Copper foil, electrode comprising same, secondary battery comprising same, and method for manufacturing same

By controlling the grain orientation difference of the copper foil and forming a protective layer on the surface of the copper foil, the problems of curling, wrinkling or tearing of copper foil during manufacturing are solved, thereby improving the ductility of the copper foil and the capacity of the secondary battery.

CN122314906APending Publication Date: 2026-06-30SK NEXILIS CO LTD
1 Cites 0 Cited by

Patent Information

Application Number
CN202512020942.7
Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
Priority Date
2025-04-16
Filing Date
2025-12-30
Publication Date
2026-06-30

AI Technical Summary

Technical Problem

Existing copper foil is prone to curling, wrinkling, or tearing during the manufacturing process, making it difficult to manufacture very thin copper foil, which affects the performance and capacity of secondary batteries.

Method used

By controlling the grain orientation difference of the copper foil, the area ratio of grains with a room temperature GOS value of 0° to less than 2° is ensured to be 45% to 95%, and a protective layer is formed on the surface of the copper foil to prevent wrinkles or tears from occurring during the manufacturing process.

Benefits of technology

This technology prevents copper foil from curling, wrinkling, or tearing during manufacturing, improving its ductility and stability, and enhancing the capacity and performance of secondary batteries.

✦ Generated by Eureka AI based on patent content.
Patent Text Reader

Abstract

One embodiment of the present disclosure provides a copper foil including a copper film having a matte surface and a bright surface; and a protective layer disposed on the copper film; wherein when a boundary where a difference in orientation between adjacent pixels is 5 DEG or more is regarded as a grain boundary, an area ratio of an area of crystal grains (including twin crystals) having a room temperature GOS value of 0 DEG to less than 2 DEG with respect to a total cross-sectional area is 45% to 95%. Room temperature GOS values are measured using an electron backscatter diffraction (EBSD) pattern analyzer on the cross-section of the copper foil at room temperature.
Need to check novelty before this filing date? Find Prior Art