Laser processing method, device, processing equipment and storage medium for circuit board

Abstract

This application proposes a laser processing method, apparatus, processing equipment, and storage medium for circuit boards, relating to the field of laser processing technology. The method obtains the processing requirements of the circuit board; these requirements include processing sub-requirements for multiple processing structures within the circuit board; different processing subroutines are then set based on these sub-requirements, forming a processing program; and laser processing is then performed on multiple processing structures according to this processing program. This application customizes processing subroutines for each processing structure based on its specific processing sub-requirements, ensuring that the final processing program includes subroutines that meet different processing sub-requirements. When performing laser processing based on this program, laser processing can be carried out according to the processing sub-requirements of each processing substructure. Only one processing drawing is needed, and a complete processing program can be executed to process the entire circuit board, resulting in higher processing efficiency.

Description

Technical Field

[0001] This application relates to the field of laser processing technology, and in particular to a laser processing method, apparatus, processing equipment and storage medium for circuit boards. Background Technology

[0002] A printed circuit board (PCB) is the carrier for the electrical connection of electronic components. PCBs involve various processing structures, such as hole structures and cutting structures for mounting components of different shapes. Often, multiple processing requirements for different processing structures exist on a single PCB.

[0003] Currently, when processing PCBs with multiple processing requirements, it is necessary to input multiple drawings corresponding to the various processing structures of the PCB into the processing equipment multiple times, which reduces processing efficiency. Summary of the Invention

[0004] Therefore, it is necessary to provide a laser processing method, apparatus, processing equipment, and storage medium for PCBs with multiple processing requirements to address the problem of low processing efficiency. This would improve processing efficiency when processing PCBs with multiple processing requirements.

[0005] In a first aspect, this application provides a laser processing method for a circuit board, comprising: obtaining processing requirements for the circuit board; wherein the circuit board includes multiple processing structures, and the processing requirements include processing sub-requirements for the multiple processing structures; setting different processing subroutines according to the processing sub-requirements, wherein each processing subroutine constitutes a processing program; and performing laser processing on the multiple processing structures according to the processing program.

[0006] In one embodiment, the processing sub-requirements include positional accuracy and dimensional accuracy.

[0007] In one embodiment, different processing procedures are set according to the processing sub-requirements, including: when the processing sub-requirement of the processing structure is positional accuracy, a first processing sub-program is set; wherein, the first processing sub-program represents processing based on the actual expansion and contraction of the circuit board; when the processing sub-requirement of the processing structure is dimensional accuracy, a second processing sub-program is set; wherein, the second processing sub-program represents processing based on the rotation angle generated by the circuit board.

[0008] In one embodiment, laser processing is performed on the plurality of processing structures according to the processing program, including: when executing the first processing subroutine corresponding to positional accuracy, determining the actual coordinates of the processing point according to the actual expansion and contraction of the circuit board, and performing laser processing on the processing structure with positional accuracy requirements according to the actual coordinates of the processing point; when executing the second processing subroutine corresponding to dimensional accuracy, adjusting the laser processing angle according to the rotation angle generated by the circuit board, and performing laser processing on the processing structure with dimensional accuracy requirements according to the drawing coordinates of the processing point.

[0009] In one embodiment, laser processing of the plurality of processing structures according to the processing program further includes: when executing a first processing subroutine corresponding to positional accuracy and a second processing subroutine corresponding to dimensional accuracy, firstly determining the actual coordinates of the processing point based on the actual expansion and contraction of the circuit board, and then performing laser processing on the processing structure with positional accuracy requirements based on the actual coordinates of the processing point; next, adjusting the laser processing angle based on the rotation angle generated by the circuit board, and performing laser processing on the processing structure with dimensional accuracy requirements according to the drawing coordinates of the processing point.

[0010] In one embodiment, the processing sub-requirement includes a first processing efficiency and a second processing efficiency; wherein the first processing efficiency is not equal to the second processing efficiency.

[0011] In one embodiment, different processing subroutines are set according to the processing sub-requirements, including: when the processing sub-requirement of the processing structure is a first processing efficiency, a third processing subroutine is set; wherein the third processing subroutine represents processing according to the first processing efficiency; when the processing sub-requirement of the processing structure is a second processing efficiency, a fourth processing subroutine is set; wherein the fourth processing subroutine represents processing according to the second processing efficiency.

[0012] In one embodiment, the processing structure includes multiple processing positions; laser processing is performed on the multiple processing structures according to the processing program, including: when executing a third processing subroutine, processing is performed according to a first processing efficiency corresponding to the third processing subroutine; when executing a fourth processing subroutine, processing is performed according to a second processing efficiency corresponding to the fourth processing subroutine; when the processing sub-requirement of at least one of the processing structures at the processing position is the first processing efficiency, and the processing sub-requirement of at least one of the processing structures at the processing position is the second processing efficiency, processing is performed on the processing position corresponding to the first processing efficiency according to the third processing subroutine, and processing is performed on the processing position corresponding to the second processing efficiency according to the fourth processing subroutine.

[0013] In one embodiment, before laser processing is performed on the plurality of processing structures according to the processing procedure, the method includes: grasping a positioning target point and obtaining the position information of the positioning target point to position the circuit board.

[0014] A laser processing apparatus for circuit boards includes: an acquisition module for acquiring processing requirements of the circuit board; wherein the circuit board includes multiple processing structures, and the processing requirements include processing sub-requirements for the multiple processing structures; a program setting module for setting different processing subroutines according to the processing sub-requirements, wherein each processing subroutine constitutes a processing program; and a processing module for performing laser processing on the multiple processing structures according to the processing program.

[0015] In one embodiment, the processing sub-requirements include positional accuracy and dimensional accuracy.

[0016] In one embodiment, the program setting module is configured to: set a first processing subroutine when the processing sub-requirement of the processing structure is positional accuracy; wherein the first processing subroutine represents processing based on the actual expansion and contraction of the circuit board; and set a second processing subroutine when the processing sub-requirement of the processing structure is dimensional accuracy; wherein the second processing subroutine represents processing based on the rotation angle generated by the circuit board.

[0017] In one embodiment, the processing module is configured to: when executing the first processing subroutine corresponding to positional accuracy, determine the actual coordinates of the processing point based on the actual expansion and contraction of the circuit board, and perform laser processing on the processing structure with positional accuracy requirements based on the actual coordinates of the processing point; when executing the second processing subroutine corresponding to dimensional accuracy, adjust the laser processing angle based on the rotation angle generated by the circuit board, and perform laser processing on the processing structure with dimensional accuracy requirements according to the drawing coordinates of the processing point.

[0018] In one embodiment, the processing module is configured to: when executing a first processing subroutine corresponding to positional accuracy and a second processing subroutine corresponding to dimensional accuracy, first determine the actual coordinates of the processing point based on the actual expansion and contraction of the circuit board, and then perform laser processing on the processing structure with positional accuracy requirements based on the actual coordinates of the processing point; next, adjust the laser processing angle based on the rotation angle generated by the circuit board, and perform laser processing on the processing structure with dimensional accuracy requirements according to the drawing coordinates of the processing point.

[0019] In one embodiment, the processing sub-requirement includes a first processing efficiency and a second processing efficiency; wherein the first processing efficiency is not equal to the second processing efficiency.

[0020] In one embodiment, the program setting module is configured to: set a third processing subroutine when the processing sub-requirement of the processing structure is a first processing efficiency; wherein the third processing subroutine represents processing according to the first processing efficiency; and set a fourth processing subroutine when the processing sub-requirement of the processing structure is a second processing efficiency; wherein the fourth processing subroutine represents processing according to the second processing efficiency.

[0021] In one embodiment, the processing structure includes multiple processing positions and a processing module, which performs processing according to a first processing efficiency corresponding to the third processing subroutine when executing a third processing subroutine; and performs processing according to a second processing efficiency corresponding to the fourth processing subroutine when executing a fourth processing subroutine; when the processing sub-requirement of at least one of the processing positions in the processing structure is the first processing efficiency, and the processing sub-requirement of at least one of the processing positions in the processing structure is the second processing efficiency, the processing position corresponding to the first processing efficiency is processed according to the third processing subroutine, and the processing position corresponding to the second processing efficiency is processed according to the fourth processing subroutine.

[0022] In one embodiment, the processing module is further configured to: grasp the positioning target point and obtain the position information of the positioning target point in order to position the circuit board.

[0023] A laser processing device includes a laser processing apparatus for circuit boards as described in any of the above embodiments.

[0024] A computer-readable storage medium having a computer program stored thereon, which, when executed by a processor, implements the steps of the laser processing method for a circuit board as described in the above embodiments.

[0025] In summary, this application proposes a laser processing method, apparatus, processing equipment, and storage medium for circuit boards. The method first obtains the processing requirements of the circuit board; wherein the circuit board includes multiple processing structures, and the processing requirements of the circuit board include processing sub-requirements for multiple processing structures; then, different processing subroutines are set according to these processing sub-requirements, and each processing subroutines constitute a processing program; then, laser processing is performed on multiple processing structures according to the processing program. This application sets customized processing subroutines for each processing structure based on its processing sub-requirements, so that the final processing program includes processing subroutines that can meet different processing sub-requirements. When performing laser processing based on this processing program, laser processing can be carried out according to the processing sub-requirements of each processing substructure. Compared to the prior art, which designs processing structures corresponding to the same processing requirements in the same processing drawing and then sets a processing program for each processing drawing, this application only requires one processing drawing, and the entire circuit board can be processed by executing a complete processing program, resulting in higher processing efficiency. Attached Figure Description

[0026] To more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings used in the description of the embodiments of the present invention will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0027] Figure 1 This is a flowchart illustrating a laser processing method for a circuit board according to an exemplary embodiment of this application; Figure 2 This is a schematic diagram of a circuit board fabrication drawing according to an exemplary embodiment of this application; Figure 3 This is a schematic block diagram of a laser processing apparatus for a circuit board according to an exemplary embodiment of this application; Figure 4 This is a schematic block diagram of a laser processing apparatus according to an exemplary embodiment of this application. Detailed Implementation

[0028] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, not all embodiments. The embodiments described with reference to the accompanying drawings are exemplary and intended to explain this application, and should not be construed as limiting this application. All other embodiments obtained by those skilled in the art based on the embodiments of this application without creative effort are within the scope of protection of this application.

[0029] Figure 1 This is a flowchart illustrating a laser processing method for a circuit board according to an exemplary embodiment of this application, such as... Figure 1 As shown, the laser processing method for this circuit board includes the following steps: S101, Obtain the processing requirements of the circuit board; wherein, the circuit board contains multiple processing structures, and the processing requirements include processing sub-requirements for multiple processing structures.

[0030] Exemplary examples show that the executing entity in this application embodiment can be a laser processing device, an electronic device, a server, a terminal device, or other device or CNC machining equipment capable of executing the solution of this embodiment, and there are no limitations on this. This embodiment uses a laser processing device with a circuit board as the executing entity as an example for description.

[0031] The circuit board in this embodiment is a printed circuit board (PCB).

[0032] Circuit boards, as carriers of electronic components, are designed with various processing structures such as through holes or slots for mounting electronic components of different shapes.

[0033] Engineers often use circuit board processing drawings to represent the dimensions, shape, processing structures to be processed on the circuit board, the location and dimensions of the processing structures, and other information required for processing.

[0034] In one example, the laser processing device for circuit boards can parse the processing requirements of the circuit board from the processing drawings uploaded by the engineers. Of course, the laser processing device can also directly obtain the processing requirements configured by the user through an interactive interface. This embodiment does not limit the method of obtaining the processing requirements of the circuit board.

[0035] The processing requirements for circuit boards may include, but are not limited to, processing sub-requirements for multiple processing structures.

[0036] In one example, the processing requirements may include, but are not limited to, at least one of the following: positional accuracy and dimensional accuracy, etc. It should be noted that the processing structure used in this embodiment may refer to the entire processing structure body, or simply an edge line within the processing structure.

[0037] Now combined Figure 2 The description covers positional accuracy and dimensional accuracy, including... Figure 2 The circles drawn with solid black lines represent reference points (also known as mark points) used for positioning on the circuit board, while the dashed lines represent the structures to be machined onto the circuit board. The edge lines of the shapes represent the outer contours of the structures to be obtained through laser processing.

[0038] For machining structures requiring precise positioning, it is necessary to ensure that the relative position of the machined structure on the circuit board after machining matches the circuit board machining drawings. For example... Figure 2 If the relative positional relationship between the left edge line of the machining structure 1 and the MARK point 1 is required to be consistent with the circuit board machining drawing, then it can be confirmed that the left edge line of the machining structure 1 requires positional accuracy, or that the machining structure 1 requires positional accuracy.

[0039] For machined structures requiring dimensional accuracy, it is necessary to ensure that the shape of the machined structure on the circuit board is consistent with the circuit board manufacturing drawings. Dimensional accuracy includes requirements for the distance between contour lines and / or the angle between contour lines, etc. (e.g.) Figure 2 The processing structure 3 in the diagram requires its width to be consistent with the circuit board processing drawing, which is equivalent to requiring the distance between the left and right edge lines of processing structure 3 to be consistent with the circuit board processing drawing. For example... Figure 2If the width requirement between the left and right edge lines of processed structure 3 is consistent with the circuit board processing drawing, then the dimensional accuracy requirement for the left and right edge lines of processed structure 3 is confirmed. Furthermore, if the relative position requirement between the upper edge line of processed structure 3 and the lower edge line of processed structure 2 is consistent with the circuit board processing drawing, then the positional accuracy requirement for the upper edge line of processed structure 3 can be confirmed. Alternatively, it can be confirmed that structure 3 requires both positional and dimensional accuracy.

[0040] It should be noted that the "consistency" described in the above example can be understood as consistency that allows for a certain range of error, rather than complete numerical equality.

[0041] S102, different processing subroutines are set according to the processing sub-requirements, and each processing subroutines constitute the processing program.

[0042] For example, the laser processing apparatus for circuit boards sets processing subroutines for each processing structure according to its processing requirements. The processing subroutines of all processing structures constitute the processing program.

[0043] The term "machining program / machining subroutine" is explained below: A machining program / machining subroutine can be understood as machining code or a CNC program. For example, CNC machining equipment such as laser processing devices or laser processing machines for circuit boards can determine the machining path corresponding to the machining structure, the angle and position of the CNC machining equipment during machining, and other information based on this machining subroutine.

[0044] For example, setting up a machining subroutine based on machining sub-requirements can be achieved in the following way: the machining subroutine represents how the machining path is determined, and how the angle and position of the CNC machining equipment during machining are determined. The logic for determining the machining path and other information is adaptively adjusted according to the machining sub-requirements of the machining structure. It is worth noting that this is merely an example of how to set up a machining subroutine based on machining sub-requirements, and is not a limitation on its implementation.

[0045] S103 performs laser processing on multiple processing structures according to the processing program.

[0046] For example, the laser processing apparatus for the circuit board performs laser processing on the processing structure according to the processing subroutine of each processing structure.

[0047] The processing subroutines set for different processing structures can reflect the processing sub-requirements of that processing structure. In this way, when the circuit board processing device performs laser processing according to the processing program, it can take into account the processing sub-requirements of that processing structure during the laser processing process.

[0048] In summary, the circuit board processing method proposed in this application first obtains the processing requirements of the circuit board; wherein, the circuit board includes multiple processing structures, and the processing requirements of the circuit board include processing sub-requirements of multiple processing structures; then, different processing subroutines are set according to these processing sub-requirements, and each processing subroutines constitute a processing program; then, laser processing is performed on multiple processing structures according to the processing program.

[0049] This application embodiment sets customized processing subroutines for each processing structure based on its processing sub-requirements, resulting in a final processing program that includes subroutines capable of meeting different processing sub-requirements. When performing laser processing based on this program, laser processing can be carried out according to the processing sub-requirements of each processing substructure. Compared to the prior art, which designs processing structures corresponding to the same processing requirements on the same processing drawing and then sets a processing program for each drawing, this application only requires one processing drawing. The entire circuit board can be processed by executing a single complete processing program, resulting in higher processing efficiency.

[0050] In one example, step S102 above, "setting different processing subroutines according to processing sub-requirements," can include the following situations: Firstly, when the processing requirement of the processing structure is positional accuracy, a first processing subroutine is set. The first processing subroutine represents processing based on the actual expansion and contraction of the circuit board.

[0051] For example, when setting a processing subroutine for a processing structure requiring positional accuracy, the laser processing apparatus for circuit boards sets the processing subroutine for that structure as a CNC program capable of processing according to the actual expansion and contraction of the circuit board. For ease of distinction, this embodiment refers to such a processing subroutine as the first processing subroutine.

[0052] The expansion and contraction phenomenon of circuit boards will now be explained: During the circuit board manufacturing process, changes in temperature and pressure, as well as differences in the coefficients of thermal expansion between different materials, may cause deviations between the actual dimensions of the circuit board and the design dimensions shown in the circuit board processing drawings.

[0053] For example, a single-sided board is designed to be 100mm long and 80mm wide. However, due to factors such as temperature changes and moisture absorption during processing, the resulting circuit board may expand or contract, resulting in a length of 100.3mm and a width of 80.2mm. A double-sided board is designed to be 150mm long and 120mm wide. If problems occur during the lamination process, causing expansion or contraction, the final circuit board may become 150.5mm long and 120.4mm wide.

[0054] This embodiment performs laser processing on the processing structure based on the actual expansion and contraction of the circuit board. This ensures that the processed structure is adaptively adjusted according to the actual expansion and contraction of the circuit board, thereby reducing the impact of the expansion and contraction of the circuit board on the relative positional relationship of the processing structure within the circuit board and meeting the positional accuracy requirements of the processing structure.

[0055] For example, for Figure 2 The machining structure 1, which requires precise positioning, is set up with a first machining subroutine to perform laser machining on the machining structure 1 according to the actual expansion and contraction of the circuit board.

[0056] Secondly, when the machining requirement of the machining structure is dimensional accuracy, a second machining subroutine is set. The second machining subroutine represents machining based on the rotation angle generated by the circuit board and directly uses the theoretical drawing coordinates for machining without performing coordinate scaling conversion.

[0057] For example, when setting a machining subroutine for a machining structure requiring dimensional accuracy, the circuit board machining apparatus sets the machining subroutine for that structure as a CNC program capable of machining according to the rotation angle generated by the circuit board. For ease of distinction, this embodiment refers to this machining program as the second machining subroutine.

[0058] The rotation angle generated by the circuit board is explained below: During the production of circuit boards, the boards may undergo a certain degree of rotation. This is due to the combined effects of various factors, such as the anisotropy of the material and the uneven distribution of stress during processing.

[0059] For example, during the lamination process, pressure and temperature differences at different locations may cause the circuit board to rotate slightly.

[0060] When the circuit board rotates, if the machining program is not adjusted accordingly to accommodate the rotation, the machining structure designed as a rectangle or other regular shape in the circuit board machining drawings will exhibit a deformed shape on the machined circuit board.

[0061] For example, if a circuit board manufacturing drawing includes a square slot with four sides parallel to the four sides of the circuit board, and the circuit board is rotated, there will be an angle difference between the rotated placement angle and the angle indicated on the circuit board manufacturing drawing. If the rotation angle of the circuit board is not considered during laser processing of this square slot, and processing is not performed according to this rotation angle, the actual shape of the processed structure on the circuit board will become a rhombus due to the aforementioned angle difference, and its shape will not match the shape shown on the circuit board manufacturing drawing.

[0062] This embodiment addresses machining structures requiring dimensional accuracy by establishing a CNC program, or second machining subroutine, that processes the structure based on the rotation angle of the circuit board. This allows the CNC machining equipment to perform laser processing according to the rotation angle of the circuit board. During processing, the influence of the rotation angle on various parameters and control logic is fully considered, and the laser processing process is adaptively adjusted so that the angle of the processed structure on the circuit board changes with the circuit board angle. Changes in the overall angle of the processed structure do not affect the spacing between the outlines of the processed structure. Therefore, this application, while adaptively adjusting the angle of the processed structure according to changes in the circuit board angle, still maintains the dimensions shown in the drawing, thus meeting the dimensional accuracy requirements of the processed structure.

[0063] In this embodiment, the laser processing of the structure is performed based on the rotation angle generated by the circuit board, so that the placement angle of the processed structure on the rotated circuit board is consistent with its placement angle on the circuit board processing drawing. This ensures that the shape of the processed structure on the circuit board is consistent with the shape on the circuit board processing drawing. At the same time, the change in the placement angle of the processed structure does not affect the distance between the contour lines of the processed structure, thus ensuring that the placement angle and size of the processed structure on the circuit board are consistent with the circuit board processing drawing, thereby ensuring the dimensional accuracy of the processed structure.

[0064] In one example, step S103 above, "performing laser processing on multiple processing structures according to the processing program," may include the following situations: Firstly, when executing the first processing subroutine corresponding to the positional accuracy, the actual coordinates of the processing point are determined based on the actual expansion and contraction of the circuit board, so as to perform laser processing on the processing structure with positional accuracy requirements based on the actual coordinates of the processing point.

[0065] For example, the laser processing apparatus for the circuit board executes a first processing subroutine corresponding to the required positional accuracy to perform laser processing on the structure requiring precise positional accuracy. Before initiating the processing, the laser processing apparatus for the circuit board can first determine the actual coordinates of the processing point based on the actual expansion and contraction of the circuit board. Then, laser processing is performed based on the actual coordinates of the processing point.

[0066] The actual expansion and contraction of the circuit board can be determined by comparing the difference between the actual size and the design size of the circuit.

[0067] For example, the expansion / contraction ratio of a circuit board can be used to characterize its actual expansion / contraction. The expansion / contraction ratio is typically calculated using the following formula: Expansion / contraction ratio = (Actual size - Design size) / Design size × 100%; For example, if a PCB board is designed to be 100 mm long but its actual measured length is 100.5 mm, then the expansion / contraction ratio in this direction is: (100.5-100) / 100×100%=0.5%.

[0068] The laser processing equipment for circuit boards can use image recognition technology to photograph and identify the circuit board, thereby obtaining the actual size of the circuit board.

[0069] The laser processing equipment for circuit boards can extract the design dimensions of the circuit board in advance from the circuit board processing drawings uploaded by the user.

[0070] As a feasible implementation method, the expansion / contraction ratio of the circuit board can also be obtained through the following steps: Obtain the drawing coordinates and actual coordinates of any two target points (e.g., MARK points) on the circuit board; Calculate the design distance between the two target points in the first coordinate axis direction and the design distance in the second coordinate axis direction; Calculate the actual distance between the two target points along the first coordinate axis and the actual distance along the second coordinate axis. The ratio of the actual distance to the designed distance in the first coordinate axis direction is used as the expansion / contraction ratio of the circuit board in the first coordinate axis direction. The ratio of the actual distance to the designed distance in the second coordinate axis direction is used as the expansion / contraction ratio of the circuit board in the second coordinate axis direction.

[0071] After determining the expansion / contraction ratio, the actual coordinates of the processing point can be determined based on the expansion / contraction ratio.

[0072] For example, if the expansion / contraction ratio of the circuit board in the length (Y-axis) direction is 0.5%, then the sum of the Y-axis value of the drawing coordinates of the machining point and 0.5% of that value can be used as the actual Y-axis coordinate value of the machining point.

[0073] In this embodiment, the coordinates of the processing point on the drawing are adaptively adjusted according to the expansion and contraction ratio of the circuit board, so that the actual coordinate position of the processing point on the circuit board changes with the expansion and contraction of the circuit board.

[0074] In one example, before laser processing multiple processing structures according to the processing program, the following steps are included: grasping and positioning target points, and obtaining the position information of the positioning target points to position the circuit board. This embodiment only requires obtaining the position information of the positioning target points once. After the circuit board is positioned, laser processing of multiple processing structures is initiated according to the circuit board's processing program; there is no need to perform target point grasping and circuit board positioning before processing each processing structure.

[0075] In some embodiments, the machining points whose actual coordinates need to be determined may include machining points associated with positional accuracy (such as...). Figure 2 The machining points involved in the left edge line of machining structure 1; or all machining points involved in the entire machining structure 2.

[0076] This application embodiment addresses the need to ensure positional accuracy in machining structures. It uniformly determines the actual coordinates of the machining points based on the actual expansion and contraction of the circuit board, and uses the actual coordinates of the machining points for laser machining. This ensures that the position of the laser beam emitted from the machining point on the circuit board is the position after the expansion and contraction of the circuit board, thereby enabling the machined structure on the circuit board to maintain a consistent relative positional relationship with the circuit board machining drawings and meeting the positional accuracy requirements of the machining structure.

[0077] Secondly, when executing the second processing subroutine corresponding to the dimensional accuracy, the laser processing angle is adjusted according to the rotation angle generated by the circuit board, and the processing structure with dimensional accuracy requirements is laser processed according to the drawing coordinates of the processing point.

[0078] For example, the laser processing device for the circuit board executes a second processing subroutine corresponding to the dimensional accuracy, and performs laser processing on the processing structure requiring dimensional accuracy. Before starting the processing process, the laser processing device for the circuit board can first adjust the laser processing angle according to the rotation angle generated by the circuit board, and then perform laser processing on the processing structure with dimensional accuracy requirements according to the drawing coordinates of the processing point at this laser processing angle.

[0079] For example, a circuit board processing device can obtain the rotation angle generated by the circuit board in the following ways: Capture the positions of at least two MARK points on the circuit board, determine the actual coordinates of the MARK points, and extract the drawing coordinates of the MARK points from the circuit board manufacturing drawings.

[0080] The actual placement angle of the circuit board is calculated based on the actual coordinates of at least two MARK points.

[0081] For example, using trigonometric functions, the angle between the line containing the two MARK points and the X-axis can be calculated based on the distance between the two MARK points on the Y-axis and the distance on the X-axis. This angle is used as the actual placement angle of the circuit board.

[0082] Similarly, the theoretical placement angle of the circuit board is calculated based on the drawing coordinates of at least two MARK points mentioned above. The calculation process for this theoretical placement angle can be referred to the calculation process for the actual placement angle mentioned above, and will not be repeated here.

[0083] The rotation angle of the circuit board is obtained by calculating the angle difference between the actual placement angle and the theoretical placement angle.

[0084] In one embodiment, adjusting the laser processing angle based on the rotation angle generated by the circuit board can be achieved through the following process: For example, based on the rotation angle of the circuit board, the angle of the laser processing equipment can be adjusted so that the placement angle of the laser processing equipment is the same as that of the circuit board. In this state, the relative positional relationship between the laser processing equipment and the circuit board is equivalent to the relative positional relationship between the circuit board before rotation and the laser processing equipment before angle adjustment. Of course, the laser processing angle can also be adjusted by directly adjusting the placement angle of the CNC machining equipment. This is merely an example of how to adjust the laser processing angle and is not intended to limit it.

[0085] The laser processing angle can be understood as the angle between the placement direction of the laser processing equipment and the placement direction of the circuit board. When the placement direction of the laser processing equipment changes, the processing path formed by the laser beam emitted by the equipment on the circuit board will also change, thus affecting the placement direction of the processed structure on the circuit board.

[0086] In this embodiment, after adjusting the laser processing angle, the drawing coordinates of the processing points are still used to perform laser processing on the structure with dimensional accuracy requirements. The distances and angles between the edges of the processed structure processed using the drawing coordinates of the processing points remain consistent with the circuit board processing drawings, thus ensuring the dimensional accuracy of the processed structure.

[0087] In this embodiment, when processing structures requiring dimensional accuracy, the laser processing angle is first adjusted based on the rotation angle of the circuit board. Then, laser processing is performed using the drawing coordinates of the processing points at this laser processing angle. This method ensures that the placement angle of the processed structure on the circuit board is consistent with the circuit board processing drawing. Furthermore, by utilizing the drawing coordinates for laser processing, the coordinate relationships between different processing points remain consistent with the circuit board processing drawing, thereby mitigating the impact of circuit board expansion and contraction on the shape and size of the processed structure and guaranteeing its dimensional accuracy.

[0088] In one example, step S102 above, which involves setting the processing program based on the processing sub-requirements, may also include the following: When both positional and dimensional accuracy are required in the processing sub-requirements, the laser processing of multiple structures according to the processing program can be achieved through the following steps: When executing the first machining subroutine corresponding to positional accuracy and the second machining subroutine corresponding to dimensional accuracy, the actual coordinates of the machining points are first determined based on the actual expansion and contraction of the circuit board, so as to perform laser machining on the machining structure with positional accuracy requirements based on the actual coordinates of the machining points; next, the laser machining angle is adjusted according to the rotation angle generated by the circuit board, and the machining structure with dimensional accuracy requirements is laser machined according to the drawing coordinates of the machining points.

[0089] For example, Figure 2 The upper edge of the processed structure 3 shown is a structure requiring positional accuracy, while the left and right edge lines are structures requiring dimensional accuracy. When laser processing this structure 3, the actual coordinates of the processing points on the upper edge can be determined first based on the actual expansion and contraction of the circuit board. This allows for laser processing of the upper edge, which requires positional accuracy, based on these coordinates, thus determining the position of the processed structure 3 on the circuit board. Next, the laser processing angle is adjusted according to the rotation angle of the circuit board, and the left and right edge lines are laser processed according to the drawing coordinates of the processing points on the left and right edge lines. This ensures the dimensional accuracy of the left and right edge lines. It is worth noting that for other structures that do not require positional or dimensional accuracy, conventional processing methods can be used, or processing can be performed according to the drawing coordinates of the processing points after adjusting the laser processing angle; this application does not impose any restrictions.

[0090] In this embodiment, when laser processing a structure with both dimensional and positional accuracy requirements, the actual expansion and contraction of the circuit board and its rotation angle are considered. First, the actual coordinates of the processing points are determined based on the circuit board's expansion and contraction. The portion of the structure requiring positional accuracy is then processed according to these coordinates, determining its position within the circuit board. Next, the laser processing angle is adjusted based on the circuit board's rotation angle, and the portion of the structure requiring dimensional accuracy is laser-processed according to the drawing coordinates of the processing points, ensuring the dimensional accuracy of the structure relative to the circuit board's rotation angle.

[0091] Furthermore, this processing method eliminates the need to input drawings into the processing device multiple times. Each time a drawing is input, the mark points need to be re-captured and repositioned during processing. This not only reduces processing efficiency but also increases errors and can even cause mistakes due to multiple positioning steps, thereby reducing yield and affecting processing quality. The processing method provided in this application only requires one drawing and one processing step, avoiding the errors or mistakes caused by multiple mark point captures, thus improving yield and processing quality.

[0092] In one example, the processing sub-requirement may include a first processing efficiency and a second processing efficiency; wherein the first processing efficiency is not equal to the second processing efficiency.

[0093] For example, some processing structures on a circuit board require high processing efficiency while others require high processing precision. In this case, different processing efficiencies can be matched to different processing structures to meet the different needs of different processing structures on the same circuit board.

[0094] In step S102 above, setting different processing subroutines according to processing sub-requirements can include the following situations: When the processing requirement of the processing structure is the first processing efficiency, a third processing subroutine is set; wherein, the third processing subroutine represents processing according to the first processing efficiency.

[0095] For example, when the circuit board processing apparatus sets a processing subroutine for a processing structure requiring a first processing efficiency, it sets the processing subroutine for that processing structure as a CNC program capable of processing according to the first processing efficiency. For ease of distinction, this embodiment refers to such a processing subroutine as a third processing subroutine.

[0096] When the processing requirement of the processing structure is the second processing efficiency, a fourth processing subroutine is set; wherein, the fourth processing subroutine represents processing according to the second processing efficiency.

[0097] For example, when the circuit board processing apparatus sets a processing subroutine for a processing structure requiring a second processing efficiency, it sets the processing subroutine of that processing structure as a CNC program capable of processing according to the second processing efficiency. For ease of distinction, this embodiment refers to such a processing subroutine as the fourth processing subroutine.

[0098] According to the different processing efficiency requirements of the processing structure, different processing subroutines are set for each processing structure. In this way, when the processing program is executed for laser processing, different processing efficiencies can be implemented for different processing structures, thereby realizing customized processing of different processing structures on the same circuit board.

[0099] In one example, the processing structure may include multiple locations to be processed; as described in the embodiments above. Figure 2 The edge lines of each processing structure are shown.

[0100] In step S103 above, laser processing is performed on multiple processing structures according to the processing program, which may include the following steps: When executing the third processing subroutine, processing is performed according to the first processing efficiency corresponding to the third processing subroutine.

[0101] For example, when the processing subroutine of a processing structure is a third processing subroutine, the third processing subroutine is executed to perform laser processing on the processing structure. The laser processing process is implemented according to a first processing efficiency.

[0102] When executing the fourth processing subroutine, processing is performed according to the second processing efficiency corresponding to the fourth processing subroutine.

[0103] For example, when the processing subroutine of a processing structure is the fourth processing subroutine, the fourth processing subroutine is executed to perform laser processing on the processing structure. The laser processing process is implemented according to the second processing efficiency.

[0104] When the processing sub-requirement of at least one processing position in the processing structure is a first processing efficiency, and the processing sub-requirement of at least one processing position in the processing structure is a second processing efficiency, the processing position corresponding to the first processing efficiency is processed according to the third processing subroutine, and the processing position corresponding to the second processing efficiency is processed according to the fourth processing subroutine.

[0105] For example, when different processing positions in a processing structure require different processing efficiencies, that is, when at least one processing position in the processing structure requires a first processing efficiency and at least one processing position requires a second processing efficiency, the circuit board processing device can process the processing position corresponding to the first processing efficiency according to the third processing subroutine, and process the processing position corresponding to the second processing efficiency according to the fourth processing program.

[0106] According to the processing efficiency requirements of the processing structure, this application sets a processing subroutine for the processing structure to perform processing at the required efficiency. In this way, when performing laser processing according to the final processing program, different processing powers can be provided for different processing structures on the same circuit board.

[0107] During the machining process, machining efficiency and machining accuracy are negatively correlated. When machining efficiency is higher, the machining speed is faster but the machining accuracy is lower; conversely, when machining efficiency is lower, the machining speed is slower but the machining accuracy is higher.

[0108] Moreover, not all edges of the machining structure require high machining accuracy. By designing machining efficiency separately, a low-efficiency, high-precision machining method is used for the parts that require high precision, while a high-efficiency machining method is used for the other parts that require lower precision. In this way, while ensuring sufficient precision for the key structures, a faster overall machining speed can be achieved, thereby improving machining efficiency.

[0109] It should be understood that the sequence number of each step in the above embodiments does not imply the order of execution. The execution order of each process should be determined by its function and internal logic, and should not constitute any limitation on the implementation process of the embodiments of this application.

[0110] Figure 3 This is a block diagram of a laser processing apparatus for a circuit board according to an exemplary embodiment of this application, such as... Figure 3As shown, the device 300 includes an acquisition module 301, a program setting module 302, and a processing module 303: The acquisition module 301 is used to acquire the processing requirements of the circuit board; wherein the circuit board contains multiple processing structures, and the processing requirements include processing sub-requirements for multiple processing structures. The program setting module 302 is used to set different processing subroutines according to the processing sub-requirements, and the processing subroutines constitute the processing program. The processing module 303 is used to perform laser processing on multiple processing structures according to the processing program.

[0111] In one embodiment, the processing sub-requirements include positional accuracy and dimensional accuracy.

[0112] In one embodiment, the program setting module is configured to: set a first processing subroutine when the processing sub-requirement of the processing structure is positional accuracy; wherein the first processing subroutine represents processing based on the actual expansion and contraction of the circuit board; and set a second processing subroutine when the processing sub-requirement of the processing structure is dimensional accuracy; wherein the second processing subroutine represents processing based on the rotation angle generated by the circuit board.

[0113] In one embodiment, the processing module is configured to: when executing the first processing subroutine corresponding to positional accuracy, determine the actual coordinates of the processing point based on the actual expansion and contraction of the circuit board, and perform laser processing on the processing structure with positional accuracy requirements based on the actual coordinates of the processing point; when executing the second processing subroutine corresponding to dimensional accuracy, adjust the laser processing angle based on the rotation angle generated by the circuit board, and perform laser processing on the processing structure with dimensional accuracy requirements according to the drawing coordinates of the processing point.

[0114] In one embodiment, the processing module is configured to: when executing a first processing subroutine corresponding to positional accuracy and a second processing subroutine corresponding to dimensional accuracy, first determine the actual coordinates of the processing point based on the actual expansion and contraction of the circuit board, and then perform laser processing on the processing structure with positional accuracy requirements based on the actual coordinates of the processing point; next, adjust the laser processing angle based on the rotation angle generated by the circuit board, and perform laser processing on the processing structure with dimensional accuracy requirements according to the drawing coordinates of the processing point.

[0115] In one embodiment, the processing sub-requirement includes a first processing efficiency and a second processing efficiency; wherein the first processing efficiency is not equal to the second processing efficiency.

[0116] In one embodiment, the program setting module is configured to: set a third processing subroutine when the processing sub-requirement of the processing structure is a first processing efficiency; wherein the third processing subroutine represents processing according to the first processing efficiency; and set a fourth processing subroutine when the processing sub-requirement of the processing structure is a second processing efficiency; wherein the fourth processing subroutine represents processing according to the second processing efficiency.

[0117] In one embodiment, the processing structure includes multiple processing positions and a processing module, which performs processing according to a first processing efficiency corresponding to the third processing subroutine when executing a third processing subroutine; and performs processing according to a second processing efficiency corresponding to the fourth processing subroutine when executing a fourth processing subroutine; when the processing sub-requirement of at least one processing position in the processing structure is the first processing efficiency and the processing sub-requirement of at least one processing position in the processing structure is the second processing efficiency, the processing position corresponding to the first processing efficiency is processed according to the third processing subroutine, and the processing position corresponding to the second processing efficiency is processed according to the fourth processing subroutine.

[0118] In one embodiment, the processing module is further configured to: grasp the positioning target point and obtain the position information of the positioning target point in order to position the circuit board.

[0119] In summary, the circuit board processing apparatus proposed in this application first obtains the processing requirements of the circuit board; wherein, the circuit board includes multiple processing structures, and the processing requirements of the circuit board include processing sub-requirements for multiple processing structures; then, different processing subroutines are set according to these processing sub-requirements, and each processing subroutines constitute a processing program; then, laser processing is performed on multiple processing structures according to the processing program. This application sets customized processing subroutines for each processing structure based on its processing sub-requirements, so that the final processing program includes processing subroutines that can meet different processing sub-requirements. When performing laser processing based on this processing program, laser processing can be carried out according to the processing sub-requirements of each processing substructure. Compared with the prior art, which designs processing structures corresponding to the same processing requirements in the same processing drawing and then sets a processing program for each processing drawing, this application only requires one processing drawing, and the entire circuit board can be processed by executing a complete processing program, resulting in higher processing efficiency.

[0120] To implement the above embodiments, such as Figure 4 As shown in the embodiments of this application, a laser processing device 400 is also proposed, including... Figure 3 The laser processing device 300 for the circuit board shown.

[0121] To implement the above embodiments, this application also proposes a computer-readable storage medium storing a computer program that, when executed by a processor, implements the steps of the laser processing method for circuit boards as described in the above embodiments.

[0122] Those skilled in the art will understand that all or part of the processes in the above embodiments can be implemented by a computer program instructing related hardware. The computer program can be stored in a non-volatile computer-readable storage medium. When executed, the computer program can include the processes of the embodiments of the above methods. Any references to memory, storage, databases, or other media used in the embodiments provided in this application can include non-volatile and / or volatile memory. Non-volatile memory may include read-only memory (ROM), programmable ROM (PROM), electrically programmable ROM (EPROM), electrically erasable programmable ROM (EEPROM), or flash memory. Volatile memory may include random access memory (RAM) or external cache memory. By way of illustration and not limitation, RAM is available in a variety of forms, such as static RAM (SRAM), dynamic RAM (DRAM), synchronous DRAM (SDRAM), dual data rate SDRAM (DDRSDRAM), enhanced SDRAM (ESDRAM), synchronous link DRAM (SLDRAM), RAMbus direct RAM (RDRAM), direct memory bus dynamic RAM (DRDRAM), and memory bus dynamic RAM (RDRAM), etc.

[0123] Those skilled in the art will clearly understand that, for the sake of convenience and brevity, the above-described division of functional units and modules is used as an example. In practical applications, the above functions can be assigned to different functional units and modules as needed, that is, the internal structure of the device can be divided into different functional units or modules to complete all or part of the functions described above.

[0124] The above-described embodiments are only used to illustrate the technical solutions of this application, and are not intended to limit them. Although this application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of this application, and should all be included within the protection scope of this application.

Claims

1. A laser processing method for circuit boards, characterized in that, The method includes: Obtain the processing requirements of the circuit board; wherein the circuit board includes multiple processing structures, and the processing requirements include processing sub-requirements of the multiple processing structures; Different processing subroutines are set according to the processing requirements, and the processing subroutines together form a processing program. According to the processing procedure, the plurality of processing structures are laser-processed.

2. The processing method according to claim 1, characterized in that, The processing requirements include positional accuracy and dimensional accuracy.

3. The processing method according to claim 2, characterized in that, Different processing subroutines are set according to the aforementioned processing sub-requirements, including: When the processing requirement of the processing structure is positional accuracy, a first processing subroutine is set; wherein, the first processing subroutine represents processing according to the actual expansion and contraction of the circuit board; When the processing requirement of the processing structure is dimensional accuracy, a second processing subroutine is set; wherein, the second processing subroutine represents processing based on the rotation angle generated by the circuit board.

4. The processing method according to claim 3, characterized in that, According to the processing procedure, laser processing is performed on the plurality of processing structures, including: When executing the first processing subroutine corresponding to the positional accuracy, the actual coordinates of the processing point are determined according to the actual expansion and contraction of the circuit board, so as to perform laser processing on the processing structure with positional accuracy requirements based on the actual coordinates of the processing point; When executing the second processing subroutine corresponding to the dimensional accuracy, the laser processing angle is adjusted according to the rotation angle generated by the circuit board, and the processing structure with dimensional accuracy requirements is laser processed according to the drawing coordinates of the processing point.

5. The processing method according to claim 4, characterized in that, According to the processing procedure, laser processing of the plurality of processing structures further includes: When executing the first machining subroutine corresponding to positional accuracy and the second machining subroutine corresponding to dimensional accuracy, the actual coordinates of the machining point are first determined according to the actual expansion and contraction of the circuit board, so as to perform laser machining on the machining structure with positional accuracy requirements according to the actual coordinates of the machining point; next, the laser machining angle is adjusted according to the rotation angle generated by the circuit board, and the machining structure with dimensional accuracy requirements is laser machined according to the drawing coordinates of the machining point.

6. The processing method according to claim 1, characterized in that, The processing sub-requirements include a first processing efficiency and a second processing efficiency; wherein the first processing efficiency is not equal to the second processing efficiency.

7. The processing method according to claim 6, characterized in that, Different processing subroutines are set according to the aforementioned processing sub-requirements, including: When the processing requirement of the processing structure is a first processing efficiency, a third processing subroutine is set; wherein, the third processing subroutine represents processing according to the first processing efficiency; When the processing requirement of the processing structure is the second processing efficiency, a fourth processing subroutine is set; wherein, the fourth processing subroutine represents processing according to the second processing efficiency.

8. The processing method according to claim 7, characterized in that, The processing structure includes multiple processing positions; According to the processing procedure, laser processing is performed on the plurality of processing structures, including: When executing the third processing subroutine, processing is performed according to the first processing efficiency corresponding to the third processing subroutine; When executing the fourth processing subroutine, processing is performed according to the second processing efficiency corresponding to the fourth processing subroutine; When the processing sub-requirement of the processing position of at least one of the processing structures is a first processing efficiency, and the processing sub-requirement of the processing position of at least one of the processing structures is a second processing efficiency, the processing position corresponding to the first processing efficiency is processed according to the third processing subroutine, and the processing position corresponding to the second processing efficiency is processed according to the fourth processing subroutine.

9. The processing method according to any one of claims 1-8, characterized in that, Before performing laser processing on the plurality of processing structures according to the processing procedure, the process includes: The positioning target point is captured and its location information is obtained to locate the circuit board.

10. A laser processing apparatus for circuit boards, characterized in that, The device includes: An acquisition module is used to acquire the processing requirements of a circuit board; wherein the circuit board includes multiple processing structures, and the processing requirements include processing sub-requirements for the multiple processing structures; The program setting module is used to set different processing subroutines according to the processing sub-requirements, and the processing subroutines together form a processing program. The processing module is used to perform laser processing on the plurality of processing structures according to the processing program.

11. A laser processing device, characterized in that, The device includes the laser processing apparatus for circuit boards as described in claim 10.

12. A computer-readable storage medium having a computer program stored thereon, characterized in that, When executed by a processor, the program implements the steps of the method for laser processing of a circuit board as described in any one of claims 1-9.

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