Circuit board reliability testing apparatus

Abstract

This application relates to the field of testing equipment technology, and in particular to a circuit board reliability testing device. A circuit board reliability testing device includes an environmental loading system, a testing system, and a data analysis system. The testing system includes a housing with a detection chamber inside; a testing stage disposed within the detection chamber for placing the workpiece to be tested; a temperature detection device disposed within the detection chamber and electrically connected to the data analysis system for detecting the temperature data of the workpiece and feeding it back to the data analysis system; a displacement detection device disposed within the detection chamber and electrically connected to the data analysis system for detecting the deformation data of the workpiece and feeding it back to the data analysis system; and a monitoring device located outside the detection chamber and electrically connected to the workpiece to be tested for monitoring the electrical signal data of the workpiece. This provides a circuit board reliability testing device that provides comprehensive and accurate test results.

Description

Technical Field

[0001] This application relates to the field of testing equipment technology, and in particular to a circuit board reliability testing device. Background Technology

[0002] With the development of emerging technologies such as 5G, IoT, cloud computing, and big data, higher requirements are being placed on the safety and reliability of circuit boards. Among these, temperature change is one of the key factors affecting circuit board reliability. Temperature changes cause the expansion and contraction of circuit board materials (for example, the circuit board material expands at high temperatures and contracts at low temperatures), thereby generating mechanical stress and fatigue, leading to damage to solder joints and components, and ultimately potentially causing structural failure of the circuit board.

[0003] To ensure circuit board quality, reliability testing is necessary. Several reliability testing standards exist, such as the GB2423 series and GJB150 series. These standards involve testing the circuit board's electrical signals, temperature, or deformation under environmental stress conditions to analyze failure modes and patterns, thereby identifying the root causes and weak points leading to failure. However, current testing equipment can only measure the circuit board's electrical signals, temperature, or deformation during temperature loading, failing to simultaneously measure these factors. This results in a lack of comprehensive and accurate reliability test data, hindering the assurance of complete and accurate test results. Summary of the Invention

[0004] Therefore, it is necessary to provide a circuit board reliability testing device that provides comprehensive and accurate test results.

[0005] A circuit board reliability testing device, comprising:

[0006] An environmental loading system is used to provide the required environmental stress to the workpiece under test.

[0007] The testing system is used to obtain test data of the workpiece under environmental stress, including temperature data, deformation data and electrical signal data.

[0008] The data analysis system is used for the analysis and display of temperature and deformation data.

[0009] The testing system includes:

[0010] The housing has a detection chamber inside;

[0011] A testing platform, located inside the testing cavity, is used to place the workpiece to be tested;

[0012] A temperature detection element is disposed inside the detection chamber and electrically connected to the data analysis system, used to detect the temperature data of the workpiece under test and feed it back to the data analysis system;

[0013] A displacement detection element is disposed in the detection cavity and electrically connected to the data analysis system, used to detect the deformation data of the workpiece under test and feed it back to the data analysis system;

[0014] The monitoring device is located outside the detection cavity and is electrically connected to the workpiece to be tested, and is used to monitor the electrical signal data of the workpiece to be tested.

[0015] In one embodiment, there is a gap between the temperature detection element and the detection stage, and the temperature detection element is capable of emitting an optical signal to the workpiece under test and receiving the optical signal reflected by the workpiece under test; there is a gap between the displacement detection element and the detection stage, and the displacement detection element is capable of emitting an optical signal to the workpiece under test and receiving the optical signal reflected by the workpiece under test.

[0016] In one embodiment, the environmental loading system includes a temperature sensor, an isolation chamber, and a temperature control device. The isolation chamber is located inside the detection chamber, and the temperature detection element and the displacement detection element are located inside the isolation chamber. The isolation chamber has a detection window through which the temperature detection element and the displacement detection element can detect the workpiece to be tested. The temperature sensor is used to monitor the temperature data inside the detection chamber and feed it back to the temperature control device, which is used to maintain the temperature stability inside the isolation chamber.

[0017] In one embodiment, the temperature control device includes a cooling component, a heating component, and a control system; when the temperature sensor detects that the temperature data inside the detection chamber is higher than the rated temperature, the control system controls the cooling component to start to cool the isolation chamber; when the temperature sensor detects that the temperature data inside the detection chamber is lower than the rated temperature, the control system controls the heating component to start to heat the isolation chamber.

[0018] In one embodiment, the cooling component includes a compressor and a condenser, the compressor being connected to the condenser via a condensation pipe; a receiving cavity is provided on the housing, and the compressor and condenser are disposed within the receiving cavity; the receiving cavity is located below the detection cavity along the height direction; the heating component includes a heating element, the heating element being disposed within the isolation box; the compressor and the heating element are electrically connected to the control system respectively.

[0019] In one embodiment, along the height direction, the detection platform is located at the bottom of the detection cavity, and the detection platform has multiple hollow openings; the isolation box is located at the top of the detection cavity, and the detection window is located at the bottom of the isolation box.

[0020] In one embodiment, the isolation box includes an inner box and an outer box, the inner box covering the temperature detection element and the displacement detection element, and the outer box covering the inner box; a water injection cavity is provided between the inner box and the outer box, and the water injection cavity is connected to a water tank through a pipe; the outer box includes an outer layer and an inner layer, the outer layer covering the inner layer, the inner layer being a thermal insulation material, and the outer layer being a metal thermal insulation material.

[0021] In one embodiment, the data analysis system includes a data acquisition module and a host computer. The temperature detection device and the displacement detection device are connected to the data acquisition module, and the data acquisition module is connected to the host computer. After receiving temperature data and deformation data, the data acquisition module converts the data into a format that the host computer can receive for analysis and display. When the temperature sensor detects that the temperature data in the detection chamber is higher than the limit temperature, the host computer corrects the temperature data and deformation data.

[0022] In one embodiment, the detection cavity is provided with a first driving component and a second driving component. The first driving component is used to drive the detection stage to reciprocate along the length direction of the detection cavity, and the second driving component is used to drive the detection stage to reciprocate along the width direction of the detection cavity. A camera is provided in the detection cavity. Along the height direction, the camera is located above the detection stage, and the camera is connected to the host computer.

[0023] In one embodiment, the first driving assembly includes a first base, a first slide rail, a first rotating member, and a first knob. The first rotating member is rotatably mounted on the first base, and one end of the first rotating member extends out of the housing and is connected to the first knob. The first slide rail is mounted on the first base and extends along the length of the detection cavity. The detection stage is connected to the first rotating member and slidably connected to the first slide rail. The second driving assembly includes a second base, a second slide rail, a second rotating member, and a second knob. The second rotating member is rotatably mounted on the second base, and one end of the second rotating member extends out of the housing and is connected to the second knob. The second slide rail is mounted on the second base and extends along the width of the detection cavity. The first base is mounted on the second base, and the first base is connected to the second rotating member and slidably connected to the second slide rail.

[0024] Compared to existing technologies, the circuit board reliability testing device provides specific environmental stress detection through an environmental loading system. Temperature and displacement sensors are simultaneously installed within the testing chamber, and the circuit board is also connected to a monitoring device. Therefore, during testing, it can simultaneously acquire temperature, deformation, and electrical signal data of the circuit board under test, obtaining rich, comprehensive, and accurate reliability test data. This provides a comprehensive perspective on how temperature changes affect circuit board performance, ensuring comprehensive and accurate test results and making circuit board failure analysis more efficient. Attached Figure Description

[0025] To more clearly illustrate the technical solutions in the embodiments of this application or the conventional technology, the drawings used in the description of the embodiments or the conventional technology will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0026] Figure 1 A schematic diagram of the circuit board reliability testing device provided in this application.

[0027] Figure 2 for Figure 1 A schematic diagram of the structure after removing the cabinet door.

[0028] Figure 3 for Figure 2 A diagram showing the view from below.

[0029] Figure 4 for Figure 1 A structural diagram after removing the door panels and cabinet doors.

[0030] Figure 5 This is a structural schematic diagram of the isolation box provided in this application.

[0031] Figure 6 for Figure 3 A partial structural diagram.

[0032] Figure 7 A schematic diagram of the structure of the first drive component and the second drive component provided in this application.

[0033] Figure 8 A schematic diagram of the circuit board reliability testing device provided in this application.

[0034] Reference numerals: 1. Environmental loading system; 11. Temperature sensor; 12. Isolation chamber; 121. Inner chamber; 122. Outer chamber; 123. Outer layer; 124. Inner layer; 125. Water injection chamber; 13. Detection window; 14. Temperature control device; 141. Cooling component; 141a. Compressor; 141b. Condenser; 142. Heating component; 142a. Heating element; 2. Testing system; 21. Chamber; 211. Cable hole; 22. Detection chamber; 23. Detection platform; 231. Hole; 24. Temperature detection element; 25. Displacement detection element; 26. Monitoring device 261. Signal line; 3. Data analysis system; 31. Data acquisition module; 311. Transmission line; 32. Host computer; 4. First drive assembly; 41. First base; 42. First slide rail; 43. First rotating component; 44. First knob; 5. Second drive assembly; 51. Second base; 52. Second slide rail; 53. Second rotating component; 54. Second knob; 6. Camera; 71. Power supply; 72. Time delay relay; 81. Receiving cavity; 82. Door panel; 83. Control button; 84. Box door; 85. Handle; 91. Equipment power supply; 92. Water tank. Detailed Implementation

[0035] To make the above-mentioned objectives, features, and advantages of this application more apparent and understandable, the specific embodiments of this application are described in detail below with reference to the accompanying drawings. Many specific details are set forth in the following description to provide a thorough understanding of this application. However, this application can be implemented in many other ways different from those described herein, and those skilled in the art can make similar modifications without departing from the spirit of this application. Therefore, this application is not limited to the specific embodiments disclosed below.

[0036] It should be noted that when a component is referred to as being "fixed to" or "set on" another component, it can be directly on the other component or there may be an intermediate component. When a component is considered to be "connected to" another component, it can be directly connected to the other component or there may be an intermediate component present. The terms "vertical," "horizontal," "upper," "lower," "left," "right," and similar expressions used in this application's specification are for illustrative purposes only and do not represent the only possible implementation.

[0037] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one of that feature. In the description of this application, "multiple" means at least two, such as two, three, etc., unless otherwise explicitly specified.

[0038] In this application, unless otherwise expressly specified and limited, "above" or "below" the second feature can mean that the first feature is in direct contact with the second feature, or that the first feature and the second feature are in indirect contact through an intermediate medium. Furthermore, "above," "over," and "on top" the second feature can mean that the first feature is directly above or diagonally above the second feature, or simply indicates that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature can mean that the first feature is directly below or diagonally below the second feature, or simply indicates that the first feature is at a lower horizontal level than the second feature.

[0039] Unless otherwise defined, all technical and scientific terms used in this application have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The terminology used in this application is for the purpose of describing particular embodiments only and is not intended to be limiting of the application. The term "and / or" as used in this application includes any and all combinations of one or more of the associated listed items.

[0040] Please see Figures 1 to 8 This application provides a circuit board reliability testing device, which includes an environmental loading system 1, a testing system 2, and a data analysis system 3. The environmental loading system 1 provides the required environmental stress to the workpiece under test. The testing system 2 obtains test data of the workpiece under environmental stress. The test data includes temperature data, deformation data, and electrical signal data. The data analysis system 3 analyzes and displays the temperature and deformation data.

[0041] The testing system 2 includes a housing 21, a testing platform 23, a temperature sensor 24, a displacement sensor 25, and a monitoring device 26. A testing cavity 22 is formed inside the housing 21. The testing platform 23 is located inside the testing cavity 22 and is used to place the workpiece to be tested. The temperature sensor 24 is located inside the testing cavity 22 and is electrically connected to the data analysis system 3, used to detect the temperature data of the workpiece and feed it back to the data analysis system 3. The displacement sensor 25 is located inside the testing cavity 22 and is electrically connected to the data analysis system 3, used to detect the deformation data of the workpiece and feed it back to the data analysis system 3. The monitoring device 26 is located outside the testing cavity 22 and is electrically connected to the workpiece to be tested, used to monitor the electrical signal data of the workpiece.

[0042] Understandably, the detection chamber 22 is equipped with both a temperature sensor 24 and a displacement sensor 25, and the circuit board is also connected to a monitoring device 26. During reliability testing, the circuit board under test is mounted on the test bench 23, and the environmental loading system 1 first provides the detection chamber 22 with specific environmental stress. Then, the temperature sensor 24, displacement sensor 25, and monitoring device 26 are activated to detect the temperature, deformation, and electrical signals of the circuit board under test under this environmental stress, thereby simultaneously acquiring the temperature data, deformation data, and electrical signal data of the circuit board under test. This provides rich, comprehensive, and accurate reliability test data, offering a comprehensive perspective on how temperature changes affect the performance of the circuit board, ensuring comprehensive and accurate test results, and making circuit board failure analysis more efficient.

[0043] For example, the environmental stress mentioned above refers to temperature, such as high temperature, low temperature, extreme temperature, etc., which can be selected according to the temperature changes required for circuit board testing. Electrical signal data includes voltage, resistance, current, etc.

[0044] For example, temperature sensor 24 and displacement sensor 25 are connected to power supply 71 and time delay relay 72. Time delay relay 72 is placed outside detection cavity 22 and controls the opening and closing of temperature sensor 24 and displacement sensor 25 by its own on / off switching. The specific principle is prior art and will not be described in detail.

[0045] Understandably, the data analysis system 3 requires different data processing modules for different test data, and the consistency of the measurement data in timing can be adjusted by controlling the on / off state of the relay.

[0046] In one embodiment, a cable hole 211 communicating with the detection chamber 22 is provided on the side wall of the housing 21. A signal line 261 is connected to the output terminal of the circuit board under test, and the signal line 261 passes through the cable hole 211 to the outside of the housing 21 and is connected to the monitoring device 26.

[0047] For example, the monitoring device 26 can be an oscilloscope, a digital source meter, or an impedance analyzer. Specifically, a suitable monitoring device 26 can be selected based on the function of the circuit board under test. The monitoring device 26 is used to monitor the changing trends of the electrical signals (voltage, resistance, current) of the circuit board under environmental stress.

[0048] Furthermore, there is a gap between the temperature detection element 24 and the detection stage 23, and the temperature detection element 24 is capable of emitting optical signals to the workpiece under test and receiving optical signals reflected by the workpiece under test. There is also a gap between the displacement detection element 25 and the detection stage 23, and the displacement detection element 25 is capable of emitting optical signals to the workpiece under test and receiving optical signals reflected by the workpiece under test.

[0049] Understandably, there is a certain distance between the temperature detection element 24 and the displacement detection element 25 and the detection stage 23, that is, non-contact measurement is adopted to realize non-contact measurement of temperature and deformation of the circuit board under test under specific environmental stress, while monitoring the output electrical signal of the circuit board.

[0050] Because the detection element can be positioned far from the workpiece, the influence of ambient temperature on the detection element is minimal, resulting in more accurate measurements. Data acquisition via photoelectric reflection allows for a greater distance to be set between the detection element and the detection stage 23.

[0051] For example, temperature detection element 24 employs an optical temperature sensor. Displacement detection element 25 employs a laser displacement sensor.

[0052] In one embodiment, the environmental loading system 1 includes a temperature sensor 11, an isolation chamber 12, and a temperature control device 14. Specifically, the isolation chamber 12 is disposed within the detection chamber 22, and temperature detection elements 24 and displacement detection elements 25 are disposed within the isolation chamber 12. The isolation chamber 12 is provided with a detection window 13, through which the temperature detection elements 24 and displacement detection elements 25 can detect the workpiece to be tested. The temperature sensor 11 is used to monitor the temperature data within the detection chamber 22 and feed it back to the temperature control device 14, which is used to maintain the temperature stability within the isolation chamber 12.

[0053] Understandably, the isolation chamber 12 isolates the temperature sensor 24 and displacement sensor 25 from the detection chamber 22, preventing temperature changes within the detection chamber 22 from affecting the temperature inside the isolation chamber 12 and reducing the impact of temperature changes on the detection results of the temperature sensor 24 and displacement sensor 25. Furthermore, the temperature control device 14 maintains the temperature inside the isolation chamber 12 at a relatively stable state, ensuring that the temperature sensor 24 and displacement sensor 25 operate at their optimal temperature, thereby ensuring the accuracy of the test data.

[0054] Secondly, the isolation box 12 is equipped with a detection window 13, which allows optical signals to be projected onto the circuit board without obstruction, thus further ensuring the accuracy of the obtained test data.

[0055] In one embodiment, along the height direction, the detection platform 23 is located at the bottom of the detection cavity 22, and the detection platform 23 has multiple hollow openings 231. The isolation box 12 is located at the top of the detection cavity 22, and the detection window 13 is located at the bottom of the isolation box 12.

[0056] For example, temperature detection element 24 and displacement detection element 25 are also disposed on the top of detection cavity 22 and are covered inside isolation box 12.

[0057] Understandably, with this setup, the distance between the detection platform 23 and the isolation box 12 within the detection cavity 22 can be maximized, further reducing the impact of temperature changes at the detection location on the isolation box 12 and its internal temperature detection element 24 and displacement detection element 25.

[0058] For example, the cutouts 231 are multiple openings or openings that penetrate the testing stage 23 from top to bottom and are spaced apart on the testing stage 23. The cutouts 231 can dissipate heat from the circuit board on the testing stage 23, prevent heat accumulation at the bottom of the circuit board, make the air circulation in the testing cavity 22 more reasonable, and make the testing results of the circuit board more accurate.

[0059] Furthermore, the temperature control device 14 includes a cooling component 141, a heating component 142, and a control system. The temperature sensor 11 is electrically connected to the control system. When the temperature sensor 11 detects that the temperature inside the detection chamber 22 is higher than the rated temperature, the control system controls the cooling component 141 to start and cool the isolation chamber 12. When the temperature sensor 11 detects that the temperature inside the detection chamber 22 is lower than the rated temperature, the control system controls the heating component 142 to start and heat the isolation chamber 12.

[0060] Understandably, the temperature sensor 11, in conjunction with real-time heating and cooling operations, provides a rapid response and ensures stable temperature within the isolation chamber 12. This provides a stable working environment for the tested components, ensuring the accuracy and scientific validity of the measurement results.

[0061] For example, the rated temperature refers to the ambient temperature at which the temperature sensing element 24 and the displacement sensing element 25 can operate normally. If the ambient temperature is lower than this, the detection of the temperature sensing element 24 and the displacement sensing element 25 will be inaccurate. The specific value of the rated temperature can be selected according to actual needs, and will not be listed here.

[0062] In one embodiment, the cooling assembly 141 includes a compressor 141a and a condenser 141b, with the compressor 141a connected to the condenser 141b via a condensation pipe. The heating assembly 142 includes a heating element 142a, which is disposed inside the isolation chamber 12. The compressor 141a and the heating element 142a are electrically connected to the control system.

[0063] For example, the control system uses a PLC, a microcontroller, etc. The heating element 142a is a heating tube.

[0064] For example, an evaporator may also be installed on the detection chamber 22 or the housing 21. The compressor 141a, condenser 141b, and evaporator are all connected to the equipment power supply 91. The equipment power supply 91 is electrically connected to the control system, which controls the equipment power supply 91 to supply power to different devices to control their startup. The evaporator is used to deliver cold air into the detection chamber 22, reducing the temperature inside the detection chamber 22. This is similar to the cooling principle of an air conditioner, and will not be elaborated further.

[0065] Understandably, after the power supply 91 supplies power to the temperature sensor 11, the temperature sensor 11 senses the temperature change inside the detection chamber 22. When the temperature sensor 11 detects that the temperature inside the detection chamber 22 is higher than the rated temperature, it feeds a signal back to the control system. The control system then controls the power supply 71 to supply power to the compressor 141a, condenser 141b, and evaporator, and these devices start to cool the isolation chamber 12. Similarly, when the temperature sensor 11 detects that the temperature inside the detection chamber 22 is lower than the rated temperature, it feeds a signal back to the control system. The control system then controls the power supply 71 to supply power to the heating element 142a, and the heating element 142a starts heating to raise the temperature inside the isolation chamber 12.

[0066] In one embodiment, the housing 21 has a receiving cavity 81, and the compressor 141a and condenser 141b are disposed within the receiving cavity 81. Specifically, along the height direction, the receiving cavity 81 is located below the detection cavity 22.

[0067] For example, a door panel 82 is hinged to the receiving cavity 81. The aforementioned device is placed inside the receiving cavity 81 and covered by the door panel 82, making it more aesthetically pleasing. The receiving cavity 81 and the detection cavity 22 are arranged vertically, which is a reasonable layout and makes full use of space.

[0068] Furthermore, the isolation box 12 includes an inner box 121 and an outer box 122. The inner box 121 covers the temperature detection element 24 and the displacement detection element 25, and the outer box 122 covers the inner box 121. A water injection chamber 125 is provided between the inner box 121 and the outer box 122, and the water injection chamber 125 is connected to the water tank 92 through a pipe.

[0069] Understandably, the water injection chamber 125 can be filled with an aqueous solution, thereby isolating the heat transfer between the interior of the isolation chamber 12 and the detection chamber 22 through water, reducing the impact of the temperature of the detection chamber 22 on the isolation chamber 12. At the same time, the water can also lock in the temperature of the isolation chamber 12, ensuring that the temperature inside the isolation chamber 12 remains stable.

[0070] This method can achieve stable temperature maintenance inside the isolation chamber 12 using only a simple structure, with low equipment investment costs and is easy to implement.

[0071] Furthermore, the outer casing 122 includes an outer layer 123 and an inner layer 124. The outer layer 123 covers the inner layer 124. The inner layer 124 is a thermal insulation material, and the outer layer 123 is a metal thermal insulation material. By utilizing the combination of the metal thermal insulation material and the thermal insulation material, the heat of the detection cavity 22 is better reflected, further preventing heat from being transferred to the inner casing 121.

[0072] For example, glass wool is used as the insulation material. Aluminum insulation board is used as the metal insulation material.

[0073] In one embodiment, the data analysis system 3 includes a data acquisition module 31 and a host computer 32. Temperature detection element 24 and displacement detection element 25 are connected to the data acquisition module 31, which in turn is connected to the host computer 32. After receiving temperature and deformation data, the data acquisition module 31 converts the data into a format that the host computer 32 can receive, which then analyzes and displays the data. When the temperature sensor 11 detects that the temperature data within the detection chamber 22 exceeds the limit temperature, the host computer 32 corrects the temperature and deformation data.

[0074] Furthermore, the temperature detection element 24 and the displacement detection element 25 are electrically connected to the data acquisition module 31, and can be connected via transmission line 311. The data acquisition module 31 is also electrically connected to the host computer 32.

[0075] For example, the data acquisition module 31 uses a data acquisition card, an analog-to-digital converter, etc. The host computer 32 has software installed to display the curve. After receiving temperature data and deformation data, the data acquisition module 31 converts the data into a format that the host computer 32 can receive and uploads it to the host computer 32. The host computer 32 integrates, processes, and stores the data, and finally presents the results as a curve on the software of the host computer 32.

[0076] Optionally, the host computer 32 is installed on the enclosure 21, and the display screen of the host computer 32 is located on the side wall of the enclosure 21, so that personnel can directly observe the test results displayed on the screen.

[0077] Furthermore, the limiting temperature refers to the ambient temperature at which the temperature sensing element 24 and the displacement sensing element 25 will cease to function. When the temperature inside the sensing chamber 22 is too high, making it difficult to reduce the temperature inside the isolation box 12 below the limiting temperature even through the cooling assembly 141, the temperature sensing element 24 and the displacement sensing element 25 will be affected by the limiting temperature, and their detection results will be inaccurate.

[0078] Understandably, in this state, the temperature and deformation data can be corrected by the host computer 32 to ensure the accuracy of the test data. This involves front-end suppression and back-end optimization to ensure the scientific accuracy of the measurement data.

[0079] For example, the method of correction by the host computer 32 can be algorithm optimization or providing compensation values. By monitoring and processing temperature, deformation, and electrical signal data in real time through the host computer 32 and integrating reliability analysis algorithms, the performance status of the sample can be evaluated and predicted in real time.

[0080] In one embodiment, the detection cavity 22 is provided with a first driving component 4 and a second driving component 5. The first driving component 4 drives the detection stage 23 to reciprocate along the length direction X of the detection cavity 22, and the second driving component 5 drives the detection stage 23 to reciprocate along the width direction Z of the detection cavity 22. A camera 6 is provided inside the detection cavity 22, positioned above the detection stage 23 in the height direction, and connected to a host computer 32.

[0081] Understandably, the first drive assembly 4 and the second drive assembly 5 can drive the testing stage 23 to move in the X / Z directions, thereby adjusting the relative position of the workpiece being tested. The system can measure the circuit board at different positions and in different directions, achieving comprehensive multi-point and multi-directional measurement of the circuit board, obtaining more comprehensive data, and thus making the analysis of the circuit board's reliability more accurate.

[0082] Understandably, camera 6 can capture images of the testing platform 23 and transmit the images to the host computer 32 for display, making the adjustment of the position of the testing platform 23 more convenient and accurate.

[0083] For example, camera 6 is also enclosed inside the isolation box 12 and takes pictures of the detection table 23 through the detection window 13.

[0084] Specifically, the first drive assembly 4 includes a first base 41, a first slide rail 42, a first rotating component 43, and a first knob 44. The first rotating component 43 is rotatably mounted on the first base 41, and one end of the first rotating component 43 extends out of the housing 21 and is connected to the first knob 44. The first slide rail 42 is mounted on the first base 41 and extends along the length direction X of the detection cavity 22. The detection stage 23 is connected to the first rotating component 43 and slidably connected to the first slide rail 42.

[0085] Specifically, the second drive assembly 5 includes a second base 51, a second slide rail 52, a second rotating member 53, and a second knob 54. The second rotating member 53 is rotatably mounted on the second base 51, and one end of the second rotating member 53 extends out of the housing 21 and is connected to the second knob 54. The second slide rail 52 is mounted on the second base 51 and extends along the width direction Z of the detection cavity 22. The first base 41 is mounted on the second base 51, and the first base 41 is connected to the second rotating member 53 and slidably connected to the second slide rail 52.

[0086] For example, the first rotating member 43 is a lead screw or a screw rod that is sleeved on each other, and the detection table 23 is fixedly connected to the first rotating member 43. When the first rotating member 43 rotates, the first slide rail 42 restricts the rotation of the detection table 23, and the detection table 23 can move along the first slide rail 42, thereby adjusting the position of the detection table 23 in the X direction.

[0087] For example, the second rotating member 53 is a lead screw or a screw rod that is sleeved on each other, and the first base 41 is fixedly connected to the second rotating member 53. When the second rotating member 53 rotates, the second slide rail 52 restricts the rotation of the first base 41, and the first base 41 can move along the second slide rail 52, thereby adjusting the position of the detection table 23 in the Z direction.

[0088] Both the first knob 44 and the second knob 54 are located on the outside of the housing 21. Rotating either the first knob 44 or the second knob 54 will drive the first rotating component 43 or the second rotating component 53 to rotate, thereby moving the detection stage 23. The position adjustment of the detection stage 23 can be achieved without opening the detection chamber 22, making operation simple and the structure straightforward. No electric drive component is required, resulting in low equipment investment costs.

[0089] Secondly, the manual turning of the knob allows for a smaller adjustment distance at position 23 of the testing platform, making it easier to adapt to multi-point and multi-directional testing of circuit boards.

[0090] Furthermore, the housing 21 has an elongated slot corresponding to the position where the second rotating member 53 protrudes. As the first base 41 moves along the second slide rail 52, the second rotating member 53 can move within this slot, ensuring the normal operation of the equipment.

[0091] For example, temperature changes within the detection chamber 22 can be achieved using a heating element and a fan. The heating element can be embedded in the inner wall of the detection chamber 22 or installed on the housing 21. Heating the detection chamber 22 with the heating element raises the temperature inside the chamber, thus achieving temperature increase. The fan is connected to the detection chamber 22 and, when started, lowers the temperature inside the chamber, thus achieving cooling.

[0092] Furthermore, a control button 83 is provided on the housing 21. The control button 83, the heating element, and the fan are respectively connected to the aforementioned control system. Pressing the heating or cooling button will control the heating element or the fan accordingly, thereby detecting changes in environmental stress within the detection chamber 22. The specific principle is existing technology and will not be elaborated upon.

[0093] Of course, this is not the only option; temperature changes within the detection chamber 22 can also be achieved using other methods, such as a hot air blower or a condensate pipe. The key is to ensure that the environmental stress within the detection chamber 22 can be adequately addressed.

[0094] Furthermore, one side of the detection chamber 22 is open, and the housing 21 is provided with a door 84 corresponding to the open side, and the door 84 is provided with a handle 85. The door 84 is hinged to the housing 21 to open or close the detection chamber 22.

[0095] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0096] The embodiments described above are merely illustrative of several implementation methods of this application, and while the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the patent application. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this application, and these all fall within the scope of protection of this application. Therefore, the patent protection scope of this application should be determined by the appended claims.

Claims

1. A circuit board reliability testing device, characterized in that, include: An environmental loading system (1) is used to provide the environmental stress required for the workpiece under test; The testing system (2) is used to obtain test data of the workpiece under the environmental stress, the test data including temperature data, deformation data and electrical signal data; The data analysis system (3) is used for the analysis and display of temperature data and deformation data; The test system (2) includes: The housing (21) has a detection chamber (22) inside. The testing platform (23) is located inside the testing cavity (22) and is used to place the workpiece to be tested; A temperature detection element (24) is disposed in the detection cavity (22) and electrically connected to the data analysis system (3) for detecting the temperature data of the workpiece to be tested and feeding it back to the data analysis system (3); The displacement detection element (25) is located in the detection cavity (22) and is electrically connected to the data analysis system (3) to detect the deformation data of the workpiece to be tested and feed it back to the data analysis system (3); The monitoring device (26) is located outside the detection cavity (22) and is electrically connected to the workpiece to be tested, and is used to monitor the electrical signal data of the workpiece to be tested.

2. The circuit board reliability testing device according to claim 1, characterized in that, There is a gap between the temperature detection element (24) and the detection stage (23). The temperature detection element (24) can emit optical signals to the workpiece under test and receive optical signals reflected by the workpiece under test. There is a gap between the displacement detection element (25) and the detection stage (23). The displacement detection element (25) can emit optical signals to the workpiece under test and receive optical signals reflected by the workpiece under test.

3. The circuit board reliability testing device according to claim 1, characterized in that, The environmental loading system (1) includes a temperature sensor (11), an isolation chamber (12), and a temperature control device (14). The isolation chamber (12) is located inside the detection chamber (22), and the temperature detection element (24) and the displacement detection element (25) are located inside the isolation chamber (12). The isolation chamber (12) is provided with a detection window (13), through which the temperature detection element (24) and the displacement detection element (25) can detect the workpiece to be tested. The temperature sensor (11) is used to monitor the temperature data in the detection chamber (22) and feed it back to the temperature control device (14). The temperature control device (14) is used to maintain the temperature stability in the isolation chamber (12).

4. The circuit board reliability testing device according to claim 3, characterized in that, The temperature control device (14) includes a cooling component (141), a heating component (142), and a control system. When the temperature sensor (11) detects that the temperature data in the detection chamber (22) is higher than the rated temperature, the control system controls the cooling component (141) to start and cool the isolation box (12). When the temperature sensor (11) detects that the temperature data in the detection chamber (22) is lower than the rated temperature, the control system controls the heating component (142) to start and heat the isolation box (12).

5. The circuit board reliability testing device according to claim 4, characterized in that, The cooling component (141) includes a compressor (141a) and a condenser (141b), the compressor (141a) being connected to the condenser (141b) via a condensing pipe; a receiving cavity (81) is provided on the housing (21), the compressor (141a) and the condenser (141b) being located within the receiving cavity (81); along the height direction, the receiving cavity (81) is located below the detection cavity (22); the heating component (142) includes a heating element (142a), the heating element (142a) being located within the isolation box (12); the compressor (141a) and the heating element (142a) are electrically connected to the control system respectively.

6. The circuit board reliability testing apparatus according to claim 3, characterized in that, Along the height direction, the detection platform (23) is located at the bottom of the detection cavity (22), and the detection platform (23) has multiple hollow openings (231); the isolation box (12) is located at the top of the detection cavity (22), and the detection window (13) is located at the bottom of the isolation box (12).

7. The circuit board reliability testing apparatus according to claim 3, characterized in that, The isolation box (12) includes an inner box (121) and an outer box (122). The inner box (121) covers the temperature detection element (24) and the displacement detection element (25), and the outer box (122) covers the inner box (121). There is a water injection cavity (125) between the inner box (121) and the outer box (122). The water injection cavity (125) is connected to the water tank (92) through a pipe. The outer box (122) includes an outer layer (123) and an inner layer (124). The outer layer (123) covers the inner layer (124). The inner layer (124) is a heat insulation material, and the outer layer (123) is a metal heat insulation material.

8. The circuit board reliability testing apparatus according to claim 3, characterized in that, The data analysis system (3) includes a data acquisition module (31) and a host computer (32). The temperature detection element (24) and the displacement detection element (25) are connected to the data acquisition module (31), and the data acquisition module (31) is connected to the host computer (32). After receiving temperature data and deformation data, the data acquisition module (31) converts the data into a form that the host computer (32) can receive, and the host computer (32) analyzes and displays the data. When the temperature control sensor (11) detects that the temperature data in the detection cavity (22) is higher than the limit temperature, the host computer (32) corrects the temperature data and deformation data.

9. The circuit board reliability testing apparatus according to claim 8, characterized in that, The detection cavity (22) is provided with a first driving component (4) and a second driving component (5). The first driving component (4) is used to drive the detection stage (23) to reciprocate along the length direction X of the detection cavity (22), and the second driving component (5) is used to drive the detection stage (23) to reciprocate along the width direction Z of the detection cavity (22). The detection cavity (22) is provided with a camera (6). Along the height direction, the camera (6) is located above the detection stage (23), and the camera (6) is connected to the host computer (32).

10. The circuit board reliability testing apparatus according to claim 9, characterized in that, The first driving assembly (4) includes a first base (41), a first slide rail (42), a first rotating member (43), and a first knob (44). The first rotating member (43) is rotatably mounted on the first base (41), and one end of the first rotating member (43) extends out of the housing (21) and is connected to the first knob (44). The first slide rail (42) is mounted on the first base (41) and extends along the length direction X of the detection cavity (22). The detection stage (23) is connected to the first rotating member (43) and slidably connected to the first slide rail (42). The second driving assembly (5) includes... The device includes a second base (51), a second slide rail (52), a second rotating component (53), and a second knob (54). The second rotating component (53) is rotatably mounted on the second base (51), and one end of the second rotating component (53) extends out of the housing (21) and is connected to the second knob (54). The second slide rail (52) is mounted on the second base (51) and extends along the width direction Z of the detection cavity (22). The first base (41) is mounted on the second base (51), and the first base (41) is connected to the second rotating component (53) and slidably connected to the second slide rail (52).

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