A wind deflector, a heat dissipation module and a server

Abstract

This invention discloses an air guide shroud, a heat dissipation module, and a server. The air guide shroud includes: a shroud body with an air inlet side at one end opposite to the fan outlet and an air outlet side at the other end; guide vanes located on the air inlet side, with multiple guide vanes extending along the fan outlet direction, the guide vanes spaced apart to form multiple air ducts corresponding to heat-generating elements, and at least one guide vane extending to the air outlet side; a vortex suppression plate fixed to the inner wall of the shroud body, located in the area of ​​the air ducts near the air inlet side and / or the air outlet side, the vortex suppression plate extending along the guide direction of the corresponding air duct; and a return flow baffle located at the end of the guide vane extending to the air outlet side, with both ends of the return flow baffle extending in a direction perpendicular to the guide vane, and the two ends of the return flow baffle partially overlapping the air ducts on both sides of the guide vane. This air guide shroud solves the problem of low cooling efficiency by optimizing the internal air duct structure.

Description

Technical Field

[0001] This invention relates to the field of server heat dissipation technology, and in particular to an air guide shroud, a heat dissipation module, and a server. Background Technology

[0002] A cooling shroud is a method of cooling computer components, such as the central processing unit (CPU) and other high-heat-generating parts, using ambient air as a cooling medium. In data center and computer server environments, the goal is to keep these components at their recommended operating temperatures by allowing cool air to pass through the server or data center equipment and exhausting hot air.

[0003] Traditional server shrouds are typically simple enclosures whose core function is to guide cooling airflow from the fan to the CPU heatsink. However, this simple structure often overlooks the cooling needs of other high-heat components inside the server (such as memory DIMMs, chipsets, power supply modules, etc.), as well as the eddies, backflows, and pressure losses generated when airflow moves through complex spaces. These unoptimized airflow characteristics directly lead to low cooling efficiency.

[0004] It is evident that optimizing the internal structure of the air guide shroud to enable precise and efficient airflow for cooling the heat-generating components of the server is a problem that needs to be solved by those skilled in the art. Summary of the Invention

[0005] The purpose of this invention is to provide an air guide shroud, a heat dissipation module, and a server that can solve the problem of low cooling efficiency.

[0006] To solve the above technical problems, embodiments of the present invention provide an air guide shroud, comprising:

[0007] The cover has an air inlet side at one end that is opposite to the fan outlet, and an air outlet side at the other end.

[0008] A guide vane is provided on the air inlet side, and a plurality of the guide vanes extend along the air outlet direction of the fan. The guide vanes are spaced apart from each other to form a plurality of air ducts corresponding to the heating element, and at least one of the guide vanes extends to the air outlet side.

[0009] A vortex suppression plate is fixed to the inner wall of the cover and located in the area of ​​the air duct near the air inlet side and / or the air outlet side. The vortex suppression plate extends along the guiding direction of the corresponding air duct.

[0010] A return flow baffle is provided at the end of the guide vane extending to the air outlet side. Both ends of the return flow baffle extend in a direction perpendicular to the guide vane, and both ends of the return flow baffle overlap with the air duct portion on both sides of the guide vane.

[0011] In some embodiments, the cover is provided with side vanes on both sides, the side vanes serving as the side boundaries of the cover, and the guide vanes include a first vane and a second vane located between the two side vanes. The first vane and the second vane extend to the air outlet side, and the air duct between the first vane and the second vane corresponds to the air inlet and channel of the memory module array to ensure that at least part of the airflow is guided and passes through the gap between the memory slots.

[0012] In some embodiments, the air duct between the first blade and one of the side blades corresponds to a CPU heatsink, the air duct between the second blade and another side blade corresponds to another CPU heatsink, and the air duct at least covers a portion of the fins of the CPU heatsink, and the airflow direction of the air duct is consistent with the direction of the gaps between the fins.

[0013] In some embodiments, the airflow guide vanes include a third vane and a fourth vane, the third vane being located between the first vane and one of the side vanes, and the fourth vane being located between the second vane and another of the side vanes. The third vane and the fourth vane further subdivide the airflow channel corresponding to the CPU heatsink into sub-airflow channels to correspond to the heat source distribution in different areas of the CPU heatsink.

[0014] In some embodiments, the return flow baffle is in the shape of a flat plate or an arc-shaped plate, and the projected area of ​​the return flow baffle covers at least the cross-sectional area of ​​the end of the guide vane, so as to block the airflow from generating reverse return flow at the end of the guide vane; the two ends of the return flow baffle are connected to the middle of the guide vane through transition plates, and the transition plates are located in the air duct, and have a continuously changing radius of curvature or a plate-shaped structure with a smooth transition.

[0015] In some embodiments, the guide vane and the cover are integrally formed, or the guide vane is detachably or fixedly connected to the inner wall of the cover by a snap-fit ​​structure, welding structure or adhesive structure.

[0016] In some embodiments, the vortex suppression plate is an arc-shaped sheet or plate structure, its extension direction is adapted to the airflow streamline in the air duct, and the edge of the vortex suppression plate is smoothly connected to the inner wall of the cover.

[0017] In some embodiments, the outer surface of the side vane blades and / or the air outlet side of the shroud are provided with positioning protrusions or limiting grooves, which are configured to cooperate with the bracket inside the chassis to fix the air guide shroud in place.

[0018] A heat dissipation module includes a fan and an air guide shroud as described in any of the above claims, wherein the air outlet of the fan is connected to the air inlet side of the air guide shroud, and the airflow generated by the fan is guided to the corresponding heat-generating element through the air duct of the air guide shroud.

[0019] A server includes a chassis, a motherboard disposed within the chassis, a CPU heatsink and a memory module array mounted on the motherboard, and the aforementioned heat dissipation module, wherein the heat dissipation module is installed within the chassis such that each air duct of the air guide corresponds to the CPU heatsink and the memory module array, respectively.

[0020] As can be seen from the above technical solution, the beneficial effects of this invention are as follows: First, by using guide vanes to precisely divide the turbulent airflow output by the fan into multiple independent air ducts, the airflow and heat-generating components (such as CPU and memory) are directionally matched, solving the problem of airflow mismatch in traditional heat dissipation. Second, by setting vortex suppression plates extending along the guide direction in key areas of the air ducts, boundary layer separation and secondary vortices caused by abrupt changes in the flow channel or wall friction are effectively suppressed, reducing flow resistance noise and ensuring the laminar flow characteristics of the airflow. At the same time, by setting backflow baffles overlapping with the air ducts on both sides at the ends of the guide vanes, the reverse backflow path formed by high-speed airflow at the blade trailing edge due to inertial diffusion and negative pressure entrainment is blocked, preventing hot exhaust gas from flowing back to the air inlet side or interfering with adjacent air ducts, thereby ensuring that the cold airflow can flow smoothly through the heat source and ensuring heat exchange efficiency. Attached Figure Description

[0021] To more clearly illustrate the embodiments of the present invention, the accompanying drawings used in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0022] Figure 1 This is a schematic diagram of a wind guide shroud structure provided in an embodiment of the present invention.

[0023] In the diagram: 1-shroud; 2-guide vane; 3-side vane; 4-vortex suppression plate; 5-return baffle; 6-transition plate; 7-air duct;

[0024] 21-First blade; 22-Second blade; 23-Third blade; 24-Fourth blade. Detailed Implementation

[0025] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present invention.

[0026] The terms "comprising" and "having," and any variations thereof, in the specification and accompanying drawings of this invention are intended to cover non-exclusive inclusion. For example, a process, method, system, product, or apparatus that includes a series of steps or units is not limited to the steps or units listed, but may include steps or units not listed.

[0027] To enable those skilled in the art to better understand the present invention, the present invention will be further described in detail below with reference to the accompanying drawings and specific embodiments.

[0028] Next, we will describe in detail an air guide shroud provided in the embodiments of the present invention. Figure 1 This is a schematic diagram of the internal structure of an air guide shroud according to an embodiment of the present invention. The air guide shroud includes: a shroud body 1, guide vanes 2, a vortex suppression plate 4, and a return flow baffle 5. The shroud body 1, as the main structure of the entire air guiding system, is a hollow tubular or irregularly shaped cavity structure, with one end being the air inlet side and the other end being the air outlet side. The air inlet side is positioned facing the air outlet of the fan, and its opening shape can match the outline of the fan outlet or be adjusted according to the installation space, such as rectangular, circular, trapezoidal, etc. The air outlet side is designed for diversion or concentration according to the spatial distribution of the target heat dissipation area, and can be set as a single-outlet or multi-outlet structure, without much limitation here.

[0029] The inner wall surface of the cover 1 can be smoothed or micro-textured to reduce airflow friction resistance; guide channels or raised structures can also be added to specific areas of the inner wall to help guide the airflow along a preset path. The material of the cover 1 can be high-strength engineering plastics, aluminum alloys or composite materials, etc., taking into account weight, strength and thermal conductivity, which will not be described in detail here.

[0030] The guide vanes 2 are installed on the inner wall of the housing 1. Specifically, one end of the guide vane 2 is located on the air inlet side of the housing 1, and the other end extends along the air outlet direction of the fan. The specific number can be flexibly configured according to the needs of the air duct 7. Adjacent guide vanes 2 maintain a certain distance to form independent air ducts 7. Each air duct 7 corresponds to one or more heating elements to achieve directional air delivery. The guide vanes 2 integrate and sort the airflow from multiple fans, which may have differences in speed and direction, transforming it into laminar or quasi-laminar flow with consistent direction and more uniform speed distribution, laying the foundation for subsequent precise air guidance. It should be noted that the other end of the guide vane 2 does not necessarily have to extend to the air outlet side of the housing 1. It is acceptable for some guide vanes 2 to extend to the air outlet side, while the other part of the guide vanes 2 extends to the middle of the housing 1.

[0031] Furthermore, the guide vanes 2 may be arranged in parallel or not, but rather tilted, bent, or stepped, depending on the position, height difference, and heat load distribution of the heating elements. For example, for high-positioned heating elements, the guide vanes 2 of the corresponding air duct 7 can be tilted upwards; for densely distributed heat sources, a staggered vane layout can be used to avoid mutual airflow interference.

[0032] It should be noted that in this embodiment, at least one guide vane 2 needs to extend to the air outlet side of the cover 1, and a return baffle 5 is provided at its end. The extended guide vane 2 not only undertakes the function of airflow guidance, but also serves as the supporting skeleton of the return baffle 5, thereby enhancing the structural stability.

[0033] The vortex suppression plate 4 is fixed to the inner wall of the shroud 1, located in the area of ​​the air duct 7 near the air inlet side and / or air outlet side. The vortex suppression plate 4 extends along the guiding direction of the corresponding air duct 7, and its main function is to suppress secondary flow and vortex phenomena generated by the airflow during the flow process. The vortex suppression plate 4 can be a physical baffle or rib on the inner wall of the air guide shroud. When the airflow attempts to rotate in the air duct 7, it will collide with the vortex suppression plate 4, and its kinetic energy will be dissipated. This part of the rotating airflow is forcibly corrected back to the main direction.

[0034] When multiple air ducts 7 are arranged side by side, the vortex suppression plate 4 can also serve as an isolation barrier between adjacent air ducts 7, reducing lateral airflow interference and enhancing the independence of each air duct 7. In addition, micro-guide holes or grooves can be formed on the surface of the vortex suppression plate 4 to further refine the airflow organization and promote turbulent mixing and heat exchange.

[0035] The return flow baffle 5 is located at the end of the guide vane 2 extending to the air outlet side, with both ends extending in a direction perpendicular to the guide vane 2 and partially overlapping with the air ducts 7 on both sides. It should be noted that the part of the return flow baffle 5 that overlaps with the air duct 7 only occupies a small portion of the air outlet area of ​​the air duct 7, so as to avoid affecting the normal exhaust of the airflow.

[0036] In summary, this application utilizes the guide vanes 2 to precisely divide the turbulent airflow output by the fan into multiple independent air ducts 7, achieving directional matching between the airflow and heat-generating components (such as CPU and memory), thus solving the problem of airflow mismatch in traditional heat dissipation. Secondly, by setting vortex suppression plates 4 extending along the guiding direction in key areas of the air ducts 7, boundary layer separation and secondary vortices caused by abrupt changes in the flow path or wall friction are effectively suppressed, reducing flow resistance noise and ensuring the laminar flow characteristics of the airflow. At the same time, by setting backflow baffles 5 at the ends of the guide vanes 2 that overlap with the air ducts 7 on both sides, the reverse backflow path formed by high-speed airflow at the blade trailing edge due to inertial diffusion and negative pressure entrainment is blocked, preventing hot exhaust gas from flowing back to the air inlet side or interfering with adjacent air ducts 7, thereby ensuring that the cold airflow can flow smoothly through the heat source and guaranteeing heat exchange efficiency.

[0037] In some embodiments, side wing blades 3 are provided on both sides of the cover 1, please refer to Figure 1 The side blades 3, serving as the side boundaries of the shroud 1, confine the airflow from the fan within the air ducts 7 between the side blades 3 as much as possible. Specifically, the side blades 3 extend downwards, with their height designed to be exactly flush with or slightly higher than the highest point of the CPU cooler. Furthermore, the two side blades 3 correspond to the sides of two different CPU coolers that are far apart from each other, thereby forcing all airflow entering the shroud 1 to flow within the channels defined by the two side blades 3.

[0038] Within the space enclosed by the two side vanes 3, several sets of guide vanes 2 are arranged. These guide vanes 2 include a first vane 21 and a second vane 22. Both the first vane 21 and the second vane 22 start from the air inlet side and extend along the air outlet direction of the fan until they reach the air outlet side of the shroud 1. This fully continuous design ensures the continuity and integrity of the airflow path, avoiding airflow separation and secondary vortex generation caused by interruptions in the guide vanes 2.

[0039] The first blade 21 and the second blade 22, as well as the blades and the side blades 3, together form multiple independent, narrow air ducts 7. The width and spacing of these air ducts 7 are not randomly distributed, but strictly correspond to the physical layout of the main heat-generating components on the motherboard; for example, the air duct 7 between the first blade 21 and the second blade 22 corresponds to the airflow inlets and channels of the memory module array, ensuring that at least part of the airflow is directed and passes through the gaps between the memory slots. Alternatively, the air duct 7 between the first blade 21 and the second blade 22 corresponds to the CPU cooler, ensuring that the air duct 7 can cover part of the CPU cooler's fins.

[0040] The ends (exhaust side) of the first blade 21 and the second blade 22 can be designed as special tapered outlets. When the airflow passes through these outlets, the flow velocity increases further, forming a high-speed jet. This high-speed airflow can be injected into the gaps between memory slots or between CPU heatsink fins, directly carrying away the heat from the high-heat areas inside the heat-generating components, ensuring effective heat dissipation.

[0041] Furthermore, in a dual-processor server architecture, there are typically two central processing units (CPUs), each with its own CPU heatsink. In this embodiment, the interior of the enclosure 1 is further divided into two side air ducts 7 by a first blade 21 and a second blade 22. Specifically, these two air ducts 7 are formed by the first blade 21 and a side wing blade 3, and the second blade 22 and another side wing blade 3, respectively. The air duct 7 between the first blade 21 and a side wing blade 3 corresponds to one CPU heatsink, and the air duct 7 between the second blade 22 and the other side wing blade 3 corresponds to the other CPU heatsink. The air ducts 7 at least cover part or all of the fins of the CPU heatsink, and the airflow direction of the air ducts 7 is consistent with the direction of the gaps between the fins, ensuring that the airflow can smoothly enter the gaps between the fins and guaranteeing heat dissipation efficiency.

[0042] Considering the slight differences in height between different CPU cooler models, elastic sealing strips (such as silicone) can be installed on the lower edges of the side blades 3, the first blade 21, and the second blade 22. When the air shroud is installed in place, these sealing strips are slightly compressed on the top of the CPU cooler fins or the surrounding frame, forming a near-closed environment that forces all airflow to pass through the fin gaps.

[0043] Furthermore, the first blade 21 and the second blade 22 can be designed as detachable modules. When it is necessary to clean the dust accumulated on the CPU heatsink or replace the CPU, the user can remove the first blade 21 and the second blade 22 separately without disassembling the entire air guide cover, which greatly improves the convenience of operation and maintenance.

[0044] In addition, the guide vane 2 also includes a third blade 23 and a fourth blade 24. The third blade 23 is located between the first blade 21 and a side vane 3, and the fourth blade 24 is located between the second blade 22 and another side vane 3. Please refer to [reference needed] for details. Figure 1 Considering that CPU cores are usually concentrated in the center of the chip or arranged in a specific matrix, while the edge area has lower heat, the third blade 23 and the fourth blade 24 are not located in the exact center of the corresponding air duct 7, but are arranged eccentrically according to the heat source distribution.

[0045] In this embodiment, the third blade 23 is used as an example. The third blade 23 further subdivides the airflow 7 of the CPU heatsink into sub-airflows to correspond to the heat source distribution in different areas of the CPU heatsink. For high-heat areas of the CPU, the cross-sectional area of ​​the corresponding sub-airflow is designed to be relatively large, or its inlet end is designed to be expanded to introduce more cooling airflow. For low-heat areas of the CPU, the cross-sectional area of ​​the corresponding sub-airflow is relatively small, providing only the airflow required to maintain basic heat dissipation.

[0046] Furthermore, the third blade 23 and the fourth blade 24 can be flat plates, or they can be designed as three-dimensional curved surfaces according to the internal flow resistance characteristics of the CPU heatsink. For example, the guiding surfaces of the third blade 23 and the fourth blade 24 can exhibit a slight S-shaped bend. Simultaneously, dust filters of different densities can be integrated at the air inlet of each sub-duct. Sub-ducts corresponding to high-heat areas use low-resistance mesh to ensure airflow, while sub-ducts corresponding to low-heat areas use high-density mesh to block dust, thereby extending the equipment maintenance cycle while ensuring heat dissipation performance.

[0047] In this embodiment, the return flow baffle 5 is located at the end of the guide vane 2 extending to the air outlet side. Its core function is to physically block the reverse flow of airflow. The return flow baffle 5 can be a flat plate, an arc-shaped plate, or a plate structure with reinforcing ribs. The flat plate-shaped return flow baffle 5 can be perpendicular to or slightly inclined to the guiding direction of the guide vane 2. Its projected area in the guiding direction at least covers the cross-sectional area of ​​the end of the guide vane 2, and can extend a certain amount to the air ducts 7 on both sides of the guide vane 2. Through this extension, a shielding area can be formed at the end of the guide vane 2, which can effectively cut off the path of airflow return.

[0048] The arc-shaped return baffle 5 can be an arc-shaped surface that bulges outward or is concave inward. For the outwardly bulging arc-shaped surface, the windward side of the return baffle 5 is part of a sphere or cylinder, with its center located inside the air duct 7 and its apex pointing in the air outlet direction. When the weak return airflow generated at the tip of the blades impacts the outwardly convex surface, the airflow will disperse to both sides and diagonally forward along the normal direction of the curved surface, thereby preventing the return airflow carrying waste heat from entering the air duct 7.

[0049] For the inwardly concave arc surface, the windward side of the baffle is bowl-shaped or groove-shaped concave, with the center located outside the air duct 7 (air outlet side). When the return airflow hits the concave surface, the return baffle 5 gathers and reflects the airflow that might have escaped to the surroundings, thereby keeping the return airflow away from the air duct 7. This also prevents the return airflow carrying waste heat from entering the air duct 7.

[0050] Furthermore, the two ends of the return baffle 5 are connected to the middle of the guide vane 2 via transition plates 6, allowing the airflow in the duct 7 to gradually flow towards the tail of the guide vane 2 through the transition plates 6, preventing the angle between the return baffle 5 and the guide vane 2 from affecting the stable flow of the airflow. Alternatively, if the transition plates 6 are not provided, the airflow direction will abruptly change at the approximately 90° angle between the return baffle 5 and the guide vane 2 when flowing in the duct 7. This can easily lead to airflow pressure loss and the formation of vortices, generating abnormal noise and affecting the flow efficiency of the airflow in the duct 7.

[0051] Specifically, the transition plate 6 is located inside the air duct 7, and the transition plate 6 has a continuously varying radius of curvature or a smoothly transitioning plate structure. This ensures that the airflow direction does not change abruptly when passing through the connection between the transition plate 6 and the guide vane 2. Simultaneously, when the airflow passes through the transition plate 6 with its continuous curvature or smooth transition, the surface of the transition plate 6 has a smooth transition area, ensuring minimal pressure loss. When the airflow reaches the end region of the guide vane 2, it is blocked by the return baffle 5, preventing the airflow from curling backward and forming a backflow.

[0052] In some embodiments, the guide vane 2, transition plate 6, return baffle 5 and cover 1 can be integrally formed by injection molding or die casting. The guide vane 2, transition plate 6 and return baffle 5 can also be detachably or fixedly connected to the inner wall of cover 1 by snap-fit ​​structure, welding structure or adhesive structure to ensure a stable connection structure during use.

[0053] The vortex suppression plate 4 can be an arc-shaped sheet or a flat plate, but its core principle is that its extension direction matches the airflow streamline within the duct 7. The arc-shaped sheet design is suitable for areas where the airflow direction changes continuously, such as areas where the air inlet side of the guide hood needs to contract or expand, and areas where the air outlet side needs to contract or expand. The flat plate design is suitable for the dominant flow area inside the duct 7, effectively suppressing the generation of vortices within the duct 7.

[0054] The edge of the vortex suppressor plate 4 smoothly transitions to the inner wall of the cover 1. There are no right-angle steps or gaps between the vortex suppressor plate 4 and the inner wall. Instead, they are integrated through continuous curvature changes, such as using R-angle transition or curved surface fusion. This ensures that the airflow will not be abruptly disturbed when it flows through the edge of the vortex suppressor plate 4, eliminating secondary vortices and howling noise caused by disturbances.

[0055] The outer surface of the side vane 3 and / or the air outlet side of the shroud 1 are provided with positioning protrusions or limiting grooves. The positioning protrusions or limiting grooves are configured to cooperate with the bracket inside the chassis to fix the air guide shroud in place. Positioning protrusions include, but are not limited to, positioning features with raised structures such as positioning posts and positioning sliders; limiting grooves include, but are not limited to, positioning features with groove structures such as through holes and threaded holes.

[0056] This application also provides a heat dissipation module, which includes a fan and an air guide shroud as described above. The air outlet of the fan is connected to the air inlet side of the air guide shroud, and the airflow generated by the fan is guided to the corresponding heat-generating element through the air duct 7 of the air guide shroud.

[0057] This application also provides a server, which includes a chassis, a motherboard disposed within the chassis, a CPU heatsink and a memory module array mounted on the motherboard, and the aforementioned heat dissipation module. The heat dissipation module is installed inside the chassis such that each air duct 7 of the air guide shroud corresponds to at least the CPU heatsink and the memory module array.

[0058] The foregoing has provided a detailed description of an air guide shroud, a heat dissipation module, and a server provided by embodiments of the present invention. The various embodiments are described in a progressive manner, with each embodiment focusing on its differences from other embodiments. Similar or identical parts between embodiments can be referred to interchangeably. For the apparatus disclosed in the embodiments, since it corresponds to the method disclosed in the embodiments, the description is relatively simple; relevant parts can be referred to the method section.

[0059] Those skilled in the art will further recognize that the units and algorithm steps of the various examples described in conjunction with the embodiments disclosed herein can be implemented in electronic hardware, computer software, or a combination of both. To clearly illustrate the interchangeability of hardware and software, the components and steps of the various examples have been generally described in terms of functionality in the foregoing description. Whether these functions are implemented in hardware or software depends on the specific application and design constraints of the technical solution. Those skilled in the art can use different methods to implement the described functions for each specific application, but such implementations should not be considered beyond the scope of this invention.

[0060] The present invention has been described in detail above as follows: an air guide shroud, a heat dissipation module, and a server. Specific examples have been used to illustrate the principles and implementation methods of the invention. The descriptions of the embodiments above are merely for the purpose of helping to understand the method and core ideas of the present invention. It should be noted that those skilled in the art can make various improvements and modifications to the present invention without departing from its principles, and these improvements and modifications also fall within the protection scope of the claims of the present invention.

Claims

1. An air guide shroud, characterized in that, include: The cover (1) has an air inlet side at one end that is opposite to the air outlet of the fan, and an air outlet side at the other end; A guide vane (2) is provided on the air inlet side. Multiple guide vanes (2) extend along the air outlet direction of the fan. The guide vanes (2) are spaced apart to form multiple air ducts (7) corresponding to the heating element. At least one guide vane (2) extends to the air outlet side. A vortex suppression plate (4) is fixed to the inner wall of the cover (1) and located in the area of ​​the air duct (7) near the air inlet side and / or the air outlet side. The vortex suppression plate (4) extends along the guiding direction of the corresponding air duct (7). A return flow baffle (5) is provided at the end of the guide vane (2) extending to the air outlet side. Both ends of the return flow baffle (5) extend in a direction perpendicular to the guide vane (2). Both ends of the return flow baffle (5) partially overlap with the air duct (7) on both sides of the guide vane (2).

2. The air guide shroud according to claim 1, characterized in that, The cover (1) is provided with side vanes (3) on both sides. The side vanes (3) serve as the side boundaries of the cover (1). The guide vane (2) includes a first blade (21) and a second blade (22) located between the two side vanes (3). The first blade (21) and the second blade (22) extend to the air outlet side. The air duct (7) between the first blade (21) and the second blade (22) corresponds to the air inlet and channel of the memory module array to ensure that at least part of the airflow is guided and passes through the gap between the memory slots.

3. The air guide shroud according to claim 2, characterized in that, The air duct (7) between the first blade (21) and one of the side blades (3) corresponds to a CPU heatsink, and the air duct (7) between the second blade (22) and another side blade (3) corresponds to another CPU heatsink. The air duct (7) covers at least part of the fins of the CPU heatsink, and the airflow direction of the air duct (7) is consistent with the direction of the gap between the fins.

4. The air guide shroud according to claim 3, characterized in that, The airflow guide blade (2) includes a third blade (23) and a fourth blade (24). The third blade (23) is located between the first blade (21) and one of the side blades (3). The fourth blade (24) is located between the second blade (22) and another side blade (3). The third blade (23) and the fourth blade (24) further subdivide the airflow channel (7) corresponding to the CPU heat sink into sub-airflow channels to correspond to the heat source distribution in different areas of the CPU heat sink.

5. The air guide shroud according to claim 1, characterized in that, The return baffle (5) is flat or arc-shaped. The projected area of ​​the return baffle (5) covers at least the cross-sectional area of ​​the end of the guide vane (2) to block the airflow from generating reverse return flow at the end of the guide vane (2). The two ends of the return baffle (5) are connected to the middle of the guide vane (2) through a transition plate (6). The transition plate (6) is located in the air duct (7) and has a continuously changing radius of curvature or a plate structure with a smooth transition.

6. The air guide shroud according to claim 1, characterized in that, The guide vane (2) and the cover (1) are integrally formed, or the guide vane (2) is detachably or fixedly connected to the inner wall of the cover (1) by means of a snap-fit ​​structure, welding structure or adhesive structure.

7. The air guide shroud according to claim 1, characterized in that, The vortex suppression plate (4) has an arc-shaped sheet or flat plate structure, and its extension direction is adapted to the airflow streamline in the air duct (7). The edge of the vortex suppression plate (4) is smoothly connected to the inner wall of the cover (1).

8. The air guide shroud according to claim 2, characterized in that, The outer surface of the side blade (3) and / or the air outlet side of the cover (1) are provided with positioning protrusions or limiting grooves, which are configured to cooperate with the bracket inside the chassis to fix the air guide cover.

9. A heat dissipation module, characterized in that, Includes a fan and a shroud as described in any one of claims 1 to 8, wherein the air outlet of the fan is connected to the air inlet side of the shroud, and the airflow generated by the fan is guided to the corresponding heating element via the air duct (7) of the shroud.

10. A server, characterized in that, The system includes a chassis, a motherboard disposed within the chassis, a CPU heatsink and a memory module array mounted on the motherboard, and a heat dissipation module as described in claim 9, wherein the heat dissipation module is installed within the chassis such that each air duct (7) of the air guide shroud corresponds to the CPU heatsink and the memory module array, respectively.

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