Coil assembly and method of forming the same
By designing a coil assembly with a decahedral shape and employing a tilted surface and concave structure, the problem of insufficient vibration resistance and heat dissipation of inductors in high-performance and miniaturized electronic devices is solved, achieving improved vibration resistance and heat dissipation performance.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- SAMSUNG ELECTRO MECHANICS CO LTD
- Filing Date
- 2025-12-31
- Publication Date
- 2026-07-10
AI Technical Summary
As electronic devices become more high-performance and miniaturized, the demand for inductors is increasing. Existing inductors are inadequate in terms of vibration resistance and heat dissipation, especially in electronic devices used in vehicles, where improved vibration resistance and heat dissipation are needed.
A coil assembly was designed with a body having a decahedral shape, a first inclined surface and a second inclined surface with the side surfaces inclined in different directions, and deep recesses formed on the surface to increase the surface area to improve heat dissipation performance. At the same time, the structure design of the external electrodes enhances vibration resistance.
It improves the vibration resistance and heat dissipation performance of coil assemblies, adapting to the high performance and miniaturization requirements of electronic devices, especially exhibiting excellent vibration resistance and heat dissipation in electronic devices used in vehicles.
Smart Images

Figure CN122370146A_ABST