Modular hierarchical cushioning ankle support children's shoe structure

Abstract

This invention discloses a modular, graded, cushioned ankle support structure for children's shoes, comprising: a heel shaping cup for calcaneal guidance, the heel shaping cup having a guide extending downward along the heel counter of the shoe, and a connecting member bending inward relative to the guide and extending into the shoe; the heel shaping cup circumferentially surrounds the heel counter; the guide includes an outer layer, a middle layer, and an inner layer arranged sequentially from the outside to the inside; and a support mechanism disposed on the inner surface of the shoe facing the heel and connected to the connecting member. When the support mechanism is compressed, the pressure is converted into an inward tightening force on the guide through the connecting member, thereby guiding the calcaneus. This invention, through the coordinated operation of the guide, connecting member, and support mechanism, converts pressure into an inward tightening force on the guide when the support mechanism is compressed. When force is applied to one side, a larger directional tightening force is generated, triggering guidance in advance, effectively limiting abnormal calcaneal displacement, improving heel stability, and significantly enhancing the support and guidance effect on the calcaneus.

Description

Technical Field

[0001] This invention belongs to the field of children's shoes, specifically relating to a modular, graded cushioning ankle support structure for children's shoes. Background Technology

[0002] In the children's footwear industry, to reduce the risk of ankle sprains and twists during children's sports activities, the industry commonly uses heel reinforcement technology to improve foot and ankle stability. For example, a rigid or semi-rigid heel counter is installed at the heel of the shoe to passively wrap the heel and ankle, limiting excessive inward or outward pronation of the ankle joint. Brands such as Dr. Kong and Genop have adopted a reinforced heel cup design in their children's sports shoes to improve foot and ankle stability and reduce the risk of ankle sprains. In addition, existing patented technologies also disclose various heel support structures, such as embedding a heel counter inside the heel of the shoe to stabilize the heel, or embedding a rigid protective plate in the heel to wrap the ankle area and achieve a supporting and corrective effect.

[0003] However, most existing heel support structures are independently designed reinforcements (such as heel counters and protective plates), which can only provide passive support functions such as wrapping the ankle and limiting excessive pronation. They are difficult to actively guide the calcaneus according to the dynamic force applied by the wearer during walking and cannot be linked with the pressure state of the sole.

[0004] Moreover, existing heel supports typically employ a rigid, monolithic structure, which, while providing stability, suffers from insufficient adaptability and struggles to actively tighten inward under pressure to dynamically guide the calcaneus. Summary of the Invention

[0005] This invention provides a modular, graded, cushioned ankle support structure for children's shoes. By setting a guide that surrounds the heel counter circumferentially, a connector that bends and connects to the guide, and a support mechanism located on the inner surface of the heel and connected to the connector, the support mechanism converts the pressure into a tightening force on the guide through the connector when it is compressed, thereby achieving dynamic guidance of the calcaneus. This solves the technical problem of the difficulty in actively guiding the calcaneus based on dynamic forces during wear.

[0006] The technical solution adopted in this invention is as follows: A modular, tiered cushioning ankle support structure for children's shoes, integrated into children's footwear, includes: A heel support cup for calcaneal guidance, the heel support cup having a guide extending downward along the heel counter of the child's shoe, and a connector extending inward relative to the guide, the heel support cup circumferentially surrounding the heel counter; The guide includes an outer layer, a middle layer and an inner layer arranged sequentially from the outside to the inside, wherein the outer layer is used for cushioning, the middle layer is used to provide anti-torsional support and the inner layer is used to provide a sense of envelopment; The support mechanism is located on the inner surface of the shoe facing the heel and is connected to the connector. When the support mechanism is compressed, the force is converted into an inward tightening force on the guide through the connector, thereby guiding the calcaneus.

[0007] The modular, graded cushioning ankle support structure used in this invention also has the following additional technical features: The outer layer has a Shore hardness of 55±5A; The Shore hardness of the intermediate layer is 85±5A; The inner layer has a Shore hardness of 35±5A.

[0008] The base layer of the connector has at least one recessed clearance opening, forming multiple connecting segments, so that when the support mechanism is compressed, the connecting segments can drive the guide to tighten inward.

[0009] The guide also has a gasket on its inner side, and the gasket is detachably connected to the base layer.

[0010] The pads are silicone sheets of varying hardness to enhance guidance of the pressure applied to the calcaneus; and / or, The pads are silicone sheets of varying thicknesses to adjust the space inside the shoe.

[0011] The guide member surrounds the heel counter in a circumferential direction and has a first guide portion located on the left side of the shoe, a second guide portion located on the right side of the shoe, and a third guide portion located on the rear side of the shoe. The third guide portion connects the first guide portion and the second guide portion. At least the first guide portion and the second guide portion are provided with a micro airbag array to regulate the guiding force applied to the calcaneus by inflating and deflating the micro airbag array.

[0012] The micro airbag array is connected to a micro air pump via an air tube, and the micro air pump is equipped with a button for controlling inflation and deflation. The outer side of the heel shaping cup is provided with reinforcing ribs.

[0013] The system also includes a multi-dimensional force line detection module, used to collect plantar pressure distribution data and / or calcaneal offset data relative to the heel cup, in order to determine the calcaneal force line deviation index and apply guiding force to the calcaneal through the heel cup.

[0014] The multi-dimensional force line detection module has the following features: A flexible pressure sensor array integrated into the heel is used to collect pressure distribution data in the heel area; and / or, A thin-film strain sensor, installed on the inner wall of the heel cup, is used to detect the offset angle and amount of the calcaneus.

[0015] The second aspect of this invention employs a children's shoe, comprising an upper and a sole. The upper has a heel counter, and the sole has a heel. The children's shoes also include the system integrated into the heel counter and heel.

[0016] Due to the adoption of the above technical solution, the beneficial effects achieved by this invention are as follows: 1. In this invention, by setting a connector between the guide and the support mechanism, when the support mechanism is under pressure (i.e., during the heel strike phase when a child is standing or walking), this pressure is converted into an inward tightening force on the guide through the connector. This allows the heel shaping cup to tighten according to the wearer's real-time force state, achieving dynamic guidance of the calcaneus. This couples the heel support function of the shoe with the wearer's gait in real time. When the support mechanism is under pressure, the pressure is transmitted along the connector to the guide, causing the guide to generate an inward tightening force, thereby guiding the calcaneus.

[0017] Furthermore, when force is applied to one side of the support mechanism, the force line of the child's calcaneus tilts, resulting in a greater force transmitted to the guide on the force-affected side, and a greater tightening force on the guide on the force-affected side. In contrast, in existing technologies, the shoe upper only provides support to the child's calcaneus under compression after the calcaneus has displaced and touched the shoe upper. This application triggers the guiding force of the guide earlier when the support mechanism is compressed, effectively limiting abnormal displacement of the calcaneus within the shoe cavity and improving heel stability during walking and exercise.

[0018] In addition, the guide surrounds the rear side in a circumferential direction, forming a circumferential wrap around the calcaneus from the rear and sides, which further tightens the circumferential structure inward, providing a more comprehensive and closer fit to the calcaneus.

[0019] Furthermore, by combining the gradient structure of the outer, middle, and inner layers of the guide, which are arranged sequentially from the outside to the inside, a unified performance of cushioning, support, and wrapping is achieved: the outer layer (cushioning layer) first absorbs the impact energy of the heel landing, providing excellent vertical cushioning performance; the middle layer (torsional support layer) absorbs the impact while using its high hardness to efficiently transfer the impact force to the connector, ensuring the generation and transmission efficiency of the inward tightening force, providing a rigid foundation for dynamic guidance; the inner layer (wrapping layer) closely conforms to the contour of the heel under the centripetal tightening action of the guide, providing a soft and comfortable wrapping feeling.

[0020] This invention achieves the transmission of pressure from the support mechanism to the inward tightening of the guide by the coordinated cooperation of the guide, connector and support mechanism. This allows the heel shaping cup to dynamically guide the calcaneus according to the pressure state of the heel during the wearer's walking, thus improving the support and guidance effect of children's shoes on the calcaneus. Attached Figure Description

[0021] The accompanying drawings, which are included to provide a further understanding of the invention and form part of this invention, illustrate exemplary embodiments of the invention and are used to explain the invention, but do not constitute an undue limitation of the invention. In the drawings: Figure 1 This is a schematic diagram of the modular graded cushioning ankle support children's shoe structure according to one embodiment of the present invention; Figure 2 This is a schematic diagram of the structure of the heel shaping cup according to one embodiment of the present invention.

[0022] in: 1. Heel shaping cup; 11. Guide component; 111. First guide section; 112. Second guide section; 113. Third guide section; 114. Outer layer; 115. Middle layer; 116. Inner layer; 12. Connector; 121. Clearance opening; 122. Connecting section; 13. Base layer; 2. Supporting structures; 31. Button; 32. Reinforcing rib. Detailed Implementation

[0023] To more clearly illustrate the overall concept of the present invention, a detailed description will be provided below with reference to the accompanying drawings and examples.

[0024] Many specific details are set forth in the following description in order to provide a full understanding of the invention. However, the invention may also be practiced in other ways different from those described herein, and therefore the scope of protection of the invention is not limited to the specific embodiments disclosed below.

[0025] It should be noted that in the description of this invention, the terms "inner side", "towards the inner side", "inside the shoe", etc., indicate the orientation or positional relationship based on the orientation of the children's shoes in the normal wearing state, that is, the side facing the wearer's foot is the inner side, and the side away from the wearer's foot is the outer side.

[0026] like Figure 1 and Figure 2 As shown, a modular, tiered cushioning ankle support structure for children's shoes, integrated into children's shoes, includes: A heel shaping cup 1 for guiding the calcaneus, the heel shaping cup 1 having a guide 11 extending downward along the back of the child's shoe, and a connector 12 extending into the shoe relative to the guide 11, the heel shaping cup 1 circumferentially surrounding the back of the shoe. The guide includes an outer layer, a middle layer and an inner layer arranged sequentially from the outside to the inside, wherein the outer layer is used for cushioning, the middle layer is used to provide anti-torsional support and the inner layer is used to provide a sense of envelopment; Support mechanism 2 is disposed on the inner surface of the shoe facing the heel and connected to connector 12. When the support mechanism 2 is compressed, the force is converted into an inward tightening force by the connector 12 to guide the guide 11.

[0027] This application provides a modular, graded cushioning ankle support structure for children's shoes, integrated into the shoe. The children's shoe includes an upper and a sole. The upper has a heel counter located in the heel area, and the sole has a heel area corresponding to the heel counter. The system mainly comprises two parts: a heel support cup 1 and a support mechanism 2.

[0028] The heel support cup 1 is the core structural component used to guide the calcaneus, and it has two functional parts: a guide 11 and a connector 12. The guide 11 extends downward along the heel counter of the children's shoe and wraps around the counter in a circumferential direction, thereby forming a wrap-around structure for the calcaneus in the heel area of ​​the shoe. The connector 12 bends relative to the guide 11 and extends into the shoe, connecting the guide 11 to the support mechanism 2. The guide 11 and the connector 12 can be a single molded structure, or they can be fixedly connected by means of adhesive or other methods.

[0029] The support mechanism 2 is located on the inner surface of the shoe facing inwards from the heel, that is, on the insole of the shoe at the position corresponding to the heel. The support mechanism 2 is connected to the connector 12 of the heel shaping cup 1, and the connection between the two can be achieved by means of hot pressing, adhesive bonding, ultrasonic welding or sewing to achieve a firm bond.

[0030] When a child stands wearing the shoes of this system, their weight is transferred to the support mechanism 2 via the calcaneus. Under vertical pressure, the support mechanism 2 undergoes compressive deformation, which is converted into a bending moment on the lower edge of the guide 11 through the mechanical coupling of the connector 12. Because the connector 12 is bent relative to the guide 11, the vertical pressure on the support mechanism 2 generates a torque in the connector 12. This torque forces the guide 11 to rotate or displace inward, thereby applying an inward tightening force to the calcaneus.

[0031] As the gait cycle progresses during a child's walking, the force on the heel changes periodically. During heel strike, the calcaneus experiences a significant vertical impact force. At this time, the support mechanism 2 is compressed to its maximum, the torque transmitted by the connector 12 is at its maximum, and the inward tightening force of the guide 11 also reaches its peak, providing the strongest stable wrapping for the calcaneus. This allows the tightening force of the guide 11 to automatically change with the gait cycle, achieving dynamic adaptive guidance for the calcaneus.

[0032] Furthermore, when the calcaneal force line of a child's foot tilts, the compression of the force-bearing side (such as the left side) of the support mechanism 2 is greater than that of the other side. The corresponding connecting segment 122 will transmit a greater pulling force to the guide part on the same side, causing the guide part on that side to produce a greater tightening displacement, thereby forming a targeted corrective force on the calcaneus.

[0033] Furthermore, when the support mechanism 2 is compressed, the tightening of the guide 11 occurs instantly. At the moment the pressure is generated, the tightening force is transmitted to the guide 11 through the connector 12, causing the heel shaping cup 1 to begin tightening before the heel fully touches the ground. In existing technologies, the calcaneus of a child's foot needs to touch the shoe upper before the upper generates support for the calcaneus under passive compression, resulting in a certain response lag. In contrast, this system effectively limits abnormal displacement of the calcaneus within the shoe cavity, improving the dynamic stability of the heel during walking.

[0034] Specifically, the guide 11 is the part of the heel shaping cup 1 that directly contacts the posterior side and inner and outer sides of the calcaneus. Its basic function is to form a circumferential wrap around the calcaneus. The guide 11 extends downward along the contour of the posterior side, and the whole has an arc-shaped structure adapted to the shape of the child's calcaneus.

[0035] Furthermore, by combining the gradient structure of the outer layer 114, the middle layer 115, and the inner layer 116 arranged sequentially from the outside to the inside of the guide, a unified performance of cushioning, support, and wrapping is achieved: the outer layer 114 (cushioning layer) first absorbs the impact energy of the heel landing, providing excellent vertical cushioning performance; the middle layer 115 (torsional support layer) absorbs the impact while using its high hardness to efficiently transfer the impact force to the connector, ensuring the generation and transmission efficiency of the inward tightening force, providing a rigid foundation for dynamic guidance; the inner layer 116 (wrapping layer) closely conforms to the contour of the heel under the centripetal tightening action of the guide, providing a soft and comfortable wrapping feeling.

[0036] In one embodiment, the guide 11 has a U-shaped or C-shaped wrapping structure that wraps around the calcaneus from the rear and both sides. The U-shaped structure opens forward, matching the posterior and lateral curvature of the calcaneus. The height of the guide 11 can be adjusted according to the child's age and shoe type: for infant shoes, the height of the guide 11 can be set to cover one-half to two-thirds of the calcaneus height; for preschool children's athletic shoes, the height of the guide 11 can be appropriately increased to provide more adequate lateral support.

[0037] The wall thickness of the guide 11 can be designed according to structural strength and lightweight requirements. In one embodiment, the main wall thickness of the guide 11 is 1.5 mm to 3 mm, and it can be locally thickened or reinforced in areas of concentrated stress (such as both sides of the calcaneus). The reinforcing ribs can be ribs extending longitudinally along the guide 11, or they can be a reinforcing structure distributed in a grid pattern.

[0038] In addition, the outer surface of the guide 11 may be provided with anti-slip texture or uneven structure to enhance the bonding stability with the shoe upper material and prevent relative displacement of the guide 11 during use. The anti-slip texture may be dotted, grid-like, or wavy raised.

[0039] The connector 12 is a force-transmitting component in the heel shaping cup 1 that connects the guide 11 and the support mechanism 2. The connector 12 bends relative to the guide 11 and extends into the shoe, with its extension direction being approximately perpendicular to or at a certain angle to the extension direction of the guide 11, so that the connector 12 can transition from the heel counter area to the insole area of ​​the heel.

[0040] In one embodiment, the connector 12 and the guide 11 are integrally injection molded, forming a smooth transition surface between them. The bending angle of the connector 12 can be determined based on the angle between the heel counter and the insole of the heel, generally between 90° and 120°.

[0041] The shape of the connector 12 can be designed according to the requirements of mechanical transmission efficiency. The connector 12 is a continuous sheet structure, that is, it extends continuously along the entire width of the lower edge of the guide 11 to form a whole connecting area. The continuous sheet structure of the connector 12 can uniformly transmit the pressure on the support mechanism 2 to the entire lower edge of the guide 11, so that the guide 11 is uniformly tightened inward as a whole.

[0042] Alternatively, the connector 12 can be a segmented structure. The segmented connector 12 allows the guide 11 to produce a more selective tightening effect when the support mechanism 2 is under pressure, through each connecting segment 122.

[0043] The thickness of the connector 12 is less than that of the guide 11 to ensure that the connector 12 can deform appropriately to transmit pressure when the support mechanism 2 is compressed, while the guide 11 maintains sufficient structural rigidity to provide effective tightening force. Specifically, the thickness of the connector 12 is 1mm to 2mm, which ensures sufficient mechanical transmission strength while avoiding unnecessary impact on the thickness of the sole.

[0044] The support mechanism 2 is located on the inner surface of the shoe facing the heel and is connected to the connector 12 of the heel shaping cup 1. The main function of the support mechanism 2 is to bear the pressure applied by the heel and transmit the pressure to the guide 11 through the connector 12, while also providing cushioning and support for the heel area.

[0045] The support mechanism 2 is located in the heel area and is fixed to the upper or lower surface of the connector 12. When the heel of the insole is compressed, the pressure is transmitted to the guide 11 through the connector 12, causing the guide 11 to generate an inward tightening force.

[0046] In one embodiment, the support mechanism 2 is an independent support pad, specifically disposed between the inner surface of the heel and the connector 12. The support pad can be made of highly elastic materials such as EVA (ethylene-vinyl acetate copolymer) foam, PU (polyurethane) foam, or silicone, which have excellent energy absorption and resilience properties.

[0047] The heel support cup 1 is pre-placed in the heel counter layer of the upper, allowing the guide 11 to conform to the inner side of the heel counter. The guide 11 is then fixed between the inner surface of the heel counter and the upper fabric via stitching or heat pressing. The connector 12 extends from the bottom of the heel counter and bends into the sole area. During sole assembly, the support mechanism 2 is placed on the inner surface of the heel and bonded to the connector 12. Finally, the insole is placed over the support mechanism 2, forming the complete shoe cavity bottom surface.

[0048] Alternatively, the heel support cup 1 and the insole can be pre-assembled into a functional module and then inserted into the shoe cavity as a whole. The connector 12 is pre-bonded and fixed to the support mechanism 2, and then the guide 11 is inserted into the rear of the shoe cavity along the inner side of the heel counter, so that the entire module fits tightly into the shoe cavity. This pre-assembly method is beneficial for quality control, improving production efficiency and product consistency. In a preferred embodiment of the present invention, the outer layer 114 has a Shore hardness of 55±5A; the middle layer 115 has a Shore hardness of 85±5A; and the inner layer 116 has a Shore hardness of 35±5A.

[0049] By precisely defining the Shore hardness parameters of each layer of the guide, a gradient functional system of "soft outer cushioning, rigid middle support, and soft inner skin-friendly" is constructed. Specifically, the middle layer 115 uses a high-hardness material with a Shore hardness of 85±5A, forming the rigid skeleton of the guide. This ensures structural stability when the foot is under force, effectively resists torsional torque, and provides a solid mechanical support for the connector 12, thereby ensuring the precise transmission of inward tightening force and the effectiveness of calcaneal guidance. Meanwhile, the outer layer 114 uses a medium-low hardness material with a Shore hardness of 55±5A, which can play an excellent shock absorption and cushioning role when the heel lands, reducing the impact of ground reaction force on the bones. Combined with the inner layer 116 with a Shore hardness of 35±5A, its excellent softness can closely conform to the delicate skin of children's heels, providing a skin-like, skin-friendly feel, effectively avoiding the risk of chafing or pressure pain that may be caused by high-hardness materials directly contacting the skin. This specific hardness gradient design maximizes wearing comfort and safety while ensuring that the heel support cup 1 has sufficient torsional strength and dynamic guidance capabilities. It solves the technical problems of traditional ankle support shoes, such as "insufficient support leading to discomfort" or "insufficient material leading to support failure".

[0050] As one embodiment of this implementation, such as Figure 2As shown, the base layer 13 of the connector 12 has at least one recessed relief opening 121, forming a plurality of connecting segments 122, so that when the support mechanism 2 is compressed, the guide 11 is pulled inward through the connecting segments 122.

[0051] This embodiment further enhances the selectivity of pressure transmission and the differentiated control capability of the tightening of the guide 11 by designing the structural form of the connector 12.

[0052] The clearance 121 refers to a void area formed on the base layer 13 of the connector 12, which does not contain the material of the connector 12, thus causing the connector 12 to be interrupted at that location. The clearance 121 can be a notch formed by recessing from the edge of the connector 12 inward.

[0053] By providing clearance openings 121, the originally continuous and complete connector 12 is divided into multiple independent connector segments 122. One end of each connector segment 122 is connected to the lower edge of the guide 11, and the other end is connected to the support mechanism 2. The connector segments 122 are physically separated through clearance openings 121, and there is no direct mechanical connection between them. Therefore, they can deform and displace independently under stress without interfering with each other.

[0054] The shape, number, size, and distribution of the clearance opening 121 can be adjusted according to specific design requirements. In one embodiment, the clearance opening 121 is U-shaped or V-shaped recessed, extending from the free edge of the connector 12 toward the guide 11, dividing the connector 12 circumferentially into multiple main connecting segments 122.

[0055] Since the force on the calcaneus during walking is mainly concentrated on the left and right sides of the heel, while the force on the posterior side is relatively small, the clearance 121 can be preferentially set at the position of the connector 12 corresponding to the posterior side of the calcaneus, while retaining the connecting sections 122 on the left and right sides. This arrangement allows the connecting sections 122 on the left and right sides to independently transmit pressure when the support mechanism 2 is compressed, thereby causing the left and right sides of the guide 11 to produce an inward tightening displacement.

[0056] As one embodiment of this implementation, such as Figure 1 and Figure 2 As shown, the inner side of the guide 11 also has a gasket, and the gasket is detachably connected to the base layer 13.

[0057] This embodiment further enhances the heel shaping cup 1's ability to wrap and adapt to the calcaneus and the flexibility of force line guidance adjustment by adding a detachable pad structure to the inside of the guide 11. The pad is located between the base layer 13 of the guide 11 and the wearer's calcaneus, contacting the calcaneus directly or indirectly through the shoe upper lining. The pad and the base layer 13 of the guide 11 are detachably connected, meaning the pad can be installed in a predetermined position inside the guide 11, or removed from the guide 11 without damaging any components, and can be reinstalled or replaced with another pad after removal.

[0058] The shape of the pad matches the inner curved surface of the guide 11. The pad has a curved shape adapted to the corresponding arcuate contours of the posterior and lateral sides of the calcaneus, allowing it to conform to the inner side of the guide 11 and cover the main area where the guide 11 contacts the calcaneus. In one embodiment, the pad covers the entire inner surface of the guide 11, extending from the posterior side to the left and right sides, forming a complete padding layer. In another embodiment, the pad covers only a partial area of ​​the guide 11, such as only the stress-concentrated areas on both sides of the calcaneus, or only the area directly behind the posterior heel, to accommodate different functional requirements.

[0059] Specifically, the pads are silicone sheets of varying hardness to enhance guidance of the pressure applied to the calcaneus; and / or, The pads are silicone sheets of varying thicknesses to adjust the space inside the shoe.

[0060] In one embodiment, the pad is made of medical-grade silicone material, which has good biocompatibility, moderate softness and excellent resilience, and is not likely to cause skin allergies, making it suitable for direct contact with children's foot skin.

[0061] The pads are available in three firmness options: low, medium, and high. Low-firm pads offer a soft touch and good cushioning, suitable for everyday light activities; high-firm pads provide stronger support and more precise force line guidance, suitable for scenarios requiring orthodontic intervention; medium-firm pads balance comfort and support, suitable for most regular use scenarios.

[0062] It should be noted that the gasket can be made of a variety of materials, including but not limited to silicone, thermoplastic polyurethane elastomer, slow rebound memory foam, EVA foam, etc.

[0063] In another embodiment, the gasket is available in various thicknesses, such as thin, standard, and thick, and gaskets of different thicknesses can be used interchangeably. By changing the gasket of different thicknesses, the gap between the inner side of the guide 11 and the calcaneus can be altered, thereby adjusting the tightness of the heel shaping cup 1's encirclement of the calcaneus. A thicker gasket is used when a tighter fit is required; a thinner gasket is used when a looser fit is required; and a standard thickness gasket can be used as a buffer layer after the guide 11 has been heated and shaped to fit closely to the calcaneus.

[0064] The detachable connection is achieved via Velcro. The inner surface of the base layer 13 of the guide 11 is fixed with the hook or loop side of the Velcro, and the back of the gasket is fixed with a corresponding loop or hook side. During installation, the gasket is pressed onto the guide 11, causing the hook and loop sides of the Velcro to engage, thus securing the connection. The advantages of Velcro connections are that installation and removal are very convenient, requiring no tools, and they can be reused multiple times. Furthermore, the Velcro allows for fine-tuning of the gasket's positioning on the surface of the guide 11, facilitating the finding of the most suitable fit. As a preferred embodiment of the present invention, such as Figure 1 and Figure 2 As shown, the guide 11 surrounds the heel counter in a circumferential direction and has a first guide portion 111 located on the left side of the shoe, a second guide portion 112 located on the right side of the shoe, and a third guide portion 113 located on the rear side of the shoe. The third guide portion 113 connects the first guide portion 111 and the second guide portion 112. At least the first guide portion 111 and the second guide portion 112 are provided with a micro airbag array to regulate the guiding force applied to the calcaneus by inflating and deflating the micro airbag array.

[0065] This embodiment introduces a micro airbag array on both sides of the guide 11, which enables active, dynamic, and independent adjustment of the calcaneal guiding force, significantly improving the accuracy of force line correction and personalized adaptation capability.

[0066] The guide 11 surrounds the heel counter in a circumferential direction and has three functional parts: a first guide 111 located on the left side of the shoe, a second guide 112 located on the right side of the shoe, and a third guide 113 located on the rear side of the shoe. The third guide 113 connects to the first guide 111 and the second guide 112 respectively, and the three together form a complete U-shaped or C-shaped embracing structure, which wraps around the calcaneus from the rear and both sides.

[0067] The first guide portion 111 corresponds to the left side of the calcaneus, the second guide portion 112 corresponds to the right side of the calcaneus, and the third guide portion 113 corresponds to the posterior region of the calcaneus. This three-section structural design allows the guide 11 to apply differentiated forces to different parts of the calcaneus.

[0068] At least the first guide section 111 and the second guide section 112 are provided with a micro airbag array. A micro airbag array refers to an array structure composed of multiple tiny airbag units arranged in a certain pattern. Each airbag unit is an independent closed air chamber with its own air inlet and air outlet (or shares an air inlet and air outlet channel but is equipped with an independent control valve), and its internal air pressure and expansion volume can be changed independently through inflation and deflation operations.

[0069] A micro-airbag array is embedded on the inner surface of the first guide part 111 and the second guide part 112, that is, the airbag array is located between the base layer 13 of the guide 11 and the wearer's calcaneus. When the airbags are inflated, they bulge inward, compressing the space between the guide 11 and the calcaneus, thus increasing the effective tightening force of the guide 11 on the calcaneus; when the airbags are deflated, their volume decreases, the compression effect on the calcaneus weakens, and the tightening force decreases accordingly.

[0070] The inflation / deflation system of the micro-airbag array includes an air source, air supply lines, and control valves. In one embodiment, the air source is an external, manually operated airbag located on the side of the shoe tongue or upper. The user can inflate the micro-airbag array by repeatedly pressing the manual airbag. The manual airbag is connected to an air inlet valve and an air supply line, which extends along the inside of the upper to the heel area and connects to each airbag unit.

[0071] The micro airbag array is connected to a micro air pump via an air tube, and the micro air pump is equipped with a button 31 for controlling inflation and deflation. The outer side of the heel shaping cup 1 is provided with reinforcing ribs 32.

[0072] By incorporating a micro-airbag array, a micro-air pump, and a control button 31, this invention achieves intelligent and personalized adjustment of heel support. Users can control the micro-air pump via button 31 to inflate and deflate the micro-airbag array through an air tube. This causes the airbag array to expand or contract controllably on the inside of the shoe upper, dynamically adjusting the tightness of the shoe's internal space to suit different foot shapes or wearing scenarios. The reinforcing rib 32 on the outer side of the heel shaping cup 1 not only enhances the lateral support stiffness of the shoe upper structure but also serves as a mechanical fulcrum during airbag inflation, effectively restraining excessive outward deformation of the guide components during airbag inflation and ensuring that the airbag inflation force is efficiently converted into inward support force. This design combines dynamic pneumatic adjustment technology with a rigid support structure, enabling customized heel support and significantly improving the fit, comfort, and walking stability of children's shoes.

[0073] As a preferred embodiment of the present invention, the system described herein, It also includes a multi-dimensional force line detection module, which is used to collect plantar pressure distribution data and / or calcaneal offset data relative to the heel shaping cup 1 to determine the calcaneal force line deviation index and apply guiding force to the calcaneal through the heel shaping cup 1.

[0074] This implementation introduces a multi-dimensional force line detection module, which enables quantitative monitoring of the calcaneal force line status and data-based closed-loop control, significantly improving the accuracy, adaptability, and intelligence of force line guidance.

[0075] The multi-dimensional force line detection module is a sensing component responsible for collecting biomechanical interaction data between the child's foot and shoe during walking. This module mainly includes a plantar pressure acquisition unit and / or a calcaneal offset detection unit.

[0076] The plantar pressure acquisition unit is used to collect plantar pressure distribution data. In one embodiment, the plantar pressure acquisition unit is a flexible pressure sensor array integrated into the heel of the shoe. This sensor array covers the heel area of ​​the sole, including the heel region, and consists of multiple tiny pressure sensing units arranged in a matrix. Each sensing unit can independently detect the magnitude of the pressure it receives and convert the pressure signal into an electrical signal output.

[0077] The sensor array employs a piezoresistive flexible sensor, which contains a piezoresistive material. When pressure is applied, the resistance of the piezoresistive material changes, and the pressure magnitude can be calculated by measuring this change in resistance. Piezoresistive sensors offer advantages such as fast response speed, easy signal processing, and relatively low cost.

[0078] Alternatively, the sensor array can employ a capacitive flexible sensor. The sensor contains a miniature capacitor structure; when subjected to pressure, the spacing between the capacitor plates changes, causing a change in capacitance. Pressure is then calculated by measuring this change in capacitance. Capacitive sensors offer advantages such as high sensitivity and low power consumption.

[0079] Feature information related to the calcaneal force line can be extracted from the plantar pressure distribution map. For example, the location of the pressure distribution center in the heel area reflects the weight-bearing center of the calcaneus. Under normal force lines, the pressure center in the heel area should be located near the geometric center of the heel region. When calcaneal eversion occurs, the pressure center shifts laterally; when calcaneal inversion occurs, the pressure center shifts medially. The pressure ratio between the medial and lateral sides of the heel area is also an important feature parameter. Under normal force lines, the pressure on the medial and lateral sides is basically balanced, while when calcaneal eversion occurs, the lateral pressure is significantly greater than the medial pressure.

[0080] The calcaneal offset detection unit is used to collect offset data of the calcaneus relative to the heel cup 1. In one embodiment, it is a thin-film strain sensor disposed on the inner wall of the heel cup 1. When the calcaneus offsets relative to the heel cup 1, the pressure distribution and degree of compression of the calcaneus against the inner wall of the heel cup 1 change. The thin-film strain sensor can detect these changes, thereby indirectly measuring the offset angle and offset amount of the calcaneus.

[0081] Thin-film strain sensors can be selected from resistive strain gauge sensors. The resistance value of the metal foil resistance grid inside the sensor changes when it deforms under stress, and the deformation is calculated by measuring the change in resistance. The sensor's sensitive direction should be consistent with the possible direction of calcaneal displacement (mainly varus and valgus) to obtain optimal detection sensitivity. Specifically, a thin-film strain sensor is installed on the inner walls of the left and right sides of the heel shaping cup 1. The left sensor is used to detect leftward displacement (varus), and the right sensor is used to detect rightward displacement (valgus).

[0082] The force line deviation index is calculated by considering both the plantar pressure distribution characteristics and the calcaneal offset angle. The force line deviation index is equal to the first weighting coefficient multiplied by the tangent of the calcaneal offset angle, plus the second weighting coefficient multiplied by the ratio of the pressure difference between the inner and outer sides of the heel to the total pressure in the heel area.

[0083] When the force line deviation index is zero, it indicates that the calcaneal force line is in an ideal neutral state. When the force line deviation index is positive, it indicates a tendency for calcaneal valgus; the larger the value, the more severe the valgus. When the force line deviation index is negative, it indicates a tendency for calcaneal varus; the larger the absolute value, the more severe the varus.

[0084] When the absolute value of the force line deviation index is less than the first threshold, the force line is considered normal, and no corrective intervention is required. When the absolute value of the force line deviation index is between the first and second thresholds, it is considered a mild abnormality, and a mild corrective force is applied. When the absolute value of the force line deviation index is greater than the second threshold, it is considered a moderate or severe abnormality, and a stronger corrective force is applied. The specific values ​​of the threshold range can be personalized based on factors such as the child's age, weight, and foot development stage. A second aspect of the present invention provides a children's shoe, comprising an upper and a sole. The upper has a heel counter, and the sole has a heel. The children's shoes also include the system integrated into the heel counter and heel.

[0085] Therefore, it is possible to achieve any effect in the modular, graded cushioning ankle support structure of children's shoes, which will not be elaborated here. For any parts not mentioned in this invention, existing technologies can be used or referenced.

[0086] The various embodiments in this specification are described in a progressive manner. The same or similar parts between the various embodiments can be referred to each other. Each embodiment focuses on describing the differences from other embodiments.

[0087] The above description is merely an embodiment of the present invention and is not intended to limit the invention. Various modifications and variations can be made to the present invention by those skilled in the art. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principle of the present invention should be included within the scope of the claims of the present invention.

Claims

1. A modular, tiered cushioning ankle support structure for children's shoes, characterized in that, Integrated into children's shoes, including: A heel support cup for calcaneal guidance, the heel support cup having a guide extending downward along the heel counter of the child's shoe, and a connector extending inward relative to the guide, the heel support cup circumferentially surrounding the heel counter; The guide includes an outer layer, a middle layer and an inner layer arranged sequentially from the outside to the inside, wherein the outer layer is used for cushioning, the middle layer is used to provide anti-torsional support and the inner layer is used to provide a sense of envelopment; A support mechanism is disposed on the inner surface of the shoe heel facing inwards and is connected to the connector. When the support mechanism is compressed, the force is converted into an inward tightening force on the guide through the connector, thereby guiding the calcaneus.

2. The modular, graded cushioning ankle support structure for children's shoes according to claim 1, characterized in that, The outer layer has a Shore hardness of 55±5A; The Shore hardness of the intermediate layer is 85±5A; The inner layer has a Shore hardness of 35±5A.

3. The modular, graded cushioning ankle support structure for children's shoes according to claim 2, characterized in that, The base layer of the connector has at least one recessed clearance opening, forming multiple connecting segments, so that when the support mechanism is compressed, the connecting segments can drive the guide to tighten inward.

4. The modular, graded cushioning ankle support structure for children's shoes according to claim 2, characterized in that, The guide also has a gasket on its inner side, and the gasket is detachably connected to the base layer.

5. The modular, graded cushioning ankle support structure for children's shoes according to claim 4, characterized in that, The pads are silicone sheets of varying hardness to enhance guidance of the pressure applied to the calcaneus; and / or, The pads are silicone sheets of varying thicknesses to adjust the space inside the shoe.

6. The modular, graded cushioning ankle support structure for children's shoes according to claim 1, characterized in that, The guide member surrounds the heel counter in a circumferential direction and has a first guide portion located on the left side of the shoe, a second guide portion located on the right side of the shoe, and a third guide portion located on the rear side of the shoe. The third guide portion connects the first guide portion and the second guide portion. At least the first guide portion and the second guide portion are provided with a micro airbag array to regulate the guiding force applied to the calcaneus by inflating and deflating the micro airbag array.

7. The modular, graded cushioning ankle support structure for children's shoes according to claim 6, characterized in that, The micro airbag array is connected to a micro air pump via an air tube, and the micro air pump is equipped with a button for controlling inflation and deflation. The outer side of the heel shaping cup is provided with reinforcing ribs.

8. The modular, graded cushioning ankle support structure for children's shoes according to claim 1, characterized in that, It also includes a multi-dimensional force line detection module, which is used to collect plantar pressure distribution data and / or offset data of the calcaneus relative to the heel shaping cup to determine the calcaneus force line deviation index and apply guiding force to the calcaneus through the heel shaping cup.

9. The modular, graded cushioning ankle support structure for children's shoes according to claim 8, characterized in that, The multi-dimensional force line detection module has the following features: A flexible pressure sensor array integrated into the heel is used to collect pressure distribution data in the heel area; and / or, A thin-film strain sensor, installed on the inner wall of the heel cup, is used to detect the offset angle and amount of the calcaneus.

10. A children's shoe, comprising an upper and a sole, characterized in that, The upper has a heel counter, and the sole has a heel. The children's shoes also include a modular, graded cushioning ankle support structure according to any one of claims 1 to 9 integrated into the heel counter and heel.

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