Wafer purging apparatus and wafer processing system

Abstract

This application relates to a wafer purging apparatus and a wafer processing system. The wafer purging apparatus includes: a flow guide pipe configured to connect to a fluid source; and a flow guide assembly comprising a first fluid pipe and a fluid release element, the fluid release element having a release channel inside, wherein the fluid release element is rotatably connected to the first fluid pipe, and the release channel of the fluid release element communicates with the inner cavity of the flow guide pipe through the first fluid pipe. The wafer processing system includes the wafer purging apparatus. The wafer purging apparatus can reduce particulate matter on the wafer surface through gas purging, thereby preventing particulate matter from affecting wafer performance and improving the product yield of the wafer manufacturing line.

Description

Technical Field

[0001] This application relates to the field of semiconductor technology, and in particular to wafer purging apparatus and wafer processing system. Background Technology

[0002] In the fields of semiconductor manufacturing and semiconductor materials, particulate matter is widely present in all stages of semiconductor processing and is a significant factor affecting the yield and production capacity of the final product. During chip manufacturing, because the feature size of chips is at the micrometer or nanometer level, dust particles or microparticles adhering to the chip can have a significant impact on the chip's function, and may even lead to open circuits or short circuits.

[0003] In related technologies, particulate matter on the wafer surface is mainly controlled through process control, such as using a vacuum environment for production. However, some particulate matter may still be introduced during wafer transfer, and these particles may affect wafer performance, leading to a decrease in product yield. Summary of the Invention

[0004] Therefore, it is necessary to provide a wafer cleaning device and a wafer processing system to address the problem of reduced wafer product yield caused by particulate matter adhering to the wafer surface.

[0005] A wafer purging apparatus includes: a flow guide pipe configured to connect to a fluid source; and a flow guide assembly including a first fluid tube and a fluid release element, the fluid release element having a release channel inside, wherein the fluid release element is rotatably connected to the first fluid tube, and the release channel of the fluid release element communicates with the inner cavity of the flow guide pipe through the first fluid tube.

[0006] In one embodiment, the fluid release device includes a converging tube and a discharge nozzle, the converging tube being rotatably connected to the first fluid tube, the discharge nozzle being connected to the converging tube, the discharge nozzle having a discharge outlet, and the inner cavity of the converging tube and the discharge outlet of the discharge nozzle together forming the release channel.

[0007] In one embodiment, the inner cavity size of the flow-gathering tube gradually decreases along the fluid delivery direction; and / or the outlet is a strip-shaped structure.

[0008] In one embodiment, the fluid release device further includes a plurality of diverter tubes disposed within the discharge port along a linear trajectory, at least one of the diverter tubes being in communication with the convergence tube, and the output ports of the plurality of diverter tubes being configured to collectively form the discharge port.

[0009] In one embodiment, the fluid release element further includes a dividing element disposed within the discharge port along the fluid delivery direction, the discharge port being divided into a first unit port and a second unit port based on the dividing element.

[0010] In one embodiment, the plane containing the first unit port and the plane containing the second unit port are both inclined relative to the separating element, and the farthest end of the first unit port relative to the convergent tube and the farthest end of the second unit port relative to the convergent tube intersect the separating element.

[0011] In one embodiment, the discharge nozzle includes a first diverter nozzle, a second diverter nozzle, and a flexible connecting portion. The first diverter nozzle and the second diverter nozzle are respectively connected to the convergent tube, and the first diverter nozzle and the second diverter nozzle are connected to each other through the flexible connecting portion. The flow guiding assembly also includes a second fluid tube and a support rod. One end of the second fluid tube is rotatably connected to the first fluid tube, and the other end of the second fluid tube is telescopically connected to the convergent tube. The support rod is disposed inside the second fluid tube, one end of the support rod is connected to the second fluid tube, and the other end of the support rod is connected to the flexible connecting portion.

[0012] In one embodiment, the flow guide pipe is a flexible hose structure; and / or the wafer purging device further includes a drive assembly, the drive assembly including a drive member and a movable member, the movable member being connected to the flow guide assembly, the drive member being connected to the movable member, the drive member being used to drive the movable member and the flow guide assembly to move to adjust the position of the outlet; and / or the wafer purging device further includes a flow controller, the flow controller being disposed on the flow guide pipe.

[0013] In one embodiment, the wafer purging device further includes an adjustment mechanism disposed between the guide pipe and the first fluid pipe. The adjustment mechanism includes a connecting hose, a first connector, a second connector, and multiple adjustment components. One end of the connecting hose is connected to the guide pipe via the first connector, and the other end of the connecting hose is connected to the first fluid pipe via the second connector. The multiple adjustment components are distributed circumferentially along the connecting hose. Each adjustment component includes an adjustment screw, an adjustment nut, and a compression spring. The adjustment screw passes through the first connector and the second connector and is connected to the adjustment nut. The compression spring is sleeved outside the adjustment screw and is located between the first connector and the second connector, with both ends of the compression spring abutting against the first connector and the second connector, respectively.

[0014] A wafer processing system includes a wafer and a wafer purging device as described in any of the preceding claims, wherein the discharge port is disposed toward the wafer.

[0015] The aforementioned wafer purging apparatus and wafer processing system, wherein the wafer processing system includes a wafer purging apparatus, wherein when purging gas is supplied by a gas source, the purging gas can enter the first fluid pipe through a guide pipe, and then enter the release channel within the fluid release element through the first fluid pipe, and finally be discharged from the outlet of the fluid release element, thereby purifying the wafer surface to remove particulate matter adhering to the wafer surface. Furthermore, since the fluid release element is rotatably connected to the first fluid pipe, the fluid release element can rotate relative to the first fluid pipe. When the fluid release element rotates, the outlet at the end of the fluid release element furthest from the first fluid pipe also rotates, thus changing the airflow direction through the outlet, allowing the wafer purging apparatus to meet multi-angle purging requirements. Therefore, the wafer purging apparatus of this embodiment can reduce particulate matter on the wafer surface through gas purging, thereby preventing particulate matter from affecting wafer performance and improving the product yield of the wafer manufacturing line. Meanwhile, since the fluid release component can rotate to change the direction of the purging airflow, the purging angle can be changed to purge wafers in different arrangement positions, making the wafer purging device applicable to a wider range of scenarios and with good application prospects. Attached Figure Description

[0016] Figure 1 This is a schematic diagram of the structure of a wafer purging apparatus according to an embodiment of this application.

[0017] Figure 2 This is a front view of the flow guiding component according to an embodiment of this application.

[0018] Figure 3 This is a side view of the flow guiding component according to an embodiment of this application.

[0019] Figure 4 This is a side view of the flow guiding component according to another embodiment of this application.

[0020] Figure 5 This is a side view of the flow guiding component according to another embodiment of this application.

[0021] Figure 6 This is a front view of the flow guiding component according to another embodiment of this application.

[0022] Figure 7 This is an exploded structural diagram of a flow guiding component according to another embodiment of this application.

[0023] Figure 8 This is a front view structural diagram of a flow guiding component according to another embodiment of this application.

[0024] Figure 9 for Figure 8 A magnified structural diagram of point A in the middle.

[0025] Figure 10 This is a front view structural diagram of a flow guiding component according to another embodiment of this application.

[0026] Figure 11 for Figure 10 A magnified structural diagram at point B in the middle.

[0027] Figure 12 This is a schematic diagram of the structure of a wafer purging apparatus according to another embodiment of this application.

[0028] Figure 13 This is a schematic diagram of the structure of a wafer purging apparatus according to another embodiment of this application.

[0029] Figure 14 for Figure 13 A magnified schematic diagram of a portion of the structure.

[0030] Figure 15 for Figure 14 The diagram shows a partial side view of the structure.

[0031] Figure 16 This is a schematic diagram of the structure of a wafer processing system according to an embodiment of this application.

[0032] Icon labels:

[0033] 1. Wafer processing system;

[0034] 10. Wafer purging device;

[0035] 100. Diversion pipe;

[0036] 200, Flow guiding assembly; 210, First fluid pipe; 220, Fluid release component; 221, Flow converging pipe; 222, Discharge nozzle; 222a, First diverting nozzle; 222b, Second diverting nozzle; 222c, Flexible connection part; 223, Diverting pipe; 224, Separating element; 225, Discharge port; 225a, First unit port; 225b, Second unit port; 230, Second fluid pipe; 240, Support rod;

[0037] 300. Drive component; 310. Drive element; 320. Moving part;

[0038] 400. Flow controller;

[0039] 500. Adjustment mechanism; 510. Connecting hose; 520. First connector; 530. Second connector; 540. Adjustment assembly; 541. Adjustment screw; 542. Adjustment nut; 543. Compression spring;

[0040] 20. Wafer. Detailed Implementation

[0041] To make the above-mentioned objectives, features, and advantages of this application more apparent and understandable, the specific embodiments of this application are described in detail below with reference to the accompanying drawings. Many specific details are set forth in the following description to provide a thorough understanding of this application. However, this application can be implemented in many other ways different from those described herein, and those skilled in the art can make similar modifications without departing from the spirit of this application. Therefore, this application is not limited to the specific embodiments disclosed below.

[0042] In the description of this application, it should be understood that if terms such as "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential" appear, these terms indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application.

[0043] Furthermore, where the terms "first" and "second" appear, these terms are for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined with "first" or "second" may explicitly or implicitly include at least one of that feature. In the description of this application, where the term "multiple" appears, "multiple" means at least two, such as two, three, etc., unless otherwise explicitly specified.

[0044] In this application, unless otherwise expressly specified and limited, the terms "installation," "connection," "joining," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components, unless otherwise expressly limited. Those skilled in the art can understand the specific meaning of the above terms in this application based on the specific circumstances.

[0045] In this application, unless otherwise expressly specified and limited, the use of descriptions such as "above" or "below" the second feature indicates that the first and second features are in direct contact or indirect contact via an intermediate medium. Furthermore, "above," "on top of," and "over" the second feature can mean that the first feature is directly above or diagonally above the second feature, or simply that the first feature is at a higher horizontal level than the second feature. Similarly, "below," "below," and "under" the second feature can mean that the first feature is directly below or diagonally below the second feature, or simply that the first feature is at a lower horizontal level than the second feature.

[0046] It should be noted that if an element is referred to as being "fixed to" or "set on" another element, it can be directly on the other element or there may be an intervening element. If an element is considered to be "connected to" another element, it can be directly connected to the other element or there may be an intervening element. If so, the terms "vertical," "horizontal," "upper," "lower," "left," "right," and similar expressions used in this application are for illustrative purposes only and do not represent the only possible implementation.

[0047] Figure 1 This is a schematic diagram of the structure of the wafer purging apparatus 10 according to an embodiment of this application. Figure 2 This is a front view of the flow guiding component 200 according to an embodiment of this application.

[0048] See Figure 1 and Figure 2 As shown, the wafer purging device 10 provided in this embodiment includes a flow channel 100 and a flow guiding component 200. The wafer purging device 10 is used to purge the surface of the wafer 20 to remove particulate matter from the surface of the wafer 20.

[0049] The flow channel 100 is configured to connect to a fluid source. In this embodiment, the flow channel 100 connects a gas source and the flow guide assembly 200, wherein the gas source provides the gas required to purge particulate matter. Exemplarily, the flow channel 100 may be configured to connect to a gas source capable of providing nitrogen, inert gas, or other pure gas to prevent the purge gas from affecting the wafer 20.

[0050] The flow guiding assembly 200 is connected to an air source via the flow guiding pipe 100 and is used to purge the wafer 20. The flow guiding assembly 200 includes a first fluid pipe 210 and a fluid release component 220. The fluid release component 220 has a release channel inside, wherein the fluid release component 220 is rotatably connected to the first fluid pipe 210, and the release channel of the fluid release component 220 communicates with the inner cavity of the flow guiding pipe 100 through the first fluid pipe 210. Specifically, the first fluid pipe 210 is connected between the fluid release component 220 and the flow guiding pipe 100. One end of the fluid release component 220 is rotatably connected to the first fluid pipe 210 and communicates with the flow guiding pipe 100 through the first fluid pipe 210, and the other end of the fluid release component 220 is provided with an outlet 225. Exemplarily, the fluid release component 220 can be configured as a hollow tubular structure, and the rotatable connection between the fluid release component 220 and the first fluid pipe 210 can be a threaded connection.

[0051] Through the above structural design, when purge gas is provided by a gas source, the purge gas can enter the first fluid pipe 210 through the guide pipe 100, and then enter the release channel in the fluid release member 220 through the first fluid pipe 210, and finally be discharged from the outlet 225 of the fluid release member 220. This allows the surface of the wafer 20 to be purged to remove particles attached to the surface of the wafer 20. Furthermore, since the fluid release member 220 is rotatably connected to the first fluid pipe 210, the fluid release member 220 can rotate relative to the first fluid pipe 210. When the fluid release member 220 rotates, the outlet 225 at the end of the fluid release member 220 away from the first fluid pipe 210 also rotates. The airflow direction passing through the outlet 225 can also change with the rotation of the outlet 225, enabling the wafer purging device 10 to meet the purging requirements of multiple angles.

[0052] Therefore, the wafer purging device 10 of this application embodiment can reduce particulate matter on the surface of the wafer 20 by purging with gas, thereby preventing particulate matter from affecting the performance of the wafer 20 and improving the product yield of the wafer 20 manufacturing line. At the same time, since the fluid release component 220 can rotate to change the purging air direction, the purging angle can be changed to purge the wafers 20 in different placement positions, making the wafer purging device 10 applicable to a wider range of scenarios and having good application prospects.

[0053] Figure 3 This is a side view of the flow guiding component 200 according to an embodiment of this application.

[0054] See Figure 2 and Figure 3As shown, in some embodiments, the fluid release element 220 includes a converging tube 221 and a discharge nozzle 222. The converging tube 221 is rotatably connected to the first fluid tube 210, and the discharge nozzle 222 is connected to the converging tube 221. The discharge nozzle 222 has a discharge outlet 225, and the inner cavity of the converging tube 221 and the discharge outlet 225 of the discharge nozzle 222 together form a release channel. Exemplarily, the converging tube 221 can be threadedly connected to the first fluid tube 210, allowing the converging tube 221 to rotate relative to the first fluid tube 210. A cavity is formed inside the converging tube 221 and the discharge nozzle 222, and the two ends of the converging tube 221 are respectively connected to the first fluid tube 210 and the discharge nozzle 222. The end of the discharge nozzle 222 away from the converging tube 221 forms an outlet 225, so that after the purge gas passes through the guide tube 100 and the first fluid tube 210 in sequence, the purge gas is gathered to the discharge nozzle 222 through the converging tube 221, so that the purge gas can be blown out through the outlet 225.

[0055] In some embodiments, the internal dimensions of the flow-collecting tube 221 gradually decrease along the fluid transport direction. See also... Figure 2 As shown, the gas delivery direction refers to the horizontal direction from left to right. Thus, when the purge gas enters the converging tube 221 from the first fluid tube 210, the purge gas will flow along the inner wall of the converging tube 221 until it gathers in the discharge nozzle 222, so that the wafer 20 can be precisely purged using the discharge nozzle 222, thereby effectively removing particulate matter from the surface of the wafer 20.

[0056] Since wafer 20 is generally in the form of a circular sheet structure, in order to improve the blowing effect on particles on the surface of wafer 20, the shapes of the discharge nozzle 222 and the discharge outlet 225 are further optimized in this embodiment of the application.

[0057] In some embodiments, the outlet 225 is strip-shaped. See also Figure 3 As shown, the length of the outlet 225 is equal to the inner diameter of the first fluid pipe 210, and the width of the outlet 225 is much smaller than its length, making the outlet 225 elongated. The length of the outlet 225 refers to the length of the outlet 225 within... Figure 3 The horizontal dimension shown in the diagram refers to the width of the outlet 225 in the horizontal direction. Figure 3 The vertical dimension is shown from the perspective shown. Thus, when the wafer 20 is purged, the first fluid tube 210 is rotated so that the length direction of the outlet 225 is parallel to the surface of the wafer 20. At this time, the thin strip of airflow discharged through the outlet 225 can cover the entire surface of the wafer 20, thereby purging particles from all parts of the wafer 20 surface to improve the particle removal effect.

[0058] Figure 4This is a side view of the flow guiding component 200 according to another embodiment of this application.

[0059] See Figure 4 As shown, in some embodiments, the fluid release element 220 further includes a plurality of diverter pipes 223 arranged along a linear trajectory within the discharge nozzle 222. At least one diverter pipe 223 is connected to the convergent pipe 221, and the output ports of the plurality of diverter pipes 223 are configured to collectively form the discharge outlet 225. Specifically, the figure shows a configuration with five diverter pipes 223 arranged side by side along the horizontal direction. All diverter pipes 223 are connected to the convergent pipe 221, and the output ports of the five diverter pipes 223 collectively form the discharge outlet 225. These five diverter pipes 223 can divide the purging gas from the convergent pipe 221 into five smaller airflows, which can both purge the entire surface of the wafer 20 and concentrate the airflow, further enhancing the purging effect.

[0060] It should be understood that in other alternative embodiments, the number of shunt tubes 223 is not limited to five; for example, the number of shunt tubes 223 can also be two, three, four, six, etc.

[0061] Figure 5 This is a side view of the flow guiding component 200 according to another embodiment of this application.

[0062] See Figure 5 As shown, in some embodiments, the fluid release member 220 further includes a separating element 224 disposed within the discharge nozzle 222 along the fluid delivery direction, and the discharge outlet 225 is divided into a first unit port 225a and a second unit port 225b based on the separating element 224. Exemplarily, the separating element 224 can be a flat plate structure extending horizontally in the figure, thereby dividing the discharge outlet 225 into the first unit port 225a and the second unit port 225b. Due to the obstruction of the separating element 224, the purge gas, after passing through the discharge nozzle 222, will split into two airflows, which will be discharged from the first unit port 225a and the second unit port 225b, respectively. When purging the wafer 20, the first fluid tube 210 is rotated so that the extension direction of the separator element 224 is parallel to the surface of the wafer 20. At this time, the two airflows discharged from the first unit port 225a and the second unit port 225b can purge the two sides of the wafer 20 respectively, thereby removing particles from both sides of the wafer 20 and achieving a better purging effect.

[0063] It is understood that in some embodiments, the fluid release element 220 can be detachably connected to the first fluid tube 210, for example by a threaded connection. In this case, the two can rotate relative to each other and are detachable, which facilitates the replacement of different fluid release elements 220, thereby changing the outlet 225 with different structural forms, making the blowing method more flexible.

[0064] Figure 6 This is a front view of the flow guiding component 200 according to another embodiment of this application.

[0065] See Figure 6 As shown, in some embodiments, the plane containing the first unit port 225a and the plane containing the second unit port 225b are both inclined relative to the separator element 224. The farthest point of the first unit port 225a relative to the current collector 221 and the farthest point of the second unit port 225b relative to the current collector 221 intersect at the separator element 224. Specifically, since the planes containing the first unit port 225a and the second unit port 225b are both inclined relative to the separator element 224, the first unit port 225a blows air obliquely upwards, and the second unit port 225b blows air obliquely downwards. This allows the first unit port 225a and the second unit port 225b to blow air towards the surface of the wafer 20 at a certain angle, further improving the effect of removing particles from the surface of the wafer 20.

[0066] Exemplary, in some embodiments, see [reference] Figure 6 As shown, the plane where the first unit port 225a is located and the plane where the second unit port 225b is located are mirror images of the separating element 224, so that the gas flow rate of the first unit port 225a and the gas flow rate of the second unit port 225b are as similar as possible, so as to form a uniform sweeping of the wafer 20 and ensure the sweeping effect.

[0067] Figure 7 This is an exploded structural diagram of the flow guiding component 200 according to another embodiment of this application. Figure 8 This is a front view of the flow guiding component 200 according to another embodiment of this application. Figure 9 for Figure 8 A magnified structural diagram of point A in the middle. Figure 10 This is a front view of the flow guiding component 200 according to another embodiment of this application. Figure 11 for Figure 10 A magnified structural diagram at point B in the middle.

[0068] See Figures 7 to 11As shown, in some embodiments, the discharge nozzle 222 includes a first diverter nozzle 222a, a second diverter nozzle 222b, and a flexible connector 222c. The first diverter nozzle 222a and the second diverter nozzle 222b are respectively connected to the convergent tube 221, and the first diverter nozzle 222a and the second diverter nozzle 222b are connected to each other through the flexible connector 222c. The flow guiding assembly 200 also includes a second fluid tube 230 and a support rod 240. One end of the second fluid tube 230 is rotatably connected to the first fluid tube 210, and the other end of the second fluid tube 230 is telescopically connected to the convergent tube 221. The support rod 240 is disposed inside the second fluid tube 230, one end of the support rod 240 is connected to the second fluid tube 230, and the other end of the support rod 240 is connected to the flexible connector 222c.

[0069] Specifically, the first diverter nozzle 222a has an internal cavity. One end of the first diverter nozzle 222a is connected to the side wall of the convergent tube 221, so that the cavity inside the first diverter nozzle 222a communicates with the interior of the convergent tube 221. The other end of the first diverter nozzle 222a has a first opening. The second diverter nozzle 222b has an internal cavity. One end of the second diverter nozzle 222b is connected to the side wall of the convergent tube 221, so that the cavity inside the second diverter nozzle 222b communicates with the interior of the convergent tube 221. The other end of the second diverter nozzle 222b has a second opening. The first opening of the first diverter nozzle 222a and the second opening of the second diverter nozzle 222b together form the discharge port 225. The end of the first diverter nozzle 222a near the convergence tube 221 is connected to the end of the second diverter nozzle 222b near the convergence tube 221 by a flexible connection part 222c. The flexible connection part 222c is made of a flexible material that can undergo a certain deformation, such as nylon or rubber, so that when the flexible connection part 222c is subjected to force, it can drive the first diverter nozzle 222a and the second diverter nozzle 222b to move relative to each other.

[0070] One end of the second fluid pipe 230 is rotatably connected to the first fluid pipe 210, for example, by a threaded connection; the other end of the second fluid pipe 230 is telescopically connected to the convergent pipe 221, for example, by an interference fit so that the convergent pipe 221 can telescopically move relative to the second fluid pipe 230. The two ends of the support rod 240 are respectively connected to the second fluid pipe 230 and the flexible connection part 222c. The support rod 240 is made of a high-strength material so that the support rod 240 does not bend when subjected to force. After the second fluid pipe 230 is connected and fixed to the first fluid pipe 210, the flexible connection part 222c will also move with the flow convergence pipe 221 relative to the second fluid pipe 230 by adjusting the extension and retraction of the flow convergence pipe 221 relative to the second fluid pipe 230. Since the support rod 240 remains fixed, the flexible connection part 222c will deform under the action of the support rod 240, thereby driving the first diverter nozzle 222a and the second diverter nozzle 222b to move and change the included angle between the first diverter nozzle 222a and the second diverter nozzle 222b.

[0071] Therefore, by controlling the extension and retraction of the convergent tube 221 relative to the second fluid tube 230, the angle between the first diverter nozzle 222a and the second diverter nozzle 222b can be adjusted, thereby adjusting the airflow direction discharged from the first diverter nozzle 222a and the airflow direction discharged from the second diverter nozzle 222b. This makes the purging operation more flexible, which is beneficial for adapting to the purging of particles on the surface of different types of wafers 20, and has a wider range of applications.

[0072] To facilitate understanding of the principles of the embodiments of this application, the following description is in conjunction with the appendix. Figures 8 to 11 A detailed introduction will be provided.

[0073] See Figures 8 to 9 As shown, the diagram illustrates the structure when the converging tube 221 is moved away from the second fluid tube 230. It can be seen that when the converging tube 221 moves away from the second fluid tube 230, the support rod 240 applies a pulling force F to the flexible connection 222c. This force, through the flexible connection 222c, causes the first diverter nozzle 222a and the second diverter nozzle 222b to move closer together. At this time, the acute angle between the airflow direction discharged from the first diverter nozzle 222a and the second diverter nozzle 222b and the horizontal direction tends to decrease, and the airflow discharged from the first diverter nozzle 222a and the second diverter nozzle 222b becomes more concentrated.

[0074] See Figures 10 to 11As shown, the diagram illustrates the structure when the converging tube 221 is close to the second fluid tube 230. It can be seen that when the converging tube 221 approaches the second fluid tube 230, the support rod 240 applies a thrust F to the flexible connection 222c. This flexible connection 222c causes the first diverter nozzle 222a and the second diverter nozzle 222b to move away from each other. At this time, the acute angle between the airflow direction discharged from the first diverter nozzle 222a and the second diverter nozzle 222b and the horizontal direction tends to increase, and the airflow discharged from the first diverter nozzle 222a and the second diverter nozzle 222b becomes more dispersed.

[0075] Figure 12 This is a schematic diagram of the structure of a wafer purging apparatus 10 according to another embodiment of this application.

[0076] See Figure 12 As shown, in some embodiments, the flow guiding pipe 100 is a flexible hose structure. In this case, the flow guiding pipe 100 has a certain deformation capability, so the position and angle of the flow guiding component 200 can be adjusted by changing the shape of the flow guiding pipe 100, thereby performing targeted purging of the wafer 20, which is beneficial to improving the purging efficiency of particles on the surface of the wafer 20.

[0077] See Figure 1 As shown, in some embodiments, the wafer purging apparatus 10 further includes a drive assembly 300, which includes a drive member 310 and a movable member 320. The movable member 320 is connected to the flow guiding assembly 200, and the drive member 310 is connected to the movable member 320. The drive member 310 is used to drive the movable member 320 and the flow guiding assembly 200 to move to adjust the position of the outlet 225. For example, the drive member 310 can be a motor, cylinder, etc. The movable member 320 has an internal cavity. One end of the movable member 320 is connected to the flow guiding pipe 100 so that the cavity inside the movable member 320 communicates with the interior of the flow guiding pipe 100. The other end of the movable member 320 is connected to the drive member 310. The cavity inside the movable member 320 is connected to an air source (not shown in the figure) through a pipe, and air is supplied to the flow guiding pipe 100 through the air source. The driving component 310 drives the moving component 320 to move, which in turn drives the flow guide duct 100 and the flow guide assembly 200 to move, thereby adjusting the installation height of the outlet 225 to blow the wafer 20 at different positions and improve the blowing efficiency.

[0078] See Figure 1 As shown, in some embodiments, the wafer purging apparatus 10 further includes a flow controller 400, which is disposed on the flow guide pipe 100. Exemplarily, the flow controller 400 can be a flow valve, connected to the movable element 320 and through the movable element 320 to the flow guide pipe 100, thereby controlling the gas flow rate through the flow guide pipe 100 to achieve precise purging and improve gas utilization.

[0079] Figure 13 This is a schematic diagram of the structure of a wafer purging apparatus 10 according to another embodiment of this application. Figure 14 for Figure 13 A magnified schematic diagram of a portion of the structure. Figure 15 for Figure 14 The diagram shows a partial side view of the structure.

[0080] See Figures 13 to 15 As shown, in some embodiments, the wafer purging apparatus 10 further includes an adjustment mechanism 500, which is disposed between the guide pipe 100 and the first fluid pipe 210. The adjustment mechanism 500 includes a connecting hose 510, a first connector 520, a second connector 530, and multiple adjustment components 540. One end of the connecting hose 510 is connected to the guide pipe 100 through the first connector 520, and the other end of the connecting hose 510 is connected to the first fluid pipe 210 through the second connector 530. The multiple adjustment components... The components 540 are distributed circumferentially along the connecting hose 510; wherein, the adjusting component 540 includes an adjusting screw 541, an adjusting nut 542 and a compression spring 543, the adjusting screw 541 passes through the first connecting member 520 and the second connecting member 530 and is connected to the adjusting nut 542, the compression spring 543 is sleeved on the adjusting screw 541, the compression spring 543 is located between the first connecting member 520 and the second connecting member 530 and the two ends of the compression spring 543 respectively abut against the first connecting member 520 and the second connecting member 530.

[0081] Specifically, in this embodiment, the connecting hose 510 is only used to connect the guide pipe 100 and the first fluid pipe 210. The connecting hose 510 does not provide support to avoid interference with the adjustment process. For example, the connecting hose 510 can be a corrugated pipe. The first connector 520 and the second connector 530 are used to connect to the guide pipe 100 and the first fluid pipe 210, respectively. For example, both the first connector 520 and the second connector 530 can be configured as flange structures. The number of adjusting components 540 is at least two, and all adjusting components 540 are evenly distributed along the circumference of the connecting hose 510. For example, the figure shows the case where four adjusting components 540 are provided. It should be understood that in other optional embodiments, the number of adjusting components 540 can also be two, three, five, six, etc. The adjusting screw 541 passes through both the first connecting member 520 and the second connecting member 530. One end of the adjusting screw 541 abuts against the second connecting member 530 via a nut, and the other end of the adjusting screw 541 is threadedly connected to the adjusting nut 542, thereby confining the first connecting member 520 and the second connecting member 530 between the nut of the adjusting screw 541 and the adjusting nut 542. A compression spring 543 is fitted over the adjusting screw 541, with both ends abutting against the first connecting member 520 and the second connecting member 530 respectively. The compression spring 543 is in a compressed state, thereby applying a thrust to the first connecting member 520 and the second connecting member 530, and thus cooperating with the adjusting screw 541 and the adjusting nut 542 to connect and fix the first connecting member 520 and the second connecting member 530.

[0082] See Figure 14 As shown, when performing an adjustment operation, such as tightening... Figure 14 The adjusting nut 542 is located at the bottom. When the adjusting screw 541 is tightened, it pulls the lower end of the second connector 530, causing it to move closer to the first connector 520. This causes the first fluid pipe 210 and the fluid release component 220 to tilt downwards, thereby tilting the outlet 225 downwards and changing the direction of the airflow exiting the outlet 225. Similarly, when tightened... Figure 14 When the adjusting nut 542 is positioned at the top, the outlet 225 can be tilted upwards to change the direction of the airflow discharged from the outlet 225. Therefore, in this embodiment, the adjusting mechanism 500 can flexibly adjust the direction of the airflow discharged from the outlet 225, improving the flexibility of purging the surface of the wafer 20 and increasing purging efficiency.

[0083] Figure 16 This is a schematic diagram of the structure of the wafer processing system 1 according to an embodiment of this application.

[0084] See Figure 16As shown, this application embodiment also provides a wafer processing system 1, including a wafer 20 and a wafer blowing device 10 of any of the above embodiments, with the outlet 225 of the wafer blowing device 10 facing the wafer 20. Exemplarily, the wafer processing system 1 may include equipment for transferring the wafer 20, wherein multiple wafers 20 are stacked. Because of the wafer blowing device 10, particulate matter on the surface of the wafer 20 can be reduced by blowing gas, thereby preventing particulate matter from affecting the performance of the wafer 20 and improving the product yield of the wafer 20 manufacturing line. Furthermore, the wafer blowing device 10 of the above embodiments can simultaneously discharge multiple airflows in different directions. When multiple wafers 20 are stacked, the wafer blowing device 10 can simultaneously blow the upper and lower surfaces of different wafers 20, resulting in a better blowing effect.

[0085] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0086] The embodiments described above are merely illustrative of several implementation methods of this application, and while the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the patent application. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this application, and these all fall within the protection scope of this application. Therefore, the protection scope of this patent application should be determined by the appended claims.

Claims

1. A wafer cleaning device, characterized in that, The wafer purging apparatus includes: A flow channel, the flow channel being configured to connect to a fluid source; A flow guiding assembly includes a first fluid tube and a fluid release component. The fluid release component has a release channel inside. The fluid release component is rotatably connected to the first fluid tube, and the release channel of the fluid release component communicates with the inner cavity of the flow guiding pipe through the first fluid tube.

2. The wafer cleaning apparatus according to claim 1, characterized in that, The fluid release device includes a converging tube and a discharge nozzle. The converging tube is rotatably connected to the first fluid tube, and the discharge nozzle is connected to the converging tube. The discharge nozzle has a discharge outlet, and the inner cavity of the converging tube and the discharge outlet of the discharge nozzle together constitute the release channel.

3. The wafer purging apparatus according to claim 2, characterized in that, The inner cavity size of the flow-gathering tube gradually decreases along the fluid delivery direction; and / or The outlet is a strip-shaped structure.

4. The wafer cleaning apparatus according to claim 3, characterized in that, The fluid release device also includes a plurality of diverter tubes arranged along a linear trajectory inside the discharge nozzle, at least one of the diverter tubes being connected to the convergence tube, and the output ports of the plurality of diverter tubes being configured to collectively form the discharge outlet.

5. The wafer cleaning apparatus according to claim 3, characterized in that, The fluid release device further includes a dividing element disposed within the discharge port along the fluid delivery direction, and the discharge port is divided into a first unit port and a second unit port based on the dividing element.

6. The wafer purging apparatus according to claim 5, characterized in that, The plane containing the first unit port and the plane containing the second unit port are both inclined relative to the separating element. The farthest end of the first unit port relative to the current collector tube and the farthest end of the second unit port relative to the current collector tube intersect at the separating element.

7. The wafer purging apparatus according to claim 2, characterized in that, The discharge nozzle includes a first diverter nozzle, a second diverter nozzle, and a flexible connecting part. The first diverter nozzle and the second diverter nozzle are respectively connected to the convergence tube, and the first diverter nozzle and the second diverter nozzle are connected to each other through the flexible connecting part. The flow guiding assembly further includes a second fluid tube and a support rod. One end of the second fluid tube is rotatably connected to the first fluid tube, and the other end of the second fluid tube is telescopically connected to the flow gathering tube. The support rod is disposed inside the second fluid tube, with one end of the support rod connected to the second fluid tube and the other end of the support rod connected to the flexible connecting part.

8. The wafer purging apparatus according to claim 1, characterized in that, The flow guide pipe is a flexible hose structure; and / or The wafer purging device further includes a driving assembly, which includes a driving component and a movable component. The movable component is connected to the flow guiding assembly, and the driving component is connected to the movable component. The driving component is used to drive the movable component and the flow guiding assembly to move in order to adjust the position of the discharge port. and / or The wafer purging device also includes a flow controller, which is mounted on the flow guide pipe.

9. The wafer purging apparatus according to any one of claims 1-8, characterized in that, The wafer purging device further includes an adjustment mechanism, which is disposed between the flow guide pipe and the first fluid pipe; The adjustment mechanism includes a connecting hose, a first connector, a second connector, and multiple adjustment components. One end of the connecting hose is connected to the flow guide pipe through the first connector, and the other end of the connecting hose is connected to the first fluid pipe through the second connector. The multiple adjustment components are distributed circumferentially along the connecting hose. The adjusting assembly includes an adjusting screw, an adjusting nut, and a compression spring. The adjusting screw passes through the first connecting member and the second connecting member and is connected to the adjusting nut. The compression spring is sleeved on the adjusting screw and is located between the first connecting member and the second connecting member, with its two ends abutting against the first connecting member and the second connecting member, respectively.

10. A wafer processing system, characterized in that, The device includes a wafer and the wafer purging apparatus according to any one of claims 1-9, wherein the outlet is disposed toward the wafer.

Images