Electronic device and middle frame structure of electronic device, manufacturing method

Abstract

This application provides an electronic device and its mid-frame structure and manufacturing method, relating to the field of communication equipment technology. By making openings in the edge of the mid-frame and correspondingly setting capacitive sensors, the electronic device can have touch or grip detection capabilities on its side, thereby improving the accuracy of touch or grip detection.

Description

Technical Field

[0001] This invention relates to the field of communication equipment technology, and in particular to an electronic device, its mid-frame structure, and a manufacturing method. Background Technology

[0002] Effectively detecting the state of a user's touch on an electronic device can provide a better user experience in some usage scenarios, such as determining the user's grip on the device based on the state of touch. However, current technologies rely solely on gravity sensors and touchscreens to detect the state of touch, resulting in relatively low accuracy. Summary of the Invention

[0003] This invention provides an electronic device, a mid-frame structure for the electronic device, and a manufacturing method thereof. By making openings in the edge of the mid-frame and correspondingly setting capacitive sensors, the electronic device can have touch or grip detection capabilities on its side, thereby improving the accuracy of touch or grip detection.

[0004] In a first aspect, this application provides a mid-frame structure, the mid-frame structure comprising:

[0005] A metal frame, including a border, on which one or more through holes are provided;

[0006] The capacitive sensing electrode is located on the first side of the frame, which is the side that faces away from the appearance of the frame; the position of the capacitive sensing electrode corresponds to the position of the through hole.

[0007] In this embodiment, since a capacitive sensing electrode and a through hole are provided on the mid-frame, the capacitive sensing electrode can send a capacitive signal, which can pass through the through hole to reach the outer surface of the frame, and sense whether the frame at the location of the through hole has been touched or held, so that the side of the electronic device has the ability to detect touch or hold, thereby improving the accuracy of touch or hold detection of the electronic device.

[0008] Furthermore, the cost of setting capacitive sensing electrodes and opening through holes in this embodiment is low, and the opening through holes has little impact on the rigidity and durability of electronic devices.

[0009] Furthermore, since the capacitive sensing electrodes are located on the first side of the frame, they can be modularly deployed inside the electronic device, thereby enabling the deployment of touch or grip detection capabilities over a wider range on the side of the electronic device at a low cost.

[0010] Optionally, the mid-frame structure also includes:

[0011] One or more conductive structures, wherein the conductive structures are at least partially located within the through hole and are arranged along the depth direction of the through hole.

[0012] In this embodiment, the conductive structure can enhance the capacitive signal, improving the accuracy and stability of grip or touch detection.

[0013] Optionally, the through hole is filled with a second insulating material, which is placed between the frame and the conductive structure, so that the conductive structure is electrically insulated from the frame.

[0014] In this embodiment, the second insulating material can support conductivity, preventing the capacitive sensing electrode from contacting the middle frame and achieving electrical insulation. Furthermore, the second insulating material can also dampen vibrations, improving the stability of the electronic device mechanism.

[0015] Optionally, the metal frame is filled with a first insulating material, which is placed between the metal frame and the capacitive sensing electrode; and the capacitive sensing electrode is electrically insulated from the metal frame.

[0016] In this embodiment, the first insulating material can serve to support the capacitive sensing electrode. Furthermore, the first insulating material can also serve to dampen vibrations, improving the stability of the electronic device mechanism.

[0017] Optionally, the conductive structure includes a first end face and a second end face opposite to the first end face; wherein the first end face is located at the end where the capacitive sensing electrode is located, and the first end face corresponds to the capacitive sensing electrode;

[0018] The first end face is spaced apart from the capacitive sensing electrode, or the first end face is electrically connected to the capacitive sensing electrode.

[0019] In this embodiment, the first end face and the capacitive sensing electrode are spaced apart to form an equivalent capacitance, which further enhances the capacitance signal reaching the outer surface of the frame, and the spaced arrangement can avoid wear on the capacitive sensing electrode; the first end face and the capacitive sensing electrode are electrically connected to further enhance the capacitance signal and further improve the detection accuracy.

[0020] Optionally, the second end face forms the outer surface of the frame. The second end face can be directly touched or held, enabling better detection of whether the outer surface of the frame is touched or held.

[0021] Optionally, the second end face is covered with a second insulating material. This improves the aesthetic design of the frame and also facilitates waterproofing.

[0022] Optionally, the second end face is spaced apart from the outer surface of the frame within the through hole. With the second end face covered by the second insulating material, the conductive structure is confined within the through hole and spaced apart from the outer surface, ensuring that the conductive structure does not extend beyond the outer surface of the frame and is covered by the second insulating material. This achieves a flat design for the side frame while also being aesthetically pleasing and waterproof.

[0023] Optionally, the shape of the second end face matches the shape of the cross-section of the through hole.

[0024] Optionally, the cross-section of the through hole is rectangular.

[0025] Optionally, the shorter side of the rectangle is in the range of 1mm to 3mm, and the longer side is in the range of 3mm to 15mm.

[0026] In this embodiment, the through hole is rectangular, which can maintain the rigidity of the middle frame structure as much as possible, facilitate the arrangement of capacitive sensing electrodes, and also facilitate the design of the appearance.

[0027] Optionally, the capacitive sensing electrode includes multiple sensing electrodes, the shape of which matches the shape of the cross-section of the through hole.

[0028] In this embodiment, the complexity of the structure is simplified, the manufacturing process is simplified, and costs are saved.

[0029] Optionally, the first insulating material and the second insulating material may be made of the same material, or the first insulating material and the second insulating material may be made of different materials.

[0030] In this embodiment, the first insulating material and the second insulating material are made of the same material, which simplifies the process; the first insulating material and the second insulating material are made of different materials, so that the exposed second insulating material can be made of a material with properties such as sweat resistance, light opacity, impact resistance, and dimensional stability, while the non-exposed first insulating material can be made of a lower-cost material, saving costs and ensuring that the electronic device maintains good quality.

[0031] Optionally, the mid-frame structure also includes:

[0032] Flexible circuit board, with capacitive sensing electrodes disposed on the flexible circuit board;

[0033] The first insulating material is used to support the flexible circuit board.

[0034] In this embodiment, the flexible circuit board is easy to lay out in irregular spaces, and it is convenient to continuously lay out capacitive sensing electrodes along the frame.

[0035] Optionally, the mid-frame structure also includes:

[0036] The support component is fixedly connected to the metal frame and abuts against the flexible circuit board.

[0037] In this embodiment, the support component fixedly connected to the middle frame abuts against the flexible circuit board, which can further increase the stability of the flexible circuit board.

[0038] Optionally, the support components include:

[0039] The supporting structure is fixedly connected to the metal frame.

[0040] A flexible connector is located between the support structure and the flexible circuit board, and the support structure abuts against the flexible circuit board through the flexible connector.

[0041] In this embodiment, the flexible connector is elastic and can better fix the circuit board under the pressure of contact, further increasing the stability of the circuit board.

[0042] Optionally, the frame includes a top frame, a bottom frame, a first side frame, and a second side frame. One or more of the top frame, bottom frame, first side frame, and second side frame have multiple through holes. Each of the multiple through holes is provided with one or more capacitive sensing electrodes. The one or more capacitive sensing electrodes are spaced apart on the same flexible circuit board.

[0043] In this embodiment, the complexity of the structure can be simplified, the manufacturing process can be streamlined, and costs can be saved.

[0044] Optionally, multiple through holes are located at:

[0045] The non-antenna gap location on the top edge;

[0046] The non-antenna gap area on the bottom edge;

[0047] The non-antenna gap position of the first side frame relative to the bottom frame and near the top frame, and the non-antenna gap position relative to the top frame and near the bottom frame;

[0048] The non-antenna gap position of the second side frame relative to the bottom frame and near the top frame, and the non-antenna gap position relative to the top frame and near the bottom frame.

[0049] In a second aspect, this application provides a method for manufacturing a mid-frame structure, the method comprising:

[0050] Manufacture a metal frame; the metal frame includes a border, on which one or more through holes are provided;

[0051] Install capacitive sensing electrodes; the capacitive sensing electrodes are arranged on the first side of the frame, which is the side opposite to the appearance surface of the frame; the position of the capacitive sensing electrodes corresponds to the position of the through hole.

[0052] Thirdly, this application provides an electronic device, including the aforementioned mid-frame structure, and a display screen and a back cover located on opposite sides of the mid-frame structure.

[0053] Optionally, the frame includes a top frame, a bottom frame, a first side frame, and a second side frame, and the frame includes a frame antenna; the frame antenna is located at a position of the first side frame relative to the bottom frame near the top frame, and at a position of the second side frame relative to the bottom frame near the top frame; one or more through holes are provided at the position of the first side frame relative to the top frame near the bottom frame, and one or more through holes are provided at the position of the second side frame relative to the top frame near the bottom frame.

[0054] Optionally, the electronic device further includes a chip coupled to the capacitive sensing electrode; the chip is used to determine the gripping state of the electronic device based on the received capacitance signal from the capacitive sensing electrode.

[0055] It is understandable that the manufacturing method of the second aspect and the electronic equipment of the third aspect have the same features as the first aspect, and therefore have the same technical effects, which will not be elaborated here. Attached Figure Description

[0056] To more clearly illustrate the technical solutions in the embodiments of this application, the accompanying drawings used in the embodiments of this application will be described below.

[0057] Figure 1 A schematic diagram of the structure of an electronic device provided in an embodiment of this application;

[0058] Figure 2 A schematic diagram of the frame structure of an electronic device provided in an embodiment of this application;

[0059] Figure 3 for Figure 2 A partial cross-sectional schematic diagram of an electronic device cut along the AA axis.

[0060] Figure 4 for Figure 3 A schematic diagram of the structure of the middle frame;

[0061] Figure 5 for Figure 3 Another structural diagram of the middle frame;

[0062] Figure 6 A schematic diagram of the mid-frame structure of an electronic device provided in an embodiment of this application;

[0063] Figure 7 For along Figure 6 A partial cross-sectional schematic diagram of an electronic device cut by AA.

[0064] Figure 8 For along Figure 6 A schematic diagram of another cross-section of an electronic device cut by AA.

[0065] Figure 9 For along Figure 6 A schematic diagram of another cross-section of an electronic device cut by AA.

[0066] Figure 10 For along Figure 6 A schematic diagram of another cross-section of an electronic device cut by AA.

[0067] Figure 11 For along Figure 6 A schematic diagram of another cross-section of an electronic device cut by AA.

[0068] Figure 12 For along Figure 6 A schematic diagram of another cross-section of an electronic device cut by AA.

[0069] Figure 13 For along Figure 6 A schematic diagram of another cross-section of an electronic device cut by AA.

[0070] Figure 14 for Figure 2 A side view of an electronic device;

[0071] Figure 15 for Figure 2 Another side view of an electronic device;

[0072] Figure 16 A front view of a circuit board and a capacitive sensing electrode provided in an embodiment of this application;

[0073] Figure 17 This is a schematic flowchart illustrating a method for manufacturing a mid-frame structure according to an embodiment of this application.

[0074] In the diagram, 100-cover plate, 200-display screen, 300-printed circuit board, 400-middle frame, 410-through hole, 420-conductive structure, 402-partial structure, 500-back cover, 600-frame, 620-first side frame, 621-first radiator, 622-second radiator, 630-bottom frame, 640-second side frame, 650-top frame, 700-cavity, 800-groove, 910-capacitive sensing electrode, 920-circuit board, 930-support structure, 940-flexible connector. Detailed Implementation

[0075] The embodiments of the present invention will now be described with reference to the accompanying drawings.

[0076] In the description of the embodiments of this application, unless otherwise stated, " / " means "or", for example, A / B can mean A or B; "and / or" in the text is merely a description of the relationship between related objects, indicating that there can be three relationships, for example, A and / or B can mean: A exists alone, A and B exist simultaneously, and B exists alone. In addition, in the description of the embodiments of this application, "multiple" means two or more.

[0077] Hereinafter, the terms "first" and "second" are used for descriptive purposes only and should not be construed as implying or suggesting relative importance or implicitly indicating the number of indicated technical features. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature, and in the description of the embodiments of this application, unless otherwise stated, "multiple" means two or more.

[0078] Figure 1 This is a schematic diagram of the structure of an electronic device provided in an embodiment of this application. In this embodiment, a mobile phone is used as an example for illustration. Figure 1 As shown, in one embodiment, the electronic device includes a cover 100, a display / module 200, a printed circuit board (PCB) 300, a middle frame 400, and a rear cover 500. It should be understood that in some embodiments, the cover 100 may be a glass cover, or it may be replaced with a cover made of other materials, such as an ultra-thin glass cover, a polyethylene terephthalate (PET) cover, etc. In one embodiment, the cover 100, display 200, middle frame 400, and rear cover 500 can all be considered as part of the housing.

[0079] The cover plate 100 can be set close to the display screen 200, and can be mainly used to protect the display screen 200 from dust.

[0080] In one embodiment, the display screen 200 may include a liquid crystal display (LCD), a light emitting diode (LED) display panel, or an organic light-emitting diode (OLED) display panel, etc., and this application does not limit it.

[0081] The 400mm mid-frame primarily serves to support the entire machine. Figure 1 The diagram shows PCB 300 positioned between the mid-frame 400 and the back cover 500. It should be understood that in one embodiment, PCB 300 may also be positioned between the mid-frame 400 and the display screen 200; this application does not impose any limitations on this. PCB 300 may be made of flame-retardant material (FR-4) dielectric substrate, Rogers dielectric substrate, or a hybrid dielectric substrate of Rogers and FR-4, etc. Here, FR-4 is a designation for a flame-retardant material grade, and Rogers dielectric substrate is a high-frequency board. Electronic components, such as radio frequency chips, are mounted on PCB 300.

[0082] In one embodiment, a metal layer may be disposed on the PCB 300. This metal layer can be used for grounding electronic components carried on the PCB 300, or for grounding other components such as bracket antennas, frame antennas, etc. This metal layer may be referred to as a ground plane, grounding plate, or grounding layer. In one embodiment, this metal layer can be formed by etching metal onto the surface of any dielectric substrate in the PCB 300. In one embodiment, the grounding metal layer may be disposed on the side of the PCB 300 near the middle frame 400. In one embodiment, the edge of the printed circuit board PCB 300 can be considered as the edge of its grounding layer. In one embodiment, the metal middle frame 400 can also be used for grounding the aforementioned components. Electronic devices may also have other ground planes / grounding plates, as previously described, and will not be repeated here.

[0083] Electronic devices may also include batteries ( Figure 1 (Not shown in the image). The battery may be located between the middle frame 400 and the back cover 500, or between the middle frame 400 and the display screen 200; this application does not limit this. In some embodiments, the PCB 300 is divided into a motherboard and a daughterboard, and the battery may be located between the motherboard and the daughterboard. Specifically, the motherboard may be located between the middle frame 400 and the upper edge of the battery, and the daughterboard may be located between the middle frame 400 and the lower edge of the battery.

[0084] The electronic device may also include a bezel 600, which may be formed of a conductive material such as metal. The bezel 600 may be disposed between the display screen 200 and the back cover 500 and extend circumferentially around the periphery of the electronic device. The bezel 600 may have four sides surrounding the display screen 200 to help secure the display screen 200. In one implementation, the bezel 600 made of metal can be directly used as the metal bezel of the electronic device, forming a metal bezel appearance suitable for industrial design (ID).

[0085] The mid-frame 400 may include a border 600. The mid-frame 400, including the border 600, is a single unit that supports the electronic components within the device. The cover plate 100 and back cover 500 respectively cover the upper and lower edges of the border 600 to form the housing of the electronic device. Alternatively, the border 600 may not be considered part of the mid-frame 400. In one embodiment, the border 600 may be connected to and integrally formed with the mid-frame 400. In another embodiment, the border 600 may include inwardly extending protrusions for connection to the mid-frame 400, for example, via spring clips, screws, welding, etc. In one embodiment, the cover plate 100, back cover 500, border 600, and mid-frame 400 may be collectively referred to as the housing of the electronic device. It should be understood that "outer shell or housing" can be used to refer to part or all of any one of the cover plate 100, back cover 500, frame 600 or middle frame 400, or to part or all of any combination of the cover plate 100, back cover 500, frame 600 or middle frame 400.

[0086] The back cover 500 can be a back cover made of metal; it can also be a back cover made of non-conductive materials, such as glass back covers, plastic back covers, and other non-metallic back covers; or it can be a back cover made of both conductive and non-conductive materials.

[0087] In one embodiment, the frame 600 can at least partially serve as a radiator to receive / transmit radio frequency signals. This portion of the frame serving as the radiator may have gaps between itself and other parts of the middle frame 400, or between itself and the middle frame 400, thereby ensuring that the radiator has a good radiation environment.

[0088] In one embodiment, the radiator of the electronic device may also be disposed within the frame 600. The frame 600 comprises a non-conductive material, and the radiator of the antenna may be located within the electronic device and disposed along the frame 600, or the radiator may be at least partially embedded within the non-conductive material of the frame. In one embodiment, the radiator is disposed close to the non-conductive material of the frame 600 to minimize the volume occupied by the radiator and to be closer to the outside of the electronic device, thereby achieving better signal transmission performance. It should be noted that "disposed close to the frame 600" means that the radiator can be disposed tightly against the frame 600, or it can be disposed close to the frame 600, for example, there may be a small gap between the radiator and the frame 600.

[0089] Figure 1 The electronic device is shown only schematically, and the actual shape, size, and construction of these components are not subject to change. Figure 1 limited.

[0090] It should be understood that, in the embodiments of this application, the surface where the display screen of the electronic device is located can be considered as the front, the surface where the back cover is located as the back, and the surface where the frame is located as the side.

[0091] It should be understood that, in the embodiments of this application, when a user holds (typically vertically and facing the screen) an electronic device, the orientation of the electronic device has a top, bottom, and side.

[0092] The electronic devices in this application embodiment can have a variety of options, such as any electronic device such as a candybar phone, a foldable phone, a multi-folding phone, a tablet computer, or a smart screen.

[0093] Figure 2 This is a schematic diagram of a frame structure for an electronic device provided in an embodiment of this application. Figure 2 As shown, taking a mobile phone as an example, the bezel 600 includes a top bezel 650, a bottom bezel 630, a first side bezel 620, and a second side bezel 640. The bezel 600 is made of metal, such as... Figure 2 As shown, slots are formed on the frame 600, thereby forming multiple radiators for the frame antenna. Therefore, a portion of the frame 600 can serve as an antenna radiator. For example, the antenna slots on the first side frame 620 divide it into multiple radiators, including a first radiator 621 and a second radiator 622. The first radiator 621 is shorter in size and can serve as a first antenna operating in a first frequency band. The first frequency band can be a frequency band greater than or equal to 1 GHz; for example, the middle band (MB) (e.g., 1710-2170 MHz) or high band (HB) (e.g., 2300-2690 MHz) in cellular bands; or, for example, the BT (Bluetooth) band (e.g., 2.40-2.48 GHz) in non-cellular bands; the L1 band of GPS (Global Positioning System) (e.g., 1598-1605 MHz); or GPS... The L5 band (e.g., 1164-1215MHz); the second radiator 622 is relatively long and can serve as a second antenna operating in a second frequency band, which can be a frequency band less than 1GHz; for example, the low band (LB) in cellular bands (e.g., 698-960MHz) can be used for the low band. It should be noted that... Figure 2 The image shown is merely an example of a portion of the radiator; there could be more portions on the border 600 that could serve as radiators.

[0094] Figure 3 for Figure 2 A partial cross-sectional diagram of an electronic device cut along the AA direction. (See diagram below.) Figure 2 As shown, with the dividing line as the boundary, the middle frame 400 includes a border 600 and other portions (e.g., structure 402) spaced apart from the border 600. In one embodiment, the border 600, structure 402, display 200, and back cover 500 may form a cavity 700. In one embodiment, a portion of structure 402 of the middle frame 400 also forms a recess 800 (the area within the dashed box in the figure). It should be understood that the structure within the recess 800 varies depending on the cross-sectional position AA; in one embodiment, the recess 800 may contain a camera module.

[0095] In one embodiment, the display screen 200 and the back cover 500 may also be disposed on the middle frame 400 at positions corresponding to the front and back of the electronic device. Figure 4 for Figure 3 A structural diagram of the middle frame.

[0096] It should be noted that, Figure 3 Only a partial cross-sectional view of the electronic device along the transverse section AA is shown. At different positions along the electronic device 100 from top to bottom at the transverse section AA, the structure of the middle frame 400 differs. Therefore, along... Figure 3 The cross-sectional diagram shows differences in the structure of the middle frame 400 when cut horizontally at different 600 positions on the border. For example,... Figure 5 As shown, Figure 5 for Figure 3 A schematic diagram of another type of middle frame structure is shown in the figure. In the figure, the middle frame 400 still forms a cavity 700, but the portion of the middle frame 400 forming the groove 800 is connected to the edge frame 600. In one embodiment, such as... Figure 5 As shown, the upper and lower parts of the cavity 700 are connected to the middle frame 400. In one embodiment, only the upper part of the cavity 700 may be connected to the middle frame 400, or only the lower part of the cavity 700 may be connected to the middle frame 400.

[0097] In one embodiment, the cavity 700 can be injection molded, and the injection molded material can be an insulating material.

[0098] Figure 6 This is a schematic diagram of the mid-frame structure of an electronic device provided in an embodiment of this application. Figure 6 As shown, taking a mobile phone as an example, the mid-frame structure includes, for instance, the following: Figure 2The shown frame 600. Multiple through holes 410 can be formed on the frame 600. In one embodiment, the specific locations of the through holes 410 are: non-antenna slot positions on the top frame 650; non-antenna slot positions on the bottom frame 630; non-antenna slot positions on the first side frame 620 relative to the bottom frame 630 and near the top frame 650, and non-antenna slot positions relative to the top frame 650 and near the bottom frame 630; and non-antenna slot positions on the second side frame 640 relative to the bottom frame 630 and near the top frame 650, and non-antenna slot positions relative to the top frame 650 and near the bottom frame 630. In embodiments of this application, non-antenna slot positions can be understood as positions that are not antenna radiation slots.

[0099] For example, continue as follows Figure 6 As shown, one or more through holes 410 are provided on the second radiator 622. On the first side of the second radiator 622, a capacitive sensing electrode 910 is arranged at the position corresponding to the through hole 410. The first side is the side that is opposite to the appearance surface of the frame 600.

[0100] It should be noted that through holes 410 can be formed on any of the radiators on the frame 600, and it is not limited to the second radiator 622. For example, through holes 410 can also be formed on the first radiator 621; through holes 410 can also be formed on the second side frame 640 at the position corresponding to the first radiator 621; through holes 410 can also be formed on the top frame 650 and the bottom frame 630. In one embodiment, the through holes 410 are formed on the second radiator 622 and at the position corresponding to the second radiator 622 on the second side frame 640. The second radiator 622 is relatively long and is located at a position where the electronic device is frequently gripped. Therefore, forming through holes 410 on the second radiator 622 and at the position corresponding to the second radiator 622 on the second side frame 640, and correspondingly setting capacitive sensing electrodes 910, can further improve the touch detection accuracy of the electronic device.

[0101] Figure 7 For along Figure 6 A partial cross-sectional diagram of an electronic device cut across the center (AA). (Example) Figure 7 As shown, the boundary is still defined by the dividing line. The middle frame structure of this embodiment includes:

[0102] The middle frame 400 is made of metal and includes a side frame 600, on which a through hole 410 is provided. In the embodiments of this application, the middle frame 400 is also referred to as a metal middle frame.

[0103] A capacitive sensing electrode 910 is disposed on a first side of the frame 600, which is the side opposite to the outer surface of the frame 600; for example Figure 7As shown, the capacitive sensing electrode 910 corresponds to the position of the through hole 410. In one embodiment, the correspondence between the capacitive sensing electrode 910 and the through hole 410 can be understood as the electrode surface of the electrode 910 and the position of the through hole 410 at least partially overlapping in the thickness direction of the frame 600. For example, the capacitive sensing electrode 910 and the through hole 410 partially or completely overlap in the thickness direction of the frame 600, such that the capacitance signal emitted by the capacitive sensing electrode 910 (also referred to as the capacitance signal) can pass through the through hole 410 to reach the outer surface of the frame 600. In one embodiment, the capacitive sensing electrode 910 is located within the cavity 700.

[0104] There are several ways to electrically insulate the capacitive sensing electrode 910 from the middle frame 400. For example, the capacitive sensing electrode 910 can be glued to the inner wall of the cavity 700, or it can be supported in the cavity 700 by a bracket. It should be understood that, at the factory (before being assembled into the electronic device), the middle frame structure of this embodiment does not need to consider whether the capacitive sensing electrode 910 is electrically insulated from the middle frame 400, as long as it is electrically insulated from the middle frame 400 after assembly into the electronic device. Therefore, in the embodiments of this application, the capacitive sensing electrode 910 can also be supported in the cavity 700 by a temporary bracket (including conductive and non-conductive brackets), forming a middle frame structure as shown in the figure. Figure 7 After the electronic device shown, the bracket can be removed and then fixed in another way to achieve electrical insulation.

[0105] In this embodiment, since the mid-frame 400 in the electronic device 100 is made of metal, such as aluminum, it shields the capacitance signal, making it impossible to detect changes in the capacitance signal when a user touches the frame 600. The through-hole 410 solves the problem of the metal frame 600 shielding the capacitance signal, allowing the capacitance signal sent by the capacitive sensing electrode 910 to pass through the through-hole 410 and reach the outer surface of the frame 600, thereby sensing whether the outer surface of the frame 600 at the location of the through-hole 410 has been touched or gripped. Therefore, when the electronic device uses the mid-frame structure of this embodiment, the side of the electronic device has the ability to detect touch or gripping, improving the accuracy of touch or gripping detection. Furthermore, the cost of setting the capacitive sensing electrode and opening the through-hole in this embodiment is low, and the through-hole has little impact on the rigidity and durability of the electronic device. Furthermore, since the capacitive sensing electrode is arranged on the first side of the frame, it can be modularly deployed inside the electronic device, thereby achieving a wider range of touch or gripping detection capabilities on the side of the electronic device at low cost.

[0106] In one embodiment, the middle frame 400 is filled with a first insulating material, and in another embodiment, the cavity 700 is filled with the first insulating material. In one embodiment, the first insulating material is filled between the middle frame 400 and the capacitive sensing electrode 910, that is, the capacitive sensing electrode 910 can be wrapped in the first insulating material and close to the edge 600. The first insulating material serves to support the capacitive sensing electrode 910, so that the capacitive sensing electrode 910 does not contact the middle frame 400, thus achieving electrical insulation.

[0107] In one embodiment, the first insulating material can be any insulating material, such as insulating adhesive, plastic, fiberglass, rubber, etc.

[0108] In one embodiment, the capacitive sensing electrode 910 can be made of any conductive material, such as a metal material, like copper or aluminum.

[0109] In one embodiment, continue as follows Figure 7 As shown, the mid-frame structure also includes a circuit board 920, on which the capacitive sensing electrode 910 is placed. The circuit board 920 serves to fix the capacitive sensing electrode 910. The first insulating material can also be used to support the circuit board 920.

[0110] To implement the principle of a capacitive sensor, the capacitive sensing electrode 910 is also electrically connected to a chip, which processes the capacitive signal. In one embodiment, the chip can be mounted on the printed circuit board 300 of the electronic device 100. Separating the capacitive sensing electrode 910 from the chip simplifies the structure of the mid-frame 400 and facilitates its manufacturing. In another embodiment, the chip can be mounted on a circuit board 920. Placing both the capacitive sensing electrode 910 and the chip on the circuit board 920 reduces latency and improves the detection response speed.

[0111] In one embodiment, the circuit board 920 is a flexible circuit board. Exemplarily, the flexible circuit board may include a substrate, which may be made of materials such as polyimide (PI) or polyethylene terephthalate (PET). In one embodiment, the flexible circuit board may also have a coverlay, which covers the capacitive sensing electrode 910, thereby electrically insulating the capacitive sensing electrode 910 from the middle frame 400. In some embodiments, the first insulating material may also serve as an electrical insulator.

[0112] In one embodiment, continue as follows Figure 7As shown, the circuit board 920 can be attached to the frame 600 by adhesive bonding. A capacitive sensing electrode 910 is placed on the circuit board 920, located on the side where the through hole 410 is located, and the capacitive sensing electrode 910 does not contact the frame 600. In one embodiment, the size of the capacitive sensing electrode 910 can be smaller than the size of the through hole 410, so that the capacitive sensing electrode 910 can be as close as possible to the through hole 410, but without contacting the frame 600. In this case, in one embodiment, the capacitive sensing electrode 910 can be located inside the through hole 410. It is understood that the closer the capacitive sensing electrode 910 is to the outer surface of the frame 600, the faster it can sense whether the outer surface of the frame 600 has been touched or grasped, which can improve the detection response speed. It is understood that the circuit board 920 may or may not contact the middle frame 400, without limitation. Therefore, the circuit board 920 can be attached to the frame 600 by adhesive bonding, as long as the capacitive sensing electrode 910 does not contact the frame 600 to form electrical insulation.

[0113] In one embodiment, if the size of the capacitive sensing electrode 910 in the direction perpendicular to the extension surface of the back cover 500 is larger than the size of the through hole 410, it must be ensured that the capacitive sensing electrode 910 does not contact the frame 600. In this case, the circuit board 920 is not attached to the frame 600 by adhesive. For example, Figure 8 As shown, Figure 8 For along Figure 6 This is a schematic cross-sectional view of another portion of an electronic device with a cross-section of AA. In the figure, the capacitive sensing electrode 910 is attached to a portion of structure 402, spaced apart from the frame 600. In one embodiment, the capacitive sensing electrode 910 is placed on a circuit board 920, which is attached to the portion of structure 402 forming the recess 800 in the frame 400 by adhesive bonding. In one embodiment, the size of the capacitive sensing electrode 910 may be smaller than the size of the through hole 410. In another embodiment, the size of the capacitive sensing electrode 910 may also be larger than the size of the through hole 410; for example, the size of the capacitive sensing electrode 910 may be 0.2 mm to 0.3 mm larger than the size of the through hole 410. This slightly larger size allows the capacitive signal emitted by the capacitive sensing electrode 910 to cover the through hole 410 as much as possible, improving the utilization rate of the through hole 410.

[0114] In one embodiment, the middle frame structure further includes one or more conductive structures, the conductive structures being at least partially located within the through hole and arranged along the depth direction of the through hole.

[0115] It should be noted that the conductive structure is at least partially located within the through hole, which can be understood as the projection of the conductive structure at least partially overlapping the projection of the through hole in the direction perpendicular to the depth of the through hole. There are various ways to place the conductive structure within the through hole. In one embodiment, since it is not necessary to consider whether the conductive structure is electrically insulated from the mid-frame at the factory (before assembly onto the electronic device), as long as it is electrically insulated from the mid-frame after assembly onto the electronic device, the conductive structure can be fixed within the through hole using a temporary bracket or a reinforcing rib. When assembled onto the electronic device, the bracket can be removed, and the structure can be fixed in another way to achieve electrical insulation. In one embodiment, the through hole is filled with a second insulating material, which fills the space between the frame and the conductive structure, thus electrically insulating the conductive structure from the frame.

[0116] Specifically, a through-hole can contain one conductive structure, or multiple conductive structures. The conductive structure utilizes its conductivity; its interior does not affect electric field transmission, while electric field transmission in the insulating material gradually attenuates with distance. Therefore, the conductive structure can enhance the capacitive signal reaching the outer surface of the frame 600, improving the accuracy and stability of grip or touch detection. For example, as... Figure 9 As shown, Figure 9 For along Figure 6 Another cross-sectional view of the electronic device with the AA transverse section shown. The figure includes a conductive structure 420 arranged along the depth direction of the through hole 410. The through hole 410 is filled with a second insulating material, which electrically insulates the conductive structure 420 from the middle frame 400, meaning the conductive structure 420 does not contact the middle frame 400 and is suspended within the through hole 410. The circuit board 920 is attached to the frame 600 by adhesive bonding. A capacitive sensing electrode 910 is placed on the circuit board 920, located on the side where the through hole 410 is located, and does not contact the frame 600.

[0117] In one embodiment, such as Figure 9 As shown, the conductive structure 420 includes a first end face and a second end face opposite to the first end face; wherein, the first end face is located at the end where the capacitive sensing electrode 910 is located, and the first end face corresponds to the capacitive sensing electrode 910; correspondingly, the second end face is the end where the outer surface of the frame 600 is located. In one embodiment, as... Figure 9As shown, the first end face is spaced apart from the capacitive sensing electrode 910. This spacing creates an equivalent capacitance, still achieving the goal of enhancing the capacitive signal reaching the outer surface of the frame 600, and also prevents wear on the capacitive sensing electrode 910. In one embodiment, the space between the first end face and the capacitive sensing electrode 910 can be filled with a first insulating material to further reduce wear and increase stability. In one embodiment, as... Figure 10 As shown, Figure 10 For along Figure 6 This is a schematic cross-sectional view of another part of the electronic device, cut in half horizontally (AA). The first end face is electrically connected to the capacitive sensing electrode 910. This electrical connection further enhances the capacitance signal and improves detection accuracy.

[0118] In one embodiment, such as Figure 10 and Figure 11 As shown, Figure 11 For along Figure 6 Another cross-sectional view of the electronic device with the AA transverse section shown. In the figure, the second end face is covered by a second insulating material; that is, at the location of the through hole 410, the second insulating material forms the outer surface of the frame 600, which is beneficial for the aesthetic design of the frame 600 and also for waterproofing. In one embodiment, continuing as... Figure 10 and Figure 11 As shown in the figure, the second end face is spaced apart from the outer surface of the frame 600 within the through hole 410. In this embodiment, with the second end face covered by the second insulating material, the conductive structure 420 is confined within the through hole 410 and has a gap from the outer surface, so that the conductive structure 420 does not extend beyond the outer surface of the frame 600 and is covered by the second insulating material. This achieves a flat design for the side frame while being aesthetically pleasing and waterproof.

[0119] In one embodiment, such as Figure 12 As shown, Figure 12 For along Figure 6 Another cross-sectional view of the electronic device with the AA transverse section shown in the figure. In the figure, the second end face forms the outer surface of the frame 600, that is, the second end face is not covered by the second insulating material, so the second end face can be directly touched or held, which can better detect whether the outer surface of the frame 600 is touched or held.

[0120] In one embodiment, the conductive structure can be a metallic material, such as copper or aluminum, or other conductive materials, such as graphene.

[0121] In one embodiment, the second insulating material can be any insulating material, such as insulating adhesive, plastic, fiberglass, rubber, etc.

[0122] In one embodiment, the first insulating material and the second insulating material are made of the same material, which simplifies the process. In another embodiment, the first insulating material and the second insulating material are made of different materials. Specifically, since the second insulating material partially forms the surface of the frame 600, the second insulating material is preferably a material with properties such as sweat resistance, opacity, impact resistance, and dimensional stability, such as polybutylene terephthalate (PBT), acrylonitrile butadiene styrene (ABS), thermoplastic polyurethane elastomer (TPU), and polyethylene terephthalate (PET).

[0123] In one embodiment, the mid-frame structure further includes:

[0124] The support component is fixedly connected to the metal frame and abuts against the flexible circuit board.

[0125] In the aforementioned embodiments, the flexible circuit board is adhered to the middle frame. Furthermore, the support component fixedly connected to the middle frame abuts against the flexible circuit board, further increasing its stability. For example, as shown... Figure 13 As shown, Figure 13 For along Figure 6 Another cross-sectional view of the electronic device cut by AA. In the figure, the circuit board 920 is a flexible circuit board, which is attached to the frame 600 by adhesive. The capacitive sensing electrode 910 is placed on the circuit board 920, located on the side where the through hole 410 is located, and the capacitive sensing electrode 910 does not contact the frame 600. The support assembly is located on the side of the circuit board 920 opposite to the through hole 410. One end of the support assembly is fixedly connected to part of the structure 402 of the middle frame 400, and the other end abuts against the side of the support assembly on the circuit board 920 opposite to the through hole 410.

[0126] In one embodiment, the supporting component includes:

[0127] The supporting structure is fixedly connected to the metal frame.

[0128] The flexible connector is located between the supporting structure and the flexible circuit board, and the supporting structure abuts against the flexible circuit board through the flexible connector. There are various ways to fix the supporting structure to the middle frame, such as snap-fitting or adhesive bonding.

[0129] For example, continue as follows Figure 13As shown, the support assembly includes a support structure 930 and a flexible connector 940. A portion of the support structure 930 is snapped and fixed to a portion of the structure 402 of the middle frame 400, and the support structure 930 abuts against the circuit board 920 via the flexible connector 940. The flexible connector is elastic, and under the pressure of the abutment, it can better fix the circuit board 920, further increasing the stability of the circuit board 920. The flexible connector can be made of rubber.

[0130] The following examples illustrate the shapes of through holes.

[0131] In the embodiments of this application, the shape of the through hole is not limited, and the cross-section of the through hole can be rectangular, circular, elliptical, etc. Among them, the rectangle can be a rectangle with rounded corners, and the rectangle includes squares and rectangles.

[0132] In one embodiment, such as Figure 14 As shown, Figure 14 for Figure 2 A side view of an electronic device. In the figure, the first side frame 620 includes a first radiator 621 and a second radiator 622. The second radiator 622 has multiple through holes 410, each through hole 410 being a rectangle with rounded corners. In this embodiment, each through hole 410 can be correspondingly provided with a capacitive sensing electrode 910. In one embodiment, each through hole 410 can also be correspondingly provided with multiple capacitive sensing electrodes 910. In one embodiment, continuing as... Figure 6 and Figure 14 As shown, multiple capacitive sensing electrodes 910 are spaced apart on the same circuit board, and each of the multiple capacitive sensing electrodes 910 corresponds to a multiple through hole 410.

[0133] In one embodiment, such as Figure 15 As shown, Figure 15 for Figure 2 Another side view of the electronic device. In the figure, the first side frame 620 includes a first radiator 621 and a second radiator 622. The second radiator 622 has a through hole 410, relative to... Figure 14 The through hole 410 in this embodiment has a longer long side and is a rectangular shape with rounded corners. In this embodiment, one through hole 410 corresponds to multiple capacitive sensing electrodes 910. Correspondingly, one through hole 410 also has multiple conductive structures 420, which correspond to multiple capacitive sensing electrodes 910. In one embodiment, multiple capacitive sensing electrodes 910 are spaced apart on the same circuit board, and each of the multiple capacitive sensing electrodes 910 corresponds to one through hole 410.

[0134] In one embodiment, continue as follows Figure 14 and Figure 15 As shown, the cross-section of the through hole 410 is rectangular. In one embodiment, the shorter side of the rectangle is in the range of 1mm to 3mm, and the longer side is in the range of 3mm to 15mm. Within this size range, it includes squares (e.g., 3mm × 3mm) and rectangles (e.g., 2.5mm × 4.5mm, 2.5mm × 15mm, 1.5mm × 4.5mm). It is understood that the rectangle matches the shape of the border 600 and has a wide detection range.

[0135] Based on the limitations of the shape and size of the cross-section of the through hole 410 in this embodiment, the example of the capacitive sensing electrode 910 being 0.2mm to 0.3mm larger than the size of the through hole 410 in the aforementioned embodiment will continue to be illustrated. For example, if the cross-section of the through hole 410 is rectangular and the capacitive sensing electrode 910 is also rectangular, then both the long and short sides of the cross-section of the through hole 410 are 0.2mm to 0.3mm smaller than the size of the capacitive sensing electrode 910; if the cross-section of the through hole 410 is circular and the capacitive sensing electrode 910 is also circular, then the diameter of the cross-section of the through hole 410 is 0.2mm to 0.3mm smaller than the size of the capacitive sensing electrode 910.

[0136] In some embodiments, the through hole 410 is rectangular and centered on the frame 600, which can maintain the rigidity of the middle frame structure as much as possible, facilitate the arrangement of the capacitive sensing electrode 910, and also facilitate the design of the appearance.

[0137] Based on the description of the cross-sectional shape of the through hole 410 in the above embodiments, the shapes of the conductive structure 420 and the capacitive sensing electrode 910 will be described below.

[0138] In some embodiments, the conductive structure 420 can be a regular cube such as a cylinder, cuboid, or cube, in which case the shape and size of the first and second end faces of the conductive structure 420 are also consistent. In some embodiments, the conductive structure 420 can be an irregular three-dimensional shape, provided that the conductive structure 420 can be placed inside the through hole 410 without contacting the through hole 410. In some embodiments, the shape of the cross-section of the conductive structure 420 can match the shape of the cross-section of the through hole 410. In one embodiment, shape matching can be understood as the shapes being identical, but the sizes can be different. For example, both the conductive structure 420 and the through hole 410 are regular cubes such as cylinders, cuboids, or cubes, but the size of the through hole 410 is larger than the size of the conductive structure 420. In one embodiment, the shape of the cross-section of the conductive structure 420 can be different from the shape of the cross-section of the through hole 410, as long as the conductive structure 420 can be placed inside the through hole 410 without contacting the through hole 410.

[0139] In some embodiments, the capacitive sensing electrode includes multiple sensing electrodes, the shape of which matches the cross-sectional shape of the through hole. Specifically, the capacitive sensing electrode can be a single-layer or multi-layer metal electrode. A single-layer metal electrode can be fabricated into multiple sensing electrodes using a metal plate, and the shape formed by the multiple sensing electrodes is the shape of the metal plate. For example, as shown... Figure 16 As shown, Figure 16 This is a front view of a circuit board and capacitive sensing electrodes provided in an embodiment of this application. In the figure, a plurality of capacitive sensing electrodes 910 are disposed on the circuit board 920. The capacitive sensing electrodes 910 are square, and the cross-section of the through hole 410 is also square. In some embodiments, the shape of the plurality of sensing electrodes may not match the shape of the cross-section of the through hole. Exemplarily, the circuit board 920 and the capacitive sensing electrodes 910 continue as follows... Figure 16 As shown, the cross-section of the through hole 410 is Figure 15 The rectangular circuit board 920 and the capacitive sensing electrode 910 shown are... Figure 15 The through hole 410 shown corresponds to multiple capacitive sensing electrodes 910, which simplifies the complexity of the structure, simplifies the manufacturing process, and saves costs.

[0140] It should be noted that the embodiments of this application involve appendices. Figure 1 To be continued Figure 13 The diagram only shows a portion of the electronic device's structure and does not represent that the embodiments of this application only include the shown portions. The unshown portions can be referenced from the structures of existing electronic devices and are not limited in this embodiment.

[0141] The above are specific implementations of the mid-frame structure provided in this application. The detection effect of the mid-frame structure provided in this application is verified by simulation experiments below.

[0142] Simulations were performed on the following four mid-frame structures:

[0143] The first method: Set capacitive sensing electrodes, and do not open through holes in the metal frame.

[0144] The second method: set capacitive sensing electrodes, open through holes at corresponding positions on the frame, and do not set conductive structures;

[0145] The third method: Set up a capacitive sensing electrode, open a through hole at the corresponding position of the frame, set up a conductive structure, the conductive structure is a metal cylinder, the metal cylinder is covered by a second insulating material, and does not form the appearance surface of the frame.

[0146] The fourth method involves setting capacitive sensing electrodes, opening through holes at corresponding positions on the frame, and setting a conductive structure. The conductive structure is a metal cylinder, which is not covered by the second insulating material, forming the outer surface of the frame.

[0147] Specifically, the cross-section of the through hole is rectangular, and the dimensions of the through hole are 2.5mm × 4.5mm. The simulation results are shown in Table 1 below.

[0148] Table 1

[0149]

[0150] In Table 1, the sensed capacitance value is the capacitance signal value received by the chip under different frame structures. The capacitance signal quantity is the difference between the capacitance signal values ​​when the device is held and not held. It can be understood that the chip detects the capacitance to ground of the capacitance sensing electrode. When a person holds the device, part of the electric field generated by the capacitance sensing electrode is conducted to the ground through the person, increasing the capacitance to ground detected by the chip.

[0151] Based on the simulation results in Table 1, using the first mid-frame structure as a comparative example, there is no capacitance signal when the corresponding position of the frame is gripped. In the second mid-frame structure, the through-hole allows capacitance signals to pass through, with a capacitance signal of 0.017pF, reaching the level of signal strength that the chip can recognize. In the third mid-frame structure, the through-hole allows capacitance signals to pass through, and due to the metal cylinder placed in the through-hole, the capacitance signal is further increased to 0.089pF. In the fourth mid-frame structure, the through-hole allows capacitance signals to pass through, and because the metal cylinder is placed in the through-hole, and the metal cylinder forms the outer surface of the frame, meaning that the metal cylinder can directly contact the user's body, the capacitance signal is 0.501pF, further increasing the capacitance signal.

[0152] Figure 17 This is a schematic flowchart illustrating a method for manufacturing a mid-frame structure according to an embodiment of this application. Figure 17 As shown, the manufacturing method includes:

[0153] S172. Manufacture a metal frame; the metal frame includes a border, on which one or more through holes are provided;

[0154] S174. Install the capacitive sensing electrode; the capacitive sensing electrode is positioned on the first side of the frame, which is the side facing away from the outer surface of the frame; the position of the capacitive sensing electrode corresponds to the position of the through hole.

[0155] It is understood that the specific implementation method and the technical effect achieved by the middle frame structure involved in this embodiment can be referred to the description of the middle frame structure in the foregoing embodiment, and will not be repeated here.

[0156] Continue as Figures 6 to 13 As shown, this application embodiment also provides an electronic device, including the mid-frame structure in the foregoing embodiment, and a display screen 200 and a back cover 500 located on opposite sides of the mid-frame structure.

[0157] In one embodiment, continue as follows Figure 6 As shown, the frame 600 includes a top frame 650, a bottom frame 630, a first side frame 620, and a second side frame 640. The frame 600 includes a frame antenna, with the gap of the frame antenna located at the position of the first side frame 620 relative to the bottom frame 630 near the top frame 650, and at the position of the second side frame 620 relative to the bottom frame 630 near the top frame 650. A through hole 410 is provided at the position of the first side frame 620 relative to the top frame 650 near the bottom frame 630, and a capacitive sensing electrode 910 is provided at the corresponding position. A through hole 410 is provided at the position of the second side frame 640 relative to the top frame 650 near the bottom frame 630, and a capacitive sensing electrode 910 is provided at the corresponding position.

[0158] In one embodiment, the electronic device further includes a chip coupled to a capacitance sensing electrode 910; the chip is used to determine the gripped state of the electronic device based on the received capacitance signal from the capacitance sensing electrode 910. For example, as Figure 6 The electronic device shown has a second radiator 622 on the first side frame 620, and through holes 410 on the second side frame 640 corresponding to the second radiator 622, with corresponding capacitive sensing electrodes 910. The capacitive signal received by the chip can reflect the gripping state, including the locations of all through holes 410, thereby comprehensively determining the gripping state of the electronic device.

[0159] In one embodiment, when the electronic device is held, the holding status of the frame is detected by the mid-frame structure of this embodiment, and the touch detection of the display screen position is combined to comprehensively determine the holding status of the electronic device, thereby switching the antenna according to the antenna arrangement and improving the communication performance of the antenna system.

[0160] The above description is merely a specific embodiment of this application, but the scope of protection of this application is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art within the scope of the technology disclosed in this application should be included within the scope of protection of this application. Therefore, the scope of protection of this application should be determined by the scope of the claims.

Claims

1. A mid-frame structure, characterized in that, The middle frame structure includes: A metal frame, the metal frame including a border, the border having one or more through holes; A capacitive sensing electrode is disposed on a first side of the frame, the first side being the side opposite to the outer surface of the frame; the position of the capacitive sensing electrode corresponds to that of the through hole.

2. The middle frame structure as described in claim 1, characterized in that, The middle frame structure also includes: One or more conductive structures are arranged along the depth direction of the through hole.

3. The middle frame structure as described in claim 2, characterized in that, The through hole is filled with a second insulating material, which is placed between the frame and the conductive structure, thereby electrically insulating the conductive structure from the frame.

4. The middle frame structure as described in claim 3, characterized in that, The metal frame is filled with a first insulating material, which fills the space between the metal frame and the capacitive sensing electrode; and the capacitive sensing electrode is electrically insulated from the metal frame.

5. The middle frame structure as described in claim 3 or 4, characterized in that, The conductive structure includes a first end face and a second end face that is opposite to the first end face; wherein the first end face is located at the end where the capacitive sensing electrode is located, and the first end face corresponds to the capacitive sensing electrode; The first end face is spaced apart from the capacitive sensing electrode, or the first end face is electrically connected to the capacitive sensing electrode.

6. The middle frame structure as described in claim 5, characterized in that, The second end face forms the outer surface of the frame.

7. The middle frame structure as described in claim 5, characterized in that, The second end face is covered by the second insulating material.

8. The middle frame structure as described in claim 7, characterized in that, The second end face is spaced apart from the outer surface of the frame within the through hole.

9. The middle frame structure as described in any one of claims 5 to 8, characterized in that, The shape of the second end face matches the shape of the cross-section of the through hole.

10. The middle frame structure as described in claim 4, characterized in that, The first insulating material and the second insulating material are made of the same material, or the first insulating material and the second insulating material are made of different materials.

11. The middle frame structure as described in any one of claims 1 to 10, characterized in that, The cross-section of the through hole is rectangular.

12. The middle frame structure as described in claim 11, characterized in that, The short side of the rectangle is in the range of 1mm to 3mm, and the long side of the rectangle is in the range of 3mm to 15mm.

13. The middle frame structure as described in any one of claims 9 to 12, characterized in that, The capacitive sensing electrode includes multiple sensing electrodes, and the shape formed by the multiple sensing electrodes matches the shape of the cross-section of the through hole.

14. The middle frame structure as described in any one of claims 1 to 13, characterized in that, The middle frame structure also includes: A flexible circuit board, wherein the capacitive sensing electrode is disposed on the flexible circuit board.

15. The middle frame structure as described in claim 14, characterized in that, The middle frame structure also includes: A support component is fixedly connected to the metal frame and abuts against the flexible circuit board.

16. The middle frame structure as described in claim 15, characterized in that, The support components include: A supporting structure, which is fixedly connected to the metal frame; A flexible connector is located between the support structure and the flexible circuit board, and the support structure abuts against the flexible circuit board through the flexible connector.

17. The mid-frame structure as described in any one of claims 14 to 16, characterized in that, The frame includes a top frame, a bottom frame, a first side frame, and a second side frame. One or more of the top frame, the bottom frame, the first side frame, and the second side frame have multiple through holes. Each of the multiple through holes is provided with one or more capacitive sensing electrodes. The one or more capacitive sensing electrodes are spaced apart on the same flexible circuit board.

18. The middle frame structure as described in claim 17, characterized in that, The plurality of through holes are located at: The non-antenna gap location of the top frame; The non-antenna gap location of the bottom frame; The non-antenna gap position of the first side frame relative to the bottom frame and close to the top frame, and the non-antenna gap position relative to the top frame and close to the bottom frame; The non-antenna gap position of the second side frame relative to the bottom frame and close to the top frame, and the non-antenna gap position relative to the top frame and close to the bottom frame.

19. A method for manufacturing a middle frame structure, characterized in that, The manufacturing method includes: Manufacturing a metal frame; the metal frame includes a border, and the border has one or more through holes; Install capacitive sensing electrodes; the capacitive sensing electrodes are arranged on the first side of the frame, the first side being the side opposite to the outer surface of the frame; the position of the capacitive sensing electrodes corresponds to the position of the through hole; and the capacitive sensing electrodes are electrically insulated from the metal frame.

20. An electronic device, characterized in that, It includes the mid-frame structure as described in any one of claims 1 to 18, and the display screen and back cover located on opposite sides of the mid-frame structure.

21. The electronic device as claimed in claim 20, characterized in that, The frame includes a top frame, a bottom frame, a first side frame, and a second side frame. The frame includes a frame antenna. The frame antenna is located on the first side frame near the top frame relative to the bottom frame, and on the second side frame near the top frame relative to the bottom frame. One or more through holes are provided on the first side frame near the bottom frame relative to the top frame, and one or more through holes are provided on the second side frame near the bottom frame relative to the top frame.

22. The electronic device as claimed in claim 20 or 21, characterized in that, The electronic device further includes a chip coupled to the capacitive sensing electrode; the chip is used to determine the gripping state of the electronic device based on the received capacitance signal from the capacitive sensing electrode.

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