Adsorption refrigeration device and server liquid cooling system

Abstract

This invention discloses an adsorption refrigeration device, comprising: an adsorption bed, wherein the adsorption chamber of the adsorption bed is provided with an adsorbent to exchange heat with a heat exchange channel; a heat source supply port for supplying heat source fluid to the heat exchange channel; an evaporator, wherein the evaporation chamber of the evaporator is used to supply gaseous adsorbent to the adsorption chamber, and is also provided with a cryogenic fluid channel capable of exchanging heat with the liquid adsorbent in the evaporation chamber; a cryogenic fluid supply port for supplying fluid to the cryogenic fluid supply port; and a compression refrigeration system, including a heating channel for absorbing heat from the refrigerant after compression by the compressor and a heat release channel for releasing heat from the refrigerant after throttling, wherein the outlet of the heating channel is connected to the inlet of the heat exchange channel, and the outlet of the heat release channel is connected to the cryogenic fluid supply port. This adsorption refrigeration device can effectively solve the problem of poor integration between current compression refrigeration systems and adsorption refrigeration systems. This invention also discloses a server liquid cooling system including the above-mentioned adsorption refrigeration device.

Description

Technical Field

[0001] This invention relates to the field of liquid cooling technology, and more specifically, to an adsorption refrigeration device, and also to a server liquid cooling system including the above-mentioned adsorption refrigeration device. Background Technology

[0002] The adsorption refrigeration device mainly involves three structural components: an adsorption bed, a condenser, and an evaporator. Multiple adsorption beds can be set up in parallel and / or in series. The specific connection method of the adsorption refrigeration device can refer to the current regenerative cycle, thermal wave cycle, and multi-stage cycle, etc.

[0003] Generally, during the desorption stage of an adsorption bed, a heat source fluid is introduced into the adsorption bed to desorb the gaseous adsorbent. The condenser is used to remove the desorbed gaseous adsorbent from the adsorption bed and dissipate heat through the introduced cooling fluid, thus condensing it into a liquid adsorbent. Desorption is generally considered complete when the adsorption bed has fully desorbed the gaseous adsorbent.

[0004] Furthermore, a low-temperature cooling fluid can be introduced into the adsorption bed again to cool it down and allow it to enter the adsorption stage. At this time, the gaseous adsorbent in the chamber where the adsorbent is located is absorbed by the adsorbent, and the outlet of the evaporator's evaporation chamber is used to connect to the adsorption chamber of the adsorption bed so that the adsorbent in the evaporation chamber is continuously absorbed by the adsorbent. In this way, the evaporator can achieve evaporation and heat absorption.

[0005] In practical applications, the load that generates the heat source fluid is prone to temperature fluctuations, especially for low-temperature driven adsorption refrigeration devices. The temperature of the heat source fluid is prone to fluctuations, while the cooling requirements of the object being cooled by the evaporator may remain unchanged. In this case, the cooling requirements of the object being cooled are not easy to meet.

[0006] In the process of realizing this invention, the inventors discovered that the prior art has at least the following problems: the prior art also combines the use of compression refrigeration system and adsorption refrigeration device, but the combination is not good, so the problem of poor combination between compression refrigeration system and adsorption refrigeration device still exists. Summary of the Invention

[0007] In view of this, the first objective of the present invention is to provide an adsorption refrigeration device that can effectively solve the problem of poor integration between current compression refrigeration systems and adsorption refrigeration systems. The second objective of the present invention is to provide a server liquid cooling system including the above-mentioned adsorption refrigeration device.

[0008] To achieve the first objective mentioned above, the present invention provides the following technical solution:

[0009] An adsorption refrigeration device, comprising:

[0010] An adsorption bed, wherein the adsorption chamber of the adsorption bed is provided with an adsorbent to exchange heat with a heat exchange channel;

[0011] A heat source supply port is used to supply heat source fluid to the heat exchange channel;

[0012] An evaporator, wherein the evaporation chamber of the evaporator is used to supply gaseous adsorbent to the adsorption chamber, and a refrigeration fluid channel is provided that can exchange heat with the liquid adsorbent in the evaporation chamber;

[0013] A chilled fluid supply port, which is used to supply chilled fluid to the object requiring cooling;

[0014] A compression refrigeration system includes a heat exchange channel for absorbing heat from the refrigerant after compression by the compressor and a heat release channel for releasing heat from the refrigerant after throttling. The outlet of the heat exchange channel is connected to the inlet of the heat exchange channel, and the outlet of the heat release channel is connected to the refrigerant supply port.

[0015] In operation, the heat source supply port is connected to the outlet of the channel forming the heat source fluid, while the chilled fluid supply port is connected to the object requiring chilled fluid. Then, based on the cooling power requirements of the object being cooled or the requirements of the adsorption bed, the compression refrigeration system is activated or its power is adjusted. This allows the hot end of the compression refrigeration system to transfer heat to the adsorbent through the heating and heat exchange channels, thus making the heat available for use. Meanwhile, the cold end of the compression refrigeration system provides low-temperature fluid to the object being cooled through the heat release channel and the chilled fluid supply port, ensuring that both the evaporator and the heat release channel receive cooling. In this adsorption refrigeration device, the compression refrigeration system is embedded within the adsorption refrigeration system, providing a unified interface for easy external installation. Furthermore, it fully utilizes heat, significantly reducing power consumption compared to using a single compression refrigeration system. In conclusion, this adsorption refrigeration device effectively solves the problem of poor integration between current compression refrigeration and adsorption refrigeration systems.

[0016] In some technical solutions, the compression refrigeration system includes a compressor, a condensing heat exchanger, a throttling device, and an evaporating heat exchanger. The condensing heat exchanger includes a condensing-side refrigerant channel and a heating channel that exchange heat with each other. The evaporating heat exchanger includes an evaporating-side refrigerant channel and a heat-releasing channel that exchange heat with each other. The compressor, the condensing-side refrigerant channel, the throttling device, and the evaporating-side refrigerant channel are sequentially and cyclically connected.

[0017] In some technical solutions, an intermediate connecting channel and a first valve device are also included. The intermediate connecting channel and the heated channel are optionally connected to one end of the heat source supply port and the heat exchange channel through the first valve device.

[0018] In some technical solutions, a second valve device and a heat source outlet are also included, and the other end of the heat exchange channel is optionally connected to the inlet of the heated channel and the heat source outlet through the second valve device.

[0019] Some technical solutions also include a heating drive pump for driving the fluid flow in the heat exchange channel.

[0020] Some technical solutions include a condenser, a first cooling fluid interface, and a second cooling fluid interface;

[0021] The evaporation chamber of the evaporator can be optionally connected to the adsorption chambers corresponding to different adsorption beds in the plurality of adsorption beds through a first valve group;

[0022] The condenser's condensing chamber is optionally connected to the adsorption chambers corresponding to different adsorption beds in the plurality of adsorption beds through a second valve group. The condenser is also provided with a cooling channel for exchanging heat with the gaseous adsorption working fluid in the condensing chamber.

[0023] The first end of each heat exchange channel is optionally connected to the outlet of the first valve device via a first multi-way valve, and the second end of each heat exchange channel is optionally connected to the inlet of the second valve device via a second multi-way valve, so that heating fluid can be optionally introduced.

[0024] The first end of each heat exchange channel is optionally connected to the first cooling fluid interface via a third multi-way valve, and the second end of each heat exchange channel is optionally connected to the second cooling fluid interface via a fourth multi-way valve, so that cooling fluid can be optionally introduced.

[0025] In some technical solutions, a third valve device is also included. When the third valve device operates in a first operating state, the first cooling fluid interface, the cooling channel, the heat exchange channel, and the second cooling fluid interface are connected in series. When the third valve device operates in a second operating state, the heat exchange channel and the cooling channel are connected in parallel between the first cooling fluid interface and the second cooling fluid interface. When the third valve device operates in a third operating state, the first cooling fluid interface, the heat exchange channel, the cooling channel, and the second cooling fluid interface are connected in series.

[0026] Some technical solutions also include a chilled fluid return port, used to guide the chilled fluid to be entered into the adsorption bed into the inlet of the heat exchange channel;

[0027] The heat release channel is connected in series between the chilled fluid supply port and the outlet of the chilled fluid channel, or between the chilled fluid return port and the inlet of the chilled fluid channel.

[0028] In some technical solutions, a fourth valve device is also included, wherein the outlet of the chilled fluid channel is optionally connected to the heat release channel and the chilled fluid supply port through the fourth valve device; or, the inlet of the chilled fluid channel is optionally connected to the heat release channel and the chilled fluid return port through the fourth valve device.

[0029] Some technical solutions also include a refrigeration drive pump for driving the fluid flow in the refrigeration fluid channel and having an adjustable flow rate.

[0030] To achieve the second objective mentioned above, the present invention also provides a server liquid cooling system, which includes any of the aforementioned adsorption refrigeration systems, and further includes a cold tower and a server liquid cooling device. The cold tower supplies cooling water to the heat exchange channels of the adsorption bed and the cooling channels of the condenser in the adsorption refrigeration system; the server liquid cooling device provides heating fluid to the heat source supply port of the adsorption bed. Since the aforementioned adsorption refrigeration system has the above-mentioned technical effects, the server liquid cooling system having this adsorption refrigeration system should also have corresponding technical effects. Attached Figure Description

[0031] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0032] Figure 1 This is a schematic diagram of the adsorption refrigeration system provided in an embodiment of the present invention.

[0033] The following labels are shown in the attached diagram:

[0034] 1. Adsorption bed; 2. Heat source supply port; 3. Heat exchange channel; 4. First cooling fluid interface; 5. Heat source outlet; 6. Second cooling fluid interface; 7. Condenser; 8. Evaporator; 9. First valve group; 10. Second valve group; 11. Refrigeration fluid supply port; 12. First multi-way valve; 13. Second multi-way valve; 14. Third multi-way valve; 15. Fourth multi-way valve; 16. Cooling channel; 17. Compressor; 18. Condensing heat exchanger; 19. Throttling device; 20. Evaporating heat exchanger; 21. Intermediate connecting channel; 22. First valve device; 23. Second valve device; 24. Third valve device; 25. Heating drive pump; 26. Refrigeration drive pump; 27. Fourth valve device; 28. Refrigeration fluid return port.

[0035] First working state 241, second working state 242, third working state 243;

[0036] The refrigerant passage on the condensing side is 181, the heat-receiving passage is 182, the refrigerant passage on the evaporating side is 201, and the heat-releasing passage is 202. Detailed Implementation

[0037] This invention discloses an adsorption refrigeration device that can effectively solve the problem of poor integration between current compression refrigeration systems and adsorption refrigeration systems.

[0038] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0039] Please see Figure 1 , Figure 1 This is a schematic diagram of the adsorption refrigeration system provided in an embodiment of the present invention.

[0040] In some specific embodiments, this embodiment provides an adsorption refrigeration device, including an adsorption bed 1, a heat source supply port 2, an evaporator 8, a refrigerant supply port 11, and a compression refrigeration system.

[0041] The adsorption chamber of adsorption bed 1 is equipped with an adsorbent, and the working fluid used in conjunction with the adsorbent flows through the adsorption chamber and the condensation chamber of condenser 7, and also flows through evaporator 8. The working fluid and adsorbent are combined to form a working fluid pair. In an adsorption refrigeration system, multiple sets of working fluid pairs can be set. One adsorbent can correspond to multiple working fluids, or multiple adsorbents can correspond to one working fluid.

[0042] For adsorption bed 1, there are two main working states: adsorption and desorption, which are generally carried out in stages. In the adsorption state, a low-temperature fluid is used to cool adsorption bed 1, allowing the adsorbent within bed 1 to adsorb the gaseous working medium, ensuring continuous adsorption capacity until the adsorbent reaches a preset saturation state. Taking physical adsorption as an example, the gaseous working medium liquefies into a liquid state, maintaining a low-pressure state within the adsorption chamber to continuously draw in gaseous working medium, such as continuously adsorbing the gaseous working medium from evaporator 8, enabling continuous evaporation and heat absorption in evaporator 8. In the desorption state, a high-temperature fluid is generally used to heat adsorption bed 1, causing the working medium within the adsorbent to desorb from the adsorbent, reforming into a gaseous state. This gaseous working medium then enters condenser 7, where it liquefies into a liquid state. It should be noted that a heat exchange channel 3 can be provided to alternately circulate high-temperature fluid and low-temperature fluid; or a heat exchange channel 3 can be provided specifically for low-temperature fluid, while another channel can be provided specifically for high-temperature fluid; or only a heat exchange channel 3 can be provided for high-temperature fluid, and the adsorption stage of the adsorption bed 1 is not through high-temperature fluid, but through other heat-conducting structures, such as metal heat-conducting components, for heat dissipation.

[0043] The adsorption bed 1 has a heat exchange channel 3 for heat exchange with the adsorbent in the adsorption chamber. This heat exchange channel 3 is a channel capable of carrying at least a high-temperature fluid (heat source fluid) during the desorption phase of the adsorption bed 1. During the adsorption phase, the heat exchange channel 3 can be closed or used to carry a low-temperature fluid. The heat exchange channel 3 can exchange heat with the adsorbent, ensuring that during the desorption phase, a high-temperature fluid flows through it, keeping the entire adsorption chamber at a high temperature. After absorbing heat, the adsorbent desorbs a gaseous adsorbent, which absorbs heat from the high-temperature fluid in the heat exchange channel 3. This gaseous adsorbent can be discharged to the outside or into the condensation chamber of the condenser 7, where it is condensed back into a gaseous adsorbent.

[0044] The heat source supply port 2 is used to supply heat source fluid to the heat exchange channel 3. The heat source supply port 2 obtains the heating fluid, which is a heating fluid capable of obtaining heat from the heat source load. This heating fluid can be directly guided to the heat source load, or it can obtain heat after exchanging heat with the heat source load to form a heat source fluid. In this context, the method of heat transfer can refer to existing technologies. For example, whether obtaining or releasing heat, direct or indirect heat exchange can be selected. Indirect heat exchange is generally conducted through heat exchangers, such as plate heat exchangers or tubular heat exchangers. In this context, unless it is necessary to specify heat transfer, it is generally heat conduction, where a high-temperature heat source is transferred to a low-temperature heat source.

[0045] Evaporator 8 refers to the evaporator 8 of the adsorption bed 1 system. The evaporation chamber of evaporator 8 supplies gaseous adsorbent to the adsorption chamber. It also includes a chilled fluid channel capable of exchanging heat with the liquid adsorbent in the evaporation chamber. This chilled fluid channel can directly penetrate the evaporation chamber for direct heat exchange through the pipe wall, or it can utilize a heat exchange system. During operation, the chilled fluid introduced through the chilled fluid channel transfers heat to the liquid adsorbent in the evaporation chamber. The liquid adsorbent evaporates into a gaseous state, carrying away the heat. The gaseous adsorbent enters the adsorption chamber, releases heat, and is absorbed by the adsorbent within the chamber. This released heat is then absorbed and dissipated through a heat transfer conductor or fluid.

[0046] The chilled fluid supply port 11 is directly or indirectly connected to the outlet of the chilled fluid channel. The chilled fluid channel supplies fluid to the chilled fluid supply port 11, allowing the chilled fluid in the chilled fluid channel to release heat and cool down before being supplied to the chilled fluid supply port 11, thus transferring heat away. In use, the low-temperature fluid from the chilled fluid supply port 11 can flow directly into the object being cooled for direct heat exchange, or it can indirectly absorb heat from the object through a heat exchanger. The cooled fluid after heat absorption can be directly discharged, or it can flow back into the chilled fluid channel through the chilled fluid return port 28 to release heat again by adsorbing the working fluid in the evaporator 8.

[0047] The compression refrigeration system mainly includes a heat-receiving passage 182 and a heat-dissipating passage, and also needs to include a compressor 17, a throttling device 19, etc. The heat-receiving passage 182 is used to absorb heat from the fluid compressed by the compressor 17, thereby raising the internal temperature of the fluid. The heat-receiving passage 182 can be located outside the compressor 17 casing. The compressed refrigerant will heat up and transfer heat to the compressor 17 casing. Alternatively, the heat-receiving passage 182 can also obtain heat from the condenser of the compression refrigeration system. The high-temperature compressed refrigerant will enter the condenser, and the heat-receiving passage 182 can directly exchange heat with the refrigerant condensation passage in the condenser, or it can achieve indirect heat exchange through a heat exchanger.

[0048] The outlet of the heating channel 182 is connected to the inlet of the heat exchange channel 3 to supply high-temperature fluid to the heat exchange channel 3. The fluid at the inlet of the heating channel 182 can come directly from the outlet of the heat exchange channel 3, from the heat source supply port 2, or be obtained from an external source. Specifically, it can be configured as needed. Since both the heat source fluid supply port and the heating channel 182 can supply high-temperature fluid to the heat exchange channel 3, insufficient heat source fluid temperature is avoided.

[0049] The heat release channel is used to release heat to the refrigerant after throttling. The temperature of the refrigerant will decrease after throttling, thus enabling it to absorb heat. The heat release channel can directly exchange heat with the channel through which the throttled refrigerant flows, or it can indirectly release heat to the throttled refrigerant using a heat exchanger. Specifically, the heat release channel can be located at the evaporator 8 of the compression refrigeration system.

[0050] The outlet of the heat dissipation channel is connected to the refrigerant supply port 11 to supply low-temperature fluid. After entering the heat exchange channel 3, the fluid transfers heat to the throttled refrigerant, and after its temperature decreases, it is supplied to the refrigerant supply port 11 to absorb heat from the object being cooled. It should be noted that the fluid at the inlet of the heat dissipation channel can come directly from the outside or from the object being cooled, or it can come from the refrigerant channel.

[0051] In use, the heat source supply port 2 is connected to the outlet of the channel forming the heat source fluid, while the chilled fluid supply port 11 is connected to the object requiring chilled fluid. Then, according to the cooling power requirements of the object being cooled or the requirements of the adsorption bed 1, the compression refrigeration system is turned on or its power is adjusted so that the hot end of the compression refrigeration system can transfer heat to the adsorbent through the heating channel 182 and the heat exchange channel 3, thus making the heat from the hot end usable. Meanwhile, the cold end of the compression refrigeration system can provide low-temperature fluid to the object being cooled through the heat release channel and the chilled fluid supply port 11, allowing both the evaporator 8 and the heat release channel to obtain cooling capacity. In the above adsorption refrigeration device, the compression refrigeration system is embedded into the adsorption refrigeration system, obtaining a unified interface for easy external installation. Simultaneously, it fully utilizes heat, significantly saving power consumption compared to using a single compression refrigeration system. In summary, this adsorption refrigeration device effectively solves the problem of poor integration between current compression refrigeration and adsorption refrigeration systems.

[0052] In some embodiments, the compression refrigeration system may specifically include a compressor 17, a condenser heat exchanger 18, a throttling device 19, and an evaporator heat exchanger 20. The condenser heat exchanger 18 includes a condensing-side refrigerant passage 181 and a heated passage 182 that exchange heat with each other, while the evaporator heat exchanger 20 includes an evaporator-side refrigerant passage 201 and a heat-dissipating passage that exchange heat with each other. The compressor 17, the condensing-side refrigerant passage 181, the throttling device 19, and the evaporator-side refrigerant passage 201 are sequentially and cyclically connected.

[0053] When in use, the refrigerant, after being compressed by compressor 17, forms a hot fluid. This hot fluid exchanges heat with the heated channel 182 in the condensing-side refrigerant channel 181, thus raising the temperature of the fluid in the heated channel 182. Generally, the temperature of the compressed hot fluid needs to be higher than the set heating fluid temperature of the adsorbent in the adsorption bed 1 to ensure that the heated channel 182 is effectively heated to meet the requirements of the adsorption bed 1. After releasing heat, the refrigerant in the refrigerant channel cools down. The cooled fluid is then throttled by the throttling device 19 to form a low-temperature fluid. This low-temperature fluid enters the evaporating-side refrigerant channel 201, where it absorbs heat from the heat release channel to achieve a temperature increase. After flowing out of the evaporating-side refrigerant channel 201, the refrigerant can re-enter compressor 17, be compressed by compressor 17, and then supplied to the condensing-side refrigerant channel 181. This cycle repeats continuously, and during the cycle, the refrigerant may undergo a gas-liquid phase transition. It should be noted that if the refrigerant temperature at the inlet of the throttling device 19 is too high, a portion of the refrigerant can be discharged from the throttling outlet to cool the inlet refrigerant and meet the throttling requirements. From a temperature perspective, to better meet usage requirements, the inlet temperature of the condensing-side refrigerant channel 181, the outlet temperature of the condensing-side refrigerant channel 181, the inlet temperature of the heat exchange channel 3, and the inlet temperature of the heat transfer channel 182 can be decreased sequentially; while the inlet temperature of the evaporating-side refrigerant channel 201, the outlet temperature of the evaporating-side refrigerant channel 201, the temperature of the chilled fluid supply port 11, and the inlet temperature of the heat release channel can be increased sequentially.

[0054] By using the above method, the number of heat exchange stages can be reduced, thereby improving heat transfer efficiency.

[0055] In some embodiments, considering that the temperature of the heat source fluid may be insufficient, lower than the fluid temperature required by the adsorption bed 1, but higher than the temperature at the outlet of the heat exchange channel 3, and therefore still has heat available for utilization, an intermediate connecting channel 21 and a first valve device 22 may be included, wherein the intermediate connecting channel 21 and the heated channel 182 are optionally connected to one end of the heat source supply port 2 and the heat exchange channel 3 via the first valve device 22.

[0056] Specifically, the first valve device 22 has at least two open states: In the first open state, the intermediate connecting channel 21 connects the heat source supply port 2 and one end of the heat exchange channel 3, so that the heat source fluid of the heat source supply port 2 can flow directly to the heat exchange channel 3 through the intermediate connecting channel 21. Generally, in this state, the heat source fluid of the heat source supply port 2 does not pass through the heating channel 182; In the second open state, the heating channel 182 connects the heat source supply port 2 and one end of the heat exchange channel 3, so that the heat source fluid of the heat source supply port 2 first passes through the heating channel 182 and then flows to the heat exchange channel 3. Generally, in this state, the heat source fluid of the heat source supply port 2 does not pass through the intermediate connecting channel 21.

[0057] This allows the first valve device 22 to operate in its first open state when the temperature of the heat source fluid at the heat source supply port 2 meets the fluid temperature required by the adsorption bed, at which point the compression refrigeration system can remain closed. However, when the temperature of the heat source fluid is lower than the fluid temperature required by the adsorption bed 1 but higher than the temperature at the outlet of the heat exchange channel 3, the first valve device 22 operates in its second open state. In this case, the heat source fluid entering through the heat source supply port 2 first passes through the heating channel 182 for further heating to meet or approach the fluid temperature required by the adsorption bed 1, before being supplied to the heat exchange channel 3 for heat exchange with the adsorbent. Through this method, the heating channel 182 can be fully utilized to supplement the heat source fluid entering through the heat source supply port 2.

[0058] In some embodiments, the heat load of the heat source may disappear and become unusable, but the object to be cooled still has a cooling requirement. Preferably, a second valve device 23 and a heat source outlet 5 are also included. The other end of the heat exchange channel 3 is optionally connected to the inlet of the heated channel 182 and the heat source outlet 5 through the second valve device 23. After the heat source fluid in the heat exchange channel 3 releases heat to the adsorbent, it will flow out from the other end of the heat exchange channel 3. The second valve device 23 can also have at least two open states: In the first open state, the heat source fluid flowing out of the heat exchange channel 3 of the adsorption bed 1 flows to the heat source outlet 5. After being discharged from the heat source outlet 5, it can obtain heat again from the heat source load, and after being heated, it returns to the heat source supply port 2. In the second open state, the heat source fluid flowing out of the heat exchange channel 3 flows directly to the heated channel 182. At this time, the compression refrigeration system is turned on, the heated channel 182 can be heated and then supplied to the heat exchange channel 3 again so that the adsorption bed 1 can desorb. At this time, the heat generated by the compressed refrigerant can be fully utilized for heat recovery to reduce the overall energy consumption.

[0059] In some embodiments, to facilitate fluid circulation, a heating drive pump 25 for driving fluid flow in the heat exchange channel 3 may also be included. In practical applications, when the temperature is insufficient, the heating drive pump 25 can be turned on to accelerate fluid flow and shorten the desorption time, thereby adjusting the desorption time.

[0060] In some embodiments, the system generally includes a condenser 7, in which the adsorbent flows through the condensation chamber of the condenser 7, the evaporation chamber of the evaporator 8, and the adsorption chamber of the adsorption bed 1 to form an adsorption refrigeration system.

[0061] Specifically, the evaporation chamber of the evaporator 8 can be selectively connected to the adsorption chambers corresponding to different adsorption beds 1 in multiple adsorption beds 1 through the first valve group 9. The evaporator 8 is also provided with a refrigeration fluid channel for heat exchange with the liquid adsorption working fluid in the evaporation chamber.

[0062] The condensing chamber of the condenser 7 is optionally connected to the adsorption chambers of different adsorption beds 1 in the plurality of adsorption beds 1 through the second valve group 10. The condenser 7 is also provided with a cooling channel 16 for heat exchange with the gaseous adsorption working fluid in the condensing chamber.

[0063] Generally, to achieve continuous refrigeration, multiple adsorption beds 1 are connected in parallel, with at least some adsorption beds 1 having staggered desorption and adsorption time periods. For a specific adsorption bed 1, when entering the adsorption stage, it needs to be connected to the evaporation chamber through the first valve group 9 and disconnected from the condensation chamber through the second valve group 10; conversely, when entering the desorption stage, it needs to be disconnected from the evaporation chamber through the first valve group 9 and connected to the condensation chamber through the second valve group 10. The first valve group 9 and the second valve group 10 can be reversing valves, multi-way valves, or valve groups formed by combining multiple on / off valves. Alternatively, the first valve group 9 and the second valve group 10 can be combined into a single reversing valve.

[0064] The condenser 7's condensing chamber receives the gaseous adsorbent discharged from the adsorption chamber of the adsorption bed 1. When the heat source fluid enters the adsorption bed 1, it desorbs the gaseous adsorbent, which then enters the condensing chamber and releases heat. This heat is released into the cooling channel 16 of the condenser 7 and carried out by the fluid in the cooling channel 16. After releasing heat, the gaseous adsorbent forms a liquid adsorbent, and the condenser 7 continues to receive the gaseous adsorbent discharged from the adsorption chamber.

[0065] In some embodiments, the first end of each heat exchange channel 3 is optionally connected to the outlet of the first valve device 22 via a first multi-way valve 12, and the second end of each heat exchange channel 3 is optionally connected to the inlet of the second valve device 23 via a second multi-way valve 13, so that heating fluid can be optionally introduced. That is, the first end of each heat exchange channel 3 is respectively connected to each outlet of the first multi-way valve 12, and the inlet of the first multi-way valve 12 is connected to the outlet of the first valve device 22, and the inlet of the first multi-way valve 12 can be optionally connected to any one of the outlets. The second end of each heat exchange channel 3 is respectively connected to each inlet of the second multi-way valve 13, and the outlet of the second multi-way valve 13 is connected to the inlet of the second valve device 23, and the outlet of the second multi-way valve 13 can be optionally connected to any one of the inlets.

[0066] In some embodiments, a first cooling fluid interface 4 and a second cooling fluid interface 6 may be further provided. Specifically, the first end of each heat exchange channel 3 may be optionally connected to the first cooling fluid interface 4 via a third multi-way valve 14, and the second end of each heat exchange channel 3 may be optionally connected to the second cooling fluid interface 6 via a fourth multi-way valve 15, so that cooling fluid can be optionally introduced. At this time, the cooling fluid used to cool the adsorbent in the adsorption stage and the heating fluid used to heat the adsorbent in the desorption stage can share the heat exchange channel 3, so that the heating fluid (heat source fluid) and cooling fluid alternately flow into the heat exchange channel 3.

[0067] The first cooling fluid interface 4 serves as the cooling fluid supply port, and the second cooling fluid interface 6 serves as the cooling fluid discharge port. The first end of each heat exchange channel 3 is connected to each outlet of the third multi-way valve 14, while the inlet of the third multi-way valve 14 is connected to the first cooling fluid interface 4, and the inlet of the third multi-way valve 14 can optionally be connected to any one of the outlets. The second end of each heat exchange channel 3 is connected to each inlet of the fourth multi-way valve 15, while the outlet of the fourth multi-way valve 15 is connected to the second cooling fluid interface 6, and the outlet of the fourth multi-way valve 15 can optionally be connected to any one of the inlets.

[0068] In some embodiments, the cooling fluid of the adsorption bed 1 and the cooling fluid of the condenser 7 can come from the same equipment or from different equipment. To facilitate the control of the adsorption efficiency of the adsorption bed 1 and the condensation efficiency of the condenser 7, a switching device can be provided to allow the heat exchange channel 3 in the adsorption bed 1 and the cooling channel 16 of the condenser 7 to switch between series and parallel operation during the adsorption stage. Specifically, a third valve device 24 can also be included as a switching device. When the third valve device 24 operates in the first operating state 241, the first cooling fluid interface 4, the cooling channel 16, the heat exchange channel 3, and the second cooling fluid interface 6 are connected in series. When the third valve device 24 operates in the second operating state 242, the heat exchange channel 3 and the cooling channel 16 are connected in parallel between the first cooling fluid interface 4 and the second cooling fluid interface 6. When the third valve device 24 operates in the third operating state 243, the first cooling fluid interface 4, the heat exchange channel 3, the cooling channel 16, and the second cooling fluid interface 6 are connected in series.

[0069] The third valve device 24 can be a three-position six-way directional valve. The three working positions of the three-position six-way directional valve correspond to the first working state 241, the second working state 242 and the third working state 243, respectively. The six ports of the three-position six-way directional valve are respectively connected to the first cooling fluid port 4, the second cooling fluid port 6, the inlet end of the cooling channel 16, the outlet end of the cooling channel 16, the inlet end of the third multi-way valve 14 and the outlet end of the fourth multi-way valve 15.

[0070] Of course, the valve device can also use combination valves, such as multiple on / off valves, multiple multi-way valves, or a combination of multi-way valves and on / off valves. However, for ease of control, it is preferred to use a directional valve here, because it needs to correspond to the six interfaces mentioned above: the first cooling fluid interface 4, the second cooling fluid interface 6, the inlet end of the cooling channel 16, the outlet end of the cooling channel 16, the inlet end of the third multi-way valve 14, and the outlet end of the fourth multi-way valve 15. Therefore, it is called a six-way valve. If only the first working state 241 and the second working state 242 exist, a two-position six-way directional valve can be used. A three-position six-way directional valve has three switching positions to correspond to the first working state 241, the second working state 242, and the third working state 243, respectively.

[0071] Specifically, the two-position six-way directional valve can form ports A through F. Port A connects to the first cooling fluid port 4, port B connects to the second cooling fluid port 6, port C connects to the inlet of the third multi-way valve 14, port D connects to the outlet of the fourth multi-way valve 15, port E connects to the inlet of the cooling channel 16 of the condenser 7, and port F connects to the outlet of the cooling channel 16 of the condenser 7. The inlet and outlet ends of the cooling channel 16 can be arbitrarily selected or chosen according to specific needs.

[0072] When the first section of the directional control valve core is in the working position, the directional control valve operates in the first working state 241. Due to the internal channel relationship of the first section, ports A and E are connected, ports F and C are connected, and ports D and B are connected, thus achieving a series connection with the bed at the rear. As the second section of the valve core moves to the working position, the directional control valve operates in the second working state 242. Due to the internal channel relationship of the second section, ports A, C, and E are all connected, while ports B, D, and F are all connected, thus achieving a parallel connection. When the directional control valve core moves to the working position so that the third section is in the working position, the valve core operates in the third working state 243. Due to the internal connection relationship of the third section, ports A and C are connected, ports D and E are connected, and ports F and B are connected, thus achieving a series connection with the bed at the front.

[0073] In some embodiments, considering that the refrigerant temperature after being throttled by the throttling device 19 is generally low, it is preferable that the heat release channel is connected in series between the refrigerant supply port 11 and the outlet of the refrigerant channel, thereby facilitating the adjustment of the outlet temperature of the refrigerant channel to extend the adsorption time in the same way, so as to avoid premature termination of adsorption and uncontrollable heat.

[0074] The specific explanation is as follows: During operation, when the temperature of the heat source fluid supplied through heat source supply port 2 is lower than the preset temperature, the compression refrigeration system is activated. The heat source fluid entering through heat source supply port 2 first enters the heating channel 182 for heating. Although the temperature of the heat source fluid increases after heating, it is still lower than the preset temperature. Because the temperature of the heat source fluid entering the heat exchange channel 3 is lower than the preset temperature, the desorption time of the adsorption bed 1 will be prolonged. This can be achieved by adjusting the adsorption time of the adsorption stage, such as by changing the flow cross-section between the evaporation chamber and the adsorption chamber of the adsorption stage, or by increasing the temperature of the cooling fluid in the adsorption bed 1 of the adsorption stage or reducing the flow rate, or by taking other measures. At this time, the adsorption time is prolonged, and the corresponding evaporator 8 cooling efficiency will decrease. The temperature of the chilled fluid flowing out of the chilled fluid channel will increase compared to before, and then it will be supplied to the heat release channel. At this time, the heat release channel will cool it again. Through gradual adjustment, the temperature of the chilled fluid flowing out of the heat release channel can meet the requirements of the object being cooled, and then it can be supplied through the chilled fluid supply port 11.

[0075] Furthermore, a fourth valve device 27 can be provided, through which the outlet of the refrigerant fluid channel can optionally be connected to the heat release channel and the refrigerant fluid supply port 11. Specifically, the fourth valve device 27 has at least two open states: In the first open state, the outlet of the refrigerant fluid channel is directly connected to the refrigerant fluid supply port 11 without passing through the heat release channel. At this time, the compression refrigeration system is closed, which can reduce flow resistance, especially when the compression refrigeration system is not turned on for a long time, which will significantly reduce the overall energy consumption; In the second open state, the outlet of the refrigerant fluid channel is directly connected to the heat release channel, and the refrigerant fluid needs to flow through the heat release channel to the refrigerant fluid supply port 11. At this time, the compression refrigeration system is turned on.

[0076] In other embodiments, the heat release channel 202 can be connected in series between the chilled fluid return port 28 and the inlet of the chilled fluid channel. Further, the inlet of the chilled fluid channel can be optionally connected to the heat release channel 202 and the chilled fluid return port 28 via a fourth valve device 27. Compared to the previous embodiment, this embodiment essentially swaps the relative positions of the chilled fluid supply port 11 and the chilled fluid return port 28. In this case, the chilled fluid first passes through the heat release channel and is cooled by the evaporator on the compressor side, then flows through the evaporator on the adsorption bed side for further cooling before being discharged. The fourth valve device 27 switches the flow so that the chilled fluid, after being cooled by the adsorption side, can optionally flow through the compressor side for further cooling or be directly discharged.

[0077] In some embodiments, the first valve device 22, the second valve device 23, and the fourth valve device 27 can all be three-way valves. For ease of control, some or all of the above valves or valve units are electrically controlled valves, so as to facilitate control by a controller. For example, the first valve device 22 to the fourth valve device 27, the first valve group 9, and the second valve group 10 are all electrically controlled valves.

[0078] In some embodiments, a refrigeration drive pump 26 may be further included to drive fluid flow in the refrigeration fluid channel with adjustable flow rate. In use, the adsorption time can be changed by adjusting the flow rate of the refrigeration drive pump 26. The flow-adjustable drive pump can be based on existing technology and can be adjusted by pump speed or by changing the valve orifice size.

[0079] In some embodiments, unless otherwise stated or contradicted, the adsorption refrigeration system comprises an adsorption working fluid circulation system consisting of an adsorption bed 1, a condenser 7, and an evaporator 8, which may specifically constitute a multi-stage circulation system, a return circulation system, a heat wave circulation system, or other circulation systems.

[0080] Based on the adsorption refrigeration system provided in the above embodiments, the present invention also provides a server liquid cooling system. This server liquid cooling system includes any one of the adsorption refrigeration systems described in the above embodiments, and further includes a cold tower and a server liquid cooling device. The cold tower supplies cooling water to the heat exchange channel 3 of the adsorption bed 11 and the cooling channel 16 of the condenser 7 of the adsorption refrigeration system. The server liquid cooling device provides heating fluid to the heat source supply port 2 of the adsorption bed 1. Since this server liquid cooling system uses the adsorption refrigeration system described in the above embodiments, the beneficial effects of this server liquid cooling system are explained in the above embodiments.

[0081] Specifically, in application, the supply port of the cold tower is connected to the cooling fluid supply interface of the adsorption refrigeration system, while the cooling fluid discharge interface can be connected to the heat exchange fluid inlet of the server liquid cooling equipment and / or to the return port of the cold tower. The heat exchange fluid outlet of the server liquid cooling equipment is connected to the heating fluid inlet, while the heating fluid outlet is connected to the heat exchange fluid inlet of the server liquid cooling equipment and / or to the return port of the cold tower.

[0082] Specifically, the cooling tower can be a water-cooled cooling tower, a wet-dry cooling tower, or a dry cooling tower.

[0083] The various embodiments in this specification are described in a progressive manner, with each embodiment focusing on the differences from other embodiments. The same or similar parts between the various embodiments can be referred to each other.

[0084] The above description of the disclosed embodiments enables those skilled in the art to make or use the invention. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the general principles defined herein may be implemented in other embodiments without departing from the spirit or scope of the invention. Therefore, the invention is not to be limited to the embodiments shown herein, but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.

Claims

1. An adsorption refrigeration device, characterized in that, include: Adsorption bed (1), wherein the adsorption chamber of the adsorption bed (1) is provided with an adsorbent so that it can exchange heat with the heat exchange channel (3); Heat source supply port (2) is used to supply heat source fluid to the heat exchange channel (3); Evaporator (8), the evaporation chamber of the evaporator (8) is used to supply gaseous adsorbent to the adsorption chamber, and is also provided with a refrigeration fluid channel that can exchange heat with the liquid adsorbent in the evaporation chamber; A chilled fluid supply port (11) is provided for supplying chilled fluid to the object requiring chilled fluid for cooling. The compression refrigeration system includes a heat-receiving passage (182) for absorbing heat from the refrigerant after compression by the compressor (17) and a heat-releasing passage (202) for releasing heat from the refrigerant after throttling. The outlet of the heat-receiving passage (182) is connected to the inlet of the heat exchange passage (3), and the outlet of the heat-releasing passage (202) is connected to the refrigeration fluid supply port (11).

2. The adsorption refrigeration device according to claim 1, characterized in that, The compression refrigeration system includes the compressor (17), the condenser heat exchanger (18), the throttling device (19), and the evaporator heat exchanger (20). The condenser heat exchanger (18) includes a condenser-side refrigerant passage (181) and a heat-receiving passage (182) that exchange heat with each other. The evaporator heat exchanger (20) includes an evaporator-side refrigerant passage (201) and a heat-dissipating passage (202) that exchange heat with each other. The compressor (17), the condenser-side refrigerant passage (181), the throttling device (19), and the evaporator-side refrigerant passage (201) are sequentially and cyclically connected.

3. The adsorption refrigeration device according to claim 1, characterized in that, It also includes an intermediate connecting channel (21) and a first valve device (22), wherein the intermediate connecting channel (21) and the heating channel (182) are optionally connected to one end of the heat source supply port (2) and the heat exchange channel (3) through the first valve device (22).

4. The adsorption refrigeration device according to claim 3, characterized in that, It also includes a second valve device (23) and a heat source outlet (5), and the other end of the heat exchange channel (3) is optionally connected to the inlet of the heat-receiving channel (182) and the heat source outlet (5) through the second valve device (23).

5. The adsorption refrigeration device according to claim 4, characterized in that, It also includes a heating drive pump (25) for driving the flow of fluid in the heat exchange channel (3).

6. The adsorption refrigeration device according to claim 4, characterized in that, Includes a condenser (7), a first cooling fluid interface (4), and a second cooling fluid interface (6); The evaporation chamber of the evaporator (8) can be optionally connected to the adsorption chambers corresponding to different adsorption beds (1) in the plurality of adsorption beds (1) through the first valve group (9); The condenser (7) has its condensation chamber connected to the adsorption chambers of different adsorption beds (1) in the plurality of adsorption beds (1) via the second valve group (10). The condenser (7) is also provided with a cooling channel (16) for exchanging heat with the gaseous adsorption working fluid in the condensation chamber. The first end of each heat exchange channel (3) is optionally connected to the outlet of the first valve device (22) via a first multi-way valve (12), and the second end of each heat exchange channel (3) is optionally connected to the inlet of the second valve device (23) via a second multi-way valve (13) so that heating fluid can be optionally introduced. The first end of each heat exchange channel (3) is optionally connected to the first cooling fluid interface (4) via a third multi-way valve (14), and the second end of each heat exchange channel (3) is optionally connected to the second cooling fluid interface (6) via a fourth multi-way valve (15) so that cooling fluid can be optionally introduced.

7. The adsorption refrigeration device according to claim 6, characterized in that, It also includes a third valve device (24). When the third valve device (24) is working in the first working state (241), the first cooling fluid interface (4), the cooling channel (16), the heat exchange channel (3), and the second cooling fluid interface (6) are connected in series. When the third valve device (24) is working in the second working state (242), the heat exchange channel (3) and the cooling channel (16) are connected in parallel between the first cooling fluid interface (4) and the second cooling fluid interface (6). When the third valve device (24) is working in the third working state (243), the first cooling fluid interface (4), the heat exchange channel (3), the cooling channel (16), and the second cooling fluid interface (6) are connected in series.

8. The adsorption refrigeration device according to any one of claims 1-7, characterized in that, It also includes a cryogenic fluid return port (28) for introducing the cryogenic fluid to be entered into the adsorption bed (1) into the inlet of the heat exchange channel (3); The heat release channel (202) is connected in series between the chilled fluid supply port (11) and the outlet of the chilled fluid channel, or between the chilled fluid return port (28) and the inlet of the chilled fluid channel.

9. The adsorption refrigeration device according to claim 8, characterized in that, It also includes a fourth valve device (27), the outlet of the chilled fluid channel being optionally connected to the heat release channel (202) and the chilled fluid supply port (11) via the fourth valve device (27); or, the inlet of the chilled fluid channel being optionally connected to the heat release channel (202) and the chilled fluid return port (28) via the fourth valve device (27).

10. The adsorption refrigeration device according to claim 9, characterized in that, It also includes a refrigeration drive pump (26) for driving fluid flow in the refrigeration fluid channel and having an adjustable flow rate.

11. A server liquid cooling system, further comprising a cooling tower and server liquid cooling equipment, characterized in that, The adsorption refrigeration device includes any one of claims 1-10, wherein the cold tower is capable of supplying cooling fluid to the heat exchange channel (3) of the adsorption bed (1) and the cooling channel (16) of the condenser (7) of the adsorption refrigeration device; and the server liquid cooling device is used to supply heating fluid to the heat source supply port (2) of the adsorption bed (1).

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