit board, and can be flexibly set according to the size and requirements of the circuit board in practical applications. For example, a maximum of 64 test modules can be installed on each circuit board.

[0029] Based on this, the functions of each component in the above aging test system can be described as follows.

[0030] The first host computer 100 is used to: send installation instructions to the automatic loading and unloading equipment 200; The automatic loading and unloading equipment 200 is used to: install test modules onto circuit boards in response to installation instructions; The first host computer 100 is also used to: send test commands to the processor 310; The processor 310 is used to: respond to a test command, perform an aging test on the test module mounted on the circuit board, obtain the aging test result, and send the aging test result to the first host computer 100; The first host computer 100 is also used to: send disassembly instructions to the automatic loading and unloading equipment 200; wherein, the disassembly instructions include aging test results; The automatic loading and unloading equipment 200 is also used to: in response to a disassembly command, classify and disassemble the test modules from the circuit board according to the aging test results.

[0031] In some embodiments, the automatic loading and unloading device 200 is further configured to: remove the test module from the circuit board to a first tray when the aging test result indicates that the test module has passed the aging test; and remove the test module from the circuit board to a second tray different from the first tray when the aging test result indicates that the test module has failed the aging test.

[0032] In some embodiments, the first host computer 100 is further configured to: identify test parameters of the test module from the production work order; and send a test instruction to the processor 310 in response to a test enable operation; wherein the test instruction includes test parameters. The processor 310 is further configured to: perform an aging test on the test module on the circuit board according to the test parameters in response to the test instruction.

[0033] In some embodiments, the processor 310 is further configured to: in response to a test instruction, send a forced transmission instruction to the test module according to test parameters; wherein the forced transmission instruction includes signal transmission parameters. The test module is configured to: in response to the forced transmission instruction, perform a signal transmission operation according to the signal transmission parameters; and send the execution result of the signal transmission operation to the processor 310. The processor 310 is further configured to: monitor the operating status parameters of the test module during the execution of the signal transmission operation by the test module; and send the operating status parameters of the test module to the first host computer 100.

[0034] In some embodiments, the aging chamber 300 further includes a power supply module. The first host computer 100 is further configured to: send a power-on command to the processor 310; the processor 310 is further configured to: in response to the power-on command, control the power supply module to supply power to the circuit board; control the test module on the circuit board to power on; and send the module identification data of the test module to the first host computer 100.

[0035] In some embodiments, the first host computer 100 is further configured to: send an installation instruction for the test module to the automatic loading and unloading device 200 when the test module meets the target conditions.

[0036] In some embodiments, the target condition includes at least one of the following: the number of tests passed by the front-end test and the aging test is less than a first threshold.

[0037] In some embodiments, the second host computer 400 is used to forward data related to aging tests between the first host computer 100 and the processor 310.

[0038] For details regarding the functions of each component in the aging test system, the steps performed, and their beneficial effects, please refer to the descriptions in the following method embodiments; further details will not be provided here.

[0039] Please see Figure 2 , Figure 2 This is a flowchart of an aging test method provided in an embodiment of this application. This aging test method can be applied to the aforementioned aging test system, such as the first host computer 100, the automatic loading and unloading equipment 200, and the aging chamber 300. Figure 2 As shown, the aging test method may include the following steps 210 to 270.

[0040] Step 210: The first host computer sends an installation command to the automatic loading and unloading equipment; Step 220: The automatic loading and unloading equipment responds to the installation command and installs the test module onto the circuit board; Step 230: The first host computer sends a test command to the processor; Step 240: The processor responds to the test command and performs an aging test on the test module installed on the circuit board to obtain the aging test results; Step 250: The processor sends the aging test results to the first host computer; Step 260: The first host computer sends a disassembly command to the automatic loading and unloading equipment. The disassembly command includes the aging test results. Step 270: The automatic loading and unloading equipment responds to the disassembly command and, based on the aging test results, disassembles the test modules from the circuit board in categories.

[0041] The first host computer can send installation instructions to the automatic loading and unloading equipment to control the automatic loading and unloading equipment to install the test module onto the circuit board in the aging chamber. This application embodiment does not limit the specific content of the installation instructions; in practical applications, they can be flexibly set according to requirements. For example, the installation instructions may include, but are not limited to: the location data of the test module, the location data of the circuit board to which the test module needs to be installed, and the equipment identification of the aging chamber.

[0042] In this embodiment, the first host computer can send an installation command to the automatic loading and unloading equipment when it identifies a test requirement for the test module, including the need for aging testing. The first host computer can identify the test requirement for the test module from the production work order; for example, it can identify the test requirement from the OC (procurement code) of the production work order. This embodiment does not limit the specific content of the production work order; in practical applications, it can be flexibly set according to requirements. For example, the production work order may include, but is not limited to, test requirements, test parameters, production processes, production information, assembly requirements, etc.

[0043] In some embodiments, to improve the efficiency of aging tests, step 210 may include: when a test module meets the target conditions, the first host computer sends an installation command for the test module to the automatic loading and unloading device. The first host computer can detect whether the test module meets the target conditions. If the target conditions are met, the first host computer controls the automatic loading and unloading device to install the test module onto the circuit board for aging tests. If the target conditions are not met, the test module can be removed, and aging tests on that test module will be excluded.

[0044] By setting target conditions, test modules with existing defects or that do not meet requirements can be excluded, avoiding the waste of testing resources by performing aging tests on these modules. Furthermore, it avoids situations where aging tests are continued despite the presence of other defects, leading to inaccurate test results and improving the efficiency of aging tests. This application does not limit the specific content of the target conditions in its embodiments; they can be flexibly set according to actual needs in practical applications. In some embodiments, the target conditions include, but are not limited to, at least one of the following: passing the pre-station test or the number of aging tests is less than a first threshold. Pre-station testing refers to preliminary testing of the test module at the front end of the production line to identify obvious defects or faults. Pre-station testing includes, but is not limited to, the following tests: basic function testing, electrical performance testing, and visual inspection. By conducting pre-station testing, test modules with serious problems can be quickly screened out, preventing those that fail the pre-station test from entering the subsequent aging test stage, thus improving the efficiency of aging tests. In addition, by excluding test modules that have undergone aging tests multiple times, such as test modules with aging test counts greater than or equal to the first threshold, over-testing can be avoided, further improving the efficiency of aging tests. The embodiments of this application do not limit the specific value of the first threshold. In practical applications, it can be flexibly set according to the needs. For example, the first threshold can be three times, five times, or six times.

[0045] After the automatic loading and unloading equipment installs the test module onto the circuit board, the first host computer can initiate an aging test on the test module. Specifically, the first host computer can first control the processor of the aging chamber to activate the test module. Therefore, in some embodiments, after step 220, the following steps may be added: the first host computer sends a power-on command to the processor of the aging chamber; the processor, in response to the power-on command, controls the power module of the aging chamber to supply power to the circuit board; the processor controls the test module on the circuit board to power on; and the processor sends the module identification data of the test module to the first host computer.

[0046] When the processor powers on the test modules on the control circuit board, it can sequentially enable the power-on signals of each test module on the circuit board, enabling each test module to power on sequentially and avoiding problems such as current surges and resource conflicts caused by simultaneous power-on. After the test modules are powered on, the processor in the aging chamber can establish a communication connection with the test modules, such as through a serial interface. The processor can sequentially read the module identification data of each test module through the serial port and send it to the first host computer. The specific content of the module identification data is not limited in this embodiment. In practical applications, it can be flexibly set according to requirements. For example, the module identification data includes, but is not limited to, at least one of the following: the IMEI (International Mobile Equipment Identity) number of the test module, the location data of the test module, etc.

[0047] The first host computer can send test commands to the processor of the aging chamber to trigger aging tests on the test modules. This application embodiment does not limit the specific method of aging tests; in practical applications, it can be flexibly set according to the type, purpose, and test requirements of the test modules. Taking aging tests including forced transmission tests as an example, forced transmission tests are mainly used to test the signal transmission capability of the test modules in a specified frequency band, ensuring that the signal strength and quality of the test modules meet the standards. Forced transmission tests can verify the communication capability and performance of the test modules. Based on this, in some embodiments, step 230 above may include: the first host computer identifying the test parameters of the test modules from the production work order, and in response to the test enable operation, sending test commands to the processor of the aging chamber, the test commands including the test parameters; step 240 above may include: the processor responding to the test commands, performing aging tests on the test modules on the circuit board according to the test parameters.

[0048] This application does not limit the specific content of the test parameters for the test module. In practical applications, the parameters can be flexibly set according to the type, purpose, aging test content, and test requirements of the test module. In some embodiments, taking the aging test as an example including a forced transmission test, the test parameters of the test module include, but are not limited to, test frequency band data. The test frequency band data is used to indicate the frequency band information for the forced transmission test, and may include the number of frequency bands to be tested and / or the specific frequency bands to be tested. The first host computer can carry the test parameters identified from the production work order in the test instructions, so that the processor can perform aging tests on the test module on the circuit board according to the test parameters.

[0049] In some embodiments, taking the aging test as an example including a forced transmission test, the processor responds to the test instruction and performs an aging test on the test module on the circuit board according to the test parameters, which may include: the processor responding to the test instruction and sending a forced transmission instruction to the test module according to the test parameters, the forced transmission instruction including signal transmission parameters; the test module responding to the forced transmission instruction and performing a signal transmission operation according to the signal transmission parameters, and sending the execution result of the signal transmission operation to the processor; during the process of the test module performing the signal transmission operation, the processor monitors the operating status parameters of the test module and sends the operating status parameters of the test module to the first host computer.

[0050] The processor in the aging chamber can sequentially perform forced transmission tests on multiple test modules on the circuit board. Taking any test module as an example, the processor can send a forced transmission command to the test module via a serial port. This command carries signal transmission parameters, such as the signal transmission frequency band, the number of transmissions, and the operation duration. The test module responds to the forced transmission command by executing the signal transmission operation according to the parameters carried in the command, thus achieving forced signal transmission. After executing the forced signal transmission operation, the test module can send feedback to the processor indicating whether the operation was successful or failed, or whether it was completed or incomplete. Based on the execution result, the processor confirms that the test module has completed or successfully executed the signal transmission operation before triggering the next test module to perform forced signal transmission.

[0051] During the signal transmission operation of the test module, the processor of the aging chamber can monitor the operating status parameters of the test module. For example, the processor can continuously monitor or periodically (e.g., at preset intervals) the operating status parameters of the test module. These operating status parameters indicate the operating status of the test module. This embodiment does not limit the specific content of the operating status parameters of the test module; in practical applications, they can be flexibly set according to requirements. In some embodiments, the operating status parameters include, but are not limited to, at least one of the following: temperature, signal strength, power consumption, command response time, signal quality, frequency stability, etc. The processor can upload the operating status parameters of the test module to a first host computer, so that the first host computer can store the operating status parameters of the test module in a database for subsequent traceability.

[0052] After performing aging tests on the test modules, the processor in the aging chamber can obtain the aging test results. This application embodiment does not limit the specific content of the aging test results; in practical applications, they can be flexibly set according to requirements. For example, the aging test results may include an aging test pass / fail status, indicating whether the test module has passed the aging test; the aging test results may include first and second identifier data; the first identifier data can be 1 or pass, indicating that the test module has passed the aging test; the second identifier data can be 0 or fail, indicating that the test module has failed the aging test. As another example, the aging test results may include aging test performance data, indicating the performance of the test module; the aging test results may include aging test performance levels: first-class, second-class, and third-class, indicating excellent, average, and poor performance of the test module, respectively; the aging test results may include an aging test performance score, ranging from 0 to 100, with a higher value indicating better performance. The processor in the aging chamber can upload the aging test results to a first host computer, which can then store the aging test results in a database for subsequent traceability.

[0053] When the first host computer receives the aging test results, it can determine that the aging test for the test module is complete. At this time, it can send a disassembly command to the automatic loading and unloading equipment to remove the test module from the circuit board in a timely manner. In this embodiment, the disassembly command sent by the first host computer to the automatic loading and unloading equipment can carry the aging test results of the test module, so that the automatic loading and unloading equipment can classify and disassemble the test module according to the aging test results. The test module is stored on a tray after being removed from the circuit board, and each tray can hold one or more test modules. Classification and disassembly refers to disassembling the test module to a tray that matches the aging test results, so that all test modules stored in a tray have the same or similar aging test results. This embodiment does not limit the specific method of classification and disassembly; in practical applications, it can be flexibly set according to the specific content of the aging test results, the number of trays and storage space, and other requirements.

[0054] In some embodiments, step 270 may include: in response to a disassembly command, the automatic loading and unloading equipment disassembles the test module from the circuit board to a first tray if the aging test result indicates that the test module has passed the aging test; and disassembles the test module from the circuit board to a second tray different from the first tray if the aging test result indicates that the test module has failed the aging test. Thus, the first tray contains only test modules that have passed the aging test, and each test module in the first tray can continue to be produced and shipped; the second tray contains only test modules that have failed the aging test, and each test module in the second tray is considered a defective product and cannot continue to be shipped.

[0055] Of course, in practical applications, if the aging test results contain other information, the method of classification and disassembly can be adapted accordingly. For example, if the aging test results include aging test performance levels, a corresponding tray is set up for each aging test performance level, and all test modules stored on the same tray can have the same aging test performance level; if the aging test results include aging test performance scores, different trays are set up for aging test performance scores with different value ranges, and all test modules stored on the same tray have aging test performance scores within the same value range. This embodiment of the application achieves classified storage of test modules through classification and disassembly, avoiding confusion between test modules with different performance characteristics, especially in the case of large-scale aging tests, facilitating subsequent rapid production and shipment.

[0056] In summary, the technical solution provided in this application involves a first host computer controlling an automatic loading and unloading device to install test modules onto the circuit board in an aging chamber via installation commands. Then, the first host computer controls the processor in the aging chamber to perform aging tests on the test modules via test commands, obtaining aging test results. After obtaining the aging test results, the first host computer sends a disassembly command carrying the aging test results to the automatic loading and unloading device, controlling the device to disassemble the test modules from the circuit board according to the aging test results. This application, by introducing an automatic loading and unloading device, achieves automated and intelligent installation and disassembly of test modules, improving the efficiency of test module loading and unloading, further enhancing the efficiency of aging tests, and facilitating the import of a large number of test modules at once for batch aging tests. Furthermore, in this application, the disassembly command sent by the first host computer to the automatic loading and unloading device carries the aging test results, enabling the device to disassemble the test modules according to the results, removing them from the circuit board to trays matching the aging test results, thus achieving categorized storage of the test modules for subsequent production and shipping.

[0057] It should be noted that in the above aging test method, the first host computer and the processor of the aging chamber can be directly or indirectly connected. When the first host computer and the processor are directly connected, data related to the aging test can be sent directly from the first host computer to the processor or vice versa. When the first host computer and the processor are indirectly connected, data related to the aging test is forwarded between the first host computer and the processor via other devices, such as the second host computer. Taking the forwarding of data related to the aging test between the first host computer and the processor via the second host computer as an example, the first host computer can send power-on commands / test commands, etc., to the second host computer, which then forwards the power-on commands / test commands, etc., to the processor of the aging chamber; the processor of the aging chamber can send aging test results / test module operating status parameters, etc., to the second host computer, which then forwards the aging test results / test module operating status parameters, etc., to the first host computer. It should be understood that the specific content of the power-on command / test command sent by the first host computer to the second host computer may be the same as or different from the specific content of the power-on command / test command sent by the second host computer to the processor of the aging chamber. For example, both the test command sent by the first host computer to the second host computer and the test command sent by the second host computer to the processor may include test parameters; or, the test command sent by the first host computer to the second host computer may only be used to control the start of the aging test, while the test command sent by the second host computer to the processor may also include test parameters. In addition, in the case where the first host computer and the processor are indirectly connected, such as when the first host computer and the processor are connected through the second host computer, the second host computer may send the power-on command / test command to the processor of the aging chamber based on the control or command of the first host computer, or it may make its own decision to send the power-on command / test command to the processor of the aging chamber. This application embodiment does not limit this.

[0058] The technical solution provided in this application embodiment will be described below with an example. This example uses data forwarding between the first host computer and the processor of the aging chamber via the second host computer.

[0059] Please see Figure 3 , Figure 3 This is a flowchart of another aging test method provided in an embodiment of this application. This aging test method can be applied to the aforementioned aging test system, such as the first host computer 100, the automatic loading and unloading equipment 200, the aging chamber 300, and the second host computer 400. Figure 3 As shown, the aging test method may include the following steps 301 to 319.

[0060] Step 301: The processor sends the device identification data of the aging chamber to the second host computer.

[0061] Step 302: The second host computer sends the device identification data of the aging box to the first host computer.

[0062] The processor in the aging chamber can read the device identification data of the aging chamber, such as the device ID, and upload it to the second host computer, which then forwards it to the first host computer. The processor in the aging chamber and the second host computer can communicate via an RJ45 bus (an Ethernet interface).

[0063] Step 303: The first host computer sends an installation command to the automatic loading and unloading equipment.

[0064] Step 304: The automatic loading and unloading equipment installs the test module onto the circuit board.

[0065] Step 305: The first host computer sends a power-on command to the second host computer.

[0066] Step 306: The second host computer sends a power-on command to the processor.

[0067] Step 307: The processor controls the power module of the aging chamber to supply power to the circuit board.

[0068] Step 308: Power on the test module on the processor control circuit board.

[0069] Step 309: The processor sends the module identification data of the test module to the second host computer.

[0070] Step 310: The second host computer sends the module identification data of the test module to the first host computer.

[0071] Step 311: The first host computer identifies the test parameters of the test module from the production work order.

[0072] Step 312: The first host computer sends a test command carrying the test parameters to the second host computer.

[0073] Step 313: The second host computer sends a test command carrying the test parameters to the processor.

[0074] In response to the test enable operation, the first host computer can send test commands. The test enable operation can be user-initiated, for example, if the first host computer displays a user interface and the user initiates the test enable operation through the user interface; alternatively, the test enable operation can be automatically initiated by the first host computer.

[0075] Step 314: The processor performs an aging test on the test module on the circuit board according to the test parameters.

[0076] Step 315: The processor sends the operating status parameters of the test module and the aging test results to the second host computer.

[0077] Step 316: The second host computer sends the operating status parameters of the test module and the aging test results to the first host computer.

[0078] Step 317: The first host computer stores the operating status parameters and aging test results of the test module.

[0079] Step 318: The first host computer sends a disassembly command based on the load-bearing aging test results to the automatic loading and unloading equipment; Step 319: The automatic loading and unloading equipment disassembles the test modules from the circuit board according to the aging test results.

[0080] Specifically, steps 301 to 302 are in the system initialization stage, steps 303 to 304 are in the module installation stage, steps 305 to 310 are in the module power-on stage, steps 311 to 317 are in the module testing stage, and steps 318 to 319 are in the module disassembly stage.

[0081] It should be noted that in the above embodiments, the aging test method is described from the perspective of the interaction between the first host computer, the automatic loading and unloading equipment, the processor of the aging chamber, and the second host computer. In practical applications, the steps executed by the first host computer can be implemented as an aging test method on the first host computer side, the steps executed by the automatic loading and unloading equipment can be implemented as an aging test method on the automatic loading and unloading equipment side, and the steps executed by the processor of the aging chamber can be implemented as an aging test method on the processor side, as shown below.

[0082] Please see Figure 4 , Figure 4 This is a flowchart of another aging test method provided in an embodiment of this application. This aging test method can be applied to the aforementioned first host computer. Figure 4 As shown, the aging test method may include the following steps 410 to 430.

[0083] Step 410: Send an installation command to the automatic loading and unloading equipment; wherein, the installation command is used to trigger the automatic loading and unloading equipment to install the test module onto the circuit board in the aging chamber; Step 420: Send a test command to the processor of the aging chamber; wherein the test command is used to trigger an aging test on the test module mounted on the circuit board; Step 430: Upon receiving the aging test results from the processor, send a disassembly command to the automatic loading and unloading equipment; wherein, the disassembly command includes the aging test results, and the disassembly command is used to trigger the automatic loading and unloading equipment to classify and disassemble the test modules from the circuit board according to the aging test results.

[0084] In some embodiments, the aging test method further includes: identifying test parameters of the test module from the production work order; and sending a test instruction to the processor of the aging chamber in response to a test enable operation; wherein the test instruction includes test parameters and is used to trigger the processor of the aging chamber to perform an aging test on the test module according to the test parameters.

[0085] In some embodiments, the aging test method further includes: sending a power-on command to the processor of the aging chamber; wherein the power-on command is used to trigger the processor to control the test module to power on.

[0086] In some embodiments, step 410 includes sending an installation instruction for the test module to the automatic loading and unloading device if the test module meets the target conditions.

[0087] In some embodiments, the target condition includes at least one of the following: the number of tests passed by the front-end test and the aging test is less than a first threshold.

[0088] In some embodiments, the aging test method further includes: sending data related to the aging test to a second host computer, so that the second host computer forwards the data to the processor of the aging chamber.

[0089] Please see Figure 5 , Figure 5 This is a flowchart of another aging test method provided in an embodiment of this application. This aging test method can be applied to the aforementioned automated loading and unloading equipment. Figure 5 As shown, the aging test method may include the following steps 510 to 520.

[0090] Step 510: In response to the installation command, install the test module onto the circuit board in the aging chamber; Step 520: In response to the disassembly command, the test modules are disassembled from the circuit board according to the aging test results in the disassembly command.

[0091] In some embodiments, step 520 may include: if the aging test result indicates that the test module has passed the aging test, removing the test module from the circuit board to a first tray; if the aging test result indicates that the test module has failed the aging test, removing the test module from the circuit board to a second tray different from the first tray.

[0092] Please see Figure 6 , Figure 6 This is a flowchart of another aging test method provided in an embodiment of this application. This aging test method can be applied to the processor in the aforementioned aging chamber. Figure 6 As shown, the aging test method may include the following steps 610 to 620.

[0093] Step 610: In response to the test command, perform an aging test on the test module installed on the circuit board in the aging chamber to obtain the aging test results; Step 620: Send the aging test results to the first host computer.

[0094] In some embodiments, the test instruction includes test parameters; step 610 includes: in response to the test instruction, performing an aging test on the test module on the circuit board according to the test parameters.

[0095] In some embodiments, the above-mentioned aging test of the test module on the circuit board in response to the test command and according to the test parameters includes: in response to the test command, sending a forced transmission command to the test module according to the test parameters, the forced transmission command including signal transmission parameters, the forced transmission command being used to trigger the test module to perform a signal transmission operation according to the signal transmission parameters; monitoring the operating status parameters of the test module during the process of the test module performing the signal transmission operation; and sending the operating status parameters of the test module to a first host computer.

[0096] In some embodiments, the aging test method further includes: in response to a power-on command, controlling the power module of the aging chamber to supply power to the circuit board; controlling the test module on the circuit board to power on; and sending the module identification data of the test module to a first host computer.

[0097] In some embodiments, the above-described aging test method further includes: sending data related to the aging test to a second host computer, so that the second host computer forwards the data to the first host computer.

[0098] For details regarding the descriptions and benefits of each step in the aging test method on the first host computer side, the descriptions and benefits of each step in the aging test method on the automatic loading and unloading equipment side, and the descriptions and benefits of each step in the aging test method on the processor side of the aging chamber, please refer to the descriptions of the aging test system and aging test method in the above embodiments. Further details are omitted here.

[0099] To facilitate better implementation of the aging test method provided in this application embodiment, this application embodiment also provides a computer-readable storage medium storing a computer program or instructions thereon. When the computer program or instructions are executed by a processing unit, they implement the steps in the aging test method described above. For example, they implement the steps in the aging test method on the first host computer side as described above, or they implement the steps in the aging test method on the automatic loading and unloading equipment side as described above, or they implement the steps in the aging test method on the processor side of the aging chamber as described above.

[0100] This application also provides a communication device, which includes a storage unit and a processing unit. The storage unit stores computer programs or instructions. When the computer programs or instructions are executed by the processing unit, the processing unit performs the steps in the aging test method described above.

[0101] For example, the steps in the aging test method on the first host computer side as described above are executed, such as: Send an installation command to the automatic loading and unloading equipment; the installation command is used to trigger the automatic loading and unloading equipment to install the test module onto the circuit board in the aging chamber; Send test commands to the processor of the aging chamber; wherein, the test commands are used to trigger aging tests on the test modules mounted on the circuit board; Upon receiving the aging test results from the processor, a disassembly command is sent to the automated loading and unloading equipment; wherein, the disassembly command includes the aging test results, and the disassembly command is used to trigger the automated loading and unloading equipment to disassemble the test modules from the circuit board according to the aging test results.

[0102] For example, performing the steps in the aging test method on the automated loading and unloading equipment side as described above, such as: In response to the installation instructions, the test module is installed onto the circuit board in the aging chamber; In response to the disassembly command, the test modules are disassembled from the circuit board according to the aging test results in the disassembly command.

[0103] For example, performing the steps in the aging test method on the processor side of the aging chamber as described above, such as: In response to the test command, the test module installed on the circuit board in the aging chamber is subjected to aging test to obtain the aging test results; Send the aging test results to the first host computer.

[0104] The aforementioned processing unit can be a general-purpose processor or a special-purpose processor. For example, it can be a Central Processing Unit (CPU), or it can be other general-purpose processors, digital signal processors (DSPs), application-specific integrated circuits (ASICs), field-programmable gate arrays (FPGAs), or other programmable logic devices, discrete gate or transistor logic devices, discrete hardware components, etc. A general-purpose processor can be a microprocessor, or any conventional processor.

[0105] The aforementioned storage unit can be independent of the processing unit or integrated into the processing unit. The computer program or instructions in the storage unit can be executed by the processing unit.

[0106] Those skilled in the art will understand that all or part of the steps in the various methods of the above embodiments can be implemented by instructions, or by instructions controlling related hardware. These instructions can be stored in a computer-readable storage medium and loaded and executed by a processor. The computer-readable storage medium stores a computer program or instructions, which are loaded by a processor to perform the steps described in the above method embodiments of this application.

[0107] For details on the implementation of each of the above operations / steps, please refer to the previous examples, which will not be repeated here.

[0108] The computer-readable storage medium may include: read-only memory (ROM), random access memory (RAM), disk or optical disk, etc.

[0109] Since the computer program or instructions stored in the computer-readable storage medium can execute the steps in any of the above method embodiments provided in the embodiments of this application, the beneficial effects that the methods described in any of the above method embodiments can achieve can be realized, as detailed in the preceding embodiments, and will not be repeated here.

[0110] This application also provides a computer program product, which includes a computer program or instructions. When the computer program or instructions are executed by a processing unit, they implement the steps in any of the above method embodiments. Therefore, the beneficial effects that the methods described in any of the above method embodiments can achieve can be realized. For details, please refer to the preceding embodiments, which will not be repeated here.

[0111] The aging test system, method, storage medium, and communication device provided in the embodiments of this application have been described in detail above. Specific examples have been used to illustrate the principles and implementation methods of the present invention. The description of the above embodiments is only for the purpose of helping to understand the method and core ideas of the present invention. At the same time, for those skilled in the art, there will be changes in the specific implementation methods and application scope based on the ideas of the present invention. Therefore, the content of this specification should not be construed as a limitation of the present invention.

Claims

1. An aging test system, characterized in that, The aging test system includes: a first host computer, an automatic loading and unloading device, and an aging chamber, wherein the aging chamber includes a processor and a circuit board; wherein... The first host computer is used to: send installation instructions to the automatic loading and unloading equipment; The automatic loading and unloading equipment is used to: in response to the installation command, install the test module onto the circuit board; The first host computer is also used to: send test commands to the processor; The processor is configured to: respond to the test command, perform an aging test on the test module mounted on the circuit board, obtain an aging test result, and send the aging test result to the first host computer; The first host computer is further configured to: send a disassembly command to the automatic loading and unloading equipment; wherein the disassembly command includes the aging test results; The automatic loading and unloading equipment is also used to: in response to the disassembly command, disassemble the test module from the circuit board according to the aging test results.

2. The aging test system according to claim 1, characterized in that, The automatic loading and unloading equipment is further configured to: when the aging test result indicates that the test module has passed the aging test, remove the test module from the circuit board to a first tray; and when the aging test result indicates that the test module has failed the aging test, remove the test module from the circuit board to a second tray different from the first tray.

3. The aging test system according to claim 1, characterized in that, The first host computer is further configured to: identify the test parameters of the test module from the production work order; and send the test instruction to the processor in response to the test enable operation; wherein the test instruction includes the test parameters; The processor is further configured to: in response to the test instruction, perform the aging test on the test module on the circuit board according to the test parameters.

4. The aging test system according to claim 3, characterized in that, The processor is further configured to: in response to the test instruction, send a forced transmission instruction to the test module according to the test parameters; wherein the forced transmission instruction includes signal transmission parameters; The testing module is used to: respond to the forced transmission command, perform a signal transmission operation according to the signal transmission parameters; and send the execution result of the signal transmission operation to the processor; The processor is further configured to: monitor the operating status parameters of the test module during the signal transmission operation performed by the test module; and send the operating status parameters of the test module to the first host computer.

5. The aging test system according to claim 1, characterized in that, The aging chamber also includes a power module; wherein... The first host computer is also used to: send a power-on command to the processor; The processor is further configured to: control the power module to supply power to the circuit board in response to the power-on command; control the test module on the circuit board to power on; and send the module identification data of the test module to the first host computer.

6. The aging test system according to claim 1, characterized in that, The first host computer is also used to: send an installation instruction for the test module to the automatic loading and unloading equipment when the test module meets the target conditions.

7. The aging test system according to claim 6, characterized in that, The target conditions include at least one of the following: passing the pre-station test, or the number of tests in the aging test being less than a first threshold.

8. The aging test system according to claim 1, characterized in that, The aging test system also includes a second host computer; wherein... The second host computer is used to forward data related to the aging test between the first host computer and the processor.

9. An aging test method, characterized in that, Applied to the first host computer; the aging test method includes: Send an installation command to the automatic loading and unloading equipment; wherein, the installation command is used to trigger the automatic loading and unloading equipment to install the test module onto the circuit board in the aging chamber; A test command is sent to the processor of the aging chamber; wherein the test command is used to trigger an aging test on the test module mounted on the circuit board; Upon receiving the aging test results from the processor, a disassembly command is sent to the automatic loading and unloading equipment; wherein, the disassembly command includes the aging test results, and the disassembly command is used to trigger the automatic loading and unloading equipment to disassemble the test module from the circuit board according to the aging test results.

10. A computer-readable storage medium, characterized in that, It stores computer programs or instructions, which, when executed by the processing unit, implement the steps in the aging test method as described in claim 9.

11. A communication device, characterized in that, It includes a storage unit and a processing unit. The storage unit stores a computer program or instructions. When the computer program or instructions are executed by the processing unit, the processing unit performs the following steps: Send an installation command to the automatic loading and unloading equipment; wherein, the installation command is used to trigger the automatic loading and unloading equipment to install the test module onto the circuit board in the aging chamber; A test command is sent to the processor of the aging chamber; wherein the test command is used to trigger an aging test on the test module mounted on the circuit board; Upon receiving the aging test results from the processor, a disassembly command is sent to the automatic loading and unloading equipment; wherein the disassembly command includes the aging test results, which are used to trigger the automatic loading and unloading equipment to disassemble the test module from the circuit board by sorting.

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