Chip pickup device, chip mounting device, and chip pickup method
Patent Information
- Authority / Receiving Office
- JP · JP
- Patent Type
- Patents
- Current Assignee / Owner
- YAMAHA MOTOR CO LTD
- Filing Date
- 2023-06-13
- Publication Date
- 2026-06-22
AI Technical Summary
The stretching of the sheet holding the chip and the off-center position of the chip relative to the camera's field of view cause distortion in imaging, making it difficult to accurately pick up chips from the supply position.
A chip pickup device with a wafer transport mechanism, push-up unit, head, wafer camera, and imaging control unit that adjusts the camera's field of view and recognition target range based on the presence of the pickup unit and chip size to optimize the positional relationship between the chip and camera.
Enables accurate imaging and recognition of chips while suppressing the effects of sheet stretching and distortion, allowing efficient and precise chip pickup.
Smart Images

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