Display module and electronic device

Abstract

This application relates to the field of display technology, specifically to a display module and an electronic device. The purpose of this application is to solve the problem of static electricity accumulation in the first support layer, which affects the operation of the display layer. The display module provided in this application includes a display layer, a first support layer, and a second support layer. The first support layer is a conductive layer, stacked between the display layer and the second support layer. The display module also includes a grounding structure electrically connected to the first support layer. The grounding structure is configured to ground the first support layer, allowing static electricity in the first support layer to flow out under the guidance of the grounding structure. This prevents static electricity accumulation in the first support layer and reduces the likelihood of electrostatic discharge. The electric field within the display layer is more stable, resulting in more stable image display and touch functionality, which is beneficial for the normal operation of the display layer.

Description

Technical Field

[0001] This application relates to the field of display technology, specifically to a display module and an electronic device. Background Technology

[0002] Display modules in electronic devices such as mobile phones and tablets typically consist of a stacked display layer and a first support layer. The display layer is used for display and touch control, while the first support layer is made of a high-modulus metal to protect the display layer. However, due to friction and other factors, static electricity can easily accumulate in the first support layer, affecting the operation of the display layer. Summary of the Invention

[0003] This application provides a display module and an electronic device that can avoid static electricity accumulation in the first support layer, which is beneficial to the normal operation of the display layer.

[0004] In a first aspect, embodiments of this application provide a display module, including: a display layer, a first support layer and a second support layer stacked together, the display layer being located on one side of the first support layer, the second support layer being located on the other side of the first support layer relative to the display layer, the material used to make the first support layer including a conductive material, the display module further including a grounding structure, the grounding structure being configured to be grounded, the first support layer being electrically connected to the grounding structure and grounded through the grounding structure.

[0005] With the above settings, the first support layer is grounded through the grounding structure. Static electricity in the first support layer flows out of the first support layer under the guidance of the grounding structure, making it difficult for static electricity to accumulate in the first support layer and making it difficult for electrostatic discharge to occur. The electric field in the display layer is relatively stable, which makes the image display effect and touch function of the display layer relatively stable, which is conducive to the normal operation of the display layer.

[0006] In some embodiments that may include the above embodiments, the grounding structure includes a conductive element and a grounding layer. A second support layer is stacked between the first support layer and the grounding layer. The grounding layer is used for electrical connection with the mid-frame of the electronic device. A connection hole is provided on the second support layer, and the conductive element is disposed in the connection hole. One end of the conductive element is connected to the first support layer, and the other end of the conductive element is connected to the grounding layer.

[0007] With the above configuration, the conductive component and the grounding layer electrically connect the first support layer and the middle frame of the electronic device. Static electricity in the first support layer flows into the middle frame under the guidance of the conductive component and the grounding layer, making it difficult for static electricity to accumulate in the first support layer and making it difficult for electrostatic discharge to occur. The electric field in the display layer is relatively stable, so that the image display effect and touch function of the display layer are relatively stable, which is conducive to the normal operation of the display layer.

[0008] In some embodiments that may include the above embodiments, the connection hole includes a first opening and a second opening that are interconnected. The first opening is disposed on the second support layer, the second opening is disposed on the ground layer, and the conductive element is located in the first opening and the second opening.

[0009] The above settings help to prevent the grounding layer from hitting the conductive components in the direction from the grounding layer to the display layer, thereby preventing the conductive components from hitting the display layer and protecting the display layer.

[0010] In some embodiments that may include the above embodiments, the ground layer is disposed along the edge of the second support layer, and the ground layer surrounds the window.

[0011] The above design reduces the thickness and weight of the display module in certain areas, facilitating miniaturization and weight reduction of electronic devices. Furthermore, it increases the contact area between the grounding layer and the mid-frame, allowing the grounding structure to guide static electricity from the first support layer into the mid-frame. This prevents static electricity accumulation and electrostatic discharge within the first support layer, promoting proper operation of the display layer.

[0012] In some embodiments that may include the above embodiments, the connection hole includes a first connection hole and a second connection hole, the first connection hole and the second connection hole are disposed at intervals along the edge of the second support layer, and the conductive element includes a first conductive element and a second conductive element, the first conductive element is located in the first connection hole, and the second conductive element is located in the second connection hole.

[0013] With the above configuration, the grounding structure can guide the static electricity in the first support layer into the middle frame through the first conductive element and the second conductive element, making it difficult for static electricity to accumulate in the first support layer and making it less likely for electrostatic discharge to occur, which is beneficial to the normal operation of the display layer.

[0014] In some embodiments that may include the above embodiments, the second support layer has adjacent first support edges and second support edges, with an included angle between the first support edges and the second support edges. The grounding layer includes a first conductor and a second conductor. The first conductor is disposed along the first support edge, and the length direction of the first conductor is parallel to the first support edge. The second conductor is disposed along the second support edge, and the length direction of the second conductor is parallel to the second support edge. One end of the first conductive element is connected to the first support layer, and the other end of the first conductive element is connected to the first conductor. One end of the second conductive element is connected to the first support layer, and the other end of the second conductive element is connected to the second conductor.

[0015] The above settings increase the contact area between the grounding layer and the middle frame, which helps the grounding structure guide static electricity in the first support layer into the middle frame, making it less likely for static electricity to accumulate in the first support layer and less likely for electrostatic discharge to occur, thus facilitating the normal operation of the display layer.

[0016] In some embodiments that may include the above embodiments, the display module further has a third support edge adjacent to the second support edge, the second support edge and the third support edge have an included angle, and the third support edge is disposed opposite to the first support edge. The grounding layer further includes a third conductor, which is disposed along the third support edge and the length direction of the third conductor is parallel to the third support edge. The connection hole further includes a third connection hole, which is disposed at intervals with the first connection hole and the second connection hole along the edge of the second support layer. The conductive element further includes a third conductive element, one end of which is connected to the first support layer and the other end of which is connected to the third conductor. One end of the second conductor is connected to the first conductor and the other end of the second conductor is connected to the third conductor. The first conductor, the second conductor and the third conductor form a window.

[0017] The above settings increase the contact area between the grounding layer and the middle frame, which helps the grounding structure guide static electricity in the first support layer into the middle frame, making it less likely for static electricity to accumulate in the first support layer and less likely for electrostatic discharge to occur, thus facilitating the normal operation of the display layer.

[0018] In some embodiments that may include the above-described embodiments, the conductive element includes conductive adhesive. With the above configuration, the conductive element is conductive to electrically connect the first support layer and the mid-frame of the electronic device.

[0019] In some embodiments that may include the above-described embodiments, the ground layer comprises copper foil. With the above arrangement, the ground layer is conductive to electrically connect the first support layer and the mid-frame of the electronic device.

[0020] In some embodiments that may include the above embodiments, the grounding structure includes a bend, the first end of which is connected to the edge of the first support layer, and the projection of the bend is located outside the second support layer in a plane parallel to the display layer. The bend is used for electrical connection with the mid-frame of the electronic device.

[0021] With the above configuration, the bending part is located between the display module and the middle frame, and can be electrically connected to the middle frame of the electronic device to connect the first support layer and the middle frame, so that the first support layer is grounded.

[0022] In some embodiments that may include the above embodiments, the grounding structure further includes a connecting layer connected to the bending portion, a second support layer is stacked between the first support layer and the connecting layer, and the second end of the bending portion is connected to the connecting layer.

[0023] With the above setup, the contact area between the grounding structure and the second support layer is large, and the connection is relatively firm.

[0024] In some embodiments that may include the above-described examples, the bending portion and the first support layer are an integral structure. This configuration ensures a strong connection between the bending portion and the first support layer, avoiding the need for bonding, welding, or other similar processes.

[0025] Secondly, embodiments of this application provide an electronic device, including: a mid-frame, a back cover, and a display module as described in any of the above embodiments. The back cover is disposed on one side of the mid-frame, the display module is disposed on the other side of the mid-frame, and a grounding structure is electrically connected to the mid-frame.

[0026] With the above configuration, the first support layer is electrically connected to the middle frame of the electronic device through the grounding structure. Static electricity in the first support layer flows into the middle frame under the guidance of the grounding structure, making it difficult for static electricity to accumulate in the first support layer and making it difficult for electrostatic discharge to occur. The electric field in the display layer is relatively stable, which makes the image display effect and touch function of the display layer relatively stable, which is conducive to the normal operation of the display layer. Attached Figure Description

[0027] Figure 1 This is a schematic diagram of the structure of an electronic device in one embodiment;

[0028] Figure 2 This is a schematic diagram of the electronic device in another embodiment;

[0029] Figure 3 This is a schematic diagram of the electronic device in yet another embodiment;

[0030] Figure 4 This is a schematic diagram of the structure of the display module provided in the embodiments of this application;

[0031] Figure 5 This is a schematic diagram of the display module in the first embodiment;

[0032] Figure 6 This is a schematic diagram of the structure of a cover plate, a first adhesive layer, a display layer, a second adhesive layer, a first support layer, a third adhesive layer, a second support layer, and a grounding layer in one embodiment;

[0033] Figure 7 This is a schematic diagram of the display module structure in the second embodiment;

[0034] Figure 8 This is a schematic diagram of the structure of a cover plate, a first adhesive layer, a display layer, a second adhesive layer, a first support layer, a third adhesive layer, and a second support layer in one embodiment;

[0035] Figure 9 for Figure 5 The diagram shown is a structural schematic of the display module from another angle.

[0036] Figure 10 for Figure 7 The diagram shown is a structural schematic of the display module from another angle.

[0037] Figure 11 This is a schematic diagram of the display module in the third embodiment;

[0038] Figure 12 This is a schematic diagram of the structure of the third adhesive layer and the second support layer in one embodiment;

[0039] Figure 13 This is a schematic diagram of the structure of a cover plate, a first adhesive layer, a display layer, a second adhesive layer, a first support layer, a third adhesive layer, a second support layer, and a conductive component in one embodiment.

[0040] Figure 14 This is a schematic diagram of the structure of the third adhesive layer, the second support layer, and the grounding layer in one embodiment;

[0041] Figure 15 This is a schematic diagram of the display module structure in the fourth embodiment;

[0042] Figure 16 This is a schematic diagram of the display module in the fifth embodiment;

[0043] Figure 17 This is a schematic diagram of the structure of the first support layer in one embodiment;

[0044] Figure 18 This is a schematic diagram of the structure of the cover plate, the first adhesive layer, the display layer, the second adhesive layer, the first support layer, the third adhesive layer, and the second support layer in another embodiment.

[0045] Explanation of reference numerals in the attached figures:

[0046] 10: Electronic devices;

[0047] 20: Middle frame; 20a: First middle frame; 20b: Second middle frame; 21: First top frame; 22: First bottom frame; 23: First border; 24: Second border; 25: Second top frame; 26: Second bottom frame; 27: Third border; 28: Fourth border;

[0048] 30: Back cover;

[0049] 40: Display module; 40a: First display section; 40b: Second display section; 410: Side edge; 411: First side edge; 412: Second side edge; 413: Third side edge; 414: Fourth side edge; 415: Fifth side edge; 416: Sixth side edge; 420: Display layer; 430: Cover plate; 441: First adhesive layer; 442: Second adhesive layer; 443: Third adhesive layer; 450: First support layer; 460: Second support layer; 461: First support edge; 462 463: Second support edge; 470: Third support edge; 471: Grounding structure; 471: Conductive component; 4711: First conductive component; 4712: Second conductive component; 4713: Third conductive component; 4714: Window; 472: Grounding layer; 4721: First conductor; 4722: Second conductor; 4723: Third conductor; 473: Bend; 474: Connecting layer; 480: Connecting hole; 481: First opening; 482: Second opening; 483: Third opening;

[0050] 50: Hinges. Detailed Implementation

[0051] To make the objectives, technical solutions, and advantages of the embodiments of this application clearer, the technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of this application, and not all possible embodiments. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0052] This application provides an electronic device, which may include at least one of the following: mobile phone, foldable phone, tablet computer, laptop computer, in-vehicle device, virtual reality device, augmented reality device, etc. This application does not limit the type of electronic device.

[0053] Please refer to Figure 1 The electronic device 10 of this application embodiment includes a mid-frame 20. The material of the mid-frame 20 may include at least one conductive material such as aluminum alloy, stainless steel, or titanium alloy. The electronic device 10 also includes a back cover 30 and a display module 40. The back cover 30 is disposed on one side of the mid-frame 20, and the display module 40 is disposed on the other side of the mid-frame 20 opposite to the back cover 30. The back cover 30, the mid-frame 20, and the display module 40 surround the electronic device 10. The display module 40 is used to realize functions such as image display and touch control. The display module 40 has a side 410, which is connected to the mid-frame 20 to mount the display module 40 on the mid-frame 20. The material of the back cover 30 may include at least one conductive material such as aluminum alloy, stainless steel, or titanium alloy. The material of the back cover 30 may also include at least one material such as plastic, glass, or ceramic.

[0054] The electronic device 10 may also include a middle plate and a battery, wherein the middle plate is connected to the middle frame 20, and both the middle plate and the battery are located between the back cover 30 and the display module 40.

[0055] Please refer to Figure 2 and Figure 3 In an example where the electronic device 10 includes a foldable phone, the mid-frame 20 includes a first mid-frame 20a and a second mid-frame 20b, which are foldably connected. Exemplarily, the first mid-frame 20a and the second mid-frame 20b can be connected by a hinge 50 to allow the first mid-frame 20a to fold or unfold relative to the second mid-frame 20b. This application embodiment does not limit the structure of the hinge 50, as long as it allows the first mid-frame 20a to fold or unfold relative to the second mid-frame 20b.

[0056] The first middle frame 20a includes a first top frame 21 and a first bottom frame 22 arranged opposite to each other, and a first border 23 and a second border 24 arranged opposite to each other. The first border 23 connects one end of the first top frame 21 and one end of the first bottom frame 22; the second border 24 connects the other end of the first top frame 21 and the other end of the first bottom frame 22. The second middle frame 20b includes a second top frame 25 and a second bottom frame 26 arranged opposite to each other, and a third border 27 and a fourth border 28 arranged opposite to each other. The third border 27 connects one end of the second top frame 25 and one end of the second bottom frame 26; the fourth border 28 connects the other end of the second top frame 25 and the other end of the second bottom frame 26.

[0057] In some implementations, such as Figure 2 As shown, the hinge 50 can be located between the second frame 24 and the third frame 27. The hinge 50 connects the second frame 24 and the third frame 27, making the first middle frame 20a and the second middle frame 20b foldable.

[0058] In other implementations, such as Figure 3 As shown, the hinge 50 can be located between the first bottom frame 22 and the second top frame 25. The hinge 50 connects the first bottom frame 22 and the second top frame 25, so that the first middle frame 20a and the second middle frame 20b can be folded together.

[0059] Please refer to Figure 2 and Figure 3This application provides a display module 40, which may include a first display portion 40a and a second display portion 40b. The first display portion 40a and the second display portion 40b are foldably connected, and the second display portion 40b can be folded or unfolded relative to the first display portion 40a. The first display portion 40a may include a first side 411, a second side 412, and a third side 413, and the second display portion 40b may include a fourth side 414, a fifth side 415, and a sixth side 416.

[0060] exist Figure 2 In the illustrated electronic device 10, a first display unit 40a may be disposed on a first middle frame 20a, a first side 411 may be connected to a first top frame 21, a second side 412 may be connected to a first border 23, and a third side 413 may be connected to a first bottom frame 22. A second display unit 40b may be disposed on a second middle frame 20b, a fourth side 414 may be connected to a second top frame 25, a fifth side 415 may be connected to a fourth border 28, and a sixth side 416 may be connected to a second bottom frame 26.

[0061] exist Figure 3 In the illustrated electronic device 10, a first display unit 40a may be disposed on a first middle frame 20a, a first side 411 may be connected to a first top frame 21, a second side 412 may be connected to a first border 23, and a third side 413 may be connected to a second border 24. A second display unit 40b may be disposed on a second middle frame 20b, a fourth side 414 may be connected to a second bottom frame 26, a fifth side 415 may be connected to a third border 27, and a sixth side 416 may be connected to a fourth border 28.

[0062] Please refer to Figure 4 The display module 40 includes a display layer 420, which may include at least one of an organic light-emitting diode (OLED) or a liquid crystal display (LCD). The display layer 420 is used to realize functions such as image display and touch control.

[0063] Please combine Figure 3 and Figure 4The display module 40 includes a cover plate 430, which is stacked with the display layer 420. The cover plate 430 covers the side of the display layer 420 away from the back cover 30 and protects the display layer 420. In some implementations, the cover plate 430 may be made of at least one of the following materials: polymethyl methacrylate (PMMA), tempered glass, sapphire glass, or ultra-thin glass (UTG). In embodiments where the material of the cover plate 430 includes ultra-thin glass, the cover plate 430 has a high modulus, making the display layer 420 less susceptible to damage during the folding or unfolding of the second display portion 40b relative to the first display portion 40a, thus providing better protection for the display layer 420.

[0064] Please refer to Figure 4 The display module 40 may include a first adhesive layer 441, which is stacked between the cover plate 430 and the display layer 420 and is used to bond the cover plate 430 and the display layer 420. The material used to make the first adhesive layer 441 may include at least one of the following: optically clear adhesive (OCA), optically clear resin (OCR), or optically clear film (OCF).

[0065] Please combine Figure 3 and Figure 4 The display module 40 includes a first support layer 450, and the first support layer 450, the display layer 420, and the cover plate 430 are stacked together. The first support layer 450 is located on the side of the display layer 420 away from the cover plate 430 and is used to protect the display layer 420. The first support layer 450 is a conductive layer, which can also be understood as the material used to make the first support layer 450 including at least one of conductive materials such as metal or conductive plastic. In one example, the material used to make the first support layer 450 may include at least one of high-modulus metals such as stainless steel, aluminum alloy, or titanium alloy. Therefore, the display layer 420 is not easily damaged during the folding or unfolding of the second display part 40b relative to the first display part 40a, and the first support layer 450 provides good protection for the display layer 420.

[0066] Please refer to Figure 4The display module 40 includes a second adhesive layer 442, which is stacked between the display layer 420 and the first support layer 450 and is used to bond the display layer 420 and the first support layer 450. The material used to make the second adhesive layer 442 may include at least one of the following: pressure-sensitive adhesive (PSA), optically transparent adhesive, or moisture-curing reactive polyurethane (PUR).

[0067] Please combine Figure 3 and Figure 4 The display module 40 includes a second support layer 460, which, along with a first support layer 450 and a display layer 420, is stacked. The second support layer 460 is located on the side of the first support layer 450 away from the display layer 420. The edge of the second support layer 460 is connected to the middle frame 20 to mount the display module 40 onto the middle frame 20. For example, the second support layer 460 may include a first support edge 461, a second support edge 462, and a third support edge 463. The first support edge 461 may be parallel to a first side edge 411 and connected to a first top frame 21; the second support edge 462 may be parallel to a second side edge 412 and connected to a first frame 23; and the third support edge 463 may be parallel to a third side edge 413 and connected to a first bottom frame 22. The material used to make the second support layer 460 may include at least one of polyimide (PI) or carbon fiber.

[0068] Please refer to Figure 4 The display module 40 further includes a third adhesive layer 443, which is stacked between the first support layer 450 and the second support layer 460 and is used to bond the first support layer 450 and the second support layer 460. The material used to make the third adhesive layer 443 may include at least one of pressure-sensitive adhesive, optically transparent adhesive, or moisture-curing reactive polyurethane.

[0069] In the above example, in a plane parallel to the display layer 420, the projections of the cover plate 430, the first support layer 450, and the second support layer 460 can all be located within the projection of the display layer 420. This can also be understood as the area of ​​the display layer 420 being larger than the areas of the cover plate 430, the first support layer 450, or the second support layer 460.

[0070] Please combine Figure 3 and Figure 4The display module 40 also includes a grounding structure 470, which can be disposed in at least one of the first display section 40a or the second display section 40b. This embodiment will be described using the first display section 40a as an example, although the grounding structure 470 can also be disposed in the second display section 40b. The grounding structure 470 is conductive, and the material used to make the grounding structure 470 can include at least one of conductive materials such as copper, aluminum, gold, graphene, and conductive adhesive. The grounding structure 470 is electrically connected to the first support layer 450 and is configured to be grounded. For example, the grounding structure 470 can be electrically connected to the middle frame 20 for grounding. Alternatively, the grounding structure 470 can also be electrically connected to at least one of the back cover 30, the middle plate, or the battery for grounding.

[0071] The display module 40 provided in this embodiment includes a display layer 420, a first support layer 450, and a second support layer 460. The first support layer 450 is a conductive layer and is stacked between the display layer 420 and the second support layer 460. The display module 40 also includes a grounding structure 470, which is electrically connected to the first support layer 450. The grounding structure 470 is configured to ground so that the first support layer 450 is grounded. Static electricity in the first support layer 450 flows out of the first support layer 450 under the guidance of the grounding structure 470, making it difficult for static electricity to accumulate in the first support layer 450 and making it less likely for electrostatic discharge (ESD) to occur. The electric field in the display layer 420 is relatively stable, so that the image display effect and touch function of the display layer 420 are relatively stable, which is beneficial to the normal operation of the display layer 420.

[0072] In one alternative embodiment, please refer to Figure 5 The grounding structure 470 may include a conductive element 471 and a grounding layer 472. The grounding layer 472 and the second support layer 460 are stacked, with the grounding layer 472 located on the side of the second support layer 460 away from the first support layer 450. The grounding layer 472 may be bonded to the second support layer 460, or the grounding layer 472 may be connected to the second support layer 460 by means of pressure welding or similar methods. The material used to make the grounding layer 472 may include at least one of conductive materials such as copper, aluminum, gold, graphene, and conductive adhesive. For example, the grounding layer 472 may include copper foil. The grounding layer 472 is configured to be grounded, and the grounding layer 472 may be connected to the middle frame 20 (e.g., ...). Figure 2 (As shown) Electrical connection to ground.

[0073] Please combine Figure 5 and Figure 6The second support layer 460 has a through-hole 480, which can be circular, rectangular, or other shapes. One end of the through-hole 480 faces the first support layer 450, and the other end faces the ground layer 472. A conductive element 471 is located within the through-hole 480, with one end connected to the first support layer 450 and the other end connected to the ground layer 472. The material used to make the conductive element 471 can include at least one of conductive materials such as copper, aluminum, gold, graphene, and conductive adhesive; for example, the conductive element 471 can include conductive adhesive.

[0074] Through the above configuration, the conductive element 471 and the grounding layer 472 connect the first support layer 450 and the middle frame 20 (e.g., Figure 2 As shown, the static electricity in the first support layer 450 flows into the middle frame 20 under the guidance of the conductive element 471 and the ground layer 472, making it difficult for static electricity to accumulate in the first support layer 450 and making it difficult for electrostatic discharge to occur. The electric field in the display layer 420 is relatively stable, so that the image display effect and touch function of the display layer 420 are relatively stable, which is conducive to the normal operation of the display layer 420.

[0075] In some implementation methods, please combine Figure 5 and Figure 6 The connection hole 480 includes a first opening 481, a second opening 482, and a third opening 483 that are interconnected. The conductive element 471 is located within the first opening 481, the second opening 482, and the third opening 483. Specifically, the first opening 481 is located in the second support layer 460, the second opening 482 is located in the grounding layer 472, and the third opening 483 is located in the third adhesive layer 443. This arrangement helps to prevent the grounding layer 472 from contacting the conductive element 471 in the direction from the grounding layer 472 towards the display layer 420, thereby protecting the display layer 420.

[0076] In other implementations, please combine Figure 7 and Figure 8 The connecting hole 480 includes a first opening 481 and a third opening 483 that are interconnected, and the conductive element 471 is located within the first opening 481 and the third opening 483. The first opening 481 is located in the second support layer 460, and the third opening 483 is located in the third adhesive layer 443.

[0077] In the above embodiments, please refer to Figure 9 Connection hole 480 (e.g.) Figure 6As shown, multiple connecting holes 480 and conductive elements 471 can be provided. Each connecting hole 480 is spaced apart from the edge of the second support layer 460, and each conductive element 471 is disposed within a different connecting hole 480. For example, in an example where both connecting holes 480 and conductive elements 471 are provided in two, the connecting holes 480 include a first connecting hole and a second connecting hole, and the conductive elements 471 include a first conductive element 4711 and a second conductive element 4712. The first conductive element 4711 is disposed within the first connecting hole, and the second conductive element 4712 is disposed within the second connecting hole. In an example where three connecting holes 480 and conductive elements 471 are provided, the connecting holes 480 further include a third connecting hole, and the conductive elements 471 further include a third conductive element 4713, which is disposed within the third connecting hole. Of course, four or more connecting holes 480 and conductive elements 471 can also be provided.

[0078] In one alternative implementation, please refer to Figure 7 In a plane parallel to the display layer 420, the projection of the ground layer 472 can coincide with the projection of the second support layer 460.

[0079] In another alternative implementation, please refer to Figure 10 In a plane parallel to the display layer 420, the projection of the ground layer 472 can lie within the projection of the second support layer 460. This can also be understood as the area of ​​the ground layer 472 being smaller than the area of ​​the second support layer 460. Therefore, the thickness of the display module 40 in certain areas can be reduced, thus lightening the weight of the display module 40 and contributing to the miniaturization and weight reduction of the electronic device 10.

[0080] In the example above, please combine Figure 2 and Figure 10 The grounding layer 472 can be disposed along the edge of the second support layer 460. For example, the grounding layer 472 can be disposed along the first support edge 461 and connected to the first top frame 21. The length direction of the grounding layer 472 can be parallel to the length direction of the first support edge 461, thereby increasing the contact area between the grounding layer 472 and the middle frame 20. This facilitates the grounding structure 470 in guiding static electricity in the first support layer 450 into the middle frame 20, making it less likely for static electricity to accumulate in the first support layer 450 and less likely for electrostatic discharge to occur, which is beneficial for the normal operation of the display layer 420.

[0081] In some implementations, such as Figure 11 As shown, the grounding layer 472 may include a first conductor 4721 and a second conductor 4722, and the first conductor 4721 and the second conductor 4722 may be arranged along one of the first support edge 461, the second support edge 462 or the third support edge 463, respectively.

[0082] In one example, please combine Figure 2 and Figure 11 The first conductor 4721 can be disposed along the first support edge 461 and connected to the first top frame 21; the second conductor 4722 can be disposed along the second support edge 462 and connected to the first frame 23. The length direction of the first conductor 4721 can be parallel to the first support edge 461, and the length direction of the second conductor can be parallel to the second support edge 462. There is an angle between the first conductor 4721 and the second conductor 4722, and the first conductor 4721 can be connected to the second conductor 4722.

[0083] In another example, the first conductor 4721 can be positioned along the first support edge 461 and connected to the first top frame 21, while the second conductor 4722 can be positioned along the third support edge 463 and connected to the first bottom frame 22. The length direction of the first conductor 4721 can be parallel to the first support edge 461, and the length direction of the second conductor can be parallel to the third support edge 463. The first conductor 4721 and the second conductor 4722 are spaced apart from each other, and the length directions of the first conductor 4721 and the second conductor 4722 are parallel.

[0084] In embodiments where the conductive element 471 includes a first conductive element 4711 and a second conductive element 4712, the first conductive element 4711 can be connected to the first conductor 4721, and the second conductive element 4712 can be connected to the second conductor 4722. This facilitates the grounding structure 470 in guiding static electricity within the first support layer 450 into the middle frame 20, making it less prone to static electricity accumulation and electrostatic discharge, which is beneficial for the normal operation of the display layer 420.

[0085] In some implementation methods, please combine Figure 2 and Figure 9The grounding layer 472 can form a window. For example, the grounding layer 472 can include a first conductor 4721, a second conductor 4722, and a third conductor 4723. The first conductor 4721 can be disposed along the first support edge 461 and connected to the first top frame 21; the second conductor 4722 can be disposed along the second support edge 462 and connected to the first frame 23; the third conductor 4723 can be disposed along the third support edge 463 and connected to the first bottom frame 22, and the length direction of the third conductor 4723 can be parallel to the third support edge 463. The first conductor 4721 is connected to the second conductor 4722, and the second conductor 4722 is connected to the third conductor 4723. The first conductor 4721, the second conductor 4722, and the third conductor 4723 form a window 4714, with at least a portion of the second support layer 460 exposed in the window 4714. The above settings increase the contact area between the grounding layer 472 and the middle frame 20, which helps the grounding structure 470 guide static electricity in the first support layer 450 into the middle frame 20, making it less likely for static electricity to accumulate in the first support layer 450 and less likely for electrostatic discharge to occur, which is beneficial for the normal operation of the display layer 420.

[0086] In an embodiment where the conductive element 471 includes a first conductive element 4711, a second conductive element 4712, and a third conductive element 4713, the first conductive element 4711 can be connected to the first conductor 4721, the second conductive element 4712 can be connected to the second conductor 4722, and the third conductive element 4713 can be connected to the third conductor 4723.

[0087] In the above embodiments, the steps for preparing the display module 40 may include:

[0088] like Figure 12 As shown: S110, connecting holes 480 are formed on the second support layer 460 and the third adhesive layer 443.

[0089] like Figure 8 As shown: S120, the third adhesive layer 443 is bonded to the first support layer 450.

[0090] Please combine Figure 8 and Figure 13 S130: Inject conductive adhesive into the connection hole 480.

[0091] Thus, the conductive adhesive forms a conductive component 471.

[0092] like Figure 7 As shown: S140, the grounding layer 472 is attached to the second support layer 460.

[0093] Here, grounding layer 472 may include copper foil.

[0094] Alternatively, the steps for preparing the display module 40 may also include:

[0095] like Figure 14 As shown: S210, connection holes 480 are formed on the grounding layer 460, the second support layer 450 and the third adhesive layer 443.

[0096] like Figure 6 As shown: S220, the third adhesive layer 443 is bonded to the first support layer 450.

[0097] Please combine Figure 5 and Figure 6 S230: Inject conductive adhesive into the connection hole 480.

[0098] Please combine Figure 2 and Figure 15 In another alternative embodiment, the grounding structure 470 may further include a bend 473 disposed on the side 410 of the display module 40. A first end of the bend 473 is connected to the edge of the first support layer 450, and at least a portion of the projection of the bend 473 is located outside the second support layer 460 in a plane parallel to the display layer 420. Thus, the bend 473 is located between the display module 40 and the middle frame 20, and can electrically connect the first support layer 450 and the middle frame 20, grounding the first support layer 450. Exemplarily, the bend 473 may be disposed on the second side 412 and may be connected to the first frame 23.

[0099] With the above settings, the static electricity in the first support layer 450 flows into the middle frame under the guidance of the bending part 473, making it difficult for static electricity to accumulate in the first support layer 450 and making it difficult for electrostatic discharge to occur. The electric field in the display layer 420 is relatively stable, so that the image display effect and touch function of the display layer 420 are relatively stable.

[0100] In some implementations, the bent portion 473 is spaced apart from the second support layer 460 in a direction parallel to the display layer 420, so as to be close to the middle frame 20. In other implementations, the bent portion 473 contacts the edge of the second support layer 460 in a direction parallel to the display layer 420.

[0101] In some implementations, such as Figure 16 As shown, the second end of the bent portion 473 can be connected to the edge of the second support layer 460.

[0102] In other implementations, such as Figure 15As shown, the grounding structure 470 also includes a connecting layer 474, and the second end of the bent portion 473 can be connected to the edge of the connecting layer 474. The connecting layer 474 is stacked with the second support layer 460, and the connecting layer 474 is located on the side of the second support layer 460 away from the first support layer 450. The area of ​​the connecting layer 474 can be smaller than the area of ​​the second support layer 460, and the connecting layer 474 is located close to the edge of the second support layer 460. Through this arrangement, the contact area between the grounding structure 470 and the second support layer 460 is larger, resulting in a more secure connection.

[0103] Please combine Figure 15 , Figure 17 and Figure 18 In the above example, the bent portion 473 and the first support layer 450 can be bonded or welded; alternatively, the bent portion 473 and the first support layer 450 can be an integral structure, with the bent portion 473 including at least a portion of the first support layer 450 and formed by bending the first support layer 450. Thus, the connection between the bent portion 473 and the first support layer 450 is strong, avoiding the use of bonding, welding, or other similar processes.

[0104] The connecting layer 474, the bending portion 473, and the first support layer 450 can also be an integral structure. Both the connecting layer 474 and the bending portion 473 can include at least a portion of the first support layer 450, and both the connecting layer 474 and the bending portion 473 can be formed by bending the first support layer 450.

[0105] It should be noted that, in the description of the embodiments of this application, unless otherwise explicitly specified and limited, the terms "connected" and "linked" should be interpreted broadly. For example, they can refer to a fixed connection or an integral connection; they can also refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; or they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in the embodiments of this application according to the specific circumstances.

[0106] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the embodiments of this application, and are not intended to limit them; although this application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the foregoing embodiments, or make equivalent substitutions for some or as many of the technical features as possible; and these modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of this application.

Claims

1. A display module, characterized by It includes a display layer, a first support layer, and a second support layer; The first support layer is a conductive layer, and the first support layer is stacked between the display layer and the second support layer; The display module further includes a grounding structure, which is electrically connected to the first support layer and is configured to be grounded.

2. The display module of claim 1, wherein, The grounding structure includes conductive components and a grounding layer; The second support layer is stacked between the first support layer and the ground layer, and the ground layer is used for electrical connection with the mid-frame of the electronic device; The second support layer has a through-hole, and the conductive element is disposed in the through-hole. One end of the conductive element is connected to the first support layer, and the other end of the conductive element is connected to the ground layer.

3. The display module of claim 2, wherein, The connection hole includes a first opening and a second opening that are interconnected, the first opening being disposed on the second support layer and the second opening being disposed on the grounding layer; The conductive element is located inside the first opening and the second opening.

4. The display module of claim 2 or 3, wherein, The grounding layer is disposed along the edge of the second support layer, and the grounding layer forms a window.

5. The display module of any one of claims 2 to 4, wherein, The connection hole includes a first connection hole and a second connection hole, and the first connection hole and the second connection hole are spaced apart along the edge of the second support layer; The conductive element includes a first conductive element and a second conductive element, wherein the first conductive element is located inside the first connecting hole and the second conductive element is located inside the second connecting hole.

6. The display module of claim 5, wherein, The second support layer display module has an adjacent first support edge and a second support edge, and there is an included angle between the first support edge and the second support edge; The grounding layer includes a first conductor and a second conductor, wherein the first conductor is disposed along the first support edge and the length direction of the first conductor is parallel to the first support edge; The second conductor is disposed along the second support edge, and the length direction of the second conductor is parallel to the second support edge; One end of the first conductive element is connected to the first support layer, and the other end of the first conductive element is connected to the first conductor; one end of the second conductive element is connected to the first support layer, and the other end of the second conductive element is connected to the second conductor.

7. The display module according to claim 6, characterized in that, The second support layer also has a third support edge adjacent to the second support edge, the second support edge and the third support edge have an included angle, and the third support edge is disposed opposite to the first support edge; The grounding layer further includes a third conductor, which is disposed along the third support edge, and the length direction of the third conductor is parallel to the third support edge; The connecting hole further includes a third connecting hole, which is spaced apart from the first connecting hole and the second connecting hole along the edge of the second support layer; the conductive element further includes a third conductive element, which is located in the third connecting hole, with one end of the third conductive element connected to the first support layer and the other end of the third conductive element connected to the third conductor; One end of the second conductor is connected to the first conductor, and the other end of the second conductor is connected to the third conductor. The first conductor, the second conductor, and the third conductor form a window.

8. The display module of any one of claims 2-7, wherein, The conductive component includes conductive adhesive; and / or The grounding layer includes copper foil.

9. The display module of any one of claims 1-8, wherein, The grounding structure includes a bent portion, the first end of which is connected to the edge of the first support layer. In a plane parallel to the display layer, at least a portion of the projection of the bent portion is located outside the second support layer. The bent portion is used to connect to the mid-frame of the electronic device.

10. The display module of claim 9, wherein, The grounding structure further includes a connecting layer connected to the bent portion, and the second support layer is stacked between the first support layer and the connecting layer, with the second end of the bent portion connected to the connecting layer.

11. The display module of claim 9 or 10, wherein, The bent portion and the first support layer are an integral structure.

12. An electronic device, characterized in that, include: A mid-frame, a back cover, and a display module according to any one of claims 1 to 11, wherein the back cover is disposed on one side of the mid-frame and the display module is disposed on the other side of the mid-frame; The grounding structure is electrically connected to the middle frame.

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