Power module and device

Abstract

This invention relates to a power module and device. The power module includes: a heat dissipation substrate, a driver integrated circuit board, and a power supply board. The heat dissipation substrate and the driver integrated circuit board are connected via a pre-defined electrical connection structure on a first side adjacent to the heat dissipation substrate. The driver integrated circuit board is electrically connected to the power supply board on a second side adjacent to the power supply board. Power driver chips are sequentially distributed on the heat dissipation substrate, and the power driver chips synchronously receive power drive signals sent by the driver integrated circuit board. This power module can reduce latency even when operating at higher frequencies, fully leveraging the advantages of power modules operating at high frequencies.

Description

Technical Field

[0001] This invention relates to the field of power device technology, and in particular to a power module and device. Background Technology

[0002] A power module is a modular component that integrates power electronic devices, drive circuits, and protection functions, characterized by high efficiency, reliability, and ease of maintenance. With the continuous development of power electronics technology, power modules have been widely used in various fields.

[0003] Existing power modules use a series transmission method for power drive signals. At lower operating frequencies, this connection delay is acceptable, but at higher operating frequencies, it results in a significant delay. Summary of the Invention

[0004] Therefore, it is necessary to provide a power module and device that can reduce latency even when operating at higher frequencies.

[0005] A power module includes: a heat dissipation substrate, a driver integrated circuit board, and a power supply board. The heat dissipation substrate and the first side of the driver integrated circuit board near the heat dissipation substrate are connected by a preset electrical connection structure. The second side of the driver integrated circuit board near the power supply board is electrically connected to the power supply board. Power drive chips are sequentially distributed on the heat dissipation substrate. The power drive chips receive power drive signals sent by the driver integrated circuit board in a synchronous manner.

[0006] In some embodiments, on the heat dissipation substrate, the access point of the power drive signal is spaced 2 to 3 millimeters from the power drive chip.

[0007] In some embodiments, the power drive chips are spaced 0.5 to 1.5 mm apart.

[0008] In some embodiments, the preset electrical connection structure is an I-shaped connection component, which is vertically placed in the lead area of ​​the power drive chip.

[0009] In some embodiments, the size of the I-shaped connecting component is smaller than or equal to the size of the power drive chip.

[0010] In some embodiments, the heat dissipation substrate includes a heat dissipation aluminum substrate and a heat dissipation ceramic substrate.

[0011] In some embodiments, the heat dissipation substrate, the driver integrated circuit board, and the power board are packaged, with at least three connection windows reserved for connecting external components.

[0012] In some embodiments, a power module device is also provided, including the power module described above.

[0013] The power module described above, by having power drive chips sequentially distributed on the heat dissipation substrate that synchronously receive power drive signals sent by the drive integrated circuit board, achieves the goal of reducing latency even when the power module with the above structure is operating at a higher frequency, thus fully leveraging the advantages of the power module at high frequency operation. Attached Figure Description

[0014] To more clearly illustrate the technical solutions in the embodiments of this application or the conventional technology, the drawings used in the description of the embodiments or the conventional technology will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0015] Figure 1 This is a schematic diagram of the internal structure of a power module according to one embodiment; Figure 2 for Figure 1 A schematic diagram of a structural distribution on a heat dissipation substrate.

[0016] Explanation of reference numerals in the attached figures: Power board 100; driver integrated circuit board 200; heat dissipation substrate 300; second side of driver integrated circuit board near power board 201; first side of driver integrated circuit board near heat dissipation substrate 202; connecting component 203; power drive chip 301; I-shaped connecting component 302. Detailed Implementation

[0017] To facilitate understanding of this application, a more complete description will be provided below with reference to the accompanying drawings, which illustrate embodiments of the present application. However, the present application can be implemented in many different forms and is not limited to the embodiments described herein. Rather, these embodiments are provided so that the disclosure of this application will be thorough and complete.

[0018] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the application.

[0019] It is understood that the terms "first," "second," etc., used in this application may be used to describe various elements, but these elements are not limited by these terms. It is understood that the term "connection" in the following embodiments should be understood as "electrical connection," "communication connection," etc., if the connected circuits, modules, units, etc., have the function of transmitting electrical signals or data to each other.

[0020] When used herein, the singular forms of “a,” “an,” and “the” may also include the plural forms unless the context clearly indicates otherwise. It should also be understood that the terms “comprising / including” or “having,” etc., specify the presence of the stated features, wholes, steps, operations, components, parts, or combinations thereof, but do not preclude the possibility of the presence or addition of one or more other features, wholes, steps, operations, components, parts, or combinations thereof. Meanwhile, the term “and / or” as used in this specification includes any and all combinations of the associated listed items.

[0021] In some embodiments, such as Figure 1 As shown, the power module includes a heat dissipation substrate 300, a driver integrated circuit board 200, and a power supply board 100. The heat dissipation substrate 300 and the driver integrated circuit board 200 are connected by a preset electrical connection structure on the first side 202 of the heat dissipation substrate 300. The second side 201 of the driver integrated circuit board 200 near the power supply board 100 is electrically connected to the power supply board 100. Power drive chips 301 are sequentially distributed on the heat dissipation substrate 300. The power drive chips 301 receive the power drive signals sent by the driver integrated circuit board 200 in a synchronous manner.

[0022] In some embodiments, a plurality of uniformly arranged external connection terminals are sequentially disposed on the aforementioned driver integrated circuit board 200, which can be electrically connected to the power supply board 100. It is understood that the aforementioned power supply board 100 may also include other types of control circuits.

[0023] In some embodiments, such as Figure 2As shown, on the aforementioned heat dissipation substrate 300, the distance between the power drive signal access point 303 and the power drive chip 301 is 2 to 3 millimeters. It is understood that, based on the debugging results, the optimal distance between the power drive signal access point 303 and the power drive chip 301 can be controlled to be between 2 millimeters, 3 millimeters, or a combination of 2 millimeters and 3 millimeters. The design in this embodiment overcomes the problem of large signal delay in existing power modules operating at high frequencies, thereby enabling the power drive chip to fully utilize its characteristics even when the power module is operating at high frequencies, improving working efficiency, reducing the size or space occupied by peripheral components, and reducing EMI (Electromagnetic Interference). Specifically, the power module can achieve high-frequency operation of 500kHz, and the filter capacitor capacity is reduced to 1A / 47uF, etc.

[0024] In some embodiments, the power drive chips are spaced 0.5 to 1.5 mm apart, and the power drive chips can be aligned and arranged horizontally or vertically with the same interval.

[0025] In some embodiments, the power drive chips are spaced 1 mm apart. In this case, when the power module operates at a higher frequency, the delay is minimized, the electromagnetic interference is minimized, and the energy consumption is minimized.

[0026] In some embodiments, such as Figure 1 As shown, the aforementioned preset electrical connection structure is an I-shaped connector 302, which is vertically placed in the lead area of ​​the power driver chip 301. It can be understood that the lead area is the area of ​​wires extending outward from the package of the power driver chip 301, which can be electrically connected to the aforementioned I-shaped connector 302. In this embodiment, the use of an I-shaped connector instead of the existing external wiring method increases the contact area between the power driver chip and the external wiring point, reduces the resistance, thereby reducing power module losses and improving power module performance.

[0027] In some embodiments, the I-shaped connecting component 302 in the above embodiments may be made of a conductive material with similar parameters to the power drive chip, such as copper, a conductive material with similar thermal expansion and contraction parameters.

[0028] In some embodiments, the size of the I-shaped connecting member 302 is smaller than or equal to the size of the power drive chip 301.

[0029] In some embodiments, the heat dissipation substrate 300 includes a heat-dissipating aluminum substrate and a heat-dissipating ceramic substrate. When the power module needs to operate at a lower voltage, the heat dissipation substrate 300 is selected from the heat-dissipating aluminum substrate; when the power module needs to operate at a higher voltage, the heat dissipation substrate 300 is selected from the heat-dissipating ceramic substrate. It is understood that the operating voltage can be divided into 500V sections; when the power module needs to operate below 500V, the heat dissipation substrate 300 is selected from the heat-dissipating aluminum substrate; when the power module needs to operate above 500V, the heat dissipation substrate 300 is selected from the heat-dissipating ceramic substrate.

[0030] In some embodiments, the heat dissipation substrate 300, driver integrated circuit board 200, and power board 100 are packaged, with at least three connection windows reserved for connecting external components. These three connection windows can be a load input, a control signal input, and a power input. It is understood that the load input provides access to an external load, the control signal input provides access to external control signals such as voltage or power signals requiring conversion, and the power input provides access to an external power source. It is understood that after packaging the heat dissipation substrate 300, driver integrated circuit board 200, and power board 100, the number of connection windows is not limited to three; a reasonable number of connection windows can be reserved according to the needs of the scenario. The connection window type can be pins or connection terminals, and can be reserved according to the scenario. Existing packaging methods can be used. This embodiment enables users to avoid complex calculations, greatly shortens the development cycle, and improves the convenience of using the power module.

[0031] In some embodiments, the input range of the power supply on the power board can be from 200V to 1500V.

[0032] In some embodiments, a power module device is provided, which includes the power module described above. The power module device includes, but is not limited to, chargers, new energy power generation equipment, industrial control equipment, rail transit equipment, consumer electronics equipment, and flight equipment. For example, applying the power module from the above embodiments to a laptop power adapter can reduce the adapter's size to that of a cigarette pack and its total weight to approximately 60g; or applying the power module to an air conditioner or automotive electric motor drive can effectively reduce the weight and size of the electric motor.

[0033] In the description of this specification, references to terms such as "some embodiments," "other embodiments," and "ideal embodiments" indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of the invention. In this specification, the illustrative descriptions of the above terms do not necessarily refer to the same embodiments or examples.

[0034] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0035] The embodiments described above are merely illustrative of several implementations of the present invention, and while the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the invention patent. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of the present invention, and these all fall within the protection scope of the present invention. Therefore, the protection scope of this invention patent should be determined by the appended claims.

Claims

1. A power module, characterized in that, include: The system includes a heat dissipation substrate, a driver integrated circuit board, and a power supply board. The heat dissipation substrate and the driver integrated circuit board are connected via a preset electrical connection structure on a first side near the heat dissipation substrate. The driver integrated circuit board is electrically connected to the power supply board on a second side near the power supply board. Power drive chips are sequentially distributed on the heat dissipation substrate. The power drive chips receive power drive signals sent by the driver integrated circuit board in a synchronous manner.

2. The power module according to claim 1, characterized in that, On the heat dissipation substrate, the access point of the power drive signal is spaced 2 to 3 millimeters from the power drive chip.

3. The power module according to claim 1 or 2, characterized in that, The power drive chips are spaced 0.5 to 1.5 mm apart.

4. The power module according to claim 1, characterized in that, The preset electrical connection structure is an I-shaped connection component, which is vertically placed in the lead area of ​​the power drive chip.

5. The power module according to claim 4, characterized in that, The size of the I-shaped connecting component is less than or equal to the size of the power drive chip.

6. The power module according to claim 1, characterized in that, The heat dissipation substrate includes a heat dissipation aluminum substrate and a heat dissipation ceramic substrate.

7. The power module according to claim 1, characterized in that, The heat dissipation substrate, the driver integrated circuit board, and the power board are packaged, with at least three connection windows reserved for connecting external components.

8. A power module device, characterized in that, Includes the power module according to any one of claims 1, 2, 4 to 7.

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