A testing device and a contact pressure adjustment method

Abstract

This application discloses a testing device and a contact pressure adjustment method, relating to the field of testing technology. The testing device includes a mounting plate, a compensation mechanism, a pressure reduction mechanism, and several test probes. The test probes are slidably disposed on the mounting plate in a vertical direction. The compensation mechanism is connected to the test probes and is used to adjust the vertical position of the test probes so that the height distribution trajectory of the test probes matches the warp trajectory of the printed circuit board under test, thereby compensating for the pressure between the test probes and the printed circuit board under test. The pressure reduction mechanism is also connected to the test probes and is used to adjust the vertical position of the test probes so that the height distribution trajectory of the test probes matches the warp trajectory of the printed circuit board under test, thereby reducing the pressure between the test probes and the printed circuit board under test. This solves the technical problems of poor contact between the test probes and the printed circuit board or excessive contact pressure, achieving the technical effect of improving the accuracy of test results.

Description

Technical Field

[0001] This application relates to the field of testing technology, and in particular to a testing device and a contact pressure adjustment method. Background Technology

[0002] During the production and testing of printed circuit boards (PCBs), test probes are often used to contact test points on the PCB to perform electrical performance and functional testing. In the PCB manufacturing process, especially in wave soldering, the two ends of the PCB are typically fixed to a moving mechanism, while the middle area lacks support and is prone to upward bending and deformation when heated. Simultaneously, due to the constraint at the ends, the deformation is smaller closer to the ends, resulting in a warped state that is "high in the middle and low at both ends."

[0003] When a warped printed circuit board comes into contact with an existing test probe, it can easily cause a height inconsistency between the test probe and the test point, resulting in poor local contact or excessive contact pressure between the test probe and the printed circuit board, leading to inaccurate test results. Summary of the Invention

[0004] This application provides a testing apparatus and a contact pressure adjustment method to at least solve the problems of poor local contact or excessive contact pressure between the test probe and the printed circuit board in the related art.

[0005] This application provides a testing device, including a mounting plate, a compensation mechanism, a pressure reduction mechanism, and a plurality of test probes. The plurality of test probes are slidably disposed on the mounting plate in a vertical direction. The compensation mechanism is connected to the plurality of test probes and is used to adjust the vertical position of the plurality of test probes so that the height distribution trajectory of the plurality of test probes matches the warp trajectory of the printed circuit board under test, thereby compensating for the pressure between the test probes and the printed circuit board under test. The pressure reduction mechanism is connected to the plurality of test probes and is used to adjust the vertical position of the plurality of test probes so that the height distribution trajectory of the plurality of test probes matches the warp trajectory of the printed circuit board under test, thereby reducing the pressure between the test probes and the printed circuit board under test.

[0006] On the other hand, a contact pressure adjustment method is provided, the contact pressure adjustment method comprising: Obtain the contact pressure between the test probe and the printed circuit board under test during the test process; In response to the contact pressure between the test probe and the printed circuit board under test being less than the first pressure threshold, the height of the test probe is reduced by a compensation mechanism to increase the contact pressure between the test probe and the printed circuit board under test, while adapting the height distribution trajectory of several test probes to the warping trajectory of the printed circuit board under test. When the contact pressure between the test probe and the printed circuit board under test exceeds the second pressure threshold, the height of the test probe is increased by the pressure reduction mechanism to reduce the contact pressure between the test probe and the printed circuit board under test, while adapting the height distribution trajectory of several test probes to the warping trajectory of the printed circuit board under test. The height of the test probe is adjusted by the compensation mechanism and the pressure reduction mechanism, and the contact pressure between the test probe and the printed circuit board under test is controlled between the first pressure threshold and the second pressure threshold.

[0007] The testing device of this application adjusts the vertical position of the test probes under different pressure conditions through a compensation mechanism and a pressure reduction mechanism. Through their synergistic effect, the test probes can be adapted to the warping shape of the printed circuit board under test, realizing dynamic control of the contact pressure of the test probes. Even when the printed circuit board is warped, the height distribution trajectory of the test probes can be matched with the warping trajectory of the printed circuit board, thereby ensuring reliable contact between the test probes and the test points. This solves the problem of poor local contact or excessive contact pressure between the test probes and the printed circuit board, achieving the technical effect of improving the stability and accuracy of the printed circuit board testing process. Attached Figure Description

[0008] To more clearly illustrate the embodiments of this application, the accompanying drawings used in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0009] Figure 1 This is a first structural schematic diagram of the testing device provided in an embodiment of this application; Figure 2 A second structural schematic diagram of the test device provided in an embodiment of this application (single row of test probes). Figure 3 Schematic diagrams of the compensation mechanism and pressure reduction mechanism of the testing device provided in the embodiments of this application; Figure 4 for Figure 3 A magnified view of a portion of point A in the middle; Figure 5 A partial structural schematic diagram of the compensation mechanism of the testing device provided in the embodiments of this application; Figure 6 This is a schematic diagram of the connection structure between the test probe and the mounting plate of the test device provided in the embodiments of this application; Figure 7 for Figure 1 The main view; Figure 8 for Figure 7A magnified view of a portion of point B in the middle; Figure 9 Front view of the compensation mechanism and pressure reduction mechanism of the testing apparatus provided in the embodiments of this application; Figure 10 This is a flowchart illustrating the contact pressure adjustment method provided in an embodiment of this application.

[0010] The above figures include the following reference numerals: 1. Mounting plate; 2. Compensation mechanism; 3. Pressure reduction mechanism; 4. Test probe; 5. Compensation drive; 6. Compensation block; 7. Compensation bracket; 8. Compensation sliding seat; 9. Pressure reduction drive; 10. Pressure reduction block; 11. Pressure reduction bracket; 12. Pressure reduction sliding seat; 13. Probe body; 14. Upper wing plate; 15. Lower wing plate; 16. Through hole; 17. Guide post; 18. Guide hole; 19. Buffer spring; 20. Preload spring; 21. Support rod; 22. Connecting rod; 23. 24. Abutment component; 25. Arc-shaped sliding groove; 26. Limiting shaft; 27. Compensating component; 28. Pressure reducing component; 29. ​​Compensating transmission wheel; 30. Compensating transmission bracket; 31. Compensating pulley; 32. Compensating gear; 33. Pressure reducing transmission wheel; 34. Pressure reducing transmission bracket; 35. Pressure reducing transmission belt; 36. Pressure reducing pulley; 37. Pressure reducing gear; 38. Support spring; 39. Compensating slider; 40. Compensating groove; 41. Pressure reducing slider; 42. Pressure reducing groove. Detailed Implementation

[0011] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of this application.

[0012] It should be noted that the terms "center," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," "axial," "radial," and "circumferential," etc., indicating orientation or positional relationships based on the orientation or positional relationships shown in the accompanying drawings, are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application. The terms "installed," "connected," and "joined" should be interpreted broadly, for example, they can be fixed connections, detachable connections, or integral connections; they can be mechanical connections or electrical connections; they can be direct connections or indirect connections through an intermediate medium; they can be internal connections between two elements. The terms "parallel," "perpendicular," and "equal" include the described situation and situations similar to the described situation, the range of which is within an acceptable deviation range, wherein the acceptable deviation range is determined by those skilled in the art taking into account the measurement under discussion and the error associated with the measurement of a particular quantity (i.e., the limitations of the measurement system). For example, "parallel" includes absolute parallelism and approximate parallelism, where an acceptable deviation range for approximate parallelism can be, for example, within 5°; "perpendicular" includes absolute perpendicularity and approximate perpendicularity, where an acceptable deviation range for approximate perpendicularity can also be, for example, within 5°. "Equal" includes absolute equality and approximate equality, where an acceptable deviation range for approximate equality can be, for example, a difference between the two equal items being less than or equal to 5% of either one. Those skilled in the art will understand the specific meaning of the above terms in this application based on the specific circumstances.

[0013] To enable those skilled in the art to better understand the present application, the present application will be further described in detail below with reference to the accompanying drawings and specific embodiments.

[0014] Example 1 like Figure 1 and Figure 2 As shown, this embodiment provides a testing device for testing printed circuit boards. The testing device includes a mounting plate 1, a compensation mechanism 2, a pressure reduction mechanism 3, and a plurality of test probes 4.

[0015] The mounting plate 1 serves as the basic supporting component of the testing device, used to mount and support several test probes 4, a compensation mechanism 2, and a pressure reduction mechanism 3. The test probes 4 are slidably mounted on the mounting plate 1 in the vertical direction, so that each test probe 4 can be displaced relative to the mounting plate 1 in the vertical direction to adapt to changes in the height of the printed circuit board under test.

[0016] The compensation mechanism 2 is connected to several test probes 4 and is used to adjust the vertical position of the test probes 4 during the test. When the contact pressure between the test probe 4 and the printed circuit board under test is insufficient, the compensation mechanism 2 drives the corresponding test probe 4 to move vertically towards the printed circuit board under test, so that the height distribution trajectory of the several test probes 4 matches the warpage trajectory of the printed circuit board under test, thereby compensating for the contact pressure between the test probe 4 and the printed circuit board under test and ensuring that the test probe 4 can reliably contact the corresponding test point.

[0017] The pressure relief mechanism 3 is also connected to several test probes 4, used to adjust the vertical position of the test probes 4 during the test. When the contact pressure between the test probe 4 and the printed circuit board under test is too high, the pressure relief mechanism 3 drives the corresponding test probe 4 to move vertically away from the printed circuit board under test, so that the height distribution trajectory of the several test probes 4 matches the warpage trajectory of the printed circuit board under test, thereby reducing the contact pressure between the test probe 4 and the printed circuit board under test and avoiding damage to the test points or the printed circuit board due to local overpressure.

[0018] The compensation mechanism 2 and the pressure reduction mechanism 3 adjust the vertical position of the test probe 4 under different pressure conditions, so that the test probes 4 can be adapted as a whole to the warping shape of the printed circuit board under test, and realize the dynamic control of the contact pressure of the test probe 4.

[0019] The testing device of this application can match the height distribution trajectory of several test probes 4 with the warping trajectory of the printed circuit board when the printed circuit board is warped. This ensures reliable contact between the test probes 4 and the test points, while avoiding test instability or test point damage caused by insufficient or excessive local pressure, thus improving the stability and accuracy of the printed circuit board testing process.

[0020] In one specific implementation, such as Figure 3 and Figure 4 As shown, the compensation mechanism 2 also includes a compensation drive 5 and several compensation blocks 6. The number of compensation blocks 6 corresponds to the number of test probes 4, and each compensation block 6 is connected to one test probe 4, thus forming a one-to-one correspondence between the compensation blocks 6 and the test probes 4. Through this correspondence structure, the compensation mechanism 2 can adjust the test probes 4 at different positions.

[0021] In actual production processes, such as wave soldering, the two ends of the printed circuit board (PCB) are fixed by corresponding mechanisms, while the middle area of ​​the PCB is suspended without any support structure. During wave soldering, the middle of the PCB is prone to bending upwards after being heated. Because the two ends of the PCB are fixed and positioned, the deformation near the ends is smaller, while the deformation in the middle area is larger, resulting in an overall warped shape where the PCB is higher in the middle and lower at both ends.

[0022] When a printed circuit board with the aforementioned warping is brought into the testing station for testing, the test probe 4 located in the middle area of ​​the printed circuit board is more likely to make contact with the test point first, while the test probe 4 located at both ends may have insufficient contact pressure or even fail to make effective contact due to insufficient height.

[0023] To address this issue, the compensation drive 5 is controlled to move, causing the compensation block 6 to slide. This allows the compensation block 6 corresponding to the test probes 4 at both ends of the printed circuit board to move vertically towards the printed circuit board, thereby increasing the contact pressure between the test probes 4 at both ends and the test points. Simultaneously, the compensation block 6 corresponding to the test probe 4 in the middle area of ​​the printed circuit board maintains a relatively small displacement, ensuring that the test probe 4 in the middle area retains its original contact state.

[0024] By coordinating and adjusting the sliding motion of the compensation block 6, the height distribution of several test probes 4 in the vertical direction gradually forms a distribution state with a relatively high center and relatively low ends. This adapts to the warpage trajectory of the printed circuit board after wave soldering, where the center is high and the ends are low. This ensures that each test probe 4 can reliably contact its corresponding test point, effectively improving the problem of insufficient contact pressure at both ends and enhancing the consistency of test contact and the stability of the test process. Furthermore, by controlling the sliding stroke of the compensation drive 5, the displacement of the compensation block 6 can be adjusted according to the different degrees of thermal bending in the middle of the printed circuit board, allowing the compensation mechanism 2 to adapt to warpage caused by different process conditions.

[0025] In one specific embodiment, a plurality of test probes 4 are arranged along a first direction, which is a left-right direction. For example... Figure 3 and Figure 4 As shown, the compensation mechanism 2 also includes a compensation bracket 7 and a compensation sliding seat 8. The compensation bracket 7 is fixed to the mounting plate 1 and provides overall support for the compensation mechanism 2. The compensation sliding seat 8 is slidably disposed on the compensation bracket 7 along a first direction, so that the compensation sliding seat 8 can change position relative to the mounting part in the first direction.

[0026] like Figure 3As shown, several compensation blocks 6 are disposed on the compensation sliding seat 8 and arranged at intervals along the first direction. Each compensation block 6 is connected to a corresponding test probe 4. When the compensation sliding seat 8 moves along the first direction, the compensation block 6 can directly act on the corresponding test probe 4. By installing the compensation blocks 6 on the compensation sliding seat 8, the compensation blocks 6 can move as a whole as the compensation sliding seat 8 slides along the first direction, while maintaining the relative positional relationship between each compensation block 6.

[0027] The compensation drive component 5 is mounted on the compensation bracket 7 and is connected to the compensation sliding seat 8 in a transmission manner. When the compensation drive component 5 is working, it can drive the compensation sliding seat 8 to slide along the first direction, thereby causing several compensation blocks 6 mounted on the compensation sliding seat 8 to move synchronously. During the sliding process with the compensation sliding seat 8, the compensation blocks 6 adjust the vertical height of the test probe 4 through their connection with the test probe 4.

[0028] By controlling the driving stroke of the compensation drive 5, the sliding amplitude of the compensation slide 8 along the first direction is controllable, so that the several compensation blocks 6 disposed on the compensation slide 8 form a height distribution trajectory that matches the warpage trajectory of the printed circuit board under test while the whole is moving. Thus, the height distribution trajectory of the several test probes 4 can be adapted to the warpage trajectory of the printed circuit board under test by adjusting the compensation blocks 6.

[0029] The compensation block 6, as a functional unit mounted on the compensation sliding seat 8, participates in the overall sliding adjustment under the drive of the compensation driving component 5, thereby achieving unified and coordinated adjustment of the height of multiple test probes 4. By setting several compensation blocks 6 on the compensation sliding seat 8 and sliding the compensation sliding seat 8 relative to the compensation bracket 7 along the first direction, under the driving action of the compensation driving component 5, multiple compensation blocks 6 can be simultaneously driven to adjust their positions, so that the height distribution adjustment effect of the compensation blocks 6 can be effectively transmitted to the corresponding test probes 4, thereby enabling the height distribution trajectory of the test probes 4 to match the warping trajectory of the printed circuit board under test, improving the consistency and stability of the test contact.

[0030] In one specific embodiment, during the test, as the test probe 4 gradually comes into contact with the printed circuit board under test, due to the height difference on the surface of the printed circuit board, test probes 4 at different positions will come into contact with the printed circuit board at different times, thus causing some test probes 4 to bear greater local pressure in the initial contact stage. To reduce this local pressure, the test device is equipped with a pressure reduction mechanism 3 to adjust the vertical position of the test probes 4.

[0031] like Figure 3 and Figure 5As shown, the pressure reduction mechanism 3 includes a pressure reduction drive 9 and several pressure reduction blocks 10, with each pressure reduction block 10 connected to a test probe 4 in a corresponding manner. During the test, by controlling the working state of the pressure reduction drive 9, the pressure reduction blocks 10 are made to slide, thereby causing the corresponding test probe 4 to undergo a displacement change in the vertical direction.

[0032] When the test probe 4, located in a locally higher area, first contacts the printed circuit board, the pressure-reducing drive 9 drives the corresponding pressure-reducing block 10 to slide, causing the test probe 4 to make room in the vertical direction, that is, to slide the test probe 4 away from the printed circuit board in the vertical direction, thereby reducing the contact pressure between the test probe 4 and the printed circuit board. As the test process continues, the remaining test probes 4 gradually contact the printed circuit board, making the force among the test probes 4 tend to be balanced.

[0033] By adjusting the sliding amplitude of different pressure-reducing blocks 10, the height variations of several test probes 4 in the vertical direction are adapted to the warpage of the printed circuit board under test, thus making the height distribution trajectory of the test probes 4 match the warpage trajectory of the printed circuit board under test. The pressure-reducing drive 9 drives the pressure-reducing blocks 10 to slide, allowing the test probes 4 to make vertical clearance according to the warpage of the printed circuit board during contact, thereby reducing the contact pressure of local test probes 4, making the force on multiple test probes 4 more balanced, and improving the stability and reliability of the testing process.

[0034] In one specific embodiment, a plurality of test probes 4 are arranged along a first direction. For example... Figure 3 and Figure 5 As shown, the pressure-reducing mechanism 3 also includes a pressure-reducing bracket 11 and a pressure-reducing sliding seat 12. The pressure-reducing bracket 11 is fixed to the mounting plate 1 and provides mounting support for the pressure-reducing mechanism 3. The pressure-reducing sliding seat 12 is slidably disposed on the pressure-reducing bracket 11 along a first direction, so that the pressure-reducing sliding seat 12 can change position relative to the mounting plate 1 in the first direction.

[0035] like Figure 3 As shown, several pressure-reducing blocks 10 are disposed on the pressure-reducing sliding seat 12 and arranged at intervals along the first direction. Each pressure-reducing block 10 is connected to a corresponding test probe 4. When the pressure-reducing sliding seat 12 moves along the first direction, the pressure-reducing blocks 10 can directly act on the corresponding test probe 4. By installing the pressure-reducing blocks 10 on the pressure-reducing sliding seat 12, the pressure-reducing blocks 10 can move as a whole as the pressure-reducing sliding seat 12 slides along the first direction, while maintaining the relative positional relationship between each pressure-reducing block 10.

[0036] The pressure-reducing drive 9 is mounted on the pressure-reducing bracket 11 and is connected to the pressure-reducing sliding seat 12 in a transmission manner. When the pressure-reducing drive 9 is working, it can drive the pressure-reducing sliding seat 12 to slide along the first direction, thereby causing a plurality of pressure-reducing blocks 10 mounted on the pressure-reducing sliding seat 12 to move synchronously. During the sliding process with the pressure-reducing sliding seat 12, the pressure-reducing blocks 10 adjust the vertical position of the test probe 4 through their connection with the test probe 4.

[0037] By controlling the driving stroke of the pressure-reducing drive 9, the sliding amplitude of the pressure-reducing slide 12 along the first direction is controllable, so that the plurality of pressure-reducing blocks 10 disposed on the pressure-reducing slide 12, while moving as a whole, form a height distribution trajectory that matches the warpage trajectory of the printed circuit board under test. Thus, the height distribution trajectory of the plurality of test probes 4 can be adapted to the warpage trajectory of the printed circuit board under test by adjusting the pressure-reducing blocks 10.

[0038] By setting a pressure relief bracket 11 on the mounting plate 1 and allowing the pressure relief sliding seat 12 to be slidably mounted on the pressure relief bracket 11 in the first direction, multiple pressure relief blocks 10 can be driven to move synchronously under the drive of the pressure relief drive 9, so that the pressure relief blocks 10 form a height distribution that matches the warping trajectory of the printed circuit board under test, thereby effectively adjusting the vertical position of the test probe 4, reducing local contact pressure, and improving the stability of the test process.

[0039] In one implementation, such as Figure 6 , Figure 7 and Figure 8 As shown, the test probe 4 includes a probe body 13, and an upper wing plate 14 and a lower wing plate 15 disposed on the probe body 13. The mounting plate 1 is provided with a through hole 16 and a guide post 17. The probe body 13 is inserted vertically into the through hole 16, allowing the probe body 13 to move vertically relative to the mounting plate 1. The upper wing plate 14 is provided with a guide hole 18. The test probe 4 is fitted onto the guide post 17 through the guide hole 18, so that the test probe 4 is guided and restricted by the guide post 17 during vertical movement, thus achieving guided sliding of the test probe 4.

[0040] like Figure 8 As shown, the mounting plate 1 is located between the upper wing plate 14 and the lower wing plate 15. A buffer spring 19 is provided between the upper wing plate 14 and the mounting plate 1, and a preload spring 20 is provided between the lower wing plate 15 and the mounting plate 1. The buffer spring 19 and the preload spring 20 act on opposite sides of the test probe 4, so that the test probe 4 is not rigidly fixed in the vertical direction, but can float relative to the mounting plate 1 under elastic action.

[0041] When not in contact with the printed circuit board under test, the preload spring 20 applies a preload force to the test probe 4, keeping the test probe 4 in a predetermined initial floating position relative to the mounting plate 1. During the test, when the test probe 4 comes into contact with the printed circuit board under test and is subjected to a reaction force, the test probe 4 generates a vertical floating displacement relative to the mounting plate 1 under the action of the reaction force. The buffer spring 19 buffers and limits this floating displacement process, thereby avoiding instantaneous rigid impact between the test probe 4 and the printed circuit board.

[0042] A pressure sensor is installed between the buffer spring 19 and the upper wing plate 14 to detect the contact pressure experienced by the test probe 4 during its floating process. By acquiring the pressure signal, the floating state of the test probe 4 relative to the mounting plate 1 and its contact with the printed circuit board can be reflected in real time. Specifically, during compensation adjustment, the pressure sensor acquires the minimum pressure among the test probes; during decompression adjustment, the pressure sensor acquires the maximum pressure among the test probes.

[0043] By setting a buffer spring 19 and a preload spring 20 between the test probe 4 and the mounting plate 1, the test probe 4 is made to float relative to the mounting plate 1 in the vertical direction. When it comes into contact with the printed circuit board under test, it can generate an adaptive floating displacement according to the contact reaction force, thereby reducing the impact and local stress concentration caused by rigid contact and improving the stability and reliability of the test process.

[0044] In one specific implementation, such as Figure 6 As shown, the testing device also includes a support rod 21, a connecting rod 22, and an abutment member 23. The bottom end of the support rod 21 is connected to the mounting plate 1, and the top end is provided with an arc-shaped sliding groove 24. The bottom end of the connecting rod 22 is hinged to the upper wing plate 14 of the test probe 4, and the top end of the connecting rod 22 is provided with an abutment member 23, which is used to form an abutment relationship with the compensation block 6 and the pressure reducing block 10 respectively. A limiting shaft 25 is provided in the middle of the connecting rod 22, and the limiting shaft 25 passes through the arc-shaped sliding groove 24, so that the connecting rod 22 is constrained by the trajectory of the arc-shaped sliding groove 24 during the swinging process.

[0045] The compensation block 6 abuts against the bottom of the abutment member 23. When the compensation sliding seat 8 slides, the compensation block 6 slides accordingly. Through the abutment action with the abutment member 23, the abutment member 23 rotates around the hinge point between the limiting shaft 25 and the support rod 21, thereby driving the connecting rod 22 to swing. This causes the end of the connecting rod 22 away from the compensation block 6 to move downward, which in turn drives the upper wing plate 14 hinged to the connecting rod 22 to descend. The upper wing plate 14 further drives the test probe 4 to descend along the direction of the guide post 17. The pressure relief block 10 abuts against the top of the abutment member 23. When the pressure relief block 10 is displaced, it also acts on the connecting rod 22 through the abutment member 23, causing the abutment member 23 to rotate around the hinge point between the limiting shaft 25 and the support rod 21, thereby driving the connecting rod 22 to swing, causing the end of the connecting rod 22 away from the pressure relief block 10 to move upward, thereby driving the upper wing plate 14 hinged to the connecting rod 22 to rise. The upper wing plate 14 further drives the test probe 4 to rise along the direction of the guide post 17.

[0046] Since the upper wing plate 14 is fitted onto the guide post 17 through the guide hole 18, its degree of freedom of motion is limited to vertical sliding along the direction of the guide post 17. When the upper wing plate 14 is hinged to the connecting rod 22, it does not have the degree of freedom to rotate synchronously with the connecting rod 22. To avoid additional rotational constraints on the upper wing plate 14 at the hinge point during the swinging process of the connecting rod 22, an arc-shaped sliding groove 24 is provided on the support rod 21, so that the limiting shaft 25 slides along the arc trajectory during the swinging process of the connecting rod 22. This releases the rotational component generated during the swinging process of the connecting rod 22 through the cooperation of the limiting shaft 25 and the arc-shaped sliding groove 24, so that the swinging motion of the connecting rod 22 can be stably converted into the vertical displacement of the upper wing plate 14, thereby improving the adjustment accuracy and structural reliability of the test probe 4 when adapting to the warping of the printed circuit board.

[0047] By setting up support rod 21, connecting rod 22, abutment 23 and arc-shaped sliding groove 24, the displacement of compensation block 6 and pressure relief block 10 can be stably transmitted to test probe 4 through the connecting rod structure, and converted into vertical floating displacement of test probe 4 under the restriction of guide post 17.

[0048] The center of the arc-shaped sliding groove 24 is set on the side close to the hinge axis of the connecting rod 22 and the upper wing plate 14, so that the movement trajectory of the limiting shaft 25 matches the swing trajectory of the connecting rod 22 around the hinge axis, thereby reducing the lateral constraint force generated during the swing of the connecting rod 22 and improving the stability and reliability of the floating adjustment process of the test probe 4.

[0049] Furthermore, the connecting rod 22 may also include a first connecting rod and a second connecting rod (not shown in the figure). The second connecting rod is sleeved inside the first connecting rod, and the first and second connecting rods are arranged parallel to each other. The second connecting rod is slidably disposed on the first connecting rod along its extension direction. The first connecting rod is located above the second connecting rod. The top end of the first connecting rod is fixedly connected to the abutment member 23, and the bottom end of the first connecting rod slides relative to the top end of the second connecting rod. The bottom end of the second connecting rod is hinged to the upper wing plate 14. A limiting shaft 25 is provided on the outer edge of the bottom end of the first connecting rod, and a limiting hole is provided on the top end of the support rod 21. The limiting shaft 25 passes through the limiting hole to achieve relative hinge between the first connecting rod and the support rod 21. Therefore, when the compensation block 6 or the pressure reducing block 10 drives the abutment member to rotate around the limiting shaft 25, the rotational component generated by the connecting rod 22 during its swing is released through the relative sliding of the first and second connecting rods.

[0050] In one specific implementation, such as Figure 9 As shown, the top surface of the compensation block 6 is set as an arc-shaped structure. When multiple compensation blocks 6 are arranged along the array direction of the test probe 4, the height and curvature of the top surface of each compensation block 6 gradually increase from the middle position towards both sides. Through this setting, the compensation blocks 6 located at different positions exert different degrees of pushing force on the abutment 23 when they abut against the abutment 23.

[0051] like Figure 9 As shown, the bottom surface of the pressure-reducing block 10 is also set as an arc-shaped structure. When multiple pressure-reducing blocks 10 are arranged along the array direction of the test probe 4, the height and curvature of the bottom surface of each pressure-reducing block 10 gradually decrease from the middle position towards both sides. Through this setting, the pressure-reducing blocks 10 located at different positions in the array exert different degrees of pressure on the abutment 23 when they abut against the abutment 23.

[0052] During the test, the compensation block 6 and the pressure relief block 10 form line contact or surface contact with the corresponding abutment 23 through their arc-shaped surfaces, and under the action of the linkage structure, the height difference at different positions is converted into differential adjustment of the floating state of the test probe 4. By gradually varying the curvature of the top surface of the compensation block 6, the compensation displacement of the test probe 4 array gradually increases from the center to both sides. This allows the height distribution trajectory of the test probes 4 to match the warpage trajectory of the printed circuit board under test (PCB), compensating for and balancing the contact pressure between the test probes 4 and the PCB. Similarly, by gradually varying the curvature of the bottom surface of the pressure relief block 10, the pressure relief displacement of the test probe 4 array gradually decreases from the center to both sides. This also allows the height distribution trajectory of the test probes 4 to match the warpage trajectory of the PCB, reducing and balancing the contact pressure between the test probes 4 and the PCB. This improves the adaptability of the test probe 4 array to warped PCBs, enhancing the overall stability and reliability of the test. Furthermore, this structural design allows the test probe 4 array to form a height and pressure distribution adapted to the warpage trend of the PCB during overall adjustment, improving contact consistency during simultaneous multi-point testing.

[0053] In one specific implementation, such as Figure 3 As shown, the abutment member 23 includes a compensation member 26 and a pressure-reducing member 27 connected to each other. The compensation member 26 and the pressure-reducing member 27 are integrally formed or fixedly connected. The compensation member 26 and the pressure-reducing member 27 are staggered in the horizontal direction, with the compensation member 26 located in front of the pressure-reducing member 27 and the pressure-reducing member 27 located behind the compensation member 26. The compensation member 26 corresponds to the compensation block 6 provided on the front side, and the pressure-reducing member 27 corresponds to the pressure-reducing block 10 provided on the rear side, so that the compensation block 6 and the pressure-reducing block 10 act on different parts of the abutment member 23 respectively.

[0054] like Figure 9 As shown, the top surface of the compensation block 6 abuts against the bottom surface of the compensation member 26. When the compensation block 6 slides with the compensation sliding seat 8, the force is transmitted to the abutment member 23 through the compensation member 26. The bottom surface of the pressure reducing block 10 abuts against the top surface of the pressure reducing member 27. When the pressure reducing block 10 is displaced, the force is transmitted to the abutment member 23 through the pressure reducing member 27. Because the compensation member 26 and the pressure reducing member 27 are staggered in the front-rear direction, the compensation block 6 and the pressure reducing block 10 are separated from each other in spatial position, avoiding structural interference between them in the same vertical space.

[0055] like Figure 9As shown, the compensation block 6 and the pressure-reducing block 10, which abut against the same abutment 23, are located on the left and right sides of the abutment 23, respectively, and correspond to the positions of the compensation block 26 and the pressure-reducing block 27 in the front-back direction. This results in a spatially staggered and left-right arrangement of the compensation and pressure-reducing adjustments. This structural arrangement allows the forces exerted by the compensation block 6 and the pressure-reducing block 10 on the abutment 23 to be transmitted to the connecting rod structure via the compensation block 26 and the pressure-reducing block 27, respectively, and further act on the upper wing plate 14, thereby achieving stable adjustment of the floating state of the test probe 4.

[0056] By setting the abutment 23 to include a compensation component 26 and a pressure-reducing component 27 arranged in a staggered manner, and making the compensation block 6 and the pressure-reducing block 10 abut against the corresponding compensation component 26 and pressure-reducing component 27 respectively, structural conflicts between compensation adjustment and pressure reduction adjustment in the same spatial position are avoided. At the same time, by combining the staggered arrangement and the left and right separation, the different adjustment actions are made independent of each other on the transmission path, thereby improving the compactness and reliability of the floating adjustment structure of the test probe 4.

[0057] In one specific implementation, such as Figure 4 As shown, the compensation mechanism 2 also includes a compensation transmission wheel 28, a compensation transmission bracket 29, and a compensation transmission belt 30. The compensation drive component 5 is a compensation motor. The compensation transmission bracket 29 is mounted on the compensation bracket 7, and the compensation transmission wheel 28 is rotatably mounted on the compensation transmission bracket 29. The compensation transmission wheel 28 includes a compensation pulley 31 and a compensation rack. The compensation motor is connected to the compensation pulley 31 via the compensation transmission belt 30 to drive the compensation gear 32 to rotate. A compensation rack is provided on the compensation sliding seat 8, and the compensation rack is arranged along a first direction. The compensation gear 32 is connected to the compensation rack, thereby converting the rotational motion of the compensation gear 32 into the linear sliding motion of the compensation sliding seat 8 along the first direction. The compensation sliding seat 8 is provided with a compensation slider 39, and the compensation bracket 7 is provided with a compensation groove 40. The compensation slider 39 is slidably disposed within the compensation groove 40. The compensation transmission belt 30 is a synchronous belt, and the compensation pulley 31 is a synchronous pulley.

[0058] like Figure 5As shown, the pressure-reducing mechanism 3 also includes a pressure-reducing transmission wheel 33, a pressure-reducing transmission bracket 34, and a pressure-reducing transmission belt 35. The pressure-reducing drive component 9 is a pressure-reducing motor. The pressure-reducing transmission bracket 34 is mounted on the pressure-reducing bracket 11, and the pressure-reducing transmission wheel 33 is rotatably mounted on the pressure-reducing transmission bracket 34. The pressure-reducing transmission wheel 33 includes a pressure-reducing pulley 36 and a pressure-reducing rack. The pressure-reducing motor is connected to the pressure-reducing pulley 36 via the pressure-reducing transmission belt 35 to drive the pressure-reducing gear 37 to rotate. A pressure-reducing rack is provided on the pressure-reducing sliding seat 12, and the pressure-reducing rack is arranged along a first direction. The pressure-reducing gear 37 is connected to the pressure-reducing rack, thereby converting the rotational motion of the pressure-reducing gear 37 into linear sliding of the pressure-reducing sliding seat 12 along the first direction. The pressure-reducing sliding seat 12 is provided with a pressure-reducing slider 41, and the pressure-reducing bracket 11 is provided with a pressure-reducing groove 42. The pressure-reducing slider 41 is slidably disposed in the pressure-reducing groove 42. The pressure-reducing transmission belt 35 is a synchronous belt, and the pressure-reducing pulley 36 is a synchronous pulley.

[0059] like Figure 6 As shown, a support spring 38 is provided between the abutment member 23 and the mounting plate 1, enabling the abutment member 23 to have elastic displacement capability when subjected to the compensation block 6 or the pressure reducing block 10. The preload spring 20 has a greater elastic force than the buffer spring 19, thus, during the floating adjustment of the test probe 4, the preload spring 20 preferentially provides support force, while the buffer spring 19 absorbs impacts and minor vibrations during the displacement process. By providing a support spring 38 between the abutment member 23 and the mounting plate 1, and ensuring that the elastic force of the preload spring 20 is greater than that of the buffer spring 19, sufficient contact force is ensured for the test probe 4, while the buffer spring 19 can absorb impacts and vibrations during the adjustment and contact processes, thereby improving the stability and service life of the testing device during multiple tests.

[0060] The bottom surface of the compensation component 26 that abuts against the compensation block 6 is set with an arc-shaped structure, and the top surface of the pressure-reducing component 27 that abuts against the pressure-reducing block 10 is also set with an arc-shaped structure. When the compensation block 6 or the pressure-reducing block 10 is displaced, a smooth contact transmission is formed between the arc-shaped contact surface and the corresponding compensation component 26 or pressure-reducing component 27, so that the force can be evenly applied to the abutment component 23, avoiding jamming or wear caused by local stress concentration, improving the smoothness of the adjustment process and the structural reliability, and further transmitting the force to the test probe 4 through the linkage structure to achieve stable adjustment of the floating state of the test probe 4.

[0061] The compensation mechanism 2 and the pressure reduction mechanism 3 are precisely driven by independent motors, belt drives, and gear and rack transmission structures, respectively. Combined with the elastic support and arc-shaped contact surface design of the abutment member 23, the test probe 4 has good adjustment accuracy and structural reliability when adapting to the warping of the printed circuit board. In addition, by setting transmission structures consisting of motors, belt drives, gears, and racks in the compensation mechanism 2 and the pressure reduction mechanism 3, the rotational motion of the motor is stably converted into linear motion of the compensation sliding seat 8 and the pressure reduction sliding seat 12 along the first direction. This gives the displacement adjustment of the compensation block 6 and the pressure reduction block 10 high transmission efficiency and control accuracy, thereby improving the controllability of the floating adjustment of the test probe 4.

[0062] Through the coordinated arrangement of the compensation mechanism 2, the pressure reduction mechanism 3, and the contacting part 23, the test probe 4 can achieve precise and stable floating adjustment when adapting to the warping or height difference of the printed circuit board, thereby improving the contact consistency and test reliability when testing multiple points simultaneously.

[0063] Example 2 This embodiment provides a contact pressure adjustment method, such as Figure 10 As shown, the contact pressure adjustment method is implemented using the test apparatus of Example 1. The contact pressure adjustment method includes: S101, Obtain the contact pressure between the test probe 4 and the printed circuit board under test during the test.

[0064] During the test, test probe 4 is brought into contact with the printed circuit board (PCB) under test (PCB). A pressure sensor installed in the testing device acquires the contact pressure between test probe 4 and the PCB during the test. Specifically, as test probe 4 contacts the PCB and the test is performed, the pressure sensor detects the force acting on test probe 4. The pressure sensor converts the detected force signal into a corresponding pressure signal and outputs this pressure signal as the contact pressure between test probe 4 and the PCB during the test, which is then used for subsequent height adjustment. In this way, the actual contact pressure of test probe 4 during the test can be acquired in real-time or periodically.

[0065] S102, in response to the contact pressure between the test probe 4 and the printed circuit board under test being less than the first pressure threshold, the height of the test probe 4 is reduced by the compensation mechanism 2 to increase the contact pressure between the test probe 4 and the printed circuit board under test, while adapting the height distribution trajectory of the test probes to the warping trajectory of the printed circuit board under test; in response to the contact pressure between the test probe 4 and the printed circuit board under test being greater than the second pressure threshold, the height of the test probe 4 is increased by the pressure reduction mechanism 3 to reduce the contact pressure between the test probe 4 and the printed circuit board under test, while adapting the height distribution trajectory of the test probe 4 to the warping trajectory of the printed circuit board under test.

[0066] After acquiring the contact pressure between the test probe 4 and the printed circuit board under test (PCB), the acquired contact pressure is compared with a preset first pressure threshold and a second pressure threshold. When the contact pressure between the test probe 4 and the PCB is detected to be less than the first pressure threshold, the compensation mechanism 2 is activated. The compensation mechanism 2 drives the test probe 4 to move closer to the PCB, thereby reducing the height of the test probe 4 and increasing the contact pressure between the test probe 4 and the PCB. Simultaneously, the heights of multiple test probes 4 are coordinated and adjusted to match the height distribution trajectory of the test probes 4 with the warpage trajectory of the PCB. When the contact pressure between the test probe 4 and the PCB is detected to be greater than the second pressure threshold, the pressure reduction mechanism 3 is activated. The pressure reduction mechanism 3 drives the test probe 4 to move away from the PCB, thereby increasing the height of the test probe 4 and reducing the contact pressure between the test probe 4 and the PCB. Simultaneously, the heights of multiple test probes 4 are coordinated and adjusted to match the height distribution trajectory of the PCB.

[0067] S103, the height of the test probe 4 is adjusted by the compensation mechanism 2 and the pressure reduction mechanism 3, and the contact pressure between the test probe 4 and the printed circuit board under test is controlled between the first pressure threshold and the second pressure threshold.

[0068] During the test, based on the changes in contact pressure between the test probe 4 and the printed circuit board under test, the compensation mechanism 2 and the pressure reduction mechanism 3 are controlled to adjust the height of the test probe 4 according to the actual situation. This ensures that the contact pressure between the test probe 4 and the printed circuit board under test is always maintained between the first pressure threshold and the second pressure threshold, thereby ensuring contact reliability while avoiding affecting test accuracy or damaging the printed circuit board due to excessive or insufficient pressure. The first and second pressure thresholds are determined based on actual experiments or empirical values.

[0069] The testing apparatus provided in this application has been described in detail above. Specific examples have been used to illustrate the principles and implementation methods of this application. The descriptions of the embodiments above are merely for the purpose of helping to understand the method and core ideas of this application. It should be noted that those skilled in the art can make various improvements and modifications to this application without departing from its principles, and these improvements and modifications also fall within the protection scope of this application.

Claims

1. A testing apparatus for testing printed circuit boards, characterized in that, The device includes a mounting plate (1), a compensation mechanism (2), a pressure reduction mechanism (3), and several test probes (4). The test probes (4) are slidably disposed on the mounting plate (1) in the vertical direction. The compensation mechanism (2) is connected to the test probes (4) and is used to adjust the vertical position of the test probes (4) so ​​that the height distribution trajectory of the test probes (4) matches the warpage trajectory of the printed circuit board under test, thereby increasing the pressure between the test probes (4) and the printed circuit board under test. The pressure reduction mechanism (3) is connected to the test probes (4) and is used to adjust the vertical position of the test probes (4) so ​​that the height distribution trajectory of the test probes (4) matches the warpage trajectory of the printed circuit board under test, thereby reducing the pressure between the test probes (4) and the printed circuit board under test.

2. The testing apparatus according to claim 1, characterized in that: The compensation mechanism (2) includes a compensation drive (5), a compensation bracket (7), a compensation sliding seat (8), and a plurality of compensation blocks (6). The compensation bracket (7) is disposed on the mounting plate (1), the compensation drive (5) is disposed on the compensation bracket (7), the plurality of test probes (4) are arranged in a first direction, the compensation sliding seat (8) is slidably disposed on the compensation bracket (7) along the first direction, and the plurality of compensation blocks (6) are disposed on the compensation sliding seat (8) along the first direction. The compensation blocks (6) are connected to the test probes (4) one by one. The compensation drive (5) drives the compensation blocks (6) to slide to adjust the vertical position of the test probes (4) connected to the compensation blocks (6), so that the height distribution trajectory of the plurality of compensation blocks (6) matches the warpage trajectory of the printed circuit board under test, thereby making the height distribution trajectory of the plurality of test probes (4) match the warpage trajectory of the printed circuit board under test.

3. The testing apparatus according to claim 2, characterized in that: The top surface of the compensation block (6) is arc-shaped. Among the several compensation blocks (6), the top height and arc of the compensation block (6) increase from the middle to both sides.

4. The testing apparatus according to claim 2, characterized in that: The pressure reduction mechanism (3) includes a pressure reduction drive (9), a pressure reduction bracket (11), a pressure reduction sliding seat (12), and a plurality of pressure reduction blocks (10). The pressure reduction bracket (11) is disposed on the mounting plate (1), the pressure reduction drive (9) is disposed on the pressure reduction bracket (11), the pressure reduction sliding seat (12) is slidably disposed on the pressure reduction bracket (11) along the first direction, and a plurality of pressure reduction blocks (10) are disposed on the pressure reduction sliding seat (12) along the first direction. The pressure reduction blocks (10) are connected one-to-one with the test probes (4). The pressure reduction drive (9) drives the pressure reduction blocks (10) to slide to adjust the vertical position of the test probes (4) connected to the pressure reduction blocks (10), so that the height distribution trajectory of the plurality of pressure reduction blocks (10) is adapted to the warping trajectory of the printed circuit board under test, thereby adapting the height distribution trajectory of the plurality of test probes (4) to the warping trajectory of the printed circuit board under test.

5. The testing apparatus according to claim 4, characterized in that: The bottom surface of the pressure relief block (10) is arc-shaped. Among the several pressure relief blocks (10), the bottom height and arc of the pressure relief block (10) decrease from the middle to both sides.

6. The testing apparatus according to claim 4, characterized in that: The test probe (4) has a probe body (13) and an upper wing plate (14) and a lower wing plate (15) disposed on the probe body (13). The mounting plate (1) is provided with a through hole (16) and a guide post (17). The probe body (13) passes through the through hole (16). The upper wing plate (14) is provided with a guide hole (18). The test probe (4) is sleeved on the guide post (17) through the guide hole (18). The mounting plate (1) is located between the upper wing plate (14) and the lower wing plate (15). A buffer spring (19) is provided between the upper wing plate (14) and the mounting plate (1), and a preload spring (20) is provided between the lower wing plate (15) and the mounting plate (1). A pressure sensor is provided between the buffer spring (19) and the upper wing plate (14). The elastic force of the preload spring (20) is greater than that of the buffer spring (19).

7. The testing apparatus according to claim 6, characterized in that: The testing device also includes a support rod (21), a connecting rod (22), and abutment (23). One end of the support rod (21) is connected to the mounting plate (1), and the other end of the support rod (21) is provided with an arc-shaped sliding groove (24). One end of the connecting rod (22) is hinged to the upper wing plate (14). The abutment (23) is provided at the other end of the connecting rod (22). A limiting shaft (25) is provided in the middle of the connecting rod (22). The limiting shaft (25) passes through the arc-shaped sliding groove (24). The compensation block (6) abuts against the bottom of the abutment (23). The pressure relief block (10) abuts against the top of the abutment (23). The center of the arc-shaped sliding groove (24) is located near the hinge shaft between the connecting rod (22) and the upper wing plate (14).

8. The testing apparatus according to claim 7, characterized in that: The abutment (23) includes a compensation member (26) and a pressure-reducing member (27) connected to each other. The top surface of the compensation block (6) abuts against the bottom surface of the compensation member (26), and the bottom surface of the pressure-reducing block (10) abuts against the bottom surface of the pressure-reducing member (27). In the vertical direction, the pressure-reducing member (27) is located above the compensation member (26), and the abutment (23) is disposed between the pressure-reducing member (27) and the compensation member (26). The compensation block (6) and the pressure-reducing block (10) abutting against the same abutment (23) are located on the left and right sides of the abutment (23), respectively.

9. The testing apparatus according to claim 7, characterized in that, The compensation mechanism (2) further includes a compensation transmission wheel (28), a compensation transmission bracket (29), and a compensation transmission belt (30). The compensation transmission bracket (29) is disposed on the compensation bracket (7). The compensation transmission wheel (28) is rotatably disposed on the compensation transmission bracket (29). The compensation transmission wheel (28) includes a compensation pulley (31) and a compensation gear (32) connected together. The compensation drive member (5) is connected to the compensation pulley (31) via the compensation transmission belt (30). The compensation sliding seat (8) is provided with a compensation rack. The compensation rack is arranged along the first direction. The compensation gear (32) is connected to the compensation rack. The compensation drive member (5) is a compensation motor. The compensation sliding seat (8) is provided with a compensation slider (39), the compensation bracket (7) is provided with a compensation groove (40), and the compensation slider (39) is slidably disposed in the compensation groove (40); The pressure reduction mechanism (3) further includes a pressure reduction transmission wheel (33), a pressure reduction transmission bracket (34), and a pressure reduction transmission belt (35). The pressure reduction transmission bracket (34) is disposed on the pressure reduction bracket (11). The pressure reduction transmission wheel (33) is rotatably disposed on the pressure reduction transmission bracket (34). The pressure reduction transmission wheel (33) includes a pressure reduction pulley (36) and a pressure reduction gear (37) connected together. The pressure reduction drive (9) is connected to the pressure reduction pulley (36) via the pressure reduction transmission belt (35). The pressure reduction sliding seat (12) is provided with a pressure reduction rack. The pressure reduction rack is arranged along the first direction. The pressure reduction gear (37) is connected to the pressure reduction rack. The pressure reduction drive (9) is a pressure reduction motor. The pressure-reducing sliding seat (12) is provided with a pressure-reducing slider (41), and the pressure-reducing bracket (11) is provided with a pressure-reducing groove (42). The pressure-reducing slider (41) is slidably disposed in the pressure-reducing groove (42).

10. A method for adjusting the contact pressure using the testing apparatus as described in any one of claims 1-9, characterized in that, Obtain the contact pressure between the test probe (4) and the printed circuit board under test during the test process; In response to the contact pressure between the test probe (4) and the printed circuit board under test being less than the first pressure threshold, the height of the test probe (4) is reduced by the compensation mechanism (2) to increase the contact pressure between the test probe (4) and the printed circuit board under test, while making the height distribution trajectory of several test probes match the warping trajectory of the printed circuit board under test. When the contact pressure between the test probe (4) and the printed circuit board under test is greater than the second pressure threshold, the height of the test probe (4) is increased by the pressure reduction mechanism (3) to reduce the contact pressure between the test probe (4) and the printed circuit board under test, and at the same time, the height distribution trajectory of several test probes (4) is adapted to the warping trajectory of the printed circuit board under test. The height of the test probe (4) is adjusted by the compensation mechanism (2) and the pressure reduction mechanism (3) to control the contact pressure between the test probe (4) and the printed circuit board under test between the first pressure threshold and the second pressure threshold.

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