Display substrate, preparation method thereof and display device

Abstract

A display substrate, its fabrication method, and a display device are provided. The display substrate includes a light-transmitting region, a transition region, and a display region. The transition region at least partially surrounds the light-transmitting region, and the display region at least partially surrounds the transition region. The display substrate includes: a substrate; a driving circuit layer located on the substrate; a light-emitting device layer located on the side of the driving circuit layer away from the substrate; and an encapsulation layer located on the side of the light-emitting device layer away from the substrate. The light-emitting device layer includes a first side surface near the light-transmitting region, which is located within the transition region. The display substrate includes a cut sidewall facing the light-transmitting region. The first side surface is located on the side of the cut sidewall away from the light-transmitting region, along the direction from the display region to the light-transmitting region. The first side surface and the cut sidewall are spaced apart.

Description

Technical Field

[0001] This disclosure relates to the field of display technology, and in particular to a display substrate, a method for preparing the substrate, and a display device. Background Technology

[0002] Punch-hole displays are widely used in various display products due to their ability to achieve high screen-to-body ratios and integrate functional components such as cameras. The core of this technology involves creating a hole in the display panel, requiring the removal or thinning of structures such as a metal light-shielding layer in that area to meet light transmission requirements. However, creating the hole disrupts the structural integrity of the panel, making it a weak point and posing a reliability risk, leading to decreased product yield and lifespan.

[0003] It should be noted that the information disclosed in the background section above is only used to enhance the understanding of the background of this disclosure, and therefore may include information that does not constitute prior art known to those skilled in the art. Summary of the Invention

[0004] In one aspect, a display substrate is provided, the display substrate including a light-transmitting region, a transition region, and a display region, the transition region at least partially surrounding the light-transmitting region, and the display region at least partially surrounding the transition region, the display substrate including: a substrate; a driving circuit layer located on the substrate; a light-emitting device layer located on a side of the driving circuit layer away from the substrate; and an encapsulation layer located on a side of the light-emitting device layer away from the substrate, wherein the light-emitting device layer includes a first side surface near the light-transmitting region, the first side surface being located within the transition region, the display substrate including a cut sidewall facing the light-transmitting region, the first side surface being located on a side of the cut sidewall away from the light-transmitting region, in a direction from the display region to the light-transmitting region, the first side surface and the cut sidewall being spaced apart.

[0005] According to some exemplary embodiments, the encapsulation layer includes a second side located near the light-transmitting region, the second side being located in the transition region, and the orthographic projection of the second side on the substrate and the orthographic projection of the first side on the substrate at least partially overlap.

[0006] According to some exemplary embodiments, the display substrate further includes a touch functional layer located on the side of the encapsulation layer away from the substrate. The touch functional layer includes at least one touch metal layer and at least one touch insulating layer. The at least one touch insulating layer includes a third side surface near the light-transmitting area, and the third side surface is located on the side of the first side surface near the light-transmitting area.

[0007] According to some exemplary embodiments, the driving circuit layer includes at least one inorganic insulating layer, which extends from the display area to the transition area. The at least one inorganic insulating layer includes a first inorganic insulating portion and a second inorganic insulating portion connected to each other. The first inorganic insulating portion is located on the side of the first side closest to the light-transmitting area, and the second inorganic insulating portion is located on the side of the first side away from the light-transmitting area. The surface of the first inorganic insulating portion away from the substrate is closer to the substrate than the surface of the second inorganic insulating portion away from the substrate.

[0008] According to some exemplary embodiments, the driving circuit layer includes at least one isolation structure located in the transition region, at least a portion of the light-emitting device layer being disconnected at the isolation structure; and the light-emitting device layer includes a light-emitting material extension located on the side of at least one of the isolation structures near the light-transmitting region, the side of the light-emitting material extension near the light-transmitting region including the first side surface.

[0009] According to some exemplary embodiments, along the direction from the display area to the center of the light-transmitting area, the size of the light-emitting material extension is a first size, the distance between the first side and the light-transmitting area is a first distance, and the first size is smaller than the first distance.

[0010] According to some exemplary embodiments, the first spacing is greater than or equal to 50 micrometers.

[0011] According to some exemplary embodiments, the display substrate includes a display extension located on the side of at least one of the partition structures near the light-transmitting area. The display extension includes a first display extension sub-part and a second display extension sub-part. The first display extension sub-part includes the light-emitting material extension. The second display extension sub-part is located on the side of the light-emitting material extension near the light-transmitting area. The thickness of at least a portion of the second display extension sub-part is less than the thickness of at least a portion of the first display extension sub-part.

[0012] In another aspect, a method for fabricating a display substrate is provided. The display substrate includes a light-transmitting region, a transition region, and a display region. The transition region at least partially surrounds the light-transmitting region, and the display region at least partially surrounds the transition region. The fabrication method includes: forming a driving circuit layer on a substrate; forming a light-emitting device layer on a side of the driving circuit layer away from the substrate, the light-emitting device layer including a first side surface near the light-transmitting region, the first side surface being located within the transition region; the display substrate including a cut sidewall facing the light-transmitting region, the first side surface being located on a side of the cut sidewall away from the light-transmitting region, in a direction pointing from the display region to the light-transmitting region, the first side surface and the cut sidewall being spaced apart; and forming an encapsulation layer on the side of the light-emitting device layer away from the substrate.

[0013] In another aspect, a display device is provided, the display device comprising a display substrate as described in any of the preceding claims. Attached Figure Description

[0014] Other objects and advantages of this disclosure will become apparent from the following description of the disclosure with reference to the accompanying drawings, and will help to provide a comprehensive understanding of the disclosure.

[0015] Figure 1 A schematic plan view of a display substrate according to some embodiments of the present disclosure is shown.

[0016] Figure 2 A schematic cross-sectional structural diagram of a display substrate according to some embodiments of the present disclosure is shown, wherein, Figure 2 It shows along Figure 1 A cross-sectional structural diagram taken from the centerline B-B'.

[0017] Figure 3 A schematic cross-sectional structural diagram of a display substrate according to some embodiments of the present disclosure is shown, wherein, Figure 3 It shows along Figure 1 Cross-sectional structural diagram taken from the centerline C-C'.

[0018] Figures 4A-4C The diagram schematically illustrates the fabrication process of a display substrate according to some embodiments of the present disclosure.

[0019] Figure 5A A schematic cross-sectional structural diagram of a display substrate according to some embodiments of the present disclosure is shown, wherein, Figure 5A It shows along Figure 1 Another cross-sectional structure diagram taken from the centerline B-B'.

[0020] Figure 5B schematically shown Figure 5AA magnified view of a portion of the central region E1.

[0021] Figure 6 A flowchart illustrating a method for fabricating a display substrate according to some embodiments of the present disclosure is shown schematically.

[0022] Figures 7A-7C The diagram schematically illustrates the fabrication process of a display substrate fabrication method according to some embodiments of the present disclosure.

[0023] Figure 8 A schematic plan view of a display device according to some embodiments of the present disclosure is shown.

[0024] It should be noted that, for clarity, the dimensions of layers, structures, or regions in the accompanying drawings used to describe embodiments of this disclosure may be enlarged or reduced; that is, these drawings are not drawn to actual scale. Detailed Implementation

[0025] To make the objectives, technical solutions, and advantages of the embodiments of this disclosure clearer, the technical solutions of the embodiments of this disclosure will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some, not all, of the embodiments of this disclosure. All other embodiments obtained by those skilled in the art based on the described embodiments of this disclosure without creative effort are within the scope of protection of this disclosure.

[0026] It should be noted that, for clarity and / or descriptive purposes, the dimensions and relative dimensions of components may be enlarged in the accompanying drawings. Therefore, the dimensions and relative dimensions of the individual components are not necessarily limited to those shown in the drawings. In the specification and accompanying drawings, the same or similar reference numerals indicate the same or similar parts.

[0027] Unless otherwise defined, the technical or scientific terms used in this disclosure shall have the ordinary meaning understood by one of ordinary skill in the art. The terms “first,” “second,” and similar terms used in this disclosure do not indicate any order, quantity, or importance, but are merely used to distinguish different components. Terms such as “comprising” or “including” mean that an element or object preceding the word encompasses the elements or objects listed following the word and their equivalents, without excluding other elements or objects.

[0028] In this document, unless otherwise specified, directional terms such as "up," "down," "left," "right," "inner," and "outer" are used to indicate orientation or positional relationships based on the accompanying drawings, and are used only for the convenience of describing this disclosure, and are not intended to indicate or imply that the device, element, or component referred to must have a specific orientation, or be constructed or operated in a specific orientation. It should be understood that when the absolute position of the described object changes, the relative positional relationships they represent may also change accordingly. Therefore, these directional terms should not be construed as limitations on this disclosure.

[0029] In this document, the terms “approximately,” “about,” “approximately,” and other similar terms are used as terms of approximation rather than as terms of degree, and they are intended to account for inherent deviations in measured or calculated values ​​that would be recognized by one of ordinary skill in the art. Taking into account factors such as process variations, measurement problems, and errors associated with the measurement of a particular quantity (i.e., limitations of the measurement system), “about” or “approximately” as used herein includes stated values ​​and indicates that a particular value is within an acceptable range of deviation for one of ordinary skill in the art. For example, “about” may mean within one or more standard deviations, or within ±10% or ±5% of the stated value.

[0030] In this document, the directional terms "first direction" and / or "second direction" are used to describe different orientations of a display module or display device, such as the light emission direction and horizontal direction of the display module. It should be understood that such representations are merely exemplary descriptions and not limitations of this disclosure.

[0031] In this article, "parallel" or "nearly parallel" refers to the state where the angle formed by two straight lines is greater than -10° and less than 10°, and therefore also includes the state where the angle is greater than -5° and less than 5°. In addition, "perpendicular" refers to the state where the angle formed by two straight lines is greater than 80° and less than 100°, and therefore also includes the state where the angle is greater than 85° and less than 95°.

[0032] Figure 1 A schematic plan view of a display substrate according to some embodiments of the present disclosure is shown. Figure 2 A schematic cross-sectional structural diagram of a display substrate according to some embodiments of the present disclosure is shown, wherein, Figure 2 It shows along Figure 1 A cross-sectional structural diagram taken from the centerline B-B'. Figure 3 A schematic cross-sectional structural diagram of a display substrate according to some embodiments of the present disclosure is shown, wherein, Figure 3 It shows along Figure 1 Cross-sectional structural diagram taken from the centerline C-C'.

[0033] Some embodiments of this disclosure provide a display substrate, which, in conjunction with reference to [reference], is described. Figure 1 , Figure 2 and Figure 3 The display substrate may include a light-transmitting region TA, a transition region BA, a display region AA, and a peripheral region NA. The transition region BA at least partially surrounds the light-transmitting region TA, the display region AA at least partially surrounds the transition region BA, and the peripheral region NA at least partially surrounds the display region AA. For example, the transition region BA may completely surround the light-transmitting region TA, the display region AA may completely surround the transition region BA, and the peripheral region NA may completely surround the display region AA. The light-transmitting region TA may be located on the upper side of the display region AA along the second direction Y, that is, near the upper edge of the display region AA. The light-transmitting region TA may be centrally located in the display region AA relative to the first direction X, or it may be offset in the first direction X (for example, it may be located in the upper left or upper right corner of the display region AA). Figure 1 The illustration schematically shows the case where the object is centered relative to the first direction X.

[0034] The display substrate includes a substrate 100, a driving circuit layer 200 on the substrate 100, a light-emitting device layer 300 on the side of the driving circuit layer 200 away from the substrate 100, an encapsulation layer 400 on the side of the light-emitting device layer 300 away from the substrate 100, and a touch function layer 500 on the side of the encapsulation layer 400 away from the substrate 100. The substrate 100 and / or at least one functional layer in the display substrate can be cut away in the light-transmitting region TA to ensure that the light-transmitting region TA has high transmittance. Figure 2 The illustration schematically shows a scenario where all functional layers and the substrate 100 are cut away in the light-transmitting region TA. For example, the display substrate can be cut along the edge of the light-transmitting region TA to remove a portion of the display substrate located in the light-transmitting region TA, forming a through-hole in the light-transmitting region TA. The display substrate has a cut sidewall SW facing the through-hole (i.e., facing the light-transmitting region TA), and the cut sidewall SW is annular.

[0035] The driving circuit layer 200 may include multiple pixel driving circuits 210, which are arranged in an array along a first direction X and a second direction Y within the display area AA. The first direction X and the second direction Y intersect, for example, the first direction X is perpendicular to the second direction Y. The light-emitting device layer 300 may include multiple light-emitting devices 310, which are arranged in an array along the first direction X and the second direction Y within the display area AA. The multiple light-emitting devices 310 and the multiple pixel driving circuits 210 are electrically connected to each other. That is, multiple sub-pixels SP are arranged in an array along the first direction X and the second direction Y within the display area AA. Each sub-pixel SP includes a pixel driving circuit 210 and a light-emitting device 310 electrically connected to the pixel driving circuit 210. The encapsulation layer 400 is located on the side of the multiple light-emitting devices 310 away from the substrate 100. The encapsulation layer 400 can extend from the display area AA to the transition area BA to completely cover the multiple light-emitting devices 310.

[0036] The light-emitting device layer 300 may include an anode layer 301, a light-emitting functional layer 302 located on the side of the anode layer 301 away from the substrate 100, and a cathode layer 303 away from the light-emitting functional layer 302. The light-emitting functional layer 302 may include multiple light-emitting functional sublayers. At least a portion of the light-emitting functional sublayers and the cathode layer 303 can be formed by vapor deposition under the cover of an open mask. Therefore, the light-emitting device layer 300 (at least a portion of the light-emitting functional sublayers and the cathode layer 303) extends from the display area AA to the transition area BA. To improve the problem of light-emitting device 310 failure caused by water and oxygen in the environment being transported from the light-emitting device layer 300 through the transition area BA to the display area AA, the display substrate may also include at least one isolation trench 640A located in the transition area BA. The at least one isolation trench 640A may be disposed around the light-transmitting area TA. At least one side of the isolation trench 640A has an undercut structure. The light-emitting device layer 300 can be disconnected at the undercut structure of the isolation trench 640A, thereby cutting off the transport path of water and oxygen in the light-emitting device layer 300.

[0037] For example, the isolation trench 640A can be formed in the driving circuit layer 200. The driving circuit layer 200 can include at least one inorganic insulating layer 201, a first planarization layer PLN1 located on the side of the at least one inorganic insulating layer 201 away from the substrate 100, and a first conductive layer M1 located on the side of the first planarization layer PLN1 away from the substrate 100. The light-emitting device layer 300 is located on the side of the first conductive layer M1 away from the substrate 100. The at least one inorganic insulating layer 201 can include at least one first groove G1. The first planarization layer PLN1 includes a first organic filling portion 611 located in the first groove G1. The first organic filling portion 611 is disposed on the sidewall of the at least one inorganic insulating layer 201 facing the first groove G1. The first organic filling portion 611 has a first via V1 and is disposed around the first via V1. The first conductive layer M1 includes at least one second via V2 disposed corresponding to at least one first groove G1. The orthographic projection of the second via V2 on the substrate 100 lies within the orthographic projection of the first via V1 on the substrate 100. The first conductive layer M1 is disposed at the second via V2 protruding toward the center of the first groove G1 relative to the first organic filling portion 611, thereby forming an undercut structure. A portion of the light-emitting device layer 300 may be located on the first conductive layer M1, and another portion of the light-emitting device layer 300 may be located within the first groove G1 and disconnected from the portion located on the first conductive layer M1.

[0038] For example, the second via V2 in the first organic filling portion 611 and the first via V1 in the first conductive layer M1 can be formed in the same etching process. By adjusting the etching process parameters, the lateral etching amount of the first organic filling portion 611 is greater than the lateral etching amount of the first conductive layer M1 to form the undercut structure.

[0039] For example, the driving circuit layer 200 further includes an active layer ACT, which is located on the side of at least one inorganic insulating layer 201 near the substrate 100. The active layer ACT includes at least one first etch stop portion 621 located in the transition region BA. The first etch stop portion 621 is located on the side of the first groove G1 near the substrate 100. The orthographic projection of the first groove G1 on the substrate 100 can fall within the orthographic projection of the first etch stop portion 621 on the substrate 100. The first etch stop portion 621 can serve as an etch stop structure when etching to form the first groove G1. That is, the first groove G1 is etched until the surface of the first etch stop portion 621 is exposed, which helps to ensure the etching accuracy of the first groove G1.

[0040] For example, at least one inorganic insulating layer 201 may include at least one second groove G2, which may be disposed around the light-transmitting region TA, and the second groove G2 may be located on the side of at least one first groove G1 near the light-transmitting region TA. The driving circuit layer 200 may also include a second conductive layer M2 located on the side of the first planarization layer PLN1 near the substrate 100 and a second planarization layer PLN2 located on the side of the first conductive layer M1 away from the substrate 100. The second conductive layer M2 includes a first conductive filling portion 631 located within the second groove G2. The first planarization layer PLN1 includes a second organic filling portion 612, which fills the remaining space in the second groove G2 that is not filled by the first conductive filling portion 631. The first conductive layer M1 has a third via V3, the orthographic projection of which onto the substrate 100 falls within the orthographic projection of which onto the substrate 100. The second planarization layer PLN2 may include a third organic filling portion 613, which can contact the second organic filling portion 612 through the third via V3. By providing the second groove G2 in at least one inorganic insulating layer 201 and filling it with the second organic filling portion 612 and the third organic filling portion 613, cracks generated during the cutting process of the inorganic insulating layer 201 can be prevented from extending into the display area AA.

[0041] For example, the driving circuit layer 200 further includes a light-shielding layer BSM, which is located on the side of at least one insulating layer near the substrate 100. The light-shielding layer BSM includes at least one second etch stop portion 622 located in the transition region BA. The second etch stop portion 622 is located on the side of the second groove G2 near the substrate 100. The orthographic projection of the second groove G2 on the substrate 100 can fall within the orthographic projection of the second etch stop portion 622 on the substrate 100. The second etch stop portion 622 can serve as an etch stop structure when etching to form the second groove G2. That is, the second groove G2 is etched until the surface of the second etch stop portion 622 is exposed, which helps to ensure the etching accuracy of the second groove G2.

[0042] Figures 4A-4C The diagram schematically illustrates the fabrication process of a display substrate according to some embodiments of the present disclosure.

[0043] According to some exemplary embodiments, in conjunction with reference to Figure 1 , Figure 2 and Figures 4A-4C The inorganic layer near the cutting path can be thinned to reduce the risk of cracking during the cutting of the light-transmitting area. The thinning process can include the following:

[0044] Combined with reference Figure 1 , Figure 3 and Figure 4A A driving circuit layer 200 is formed on a substrate 100. A light-emitting device layer 300 is formed on the side of the driving circuit layer 200 away from the substrate 100. An encapsulation layer 400 is formed on the side of the light-emitting device layer 300 away from the substrate 100. The encapsulation layer 400 may include a first inorganic encapsulation layer 410, an organic encapsulation layer 430 located on the side of the first inorganic encapsulation layer 410 away from the substrate 100, and a second inorganic encapsulation layer 420 located on the side of the organic encapsulation layer 430 away from the substrate 100. A barrier wall may be provided in the transition region BA surrounding the light-transmitting region TA. The edge of the organic encapsulation layer 430 near the light-transmitting region TA may be terminated at the side of the barrier wall away from the light-transmitting region TA. Therefore, in Figure 4A In the schematic structure near the light-transmitting region TA, the first inorganic encapsulation layer 410 and the second inorganic encapsulation layer 420 are in direct contact, and the first inorganic encapsulation layer 410 and the second inorganic encapsulation layer 420 can extend to the light-transmitting region TA.

[0045] Reference Figure 4B A first touch insulating layer 510 is formed on the side of the encapsulation layer 400 away from the substrate 100, a first touch metal layer 520 is formed on the side of the first touch insulating layer 510 away from the substrate 100, and a second touch insulating layer 530 is formed on the side of the first touch metal layer 520 away from the substrate 100.

[0046] Combined with reference Figure 4B and Figure 4C At least a portion of the first touch insulating layer 510 and the second touch insulating layer 530 located in the isolation trench 640A near the light-transmitting area TA is etched away to thin the inorganic layer near the cutting path.

[0047] Combined with reference Figure 4C and Figure 3 A second touch metal layer 540 is formed on the side of the second touch insulating layer 530 away from the substrate 100, a first organic capping layer 710 is formed on the side of the second touch metal layer 540 away from the substrate 100, and a second organic capping layer 720 is formed on the side of the first organic capping layer 710 away from the substrate 100.

[0048] However, the inventors discovered that because the light-emitting device layer 300 extends into the light-transmitting area TA, after the cutting process, the edge of the light-emitting device layer 300 will be exposed at the cutting sidewall SW. This causes the light-emitting device layer 300 to easily absorb moisture from the environment, resulting in interface peeling between the light-emitting device layer 300 and the adjacent inorganic layers. Furthermore, the degree of peeling is aggravated in the subsequent film peeling process, which in turn leads to black spots around the light-transmitting area TA during the reliability process, and in severe cases, it can lead to product scrap.

[0049] Figure 5A A schematic cross-sectional structural diagram of a display substrate according to some embodiments of the present disclosure is shown, wherein, Figure 5A It shows along Figure 1 Another cross-sectional structure diagram taken from the centerline B-B'. Figure 5B schematically shown Figure 5A A magnified view of a portion of the central region E1.

[0050] According to some exemplary embodiments, in conjunction with reference to Figure 1 , Figure 5A and Figure 5B The light-emitting device layer 300 includes a first side surface S1 near the light-transmitting region TA, located within the transition region BA. The display substrate includes a cut sidewall SW facing the light-transmitting region TA. The first side surface S1 is located on the side of the cut sidewall SW away from the display region AA, along the direction from the display region AA to the light-transmitting region TA. The first side surface S1 and the cut sidewall SW are spaced apart. By spaced apart the first side surface S1 of the light-emitting device layer 300 near the light-transmitting region TA and the cut sidewall SW, the problem of the light-emitting device layer 300 absorbing moisture from the environment at the first side surface S1 near the light-transmitting region TA, thus preventing interface delamination, can be effectively avoided.

[0051] According to some exemplary embodiments, in conjunction with reference to Figure 1 , Figure 5A and Figure 5B The encapsulation layer 400 includes a second side surface S2 located near the light-transmitting region TA. The second side surface S2 is located in the transition region BA, and at least a portion of the second side surface S2 is connected to at least a portion of the first side surface S1. That is, a portion of the light-emitting device layer 300 near the light-transmitting region TA can be etched away together with a portion of the encapsulation layer 400 near the light-transmitting region TA in the same etching process. This improves the problem of interface delamination between the light-emitting device layer 300 and adjacent film layers, while also thinning the inorganic layer near the light-transmitting region TA, reducing the risk of cracking during cutting.

[0052] For example, the first inorganic encapsulation layer 410 includes a first sub-side surface S21 located near the light-transmitting region TA, and the second inorganic encapsulation layer 420 includes a second sub-side surface S22 located near the light-transmitting region TA. At least a portion of the second sub-side surface S22, at least a portion of the first sub-side surface S21, and at least a portion of the first side surface S1 are connected in sequence.

[0053] For example, the material of the first inorganic encapsulation layer 410 may include silicon oxynitride, and the material of the second inorganic encapsulation layer 420 may include silicon nitride.

[0054] According to some exemplary embodiments, in conjunction with reference to Figure 1 , Figure 5A and Figure 5B The driving circuit layer 200 includes at least one inorganic insulating layer 201. The at least one inorganic insulating layer 201 can extend from the display area AA to the transition area BA. The at least one inorganic insulating layer 201 includes a first inorganic insulating portion 201a and a second inorganic insulating portion 201b connected to each other. The first inorganic insulating portion 201a is located on the side of the first side surface S1 close to the light-transmitting area TA, and the second inorganic insulating portion 201b is located on the side of the first side surface S1 away from the light-transmitting area TA. The surface of the first inorganic insulating portion 201a away from the substrate 100 is closer to the substrate 100 than the surface of the second inorganic insulating portion 201b away from the substrate 100. Since at least a portion of the second inorganic insulating portion 201b is covered by the light-emitting device layer 300, and the first inorganic insulating portion 201a is not covered by the light-emitting device layer 300, in order to ensure that a portion of the light-emitting device layer 300 near the light-transmitting region TA is completely etched, a portion of the lower inorganic insulating layer 201 (i.e., the first inorganic insulating portion 201a) will be etched, so that the surface of the first inorganic insulating portion 201a away from the substrate 100 is closer to the substrate 100 than the surface of the second inorganic insulating portion 201b away from the substrate 100, so that a stepped structure is formed at the connection between the first inorganic insulating portion 201a and the second inorganic insulating portion 201b, and the thickness of the first inorganic insulating portion 201a is less than the thickness of the second inorganic insulating portion 201b.

[0055] For example, the material of at least one inorganic insulating layer 201 may include silicon oxide.

[0056] According to some exemplary embodiments, in conjunction with reference to Figure 1 , Figure 5A and Figure 5BThe display substrate also includes a touch function layer 500, which is located on the side of the encapsulation layer 400 away from the substrate 100. The touch function layer 500 includes at least one touch metal layer 500A and at least one touch insulating layer 500B. The at least one touch insulating layer 500B includes a third side surface S3 near the light-transmitting region TA, which is located on the side of the first side surface S1 near the light-transmitting region TA. The at least one touch insulating layer 500B can extend continuously from the side of the first side surface S1 away from the light-transmitting region TA to the side of the first side surface S1 near the light-transmitting region TA. The orthographic projection of the at least one touch insulating layer on the substrate 100 can cover at least a portion of the orthographic projection of the first side surface S1 on the substrate 100. That is, the at least one touch insulating layer 500B can cover at least a portion of the first side surface S1 of the light-emitting device layer 300. In other words, the at least one touch insulating layer 500B can be used to perform secondary encapsulation of the light-emitting device layer 300, which is beneficial to further improve the encapsulation reliability at the light-transmitting region TA.

[0057] For example, the cut sidewall SW may include a third side surface S3, that is, the third side surface S3 of at least one touch insulating layer 500B may be formed in the cutting process.

[0058] For example, the touch insulating layer 500B may include a first touch insulating layer 510 and a second touch insulating layer 530. The first touch insulating layer 510 may include a third sub-side surface S31 near the light-transmitting area TA, and the second touch insulating layer 530 may include a fourth sub-side surface S32 near the light-transmitting area TA. The cut sidewall SW may include the third sub-side surface S31 and the fourth sub-side surface S32.

[0059] For example, the material of the first touch insulating layer 510 may include silicon nitride, and the material of the second touch insulating layer 530 may include silicon nitride.

[0060] According to some exemplary embodiments, in conjunction with reference to Figure 1 , Figure 5A and Figure 5B The driving circuit layer 200 includes at least one partition structure 640 located in the transition region BA, and at least a portion of the light-emitting device layer 300 is disconnected at the partition structure 640. The light-emitting device layer 300 includes a light-emitting material extension 300a located on the side of the at least one partition structure 640 near the light-transmitting region TA, and the side of the light-emitting material extension 300a near the light-transmitting region TA includes the first side surface S1.

[0061] It should be noted that the light-emitting material extension 300a should be understood as a partition structure 640 located on the side closest to the light-transmitting region TA.

[0062] For example, the partition structure 640 may include a first partition structure 641 and at least one second partition structure 642, wherein the at least one second partition structure 642 is located on the side of the first partition structure 641 away from the light-transmitting area TA, and the light-emitting material extension 300a is located on the side of the first partition structure 641 close to the light-transmitting area TA.

[0063] The second partition structure 642 may include an isolation groove 640A, the structure of which can be found in the preceding description. The first partition structure 641 may include half of the isolation groove structure. In the first partition structure 641, the side of the first metal layer near the light-transmitting region TA protrudes relative to the side of the first planarization layer PLN1 facing the light-transmitting region TA, to form an undercut structure for blocking the light-emitting device layer 300. That is, the second partition structure 642 may include two undercut structures, spaced apart along the direction from the display region AA to the light-transmitting region TA, while the first partition structure 641 only includes one undercut structure facing the light-transmitting region TA.

[0064] According to some exemplary embodiments, in conjunction with reference to Figure 1 , Figure 5A and Figure 5B Along the direction from the center of the display area AA to the center of the light-transmitting area TA, the size of the light-emitting material extension 300a is a first size D1, and the distance between the first side surface S1 of the light-emitting material extension 300a and the light-transmitting area TA (i.e., the cut sidewall SW) is a first distance D2. The first size D1 is set to be smaller than the first distance D2. Setting the distance between the first side surface S1 of the light-emitting material extension 300a and the cut sidewall SW to be larger helps to further improve the problem of the light-emitting device layer 300 absorbing moisture from the environment at the first side surface S1 near the light-transmitting area TA, which leads to interface peeling.

[0065] For example, the first spacing D2 can be greater than or equal to 50 micrometers, such as 50 micrometers, 60 micrometers, 70 micrometers, 80 micrometers, 90 micrometers or 100 micrometers.

[0066] According to some exemplary embodiments, in conjunction with reference to Figure 1 , Figure 5A and Figure 5BThe display substrate includes a display extension 110 located on the side of at least one partition structure 640 near the light-transmitting region TA. The display extension 110 includes a first display extension sub-part 111 and a second display extension sub-part 112. The first display extension sub-part 111 includes a light-emitting material extension 300a. The second display extension sub-part 112 is located on the side of the light-emitting material extension 300a near the light-transmitting region TA. The thickness of at least a portion of the second display extension sub-part 112 is less than the thickness of at least a portion of the first display extension sub-part 111. In the region where the second display extension sub-part 112 is located, the light-emitting device layer 300 and at least one inorganic layer (e.g., may include a first inorganic encapsulation layer 410 and a second inorganic encapsulation layer 420) are etched away, such that the thickness of the second display extension sub-part 112 is less than the thickness of the first display extension sub-part 111, that is, the connection between the second display extension sub-part 112 and the first display extension sub-part 111 may have a stepped structure.

[0067] Figure 6 A flowchart illustrating a method for fabricating a display substrate according to some embodiments of the present disclosure is shown schematically. Figures 7A-7C The diagram schematically illustrates the fabrication process of a display substrate fabrication method according to some embodiments of the present disclosure.

[0068] Some embodiments of this disclosure also provide a method for fabricating a display substrate. The display substrate includes a light-transmitting region, a transition region, and a display region. The transition region at least partially surrounds the light-transmitting region, and the display region at least partially surrounds the transition region. (Refer to...) Figure 6 The preparation method may include the following steps.

[0069] In step S10, a driving circuit layer is formed on the substrate.

[0070] In step S20, a light-emitting device layer is formed on the side of the driving circuit layer away from the substrate. The light-emitting device layer includes a first side surface near the light-transmitting area. The first side surface is located in the transition area. The display substrate includes a cut sidewall facing the light-transmitting area. The first side surface is located on the side of the cut sidewall away from the display area. The first side surface and the cut sidewall are spaced apart along the direction from the display area to the light-transmitting area.

[0071] In step S30, an encapsulation layer is formed on the side of the light-emitting device layer away from the substrate.

[0072] The following combination Figures 7A-7C The preparation process of this preparation method is illustrated schematically.

[0073] Combined with reference Figure 1 , Figure 3 and Figure 7AA driving circuit layer 200 is formed on a substrate 100. A light-emitting device layer 300 is formed on the side of the driving circuit layer 200 away from the substrate 100. An encapsulation layer 400 is formed on the side of the light-emitting device layer 300 away from the substrate 100. The driving circuit layer 200 may include a plurality of pixel driving circuits 210 located in the display area AA and at least one partition structure 640 located in the transition area BA. The light-emitting device layer 300 may include a plurality of light-emitting devices 310 located in the display area AA. The light-emitting device layer 300 extends from the display area AA to the transition area BA and is located on the side of the partition structure 640 near the light-transmitting area TA. The light-emitting device layer 300 may be partitioned by at least one partition structure 640. The encapsulation layer 400 may cover the plurality of light-emitting devices 310 located in the display area AA. The first inorganic encapsulation layer 410 and the second inorganic encapsulation layer 420 in the encapsulation layer 400 may extend from the display area AA to the transition area BA and are located on the side of the partition structure 640 near the light-transmitting area TA.

[0074] Combined with reference Figure 1 , Figure 7A and Figure 7B A patterning process is performed on the light-emitting device layer 300 and the encapsulation layer 400, and a portion of the light-emitting device layer 300 and the encapsulation layer 400 located on the side of the isolation structure 640 near the light-transmitting region TA is etched away. A first side surface S1 is formed on the side of the light-emitting device layer 300 near the light-transmitting region TA, and a second side surface S2 is formed on the side of the encapsulation layer 400 near the light-transmitting region TA. At least a portion of the first side surface S1 and at least a portion of the second side surface S2 are connected, and the first side surface S1 and the second side surface S2 are spaced apart from the edge of the light-transmitting region TA.

[0075] Reference Figure 7C A touch function layer 500 is formed on the side of the encapsulation layer 400 away from the substrate 100, a first organic cover layer 710 is formed on the side of the touch function layer 500 away from the substrate 100, and a second organic cover layer 720 is formed on the side of the first organic cover layer 710 away from the substrate 100.

[0076] For example, forming the touch functional layer 500 may include forming a first touch insulating layer 510 on the encapsulation layer 400, forming a first touch metal layer 520 on the side of the first touch insulating layer 510 away from the substrate 100, forming a second touch insulating layer 530 on the side of the first touch conductive layer away from the substrate 100, and forming a second touch metal layer 540 on the side of the second touch insulating layer 530 away from the substrate 100. The first touch insulating layer 510 and the second touch insulating layer 530 can cover the first side surface S1 of the light-emitting device layer 300 to perform secondary encapsulation of the light-emitting device layer 300.

[0077] For example, the first organic coating layer 710 can be formed by a coating process, and the second organic coating layer 720 can be formed by an inkjet printing process. The first organic coating layer 710 and the second organic coating layer 720 have the function of planarizing the surface.

[0078] Figure 8 A schematic plan view of a display device according to some embodiments of the present disclosure is shown.

[0079] Some embodiments of this disclosure also provide a display device, see reference Figure 8 The display device 20 includes a display substrate 10, which can be a display module as provided in any of the above embodiments.

[0080] For example, the display device may include any device or product with display functionality. For instance, the display device may be a smartphone, mobile phone, e-book reader, desktop computer (PC), laptop PC, netbook PC, personal digital assistant (PDA), portable multimedia player (PMP), digital audio player, mobile medical device, camera, wearable device (e.g., head-mounted device, electronic clothing, electronic bracelet, electronic necklace, electronic accessory, electronic tattoo, or smartwatch), television set, etc.

[0081] While some embodiments of the general concept of this disclosure have been shown and described, those skilled in the art will understand that changes may be made to these embodiments without departing from the principles and spirit of the general concept of this disclosure, the scope of which is defined by the claims and their equivalents.

Claims

1. A display substrate, wherein, The display substrate includes a light-transmitting region, a transition region, and a display region. The transition region at least partially surrounds the light-transmitting region, and the display region at least partially surrounds the transition region. The display substrate includes: Substrate; The driving circuit layer is located on the substrate. The light-emitting device layer is located on the side of the driving circuit layer away from the substrate. An encapsulation layer is located on the side of the light-emitting device layer away from the substrate. The light-emitting device layer includes a first side surface near the light-transmitting area, the first side surface being located within the transition area, and the display substrate including a cut sidewall facing the light-transmitting area. The first side surface is located on the side of the cut sidewall away from the light-transmitting area, in the direction from the display area to the light-transmitting area, and the first side surface and the cut sidewall are spaced apart. 2.The display substrate of claim 1, wherein, The encapsulation layer includes a second side located near the light-transmitting area, the second side being located in the transition region, and the orthographic projection of the second side on the substrate and the orthographic projection of the first side on the substrate at least partially overlap. 3.The display substrate according to claim 1 or 2, wherein, The display substrate further includes a touch function layer, which is located on the side of the encapsulation layer away from the substrate. The touch function layer includes at least one touch metal layer and at least one touch insulating layer. The at least one touch insulating layer includes a third side surface near the light-transmitting area, which is located on the side of the first side surface near the light-transmitting area.

4. The display substrate according to claim 1 or 2, wherein, The driving circuit layer includes at least one inorganic insulating layer, which extends from the display area to the transition area. The at least one inorganic insulating layer includes a first inorganic insulating portion and a second inorganic insulating portion connected to each other. The first inorganic insulating portion is located on the side of the first side closer to the light-transmitting area, and the second inorganic insulating portion is located on the side of the first side away from the light-transmitting area. The surface of the first inorganic insulating portion away from the substrate is closer to the substrate than the surface of the second inorganic insulating portion away from the substrate. 5.The display substrate according to any one of claims 1-4, wherein, The driving circuit layer includes at least one isolation structure, the at least one isolation structure being located in the transition region, and at least a portion of the light-emitting device layer being disconnected at the isolation structure; and The light-emitting device layer includes a light-emitting material extension located on at least one side of the partition structure near the light-transmitting area, and the side of the light-emitting material extension near the light-transmitting area includes the first side surface. 6.The display substrate of claim 5, wherein, Along the direction from the display area to the center of the light-transmitting area, the size of the light-emitting material extension is a first size, the distance between the first side and the light-transmitting area is a first distance, and the first size is smaller than the first distance.

7. The display substrate according to claim 6, wherein, The first spacing is greater than or equal to 50 micrometers. 8.The display substrate of claim 5, wherein, The display substrate includes a display extension located on the side of at least one of the partition structures near the light-transmitting area. The display extension includes a first display extension sub-part and a second display extension sub-part. The first display extension sub-part includes the light-emitting material extension. The second display extension sub-part is located on the side of the light-emitting material extension near the light-transmitting area. The thickness of at least a portion of the second display extension sub-part is less than the thickness of at least a portion of the first display extension sub-part.

9. A method for manufacturing a display substrate, wherein The display substrate includes a light-transmitting region, a transition region, and a display region, wherein the transition region at least partially surrounds the light-transmitting region, and the display region at least partially surrounds the transition region. The fabrication method includes: A driving circuit layer is formed on the substrate. A light-emitting device layer is formed on the side of the driving circuit layer away from the substrate. The light-emitting device layer includes a first side surface near the light-transmitting area. The first side surface is located in the transition area. The display substrate includes a cut sidewall facing the light-transmitting area. The first side surface is located on the side of the cut sidewall away from the light-transmitting area. In the direction from the display area to the light-transmitting area, the first side surface and the cut sidewall are spaced apart. An encapsulation layer is formed on the side of the light-emitting device layer away from the substrate.

10. A display device, wherein, The display device includes a display substrate according to any one of claims 1-8.

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