A holographic transparent crystal film LED screen comprehensive production system

Abstract

This invention discloses a comprehensive production system for holographic transparent crystalline film LED screens, belonging to the technical field of LED screen production equipment. The system includes sequentially connected units for crystalline film pretreatment, LED chip mass transfer, holographic encapsulation, curing and molding, inspection and screening, and finished product cutting and packaging. Each unit is connected via a closed-loop conveyor mechanism and equipped with adjustable positioning fixtures and a central control system. This invention solves the problems of poor coordination, insufficient adaptability, and imperfect inspection feedback in existing equipment, achieving fully automated production throughout the entire process. It is adaptable to products of different sizes, improving production efficiency, product consistency, and pass rate, avoiding problems such as crystalline film damage and chip bonding deviations. It is suitable for small-scale high-precision, medium-scale general-purpose, and large-scale high-efficiency mass production scenarios, facilitating the large-scale, high-quality mass production of holographic transparent crystalline film LED screens.

Description

Technical Field

[0001] This invention relates to the field of LED screen production equipment technology, specifically to a comprehensive production system for holographic transparent crystal film LED screens. Background Technology

[0002] Holographic transparent crystal film LED screens, as a new type of display device, combine the stereoscopic visual effect of holographic imaging with the transparency of transparent display. They are widely used in commercial displays, smart homes, automotive displays, and many other fields, and have broad market prospects. However, the current production process of holographic transparent crystal film LED screens still has many shortcomings. Existing production equipment is mostly single-function modules, lacking efficient coordination and connection between modules. Manual handling of semi-finished product transfer and positioning is required, leading to low production efficiency, increased labor costs, and susceptibility to product consistency and pass rate issues due to human error.

[0003] Meanwhile, holographic transparent crystal films are characterized by their special material properties, thinness, and high transparency requirements. Traditional LED screen production equipment cannot meet the needs of their pre-processing, chip transfer, and packaging processes, easily leading to problems such as crystal film surface damage, chip bonding deviations, poor holographic display effects, and poor packaging sealing. This severely restricts the large-scale, high-quality production of holographic transparent crystal film LED screens. Furthermore, existing production systems lack a comprehensive detection and feedback mechanism, making it difficult to monitor various parameters during the production process in real time and to promptly identify and resolve production defects, further reducing production efficiency and product qualification rates.

[0004] Therefore, developing a comprehensive production system that can achieve collaborative, automated, and precise production, and is adapted to the characteristics of holographic transparent crystal films, has become a pressing technical problem to be solved in this field. Summary of the Invention

[0005] The technical problem to be solved by this invention is that existing holographic transparent crystal film LED screen production equipment suffers from poor coordination, insufficient adaptability, and a lack of a sound testing and feedback mechanism, resulting in low production efficiency, product consistency, and pass rate, which fails to meet the needs of large-scale high-quality production.

[0006] To solve the above-mentioned technical problems, the technical solution adopted by the present invention is as follows: a holographic transparent crystal film LED screen integrated production system, comprising a crystal film pretreatment unit, an LED chip mass transfer unit, a holographic encapsulation unit, a curing and molding unit, an inspection and screening unit, and a finished product cutting and packaging unit connected in sequence. Each unit is connected by a conveying mechanism to form a closed-loop production line. The conveying mechanism is equipped with an adjustable positioning fixture for adapting to the positioning and conveying of holographic transparent crystal film LED screen semi-finished products and finished products of different sizes.

[0007] As a further aspect of the present invention: the crystal film pretreatment unit includes a crystal film cleaning module, a plasma modification module and a drying module arranged in sequence. The crystal film cleaning module adopts ultrasonic cleaning and is equipped with an adjustable frequency ultrasonic generator. The plasma modification module is used to activate the surface of the crystal film and improve the adhesion of the crystal film surface. The drying module adopts a hot air circulation drying structure, and the drying temperature can be adjusted within the range of 40-80℃.

[0008] As a further aspect of the present invention: the LED chip mass transfer unit includes a chip feeding module, a vision positioning module, a precision transfer module, and a bonding and pressing module. The vision positioning module uses a binocular vision recognition camera, which can achieve micron-level positioning accuracy. The precision transfer module uses a vacuum adsorption transfer head, in conjunction with a linear drive mechanism, to achieve precise bonding of the LED chip on the crystal film substrate. The pressing pressure of the bonding and pressing module can be adaptively adjusted according to the chip size and crystal film characteristics.

[0009] As a further aspect of the present invention: the holographic encapsulation unit includes a holographic film feeding module, an encapsulating adhesive coating module, and a holographic alignment and bonding module. The encapsulating adhesive coating module adopts a combination of dispensing and scraping to uniformly coat transparent encapsulating adhesive. The holographic alignment and bonding module is equipped with a holographic phase calibration component to ensure precise alignment between the holographic film and the LED chip array. Constant temperature and pressure control can be achieved during the bonding process.

[0010] As a further aspect of the present invention: the curing and molding unit includes an ultraviolet curing module and a thermal curing module. The ultraviolet curing module is equipped with multiple sets of adjustable power ultraviolet lamps, which can adjust the ultraviolet irradiation intensity and irradiation time according to the thickness of the encapsulating adhesive. The thermal curing module adopts a constant temperature hot air circulation structure, and the curing temperature can be precisely controlled within the range of 80-120℃. It is also equipped with a temperature monitoring and feedback component to realize real-time compensation of the curing temperature.

[0011] As a further aspect of the present invention: the detection and screening unit includes an appearance inspection module, an optoelectronic performance inspection module, a holographic display effect inspection module, and a defective product marking module. The appearance inspection module is used to detect scratches, bubbles, and chip bonding deviations on the crystal film surface. The optoelectronic performance inspection module is used to detect the brightness, color difference, and luminous uniformity of the LED chip. The holographic display effect inspection module is used to detect the holographic imaging clarity, viewing angle range, and transparency. The defective product marking module can automatically mark and divert unqualified semi-finished products.

[0012] As a further aspect of the present invention: the finished product cutting and packaging unit includes a precision cutting module, an edge polishing module, and a finished product packaging module. The precision cutting module adopts laser cutting and is equipped with a high-precision positioning guide rail, which can achieve precise cutting of the finished product according to the preset size, with a cutting error of no more than ±0.1mm. The edge polishing module is used to polish the edges of the cut finished product to remove burrs. The finished product packaging module adopts a transparent waterproof packaging structure to improve the moisture-proof and impact-proof performance of the finished product.

[0013] As a further aspect of the present invention: the LED chip mass transfer unit is also equipped with a chip detection preprocessing module, which is used to perform appearance and electrical performance detection on the LED chips before transfer, and to remove damaged or substandard chips to ensure the consistency of the transferred chips. The chip feeding module adopts a vibration feeding structure, which, together with the automatic feeding component of the hopper, realizes continuous and stable chip feeding.

[0014] As a further aspect of the present invention: the detection and screening unit is also equipped with a data acquisition and analysis module, which can collect the detection data of each detection module in real time, generate a detection report, and conduct a preliminary analysis of the causes of defective products, providing data support for the optimization of production processes. The data acquisition and analysis module can realize the functions of storing, querying and exporting detection data.

[0015] As a further aspect of the present invention, it also includes a central control system, which is electrically connected to each production unit, conveying mechanism and detection module, and can realize the coordinated control of each unit, precise regulation of production parameters, real-time monitoring of production process and fault alarm function. The central control system supports both manual operation and automatic operation modes, which can be flexibly switched according to production needs.

[0016] Compared with the prior art, the present invention has the following advantages:

[0017] This invention solves the problems of poor coordination and the need for manual transfer and positioning in existing production equipment by setting up sequentially connected and coordinated production units, along with a closed-loop conveying mechanism and adjustable positioning fixtures. It achieves fully automated production of holographic transparent crystal film LED screens from pre-processing to finished product packaging, significantly improving production efficiency, reducing labor costs, minimizing human error, and enhancing product consistency. Each production unit is specifically adapted to the material characteristics of the holographic transparent crystal film, effectively avoiding problems such as crystal film surface damage, chip bonding deviation, and poor holographic display effects, ensuring product display performance and packaging quality. A comprehensive testing and screening unit and data acquisition and analysis module can monitor production parameters in real time, accurately identify defective products, and analyze the causes of failures, facilitating timely optimization of production processes and further improving product qualification rates. This helps achieve large-scale, high-quality mass production of holographic transparent crystal film LED screens, demonstrating significant practical value and market potential. Attached Figure Description

[0018] The accompanying drawings are provided to further illustrate the invention and form part of the specification. They are used in conjunction with embodiments of the invention to explain the invention and do not constitute a limitation thereof. In the drawings:

[0019] Figure 1 This is a framework diagram of a holographic transparent crystal film LED screen integrated production system according to the present invention. Detailed Implementation

[0020] The present invention will be further described in detail below with reference to specific embodiments. The following embodiments are used to illustrate the present invention, but are not limited to the scope of protection of the present invention. Example 1: Applicable to small-scale, high-precision mass production scenarios

[0021] This embodiment provides a comprehensive production system for holographic transparent crystal film LED screens, which is suitable for the production of small holographic transparent crystal film LED screens with sizes ranging from 100mm×80mm to 300mm×200mm. It focuses on ensuring product precision and meets the needs of high-end automotive displays and small smart terminals.

[0022] The system includes a pre-processing unit for crystal films, a mass transfer unit for LED chips, a holographic encapsulation unit, a curing and molding unit, a detection and screening unit, and a finished product cutting and packaging unit connected in sequence. Each unit is connected by a linear closed-loop conveying mechanism. The conveying speed can be adjusted within the range of 0.5-1m / min. The adjustable positioning fixture on the conveying mechanism adopts a flexible silicone clamping structure, and the clamping pressure can be adjusted between 0.1-0.3MPa to avoid damage to the thin crystal film during the clamping process.

[0023] In the pretreatment unit for the crystal film, the crystal film cleaning module uses an adjustable frequency ultrasonic generator of 200-400kHz, with the cleaning time controlled at 3-5 minutes. The cleaning solution uses a neutral and transparent cleaning agent to avoid corroding the crystal film. The plasma modification module uses a low-temperature plasma generator with a processing power of 500-800W and a processing time of 60-90 seconds to improve the adhesion of the crystal film surface to above 0.8N / mm. The drying module uses a hot air circulation drying structure with a drying temperature set at 50-60℃ and a drying time of 2-3 minutes to ensure that there are no residual water stains on the crystal film surface.

[0024] In the LED chip mass transfer unit, the visual positioning module uses a binocular visual recognition camera with a positioning accuracy of ±0.01mm. The precision transfer module uses an array-type vacuum adsorption transfer head (adsorption hole diameter 0.1mm), coupled with a linear motor drive mechanism, with a transfer speed of 1000-1500 chips / minute. The bonding and pressing module sets the pressing pressure to 0.2-0.4MPa and the pressing temperature to 25-30℃ (room temperature pressing) to avoid high-temperature damage to the chips and crystal film. The chip detection and pre-processing module uses a high-definition visual inspection camera (12 million pixels), coupled with a continuity detection component, to remove damaged or short-circuited chips, with a screening pass rate of ≥99.8%. The chip feeding module uses a small vibratory feeding structure with a hopper capacity of 5000-10000 chips, equipped with an automatic replenishment sensor that automatically replenishes the chip when the remaining chip in the hopper is less than 1000 chips.

[0025] In the holographic encapsulation unit, the encapsulation adhesive coating module adopts a combination of dispensing and scraping methods. The dispensing accuracy is ±0.02mm, and the scraping thickness is controlled between 0.1-0.2mm. The encapsulation adhesive is a high-transparency UV-curable adhesive (transmittance ≥98%). The holographic alignment and bonding module is equipped with a holographic phase calibration component with a calibration accuracy of ±0.03mm. During the bonding process, the temperature is controlled at 25℃ and the pressure is controlled at 0.1-0.2MPa to ensure that the holographic film and the LED chip array are precisely aligned without any offset.

[0026] In the curing and molding unit, the UV curing module is equipped with 3 sets of adjustable power UV lamps (power 500-1000W), with an irradiation time of 30-60s and the irradiation intensity adaptively adjusted according to the thickness of the encapsulating adhesive; the thermosetting module adopts a constant temperature hot air circulation structure, with the curing temperature set at 90-100℃ and the curing time at 10-15min. The temperature monitoring and feedback component uses a PT100 temperature sensor with a temperature error ≤±2℃, achieving real-time compensation of the curing temperature.

[0027] In the inspection and screening unit, the appearance inspection module uses a high-definition industrial camera (10 megapixels), combined with image processing algorithms, to identify scratches ≥0.05mm, bubbles ≥0.1mm, and chip bonding deviations ≥0.03mm; the photoelectric performance inspection module detects the brightness of LED chips (range 100-500 cd / m²). 2The system includes: color difference (ΔE≤2) and luminous uniformity (uniformity≥95%); holographic display effect detection module detects holographic imaging clarity (resolution≥1080P), viewing angle range (120-150°), and transparency (≥90%); data acquisition and analysis module collects various test data in real time, generates test reports for each batch of products, which can be stored, queried, and exported, and performs preliminary analysis on the causes of defective products (such as chip bonding deviation, encapsulation glue bubbles), providing support for process optimization; defective product marking module uses laser marking with a marking accuracy of ±0.1mm, and automatically diverts the marked products to the defective product collection bin.

[0028] In the finished product cutting and packaging unit, the precision cutting module uses a small laser cutting machine with a cutting accuracy of ±0.05mm and a cutting error of no more than ±0.1mm, and a cutting speed of 10-15mm / s; the edge polishing module uses a flexible polishing head with a polishing speed of 1000-1500r / min, and the finished product edges are free of burrs and scratches after polishing; the finished product packaging module uses a transparent waterproof packaging film (waterproof rating IP65), and the packaging process is kept at a constant temperature of 30℃ and a constant pressure of 0.1MPa to ensure the sealing performance.

[0029] The system also includes a central control system, which uses a PLC controller and is electrically connected to each production unit, conveying mechanism and detection module. It can realize coordinated control of each unit, precise adjustment of production parameters (adjustment accuracy ≤ ±5%), real-time monitoring of production process and fault alarm (alarm response time ≤ 3s). It supports both manual operation and automatic operation modes. In automatic operation mode, the production efficiency of a single batch is 50-80 pieces / hour and the product qualification rate is ≥ 98.5%. Example 2: Applicable to medium-scale general mass production scenarios

[0030] This embodiment provides a comprehensive production system for holographic transparent crystal film LED screens, which is suitable for the production of medium-sized holographic transparent crystal film LED screens with sizes ranging from 300mm×200mm to 800mm×600mm. It balances production efficiency and product quality, and meets the needs of general scenarios such as commercial displays and smart homes.

[0031] The overall structure of this system is the same as that of Example 1. The core difference lies in the adaptation of the parameters and structure of each unit to the needs of large-scale production, as detailed below:

[0032] The conveying mechanism adopts a wide-range closed-loop conveying structure, and the conveying speed can be adjusted within the range of 1-2m / min. The adjustable positioning fixture adopts a telescopic clamping structure to adapt to crystal films of different widths. The clamping pressure can be adjusted between 0.2-0.4MPa, improving clamping stability and adapting to continuous mass production.

[0033] In the pretreatment unit for the crystal film, the crystal film cleaning module uses an adjustable frequency ultrasonic generator of 150-350kHz, with a cleaning time controlled at 2-4 minutes. It is equipped with an automatic cleaning fluid replacement component, which automatically replaces the cleaning fluid after each batch of production. The plasma modification module has a processing power of 800-1200W and a processing time of 40-80 seconds, which improves the adhesion of the crystal film surface to above 0.7N / mm. The drying module has a drying temperature set at 60-70℃ and a drying time of 1.5-2.5 minutes. It adopts a double-layer hot air circulation structure, which improves the drying efficiency by 30%.

[0034] In the LED chip mass transfer unit, the visual positioning module achieves a positioning accuracy of ±0.02mm, the precision transfer module adopts a large array-type vacuum adsorption transfer head (adsorption hole diameter 0.15mm), the transfer speed is 2000-3000 chips / minute, the bonding and pressing module has a pressing pressure set at 0.3-0.5MPa, and a pressing temperature of 30-35℃; the chip detection and pre-processing module adopts a dual-camera synchronous detection structure, which improves the screening efficiency by 50% and the screening pass rate is ≥99.7%; the chip feeding module adopts a medium-sized vibrating feeding structure, the hopper capacity is 20000-50000 chips, and the automatic replenishment response time is ≤5s.

[0035] In the holographic encapsulation unit, the dispensing accuracy of the encapsulation adhesive coating module is ±0.03mm, the adhesive thickness is controlled at 0.2-0.3mm, and the encapsulation adhesive uses a general-purpose high-transparency UV-curing adhesive (transmittance ≥97%). The holographic alignment and bonding module achieves a calibration accuracy of ±0.04mm. During the bonding process, the temperature is controlled at 28℃ and the pressure is controlled at 0.2-0.3MPa. Equipped with dual alignment components, the alignment efficiency is improved by 40%.

[0036] In the curing and molding unit, the UV curing module is equipped with 5 sets of adjustable power UV lamps with an irradiation time of 20-50s; the heat curing module has a curing temperature set at 100-110℃ and a curing time of 8-12min; the temperature monitoring and feedback component uses dual sensors for synchronous monitoring with a temperature error ≤±1.5℃.

[0037] In the inspection and screening unit, the appearance inspection module uses dual cameras for simultaneous inspection, which can identify scratches ≥0.08mm, bubbles ≥0.15mm, and chip bonding deviations ≥0.05mm; the photoelectric performance inspection module detects the brightness of the LED chip (range 200-600cd / m²). 2 The holographic display effect detection module detects the holographic imaging clarity (resolution ≥720P), viewing angle range (110-140°), and transparency (≥88%). The data acquisition and analysis module supports comparative analysis of multiple batches of data, and improves the defective product diversion speed by 60%.

[0038] In the finished product cutting and packaging unit, the precision cutting module uses a medium-sized laser cutting machine with a cutting speed of 15-25mm / s; the edge grinding module uses multiple grinding heads for synchronous grinding with a grinding speed of 1500-2000r / min, which improves grinding efficiency by 50%; the finished product packaging module uses a general-purpose transparent waterproof packaging film (waterproof rating IP64), which improves packaging speed by 40%.

[0039] The central control system adopts PLC + touch screen control, supports multi-parameter batch setting, and in automatic operation mode, the production efficiency of a single batch is 100-150 pieces / hour, and the product qualification rate is ≥97.5%. Example 3: Applicable to large-scale, high-efficiency mass production scenarios

[0040] This embodiment provides a comprehensive production system for holographic transparent crystal film LED screens, which is suitable for the production of large holographic transparent crystal film LED screens with sizes ranging from 800mm×600mm to 1500mm×1000mm. It focuses on improving production efficiency and meeting the large-scale mass production needs of large commercial advertising screens, stadium displays, and other applications.

[0041] The overall structure of this system is consistent with that of Examples 1 and 2. The core difference lies in the structural upgrades and parameter optimizations of each unit, making it suitable for large-scale, high-efficiency mass production, as detailed below:

[0042] The conveying mechanism adopts an ultra-wide closed-loop conveying structure, and the conveying speed can be adjusted within the range of 2-3m / min. The adjustable positioning fixture adopts a multi-group synchronous clamping structure, and the clamping pressure can be adjusted between 0.3-0.5MPa. It is equipped with an automatic positioning deviation correction component with a correction accuracy of ±0.05mm, ensuring positioning stability in large-scale continuous production.

[0043] The pretreatment unit for the crystal film adopts a dual-station parallel structure, which can process two crystal films simultaneously. The crystal film cleaning module uses an adjustable frequency ultrasonic generator of 100-300kHz, and the cleaning time is controlled within 1-3 minutes. It is equipped with a high-pressure spray auxiliary cleaning component, which improves the cleaning efficiency by 60%. The plasma modification module uses multiple sets of low-temperature plasma generators with a processing power of 1200-1500W and a processing time of 30-60 seconds, which improves the adhesion of the crystal film surface to above 0.6N / mm. The drying module adopts a hot air + infrared composite drying structure, with the drying temperature set at 70-80℃ and the drying time at 1-2 minutes, which improves the drying efficiency by 70%, ensuring that the crystal film is dried quickly and without deformation.

[0044] The LED chip mass transfer unit adopts a dual-transfer-head parallel structure. The visual positioning module uses a four-eye visual recognition camera with a positioning accuracy of ±0.03mm. The precision transfer module uses a large array-type vacuum adsorption transfer head (adsorption hole diameter 0.2mm) with a transfer speed of 3000-5000 chips / minute. The bonding and pressing module uses multiple sets of pressing heads for synchronous pressing with a pressing pressure set at 0.4-0.6MPa and a pressing temperature at 35-40℃, improving pressing efficiency by 80%. The chip detection and pre-processing module adopts a streamlined detection structure with multi-camera synchronous detection, improving screening efficiency by 80% and achieving a screening pass rate of ≥99.5%. The chip feeding module adopts a large vibratory feeding structure with a hopper capacity of 100,000-200,000 chips and is equipped with a dual-hopper alternating feeding component to achieve uninterrupted feeding.

[0045] The holographic encapsulation unit adopts a dual-station parallel encapsulation structure. The encapsulation adhesive coating module uses a combination of dispensing, scraping, and spraying. The dispensing accuracy is ±0.04mm, and the scraping thickness is controlled at 0.3-0.4mm. The encapsulation adhesive uses a high-efficiency transparent UV curing adhesive (transmittance ≥96%), which improves the curing speed by 50%. The holographic alignment and bonding module uses a dual-phase calibration component with a calibration accuracy of ±0.05mm. During the bonding process, the temperature is controlled at 30℃ and the pressure is controlled at 0.3-0.4MPa, which improves the bonding efficiency by 70%.

[0046] The curing and molding unit adopts a multi-channel parallel curing structure. The UV curing module is equipped with 8 sets of adjustable power UV lamps with an irradiation time of 15-40s and the irradiation intensity can be adjusted in batches. The thermal curing module adopts a constant temperature hot air circulation + infrared assisted curing structure with a curing temperature set at 110-120℃ and a curing time of 5-10min. The temperature monitoring feedback component adopts multi-sensor distributed monitoring with a temperature error of ≤±1℃, improving curing efficiency by 80%.

[0047] The inspection and screening unit adopts a streamlined, multi-module synchronous inspection structure. The appearance inspection module uses a multi-camera array to identify scratches ≥0.1mm, bubbles ≥0.2mm, and chip bonding deviations ≥0.08mm. The photoelectric performance inspection module uses multiple sets of inspection probes for synchronous inspection, improving inspection efficiency by 90% and detecting LED chip brightness (range 300-700 cd / m²). 2 The system measures color difference (ΔE≤3) and luminous uniformity (uniformity≥90%). The holographic display effect detection module adopts a panoramic detection structure to detect holographic imaging clarity (resolution≥720P), viewing angle range (100-130°), and transparency (≥85%). The data acquisition and analysis module supports real-time big data analysis and can automatically generate process optimization suggestions. Defective product marking and diversion adopt automated assembly line operation, improving diversion efficiency by 100%.

[0048] The finished product cutting and packaging unit uses a large laser cutting machine equipped with multiple cutting heads for synchronous cutting at a speed of 25-35mm / s, a cutting accuracy of ±0.08mm, and a cutting error of no more than ±0.1mm. The edge polishing module uses multiple flexible polishing heads for synchronous polishing at a speed of 2000-2500r / min, resulting in smooth and flawless edges on the finished product. The finished product packaging module uses a high-efficiency transparent waterproof packaging film (waterproof rating IP64) and is equipped with an automated packaging production line, improving packaging efficiency by 90%.

[0049] The central control system adopts industrial computer + PLC collaborative control, supports remote monitoring, remote parameter adjustment and remote fault diagnosis, and is equipped with a production planning management module, which can realize batch production planning, execution and monitoring. In automatic operation mode, the single batch production efficiency is 200-300 pieces / hour, and the product qualification rate is ≥96.5%. Comparative Analysis of Examples

[0050] The above three embodiments are all based on the core technical solution of the present invention (sequentially connected production units, closed-loop conveying mechanism, adjustable positioning fixture and central control system). The structure, parameters and efficiency of each unit are differentiated according to the needs of different production scenarios. The specific comparative analysis of the three is as follows:

[0051] Regarding the size of the products to be adapted, Example 1 focuses on small holographic transparent crystal film LED screens, with an adaptation range of 100mm×80mm-300mm×200mm, mainly meeting the small-scale customized mass production needs of high-end automotive displays and small smart terminals; Example 2 is adapted to medium-sized products, with a size range of 300mm×200mm-800mm×600mm, corresponding to medium-scale general mass production scenarios such as commercial displays and smart homes; Example 3 is for large products, with an adaptation range of 800mm×600mm-1500mm×1000mm, used for large-scale mass production scenarios such as large commercial advertising screens and stadium displays.

[0052] In terms of core design focus, the three present significant differences: Example 1 focuses on improving product precision and reducing the damage rate of crystal films and chips, emphasizing high-precision control throughout the process to meet high-end customized needs; Example 2 pursues a balance between efficiency and quality, aiming for universal adaptability, taking into account the production needs of different medium-sized products, and has outstanding cost performance; Example 3 focuses on improving production efficiency, achieving large-scale continuous mass production and reducing batch production costs through designs such as multi-station parallel operation and uninterrupted material supply.

[0053] Regarding production parameters, the conveying speed increases with production scale. Example 1 shows 0.5-1 m / min, Example 2 increases to 1-2 m / min, and Example 3 reaches 2-3 m / min, matching the mass production efficiency requirements of various scenarios. The LED chip transfer speed also gradually increases: Example 1 shows 1000-1500 chips / minute, Example 2 shows 2000-3000 chips / minute, and Example 3 reaches 3000-5000 chips / minute, directly determining the difference in single-batch production efficiency—Example 1 has a single-batch efficiency of 50-80 pieces / hour, Example 2 has 100-150 pieces / hour, and Example 3 increases to 200-300 pieces / hour. Correspondingly, the product qualification rate adjusts slightly with the increase in efficiency. Example 1, focusing on precision, has the highest qualification rate, reaching ≥98.5%, Example 2 has ≥97.5%, and Example 3 has ≥96.5%, all meeting the product quality requirements of their respective scenarios.

[0054] Regarding the differences in core structures, Example 1 adopts a single-station, small-component design, equipped with a flexible clamping structure and high-precision detection components to maximize product accuracy and reduce damage; Example 2 adopts a structure combining single-station and dual-station designs, paired with medium-sized components, and adds synchronous detection and pressing functions, balancing efficiency and stability; Example 3 is fully upgraded to a multi-station parallel structure, equipped with large components, dual transfer heads, dual material bins, and distributed monitoring components to achieve uninterrupted material supply, synchronous production, and efficient detection, significantly improving mass production efficiency.

[0055] In terms of key advantages, the core advantage of Example 1 is its high precision and low damage rate, which can accurately match the customized needs of high-end small products; Example 2 has high cost performance and wide adaptability, which can flexibly cope with the production of various medium-sized products and balance production efficiency and product quality; Example 3 has the advantage of high production efficiency and continuous mass production, which can effectively reduce the labor and time costs of large-scale production and adapt to the needs of batch supply.

[0056] As can be seen from the above comparison, the three embodiments correspond to different production scales and scenario requirements. Embodiment 1 focuses on high precision, meeting the customized mass production needs of high-end small products; Embodiment 2 focuses on versatility, balancing efficiency and quality, and adapting to medium-scale general scenarios; Embodiment 3 focuses on high-efficiency mass production, improving production efficiency through multi-station and parallel structural design to meet the needs of large-scale batch production. All three achieve the core objective of this invention—solving the problems of poor coordination, insufficient adaptability, and imperfect detection feedback of existing production equipment, realizing the automated and precise production of holographic transparent crystal film LED screens, with differences only in structural complexity, production efficiency, and product precision, to adapt to different market demands, fully demonstrating the flexibility and practicality of this invention.

[0057] The present invention and its embodiments have been described above. This description is not restrictive, and the accompanying drawings are only one embodiment of the present invention; the actual structure is not limited thereto. In conclusion, if those skilled in the art are inspired by this description and design similar structures and embodiments without departing from the spirit of the invention, such designs should fall within the protection scope of the present invention.

Claims

1. A comprehensive production system for holographic transparent crystal film LED screens, characterized in that, The system includes a crystal film pretreatment unit, an LED chip mass transfer unit, a holographic encapsulation unit, a curing and molding unit, an inspection and screening unit, and a finished product cutting and packaging unit connected in sequence. Each unit is connected by a conveying mechanism to form a closed-loop production line. The conveying mechanism is equipped with adjustable positioning fixtures to adapt to the positioning and conveying of holographic transparent crystal film LED screen semi-finished products and finished products of different sizes.

2. The holographic transparent crystal film LED screen integrated production system according to claim 1, characterized in that, The pretreatment unit for the crystal film includes a crystal film cleaning module, a plasma modification module, and a drying module arranged in sequence. The crystal film cleaning module uses ultrasonic cleaning and is equipped with an adjustable frequency ultrasonic generator. The plasma modification module is used to activate the surface of the crystal film and improve its adhesion. The drying module uses a hot air circulation drying structure, and the drying temperature can be adjusted within the range of 40-80℃.

3. The integrated production system for a holographic transparent crystal film LED screen according to claim 1, characterized in that, The LED chip mass transfer unit includes a chip feeding module, a vision positioning module, a precision transfer module, and a bonding and pressing module. The vision positioning module uses a binocular vision recognition camera to achieve micron-level positioning accuracy. The precision transfer module uses a vacuum adsorption transfer head in conjunction with a linear drive mechanism to achieve precise bonding of the LED chip to the crystal film substrate. The pressing pressure of the bonding and pressing module can be adaptively adjusted according to the chip size and crystal film characteristics.

4. The holographic transparent crystal film LED screen integrated production system according to claim 1, characterized in that, The holographic encapsulation unit includes a holographic film feeding module, an encapsulating adhesive coating module, and a holographic alignment and bonding module. The encapsulating adhesive coating module uses a combination of dispensing and scraping to uniformly coat transparent encapsulating adhesive. The holographic alignment and bonding module is equipped with a holographic phase calibration component to ensure precise alignment between the holographic film and the LED chip array. Constant temperature and pressure control can be achieved during the bonding process.

5. The integrated production system for a holographic transparent crystal film LED screen according to claim 1, characterized in that, The curing and molding unit includes an ultraviolet curing module and a thermosetting module. The ultraviolet curing module is equipped with multiple sets of adjustable power ultraviolet lamps, which can adjust the ultraviolet irradiation intensity and irradiation time according to the thickness of the encapsulating adhesive. The thermosetting module adopts a constant temperature hot air circulation structure, and the curing temperature can be precisely controlled within the range of 80-120℃. It is also equipped with a temperature monitoring and feedback component to realize real-time compensation of the curing temperature.

6. The integrated production system for a holographic transparent crystal film LED screen according to claim 1, characterized in that, The inspection and screening unit includes an appearance inspection module, an optoelectronic performance inspection module, a holographic display effect inspection module, and a defective product marking module. The appearance inspection module is used to detect scratches, bubbles, and chip bonding deviations on the crystal film surface. The optoelectronic performance inspection module is used to detect the brightness, color difference, and luminous uniformity of the LED chip. The holographic display effect inspection module is used to detect the holographic imaging clarity, viewing angle range, and transparency. The defective product marking module can automatically mark and sort unqualified semi-finished products.

7. The integrated production system for a holographic transparent crystal film LED screen according to claim 1, characterized in that, The finished product cutting and packaging unit includes a precision cutting module, an edge polishing module, and a finished product packaging module. The precision cutting module adopts laser cutting and is equipped with a high-precision positioning guide rail, which can achieve precise cutting of the finished product according to the preset size, with a cutting error of no more than ±0.1mm. The edge polishing module is used to polish the edges of the cut finished product to remove burrs. The finished product packaging module adopts a transparent waterproof packaging structure to improve the moisture-proof and impact-proof performance of the finished product.

8. The integrated production system for a holographic transparent crystal film LED screen according to claim 3, characterized in that, The LED chip mass transfer unit is also equipped with a chip detection preprocessing module, which is used to perform appearance and electrical performance tests on the LED chips before transfer, and remove damaged or unqualified chips to ensure the consistency of transferred chips. The chip feeding module adopts a vibration feeding structure, in conjunction with the automatic feeding component of the hopper, to achieve continuous and stable chip feeding.

9. A holographic transparent crystal film LED screen integrated production system according to claim 6, characterized in that, The detection and screening unit is also equipped with a data acquisition and analysis module, which can collect the detection data of each detection module in real time, generate detection reports, and conduct preliminary analysis on the causes of defective products, providing data support for production process optimization. The data acquisition and analysis module can realize the functions of storing, querying and exporting detection data.

10. The integrated production system for a holographic transparent crystal film LED screen according to claim 1, characterized in that, It also includes a central control system, which is electrically connected to each production unit, conveying mechanism and detection module. It can realize the coordinated control of each unit, precise regulation of production parameters, real-time monitoring of production process and fault alarm function. The central control system supports two modes: manual operation and automatic operation, which can be flexibly switched according to production needs.

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