A circuit board patch correction method, device, system and storage medium thereof

Abstract

This invention discloses a circuit board surface mount correction method, apparatus, system, and medium. The circuit board surface mount correction method includes: acquiring basic accuracy data of the bare circuit board state and solder paste association data after solder paste has been printed on the circuit board; generating a D data stream based on the basic accuracy data, the solder paste association data, and corresponding component information, and sending the D data stream to a pick-and-place machine and a pre-reflow AOI (Automated Optical Inspection) unit; the pick-and-place machine completing component placement based on the D data stream; the pre-reflow AOI acquiring placement result information for each component on the circuit board after placement, and calculating offset data for each component based on the D data stream to generate an H data stream; and the pick-and-place machine performing surface mount correction based on the H data stream. This circuit board surface mount correction method achieves the effect of improving component placement correction accuracy and yield.

Description

Technical Field

[0001] The present invention relates to the field of circuit board surface mount calibration, and more particularly to a circuit board surface mount calibration method, apparatus, system and storage medium thereof. Background Technology

[0002] Currently, surface mount technology (SMT) production lines commonly use automated optical inspection (AOI) before the reflow oven to inspect the placement quality of components on printed circuit boards (PCBs) or flexible printed circuit boards (FPCBs). Based on preset Gerber data and pad reference coordinates, AOI calculates component X / Y axis offsets and rotation angle deviations, then feeds this data back to the pick-and-place machine for correction. However, this method assumes the FPCB / bare PCB is in an ideal, deviation-free standard state, completely ignoring the underlying impact of FPCB / bare PCB differences on placement quality. This can lead to correction parameter adjustments deviating significantly from actual errors, and even resulting in increased placement deviations and component misalignment with pads after correction. Summary of the Invention

[0003] This invention provides a circuit board surface mount calibration method, apparatus, system, and storage medium, which improves the accuracy and yield of component mounting calibration.

[0004] According to one aspect of the present invention, a method for correcting surface mount technology (SMT) on a circuit board is provided. The method includes: acquiring basic accuracy data of the bare state of the circuit board and solder paste association data after the circuit board has been printed with solder paste; generating a D data stream based on the basic accuracy data, the solder paste association data, and corresponding component information, and sending the D data stream to a pick-and-place machine and an AOI (Automated Optical Inspection) unit; the pick-and-place machine completing component placement based on the D data stream; the AOI acquiring placement result information of each component after placement on the circuit board, and calculating offset data of each component based on the D data stream to generate an H data stream; and the pick-and-place machine performing surface mount correction based on the H data stream.

[0005] Optionally, obtaining the basic accuracy data of the bare circuit board status includes: using a high-precision measuring machine to collect data from the bare circuit board to obtain basic accuracy data, wherein the basic accuracy data includes at least one of the following: whole board reference coordinates, sub-board reference coordinates, sub-board pad coordinates, positioning offset, and board separation information.

[0006] Optionally, the step of obtaining solder paste association data after the circuit board has been printed with solder paste includes collecting solder paste association data after the circuit board has been printed with solder paste using a solder paste inspection machine. The solder paste association data includes at least one of the following: all pad numbers associated with each component number, solder paste data identifier associated with each pad number, x-axis position detection data and y-axis position detection data of the solder paste at each pad, solder paste area data and solder paste volume data at each pad, and x-axis offset data and y-axis offset data of the solder paste at each pad relative to the corresponding pad.

[0007] Optionally, generating a D data stream based on the basic accuracy data, the solder paste association data, and the corresponding component information includes: confirming the component information corresponding to each pad; and establishing target component composite mounting coordinates based on the component information, the basic accuracy data, and the solder paste association data.

[0008] Optionally, establishing the target component assembly coordinates based on the component information, basic accuracy data, and solder paste correlation data includes: The coordinate system of the basic accuracy data and the solder paste correlation data is unified into the coordinate system of the basic accuracy data; Based on the pad coordinates in the aforementioned basic accuracy data, confirm the component placement coordinates A(x,y). Based on the offset data of the solder paste association data relative to the pad coordinates, the component mounting position offset BA(x,y) is confirmed. Based on the component information, the component mounting coordinates A(x,y) and the component mounting position offset BA(x,y), a preliminary composite mounting coordinate of the component is generated. Based on the component information of the component to be mounted, determine the mounting offset weight coefficient k corresponding to the component to be mounted; The component's initial composite mounting coordinates are adjusted using the mounting offset weight coefficient k to generate the target component's composite mounting coordinates; wherein, the target component's composite mounting coordinates are calculated as follows: C(x,y)=A(x,y)+k×BA(x,y).

[0009] Optionally, the pre-reflow AOI acquires the placement result information of each component on the circuit board after placement, including: Extract the overall board reference coordinates, sub-board reference coordinates, and sub-board pad coordinates from the D data stream corresponding to the unique number of the circuit board. The AOI in front of the furnace performs full-size scanning inspection of each component on the entire board, and identifies the physical contour of each component through image recognition algorithms; Based on the sub-board reference coordinates, the precise actual X / Y axis coordinates and actual rotation angle values ​​of each component after mounting are determined by a positioning algorithm.

[0010] Optionally, the step of calculating the offset data of each component based on the D data stream to generate the H data stream includes: The AOI in front of the furnace synchronously collects at least one of the following components: incorrect, missing, or reversed components, as mounting quality data; Compare the precise actual X / Y axis coordinates and actual rotation angles of the components after mounting with the component offset rotation data between the synthesized mounting coordinates and standard rotation angles in the D data stream; The component offset rotation data is integrated with the mounting quality data to generate an H data stream.

[0011] According to another aspect of the present invention, a circuit board placement correction device is provided, comprising: a solder paste inspection machine, used to acquire basic accuracy data of the bare circuit board state and solder paste association data after the circuit board has been printed with solder paste; generating a D data stream based on the basic accuracy data, the solder paste association data and corresponding component information, and sending the D data stream to a placement machine and a reflow AOI; a reflow AOI, used to acquire placement result information of each component after placement on the circuit board, and calculate offset data of each component based on the D data stream to generate an H data stream; and a placement machine, used to complete component placement based on the D data stream and perform placement correction based on the H data stream.

[0012] According to another aspect of the present invention, a circuit board surface mount calibration system is provided, comprising: one or more processors; a memory for storing one or more programs; wherein when the one or more programs are executed by the one or more processors, the one or more processors implement the circuit board surface mount calibration method described above.

[0013] According to another aspect of the present invention, a storage medium is provided having a computer program stored thereon, which, when executed by a processor, implements the above-described circuit board patch calibration method.

[0014] Compared with existing technologies, the circuit board placement calibration method of this embodiment has the following beneficial effects: It solves the problem that the hardware detection accuracy of existing AOI equipment is lower than that of high-precision placement machines, and therefore cannot achieve high-precision calibration of placement machines. The method of this embodiment uses high-precision data of bare boards to eliminate errors caused by non-placement machine factors such as incoming material differences and environmental interference. The deviation data detected by AOI and the quality data collected only reflect the inherent equipment problems of the placement machine, without the superposition interference of other error sources. Even if its absolute accuracy is lower than that of the placement machine, the detected deviation data can truly and accurately reflect the actual placement status of the placement machine, providing reliable and effective data basis for the autonomous calibration of the placement machine, and achieving the effect of improving the accuracy and yield of component placement calibration. Attached Figure Description

[0015] To more clearly illustrate the technical solutions in the embodiments of the present invention, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the accompanying drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0016] Figure 1 This is a flowchart of a circuit board patch calibration method provided in Embodiment 1 of the present invention.

[0017] Figure 2 This is a flowchart of a circuit board patch correction device provided in Embodiment 2 of the present invention.

[0018] Figure 3 This is a schematic diagram of a circuit board patch correction system provided in Embodiment 3 of the present invention. Detailed Implementation

[0019] To enable those skilled in the art to better understand the present invention, the technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present invention. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort should fall within the scope of protection of the present invention.

[0020] It should be noted that the terms "first," "second," etc., in the specification, claims, and accompanying drawings of this invention are used to distinguish similar objects and are not necessarily used to describe a specific order or sequence. It should be understood that such data used can be interchanged where appropriate so that embodiments of the invention described herein can be implemented in orders other than those illustrated or described herein. Furthermore, the terms "comprising" and "having," and any variations thereof, are intended to cover a non-exclusive inclusion; for example, a process, method, system, product, or apparatus that comprises a series of steps or units is not necessarily limited to those steps or units explicitly listed, but may include other steps or units not explicitly listed or inherent to such processes, methods, products, or apparatus.

[0021] Example 1 Figure 1 This is a flowchart of a circuit board surface mount calibration method provided in Embodiment 1 of the present invention. This embodiment can be applied to a circuit board surface mount calibration device for execution. This device can be implemented by software and / or hardware and is generally integrated into a circuit board surface mount calibration system. Correspondingly, such as... Figure 1 As shown, the method includes the following operations: S110. Obtain basic accuracy data of the bare circuit board state and solder paste correlation data after the circuit board has been printed with solder paste.

[0022] In one embodiment, obtaining the basic accuracy data of the bare circuit board status includes: using a high-precision measuring machine to collect data from the bare circuit board to obtain basic accuracy data, wherein the basic accuracy data includes at least one of the following: whole board reference coordinates, sub-board reference coordinates, sub-board pad coordinates, positioning offset, and board separation information.

[0023] Preferably, a high-precision measuring machine with an absolute error ≤ ±10μm and a repeatability accuracy ≤ 1μm is used to perform a full-size high-precision scan on the bare PCB or FPCB to obtain basic precision data for each bare PCB or FPCB. Preferably, the basic precision data of each bare PCB or FPCB is bound to the unique code of the bare PCB or FPCB and the board separation information.

[0024] In this embodiment, the measuring machine can be placed before the printing press station. After performing a high-precision scan on the bare board and acquiring basic accuracy data, the data is stored and forwarded to subsequent processing equipment, such as the printing press, solder paste inspection machine, pre-reflow AOI, and post-reflow AOI. In an alternative embodiment, the high-precision measuring machine can also be set up separately from the production line. In this way, each incoming bare PCB or FPCB can be scanned with high precision before entering the warehouse to acquire basic accuracy data. The basic accuracy data is then stored in a host computer. During actual production, the equipment in subsequent stations only needs to read the corresponding basic accuracy data from the host computer.

[0025] In one embodiment, obtaining solder paste-related data after the circuit board has been printed with solder paste includes using a solder paste inspection machine to collect the solder paste-related data after the circuit board has been printed with solder paste.

[0026] In one embodiment, the printing press receives the basic accuracy data, aligns the stencil reference point of the printing stencil with the overall board reference point, then compares the mesh coordinates with the actual coordinates of all corresponding pads, adjusts the position of the printing stencil based on the offset between the two, and places the printing stencil over the bare board to ensure that the offset between all meshes and corresponding pads is less than a preset printing deviation threshold. Solder paste is then printed on the bare board circuit. Specifically, if incoming material deformation or quality abnormalities cause a large offset between individual meshes and corresponding pads, but other individual meshes and corresponding pads are well aligned, then all meshes and corresponding pads are adjusted based on the offset between individual meshes and corresponding pads to ensure that the offset between all meshes and corresponding pads is less than the preset printing deviation threshold. Solder paste is then printed on the bare board based on the adjusted meshes and corresponding pads.

[0027] Preferably, the process of using a solder paste inspection machine (SPI) to collect solder paste-related data after solder paste has been printed on the circuit board includes: after solder paste is printed on the bare board, the circuit board with solder paste is transported to the station of the solder paste inspection machine; the solder paste inspection machine performs high-precision positioning of the sub-board reference points of each sub-board to generate sub-board positioning results; based on the sub-board positioning results, the solder paste at each pad of the sub-board is collected point by point to obtain the solder paste-related data. Specifically, the solder paste-related data includes all pad numbers associated with each component number, solder paste data identifiers associated with each pad number; x-axis position detection data and y-axis position detection data of the solder paste at each pad; solder paste area data and solder paste volume data at each pad; and x-axis offset data and y-axis offset data of the solder paste at each pad relative to the corresponding pad.

[0028] S120. Based on the basic accuracy data, the solder paste association data and the corresponding component information, a D data stream is generated, and the D data stream is sent to the pick-and-place machine and the AOI in front of the furnace.

[0029] In one embodiment, generating a D data stream based on the basic accuracy data, the solder paste association data, and the corresponding component information includes: Confirm the component information corresponding to each pad; Based on the component information, basic accuracy data, and solder paste correlation data, the target component composite mounting coordinates are established.

[0030] Specifically, confirming the component information corresponding to each pad also includes: confirming all pads corresponding to each component and the ownership of the solder paste on the pads, and binding the collected solder paste association data one by one with the pad number, component number, sub-board partition, and whole board / sub-board number.

[0031] In one embodiment, establishing the target component composite mounting coordinates based on the component information, basic accuracy data, and solder paste correlation data includes: The coordinate system of the basic accuracy data and the solder paste associated data is unified into the coordinate system of the basic accuracy data. Specifically, unifying the coordinate system of the basic accuracy data and the solder paste associated data into the coordinate system of the basic accuracy data includes: using the high-precision absolute coordinates of all solder pads acquired by the metrology machine as a unified absolute coordinate reference, accurately aligning the sub-board reference coordinates acquired by the metrology machine with the sub-board reference coordinates acquired by the SPI, completing the coordinate system calibration of the solder paste associated data of the SPI, converting the actual position of the solder paste x / y axis into coordinate values ​​under the absolute coordinate system of the metrology machine, and accurately matching the x / y axis offset of the solder paste relative to the solder pad with the absolute coordinates of the corresponding solder pad. This can completely eliminate the defect of insufficient global coordinate accuracy of the SPI.

[0032] Confirm the component mounting coordinates A(x, y) based on the pad coordinates in the base precision data. Confirm the component mounting position offset BA(x, y) based on the offset data of the solder paste association data relative to the pad coordinates. Generate the preliminary synthesized component mounting coordinates based on the component mounting coordinates A(x, y) of the component information and the component mounting position offset BA(x, y). Confirm the mounting offset weight coefficient k corresponding to the component to be mounted according to the component information of the component to be mounted. Use the mounting offset weight coefficient k to adjust the preliminary synthesized component mounting coordinates to generate the target component synthesized mounting coordinates; where the calculation method of the target component synthesized mounting coordinates is: C(x, y) = A(x, y) + k × BA(x, y).

[0033] In one embodiment, the calculation method of the target component synthesized mounting coordinates is as follows: C(x, y) = A(x, y) + k × BA(x, y), where the component types include three categories. The first category of components (k = 0) are large-sized components: C(x, y) = A(x, y), and the synthesized coordinates are exactly equal to the mounting coordinates converted from the pad coordinates, ensuring that the pins of the large-sized components are precisely aligned with the pads and meeting the high alignment accuracy requirements for welding reliability. The second category of components (0 < k < 1, default k = 0.5) are medium-sized components: C(x, y) = A(x, y) + 0.5 × BA(x, y), and the synthesized coordinates are the weighted average of the preliminary synthesized mounting coordinates (measurement machine data synthesized coordinates) and the mounting offset after SPI conversion, taking into account the welding reliability of medium-sized components and the influence of the surface tension of reflow welding. The third category of components (k = 1) are small-sized components: C(x, y) = A(x, y) + BA(x, y), and the synthesized coordinates are equal to the preliminary synthesized mounting coordinates (measurement machine data synthesized coordinates) plus the mounting position offset after SPI conversion, that is, the mounting coordinates matching the actual distribution of the solder paste, ensuring that the micro-components are precisely mounted at the center of the solder paste, avoiding the displacement of components during reflow welding, and meeting the high dependence requirements of micro-components on the distribution position of the solder paste. In this embodiment, C(x, y) is the x / y axis coordinate value of the final synthesized mounting coordinates of the component.

[0034] In one embodiment, based on the x / y axis coordinates of the final target composite placement coordinates, an independent standardized composite coordinate file is generated for the entire FPCB / PCB board and each sub-board. The file uses the unique FPCB / PCB number as the core identifier and contains sub-board information, the final composite placement coordinates of each component, and also embeds the basic accuracy data of the corresponding pads and the solder paste association data of the corresponding solder paste. The data of the composite coordinate file is incorporated into a preset D data stream, and the generated standardized composite coordinate file is synchronously distributed to the corresponding pick-and-place machine station, the pre-reflow AOI station, and the post-reflow AOI station according to the unique FPCB / PCB number.

[0035] In one embodiment, the D data stream integration includes the coordinates of the entire board pads, the coordinates of the entire board solder paste, and the final composite placement coordinate file data of component placement. This data needs to be saved throughout the entire circuit board production process. In another embodiment, the D data is stored in a structured database and supports multi-dimensional retrieval, realizing systematic association and traceability of the entire data lifecycle. At the same time, it can be synchronized to the existing MES system and QMS system on the circuit board production line, providing data support for the digital management and control of the entire SMT production process.

[0036] S130, the pick-and-place machine completes the placement of components based on the D data stream.

[0037] Specifically, the pick-and-place machine uses the target component's composite placement coordinates from the D data stream to place different types of components onto the corresponding pads on the circuit board. Both the pre-reflow AOI and post-reflow AOI stations use the same standardized composite coordinate file as the inspection benchmark, achieving a unified benchmark for placement and inspection.

[0038] S140. The pre-furnace AOI obtains the placement result information of each component on the circuit board after placement, and calculates the offset data of each component based on the D data stream to generate the H data stream.

[0039] In one embodiment, the pre-reflow AOI acquires the placement result information of each component on the circuit board after placement, including: Extract the overall board reference coordinates, sub-board reference coordinates, and sub-board pad coordinates from the D data stream corresponding to the unique number of the circuit board. The AOI in front of the furnace performs full-size scanning inspection of each component on the entire board, and identifies the physical contour of each component through image recognition algorithms; Based on the sub-board reference coordinates, the precise actual X / Y axis coordinates and actual rotation angle values ​​of each component after mounting are determined by a positioning algorithm.

[0040] In one embodiment, AOI is based on a unified coordinate system. It uses the sub-board reference coordinates (PcsMark) in the D data stream as a reference and calculates the precise actual coordinates and actual rotation angles of the components through a positioning algorithm. The core calculation formula is as follows. All parameters are based on the basic accuracy data provided by the metrology machine to unify the coordinate system.

[0041] In one embodiment, the accurate actual coordinates are calculated as follows: Xact = Xpcs + ΔXrel, Yact = Ypcs + ΔYrel, where Xact is the actual X-axis coordinate after component mounting; Yact is the actual Y-axis coordinate after component mounting; Xpcs is the X-axis coordinate of the composite mounting coordinates of components based on the sub-board reference coordinates in the D data stream; Ypcs is the Y-axis coordinate of the composite mounting coordinates of components based on the sub-board reference coordinates in the D data stream; both are determined by the basic accuracy data collected in advance by a high-precision metrology machine. ΔXrel represents the X-axis relative offset of the component detected by AOI relative to the sub-board reference coordinates. Specifically, it is calculated by subtracting the X-axis coordinate of the component based on the sub-board reference coordinates from the X-axis coordinate of the component detected by AOI based on the sub-board reference coordinates in the D data stream. This can be calculated by combining AOI image recognition algorithms with D data stream data. ΔYrel represents the Y-axis relative offset of the component detected by AOI relative to the sub-board reference coordinates. Specifically, it is calculated by subtracting the Y-axis coordinate of the component based on the sub-board reference coordinates from the Y-axis coordinate of the component detected by AOI based on the sub-board reference coordinates in the D data stream. This can also be calculated by combining AOI image recognition algorithms with D data stream data.

[0042] In one embodiment, the actual value of the rotation angle is calculated as follows: θact = θpcs + Δθrel, where θact is the actual rotation angle after component mounting. In this embodiment, a positive θact indicates a clockwise direction, and a negative θact indicates a counterclockwise direction. θpcs is the standard rotation angle of component mounting based on the sub-board reference coordinates in the D data stream, which is pre-collected by a high-precision measurement machine and is 0° by default when there is no offset. Δθrel is the relative offset of the component's rotation angle relative to the sub-board reference coordinates detected by AOI. Specifically, it is calculated by subtracting the component rotation angle detected by AOI based on the sub-board reference coordinates from the standard rotation angle of component mounting based on the sub-board reference coordinates in the D data stream. Specifically, it can be calculated by combining the AOI image recognition algorithm with the D data stream data.

[0043] In one embodiment, the step of calculating the offset data of each component based on the D data stream to generate the H data stream includes: The AOI in front of the furnace synchronously collects at least one of the following components: incorrect, missing, or reversed components, as mounting quality data; Compare the precise actual X / Y axis coordinates and actual rotation angles of the components after mounting with the component offset rotation data between the synthesized mounting coordinates and standard rotation angles in the D data stream; The component offset rotation data is integrated with the mounting quality data to generate an H data stream.

[0044] S150, The pick-and-place machine performs pick-and-place calibration based on the H data stream.

[0045] In one embodiment, the patch calibration includes orientation calibration and closed-loop verification.

[0046] In one embodiment, the pick-and-place machine performs placement orientation correction based on the H data stream, including: after receiving offset rotation data and placement quality data in the H data stream, the pick-and-place machine autonomously generates adjustment parameters and completes the correction action; based on the offset rotation data, it adjusts parameters such as placement coordinates and rotation angles to complete the position offset correction of the corresponding components of the next FPCB / PCB in the same batch; at the same time, based on the placement quality data, it autonomously completes the program modification, nozzle parameters and other related parameter adjustments.

[0047] In one embodiment, the pick-and-place machine performs a closed-loop calibration based on the H data stream, including: performing full-size inspection on the next calibrated FPCB / PCB after reflow AOI, collecting the actual position coordinates, rotation angle, and mounting quality data of the components, and feeding them back to the data center of the production line host computer or server. The data center compares the deviation of the actual position and rotation angle of the components before and after calibration with the composite mounting coordinates and standard rotation angle, as well as the mounting quality. If the deviation is ≤ a preset qualified threshold and the mounting quality meets the standard, the closed-loop calibration is deemed effective, and the offset rotation data of this calibration is included in the basic data of the same batch of FPCB / PCB for subsequent mounting. If the deviation exceeds the preset threshold or the mounting quality does not meet the standard, the error source is separated by combining the D data stream and AOI detection data again, the offset rotation data is recalculated, and the mounting quality data is integrated to generate an H data stream and sent to the pick-and-place machine to form a dynamic closed loop until the mounting deviation meets the standard requirements of high-precision mounting and the mounting quality meets the standard.

[0048] Compared to existing technologies, in the circuit board placement correction method of this embodiment, even though the hardware detection accuracy of the AOI equipment is lower than that of a high-precision placement machine, it can still achieve accurate and effective correction of the inherent coordinate offset and rotational offset deviation of the placement machine. The reason is as follows: 1. The measurement and testing machine completes the core coordinate acquisition of FPCB / PCB, pad alignment calibration and composite placement coordinate generation with ultra-high precision of absolute error ≤ ±10μm and repeatability ≤ 1μm, ultimately forming a D data stream. Its core function is to establish an absolutely accurate incoming material reference, placement coordinate reference and inspection reference, build a unified coordinate system for pick-and-place machine and AOI, eliminate the impact of incoming material differences on the underlying placement, and provide a unified and unbiased coordinate reference system for all subsequent inspections and data calculations. It solves the problem of "whether the reference for placement and inspection is accurate enough".

[0049] 2. Although the inspection accuracy of AOI is lower than that of pick-and-place machines, all its inspection work is carried out under a unified and precise coordinate system established by the metrology machine. Local positioning is completed by aligning the PcsMark (subboard reference coordinate) with the PcsMark measured by the metrology machine. There is no need to perform independent calibration of absolute coordinates. It is only necessary to perform local coordinate offset and rotation offset deviation detection for the composite placement coordinates and collect placement quality data. It solves the problem of "whether there is a deviation in the placement of the pick-and-place machine, what the direction of the deviation is, and how large the deviation value is", rather than just high-precision detection of absolute coordinates. The requirement for this local offset detection and data acquisition does not have high accuracy requirements. Under the model of this case, the inspection accuracy of the existing AOI can meet the requirements.

[0050] 3. In the method of this application, the process parameter adjustment of the pick-and-place machine does not require ultra-high precision support of absolute coordinates. Its core calibration requirement is to obtain accurate relative coordinate offset and rotation offset deviation data, so as to autonomously complete the correction of parameters such as placement coordinates and placement angles. At the same time, it can autonomously complete the relevant parameter adjustment based on placement quality data. It only needs to obtain the direction and value of the deviation and the type of placement quality problem to complete precise parameter adjustment. The relative coordinate offset and rotation offset deviation data detected by AOI and the collected placement quality data can meet the calibration data requirements of the pick-and-place machine and support the pick-and-place machine to complete precise autonomous calibration.

[0051] 4. Error source separation eliminates the cumulative effect of accuracy: Through the pre-calibration of the D data stream and the error source separation of the differential calculation model, errors caused by non-pick-and-place machine factors such as incoming material differences and environmental interference have been completely eliminated. The deviation data detected by AOI and the quality data collected only reflect the inherent equipment problems of the pick-and-place machine, without the superposition interference of other error sources. Even if its absolute accuracy is lower than that of the pick-and-place machine, the detected deviation data can truly and accurately reflect the actual placement status of the pick-and-place machine, providing reliable and effective data basis for the autonomous calibration of the pick-and-place machine.

[0052] Example 2 Figure 2This is a schematic diagram of a circuit board surface mount calibration device provided in Embodiment 2 of the present invention. The device 200 can be implemented by software and / or hardware, and is generally integrated into a circuit board surface mount calibration system, such as... Figure 2 As shown, the device 200 includes: a solder paste inspection machine 210, an AOI (Automated Optical Inspection) system 220, and a pick-and-place machine 230.

[0053] Solder paste inspection machine 210 is used to acquire basic accuracy data of the bare circuit board state and solder paste associated data after the circuit board has been printed with solder paste; based on the basic accuracy data, the solder paste associated data and the corresponding component information, a D data stream is generated and the D data stream is sent to the pick-and-place machine and the reflow AOI.

[0054] In one embodiment, obtaining the basic accuracy data of the bare circuit board status includes: using a high-precision measuring machine to collect data from the bare circuit board to obtain basic accuracy data, wherein the basic accuracy data includes at least one of the following: whole board reference coordinates, sub-board reference coordinates, sub-board pad coordinates, positioning offset, and board separation information.

[0055] Preferably, a high-precision measuring machine with an absolute error ≤ ±10μm and a repeatability accuracy ≤ 1μm is used to perform a full-size high-precision scan on the bare PCB or FPCB to obtain basic precision data for each bare PCB or FPCB. Preferably, the basic precision data of each bare PCB or FPCB is bound to the unique code of the bare PCB or FPCB and the board separation information.

[0056] In this embodiment, the measuring machine can be placed before the printing press station. After performing a high-precision scan on the bare board and acquiring basic accuracy data, the data is stored and forwarded to subsequent processing equipment, such as the printing press, solder paste inspection machine, pre-reflow AOI, and post-reflow AOI. In an alternative embodiment, the high-precision measuring machine can also be set up separately from the production line. In this way, each incoming bare PCB or FPCB can be scanned with high precision before entering the warehouse to acquire basic accuracy data. The basic accuracy data is then stored in a host computer. During actual production, the equipment in subsequent stations only needs to read the corresponding basic accuracy data from the host computer.

[0057] In one embodiment, obtaining solder paste-related data after the circuit board has been printed with solder paste includes using a solder paste inspection machine to collect the solder paste-related data after the circuit board has been printed with solder paste.

[0058] In one embodiment, the printing press receives the basic accuracy data, aligns the stencil reference point of the printing stencil with the overall board reference point, then compares the mesh coordinates with the actual coordinates of all corresponding pads, adjusts the position of the printing stencil based on the offset between the two, and places the printing stencil over the bare board to ensure that the offset between all meshes and corresponding pads is less than a preset printing deviation threshold. Solder paste is then printed on the bare board circuit. Specifically, if incoming material deformation or quality abnormalities cause a large offset between individual meshes and corresponding pads, but other individual meshes and corresponding pads are well aligned, then all meshes and corresponding pads are adjusted based on the offset between individual meshes and corresponding pads to ensure that the offset between all meshes and corresponding pads is less than the preset printing deviation threshold. Solder paste is then printed on the bare board based on the adjusted meshes and corresponding pads.

[0059] Preferably, the process of using a solder paste inspection machine (SPI) to collect solder paste-related data after solder paste has been printed on the circuit board includes: after solder paste is printed on the bare board, the circuit board with solder paste is transported to the station of the solder paste inspection machine; the solder paste inspection machine performs high-precision positioning of the sub-board reference points of each sub-board to generate sub-board positioning results; based on the sub-board positioning results, the solder paste at each pad of the sub-board is collected point by point to obtain the solder paste-related data. Specifically, the solder paste-related data includes all pad numbers associated with each component number, solder paste data identifiers associated with each pad number; x-axis position detection data and y-axis position detection data of the solder paste at each pad; solder paste area data and solder paste volume data at each pad; and x-axis offset data and y-axis offset data of the solder paste at each pad relative to the corresponding pad.

[0060] In one embodiment, generating a D data stream based on the basic accuracy data, the solder paste association data, and the corresponding component information includes: Confirm the component information corresponding to each pad; Based on the component information, basic accuracy data, and solder paste correlation data, the target component composite mounting coordinates are established.

[0061] Specifically, confirming the component information corresponding to each pad also includes: confirming all pads corresponding to each component and the ownership of the solder paste on the pads, and binding the collected solder paste association data one by one with the pad number, component number, sub-board partition, and whole board / sub-board number.

[0062] In one embodiment, establishing the target component composite mounting coordinates based on the component information, basic accuracy data, and solder paste correlation data includes: The coordinate system of the basic accuracy data and the solder paste associated data is unified into the coordinate system of the basic accuracy data. Specifically, unifying the coordinate system of the basic accuracy data and the solder paste associated data into the coordinate system of the basic accuracy data includes: using the high-precision absolute coordinates of all solder pads acquired by the metrology machine as a unified absolute coordinate reference, accurately aligning the sub-board reference coordinates acquired by the metrology machine with the sub-board reference coordinates acquired by the SPI, completing the coordinate system calibration of the solder paste associated data of the SPI, converting the actual position of the solder paste x / y axis into coordinate values ​​under the absolute coordinate system of the metrology machine, and accurately matching the x / y axis offset of the solder paste relative to the solder pad with the absolute coordinates of the corresponding solder pad. This can completely eliminate the defect of insufficient global coordinate accuracy of the SPI.

[0063] Based on the pad coordinates in the aforementioned basic accuracy data, confirm the component placement coordinates A(x,y). Based on the offset data of the solder paste association data relative to the pad coordinates, the component mounting position offset BA(x,y) is confirmed. Based on the component information, the component mounting coordinates A(x,y) and the component mounting position offset BA(x,y), a preliminary composite mounting coordinate of the component is generated. Based on the component information of the component to be mounted, determine the mounting offset weight coefficient k corresponding to the component to be mounted; The component's initial composite mounting coordinates are adjusted using the mounting offset weight coefficient k to generate the target component's composite mounting coordinates; wherein, the target component's composite mounting coordinates are calculated as follows: C(x,y)=A(x,y)+k×BA(x,y).

[0064] In one embodiment, the calculation method of the synthesized mounting coordinates of the target component is as follows: C(x,y) = A(x,y) + k × BA(x,y), where there are three types of component types. The first type of component (k = 0) is a large-sized component: C(x,y) = A(x,y), and the synthesized coordinates are exactly equal to the mounting coordinates converted from the pad coordinates, ensuring that the pins of the large-sized component are accurately aligned with the pads and meeting the welding reliability requirements of its high alignment accuracy. The second type of component (0 < k < 1, default k = 0.5) is a medium-sized component: C(x,y) = A(x,y) + 0.5 × BA(x,y), and the synthesized coordinates are the weighted average of the component mounting coordinates (measurement machine mounting coordinates) and the mounting offset after SPI conversion, taking into account both the welding reliability of the medium-sized component and the influence of the surface tension of the reflow soldering. The third type of component (k = 1) is a small-sized component: C(x,y) = A(x,y) + BA(x,y), and the synthesized coordinates are equal to the component mounting coordinates (measurement machine mounting coordinates) plus the mounting position offset after SPI conversion, that is, the mounting coordinates matching the actual distribution of the solder paste, ensuring that the micro-components are accurately mounted at the center of the solder paste, avoiding the displacement of the components during reflow soldering, and meeting the high dependence requirements of the micro-components on the distribution position of the solder paste. In this embodiment, C(x,y) is the x / y axis coordinate value of the final synthesized mounting coordinates of the component.

[0065] In one embodiment, based on the x / y axis coordinate values of the final target synthesized mounting coordinates, an independent standardized synthesized coordinate file is generated for the entire FPCB / PCB board and each sub-board. The file uses the unique number of the FPCB / PCB as the core identifier, includes the board splitting information, the final synthesized mounting coordinates of each component, and at the same time associates and embeds the basic accuracy data of the corresponding pads and the solder paste associated data of the corresponding solder paste; the data of this synthesized coordinate file is incorporated into the preset D data stream, and the generated standardized synthesized coordinate file is synchronously sent to the corresponding pick-and-place machine station, the pre-furnace AOI station, and the post-furnace AOI station according to the unique number of the FPCB / PCB. In one embodiment, the integration of the D data stream includes the coordinates of the pads of the entire board, the solder paste coordinates of the entire board, and the data of the final synthesized mounting coordinate file of the component mounting. These data need to be saved throughout the entire process of circuit board production; in one embodiment, the D data is stored in a structured database and supports multi-dimensional retrieval, realizing systematic association and traceability of the entire life cycle of the data, and at the same time can be synchronized to the existing MES system and QMS system on the circuit board production line, providing data support for the full-process digital control of SMT production.

[0066] The pre-furnace AOI 220 is used to obtain the patch result information of each component mounted on the circuit board, and calculate the offset data of each component based on the D data stream to generate the H data stream. In one embodiment, the pre-furnace AOI obtains the patch result information of each component mounted on the circuit board, including: Extract the overall board reference coordinates, sub-board reference coordinates, and sub-board pad coordinates from the D data stream corresponding to the unique number of the circuit board. The AOI in front of the furnace performs full-size scanning inspection of each component on the entire board, and identifies the physical contour of each component through image recognition algorithms; Based on the sub-board reference coordinates, the precise actual X / Y axis coordinates and actual rotation angle values ​​of each component after mounting are determined by a positioning algorithm.

[0067] In one embodiment, AOI is based on a unified coordinate system. It uses the sub-board reference coordinates (PcsMark) in the D data stream as a reference and calculates the precise actual coordinates and actual rotation angles of the components through a positioning algorithm. The core calculation formula is as follows. All parameters are based on the basic accuracy data provided by the metrology machine to unify the coordinate system.

[0068] In one embodiment, the accurate actual coordinates are calculated as follows: Xact = Xpcs + ΔXrel, Yact = Ypcs + ΔYrel, where Xact is the actual X-axis coordinate after component mounting; Yact is the actual Y-axis coordinate after component mounting; Xpcs is the X-axis coordinate of the composite mounting coordinates of components based on the sub-board reference coordinates in the D data stream; Ypcs is the Y-axis coordinate of the composite mounting coordinates of components based on the sub-board reference coordinates in the D data stream; both are determined by the basic accuracy data collected in advance by a high-precision metrology machine. ΔXrel represents the X-axis relative offset of the component detected by AOI relative to the sub-board reference coordinates. Specifically, it is calculated by subtracting the X-axis coordinate of the component based on the sub-board reference coordinates from the X-axis coordinate of the component detected by AOI based on the sub-board reference coordinates in the D data stream. This can be calculated by combining AOI image recognition algorithms with D data stream data. ΔYrel represents the Y-axis relative offset of the component detected by AOI relative to the sub-board reference coordinates. Specifically, it is calculated by subtracting the Y-axis coordinate of the component based on the sub-board reference coordinates from the Y-axis coordinate of the component detected by AOI based on the sub-board reference coordinates in the D data stream. This can also be calculated by combining AOI image recognition algorithms with D data stream data.

[0069] In one embodiment, the actual value of the rotation angle is calculated as follows: θact = θpcs + Δθrel, where θact is the actual rotation angle after component mounting. In this embodiment, a positive θact indicates a clockwise direction, and a negative θact indicates a counterclockwise direction. θpcs is the standard rotation angle of component mounting based on the sub-board reference coordinates in the D data stream, which is pre-collected by a high-precision measurement machine and is 0° by default when there is no offset. Δθrel is the relative offset of the component's rotation angle relative to the sub-board reference coordinates detected by AOI. Specifically, it is calculated by subtracting the component rotation angle detected by AOI based on the sub-board reference coordinates from the standard rotation angle of component mounting based on the sub-board reference coordinates in the D data stream. Specifically, it can be calculated by combining the AOI image recognition algorithm with the D data stream data.

[0070] In one embodiment, the step of calculating the offset data of each component based on the D data stream to generate the H data stream includes: The AOI in front of the furnace synchronously collects at least one of the following components: incorrect, missing, or reversed components, as mounting quality data; Compare the precise actual X / Y axis coordinates and actual rotation angles of the components after mounting with the component offset rotation data between the synthesized mounting coordinates and standard rotation angles in the D data stream; The component offset rotation data is integrated with the mounting quality data to generate an H data stream.

[0071] The pick-and-place machine 230 completes component placement based on the D data stream and performs placement correction based on the H data stream.

[0072] Specifically, the pick-and-place machine uses the target component's composite placement coordinates from the D data stream to place different types of components onto the corresponding pads on the circuit board. Both the pre-reflow AOI and post-reflow AOI stations use the same standardized composite coordinate file as the inspection benchmark, achieving a unified benchmark for placement and inspection.

[0073] In one embodiment, the patch calibration includes orientation calibration and closed-loop verification.

[0074] In one embodiment, the pick-and-place machine performs placement orientation correction based on the H data stream, including: after receiving offset rotation data and placement quality data in the H data stream, the pick-and-place machine autonomously generates adjustment parameters and completes the correction action; based on the offset rotation data, it adjusts parameters such as placement coordinates and rotation angles to complete the position offset correction of the corresponding components of the next FPCB / PCB in the same batch; at the same time, based on the placement quality data, it autonomously completes the program modification, nozzle parameters and other related parameter adjustments.

[0075] In one embodiment, the pick-and-place machine performs a closed-loop calibration based on the H data stream, including: performing full-size inspection on the next calibrated FPCB / PCB after reflow AOI, collecting the actual position coordinates, rotation angle, and mounting quality data of the components, and feeding them back to the data center of the production line host computer or server. The data center compares the deviation of the actual position and rotation angle of the components before and after calibration with the composite mounting coordinates and standard rotation angle, as well as the mounting quality. If the deviation is ≤ a preset qualified threshold and the mounting quality meets the standard, the closed-loop calibration is deemed effective, and the offset rotation data of this calibration is included in the basic data of the same batch of FPCB / PCB for subsequent mounting. If the deviation exceeds the preset threshold or the mounting quality does not meet the standard, the error source is separated by combining the D data stream and AOI detection data again, the offset rotation data is recalculated, and the mounting quality data is integrated to generate an H data stream and sent to the pick-and-place machine to form a dynamic closed loop until the mounting deviation meets the standard requirements of high-precision mounting and the mounting quality meets the standard.

[0076] The above-described circuit board surface mount calibration device can execute the circuit board surface mount calibration method provided in any embodiment of the present invention, and has the corresponding functional modules and beneficial effects for executing the method. Technical details not described in detail in this embodiment can be found in the circuit board surface mount calibration method provided in any embodiment of the present invention. Since the circuit board surface mount calibration device described above is a device capable of executing the circuit board surface mount calibration method in the embodiments of the present invention, those skilled in the art can understand the specific implementation methods and various variations of the circuit board surface mount calibration device in this embodiment based on the circuit board surface mount calibration method described in the embodiments of the present invention. Therefore, how the circuit board surface mount calibration device implements the circuit board surface mount calibration method in the embodiments of the present invention will not be described in detail here. Any device used by those skilled in the art to implement the circuit board surface mount calibration method in the embodiments of the present invention falls within the scope of protection of this application.

[0077] Example 3 Figure 3 A schematic diagram of a circuit board surface mount correction system according to Embodiment 3 of the present invention is shown. Figure 3As shown, the circuit board surface mount calibration system 300 includes the aforementioned circuit board surface mount calibration device 200. The circuit board surface mount calibration device 200 includes at least one processor 11 and a memory communicatively connected to the at least one processor 11. The memory stores a computer program executable by the at least one processor. The processor 11 can perform various appropriate actions and processes based on the computer program stored in the read-only memory (ROM) 12 or loaded from the storage unit 18 into the random access memory (RAM) 13. The RAM 13 may also store various programs and data required for the operation of the circuit board surface mount calibration system 300. The processor 11, ROM 12, and RAM 13 are interconnected via a bus 14. An input / output (I / O) interface 15 is also connected to the bus 14.

[0078] Multiple components of the PCB surface mount calibration system 300 are connected to the I / O interface 15, including: an input unit 16, such as a keyboard, mouse, etc.; an output unit 17, such as various types of displays, speakers, etc.; a storage unit 18, such as a disk, optical disk, etc.; and a communication unit 19, such as a network card, modem, wireless transceiver, etc. The communication unit 19 allows the PCB surface mount calibration system 300 to exchange information / data with other devices through computer networks such as the Internet and / or various telecommunications networks.

[0079] Processor 11 can be a variety of general-purpose and / or special-purpose processing components with processing and computing capabilities. Some examples of processor 11 include, but are not limited to, central processing unit (CPU), graphics processing unit (GPU), various special-purpose artificial intelligence (AI) computing chips, various processors running machine learning model algorithms, digital signal processors (DSPs), and any suitable processor, controller, microcontroller, etc. Processor 11 performs the various methods and processes described above, and the processor of circuit board surface mount correction device 200 implements the circuit board surface mount correction method.

[0080] In some embodiments, the circuit board placement calibration method can be implemented as a computer program tangibly contained in a computer-readable storage medium, such as storage unit 18. In some embodiments, part or all of the computer program can be loaded and / or installed via ROM 12 and / or communication unit 19 onto any station of the circuit board placement calibration apparatus 200 of the circuit board placement calibration system 300, such as a high-precision measuring machine, printer, solder paste inspection machine, pre-reflow AOI, and post-reflow AOI, or it can be loaded and / or installed separately onto a host computer or server of the circuit board placement calibration system 300. When the computer program is loaded into RAM 13 and executed by processor 11, one or more steps of the circuit board placement calibration method described above can be performed. Alternatively, in other embodiments, processor 11 can be configured to perform the circuit board placement calibration method by any other suitable means (e.g., by means of firmware).

[0081] Various embodiments of the systems and techniques described above herein can be implemented in digital electronic circuit systems, integrated circuit systems, field-programmable gate arrays (FPGAs), application-specific integrated circuits (ASICs), application-specific standard products (ASSPs), systems-on-a-chip (SoCs), payload-programmable logic devices (CPLDs), computer hardware, firmware, software, and / or combinations thereof. These various embodiments may include implementations in one or more computer programs that can be executed and / or interpreted on a programmable system including at least one programmable processor, which may be a dedicated or general-purpose programmable processor, capable of receiving data and instructions from a storage system, at least one input device, and at least one output device, and transmitting data and instructions to the storage system, the at least one input device, and the at least one output device.

[0082] Computer programs used to implement the methods of the present invention may be written in any combination of one or more programming languages. These computer programs may be provided to a processor of a general-purpose computer, a special-purpose computer, or other programmable data processing device, such that when executed by the processor, the computer programs cause the functions / operations specified in the flowcharts and / or block diagrams to be performed. The computer programs may be executed entirely on a machine, partially on a machine, or as a standalone software package, partially on a machine and partially on a remote machine, or entirely on a remote machine or server.

[0083] In the context of this invention, a computer-readable storage medium can be a tangible medium that may contain or store a computer program for use by or in conjunction with an instruction execution system, apparatus, or device. A computer-readable storage medium may include, but is not limited to, electronic, magnetic, optical, electromagnetic, infrared, or semiconductor systems, apparatus, or devices, or any suitable combination thereof. Alternatively, a computer-readable storage medium may be a machine-readable signal medium. More specific examples of machine-readable storage media include electrical connections based on one or more wires, portable computer disks, hard disks, random access memory (RAM), read-only memory (ROM), erasable programmable read-only memory (EPROM or flash memory), optical fibers, portable compact disk read-only memory (CD-ROM), optical storage devices, magnetic storage devices, or any suitable combination thereof.

[0084] To provide interaction with a user, the systems and techniques described herein can be implemented on a mobile terminal having: a display device for displaying information to the user (e.g., a CRT (cathode ray tube) or LCD (liquid crystal display) monitor); and a keyboard and pointing device (e.g., a mouse or trackball) through which the user provides input to the mobile terminal. Other types of devices can also be used to provide interaction with the user; for example, feedback provided to the user can be any form of sensory feedback (e.g., visual feedback, auditory feedback, or tactile feedback); and input from the user can be received in any form (including sound input, voice input, or tactile input).

[0085] The systems and technologies described herein can be implemented in computing systems that include backend components (e.g., as data servers), or middleware components (e.g., application servers), or frontend components (e.g., user computers with graphical user interfaces or web browsers through which users can interact with implementations of the systems and technologies described herein), or any combination of such backend, middleware, or frontend components. The components of the system can be interconnected via digital data communication of any form or medium (e.g., communication networks). Examples of communication networks include local area networks (LANs), wide area networks (WANs), blockchain networks, and the Internet.

[0086] A computing system can include clients and servers. Clients and servers are generally located far apart and typically interact through communication networks. The client-server relationship is created by computer programs running on the respective computers and having a client-server relationship with each other. The server can be a cloud server, also known as a cloud computing server or cloud host, which is a hosting product within the cloud computing service system to address the shortcomings of traditional physical hosts and VPS services, such as high management difficulty and weak business scalability.

[0087] Example 4 Embodiment 4 of the present invention also provides a computer storage medium for storing a computer program, which, when executed by a computer processor, is used to perform the circuit board patch correction method described in any of the above embodiments of the present invention.

[0088] The computer storage medium of this invention can be any combination of one or more computer-readable media. A computer-readable medium can be a computer-readable signal medium or a computer-readable storage medium. A computer-readable storage medium can be, for example, but not limited to, an electrical, magnetic, optical, electromagnetic, infrared, or semiconductor system, apparatus, or device, or any combination thereof. More specific examples of computer-readable storage media (a non-exhaustive list) include: an electrical connection having one or more wires, a portable computer disk, a hard disk, random access memory (RAM), read-only memory (ROM), erasable programmable read-only memory (EPROM, or flash memory), optical fiber, portable compact disk read-only memory (CD-ROM), optical storage device, magnetic storage device, or any suitable combination thereof. In this document, a computer-readable storage medium can be any tangible medium that contains or stores a program that can be used by or in conjunction with an instruction execution system, apparatus, or device.

[0089] Computer-readable signal media may include data signals propagated in baseband or as part of a carrier wave, carrying computer-readable program code. Such propagated data signals may take various forms, including but not limited to electromagnetic signals, optical signals, or any suitable combination thereof. Computer-readable signal media may also be any computer-readable medium other than computer-readable storage media, capable of sending, propagating, or transmitting programs for use by or in connection with an instruction execution system, apparatus, or device.

[0090] Program code contained on a computer-readable medium may be transmitted using any suitable medium, including but not limited to wireless, wire, optical fiber, radio frequency (RF), or any suitable combination thereof.

[0091] The specific embodiments described above do not constitute a limitation on the scope of protection of this invention. Those skilled in the art should understand that various modifications, combinations, sub-combinations, and substitutions can be made according to design requirements and other factors. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of this invention should be included within the scope of protection of this invention.

Claims

1. A method for correcting surface mount technology (SMT) on a circuit board, characterized in that, include: Acquire basic precision data of the bare circuit board state and solder paste correlation data after the circuit board has been printed with solder paste; Based on the basic accuracy data, the solder paste association data, and the corresponding component information, a D data stream is generated and sent to the pick-and-place machine and the AOI in front of the furnace. The pick-and-place machine completes the placement of components based on the D data stream; The pre-furnace AOI acquires the placement result information of each component on the circuit board after mounting, and calculates the offset data of each component based on the D data stream to generate the H data stream; The chip mounter performs chip mounting correction based on the H data stream.

2. The circuit board patch calibration method according to claim 1, characterized in that, The basic accuracy data for obtaining the bare circuit board status includes: using a high-precision measuring machine to collect data from the bare circuit board to obtain basic accuracy data. The basic accuracy data includes at least one of the following: whole board reference coordinates, sub-board reference coordinates, sub-board pad coordinates, positioning offset, and board separation information.

3. The circuit board patch calibration method according to claim 2, characterized in that, The step of acquiring solder paste association data after the circuit board has been printed with solder paste includes using a solder paste inspection machine to collect the solder paste association data after the circuit board has been printed with solder paste. The solder paste association data includes at least one of the following: all pad numbers associated with each component number, solder paste data identifier associated with each pad number, x-axis position detection data and y-axis position detection data of the solder paste at each pad, solder paste area data and solder paste volume data at each pad, and x-axis offset data and y-axis offset data of the solder paste at each pad relative to the corresponding pad.

4. The circuit board patch calibration method according to claim 2, characterized in that, The generation of the D data stream based on the basic accuracy data, the solder paste association data, and the corresponding component information includes: Confirm the component information corresponding to each pad; Based on the component information, basic accuracy data, and solder paste correlation data, the target component composite mounting coordinates are established.

5. The circuit board patch calibration method according to claim 4, characterized in that, The step of establishing the target component assembly coordinates based on the component information, basic accuracy data, and solder paste correlation data includes: The coordinate system of the basic accuracy data and the solder paste correlation data is unified into the coordinate system of the basic accuracy data; The component mounting coordinates A(x,y) are confirmed based on the pad coordinates in the aforementioned basic accuracy data. Based on the offset data of the solder paste association data relative to the pad coordinates, the component mounting position offset BA(x,y) is confirmed; Based on the component information, the component mounting coordinates A(x,y) and the component mounting position offset BA(x,y), a preliminary composite mounting coordinate of the component is generated. Based on the component information of the component to be mounted, determine the mounting offset weight coefficient k corresponding to the component to be mounted; The component's initial composite mounting coordinates are adjusted using the mounting offset weight coefficient k to generate the target component's composite mounting coordinates; wherein, the target component's composite mounting coordinates are calculated as follows: C(x,y)=A(x,y)+k×BA(x,y).

6. The circuit board surface mount calibration method according to claim 2, characterized in that, The pre-reflow AOI acquires the placement result information of each component on the circuit board after placement, including: Extract the overall board reference coordinates, sub-board reference coordinates, and sub-board pad coordinates from the D data stream corresponding to the unique number of the circuit board. The AOI in front of the furnace performs full-size scanning inspection of each component on the entire board, and identifies the physical contour of each component through image recognition algorithms; Based on the sub-board reference coordinates, the precise actual X / Y axis coordinates and actual rotation angle values ​​of each component after mounting are determined by a positioning algorithm.

7. The circuit board patch calibration method according to claim 6, characterized in that, The step of calculating the offset data of each component based on the D data stream to generate the H data stream includes: The AOI in front of the furnace synchronously collects at least one of the following components: incorrect, missing, or reversed components, as mounting quality data; Compare the precise actual X / Y axis coordinates and actual rotation angles of the components after mounting with the component offset rotation data between the synthesized mounting coordinates and standard rotation angles in the D data stream; The component offset rotation data is integrated with the mounting quality data to generate an H data stream.

8. A circuit board patch alignment device, characterized in that, include: Solder paste inspection machine is used to obtain basic accuracy data on the bare state of circuit boards and related data on solder paste after the circuit board has been printed with solder paste. Based on the basic accuracy data, the solder paste association data, and the corresponding component information, a D data stream is generated and sent to the pick-and-place machine and the AOI in front of the furnace. The pre-furnace AOI is used to obtain the placement result information of each component on the circuit board after placement, and to calculate the offset data of each component based on the D data stream to generate the H data stream; The pick-and-place machine completes component placement based on the D data stream and performs placement correction based on the H data stream.

9. A circuit board surface mount calibration system, characterized in that, include: One or more processors; Memory, used to store one or more programs; When the one or more programs are executed by the one or more processors, the one or more processors implement the circuit board patch correction method as described in any one of claims 1-7.

10. A storage medium having a computer program stored thereon, characterized in that, When executed by the processor, the program implements the circuit board patch correction method as described in any one of claims 1-7.

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