cooling device

Abstract

This invention proposes a cooling device, relating to the field of heat dissipation technology for electronic devices, specifically a cooling device comprising a housing, a hydrophilic membrane, and a cooling structure. The housing has a cooling cavity; the hydrophilic membrane is disposed within the cooling cavity, dividing it into a first cooling chamber and a second cooling chamber, with the first cooling chamber located above the second cooling chamber. The housing also has an inlet and a first outlet; the inlet is for introducing a phase-change liquid, and the first outlet is for discharging a phase-change gas. Both the inlet and outlet are connected to the first cooling chamber. The inner wall of the second cooling chamber has a first bottom wall. The cooling structure includes multiple first cooling columns connected to the first bottom wall and protruding upwards, penetrating the hydrophilic membrane. The horizontal sidewalls of the first cooling columns are connected to the hydrophilic membrane. The cooling device in this embodiment of the invention has higher heat dissipation efficiency.

Description

Technical Field

[0001] This invention relates to the field of heat dissipation technology for electronic devices, and more specifically to cooling devices. Background Technology

[0002] With the continuous improvement of the integration of electronic components and computing power, the heat flux density of chips has increased significantly, and traditional air cooling and liquid cooling can no longer meet the heat dissipation requirements. Existing phase change liquid cooling technology uses the phase change process of phase change liquid to absorb heat from the surface of an object, which can effectively improve heat dissipation efficiency. However, during the heat absorption process, the vapor formed after the phase change liquid evaporates can easily block the subsequent contact between the phase change liquid and the object, resulting in still low heat dissipation efficiency. Summary of the Invention

[0003] The present invention aims to solve at least one of the technical problems existing in the prior art. To this end, the present invention proposes a cooling device with higher heat dissipation efficiency.

[0004] A cooling device according to a first aspect of the present invention includes: The casing has a cooling cavity; A hydrophilic membrane is disposed in the cooling cavity and divides the cooling cavity into a first cooling chamber and a second cooling chamber. The first cooling chamber is located above the second cooling chamber. The shell also has an inlet and a first outlet. The inlet is used to introduce a phase change liquid, and the first outlet is used to discharge a phase change gas. Both the inlet and the first outlet are connected to the first cooling chamber. The inner wall of the second cooling chamber has a first bottom wall. The cooling structure includes a plurality of first cooling columns, which are connected to the first bottom wall and protrude upward and penetrate the hydrophilic membrane. The sidewalls of the first cooling columns in the horizontal direction are connected to the hydrophilic membrane.

[0005] The cooling device according to embodiments of the present invention has at least the following beneficial effects: The heat conducted to the shell can be further conducted to the multiple first cooling columns, and further to the material in contact with the first cooling columns. The phase change liquid can enter the first cooling chamber through the inlet and fall onto the hydrophilic membrane. Through the hydrophilic effect of the hydrophilic membrane, it rapidly diffuses along a direction parallel to the surface of the hydrophilic membrane to the sidewalls of different first cooling columns. The phase change liquid in contact with the sidewalls of the first cooling columns can absorb the heat located on the sidewalls of the first cooling columns through a phase change process and transform into a phase change gas. The phase change gas rises rapidly, detaches from the hydrophilic membrane, and finally exits from the first outlet.

[0006] In the above process, since the flow directions of the phase change gas and the phase change liquid are staggered, the phase change liquid located at other positions on the hydrophilic film can continue to approach the side wall of the first cooling column in a direction parallel to the surface of the hydrophilic film. The phase change liquid continuously entering from the inlet can continuously absorb heat from the phase change of the first cooling column, resulting in higher heat dissipation efficiency.

[0007] According to some embodiments of the present invention, the hydrophilic membrane has a microporous structure, and the housing also has a second outlet for discharging a phase change liquid and communicating with the second cooling chamber.

[0008] According to some embodiments of the present invention, the second outlet is located on one side of the housing in the horizontal direction; the height of the first bottom wall gradually decreases along the direction close to the second outlet.

[0009] According to some embodiments of the present invention, the height of the lower end of the second outlet is less than or equal to the height of the first bottom wall.

[0010] According to some embodiments of the present invention, the first bottom wall further has a guide groove, which is recessed downward relative to the first bottom wall and extends horizontally to the second outlet. The guide groove has a second bottom wall, the side of which is opposite to the first bottom wall is used to contact the heated object.

[0011] According to some embodiments of the present invention, the cooling structure further includes a plurality of second cooling columns, which are connected to the second bottom wall and protrude upward and penetrate the hydrophilic membrane, and the sidewalls of the second cooling columns in the horizontal direction are connected to the hydrophilic membrane.

[0012] According to some embodiments of the present invention, a plurality of first cooling columns are distributed horizontally above the first bottom wall, and a plurality of second cooling columns are distributed horizontally above the second bottom wall, wherein the distribution density of the second cooling columns is greater than or equal to the distribution density of the first cooling columns.

[0013] According to some embodiments of the present invention, the diameter of the first outlet is 1 to 5 times the diameter of the inlet.

[0014] According to some embodiments of the present invention, the height of the lower end of the first outlet is greater than the height of the hydrophilic membrane.

[0015] According to some embodiments of the present invention, the cooling device further includes an isolator and a plurality of spray heads, the isolator being housed in the first cooling chamber and dividing the first cooling chamber into a receiving cavity and a phase change cavity, the inlet being connected to the receiving cavity, and the first outlet being connected to the phase change cavity; The plurality of spray heads are inserted through the insulating member and are used to spray the phase change liquid in the receiving cavity toward the hydrophilic membrane.

[0016] Additional aspects and advantages of the invention will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of the invention. Attached Figure Description

[0017] The present invention will be further described below with reference to the accompanying drawings and embodiments, wherein: Figure 1 This is an overall schematic diagram of a cooling device according to some embodiments of the first aspect of the present invention; Figure 2 for Figure 1 Schematic cross-sectional view of the intermediate cooling unit; Figure 3 for Figure 1 A cross-sectional view of the intermediate cooling device from another angle; Figure 4 for Figure 3 A magnified view shown at point A in the middle; Figure 5 for Figure 1 A cross-sectional view of the intermediate cooling device from another angle; Figure 6 for Figure 2 A schematic diagram of the first bottom wall; Figure 7 This is a schematic diagram of the first bottom wall of a cooling device according to some embodiments of the second aspect of the present invention.

[0018] Figure label: Cooling device 10; The shell 100, cooling cavity 110, first cooling chamber 111, receiving cavity 1111, phase change cavity 1112, second cooling chamber 112, first bottom wall 1121, guide groove 1122, second bottom wall 1123, inlet 120, first outlet 130, and second outlet 140; Hydrophilic membrane 200; Cooling structure 300, first cooling column 310, second cooling column 320; 400 isolation components; 500 spray head. Detailed Implementation

[0019] Embodiments of the present invention are described in detail below. Examples of these embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present invention, and should not be construed as limiting the present invention.

[0020] In the description of this invention, it should be understood that the orientation descriptions, such as up, down, front, back, left, right, etc., are based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limiting this invention.

[0021] In the description of this invention, "several" means one or more, "multiple" means two or more, "greater than," "less than," and "exceeding" are understood to exclude the stated number, while "above," "below," and "within" are understood to include the stated number. The use of "first" and "second" in the description is merely for distinguishing technical features and should not be construed as indicating or implying relative importance, or implicitly indicating the number of indicated technical features, or implicitly indicating the order of the indicated technical features.

[0022] In the description of this invention, unless otherwise explicitly defined, terms such as "set up," "install," and "connect" should be interpreted broadly, and those skilled in the art can reasonably determine the specific meaning of the above terms in this invention in conjunction with the specific content of the technical solution.

[0023] In the description of this invention, the terms "one embodiment," "some embodiments," "illustrative embodiment," "example," "specific example," or "some examples," etc., refer to specific features, structures, materials, or characteristics described in connection with that embodiment or example, which are included in at least one embodiment or example of the invention. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples.

[0024] In existing technologies, cooling devices utilize the phase change process of phase change liquids to absorb heat from the surface of objects, achieving high heat absorption efficiency. Specifically, some technologies use a spray device to directly spray phase change liquids downwards onto heat sinks. Upon contact with the heat sink, the phase change liquid absorbs heat and eventually transforms into a phase change gas, detaching from the heat sink. However, through long-term practical experience, the inventors discovered that if the phase change liquid directly contacts the heat sink to absorb heat, the gas pressure generated by the resulting phase change gas can prevent subsequent inflows of phase change liquid from contacting the heat sink, leading to insufficient heat dissipation efficiency.

[0025] In view of this, please refer to Figures 1 to 7 As shown, the present invention proposes a cooling device 10, including a housing 100, a hydrophilic membrane 200 and a cooling structure 300.

[0026] Please refer to Figure 1As shown, the outer side of the housing 100 of the present invention is designed to contact a heat-generating object, and the heat of the object can be conducted to the housing 100. The housing 100 also has a cooling cavity 110, and the heat conducted to the housing 100 can also be conducted to a material located in the cooling cavity 110.

[0027] Please refer to the following: Figure 3 , Figure 4 As shown, the hydrophilic membrane 200 of the present invention is disposed in the cooling chamber 110, dividing the cooling chamber 110 into a first cooling chamber 111 and a second cooling chamber 112. The first cooling chamber 111 is located above the second cooling chamber 112. The housing 100 also has an inlet 120 and a first outlet 130. The inlet 120 is used to introduce a phase change liquid, and the first outlet 130 is used to discharge a phase change gas. Both the inlet 120 and the first outlet 130 are connected to the first cooling chamber 111. The inner wall of the second cooling chamber 112 has a first bottom wall 1121. The cooling structure 300 includes a plurality of first cooling columns 310. The plurality of first cooling columns 310 are connected to the first bottom wall 1121 and protrude upward, penetrating the hydrophilic membrane 200. The sidewalls of the first cooling columns 310 in the horizontal direction are connected to the hydrophilic membrane 200.

[0028] Through the above scheme, the heat conducted to the housing 100 can be further conducted to the multiple first cooling columns 310, and further conducted to the material in contact with the first cooling columns 310. The phase change liquid can enter the first cooling chamber 111 through the inlet 120 and fall onto the hydrophilic membrane 200. Through the hydrophilic effect of the hydrophilic membrane 200, it quickly diffuses along a direction parallel to the surface of the hydrophilic membrane 200 to the sidewalls of different first cooling columns 310. The phase change liquid in contact with the sidewalls of the first cooling columns 310 can absorb the heat located on the sidewalls of the first cooling columns 310 through a phase change process and transform into a phase change gas. The phase change gas rises and quickly leaves the hydrophilic membrane 200, and finally exits from the first outlet 130.

[0029] In the above process, since the flow directions of the phase change gas and the phase change liquid are staggered, the phase change liquid located at other positions on the hydrophilic film 200 can continue to approach the side wall of the first cooling column 310 in a direction parallel to the surface of the hydrophilic film 200. The phase change liquid continuously entering from the inlet 120 can continuously absorb heat from the first cooling column 310 through phase change, resulting in higher heat dissipation efficiency.

[0030] It should be noted that the hydrophilic membrane 200 of the present invention is made of a hydrophilic material, and the water droplet contact angle is less than 90°. On the other hand, without departing from the inventive concept of the present invention, those skilled in the art can further adjust the thermal conductivity of the hydrophilic membrane 200 and the cooling structure 300. In some embodiments, the thermal conductivity of the first cooling column 310 is from 10 W / m·K to 500 W / m·K, and the thermal conductivity of the hydrophilic membrane 200 does not exceed one-tenth of the thermal conductivity of the first cooling column 310. In the above embodiment, the thermal conductivity of the hydrophilic membrane 200 is much lower than that of the first cooling column 310, which can effectively prevent heat from being conducted to the hydrophilic membrane 200. This allows heat to accumulate on the side wall of the first cooling column 310 and be conducted to the phase change liquid in contact with the first cooling column 310, thereby increasing the phase change rate of the phase change liquid in contact with the first cooling column 310. It also prevents the phase change liquid falling on the hydrophilic membrane 200 from undergoing a direct phase change, which is beneficial for the phase change liquid falling on the hydrophilic membrane 200 to diffuse toward the first cooling column 310 and finally undergo a phase change after contacting the first cooling column 310.

[0031] It should be understood that the present invention does not limit the specific materials of the phase change liquid. Those skilled in the art can adjust the materials of the phase change liquid according to the actual cooling requirements, and adjust the phase change material to water, fluorinated liquid, hydrofluorocarbon, hydrocarbon, hydrated salt, etc.

[0032] Without departing from the inventive concept of this invention, those skilled in the art can further adjust the structure of the hydrophilic membrane 200.

[0033] As a preferred method, please refer to Figure 2 , Figure 3 , Figure 4 As shown, in some embodiments, the hydrophilic membrane 200 has a microporous structure, and the housing 100 also has a second outlet 140 for discharging the phase change liquid and communicating with the second cooling chamber 112. Through this scheme, when a large amount of phase change liquid accumulates on the hydrophilic membrane 200, the micropores of the hydrophilic membrane 200 allow the phase change liquid to flow from the first cooling chamber 111 into the second cooling chamber 112. Excess phase change liquid can eventually flow out from the second outlet 140, which helps to avoid excessive accumulation of phase change liquid in the first cooling chamber 111, thereby avoiding affecting the outflow of the phase change gas and improving the heat dissipation stability of the cooling device 10. On the other hand, the phase change liquid entering the second cooling chamber 112 also absorbs heat from the first bottom wall 1121 through contact with it, reducing the temperature of the first bottom wall 1121 and ultimately lowering the object temperature. The resulting phase change gas can also flow out from the second outlet 140.

[0034] The micropores in the microporous structure mentioned in this invention are micron-sized or nano-sized pores. Those skilled in the art can further select the materials for making the hydrophilic membrane, and use fiber membranes, aerogels or ceramic materials to make the hydrophilic membrane and form the microporous structure of the hydrophilic membrane.

[0035] Without departing from the inventive concept of this invention, those skilled in the art can adjust the relative positions of the first outlet 130 and the second outlet 140. As a preferred embodiment, please refer to... Figure 1 As shown, the first outlet 130 and the second outlet 140 are both located on the same side of the housing 100 (i.e., both are located on the right side of the housing 100) and are arranged horizontally (i.e., arranged in the left-right direction). With the above arrangement, the first outlet 130 and the second outlet 140 occupy less space in the vertical direction, which is beneficial to reducing the height of the cooling device 10.

[0036] Based on the above scheme, those skilled in the art can further adjust the specific size relationship and position of the first outlet 130 and the second outlet 140. In some embodiments, the lower end of the first outlet 130 is higher than the lower end of the second outlet 140. Through the above scheme, the phase change liquid can preferentially flow out through the second outlet 140, thereby allowing the phase change gas to preferentially flow out from the first outlet 130, reducing the phase change gas blockage in the first cooling chamber 111, which is beneficial to improving the cooling efficiency of the cooling device 10.

[0037] Further, please refer to Figure 2 , Figure 5 , Figure 6 As shown, where Figure 2 This is a schematic diagram of the cooling device 10, cut out in cross-section parallel to the vertical plane. Figure 5 This is a schematic diagram of the cooling device 10, cut out in a cross-section parallel to the horizontal plane. Figure 6 This is for Figure 2 A schematic diagram of the first bottom wall 1121 (cooling structure 300 not shown) is provided. In some embodiments, the second outlet 140 is located on one side of the housing 100 in the horizontal direction; the height of the first bottom wall 1121 gradually decreases along the direction close to the second outlet 140. Through this design, the phase change liquid entering the second cooling chamber 112 can be guided by the first bottom wall 1121 towards the second outlet 140, which facilitates the cooling device 10 in discharging the phase change liquid and prevents the phase change liquid from accumulating in the second cooling chamber 112.

[0038] It should be noted that, without departing from the inventive concept of this invention, those skilled in the art can adjust the shape of the first bottom wall 1121 themselves.

[0039] For example, please refer to Figure 5 , Figure 6As shown, Figure 6 The first bottom wall 1121 shown has multiple slopes. In some embodiments, the height of the portion of each slope near the second outlet 140 is lower than the height of the portion away from the second outlet 140, so that the phase change liquid falling on different slopes can flow along the slopes toward the second outlet 140.

[0040] Please refer to Figure 7 As shown, Figure 7 The first bottom wall 1121 shown has three inclined surfaces. In some embodiments, the height of the portion of each inclined surface near the second outlet 140 is lower than the height of the portion away from the second outlet 140, so that the phase change liquid falling on different inclined surfaces can flow along the inclined surfaces toward the second outlet 140.

[0041] Furthermore, in some embodiments, the height of the lower end of the second outlet 140 is less than or equal to the height of the first bottom wall 1121. With this design, the phase change liquid located on the first bottom wall 1121 can flow directly out of the second cooling chamber 112 from the second outlet 140, thereby reducing the accumulation of the phase change liquid in the second cooling chamber 112.

[0042] Further, please refer to Figure 6 As shown, the first bottom wall 1121 also has a guide groove 1122, which is recessed downward relative to the first bottom wall 1121 and extends horizontally to the second outlet 140. The guide groove 1122 has a second bottom wall 1123, the side of which faces away from the first bottom wall 1121 is used to contact the heat-generating object. Because the guide groove 1122 is recessed downward relative to the first bottom wall 1121, the phase change liquid entering the second cooling chamber 112 will accumulate in the guide groove 1122 and then flow to the second outlet 140 through the guide groove 1122. The second bottom wall 1123, which is used to contact the heat-generating object, will accumulate more heat, and the phase change liquid accumulated in the guide groove 1122 will contact the second bottom wall 1123 during its flow towards the second outlet 140, carrying away the heat from the second bottom wall 1123, thereby more effectively reducing the temperature of the heat-generating object.

[0043] Without departing from the inventive concept of this invention, those skilled in the art can adjust the number of guide grooves 1122 according to the number and position of the heat-generating objects to be cooled, or adjust the number of guide grooves 1122 according to the number and position of the heat-generating areas of a single heat-generating object. For example, in some embodiments, the cooling device 10 needs to cool multiple chips. Those skilled in the art can design multiple guide grooves 1122, and arrange different second bottom walls 1123 to contact different chips, allowing the cooling device 10 to selectively cool the chips and quickly remove heat from the chips. In some embodiments, the cooling device 10 needs to cool multiple localized heat-generating areas within a chip. Those skilled in the art can design multiple guide grooves 1122, and arrange different second bottom walls 1123 to contact different heat-generating areas on the chip, allowing the cooling device 10 to selectively cool the localized heat-generating areas, quickly remove heat from the heat-generating areas, avoid localized overheating of the heat-generating object, and effectively reduce the overall temperature of the heat-generating object.

[0044] Further, please refer to Figure 3 , Figure 5 , Figure 6 As shown, in some embodiments, the cooling structure 300 further includes a plurality of second cooling columns 320, which are connected to the second bottom wall 1123 and protrude upward and penetrate the hydrophilic membrane 200. The sidewalls of the second cooling columns 320 in the horizontal direction are connected to the hydrophilic membrane 200.

[0045] Through the above scheme, the heat conducted to the second bottom wall 1123 can be further conducted to the multiple second cooling columns 320, and further conducted to the material in contact with the second cooling columns 320. The phase change liquid can enter the first cooling chamber 111 through the inlet 120 and fall onto the hydrophilic membrane 200. Through the hydrophilic effect of the hydrophilic membrane 200, it quickly diffuses along a direction parallel to the surface of the hydrophilic membrane 200 to the sidewalls of different second cooling columns 320. The phase change liquid in contact with the sidewalls of the second cooling columns 320 can absorb the heat located on the sidewalls of the second cooling columns 320 through a phase change process and transform into a phase change gas. The phase change gas rises and quickly leaves the hydrophilic membrane 200, and finally exits from the first outlet 130.

[0046] In the above process, since the flow directions of the phase change gas and the phase change liquid are staggered, the phase change liquid located at other positions on the hydrophilic film 200 can continue to approach the side wall of the second cooling column 320 in a direction parallel to the surface of the hydrophilic film 200. The phase change liquid continuously entering from the inlet 120 can continuously absorb heat from the second cooling column 320 through phase change, resulting in higher heat dissipation efficiency.

[0047] Based on the above solution, those skilled in the art can further adjust the structure of the second cooling column 320.

[0048] In some embodiments, a plurality of first cooling columns 310 are distributed horizontally above the first bottom wall 1121, and a plurality of second cooling columns 320 are distributed horizontally above the second bottom wall 1123, wherein the distribution density of the second cooling columns 320 is greater than or equal to the distribution density of the first cooling columns 310.

[0049] Those skilled in the art should understand that the "distribution density" referred to in this invention specifically refers to the number of structures within the same horizontal projected area. In the above embodiment, the first cooling column 310 is disposed on the first bottom wall 1121, and the second cooling column 320 is disposed on the second bottom wall 1123. Therefore, the ratio of the number of first cooling columns 310 to the projected area of ​​the first bottom wall 1121 on the horizontal plane is the distribution density of the first cooling columns 310, and the ratio of the number of second cooling columns 320 to the projected area of ​​the second bottom wall 1123 on the horizontal plane is the distribution density of the second cooling columns 320. Since the distribution density of the second cooling columns 320 in the above embodiment is greater than or equal to the distribution density of the first cooling columns 310, within the same horizontal area, having the same or more second cooling columns 320 facilitates the transfer of more heat to the second cooling columns 320, thereby improving the efficiency of the second cooling columns 320 in absorbing heat from the object, and resulting in higher heat dissipation efficiency of the cooling device 10.

[0050] In some embodiments, the diameter of the first outlet 130 is 1 to 5 times the diameter of the inlet 120. With this design, the diameter of the first outlet 130 is larger than the diameter of the inlet 120. Since the first outlet 130 is used to discharge phase change gas, making the diameter of the first outlet 130 larger than the diameter of the inlet 120 facilitates faster discharge of the phase change gas, thereby accelerating the rate at which the phase change gas escapes from the first cooling chamber 310, resulting in higher heat dissipation efficiency of the cooling device 10.

[0051] Further, please refer to Figure 1 As shown, in some embodiments, the height of the lower end of the first outlet 130 is greater than the height of the hydrophilic membrane 200. With this design, the phase change liquid entering the first cooling chamber 111 is more easily blocked by the lower end of the first outlet 130, thus remaining in the first cooling chamber 111. This facilitates the preferential flow of the phase change gas from the first cooling chamber 111 out through the first outlet 130, reducing the residence time of the phase change gas in the first cooling chamber 111. Furthermore, it allows the phase change liquid located at other positions on the hydrophilic membrane 200 to continue approaching the sidewall of the first cooling column 310 in a direction parallel to the surface of the hydrophilic membrane 200, thereby improving heat dissipation efficiency.

[0052] Please refer to Figure 3 , Figure 4As shown, in some embodiments, the cooling device 10 further includes an isolator 400 and a plurality of spray nozzles 500. The isolator 400 is housed in a first cooling chamber 111 and divides the first cooling chamber 111 into a receiving cavity 1111 and a phase change cavity 1112. An inlet 120 communicates with the receiving cavity 1111, and a first outlet 130 communicates with the phase change cavity 1112. The plurality of spray nozzles 500 pass through the isolator 400 and are used to spray the phase change liquid in the receiving cavity 1111 onto the hydrophilic membrane 200. With the above scheme, the phase change liquid can enter the receiving cavity 1111 through the inlet 120, and then enter the phase change cavity 1112 through the spray nozzles 500, and then fall onto the hydrophilic membrane 200, and diffuse through the hydrophilic membrane 200 to the side wall of the cooling column to perform phase change heat absorption. The above process enables the downward-spraying phase change liquid to avoid the phase change gas rising along the side wall of the cooling column through the directional spray of the spray head 500, thereby allowing the phase change liquid to diffuse more stably to the side wall of the cooling column in a direction parallel to the surface of the hydrophilic film 200.

[0053] The embodiments of the present invention have been described in detail above with reference to the accompanying drawings. However, the present invention is not limited to the above embodiments, and various changes can be made within the scope of knowledge possessed by those skilled in the art without departing from the spirit of the present invention. Furthermore, the embodiments of the present invention and the features thereof can be combined with each other unless otherwise specified.

Claims

1. A cooling device, characterized in that, include: The casing has a cooling cavity; A hydrophilic membrane is disposed in the cooling cavity and divides the cooling cavity into a first cooling chamber and a second cooling chamber. The first cooling chamber is located above the second cooling chamber. The shell also has an inlet and a first outlet. The inlet is used to introduce a phase change liquid, and the first outlet is used to discharge a phase change gas. Both the inlet and the first outlet are connected to the first cooling chamber. The inner wall of the second cooling chamber has a first bottom wall. The cooling structure includes a plurality of first cooling columns, which are connected to the first bottom wall and protrude upward and penetrate the hydrophilic membrane. The sidewalls of the first cooling columns in the horizontal direction are connected to the hydrophilic membrane.

2. The cooling device according to claim 1, characterized in that, The hydrophilic membrane has a microporous structure, and the shell also has a second outlet for discharging phase change liquid and communicating with the second cooling chamber.

3. The cooling device according to claim 2, characterized in that, The second outlet is located on one side of the housing in the horizontal direction; the height of the first bottom wall gradually decreases along the direction close to the second outlet.

4. The cooling device according to claim 2, characterized in that, The height of the lower end of the second outlet is less than or equal to the height of the first bottom wall.

5. The cooling device according to claim 2, characterized in that, The first bottom wall also has a guide groove, which is recessed downward relative to the first bottom wall and extends horizontally to the second outlet. The guide groove has a second bottom wall, the side of which is opposite to the first bottom wall is used to contact the heated object.

6. The cooling device according to claim 5, characterized in that, The cooling structure further includes a plurality of second cooling columns, which are connected to the second bottom wall and protrude upward and penetrate the hydrophilic membrane. The sidewalls of the second cooling columns in the horizontal direction are connected to the hydrophilic membrane.

7. The cooling device according to claim 6, characterized in that, Multiple first cooling columns are distributed horizontally above the first bottom wall, and multiple second cooling columns are distributed horizontally above the second bottom wall, with the distribution density of the second cooling columns being greater than or equal to the distribution density of the first cooling columns.

8. The cooling device according to claim 1, characterized in that, The diameter of the first outlet is 1 to 5 times the diameter of the inlet.

9. The cooling device according to claim 1, characterized in that, The height of the lower end of the first outlet is greater than the height of the hydrophilic membrane.

10. The cooling device according to claim 1, characterized in that, The cooling device further includes an isolating element and multiple spray heads. The isolating element is housed in the first cooling chamber and divides the first cooling chamber into a receiving cavity and a phase change cavity. The inlet is connected to the receiving cavity, and the first outlet is connected to the phase change cavity. The plurality of spray heads are inserted through the insulating member and are used to spray the phase change liquid in the receiving cavity toward the hydrophilic membrane.

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