Resin composition, prepreg, circuit board, printed circuit board

Abstract

This invention relates to a resin composition, a prepreg, a circuit board, and a printed circuit board. The resin composition comprises a modified polyphenylene ether resin, a thermosetting hydrocarbon resin, and a hard-soft segment intercalation copolymer, wherein: the end groups of the modified polyphenylene ether resin include double bond groups; the dipole moment of the reactive groups in the thermosetting hydrocarbon resin is ≤0.7; the number of carbon atoms in the main chain of any soft segment in the hard-soft segment intercalation copolymer is 5-15, and the bond angle of the hard segment has a maximum rotation angle ≤20° below 300°. The circuit board made from the resin composition of this invention not only has low dielectric loss and XYZ-CTE, but also high peel strength, which is beneficial to ensuring the reliability of printed circuit board processing.

Description

Technical Field

[0001] This invention relates to the field of electronic industry technology, and in particular to a resin composition, a prepreg, a circuit board, and a printed circuit board. Background Technology

[0002] In current printed circuit board (PCB) manufacturing, the requirements for the coefficient of thermal expansion (CTE) are becoming increasingly stringent. For the processing of high-end materials, in addition to ensuring processing reliability while maintaining ultra-low dielectric loss, it is also necessary to have a low coefficient of thermal expansion to meet the increasingly diverse application scenarios.

[0003] However, the traditional resin system of mixed hydrocarbon resin and polyphenylene ether resin used in PCB processing will cause the circuit board to have problems such as high coefficient of thermal expansion (XYZ-CTE) in the X, Y and Z axes when the temperature changes, and poor peel strength, which makes it difficult to meet the high processing requirements. Summary of the Invention

[0004] Therefore, it is necessary to provide a resin composition, a prepreg, a circuit board, and a printed circuit board to address the above problems. The circuit board made from the resin composition not only has low dielectric loss and XYZ-CTE, but also high peel strength, which helps to ensure the reliability of printed circuit board processing.

[0005] A resin composition comprising a modified polyphenylene ether resin, a thermosetting hydrocarbon resin, and a soft-hard segment intercalation copolymer, wherein:

[0006] The modified polyphenylene ether resin has end groups including double bond groups;

[0007] The dipole moment of the reactive groups in the thermosetting hydrocarbon resin is ≤0.7;

[0008] In the soft-hard segment intercalation copolymer, the main chain carbon number of any soft segment is 5-15, and the bond angle of the hard segment is ≤20° at a maximum rotation angle below 300°.

[0009] In one embodiment, the soft segment of the soft-hard segment intercalation copolymer includes a first reactive group, the dipole moment of which is ≥1.7.

[0010] In one embodiment, the functional group equivalent of the first reactive group is 5000 g / mol to 10000 g / mol.

[0011] In one embodiment, the soft segment branched in the soft-hard segment intercalation copolymer includes a second reactive group, the second reactive group satisfying at least one of the following conditions:

[0012] (1) The dipole moment of the second reactive group is ≤0.7;

[0013] (2) The functional group equivalent of the second reactive group is 300 g / mol-1000 g / mol;

[0014] (3) The second reactive group is located at the end of the branch chain.

[0015] In one embodiment, the hard segment of the hard segment intercalation copolymer comprises a cyclic structure and contains no reactive groups.

[0016] In one embodiment, the mass ratio of the modified polyphenylene ether resin, the thermosetting hydrocarbon resin, and the soft-hard segment intercalation copolymer is (15-25):(5-25):(1-7).

[0017] In one embodiment, the resin composition further includes at least one of filler, accelerator, and flame retardant.

[0018] A semi-cured sheet made using the resin composition described above.

[0019] A circuit board made using a prepreg as described above.

[0020] A printed circuit board made using the circuit board described above.

[0021] The resin composition of this invention utilizes the synergistic effect of a modified polyphenylene ether resin with end groups including double bond groups, a thermosetting hydrocarbon resin with a reactive group dipole moment ≤0.7, and a soft-hard segment intercalation copolymer with specific soft and hard segment combinations. On the one hand, it can not only increase the crosslinking density of the resin composition, thereby reducing dielectric loss and the influence of temperature changes on the coefficient of thermal expansion in the Z-axis direction, but also avoid problems such as reduced peel strength of circuit board due to excessively fast reaction rate, which is beneficial to improving the reliability of PCB processing. On the other hand, it enables some segments in the resin composition to have the advantages of both soft and hard segments, which is beneficial to reducing the influence of temperature changes on the coefficient of thermal expansion in the X and Y-axis directions, and further improving the peel strength of circuit board.

[0022] Therefore, the resin composition of the present invention not only has low dielectric loss and XYZ-CTE, but also produces circuit board with high peel strength, which is beneficial to ensuring the reliability of PCB processing. Detailed Implementation

[0023] To facilitate understanding of the present invention, it will be described in more detail below. However, it should be understood that the present invention can be implemented in many different forms and is not limited to the embodiments or examples described herein. Rather, these embodiments or examples are provided to make the disclosure of the present invention more thorough and complete.

[0024] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention pertains. The terminology used herein in the description of the invention is for the purpose of describing particular embodiments or examples only and is not intended to limit the invention. In this invention, when referring to numerical ranges, unless otherwise specified, such ranges are considered continuous and include the minimum and maximum values ​​of the range, as well as every value between such minimum and maximum values. Further, when a range refers to an integer, it includes every integer between the minimum and maximum values ​​of the range. Furthermore, when multiple ranges are provided to describe a feature or characteristic, the ranges may be combined. In other words, unless otherwise specified, all ranges disclosed herein should be understood to include any and all subranges to which they are included.

[0025] This invention provides a resin composition comprising a modified polyphenylene ether resin, a thermosetting hydrocarbon resin, and a soft-hard segment intercalation copolymer, wherein:

[0026] The modified polyphenylene ether resin has end groups including double bond groups;

[0027] The dipole moment of the reactive groups in the thermosetting hydrocarbon resin is ≤0.7;

[0028] In the soft-hard segment intercalation copolymer, the main chain carbon number of any soft segment is 5-15, and the bond angle of the hard segment is ≤20° at a maximum rotation angle below 300°.

[0029] The resin composition of this invention utilizes the synergistic effect of a modified polyphenylene ether resin with end groups including double bond groups, a thermosetting hydrocarbon resin with a reactive group dipole moment ≤0.7, and a soft-hard segment intercalation copolymer with specific soft and hard segment combinations. On the one hand, it can not only increase the crosslinking density of the resin composition, thereby reducing dielectric loss and the influence of temperature changes on the coefficient of thermal expansion in the Z-axis direction, but also avoid problems such as reduced peel strength of circuit board due to excessively fast reaction rate, which is beneficial to improving the reliability of PCB processing. On the other hand, it enables some segments in the resin composition to have the advantages of both soft and hard segments, which is beneficial to reducing the influence of temperature changes on the coefficient of thermal expansion in the X and Y-axis directions, and further improving the peel strength of circuit board.

[0030] It is understood that this invention does not limit the functional groups other than the end groups in the modified polyphenylene ether resin; the dipole moment of the reactive group in the thermosetting hydrocarbon resin is ≤0.7, meaning that the dipole moment of all reactive groups is ≤0.7, including but not limited to any value of 0.1, 0.2, 0.3, 0.4, 0.5, 0.6, 0.7 or any range between any two, specifically, the reactive groups include but are not limited to carbon-carbon double bonds, carbon-carbon triple bonds, vinyl benzyl, etc.; the number of carbon atoms in the main chain of any soft segment in the soft-hard segment intercalation copolymer includes but is not limited to any value of 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15 or any range between any two; the maximum rotation angle of the bond angle of the hard segment in the soft-hard segment intercalation copolymer below 300°C includes but is not limited to any value of 1°, 5°, 10°, 12°, 15°, 18°, 20° or any range between any two.

[0031] In one embodiment, the modified polyphenylene ether resin has a molecular weight ≤7000, including but not limited to any value among 2000, 3000, 4000, 5000, 6000, and 7000, or any range between two of them, which is beneficial to further improve the peel strength of the circuit board and reduce dielectric loss and coefficient of thermal expansion.

[0032] In one embodiment, the end groups of the modified polyphenylene ether resin include, but are not limited to, at least one of vinyl, acrylic, methacrylic, or vinyl benzyl groups, which facilitates the participation of the end groups in free radical reactions, promotes the reaction between the modified polyphenylene ether resin and hydrocarbon resin, thereby further increasing the crosslinking density and ensuring that the dielectric loss and coefficient of thermal expansion can meet higher requirements.

[0033] It should be noted that the present invention does not limit the preparation method of the modified polyphenylene ether resin. Existing commercially available products can be used, or conventional modification methods can be used to prepare the resin. The present invention will not elaborate on this further.

[0034] In one embodiment, the molecular weight of the thermosetting hydrocarbon resin is ≤50,000, including but not limited to any value among 1,000, 3,000, 5,000, 10,000, 30,000, and 50,000, or any range between two. By controlling the molecular weight of the thermosetting hydrocarbon resin, it is beneficial to reduce steric hindrance, further promote the reaction, and thereby improve the peel strength of the circuit board.

[0035] In one embodiment, the thermosetting hydrocarbon resin includes, but is not limited to, at least one of polybutadiene, polystyrene, styrene-butadiene-styrene block copolymer, or semi-hydrogenated styrene-butadiene block copolymer.

[0036] It should be noted that the soft-hard segment intercalation copolymer is composed of soft segments and hard segments, which are intercalated with each other.

[0037] In one embodiment, the soft segment branch of the soft segment in the soft-hard segment intercalation copolymer includes a first reactive group, the dipole moment of which is ≥1.7, including but not limited to any one of 1.7, 1.8, 1.9, 2.0, 2.1, 2.5, 3.0, 4.0, 5.0, 6.0 or any range between two of them.

[0038] More preferably, the functional group equivalent of the first reactive group is 5000 g / mol to 10000 g / mol, including but not limited to any one of 5000 g / mol, 6000 g / mol, 7000 g / mol, 8000 g / mol, 9000 g / mol, 10000 g / mol or any range between the two.

[0039] Specifically, the first reactive group includes, but is not limited to, amino, hydroxyl, etc.

[0040] By controlling the dipole moment and functional group equivalent of the first reactive group in the soft segment branch of the soft-hard segment intercalation copolymer, it is beneficial to promote the formation of hydrogen bonds during the reaction process, thereby further improving the peel strength.

[0041] In one embodiment, the soft segment branch of the soft segment in the soft-hard segment intercalation copolymer includes a second reactive group, the dipole moment of which is ≤0.7, including but not limited to any one of 0.1, 0.2, 0.3, 0.4, 0.5, 0.6, 0.7 or any range between both.

[0042] Preferably, the functional group equivalent of the second reactive group is 300 g / mol to 1000 g / mol, including but not limited to any one of 300 g / mol, 500 g / mol, 1000 g / mol or any range between the two.

[0043] Specifically, the second reactive group includes, but is not limited to, vinyl, acrylic, etc.

[0044] By further regulating the dipole moment and functional group equivalent of the second reactive group in the soft segment branch of the soft-hard segment intercalation copolymer, it is not only beneficial to further reduce the dielectric loss of the circuit board, but also beneficial to further increase the crosslinking density, thereby improving the peel performance of the circuit board and reducing the coefficient of thermal expansion.

[0045] Further preferably, the second reactive group is located at the end of the branch chain, which is beneficial to further reduce the dielectric loss of the circuit board.

[0046] In one embodiment, the soft segment branches of the hard-soft segment intercalation copolymer do not contain reactive groups other than end groups, which is beneficial to further reduce the dielectric loss of the circuit board.

[0047] In one embodiment, the hard segment of the soft-hard segment intercalation copolymer includes a cyclic structure and does not contain reactive groups, specifically including but not limited to benzene rings, fluorene, acenaphthene, etc., which helps to ensure the rigidity of the hard segment, thereby further reducing the influence of temperature changes on the coefficient of thermal expansion (XY-CTE) in the X and Y axes.

[0048] In one embodiment, the mass ratio of the modified polyphenylene ether resin, the thermosetting hydrocarbon resin, and the soft-hard segment intercalation copolymer is (15-25):(5-25):(1-7), preferably (18-21):(10-13):(3-5).

[0049] In one embodiment, the resin composition further includes a filler, preferably in a mass ratio of (3:7) to (7:3) of the filler to the modified polyphenylene ether resin, more preferably (2-5):(2-3).

[0050] Further preferably, the particle size of the filler is ≤5μm, including but not limited to any one of 1μm, 2μm, 3μm, 4μm, 5μm or any range between two.

[0051] Specifically, the filler includes, but is not limited to, at least one of spherical silica, polytetrafluoroethylene powder, hollow silica, or hollow glass microspheres.

[0052] In one embodiment, the resin composition further includes an accelerator, preferably in a mass ratio of accelerator to modified polyphenylene ether resin of 1:500-1:15, more preferably (1-300):(1-450).

[0053] More preferably, the accelerator is selected from organic peroxides, including but not limited to at least one of dicumyl peroxide (DCP) and bis(tert-butylperoxyisopropyl)benzene (BIPB).

[0054] In one embodiment, the resin composition further includes a flame retardant, preferably in a mass ratio of 2:5 to 4:3, more preferably (1-2):(2-3).

[0055] Specifically, the flame retardant is selected from at least one of decabromodiphenyl ethane, octabromoether, phosphazene, phosphate ester flame retardants, and DOPO-based flame retardants.

[0056] It should be noted that the present invention does not limit the preparation method of the resin composition; existing mixing processes can be used. For example, the raw materials are weighed according to the following formula: 15-25 parts by weight of modified polyphenylene ether resin, 1-7 parts by weight of soft and hard segment intercalation copolymer, 5-25 parts by weight of thermosetting hydrocarbon resin, 0.05-1 part by weight of accelerator, 25-35 parts by weight of filler, and 10-20 parts by weight of flame retardant. The modified polyphenylene ether resin is first fully dispersed at 30℃-40℃ using toluene or xylene as a solvent to obtain a first solution. Then, the soft and hard segment intercalation copolymer and thermosetting hydrocarbon resin are added to the first solution and mixed evenly. The mixture is stirred at 15℃-30℃ for 4-8 hours to obtain a second solution. Finally, the filler and flame retardant are added to the second solution and mechanically stirred for 2-4 hours until evenly dispersed. The accelerator is then added and stirred evenly to obtain the resin composition.

[0057] The present invention also provides a semi-cured sheet made using the resin composition described above.

[0058] It should be noted that the present invention does not limit the preparation method of the prepreg; any existing method may be used, such as: forming a resin composition on a reinforcing material by impregnation and / or coating, and then baking it at 110°C-150°C for 2 min-4 min to obtain a prepreg. The reinforcing material includes, but is not limited to, at least one of electronic-grade glass fiber cloth, aramid cloth, and carbon fiber cloth.

[0059] The present invention also provides a circuit board made of the prepreg as described above, which has low dielectric loss and XYZ-CTE and high peel strength, is not prone to delamination, board bursting and other defects, and can meet higher processing requirements.

[0060] Specifically, the circuit board includes a dielectric layer and a conductive layer disposed on at least one surface of the dielectric layer, wherein the dielectric layer is formed by pressing one or more prepregs as described above, and the conductive layer includes, but is not limited to, conductive metal materials such as copper foil and aluminum foil.

[0061] It should be noted that the present invention does not limit the method of fabricating the circuit board; existing methods can be used.

[0062] The present invention also provides a printed circuit board made using the circuit substrate described above, which can meet diverse application scenarios and has high market application potential.

[0063] Specifically, the printed circuit board is made from the circuit substrate through processes such as drilling, hole filling, micro-etching, pre-immersion, activation, acceleration, chemical copper plating, and copper thickening.

[0064] The resin composition, prepreg, circuit board, and printed circuit board will be further described below through specific embodiments. However, those skilled in the art will understand that the following embodiments are for illustrative purposes only and should not be considered as limiting the scope of the invention. Unless otherwise specified, specific conditions in the embodiments are performed under conventional conditions or conditions recommended by the manufacturer. Reagents or instruments used, unless otherwise specified, are all commercially available conventional products.

[0065] Example 1

[0066] Using 42 parts by weight of toluene as a solvent, 25 parts by weight of modified polyphenylene ether resin (brand name SA9000; molecular weight 2300, end group methacrylic acid group) were first fully dispersed to obtain the first solution. Then, 5 parts by weight of the soft and hard segment intercalation copolymer as shown in Table 1, 7 parts by weight of polybutadiene (brand name B1000; molecular weight 1000, reactive group vinyl, dipole moment 0.2), and 5 parts by weight of styrene-butadiene-styrene block copolymer (brand name A1536; molecular weight 35000, reactive group vinyl, dipole moment 0.2) were added to the first solution and mixed evenly. The mixture was stirred at 20°C for 8 hours to obtain the second solution. Finally, 35 parts by weight of spherical silica filler and 10.95 parts by weight of decabromodiphenyl ethane flame retardant were added to the second solution and mechanically stirred for 3 hours until evenly dispersed. 0.0018 parts by weight of BIPB were added and mixed evenly to obtain the resin composition.

[0067] Example 2

[0068] Using 42 parts by weight of toluene as a solvent, 25 parts by weight of modified polyphenylene ether resin (brand name OPE-2200-2ST; molecular weight 2200, end group vinyl benzyl) were first fully dispersed to obtain the first solution. Then, 5 parts by weight of the soft and hard segment intercalation copolymer as shown in Table 1, 7 parts by weight of polybutadiene (brand name B1000; molecular weight 1000, reactive group vinyl, dipole moment 0.2), and 5 parts by weight of styrene-butadiene-styrene block copolymer (brand name D1118; molecular weight 50000, reactive group vinyl, dipole moment 0.2) were added to the first solution and mixed evenly. The mixture was stirred at 20°C for 8 hours to obtain the second solution. Finally, 35 parts by weight of spherical silica filler and 10.95 parts by weight of decabromodiphenyl ethane flame retardant were added to the second solution and mechanically stirred for 3 hours until evenly dispersed. 0.0018 parts by weight of BIPB were added and mixed evenly to obtain the resin composition.

[0069] Example 3

[0070] Example 3 differs from Example 1 only in that it uses different soft and hard segment intercalation copolymers, as shown in Table 1.

[0071] Example 4

[0072] Example 4 differs from Example 1 only in that it uses different soft and hard segment intercalation copolymers, as shown in Table 1.

[0073] Example 5

[0074] The difference between Example 5 and Example 1 is that a modified polyphenylene ether resin with the brand name Nantong Xingchen 630, a molecular weight of 9000, and methacrylic acid end groups is used.

[0075] Example 6

[0076] The difference between Example 6 and Example 1 is that an equal amount of semi-hydrogenated styrene-butadiene block copolymer (brand name FG1901; molecular weight 226000, reactive group is vinyl, dipole moment is 0.2) is used instead of polybutadiene.

[0077] Example 7

[0078] The difference between Example 7 and Example 1 is that 12 parts by weight of polybutadiene (brand name B3000; molecular weight 3000, reactive group is vinyl, dipole moment is 0.2) is used instead of 7 parts by weight of polybutadiene and 5 parts by weight of styrene-butadiene-styrene block copolymer.

[0079] Example 8

[0080] The difference between Example 8 and Example 1 is that the soft and hard segment intercalation copolymer is 15 parts by weight.

[0081] Comparative Example 1

[0082] The difference between Comparative Example 1 and Example 1 is that an equal amount of modified polyphenylene ether resin (brand name SA900, molecular weight 150, terminal group hydroxyl) was used instead of the modified polyphenylene ether resin.

[0083] Comparative Example 2

[0084] The difference between Comparative Example 2 and Example 1 is that an equal amount of polybutadiene (grade JP200, molecular weight 1300, reactive group is epoxy group, dipole moment is 30) was used instead of polystyrene.

[0085] Comparative Example 3

[0086] The difference between Comparative Example 3 and Example 1 is that equal amounts of the soft and hard segment intercalation copolymers shown in Table 1 were used.

[0087] Comparative Example 4

[0088] The difference between Comparative Example 4 and Example 1 is that equal amounts of the soft and hard segment intercalation copolymers shown in Table 1 were used.

[0089] The soft and hard segment intercalation copolymers used in the embodiments of this case are all from Kronentech.

[0090] Table 1

[0091]

[0092] Application examples

[0093] The resin compositions prepared in all examples and comparative examples were uniformly coated onto electronic-grade glass fiber cloth and dried at 136°C for 3 minutes to obtain a prepreg. Twelve prepregs were stacked together, and copper foil was covered on both the top and bottom sides. The prepregs were then placed in a vacuum press at 220°C and 400MPa for 120 minutes to form a circuit board.

[0094] The circuit boards prepared in all embodiments and comparative examples were subjected to performance tests. The test indicators and methods are as follows:

[0095] (1) Coefficient of thermal expansion - X / Y: Prepare an 8×8mm sample and measure XY-CTE according to IPC TM-6502.4.41 standard;

[0096] (2) Coefficient of thermal expansion - Z: Prepare an 8×8mm sample and measure Z-CTE according to IPC TM-6502.4.24c standard;

[0097] (2) Peel strength: The test method is carried out according to GB / T4722-2017 7.2.1 standard;

[0098] (3) Dielectric loss factor (Df): The test method is based on the IEC61189-2-721-2015 standard, and the test conditions are 10GHz.

[0099] The performance test results of the circuit boards prepared in all embodiments and comparative examples are shown in Table 2.

[0100] Table 2

[0101]

[0102] According to the test results in Table 1, the circuit board made from the resin composition provided by the present invention not only has low dielectric loss and XYZ-CTE, but also high peel strength, which is beneficial to ensuring the reliability of printed circuit board processing.

[0103] Comparing Examples 1 and 5, it can be seen that by controlling the molecular weight of the modified polyphenylene ether resin, it is beneficial to further improve the peel strength of the circuit board and reduce the coefficient of thermal expansion. Comparing Examples 1 and 6, it can be seen that by controlling the molecular weight of the thermosetting hydrocarbon resin, it is beneficial to further reduce steric hindrance, promote reaction, and improve peel strength. Compared with Example 1, Example 7 uses a single thermosetting hydrocarbon resin, and the circuit board obtained has a large number of microscopic voids, resulting in a decrease in peel strength. Compared with Example 1, Example 8 adds more soft and hard segment intercalation copolymers, resulting in poorer bonding between the circuit board and the metal, leading to a decrease in peel strength.

[0104] Comparative Example 1 uses a modified polyphenylene ether resin with no double bonds at the end groups, resulting in excessive dielectric loss; Comparative Example 2 uses a thermosetting hydrocarbon resin with excessively high dipole moments of reactive groups, resulting in a significant increase in dielectric loss of the circuit board; Comparative Example 3 uses a soft-hard segment intercalation copolymer with excessively short soft segment chain length, making it impossible to produce a usable finished product; Comparative Example 4 uses a soft-hard segment intercalation copolymer with excessively high maximum rotation angle of hard segment bond angle below 300°C, resulting in excessively large XYZ-CTE.

[0105] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0106] The embodiments described above are merely illustrative of several implementations of the present invention, and while the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the invention patent. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of the present invention, and these all fall within the protection scope of the present invention. Therefore, the protection scope of this invention patent should be determined by the appended claims.

Claims

1. A resin composition, characterized by comprising: Including modified polyphenylene ether resins, thermosetting hydrocarbon resins, and soft and hard segment intercalation copolymers, wherein: The modified polyphenylene ether resin has end groups including double bond groups; The dipole moment of the reactive groups in the thermosetting hydrocarbon resin is ≤0.7; In the soft-hard segment intercalation copolymer, the main chain carbon number of any soft segment is 5-15, and the bond angle of the hard segment is ≤20° at a maximum rotation angle below 300°.

2. The resin composition according to claim 1, characterized in that, The soft segment branched in the soft-hard segment intercalation copolymer includes a first reactive group, and the dipole moment of the first reactive group is ≥1.

7.

3. The resin composition according to claim 2, characterized in that, The functional group equivalent of the first reactive group is 5000 g / mol-10000 g / mol.

4. The resin composition according to claim 1, characterized in that, The soft segment branched chain of the soft-hard segment intercalation copolymer includes a second reactive group, which satisfies at least one of the following conditions: (1) The dipole moment of the second reactive group is ≤0.7; (2) The functional group equivalent of the second reactive group is 300 g / mol-1000 g / mol; (3) The second reactive group is located at the end of the branch chain.

5. The resin composition according to claim 1, characterized in that, The hard segment of the soft-hard segment intercalation copolymer includes a cyclic structure and does not contain reactive groups.

6. The resin composition according to any one of claims 1-5, characterized in that, The mass ratio of the modified polyphenylene ether resin, the thermosetting hydrocarbon resin, and the soft-hard segment intercalation copolymer is (15-25):(5-25):(1-7).

7. The resin composition according to any one of claims 1-5, characterized in that, The resin composition further includes at least one of filler, accelerator, flame retardant, solvent, silane coupling agent, polymerization inhibitor, and catalyst.

8. A semi-cured sheet made using the resin composition as described in any one of claims 1-7.

9. A circuit board made using the prepreg as described in claim 8.

10. A printed circuit board made using the circuit board as described in claim 9.

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