Production equipment for roll-to-roll film switch LED sticking

Abstract

The application discloses a kind of production equipment for film switch LED pasting of roll-to-roll, including the film circuit board feeding device for the film circuit board material of LED switch to be pasted for feeding, for the film circuit board material of LED switch pasted for winding and receiving, for the position of film circuit board material band on LED switch to be pasted silver point roll material silver point machine, for the LED lamp bead pasting machine of LED supply device supply to specified position is pasted in silver position on film circuit board material band, for the welding equipment of the LED lamp bead of film circuit board material band is pasted, for the film circuit board material band on LED lamp bead welded is glued roll glue sealing machine, for the drying equipment and control system of glue heating solidification, the film switch position of the film circuit board material band of the present application realizes that film switch position is efficiently pasted LED lamp bead on the film circuit board material band of roll, production efficiency is high, and production cost is low.

Description

Technical Field

[0001] This invention relates to a switch, and more particularly to a production equipment for roll-to-roll bonding of thin-film LED switches. Background Technology

[0002] Currently, the method for attaching LEDs to membrane switches on thin-film circuit boards involves first cutting the thin-film circuit board into sheets, then applying silver paste as pads to the LED attachment areas of the sheet as a solder pad, then using a pick-and-place machine to position the thin-film circuit board sheets, attaching each LED bead to the respective membrane switch area of ​​the thin-film circuit board, and then soldering the LED bead pins to the pads to form conductivity. Finally, sealing and stacking are performed. This LED attachment method has low production efficiency, complex production processes, and high production costs. Summary of the Invention

[0003] To overcome the above deficiencies, the present invention provides a production equipment for roll-to-roll bonding of membrane switch LEDs. This production equipment can efficiently bond LED beads to the membrane switch positions on the roll of thin-film circuit board material strip, with high production efficiency, simple process, and low production cost.

[0004] The technical solution adopted by this invention to solve its technical problem is: a production equipment for roll-to-roll bonding of film switch LEDs, including a film circuit board feeding device, a film circuit board taking device, a taking device drive, a roll silver-dotting machine, an LED chip mounter, a welding device, a roll sealing machine, a drying device, and a control system. The film circuit board feeding device rotatably mounts a roll of film circuit board to be bonded with LED switches, and the film circuit board taking device rotatably mounts a roll of film circuit board taking device. The taking device drive drives the roll of film circuit board taking device to rotate intermittently to take the film circuit board strip. The roll silver-dotting machine, LED chip mounter, welding device, roll sealing machine, and drying device are arranged sequentially and intermittently between the film circuit board feeding device and the film circuit board taking device along the conveying direction of the film circuit board strip.

[0005] The roll silver application machine includes a silver application worktable, a silver application pulling mechanism, a silver application head, and a silver application driving device. The silver application pulling mechanism can intermittently pull the thin film circuit board strip forward by a fixed length, so that each thin film circuit board on the thin film circuit board strip is flat against the surface of the designated position on the silver application worktable. The silver application driving device drives the silver application head to move in the front-back, left-right, and up-down directions above the silver application worktable to apply silver paste to the position of the LED to be attached on the thin film circuit board.

[0006] The LED chip mounter includes a mounting table, a chip mounting pull mechanism, LED chip mounting nozzles, an LED supply device, and a chip mounting drive device. The chip mounting pull mechanism can intermittently pull the thin film circuit board strip forward a fixed length, so that each thin film circuit board on the thin film circuit board strip is flatly attached to the surface of the designated position on the mounting table. The LED supply device can supply LED lamp beads to the designated position. The chip mounting drive device drives the LED chip mounting nozzle to move in the front-back, left-right, and up-down directions above the mounting table, thereby attaching the LED lamp beads at the designated position to the position of the thin film circuit board with silver paste applied.

[0007] The welding equipment includes a welding material pulling mechanism and a welding box. The welding material pulling mechanism can intermittently pull the thin film circuit board strip forward by a fixed length so that the thin film circuit board that has been fitted with LEDs by the LED chip mounter enters the welding box. The welding box can weld the LED lamp beads to the silver paste on the thin film circuit board.

[0008] The roll sealing machine includes a sealing worktable, a sealing pulling mechanism, a dispensing head, and a sealing drive device. The sealing pulling mechanism can intermittently pull the film circuit board strip forward by a fixed length, so that each film circuit board on the film circuit board strip is flat against the surface of the sealing worktable at a designated position. The sealing drive device drives the dispensing head to move in the front-back, left-right, and up-down directions above the sealing worktable, thereby applying sealant to the outside of the LED beads on the film circuit board for sealing.

[0009] The drying equipment includes a drying pulling mechanism and a drying box. The drying pulling mechanism can intermittently pull the film circuit board strip forward by a fixed length so that the sealed film circuit board enters the drying box. The drying box can dry and cure the sealant on the film circuit board.

[0010] The control system controls the receiving drive device, silver dotting and pulling mechanism, silver dotting head, silver dotting drive device, chip mounting and pulling mechanism, LED chip mounting nozzle, LED supply device, chip mounting drive device, welding and pulling mechanism, welding box, sealing and pulling mechanism, dispensing head, sealing drive device, drying and pulling mechanism, and drying box to operate according to the control program.

[0011] As a further improvement of the present invention, a film circuit board tension detection device is provided between the film circuit board feeding device and the roll silvering machine, between the roll silvering machine and the LED chip mounter, between the LED chip mounter and the welding equipment, between the welding equipment and the roll sealing machine, between the sealing machine and the drying equipment, and between the drying equipment and the film circuit board take-up device. The film circuit board tension detection device includes an upper contact switch and a lower contact switch. The film circuit board strip is located between the upper contact switch and the lower contact switch. When the film circuit board strip droops to a specified height, the lower contact switch can be triggered. When the film circuit board strip is tightened to the point where the drooping arc increases to a set angle, the upper contact switch can be triggered. The upper contact switch and the lower contact switch communicate with the control system respectively. The control system controls the start and stop of the silvering pulling mechanism, the chip mounting pulling mechanism, the welding pulling mechanism, the sealing pulling mechanism, and the drying pulling mechanism according to the information from the upper contact switch and the lower contact switch.

[0012] As a further improvement of the present invention, a first camera is fixedly installed on the side wall of the silver dispensing head. The first camera can image the thin film circuit board that reaches the designated position on the silver dispensing worktable, and can send the image captured by the first camera to the control system to detect the silver dispensing position on the thin film circuit board. A second camera is fixedly installed on the LED mounting nozzle. The second camera can image the LED lamp bead product that reaches the designated position and the thin film circuit board that reaches the designated position on the mounting worktable, respectively. The second camera can send the image captured by the second camera to the control system to detect the position of the LED lamp bead product and the LED lamp bead mounting position on the thin film circuit board. A third camera is fixedly installed on the side wall of the dispensing head. The third camera can image the thin film circuit board that reaches the designated position on the encapsulation worktable, and can send the image captured by the third camera to the control system to detect the encapsulation position on the thin film circuit board.

[0013] As a further improvement of the present invention, the LED supply device includes LED chip strip slides, an LED chip strip supply device, and an LED chip strip traction device. Several LED chip strip slides are arranged parallel to each other on one side of the mounting worktable. The cross-section of the LED chip strip slide is a T-shaped opening groove structure. Several LED chip strips led out from the LED chip strip supply device can move horizontally forward along the corresponding LED chip strip slides. The two side edges of the LED chip strips are stopped by the inner sidewall of the opening direction of the T-shaped opening groove structure. The LEDs on the LED chip strips can be exposed on the upper surface of the LED chip strip slide through the opening of the T-shaped opening groove. The LED chip strip traction device can intermittently pull forward the LED chip strip waste after removing the LEDs.

[0014] As a further improvement of the present invention, the chip mounting worktable is also equipped with a chip detection camera. The chip mounting driving device can drive the LED chip nozzle with LED chips adsorbed to reach directly above the chip detection camera. The chip detection camera can image the LED chips adsorbed on the LED chip nozzle. The chip detection camera can transmit the image of the LED chips it captures to the control system. The control system can determine whether the LED chips are qualified based on the image of the LED chips captured by the chip detection camera.

[0015] As a further improvement of the present invention, each of the encapsulation worktables is provided with a first pressing block capable of vertical movement and a first pressing drive device for driving the first pressing block to reciprocate vertical movement. The first pressing blocks are distributed on both sides of the silvering worktable and the encapsulation worktable along the width direction of the thin film circuit board strip. At least two first pressing strips extending along the width direction of the thin film circuit board strip are fixedly installed on the first pressing blocks. Each first pressing strip can press the strips of the thin film circuit board that have reached the silvering and encapsulation positions on both sides along the conveying direction as the first pressing block descends, so that the thin film circuit board is flat against the silvering worktable and the encapsulation worktable. The control system controls the lifting and lowering movement of the first pressing drive device. The silvering worktable and the bonding worktable are provided with a plurality of first air holes evenly spaced apart. The first air holes are connected to a first negative pressure providing device. The first air holes can perform negative pressure adsorption on the thin film circuit board laid flat on the bonding worktable to keep it flat. The control system controls the start and stop of the first pressing drive device and the first negative pressure providing device.

[0016] As a further improvement of the present invention, the roll silver dotting machine also includes a silver dotting detection platform that is horizontally connected to the silver dotting worktable. A plurality of second air holes are evenly distributed on the silver dotting detection platform. The second air holes are connected to a second negative pressure providing device. The second air holes can exert negative pressure to adsorb the thin film circuit board laid flat on the silver dotting detection platform, keeping it flat. A silver dotting detection head and a silver dotting detection driving device are also installed above the silver dotting detection platform. The silver dotting detection driving device drives the silver dotting detection head to slide linearly along the width direction of the thin film circuit board strip on the silver dotting detection platform. A silver dotting detection camera and a silver dotting detection light source are installed on the silver dotting detection head. The silver dotting detection light source can illuminate the thin film circuit board in the detection area, and the silver dotting detection camera can image the thin film circuit board in the detection area. The silver dotting detection camera can transmit the image of the thin film circuit board it captures to the control system. The control system can analyze and determine whether the silver dotting position and silver dot size meet the requirements based on the image captured by the silver dotting detection camera, and control the second negative pressure providing device and the silver dotting detection driving device to start and stop.

[0017] As a further improvement of the present invention, the roll sealing machine further includes a sealing inspection platform that is horizontally connected to the sealing worktable. The sealing inspection platform is provided with a second pressing block capable of vertical movement, a second pressing drive device that drives the second pressing block to reciprocate vertical movement, a sealing inspection head, and a sealing inspection drive device. The second pressing blocks are distributed on both sides of the sealing inspection platform along the width direction of the film circuit board strip. When each second pressing block descends, it can press the strip of the film circuit board that has reached the sealing inspection position onto the front and rear sides along the conveying direction, so that the film circuit board is flat against the sealing inspection platform. The sealing inspection drive device drives the sealing inspection head to slide linearly on the sealing inspection platform along the width and length directions of the film circuit board strip. The sealing inspection head is equipped with a sealing inspection camera and a sealing inspection light source. The sealing inspection light source can illuminate the film circuit board in the inspection area, and the sealing inspection camera can image the film circuit board in the inspection area. The sealing inspection camera can transmit the image of the film circuit board it captures to the control system. The control system can analyze and determine whether the sealing position meets the requirements based on the image captured by the sealing inspection camera, and control the second pressing drive device and the sealing inspection drive device to start and stop working.

[0018] As a further improvement of the present invention, a flat press is also provided between the thin film circuit board feeding device and the roll silvering machine. The flat press includes a flat press worktable, a flat press upper die, a flat press drive device, a heating device, and a flat press pulling mechanism. The thin film circuit board strip drawn from the thin film circuit board roll of the thin film circuit board feeding device can move forward intermittently under the pull of the flat press pulling mechanism and be laid on the flat press worktable intermittently. The flat press drive device drives the flat press upper die to move up and down. The flat press upper die descends and can press tightly against the upper side of the thin film circuit board strip. The heating device can heat the flat press upper die. The thin film circuit board strip can be kept flat under the combined pressing force of the heated flat press upper die and the flat press worktable. The control system controls the start and stop of the flat press drive device, the heating device, and the flat press pulling mechanism, as well as the downward pressure of the flat press drive device.

[0019] As a further improvement of the present invention, the thin film circuit board feeding device includes a feeding frame, a feeding shaft, a feeding conveyor belt, a belt tension adjustment device, and support rollers. The feeding shaft is rotatably mounted on the lower layer of the feeding frame, and the thin film circuit board roll can be fitted onto the feeding shaft. The feeding conveyor belt is mounted on the upper layer of the feeding frame, and several support rollers are rotatably mounted on the discharge end of the feeding frame. The support rollers are arranged at intervals from top to bottom along the belt conveying direction. The thin film circuit board strip drawn from the thin film circuit board roll can be laid flat on the surface of the feeding conveyor belt and moved horizontally forward by the feeding conveyor belt, and then leaves the film via the support rollers. The circuit board feeding device includes a strip tension adjustment device comprising a horizontal slide, strip clamping blocks, a clamping drive device, and a guide roller. The guide roller is rotatably mounted on the feeding frame. The film circuit board strip drawn from the film circuit board roll passes around the guide roller and is laid flat on the feeding conveyor belt. The horizontal slide is horizontally slidable and mounted on the feeding frame. Several strip clamping blocks are fixedly mounted on the horizontal slide at intervals along the width direction of the film circuit board strip. The clamping drive device drives the horizontal slide to slide horizontally, thereby changing the clamping force of the strip clamping blocks and the guide roller on the film circuit board strip. The control system controls the operation of the clamping drive device.

[0020] The beneficial technical effects of this invention are as follows: This invention eliminates the need for slitting the thin-film circuit board strip before attaching LED beads to the thin-film switch position. The entire roll of thin-film circuit board strip is intermittently fed forward by a feeding mechanism, and each station quickly positions the strip and automatically identifies the LED bead placement location. Silver paste is applied, LED beads are attached, soldering, and sealing are then performed. After the LED beads are attached, the strip is collected in a roll. The entire LED bead attachment process is simple, eliminating the need for slitting, storing, and retrieving the thin-film circuit board strip. Furthermore, the final roll facilitates subsequent steps. This invention significantly improves the efficiency of attaching LED beads to the thin-film switch position on thin-film circuit boards, effectively reduces costs, and ensures accurate LED bead placement and positioning. Attached Figure Description

[0021] Figure 1 This is a schematic diagram illustrating the structural principle of the present invention;

[0022] Figure 2 This is a perspective view of the thin-film circuit board loading device of the present invention;

[0023] Figure 3 for Figure 2 Enlarged view of section A in the middle;

[0024] Figure 4 This is a perspective view of the flat press of the present invention;

[0025] Figure 5This is a perspective view of the coil silver-doping machine of the present invention;

[0026] Figure 6 This is a front view of the coil silver-doping machine of the present invention;

[0027] Figure 7 This is a top view of the coil silver-doping machine of the present invention;

[0028] Figure 8 This is a left view of the coil silver-doping machine of the present invention;

[0029] Figure 9 This is a perspective view of the internal structure of the coil silver-doping machine of the present invention;

[0030] Figure 10 This is a front view of the internal structure of the coil silver-doping machine of the present invention;

[0031] Figure 11 This is a top view of the internal structure of the coil silver-doping machine of the present invention;

[0032] Figure 12 This is a left view of the internal structure of the coil silver-doping machine of the present invention;

[0033] Figure 13 This is a perspective view of the LED chip mounter of the present invention;

[0034] Figure 14 This is a perspective view of the internal structure of the LED chip mounter of the present invention;

[0035] Figure 15 for Figure 14 Enlarged view of section B;

[0036] Figure 16 This is a front view of the internal structure of the LED chip mounter of the present invention;

[0037] Figure 17 This is a top view of the internal structure of the LED chip mounter of the present invention;

[0038] Figure 18 This is a right view of the internal structure of the LED chip mounter of the present invention;

[0039] Figure 19 This is a perspective view of the roll sealing machine of the present invention;

[0040] Figure 20 This is a front view of the roll sealing machine of the present invention;

[0041] Figure 21 This is a top view of the roll sealing machine of the present invention;

[0042] Figure 22 This is a left view of the roll sealing machine of the present invention;

[0043] Figure 23This is a perspective view of the internal structure of the roll sealing machine of the present invention;

[0044] Figure 24 for Figure 23 Enlarged view of section C;

[0045] Figure 25 for Figure 23 Enlarged view of section D in the middle;

[0046] Figure 26 This is a front view of the internal structure of the roll sealing machine of the present invention;

[0047] Figure 27 This is a top view of the internal structure of the roll sealing machine of the present invention;

[0048] Figure 28 This is a left view of the internal structure of the roll sealing machine of the present invention. Detailed Implementation

[0049] Example: A production equipment for roll-to-roll bonding of film switch LEDs includes a film circuit board feeding device 1, a film circuit board taking device 8, a taking device drive, a roll silver-dotting machine 2, an LED chip mounter 3, a welding device 4, a roll sealing machine 5, a drying device 6, and a control system. The film circuit board feeding device 1 rotatably mounts a roll of film circuit board 10 containing LED switches to be bonded. The film circuit board taking device 8 rotatably mounts a roll of film circuit board taking device. The taking device drive drives the roll of film circuit board taking device to rotate intermittently to take the film circuit board strip 101. The roll silver-dotting machine 2, the LED chip mounter 3, the welding device 4, the roll sealing machine 5, and the drying device 6 are arranged sequentially and at intervals between the film circuit board feeding device 1 and the film circuit board taking device 8 along the conveying direction of the film circuit board strip 101.

[0050] The roll silver application machine 2 includes a silver application worktable 21, a silver application pulling mechanism 22, a silver application head 23, and a silver application driving device 24. The silver application pulling mechanism 22 can intermittently pull the thin film circuit board strip 101 forward by a fixed length, so that each thin film circuit board on the thin film circuit board strip 101 is flatly attached to the surface of the designated position on the silver application worktable 21. The silver application driving device 24 drives the silver application head 23 to move in the front-back, left-right, and up-down directions above the silver application worktable 21 to apply silver paste to the position of the LED to be attached on the thin film circuit board.

[0051] LED chip mounter 3 includes a mounting table 31, a chip mounting pull mechanism 32, an LED chip mounting nozzle 33, an LED supply device, and a chip mounting drive device 34. The chip mounting pull mechanism 32 can intermittently pull the thin film circuit board strip 101 forward by a fixed length, so that each thin film circuit board on the thin film circuit board strip 101 is flatly attached to the surface of the designated position on the mounting table 31. The LED supply device can supply LED lamp beads to the designated position. The chip mounting drive device 34 drives the LED chip mounting nozzle 33 to move in the front-back, left-right, and up-down directions above the mounting table 31, thereby attaching the LED lamp beads at the designated position to the position of the thin film circuit board with silver paste by the LED chip mounting nozzle 33.

[0052] The welding equipment 4 includes a welding material pulling mechanism and a welding box. The welding material pulling mechanism can intermittently pull the thin film circuit board strip 101 forward by a fixed length so that the thin film circuit board that has been LED-mounted by the LED mounting machine 3 can enter the welding box. The welding box can weld the LED lamp bead products to the silver paste on the thin film circuit board.

[0053] The roll sealing machine 5 includes a sealing worktable 51, a sealing pulling mechanism 52, a dispensing head 53, and a sealing drive device 54. The sealing pulling mechanism 52 can intermittently pull the film circuit board strip 101 forward by a fixed length, so that each film circuit board on the film circuit board strip 101 is flatly attached to the surface of the sealing worktable 51 at a designated position. The sealing drive device 54 drives the dispensing head 53 to move in the front-back, left-right, and up-down directions above the sealing worktable 51, thereby applying sealant to the outside of the LED beads on the film circuit board for sealing.

[0054] The drying equipment 6 includes a drying pulling mechanism and a drying box. The drying pulling mechanism can intermittently pull the film circuit board strip 101 forward by a fixed length so that the sealed film circuit board enters the drying box. The drying box can dry and cure the sealant on the film circuit board.

[0055] The control system controls the receiving drive device, the silver-doping material pulling mechanism 22, the silver-doping head 23, the silver-doping drive device 24, the chip-mounting material pulling mechanism 32, the LED chip-mounting nozzle 33, the LED supply device, the chip-mounting drive device 34, the welding material pulling mechanism, the welding box, the sealing material pulling mechanism 52, the dispensing head 53, the sealing drive device 54, the drying material pulling mechanism, and the drying box to operate according to the control program.

[0056] When attaching LED beads to the membrane switch positions on the thin-film circuit board, it is not necessary to pre-cut the roll material into sheets. The roll material is directly installed on the thin-film circuit board feeding device 1, and the thin-film circuit board strip 101 is pulled out from the roll material and sequentially passes through the roll material silvering machine 2, LED chip mounter 3, welding equipment 4, roll material sealing machine 5, and drying equipment 6. When each thin-film circuit board on the thin-film circuit board feeding strip reaches the silvering position of the roll material silvering machine 2 under the pull of the sealing and pulling mechanism 52, the silvering head 23 moves back and forth, left and right, and up and down under the drive of the silvering drive device 24. The silvering head 23 includes a silvering bracket, a silver paste outlet nozzle, a silvering valve, and a silvering machine. The silver paste outlet nozzle is installed on... On the side wall of the silver-plating bracket, the silver-plating machine is connected to the silver paste outlet nozzle via a pipe. The silver-plating machine dispenses silver paste into the outlet nozzle, and the silver-plating valve controls the opening and closing of the outlet nozzle. The silver paste outlet nozzle of the silver-plating head 23 applies silver paste to designated positions on the thin-film circuit board according to the control program of the control system. After the silver paste is applied, the thin-film circuit board strip 101 is pulled to the mounting worktable 31 by the mounting pull mechanism 32. The LED mounting nozzle 33 moves back and forth, left and right, and up and down under the drive of the mounting drive device 34. The LED mounting nozzle 33 first removes the LED beads delivered to the designated position by the LED supply device through negative pressure, and then moves to the position where the silver paste is applied. The LED beads are pasted onto the silver paste with their solder pads facing downwards to achieve LED bead attachment. After the LED beads are attached, the thin-film circuit board enters the soldering box for soldering, ensuring that the LED bead solder pads are firmly soldered to the thin-film circuit board and connected to the circuit of the thin-film circuit board. After the LED beads are soldered, the thin-film circuit board is pulled to the sealing worktable 51 of the roll sealing machine 5. The dispensing head 53 moves back and forth, left and right, and up and down under the drive of the sealing drive device 54. The dispensing head 53 includes a dispensing bracket, a sealant nozzle, a dispensing valve, and a dispensing machine. The sealant nozzle is installed on the side wall of the dispensing bracket, and the dispensing machine is connected to the sealant nozzle through a pipe. The dispensing machine dispenses sealant into the sealant nozzle. The dispensing valve controls the opening and closing of the sealant nozzle. The sealant nozzle of the dispensing head 53 applies the sealant to the designated positions on the thin-film circuit board according to the control program of the control system. After the sealant is applied, the thin-film circuit board tape 101 enters the drying equipment 6. The drying equipment 6 heats the thin-film circuit board. Since the sealant is a thermosetting adhesive, it cures in the drying equipment 6 to protect the LED beads. Finally, the thin-film circuit board tape 101 with the LED beads attached enters the thin-film circuit board receiving device 8, where it is wound into a roll for storage and transportation, so that it can be laminated with other layers of the thin-film circuit board later.

[0057] Among them, the silver-dot material pulling mechanism 22, the chip-mount material pulling mechanism 32, the welding material pulling mechanism, the encapsulation material pulling mechanism 52 and the drying material pulling mechanism realize the traction of the thin film circuit board material strip 101 by the cooperation of the active roller and the pressure roller, or the traction of the thin film circuit board material strip 101 by the cooperation of the conveyor belt and the pressure roller.

[0058] The silver application drive 24, the patch drive 34, and the encapsulation drive 54 can be either a three-axis manipulator that slides linearly along front-back, left-right, and up-down tracks, or a multi-axis manipulator that rotates around a rotating axis that extends up-down, front-back, and left-right.

[0059] To improve the positional accuracy of the silver dotting head 23, the LED chip nozzle 33, and the sealing head, a position fine-tuning structure can be set on the moving ends of the silver dotting drive device 24, the chip mounting drive device 34, and the sealing drive device 54 to achieve fine-tuning of the silver dotting head 23, the LED chip nozzle 33, and the sealing head in terms of front-to-back swing angle, left-to-right swing angle, and vertical height.

[0060] To improve production efficiency, multiple silver-doping machines, chip mounters, and encapsulation machines can be installed. Each machine performs silver-doping, LED bead mounting, and encapsulation on a portion of the thin-film circuit board. Multiple welding machines and encapsulation equipment can also be installed according to demand.

[0061] The aforementioned equipment enables the LED beads to be bonded and fixed by feeding and retracting the thin film circuit board strip 101 in a roll manner, avoiding the cutting and strip removal processes of the thin film circuit board, greatly improving the bonding efficiency of the LED beads. Furthermore, the thin film circuit board strip 101 is easy to pull and position, and the LED beads are bonded with high precision. Before and after bonding, the thin film circuit board strip 101 is easy to store. This equipment greatly reduces the cost of bonding LED beads on thin film circuit boards.

[0062] Thin film circuit board (PCB) feeding device 1 is equipped with a PCB tension detection device between it and the roll silver-doping machine 2, between it and the LED chip mounter 3, between it and the welding equipment 4, between it and the roll sealing machine 5, between the sealing machine and the drying equipment 6, and between the drying equipment 6 and the PCB take-up device 8. The PCB tension detection device includes an upper contact switch and a lower contact switch. The PCB strip 101 is located between the upper and lower contact switches. When the PCB strip 101 droops to a specified height, the lower contact switch is triggered. When the PCB strip 101 is tightened to the point where the drooping arc increases to a set angle, the upper contact switch is triggered. The upper and lower contact switches communicate with the control system. The control system controls the start and stop of the silver-doping pulling mechanism 22, the chip mounting pulling mechanism 32, the welding pulling mechanism, the sealing pulling mechanism 52, and the drying pulling mechanism based on the information from the upper and lower contact switches. Each process uses a silver-doping material pulling mechanism 22, a chip mounting material pulling mechanism 32, a soldering material pulling mechanism, an encapsulation material pulling mechanism 52, and a drying material pulling mechanism to pull the thin film circuit boards on the thin film circuit board strip 101 to the silver-doping worktable 21, the chip mounting worktable 31, the soldering box, the encapsulation worktable 51, and the drying box, respectively. The tension of the strip is controlled between adjacent machines by upper and lower contact switches to prevent the strip from being broken and to prevent the strip from piling up in a certain position, ensuring that the entire process proceeds in an orderly manner.

[0063] A first camera 25 is fixedly installed on the side wall of the silver dispensing head 23. The first camera 25 can image the thin film circuit board that reaches the designated position on the silver dispensing worktable 21, and can send the image captured by the first camera 25 to the control system to detect the silver dispensing position on the thin film circuit board. A second camera 35 is fixedly installed on the LED mounting nozzle 33. The second camera 35 can image the LED lamp bead product that reaches the designated position and the thin film circuit board that reaches the designated position on the mounting worktable 31, respectively. The second camera 35 can send the image captured by the second camera 35 to the control system to detect the position of the LED lamp bead product and the LED lamp bead mounting position on the thin film circuit board. A third camera 55 is fixedly installed on the side wall of the glue dispensing head 53. The third camera 55 can image the thin film circuit board that reaches the designated position on the glue sealing worktable 51, and can send the image captured by the third camera 55 to the control system to detect the glue sealing position on the thin film circuit board.

[0064] During the processes of silvering, LED chip mounting, and encapsulation, the silvering head 23, LED chip mounting nozzle 33, and encapsulation head first image the thin-film circuit board and LED chip strip through the first camera 25, the second camera 35, and the third camera 55, respectively. After accurately obtaining the positions of silvering, chip mounting, encapsulation on the thin-film circuit board and the placement position of the LED chips, the control system will perform position corrections on the silvering head 23, LED chip mounting nozzle 33, and encapsulation head based on calculation and analysis to ensure accurate silvering, chip mounting, and encapsulation positions.

[0065] The LED supply device includes LED chip strip slides 36, an LED chip strip supply device, and an LED chip strip traction device. Several LED chip strip slides 36 are arranged parallel to each other on one side of the mounting table 31. Each LED chip strip slide 36 has a T-shaped opening groove structure in cross-section. Several LED chip strips led from the LED chip strip supply device can move horizontally forward along corresponding LED chip strip slides 36. The two edges of the LED chip strips are stopped by the inner sidewalls of the T-shaped opening groove structure. The LEDs on the LED chip strips can be exposed on the upper surface of the LED chip strip slide 36 through the opening of the T-shaped opening groove. The LED chip strip traction device can intermittently pull forward the waste LED chip strip after removing the LEDs. LEDs are supplied by the continuous movement of their strips within the LED chip strip slides 36, ensuring that the LED mounting nozzle 33 can accurately pick up the LEDs each time. Alternatively, LEDs can also be fed by a vibratory feeder, allowing them to be arranged in an orderly manner and placed at designated positions.

[0066] The mounting table 31 is also equipped with an LED bead detection camera 37. The mounting drive device 34 can drive the LED mounting nozzle 33, which adsorbs LED beads, to directly above the LED bead detection camera 37. The LED bead detection camera 37 can image the LED beads adsorbed on the LED mounting nozzle 33 and transmit the image of the LED beads it captures to the control system. The control system can determine whether the LED beads are qualified based on the image captured by the LED bead detection camera 37. After the LED mounting nozzle 33 adsorbs LED beads through negative pressure, it first moves above the LED bead detection camera 37, which then images the LED beads and analyzes and determines whether the LED beads are qualified. This prevents unqualified LED beads from being stuck on the thin film circuit board, which would cause subsequent LED beads to not light up properly. A waste LED bead collection box can also be set on one side of the mounting table 31, where unqualified LED beads can be discarded.

[0067] Each of the encapsulation worktables 51 is equipped with a first pressing block 56 capable of vertical movement and a first pressing drive device 57 that drives the first pressing block 56 to reciprocate vertical movement. The first pressing blocks 56 are distributed on both sides of the silvering worktable 21 and the encapsulation worktable 51 along the width direction of the thin film circuit board strip 101. At least two first pressing strips 58 extending along the width direction of the thin film circuit board strip 101 are fixedly installed on the first pressing block 56. Each first pressing strip 58 can press the thin film circuit board that reaches the silvering and encapsulation positions as the first pressing block 56 descends. The material belts on both sides of the conveying direction make the thin film circuit board flat against the silver dotting worktable 21 and the sealing worktable 51. The control system controls the lifting and lowering movement of the first pressing drive device 57. The silver dotting worktable 21 and the bonding worktable 31 are provided with a plurality of first air holes 38 evenly spaced. The first air holes 38 are connected to the first negative pressure providing device. The first air holes 38 can perform negative pressure adsorption on the thin film circuit board laid flat on the bonding worktable 31 to keep it flat. The control system controls the start and stop of the first pressing drive device 57 and the first negative pressure providing device.

[0068] When the thin film circuit board strip 101 is silvered, LED beads are attached, and encapsulated on the silvering worktable 21, the mounting worktable 31, and the encapsulation worktable 51, respectively, its flatness is ensured by negative pressure adsorption and pressing strip, so as to prevent the position deviation of silvering, LED bead attachment, and encapsulation due to unevenness.

[0069] The roll silver plating machine 2 also includes a silver plating detection platform 26 that is horizontally connected to the silver plating worktable 21. The silver plating detection platform 26 has a plurality of second air holes 27 evenly distributed on it. These second air holes 27 are connected to a second negative pressure providing device. The second air holes 27 can exert negative pressure to adsorb the thin-film circuit board laid flat on the silver plating detection platform 26, keeping it flat. A silver plating detection head 28 and a silver plating detection driving device 29 are also installed above the silver plating detection platform 26. The silver plating detection driving device 29 drives the silver plating detection head 28 to move along the thin film circuit board on the silver plating detection platform 26. The film circuit board strip 101 slides linearly in the width direction. The silver dot detection head 28 is equipped with a silver dot detection camera and a silver dot detection light source. The silver dot detection light source can illuminate the film circuit board in the detection area, and the silver dot detection camera can image the film circuit board in the detection area. The silver dot detection camera can transmit the image of the film circuit board it captures to the control system. The control system can analyze and judge whether the silver dot position and silver dot size meet the requirements based on the image captured by the silver dot detection camera, and control the second negative pressure providing device and the silver dot detection drive device 29 to start and stop.

[0070] After the silver dotting on the thin-film circuit board is completed, the silver dotting detection camera images the thin-film circuit board after silver dotting, and then uses it to detect whether all silver dotting positions on the thin-walled circuit board are accurate and whether there are any missing or incorrect dots. If a silver dotting fault is detected, the control system is notified and the control system will shut down the machine. It is best to set up a silver dotting fault alarm device to issue an alarm.

[0071] The roll sealing machine 5 also includes a sealing inspection platform 59 that is horizontally connected sequentially to the sealing workbench 51. The sealing inspection platform 59 is equipped with a second pressing block 591 capable of vertical movement, a second pressing drive device 592 that drives the second pressing block 591 to reciprocate vertical movement, a sealing inspection head, and a sealing inspection drive device 593. The second pressing blocks 591 are distributed on both sides of the sealing inspection platform 59 along the width direction of the film circuit board strip 101. The descent of each second pressing block 591 presses the strip on both sides of the film circuit board reaching the sealing inspection position along the conveying direction, causing the film circuit board to lie flat against the sealing inspection platform 59. The sealing inspection drive device 593 drives the sealing process. The detection head slides linearly along the width and length of the thin film circuit board strip 101 on the sealing detection platform 59. The sealing detection head is equipped with a sealing detection camera 595 and a sealing detection light source 594. The sealing detection light source 594 can illuminate the thin film circuit board in the detection area, and the sealing detection camera 595 can image the thin film circuit board in the detection area. The sealing detection camera 595 can transmit the image of the thin film circuit board it captures to the control system. The control system can analyze and determine whether the sealing position meets the requirements based on the image captured by the sealing detection camera 595, and control the second pressing drive device 592 and the sealing detection drive device 593 to start and stop working.

[0072] After the encapsulation is completed, the encapsulation detection camera 595 images the thin-film circuit board after silver application, and then uses it to detect whether all the encapsulation positions on the thin-walled circuit board are accurate and whether there are any missing or incorrect points. If an encapsulation fault is detected, the control system is notified, and the control system will shut down the machine. It is best to set up an encapsulation fault alarm device to issue an alarm.

[0073] A flat press 7 is also provided between the thin film circuit board feeding device 1 and the roll silver-pointing machine 2. The flat press 7 includes a flat press worktable 71, a flat press upper die 72, a flat press drive device 73, a heating device, and a flat press pulling mechanism 74. The thin film circuit board strip 101 drawn from the thin film circuit board roll 10 of the thin film circuit board feeding device 1 can move forward intermittently under the pull of the flat press pulling mechanism 74 and is laid on the flat press worktable 71 intermittently. The flat press drive device 73 drives the flat press upper die 72 to move up and down. When the flat press upper die 72 descends, it can press tightly against the upper side of the thin film circuit board strip 101. The heating device can heat the flat press upper die 72. The thin film circuit board strip 101 can remain flat under the combined pressing force of the heated flat press upper die 72 and the flat press worktable 71. The control system controls the start and stop of the flat press drive device 73, the heating device, and the flat press pulling mechanism 74, as well as the downward pressure of the flat press drive device 73. After the thin film circuit board strip 101 is drawn from the roll, it will curl up, which is not conducive to the precise application of silver, LED beads and encapsulation in the subsequent process. Therefore, the thin film circuit board strip 101 is flattened by the flat press 7 so that it can remain flat in the future and avoid the curling of the thin film circuit board strip 101 from affecting the normal operation of the equipment.

[0074] The thin-film circuit board feeding device 1 includes a feeding frame 11, a feeding shaft 12, a feeding conveyor belt 13, a belt tension adjustment device, and support rollers 14. The feeding shaft 12 is rotatably mounted on the lower layer of the feeding frame 11, and the thin-film circuit board roll 10 can be fitted onto the feeding shaft 12. The feeding conveyor belt 13 is mounted on the upper layer of the feeding frame 11, and several support rollers 14 are rotatably mounted on the discharge end of the feeding frame 11. The support rollers 14 are arranged at intervals from top to bottom along the belt conveying direction. The thin-film circuit board strip 101 drawn from the thin-film circuit board roll 10 can be laid flat on the surface of the feeding conveyor belt 13 and moved horizontally forward by the feeding conveyor belt 13, and then leave the thin-film circuit board feeding device via the support rollers 14. 1. The strip tension adjustment device includes a horizontal slide 15, strip clamping blocks 16, clamping drive device 17, and a guide roller. The guide roller is rotatably mounted on the loading frame 11. The film circuit board strip 101 drawn from the film circuit board roll 10 passes around the guide roller and is laid flat on the loading conveyor belt 13. The horizontal slide 15 is horizontally slidable on the loading frame 11. Several strip clamping blocks 16 are fixedly mounted on the horizontal slide 15 at intervals along the width direction of the film circuit board strip 101. The clamping drive device 17 drives the horizontal slide 15 to slide horizontally, thereby changing the clamping force of the strip clamping blocks 16 and the guide roller on the film circuit board strip 101. The control system controls the operation of the clamping drive device 17.

[0075] When feeding the thin film circuit board strip 101, the rolled thin film circuit board is mounted on the feeding shaft 12. After the thin film circuit board strip 101 is drawn from the roll, it is laid flat on the surface of the feeding conveyor belt 13. The feeding conveyor belt 13 drives it forward. During the feeding process, the strip clamping block 16 and the steering roller of the strip tension adjustment device provide clamping force to the strip to prevent the strip from moving forward quickly and causing the roll to rotate quickly and become scattered. When the machine stops, the strip can be clamped by the strip clamping block 16 and the steering roller of the strip tension adjustment device to prevent the strip from being pulled apart.

Claims

1. A production equipment for roll-to-roll bonding of thin-film switch LEDs, characterized in that: The device includes a thin film circuit board feeding device (1), a thin film circuit board receiving device (8), a receiving drive device, a roll silver-dotting machine (2), an LED chip mounter (3), a welding device (4), a roll sealing machine (5), a drying device (6), and a control system. The thin film circuit board feeding device is rotatably mounted with a roll of thin film circuit board material (10) to be mounted with LED switches. The thin film circuit board receiving device is rotatably mounted with a roll of thin film circuit board material. The receiving drive device drives the roll of thin film circuit board material to rotate intermittently to receive the thin film circuit board material strip (101). The roll silver-dotting machine, LED chip mounter, welding device, roll sealing machine, and drying device are arranged sequentially and intermittently between the thin film circuit board feeding device and the thin film circuit board receiving device along the conveying direction of the thin film circuit board material strip. The roll silver dotting machine includes a silver dotting worktable (21), a silver dotting pulling mechanism (22), a silver dotting head (23), and a silver dotting drive device (24). The silver dotting pulling mechanism can intermittently pull the thin film circuit board strip forward by a fixed length, so that each thin film circuit board on the thin film circuit board strip is flatly attached to the surface of the designated position on the silver dotting worktable. The silver dotting drive device drives the silver dotting head to move in the front-back, left-right, and up-down directions above the silver dotting worktable to dot the silver paste on the position of the LED to be attached on the thin film circuit board. The LED chip mounter includes a mounting table (31), a chip mounting pull mechanism (32), an LED chip mounting nozzle (33), an LED supply device, and a chip mounting drive device (34). The chip mounting pull mechanism can intermittently pull the thin film circuit board strip forward by a fixed length, so that each thin film circuit board on the thin film circuit board strip is flatly attached to the surface of the designated position on the mounting table. The LED supply device can supply LED lamp beads to the designated position. The chip mounting drive device drives the LED chip mounting nozzle to move in the front-back, left-right, and up-down directions above the mounting table, and then attaches the LED lamp beads at the designated position to the position of the thin film circuit board with silver paste by attaching the LED chip mounting nozzle. The welding equipment includes a welding material pulling mechanism and a welding box. The welding material pulling mechanism can intermittently pull the thin film circuit board strip forward by a fixed length so that the thin film circuit board that has been fitted with LEDs by the LED chip mounter enters the welding box. The welding box can weld the LED lamp beads to the silver paste on the thin film circuit board. The roll sealing machine includes a sealing worktable (51), a sealing pulling mechanism (52), a dispensing head (53), and a sealing drive device (54). The sealing pulling mechanism can intermittently pull the film circuit board strip forward by a fixed length, so that each film circuit board on the film circuit board strip is flat against the surface of the sealing worktable at a designated position. The sealing drive device drives the dispensing head to move in the front-back, left-right, and up-down directions above the sealing worktable, thereby applying sealant to the outside of the LED beads on the film circuit board for sealing. The drying equipment includes a drying pulling mechanism and a drying box. The drying pulling mechanism can intermittently pull the film circuit board strip forward by a fixed length so that the sealed film circuit board enters the drying box. The drying box can dry and cure the sealant on the film circuit board. The control system controls the receiving drive device, silver dotting and pulling mechanism, silver dotting head, silver dotting drive device, chip mounting and pulling mechanism, LED chip mounting nozzle, LED supply device, chip mounting drive device, welding and pulling mechanism, welding box, sealing and pulling mechanism, dispensing head, sealing drive device, drying and pulling mechanism, and drying box to operate according to the control program.

2. The production equipment for roll-to-roll film switch LED bonding according to claim 1, characterized in that: Thin-film circuit board (PCB) tension detection devices are installed between the PCB feeding device and the roll silver-doping machine, between the roll silver-doping machine and the LED chip mounter, between the LED chip mounter and the welding equipment, between the welding equipment and the roll sealing machine, between the sealing machine and the drying equipment, and between the drying equipment and the PCB take-up device. Each PCB tension detection device includes an upper contact switch and a lower contact switch. The PCB strip is positioned between the upper and lower contact switches. When the PCB strip droops to a specified height, the lower contact switch is triggered. When the PCB strip is stretched until the drooping arc increases to a set angle, the upper contact switch is triggered. The upper and lower contact switches communicate with the control system. The control system controls the start and stop of the silver-doping pulling mechanism, the chip mounting pulling mechanism, the welding pulling mechanism, the sealing pulling mechanism, and the drying pulling mechanism based on the information from the upper and lower contact switches.

3. The production equipment for roll-to-roll film switch LED bonding according to claim 1, characterized in that: A first camera (25) is fixedly installed on the side wall of the silver dispensing head. The first camera can image the thin film circuit board that reaches the designated position on the silver dispensing worktable. The first camera can send the image it captures to the control system to detect the silver dispensing position on the thin film circuit board. A second camera (35) is fixedly installed on the LED chip nozzle. The second camera can image the LED lamp bead product that reaches the designated position and the thin film circuit board that reaches the designated position on the chip mounting worktable. The second camera can send the image it captures to the control system to detect the position of the LED lamp bead product and the position of the LED lamp bead on the thin film circuit board. A third camera (55) is fixedly installed on the side wall of the dispensing head. The third camera can image the thin film circuit board that reaches the designated position on the encapsulation worktable. The third camera can send the image it captures to the control system to detect the encapsulation position on the thin film circuit board.

4. The production equipment for roll-to-roll film switch LED bonding according to claim 1, characterized in that: The LED supply device includes a LED chip strip chute (36), an LED chip strip supply device, and an LED chip strip traction device. Several LED chip strip chutes are arranged parallel to each other on one side of the mounting worktable. The cross-section of the LED chip strip chute is a T-shaped opening groove structure. Several LED chip strips led out from the LED chip strip supply device can move horizontally forward along the corresponding LED chip strip chutes. The two sides of the LED chip strip are stopped by the inner side wall of the opening direction of the T-shaped opening groove structure. The LEDs on the LED chip strip can be exposed on the upper surface of the LED chip strip chute through the opening of the T-shaped opening groove. The LED chip strip traction device can intermittently pull forward the LED chip strip waste after removing the LEDs.

5. The production equipment for roll-to-roll bonding of membrane switch LEDs according to claim 1 or 4, characterized in that: The chip mounting workbench is also equipped with a chip detection camera (37). The chip mounting drive device can drive the LED chip nozzle with LED chips adsorbed to reach directly above the chip detection camera. The chip detection camera can image the LED chips adsorbed on the LED chip nozzle. The chip detection camera can transmit the image of the LED chips it captures to the control system. The control system can determine whether the LED chips are qualified based on the image of the LED chips captured by the chip detection camera.

6. The production equipment for roll-to-roll film switch LED bonding according to claim 1, characterized in that: Each of the sealing worktables is provided with a first pressing block (56) capable of lifting and lowering, and a first pressing drive device (57) for driving the first pressing block to reciprocate lifting and lowering. The first pressing blocks are distributed on both sides of the silvering worktable and the sealing worktable along the width direction of the thin film circuit board strip. At least two first pressing strips (58) extending along the width direction of the thin film circuit board strip are fixedly installed on the first pressing blocks. Each first pressing strip can press the strip of the thin film circuit board that reaches the silvering and sealing position along the front and rear sides of the conveying direction, so that the thin film circuit board is flat against the silvering worktable and the sealing worktable. The control system controls the lifting and lowering movement of the first pressing drive device. The silvering worktable and the bonding worktable are provided with a number of first air holes (38) evenly spaced. The first air holes are connected to the first negative pressure providing device. The first air holes can perform negative pressure adsorption on the thin film circuit board laid flat on the bonding worktable to keep it flat. The control system controls the start and stop of the first pressing drive device and the first negative pressure providing device.

7. The production equipment for roll-to-roll film switch LED bonding according to claim 1, characterized in that: The roll silver dotting machine also includes a silver dotting detection platform (26) that is horizontally connected to the silver dotting workbench. A number of second air holes (27) are evenly distributed on the silver dotting detection platform. The second air holes are connected to the second negative pressure providing device. The second air holes can perform negative pressure adsorption on the thin film circuit board laid flat on the silver dotting detection platform to keep it flat. A silver dotting detection head (28) and a silver dotting detection driving device (29) are also installed above the silver dotting detection platform. The silver dotting detection driving device drives the silver dotting detection head to slide linearly along the width direction of the thin film circuit board strip on the silver dotting detection platform. A silver dotting detection camera and a silver dotting detection light source are installed on the silver dotting detection head. The silver dotting detection light source can illuminate the thin film circuit board in the detection area. The silver dotting detection camera can image the thin film circuit board in the detection area. The silver dotting detection camera can transmit the thin film circuit board image it captures to the control system. The control system can analyze and judge whether the silver dotting position and silver dot size meet the requirements based on the image captured by the silver dotting detection camera, and control the second negative pressure providing device and the silver dotting detection driving device to start and stop.

8. The production equipment for roll-to-roll film switch LED bonding according to claim 1, characterized in that: The roll sealing machine also includes a sealing inspection platform (59) that is horizontally connected to the sealing workbench. The sealing inspection platform is equipped with a second pressing block (591) capable of vertical movement, a second pressing drive device (592) that drives the second pressing block to reciprocate vertical movement, a sealing inspection head, and a sealing inspection drive device (593). The second pressing blocks are distributed on both sides of the sealing inspection platform along the width direction of the film circuit board strip. The descent of each second pressing block can press the strip on both sides of the film circuit board reaching the sealing inspection position along the conveying direction, making the film circuit board flat against the sealing inspection platform. The sealing inspection drive device drives... The sealing inspection head slides linearly along the width and length of the thin film circuit board strip on the sealing inspection platform. The sealing inspection head is equipped with a sealing inspection camera (595) and a sealing inspection light source (594). The sealing inspection light source can illuminate the thin film circuit board in the inspection area, and the sealing inspection camera can image the thin film circuit board in the inspection area. The sealing inspection camera can transmit the image of the thin film circuit board it captures to the control system. The control system can analyze and determine whether the sealing position meets the requirements based on the image captured by the sealing inspection camera, and control the second pressing drive device and the sealing inspection drive device to start and stop working.

9. The production equipment for roll-to-roll film switch LED bonding according to claim 1, characterized in that: A flat press (7) is also provided between the thin film circuit board feeding device and the roll silvering machine. The flat press includes a flat press worktable (71), a flat press upper die (72), a flat press drive device (73), a heating device, and a flat press pulling mechanism (74). The thin film circuit board strip drawn from the thin film circuit board roll of the thin film circuit board feeding device can move forward intermittently under the pull of the flat press pulling mechanism and be laid on the flat press worktable intermittently. The flat press drive device drives the flat press upper die to move up and down. The flat press upper die can be pressed tightly against the upper side of the thin film circuit board strip when it descends. The heating device can heat the flat press upper die. The thin film circuit board strip can be kept flat under the combined pressing force of the heated flat press upper die and the flat press worktable. The control system controls the start and stop of the flat press drive device, the heating device, and the flat press pulling mechanism, as well as the downward pressure of the flat press drive device.

10. The production equipment for roll-to-roll film switch LED bonding according to claim 1, characterized in that: The film circuit board feeding device includes a feeding frame (11), a feeding shaft (12), a feeding conveyor belt (13), a belt tension adjustment device, and support rollers (14). The feeding shaft is rotatably mounted on the lower layer of the feeding frame, and the film circuit board roll can be fitted onto the feeding shaft. The feeding conveyor belt is mounted on the upper layer of the feeding frame. Several support rollers are rotatably mounted on the discharge end of the feeding frame and are arranged at intervals from top to bottom along the belt conveying direction. The film circuit board strip drawn from the film circuit board roll can be laid flat on the surface of the feeding conveyor belt and moved horizontally forward by the feeding conveyor belt, and then leave the film circuit board feeding device via the support rollers. The strip tension adjustment device includes a horizontal slide (15), strip clamping blocks (16), clamping drive device (17), and a guide roller (18). The guide roller is rotatably mounted on the feeding frame. The film circuit board strip drawn from the film circuit board roll passes around the guide roller and is laid flat on the feeding conveyor belt. The horizontal slide is horizontally mounted on the feeding frame. Several strip clamping blocks are fixedly mounted on the horizontal slide at intervals along the width direction of the film circuit board strip. The clamping drive device drives the horizontal slide to slide horizontally, thereby changing the clamping force of the strip clamping blocks and the guide roller on the film circuit board strip. The control system controls the operation of the clamping drive device.

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