Laser inspection devices and methods, laser die-cutting equipment, storage media

Abstract

This application discloses a laser inspection device and method, a laser die-cutting equipment, and a storage medium, relating to the technical field of laser cutting. The laser inspection device includes: a laser receiving module, an image acquisition module, and a data processing module. The laser receiving module is positioned opposite the cutting station of the laser cutting device and receives the laser light passing through the cutting station to form a light spot. The workpiece to be cut is placed at the cutting station. The image acquisition module is located to one side of the laser receiving module and receives the light spot light from the laser receiving module to acquire a light spot image. The data processing module is wired and / or wirelessly connected to the image acquisition module and processes the image data transmitted by the image acquisition module to identify the light spot position. Thus, the laser inspection device can detect the laser cutting position in real time through the light spot position. This not only improves the detection accuracy of the laser cutting position but also enhances the independence and versatility of the laser inspection device, thereby reducing the operating cost.

Description

Technical Field

[0001] This application relates to the technical field of laser cutting, and in particular to a laser detection device and its detection method, laser die-cutting equipment, and storage medium. Background Technology

[0002] In industrial applications of laser die-cutting for lithium-ion battery electrodes, laser die-cutting equipment operates primarily at high speeds to meet the industry's demand for efficient production. However, current laser die-cutting equipment often lacks the ability to detect the cutting position. If the cut is off-center during high-speed cutting, it can lead to a large number of scrapped lithium-ion battery electrodes. Therefore, how to detect the cutting position of laser die-cutting equipment has become a major concern in the industry. Summary of the Invention

[0003] This application provides a laser detection device and method, a laser die-cutting device, and a storage medium, aiming to solve the problem that existing laser die-cutting devices cannot detect the cutting position.

[0004] To address the aforementioned problems, this application provides a laser detection device, comprising: a laser receiving module, an image acquisition module, and a data processing module; the laser receiving module is positioned opposite to the cutting station of the laser cutting device and is used to receive laser light passing through the cutting station to form a light spot; the cutting station is used to place the workpiece to be cut; the image acquisition module is located on one side of the laser receiving module and is used to receive the light spot light from the laser receiving module to acquire a light spot image; the data processing module is wired and / or wirelessly connected to the image acquisition module and is used to process the image data transmitted by the image acquisition module to identify the position of the light spot.

[0005] In the above scheme, a laser receiving module is set up opposite to the cutting station to receive the laser light passing through the cutting station and form a light spot. An image acquisition module collects the light spot light from the laser receiving module to form a light spot image. The data processing module can identify the position of the light spot based on the light spot image, so that the laser detection device can detect the laser cutting position on the workpiece in real time through the position of the light spot. This can not only improve the detection accuracy of the laser cutting position, but also improve the independence and versatility of the laser detection device, thereby reducing the cost of using the laser detection device.

[0006] In one embodiment, the laser detection device further includes a function execution module; the function execution module is electrically connected to the data processing module and the laser cutting device respectively, and is used to receive control signals transmitted by the data processing module to control the laser cutting device to turn off the light.

[0007] Therefore, by electrically connecting the function execution module to both the data processing module and the laser cutting device, when the data processing module detects a cutting anomaly and outputs a control signal to the function execution module, the laser cutting device can shut off its light under the control of the function execution module, thereby reducing production losses caused by the workpiece cutting anomaly. Simultaneously, because the function execution module is set up independently of the laser cutting device, the probability of interference from other electronic components of the laser cutting device is relatively low, which helps improve the reliability of the laser detection device's light-off function.

[0008] In one embodiment, the function execution module includes: a light-off switch and an audible and visual alarm; the light-off switch is electrically connected to the data processing module and the laser cutting device respectively, and is used to receive control signals transmitted by the data processing module to control the laser cutting device to turn off the light; the audible and visual alarm is electrically connected to the data processing module and is used to receive control signals transmitted by the data processing module to provide an audible and visual alarm.

[0009] Therefore, by setting independent shut-off switches electrically connected to both the data processing module and the laser cutting device, when the data processing module detects a cutting abnormality and outputs a control signal to the shut-off switch, the laser cutting device can shut off under the control of the shut-off switch, thereby reducing production losses caused by workpiece abnormalities. Simultaneously, by setting an audible and visual alarm electrically connected to the data processing module and using it to receive control signals transmitted from the data processing module, the laser detection device can not only control the laser cutting device to shut off but also provide audible and visual alarms.

[0010] In one embodiment, the light-off switch includes any one of an optocoupler, a relay, a solid-state switch, a MOSFET, and a laser enable switch.

[0011] Therefore, by setting the light-off switch to any one of hardware switches such as optocouplers, relays, solid-state switches, MOSFETs, and laser enable switches, it is helpful to improve the reliability, independence, and sensitivity of the light-off switch, thereby reducing the probability of the light-off switch malfunctioning or being accidentally triggered due to interference.

[0012] In one embodiment, the laser passing through the cutting station generates diffuse reflection on the laser receiving module and forms a light spot.

[0013] Therefore, by setting the laser receiving module to diffusely reflect the received laser, the laser receiving module can form a uniform and stable light spot, so that the image acquisition module can capture a clear light spot image.

[0014] In one embodiment, the laser receiving module includes any one of a diffuse reflection screen, a matte ceramic sheet, and a matte metal plate.

[0015] Therefore, by setting the laser receiving module to include any one of a diffuse reflection screen, a matte ceramic sheet, and a matte metal plate, the laser receiving module can diffusely reflect the received laser to form a uniform and stable light spot.

[0016] In one embodiment, the image acquisition module includes: a light-shielding shell and a camera; the camera is disposed inside the light-shielding shell, and the light-shielding shell has a light-transmitting area; the camera receives light from the light spot on the laser receiving module through the light-transmitting area to acquire a light spot image.

[0017] Therefore, by setting the camera inside a light-shielding shell with a light-transmitting area, and allowing the camera to receive light from the laser receiving module through the light-transmitting area, the light-shielding shell can reduce the ambient light entering the camera, thereby improving the imaging effect of the light spot image captured by the camera and thus improving the accuracy of the data processing module in recognizing the position of the light spot.

[0018] In one embodiment, the image acquisition module further includes an auxiliary light source; the auxiliary light source is disposed inside the light-shielding shell and located on the backlight side of the camera to illuminate and assist the camera in acquiring light spot images.

[0019] Therefore, by setting an auxiliary light source inside the light-shielding shell and placing the auxiliary light source on the backlight side of the camera, the auxiliary light source can illuminate and assist the camera in capturing light spot images, thereby reducing noise caused by insufficient brightness in the light spot images and improving the imaging effect of the camera.

[0020] In one embodiment, the camera has a 650nm±10nm filter for filtering ambient light.

[0021] Therefore, by setting the camera to have a 650nm±10nm filter, the filter can filter the ambient light entering the camera, thereby improving the imaging effect of the light spot image captured by the camera, and thus improving the accuracy of the data processing module in recognizing the position of the light spot.

[0022] This application also provides a laser die-cutting device, which includes a laser cutting device and the aforementioned laser detection device, wherein the laser detection device is electrically connected to the laser cutting device.

[0023] In the above scheme, the laser cutting device can use a laser detection device to detect the laser cutting position, so as to stop cutting when it encounters a cutting abnormality, thereby reducing the production loss caused by the cutting abnormality of the workpiece.

[0024] This application also provides a laser detection method for use in the aforementioned laser detection device. The laser detection method includes: acquiring a spot image and detecting the spot position; confirming that the detection result meets preset abnormal conditions; and outputting a light-off signal.

[0025] In the above scheme, by setting the laser detection device to output a light-off signal when the detection result meets the preset abnormal conditions, the laser detection device can control the laser cutting device to turn off the light when a cutting abnormality occurs, so as to reduce the production loss caused by the cutting abnormality of the workpiece.

[0026] In one embodiment, the preset abnormal conditions include: the spot offset distance is greater than or equal to 0.1 mm, the spot offset duration is greater than or equal to 1 ms, and the spot movement path is different from the preset path; when the detection result satisfies any one of the following: the spot offset distance is greater than or equal to 0.1 mm, the spot offset duration is greater than or equal to 1 ms, and the spot movement path is different from the preset path, the detection result is confirmed to meet the preset abnormal conditions.

[0027] Therefore, by setting preset abnormal conditions, including three different situations such as spot offset distance greater than or equal to 0.1mm, spot offset duration greater than or equal to 1ms, and spot movement path different from preset path, the laser detection device can have high abnormal detection sensitivity, so as to quickly identify when cutting abnormalities occur and control the laser cutting device to turn off the light.

[0028] This application also discloses a computer-readable storage medium storing program data, which, when executed by a processor, is used to implement the laser detection method described above.

[0029] In the above scheme, a computer-readable storage medium is set to store program data of the laser detection method. When the program data is executed by the processor, it is used to implement the laser detection method, so that the laser detection device with the storage medium can detect the laser cutting position. Attached Figure Description

[0030] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort, wherein: Figure 1 This is a schematic diagram of the structural composition of the laser die-cutting equipment disclosed in the embodiments of this application; Figure 2 yes Figure 1 A schematic diagram of the structural components of a laser cutting device; Figure 3 yes Figure 1 A schematic diagram of the structure of the laser detection device; Figure 4 This is a schematic flowchart of the laser detection method disclosed in the embodiments of this application; Figure 5 This is a flowchart illustrating the process of confirming that the test results meet preset abnormal conditions, as disclosed in the embodiments of this application. Figure 6 This is a schematic diagram of a framework of an embodiment of the computer-readable storage medium provided in this application.

[0031] The attached figures are labeled as follows: Laser die-cutting equipment 10, workpiece 20, laser cutting device 100, cutting station 101, laser generator 110, optical path adjuster 120, laser output head 130, laser detection device 200, laser receiving module 210, image acquisition module 220, light-shielding shell 221, light-transmitting area 2211, camera 222, auxiliary light source 223, data processing module 230, function execution module 240, light-off switch 241, audible and visual alarm 242, computer-readable storage medium 900, program data 910. Detailed Implementation

[0032] It should be noted that, unless otherwise specified, the embodiments and technical features in the embodiments of this application can be combined with each other, and the detailed descriptions in the specific implementation should be understood as explanations of the purpose of this application and should not be regarded as undue limitations on this application.

[0033] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application pertains; the terminology used herein is for the purpose of describing particular embodiments only and is not intended to limit the application; the terms “comprising” and “having” and any variations thereof are intended to cover non-exclusive inclusion.

[0034] In the description of the embodiments of this application, the technical terms "first", "second", "third", etc. are used only to distinguish different objects and should not be construed as indicating or implying relative importance or implicitly indicating the number, specific order or primary and secondary relationship of the indicated technical features.

[0035] In this document, the term "embodiment" means that a particular feature, structure, or characteristic described in connection with an embodiment may be included in at least one embodiment of this application. The appearance of this phrase in various places throughout the specification does not necessarily refer to the same embodiment, nor is it a separate or alternative embodiment mutually exclusive with other embodiments. It will be explicitly and implicitly understood by those skilled in the art that the embodiments described herein can be combined with other embodiments.

[0036] In the description of the embodiments of this application, unless otherwise expressly specified and limited, the technical terms such as "connected," "linked," and "fixed" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. For those skilled in the art, the specific meaning of the above terms in the embodiments of this application can be understood according to the specific circumstances.

[0037] To detect the laser cutting position, some technical solutions involve placing a camera above the cutting station to capture images of the workpiece during laser cutting, thereby detecting the laser cutting position. However, due to the need to avoid the laser cutting device, the available placement of the camera is often limited, and the image capture of the workpiece cannot be very accurate. Furthermore, the smoke and high-intensity flame generated during laser cutting also affect the camera's imaging performance, ultimately resulting in poor accuracy in identifying the cutting position and failing to meet the position detection requirements of high-speed cutting.

[0038] To improve camera imaging, some technical solutions incorporate a lens in the laser cutting device. This lens has one transparent side and the opposite side has a mirror-like surface, allowing the laser to pass through the lens and cut the workpiece. Light reflected from the workpiece to the lens is then reflected back to the camera, enabling the capture of a forward-facing image of the workpiece and detection of the cutting position. However, since the lens is typically integrated into the laser cutting device, this solution is not applicable to laser cutting devices without lenses, lacking versatility. Furthermore, the presence of the lens weakens the laser intensity and increases the operating cost of the laser cutting device.

[0039] To address the aforementioned technical problems, this application discloses a laser inspection device. A laser receiving module is positioned opposite the cutting station to receive laser light passing through the cutting station, forming a light spot. An image acquisition module collects the light from the light spot on the laser receiving module to form a light spot image. A data processing module can identify the light spot position based on the image, enabling the laser inspection device to detect the laser cutting position on the workpiece in real time. This not only improves the detection accuracy of the laser cutting position but also enhances the independence and versatility of the laser inspection device, thereby reducing its operating cost.

[0040] Please see Figures 1 to 3 , Figure 1 This is a schematic diagram of the structural composition of the laser die-cutting equipment disclosed in the embodiments of this application. Figure 2 yes Figure 1 A schematic diagram of the structure of a laser cutting device. Figure 3 yes Figure 1A schematic diagram of the structure of a laser detection device.

[0041] The laser die-cutting equipment 10 disclosed in this application can be used to cut a workpiece 20 into a predetermined shape. The following example illustrates this using a battery electrode as an example. Figures 1 to 3 As shown, the laser die-cutting equipment 10 includes a laser cutting device 100 and a laser detection device 200 electrically connected to the laser cutting device 100. The laser cutting device 100 has a cutting station 101 for placing a workpiece 20 and is capable of emitting a laser beam to the cutting station 101 to cut the workpiece 20 on the cutting station 101. The laser detection device 200 can be located below the cutting station 101 and is capable of receiving the laser beam passing through the cutting station 101 to detect the cutting position of the laser beam on the workpiece 20.

[0042] like Figure 2 As shown, in order to emit laser light to cut the workpiece 20, the laser cutting device 100 may include: a laser generator 110, an optical path adjuster 120, and a laser output head 130 connected in sequence. The laser generator 110 is connected to an external power supply and is used to generate laser light. The optical path adjuster 120 is mainly used to receive the laser light generated by the laser generator 110 and adjust the propagation path of the laser light to a preset path. The laser output head 130 is used in conjunction with the optical path adjuster 120 to emit the laser light adjusted by the optical path adjuster 120 to the cutting station 101, so that the laser light can complete the cutting of the workpiece 20 according to a predetermined trajectory.

[0043] To adjust the laser propagation path, the optical path adjuster 120 may include optical units such as galvanometers and field lenses, and driving units such as motors to drive the galvanometers to deflect. This allows the optical path adjuster 120 to adjust the laser propagation path using galvanometer deflection, enabling efficient and precise cutting of the workpiece 20 within a small area, thus meeting the cutting requirements of the workpiece 20. Simultaneously, if the workpiece 20 requires cutting over a large area, the laser die-cutting equipment 10 may also include a driving device capable of driving the laser cutting device 100 to move along the X and Y axes to perform large-area cutting of the workpiece 20. Of course, the optical path adjuster 120 and the driving device can work together to adjust the laser cutting trajectory.

[0044] In this embodiment, the laser cutting device 100 can operate at a wide speed range of 10m / min to 120m / min, with core operating conditions mainly concentrated in high-speed ranges such as 50m / min, 80m / min, and 100m / min, to meet the high-efficiency production requirements of the workpiece 20. It is understood that the laser cutting device 100 described above is merely illustrative, and the specific design of the laser cutting device 100 can be adjusted according to the actual cutting requirements of the workpiece 20. This embodiment does not list all such adjustments here.

[0045] like Figure 2 As shown, in order to detect the laser cutting position, the laser detection device 200 is positioned opposite the cutting station 101 and below it, that is, on the side of the cutting station 101 furthest from the laser output head 130. This allows the laser detection device 200 to receive the laser light passing through the cutting station 101 and detect the laser cutting position in real time. Specifically, during cutting, the laser penetrates the workpiece 20 and passes through the cutting station 101 before reaching the laser detection device 200, enabling the laser detection device 200 to simultaneously detect the laser cutting position. Of course, even without the workpiece 20, the laser can be directly directed at the laser detection device 200 to detect its static position.

[0046] The laser detection device 200 is also electrically connected to the laser cutting device 100, enabling the laser detection device 200 to output control signals to the laser cutting device 100. This allows the laser cutting device 100 to be forcibly stopped when a cutting abnormality is detected, thereby reducing production losses to the workpiece 20 caused by the abnormality. For example, the laser detection device 200 is compatible with common wiring architectures of the laser cutting device 100, such as NPN PLC inputs, common neutral wires, and multi-coil solenoid valves. This not only enables electrical connection between the laser detection device 200 and the laser cutting device 100 but also improves the versatility of the laser detection device 200. Of course, in addition to electrical connection via wiring, the laser detection device 200 can also establish a wireless connection with the laser cutting device 100 to transmit control signals wirelessly.

[0047] To quickly and reliably stop the laser cutting device 100 from cutting, the control signal output by the laser detection device 200 can be used to cut off the laser power supply. That is, when the laser detection device 200 detects a cutting abnormality such as laser deviation, the control signal output by the laser detection device 200 can be transmitted to the laser board of the laser cutting device 100 to cut off the laser power supply and shut down the laser. Compared to the solution of relying on the main control system of the laser cutting device 100 for soft control to shut down the laser, forcibly controlling the laser board to cut off the power supply to shut down the laser has the advantages of lower probability of interference from other electronic components, lower failure rate, and faster response speed. This helps to achieve rapid and reliable shutdown of the laser cutting device 100, thereby reducing production losses caused by cutting abnormalities in the workpiece 20.

[0048] In the above scheme, the laser cutting device 100 can use the laser detection device 200 to detect the laser cutting position, so as to stop cutting when a cutting abnormality occurs, thereby reducing the production loss of the workpiece 20 caused by the cutting abnormality. At the same time, the laser detection device 200 can also be set with multiple detection modes such as power-on detection, real-time detection, timed detection, and standby detection to meet the different detection needs of the laser cutting device 100. Among them, standby detection refers to detecting the stationary position of the laser when the laser is in a stationary state without cutting, so as to confirm whether the cutting position of the laser is in the predetermined position in the standby state.

[0049] like Figure 3 As shown, to detect the cutting position of the laser, the laser detection device 200 may include a laser receiving module 210, an image acquisition module 220, and a data processing module 230. The laser receiving module 210 is positioned opposite the cutting station 101 of the laser cutting device 100 and is used to receive the laser light passing through the cutting station 101 to form a laser spot. The cutting station 101 is used to place the workpiece 20 to be cut. The image acquisition module 220 is located to one side of the laser receiving module 210 and is used to receive the laser spot light from the laser receiving module 210 to acquire a laser spot image. The data processing module 230 is wired and / or wirelessly connected to the image acquisition module 220 and is used to process the image data transmitted by the image acquisition module 220 to identify the laser spot position.

[0050] The laser receiving module 210 is positioned opposite the cutting station 101 and below it, that is, on the side of the cutting station 101 furthest from the laser cutting device 100. This allows the laser receiving module 210 to receive the laser light passing through the cutting station 101 and form a corresponding light spot on its outer surface. Specifically, when the laser is stationary, the laser receiving module 210 can form a static light spot to detect the laser's cutting position. When the laser is cutting, the laser receiving module 210 can form a dynamic light spot to detect the laser's cutting trajectory.

[0051] To facilitate the acquisition of spot images by the image acquisition module 220, the laser receiving module 210 can form spot images on both its facing and opposing sides of the cutting station 101. This allows the image acquisition module 220 to select appropriate positions for spot image acquisition as needed, improving the layout flexibility of the image acquisition module 220. Simultaneously, to improve the matching degree between the spot and the laser, the opposing sides of the laser receiving module 210 facing and opposing the cutting station 101 are parallel to the cutting surface of the workpiece 20. This helps reduce the displacement deviation between the spot and the laser, thereby improving the recognition accuracy and reliability of the laser cutting trajectory.

[0052] The image acquisition module 220 is located on one side of the laser receiving module 210 and can receive the light spot rays from the laser receiving module 210 to acquire a light spot image. For example, the image acquisition module 220 can be located on the side of the laser receiving module 210 away from the cutting station 101 and can receive the light spot rays from the side of the laser receiving module 210 away from the cutting station 101 to acquire a light spot image of the laser receiving module 210 from the front via a back-shot method. This helps to improve the imaging effect of the light spot image, thereby improving the accuracy of light spot position recognition. Of course, the image acquisition module 220 can also be deployed on other sides of the laser receiving module 210 and acquire light spot images via front-shot, side-shot, or oblique-shot methods to improve the layout flexibility of the image acquisition module 220, thereby meeting the needs of different installation spaces. This also helps to improve the versatility of the laser detection device 200.

[0053] The data processing module 230 is connected to the image acquisition module 220 via wired and / or wireless means, and is used to process the image data transmitted by the image acquisition module 220 to confirm the actual cutting position of the laser by identifying the position of the laser spot, thereby determining whether there is a cutting abnormality. Meanwhile, the data processing module 230 can adopt an ARM+FPGA hardware architecture, or it can adopt an ARM, DSP, MCU, dedicated ASIC, or other architectures to improve the data processing performance of the data processing module 230. In this embodiment, the data processing module 230 adopts an ARM+FPGA hardware architecture.

[0054] The data processing module 230 can incorporate algorithms for calculating the center of gravity of the laser beam, offset filtering, determining abnormal holding time, and judging the integrity of the laser beam trajectory. These algorithms are used to identify the position and movement trajectory of the laser beam, thereby determining whether there are any cutting abnormalities. Simultaneously, the data processing module 230 can also store fault data and trace historical records, recording the time, type, and parameters of each fault. This allows staff to retrieve historical fault records for analysis and optimization.

[0055] For example, when the data processing module 230 receives the spot image transmitted by the image acquisition module 220, the data processing module 230 can sequentially perform preprocessing operations such as dark level correction, bad pixel removal, adaptive binarization, and morphological filtering on the spot image. Then, it uses a spot centroid calculation algorithm to determine the center coordinates of the spot to calculate the spot offset, drift rate, and abnormal holding time, thereby determining whether there is a cutting abnormality. At the same time, the data processing module 230 can also confirm the movement trajectory of the spot through a cutting trajectory integrity judgment algorithm to determine whether there are cutting abnormalities such as off-center cutting, missing parts, or distortion in the workpiece 20. Among them, the spot center positioning algorithm supports any one of the following: gray-scale centroid method, least squares method, circle fitting, ellipse fitting, and edge center method, to reduce the positioning error of the spot center to below 0.05mm.

[0056] The data processing module 230 is also electrically connected to the laser cutting device 100. When the data processing module 230 detects a cutting abnormality, it immediately sends a control signal to the laser cutting device 100 and controls the laser board to cut off the laser power supply to stop cutting the workpiece 20, thereby reducing production losses caused by the cutting abnormality. Simultaneously, while sending the control signal to the laser cutting device 100 to turn off the laser, the data processing module 230 can also record the fault data of this cutting abnormality for later analysis and optimization by staff.

[0057] In the above scheme, by setting the laser receiving module 210 to be opposite to the cutting station 101 and to receive the laser light passing through the cutting station 101 to form a light spot, and the image acquisition module 220 to receive the light spot light on the laser receiving module 210 to acquire the light spot image, and the data processing module 230 to identify the light spot position according to the light spot image, the laser detection device 200 can detect the laser cutting position on the workpiece in real time through the light spot position. This can not only improve the detection accuracy of the laser cutting position, but also improve the independence and versatility of the laser detection device 200, so as to reduce the use cost of the laser detection device 200.

[0058] To improve the imaging effect of the image acquisition module 220, the laser receiving module 210 can also diffusely reflect the received laser light, enabling it to form a uniform and stable light spot. This reduces imaging distortion caused by the high reflectivity of the laser receiving module 210, thereby improving the accuracy of the light spot image acquisition. Specifically, when the laser shines on the side of the laser receiving module 210 facing the cutting station 101, some of the light rays undergo diffuse reflection on that side, forming a uniform and stable light spot. Simultaneously, some light rays can also pass through the laser receiving module 210 and undergo diffuse reflection on the opposite side, away from the cutting station 101, forming a uniform and stable light spot.

[0059] To enable diffuse reflection of the received laser light, the laser receiving module 210 includes any one of a diffuse reflection screen, a matte ceramic sheet, and a matte metal plate. For example, when the laser receiving module 210 includes a diffuse reflection screen, the screen can specifically be a 40mm × 40mm high-temperature resistant frosted quartz screen, allowing the laser receiving module 210 to diffusely reflect the received laser light, forming a uniform and stable light spot, thus facilitating the image acquisition module 220 to acquire a clear and realistic light spot image. Of course, the size of the diffuse reflection screen can also be adjusted according to requirements.

[0060] To improve the imaging effect of the image acquisition module 220, the image acquisition module 220 includes a light-shielding shell 221 and a camera 222. The camera 222 is located inside the light-shielding shell 221, and the light-shielding shell 221 has a light-transmitting area 2211. The camera receives the light spot light from the laser receiving module 210 through the light-transmitting area 2211 to acquire the light spot image.

[0061] The light-shielding shell 221 can be located on one side of the laser receiving module 210, such as on the side of the laser receiving module 210 facing away from the cutting station 101. The light-shielding shell 221 can be used to create a closed or semi-closed optical environment to reduce the impact of ambient light on the imaging of the camera 222. The light-shielding shell 221 can be any of the following: a closed or semi-closed light-shielding cover, an optical dark box, or a light-shielding tube. Simultaneously, the side of the light-shielding shell 221 facing the laser receiving module 210 can be partially transparent or have openings to form the aforementioned light-transmitting area 2211 for transmitting light, allowing the light spot on the laser receiving module 210 to enter the light-shielding shell 221.

[0062] The camera 222 is housed within the light-shielding shell 221 and is capable of receiving light spots incident within the shell 221 to capture light spot images. The camera 222 can be a CCD / CMOS camera with a resolution of 1280×800, a pixel size of 3.0μm×3.0μm, a continuously adjustable frame rate of 120fps to 240fps, a global shutter mode, a spectral response of 400nm to 1100nm, a dynamic range ≥60dB, and an output interface of LVDS / USB3.0. The camera 222 can also be equipped with a fixed-focus lens with an aperture of F1.4 to F4.0, a working distance of 50mm to 150mm, and a focal length of 8mm / 16mm.

[0063] In this embodiment, the camera 222 can specifically be a 1.3-megapixel CMOS camera with a global shutter and a frame rate of ≥120fps, used with an 8mm fixed-focus lens. Of course, the specific specifications of the camera 222 can also be adjusted according to requirements, which will not be listed in detail in this embodiment.

[0064] In the above scheme, by setting the camera 222 inside the light-shielding shell 221 with a light-transmitting area 2211, and the camera 222 being able to receive the light spot light from the laser receiving module 210 through the light-transmitting area 2211, the light-shielding shell 221 can reduce the ambient light entering the camera 222, thereby improving the imaging effect of the light spot image collected by the camera 222, and thus improving the accuracy of the data processing module 230 in recognizing the position of the light spot.

[0065] To improve the imaging effect of the camera 222, the image acquisition module 220 may further include an auxiliary light source 223. The auxiliary light source 223 is located inside the light-shielding shell 221 and on the backlight side of the camera 222 to illuminate and assist the camera 222 in acquiring light spot images.

[0066] The auxiliary light source 223 can be located on the backlight side of the camera 222, that is, on the side of the camera 222 away from the light-transmitting area 2211. The auxiliary light source 223 can emit light with a wavelength of 630nm to illuminate and assist the camera 222 in capturing the light spot image. At the same time, the auxiliary light source 223 can also be arranged in a ring, and the orthographic projection of the camera 222 in the optical axis direction can also be located within the ring space of the auxiliary light source 223, so that the light emitted by the auxiliary light source 223 can be evenly distributed around the camera 222.

[0067] In the above solution, by setting an auxiliary light source 223 inside the light-shielding shell 221 and placing the auxiliary light source 223 on the backlight side of the camera 222, the auxiliary light source 223 can illuminate and assist the camera 222 in acquiring light spot images, thereby reducing noise in the light spot images due to insufficient brightness and improving the imaging effect of the camera 222.

[0068] To reduce the impact of ambient light on the light spot image, the camera 222 can also have a 650nm±10nm filter, which allows the camera 222 to filter ambient light with a wavelength of 650nm±10nm, thereby improving the imaging effect of the light spot image acquired by the camera 222 and thus improving the accuracy of the data processing module 230 in recognizing the position of the light spot.

[0069] To improve the reliability of the data processing module 230 in controlling the laser cutting device 100 to turn off the laser, the laser detection device 200 may further include a function execution module 240. The function execution module 240 is electrically connected to both the data processing module 230 and the laser cutting device 100, and is used to receive control signals transmitted by the data processing module 230 to control the laser cutting device 100 to turn off the laser.

[0070] The function execution module 240 is electrically connected to the data processing module 230 and can also be electrically connected to the laser cutting device 100 via the aforementioned common wiring architecture. When the data processing module 230 detects a cutting abnormality, it can send a control signal to the function execution module 240. The function execution module 240 can then transmit a signal to the laser board of the laser cutting device 100 and control the laser board to cut off the laser power supply, thus shutting down the laser cutting device 100. Simultaneously, when the function execution module 240 controls the laser cutting device 100 to shut down, it can also simultaneously issue an audible and visual alarm to alert personnel to investigate the cutting abnormality.

[0071] In the above scheme, by electrically connecting the function execution module 240 to both the data processing module 230 and the laser cutting device 100, when the data processing module 230 detects a cutting abnormality and outputs a control signal to the function execution module 240, the laser cutting device 100 can shut down under the control of the function execution module 240, thereby reducing production losses caused by the cutting abnormality of the workpiece 20. Simultaneously, since the function execution module 240 is set independently of the laser cutting device 100, the probability of interference from other electronic components of the laser cutting device 100 is relatively low, which helps improve the reliability of the laser detection device 200 in shutting down.

[0072] To implement the light-off and alarm functions, the function execution module 240 includes a light-off switch 241 and an audible and visual alarm 242. The light-off switch 241 is electrically connected to both the data processing module 230 and the laser cutting device 100, and is used to receive control signals transmitted from the data processing module 230 to control the laser cutting device 100 to turn off the light. The audible and visual alarm 242 is electrically connected to the data processing module 230 and is used to receive control signals transmitted from the data processing module 230 to provide an audible and visual alarm.

[0073] Both the light-off switch 241 and the audible and visual alarm 242 are electrically connected to the data processing module 230. The light-off switch 241 can also be electrically connected to the laser cutting device 100 via the aforementioned common wiring configuration. When the data processing module 230 detects a cutting abnormality, it sends a control signal to the light-off switch 241. The light-off switch 241 then transmits a signal to the laser board of the laser cutting device 100, controlling the laser board to cut off the laser power supply, thus turning off the laser cutting device 100. Simultaneously, the data processing module 230 can also send a control signal to the audible and visual alarm 242, causing the alarm to sound and alert personnel to investigate the cutting abnormality.

[0074] In the above technical solution, by setting independent light-off switches 241 and electrically connecting them to the data processing module 230 and the laser cutting device 100 respectively, when the data processing module 230 detects a cutting abnormality and outputs a control signal to the light-off switch 241, the laser cutting device 100 can turn off the laser under the control of the light-off switch 241, thereby reducing production losses caused by the workpiece 20 due to the cutting abnormality. Simultaneously, by setting an audible and visual alarm 242 and electrically connecting it to the data processing module 230 to receive the control signals transmitted by the data processing module 230, the laser detection device 200 can not only control the laser cutting device 100 to turn off the laser but also provide an audible and visual alarm.

[0075] To control the laser cutting device 100 to turn off the laser, the laser-off switch 241 includes any one of the following: an optocoupler, a relay, a solid-state switch, a MOSFET, and a laser enable switch, ensuring that the response time of the laser-off switch 241 is below 10ms. Using the aforementioned hardware switch not only ensures compatibility with the common wiring architecture of the laser cutting device 100, improving the versatility of the laser detection device 200, but also enhances the reliability, independence, and sensitivity of the laser-off switch 241, reducing the probability of malfunction or false triggering due to interference. In this embodiment, the laser-off switch 241 can specifically use an optocoupler for laser-off, and the response time can be controlled below 5ms.

[0076] Please see Figure 4 , Figure 4 This is a schematic flowchart of the laser detection method disclosed in the embodiments of this application, and the laser detection method is executed by the laser detection device 200 described above, and may include the following steps: S100: Acquire the light spot image and detect the position of the light spot.

[0077] S200, confirm that the test results meet the preset abnormal conditions.

[0078] S300 outputs a light-off signal.

[0079] Specifically, when the laser die-cutting equipment 10 is powered on, the laser generated by the laser cutting device 100 can pass through the cutting station 101 and be automatically projected onto the laser receiving module 210, which can then form a light spot corresponding to the laser. Simultaneously, the image acquisition module 220 can receive the light from the light spot on the laser receiving module 210 and continuously acquire static light spot images at a set frame rate. After processing by the analog front-end 12-bit ADC and CDS noise reduction circuit, the image data is transmitted to the data processing module 230 for further processing, and the image buffer latency can be controlled to below 8ms.

[0080] When the data processing module 230 receives the corresponding spot image data, it can sequentially perform preprocessing operations such as dark level correction, bad pixel removal, adaptive binarization, and morphological filtering on the spot image. Then, it uses a spot centroid calculation algorithm to determine the center coordinates of the spot and a spot trajectory integrity judgment algorithm to confirm the continuity of the spot's movement. It calculates the detection results such as spot offset, drift rate, abnormal holding time, spot movement trajectory, movement start point, and movement end point, thereby determining whether the detection results meet the preset abnormal conditions.

[0081] When the data processing module 230 detects a cutting abnormality, that is, when the detection result confirms that the preset abnormality conditions are met, the data processing module 230 can send control signals to the light-off switch 241 and the audible and visual alarm 242 respectively. This causes the light-off switch 241 to output a light-off signal to the laser cutting device 100 to turn off the laser, while the audible and visual alarm 242 simultaneously sounds an audible and visual alarm. At the same time, when the data processing module 230 sends the control signal to the laser cutting device 100 to turn off the laser, it can also simultaneously record the fault data of this cutting abnormality for subsequent analysis and optimization by the staff.

[0082] In the above scheme, by setting the laser detection device 200 to output a light-off signal when confirming that the detection result meets the preset abnormal conditions, the laser detection device 200 can control the laser cutting device 100 to turn off the light when a cutting abnormality occurs, so as to reduce the production loss of the workpiece 20 caused by the cutting abnormality.

[0083] Please see Figure 5 , Figure 5 This is a flowchart illustrating the process of confirming that the test results meet preset abnormal conditions, as disclosed in the embodiments of this application.

[0084] like Figure 5 As shown, the preset abnormal conditions may include: a spot offset distance greater than or equal to 0.1 mm, a spot offset duration greater than or equal to 1 ms, and a spot movement path different from a preset path. Specifically, when the detection result satisfies any one of the following conditions—a spot offset distance greater than or equal to 0.1 mm, a spot offset duration greater than or equal to 1 ms, or a spot movement path different from a preset path—then the detection result is confirmed to meet the preset abnormal conditions. This allows the data processing module 230 to immediately control the light-off switch 241 and the audible and visual alarm 242 to respectively turn off the light and trigger an audible and visual alarm.

[0085] That is, when the spot offset distance calculated by the data processing module 230 is greater than or equal to 0.1 mm, the detection result can be determined to meet the preset abnormality condition. When the spot offset duration calculated by the data processing module 230 is greater than or equal to 1 ms, the detection result can be determined to meet the preset abnormality condition. When the spot movement path detected by the data processing module 230 is different from the preset path, that is, when the spot movement trajectory, movement start point, and movement end point do not match any of the preset movement trajectory, movement start point, and movement end point, the detection result can be determined to meet the preset abnormality condition.

[0086] In the above scheme, by setting preset abnormal conditions including three different situations such as spot offset distance greater than or equal to 0.1mm, spot offset duration greater than or equal to 1ms, and spot movement path different from preset path, the laser detection device 200 can have high abnormal detection sensitivity, so as to quickly identify when cutting abnormality occurs and control the laser cutting device 100 to turn off the light.

[0087] Please see Figure 6 , Figure 6 This is a schematic diagram of a framework of an embodiment of the computer-readable storage medium provided in this application.

[0088] like Figure 6 As shown, this application also discloses a computer-readable storage medium 900, which stores program data 910. When executed by a processor, the program data 910 is used to implement the aforementioned laser detection method. Specifically, the computer-readable storage medium 900 can be a USB flash drive, a portable hard drive, a read-only memory (ROM), a random access memory (RAM), a magnetic disk, or an optical disk, or a medium capable of storing computer programs. Alternatively, it can be a server storing the computer program, which can send the stored computer program to other devices for execution or run the stored computer program itself.

[0089] Finally, in some specific application scenarios, to address the problem that existing laser die-cutting equipment cannot detect the cutting position, the laser die-cutting equipment 10 disclosed in this application includes: a laser cutting device 100, and a laser detection device 200 electrically connected to the laser cutting device 100. The laser cutting device 100 has a cutting station 101 for placing the workpiece 20, and is capable of emitting a laser beam to the cutting station 101 to cut the workpiece 20 on the cutting station 101. The laser detection device 200 can be located below the cutting station 101 and is capable of receiving the laser beam passing through the cutting station 101 to detect the cutting position of the laser beam on the workpiece 20.

[0090] The laser detection device 200 may include a laser receiving module 210, an image acquisition module 220, and a data processing module 230. The laser receiving module 210 is positioned opposite the cutting station 101 of the laser cutting device 100 and is used to receive the laser light passing through the cutting station 101 to form a light spot. The image acquisition module 220 is located to one side of the laser receiving module 210 and is used to receive the light from the light spot on the laser receiving module 210 to acquire a light spot image. The cutting station 101 is used to place the workpiece 20 to be cut. The data processing module 230 is wired and / or wirelessly connected to the image acquisition module 220 and is used to process the image data transmitted by the image acquisition module 220 to identify the position of the light spot.

[0091] The laser receiving module 210 includes any one of a diffuse reflection screen, a matte ceramic sheet, and a matte metal plate. The image acquisition module 220 includes a light-shielding shell 221 and a camera 222. The camera 222 is disposed within the light-shielding shell 221, and the light-shielding shell 221 has a light-transmitting area 2211. The camera receives light from the laser spot on the laser receiving module 210 through the light-transmitting area 2211 to acquire a light spot image. The image acquisition module 220 may also include an auxiliary light source 223. The auxiliary light source 223 is disposed within the light-shielding shell 221 and located on the backlight side of the camera 222 to illuminate and assist the camera 222 in acquiring the light spot image. The camera 222 may also have a 650nm±10nm filter.

[0092] The laser detection device 200 may further include a function execution module 240. The function execution module 240 is electrically connected to both the data processing module 230 and the laser cutting device 100, and is used to receive control signals transmitted by the data processing module 230 to control the laser cutting device 100 to turn off the laser. The function execution module 240 includes a light-off switch 241 and an audible and visual alarm 242. The light-off switch 241 is electrically connected to both the data processing module 230 and the laser cutting device 100, and is used to receive control signals transmitted by the data processing module 230 to control the laser cutting device 100 to turn off the laser. The audible and visual alarm 242 is electrically connected to the data processing module 230 and is used to receive control signals transmitted by the data processing module 230 to provide an audible and visual alarm. The light-off switch 241 includes any one of an optocoupler, a relay, a solid-state switch, a MOSFET, or a laser enable switch.

[0093] The laser detection device 200 disclosed in this application embodiment is configured with a laser receiving module 210 positioned opposite to the cutting station 101 to receive laser light passing through the cutting station 101 and forming a light spot. An image acquisition module 220 is used to receive the light spot from the laser receiving module 210 and acquire the light spot image. A data processing module 230 can identify the position of the light spot based on the light spot image. This allows the laser detection device 200 to detect the laser cutting position on the workpiece in real time by detecting the position of the light spot. This not only improves the detection accuracy of the laser cutting position but also enhances the independence and versatility of the laser detection device 200, thereby reducing the cost of using the laser detection device 200.

[0094] The above are merely embodiments of this application and do not limit the scope of this patent application. Any equivalent structural or procedural changes made using the content of this application's specification and drawings, or direct or indirect applications in other related technical fields, are similarly included within the scope of patent protection of this application.

Claims

1. A laser detection device, characterized by, The laser detection device includes: a laser receiving module, an image acquisition module, and a data processing module; The laser receiving module is positioned opposite the cutting station of the laser cutting device and is used to receive the laser light passing through the cutting station to form a light spot; the cutting station is used to place the workpiece to be cut. The image acquisition module is located on one side of the laser receiving module and is used to receive the light spot on the laser receiving module in order to acquire the light spot image; The data processing module is connected to the image acquisition module via wired and / or wireless means, and is used to process the image data transmitted by the image acquisition module to identify the location of the light spot.

2. The laser detection apparatus according to claim 1, characterized by The laser detection device further includes: a function execution module; The function execution module is electrically connected to the data processing module and the laser cutting device respectively, and is used to receive control signals transmitted by the data processing module to control the laser cutting device to turn off the light.

3. The laser detection apparatus according to claim 2, wherein The functional execution module includes: a light-off switch and an audible and visual alarm; The light-off switch is electrically connected to the data processing module and the laser cutting device respectively, and is used to receive the control signal transmitted by the data processing module to control the laser cutting device to turn off the light; the audible and visual alarm is electrically connected to the data processing module and is used to receive the control signal transmitted by the data processing module to provide an audible and visual alarm.

4. The laser detection apparatus according to claim 3, wherein The light-off switch includes any one of the following: optocoupler, relay, solid-state switch, MOSFET, and laser enable switch.

5. The laser detection apparatus according to claim 1, wherein The laser passing through the cutting station generates diffuse reflection on the laser receiving module and forms a light spot.

6. The laser detection device according to claim 5, characterized in that, The laser receiving module includes any one of the following: a diffuse reflection screen, a matte ceramic sheet, and a matte metal plate.

7. The laser detection device according to claim 1, characterized in that, The image acquisition module includes: a light-shielding shell and a camera; The camera is located inside the light-shielding shell, and the light-shielding shell has a light-transmitting area; the camera receives the light spot light from the laser receiving module through the light-transmitting area to collect the light spot image.

8. The laser detection device according to claim 7, characterized in that, The image acquisition module also includes: an auxiliary light source; The auxiliary light source is located inside the light-shielding shell and on the backlight side of the camera to illuminate and assist the camera in capturing light spot images.

9. The laser detection device according to claim 7, characterized in that, The camera has a 650nm±10nm filter for filtering ambient light.

10. A laser die-cutting device, characterized in that, The laser die-cutting equipment includes: a laser cutting device and a laser detection device as described in any one of claims 1-9, wherein the laser detection device is electrically connected to the laser cutting device.

11. A laser detection method, used in the laser detection apparatus according to any one of claims 1-9, characterized in that, The laser detection method includes: Acquire images of light spots and detect their positions; Confirm that the test results meet the preset abnormality conditions; Output a light-off signal.

12. The laser detection method according to claim 11, characterized in that, The preset abnormal conditions include: the spot offset distance is greater than or equal to 0.1 mm, the spot offset duration is greater than or equal to 1 ms, and the spot movement path is different from the preset path; When the detection result meets any one of the following conditions: the spot offset distance is greater than or equal to 0.1 mm, the spot offset duration is greater than or equal to 1 ms, and the spot movement path is different from the preset path, the detection result is confirmed to meet the preset abnormal condition.

13. A computer-readable storage medium, characterized in that, The computer-readable storage medium stores program data, which, when executed by a processor, is used to implement the laser detection method as described in any one of claims 11-12.

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